CN117373929A - Mounting technology of special-shaped device - Google Patents
Mounting technology of special-shaped device Download PDFInfo
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- CN117373929A CN117373929A CN202311243244.8A CN202311243244A CN117373929A CN 117373929 A CN117373929 A CN 117373929A CN 202311243244 A CN202311243244 A CN 202311243244A CN 117373929 A CN117373929 A CN 117373929A
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- 238000005516 engineering process Methods 0.000 title description 3
- 238000000034 method Methods 0.000 claims abstract description 73
- 230000008569 process Effects 0.000 claims abstract description 60
- 230000009471 action Effects 0.000 claims abstract description 13
- 229910000679 solder Inorganic materials 0.000 claims abstract description 12
- 238000007650 screen-printing Methods 0.000 claims abstract description 5
- 238000005286 illumination Methods 0.000 claims description 10
- 238000004364 calculation method Methods 0.000 claims description 3
- 230000002035 prolonged effect Effects 0.000 claims description 3
- 238000005457 optimization Methods 0.000 claims description 2
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000007639 printing Methods 0.000 description 11
- 238000005476 soldering Methods 0.000 description 10
- 238000013461 design Methods 0.000 description 8
- 239000002002 slurry Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 238000005245 sintering Methods 0.000 description 6
- 238000009954 braiding Methods 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000000280 densification Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
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- 230000006870 function Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Abstract
A mounting process of special-shaped devices is characterized in that the bottom center and the surface center of solder paste screen printing are required to coincide with each other during mounting, and the verticality and levelness of the mounting of the special-shaped devices on the front side and the back side are ensured to be less than or equal to 5 degrees; the mounting height is lower than the height of the device, the vacuum pressure input in the mounting process is between 20% and 40%, and the suction nozzle is ensured not to influence the device when leaving; before mounting, a proper suction nozzle is selected according to the size and type of the special-shaped device, and a proper action mode and time are set to perfect the suction process, so that the device is accurately identified and positioned in terms of suction or mounting. The process reduces the verticality requirement of the special-shaped device in the production process to be within 3 degrees, and the process is widely applied to mass production, so that the product quality and the production efficiency are improved.
Description
Technical Field
The invention relates to the field of mounting and product assembly of integrated circuits, in particular to a mounting process of special-shaped devices.
Background
The CA series integrated circuit is widely applied to front-end heat control processing systems of new energy automobiles and traditional automobiles. With the continuous expansion of the market scale of new energy automobiles, the market demand of the control circuit of the commercial core chip of the automobile is huge, and the situation of blowout type growth is presented.
In the production process, the serial products have large thickness (2 mm thick ceramic substrate), large area (the size of a connecting piece is 112.2 multiplied by 96.8mm, the size of a single piece is 14.15 multiplied by 12.4 multiplied by 2 mm), and a plurality of connecting pieces are connected, so that cracking is easy to occur in the production process, and the consistency of printing of soldering paste is unstable. And there are higher standard verticality and levelness requirements for front and back mounted profile devices (top offset in horizontal and vertical directions cannot exceed 5 degrees).
Disclosure of Invention
The invention aims to provide a mounting process of a special-shaped device, which solves the problems of mounting of the special-shaped device and assembly of products, optimizes and perfects the product process technology, realizes large-scale production and meets the mass production condition of the products.
The technical scheme of the invention is that the mounting process of the special-shaped device is characterized in that the bottom center and the surface center of the solder paste screen printing are required to be mutually overlapped during the mounting of the device, and the verticality and the levelness of the mounting of the special-shaped device on the front and the back are ensured to be less than or equal to 5 degrees;
the mounting height is lower than the height of the device, the vacuum pressure input in the mounting process is between 20% and 40%, and the suction nozzle is ensured not to influence the device when leaving;
before mounting, a proper suction nozzle is selected according to the size and type of the special-shaped device, and a proper action mode and time are set to perfect the suction process, so that the device is accurately identified and positioned in terms of suction or mounting.
Further, the device size recognition is automatically carried out, the suction and the automatic adjustment of the height of the suction nozzle are carried out according to the size