JPH05102649A - Production of module - Google Patents

Abstract

PURPOSE:To accurately place a board on a form plate at the time of initial setting by providing the board with a placing target mark and providing the form plate with a placing opening. CONSTITUTION:A board 1 is provided with a pad 3, a recognizing target mark 4 and a placing target mark 11 close to the recognizing target mark 4. On a form plate 6, a placing opening 12, which is the same or larger than the placing target mark 11, is provided at the same position as the placing target mark 11. At the time of the initial setting of placing the board 1 on the form plate 6, the X, Y and theta-directions of a receiving table 5 are finely adjusted, the placing is visually confirmed by using the placing target mark 11 and the placing opening 12 and the accurate placing is facilitated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a module used for personal computers, machine tools and the like.

[0002]

2. Description of the Related Art FIG. 3 is a schematic view of alignment of a substrate and a plate in a conventional method of manufacturing a module. In FIG. 3, a module substrate (hereinafter abbreviated as substrate) 1 has a metal pattern formed on the surface of a base material 2 such as glass epoxy, for the purpose of electrical and mechanical connection with terminals of LSI and chip parts. It is provided with a pad 3 and a recognition target mark 4 used for recognizing a substrate position when supplying a solder paste and mounting a chip component, which will be described later.

At the time of manufacturing the module, the solder paste is supplied to a predetermined place on the substrate 1 by a solder paste supply device. A screen printing method is generally used for this solder paste supply device from the viewpoint of mass productivity. FIG. 4 is a schematic view of a solder paste supply device (screen printing method) in a conventional module manufacturing method. Hereinafter, with reference to FIGS. 3 and 4, a description will be given of the combination of the substrate and the plate in the conventional method of manufacturing a module.

First, the first substrate 1 is fixed to the pedestal 5 by a clamp method or a suction method, the image is recognized, and the position is stored. At this time, the receiving table 5 is arranged at the reference position A when the substrate is fixed. This completes the initial setting of the fixed position of the substrate 1 with respect to the pedestal 5. Next, substrate 1
The initial setting of the alignment of the fixed plate 6 is as follows after the substrate 1 on the pedestal 5 is horizontally moved under the plate 6 with a constant stroke.
It is determined by finely adjusting the position of the pedestal 5 in the X, Y, and θ directions while visually confirming the displacement between the pad 3 and the opening 7. This fine adjustment amount is stored and used for aligning the second and subsequent substrates 1 and the plate 6. After the alignment of the substrate 1 and the plate 6 is completed, the solder paste 8 is moved using a squeegee 9 to supply the solder paste 8 to a predetermined place on the substrate 1 through the opening 7. On the substrate 1 to which the solder paste 8 is supplied, a component mounting device (not shown) mounts the LSI and chip components at predetermined positions.

Next, the joint between the pad 3 and the component is soldered by a method of heating the entire substrate such as infrared reflow or VPS. After that, the substrate is cleaned, the lot number and the like are stamped as necessary, and finally the quality of the electrical characteristics and the like is checked to complete the process. For the second and subsequent substrates 1, first, after fixing the substrate 1 to the pedestal 5, image recognition is performed to obtain the amount of deviation from the initial setting position (the amount of deviation from the reference position A), and according to the amount of deviation. The position is corrected by automatically moving the pedestal 5 in the X, Y, and θ directions.

Next, the substrate 1 on the pedestal 5 is horizontally moved below the plate 6 with a constant stroke, and is also moved by a fine adjustment amount at the time of initial setting of the alignment of the first substrate 1 and the plate 6. By doing so, the substrate 1 and the plate 6 are aligned. The subsequent steps are the same as in the case of the first substrate described above.

[0007]

In the screen printing method in the conventional method of manufacturing a module, an LSI package having a lead pitch of 0.5 mm or less (hereinafter abbreviated as fine pitch) compatible with recent high-density mounting is described as follows. The precision with which the substrate and plate are aligned is important. this is,
Fine pitch reduces the pad spacing, so
Due to the deformation of the printed solder paste 8 during mounting or reflow, as shown in FIG.
This is because 0 easily occurs.

As a countermeasure against this, as shown in FIG.
A method is used in which the opening 7 is smaller than the size of the pad 3. However, when this method is used, the opening of the plate is smaller at the time of initial setting of the substrate and plate alignment, so it cannot be confirmed from above, and the operator actually printed several times and based on the misalignment, the operator It was necessary to set it based on my intuition. Therefore, it takes time to perform the initial setting, and the alignment accuracy is not satisfactory.

In order to eliminate the above-mentioned problem that the operator needs to consider the high-precision alignment of the fine pitch compatible substrate and the plate, the alignment target mark for the substrate and the alignment opening for the plate are eliminated. It is an object of the present invention to provide a method of manufacturing a module that enables highly accurate alignment by providing the parts.

[0010]

The present invention uses a substrate having a pad and a plate having an opening, and after aligning the position of the pad and the opening, supplying a solder paste onto the substrate through the opening. In a method of manufacturing a module having a substrate, a target mark for alignment is provided on the substrate, and an alignment opening having the same size as or a larger size than the target mark for alignment is provided on the plate to be used for alignment at the time of initial setting of the substrate and the plate. It was done.

[0011]

According to the present invention, since the module manufacturing method is configured as described above, the alignment of the substrate and the plate at the time of initial setting is performed by visually checking the alignment target mark and the alignment opening. This can be done by finely adjusting the position.

[0012]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 is a schematic view of a substrate and a plate according to an embodiment of the present invention, and FIG. 2 is a view of a mating portion viewed from above after the substrate and the plate are mated. As shown in FIG. 1, in addition to the pad 3 provided on the conventional substrate, the recognition target mark 4 used for recognizing the substrate position during screen printing and component mounting, the substrate 1 is close to the recognition target mark 4. The target mark 11 for alignment is installed in the. Further, on the plate 6, an alignment opening 12 which is the same as or slightly larger than the alignment target mark 11 is provided.

Therefore, at the initial setting of the alignment between the substrate 1 and the plate 6, the position of the pedestal 5 in the X, Y and θ directions is finely adjusted, and the alignment target mark 11 and the alignment opening 1 are formed.
By visually confirming with the use of 2, it is possible to easily carry out the highly accurate alignment shown in FIG. Here, the reason why the recognition target mark 4 and the alignment target mark 11 are separated is that if they are shared, the reproducibility of the solder paste shape printed on the target mark is not high, and image recognition cannot be performed well. is there.

The process after the substrate 1 and the plate 6 are aligned is the same as the conventional method. Although the solder layer remains on the alignment target mark 11 in the finished product, no problem occurs in the function of the module. In the above embodiment, the alignment target mark 11 has a circular shape, but of course the same effect can be obtained by using a rhombus, a parallelogram, a rectangle or the like.

In the above embodiment, the alignment target marks 11 are arranged at diagonally opposite positions on the substrate 1. However, it is sufficient if a certain distance is secured between the alignment target marks 11 for alignment. The position of the target mark 11 is not limited. Further, in the above-described embodiment, the size of the alignment opening 12 is the same as the size of the alignment target mark 11, but the alignment target mark 11 can be seen through the alignment opening 12. It is only necessary that the size of the alignment opening 12 is smaller than the size of the alignment target mark 11. However, if the size is too large, the visual alignment becomes difficult, and therefore, the size of the same size is preferable.

The present invention is not limited to the above embodiments, and various modifications can be made within the scope of the present invention, which are not excluded from the scope of the present invention.

[0017]

As described above in detail, according to the present invention, the substrate is provided with the alignment target mark and the plate is provided with the alignment opening having the same size as or slightly larger than the alignment target mark. Since it is provided and used for the initial setting of the board and plate,
High-precision alignment is possible, and as a result, it is possible to reduce the occurrence of defects such as bridges.

[Brief description of drawings]

FIG. 1 is a schematic view of a substrate and a plate according to an embodiment of the present invention.

FIG. 2 is a view of the matching portion as viewed from above after the substrate and the plate are matched in the embodiment of the present invention.

FIG. 3 is a schematic view of the alignment of the substrate and the plate in the conventional module manufacturing method.

FIG. 4 is a schematic view of a solder paste supply device in a conventional module manufacturing method.

FIG. 5 is an explanatory diagram of a bridge defect in the conventional module manufacturing method.

FIG. 6 is a configuration diagram of a plate corresponding to a fine pitch in a conventional module manufacturing method.

[Explanation of symbols]

 1 substrate 4 target mark for recognition 6 plate 12 opening for alignment

Claims (2)

[Claims] 1. A method of manufacturing a module including a step of using a substrate having a pad and a plate having an opening, aligning the pad and the opening, and then supplying a solder paste onto the substrate through the opening. In the method, the substrate is provided with an alignment target mark, and the plate is provided with an alignment opening having the same size as or a larger size than the target mark, which is used for alignment of the substrate and the plate at the time of initial setting. And a method for manufacturing a module. 2. The method for manufacturing a module according to claim 1, wherein the substrate is a printed wiring board.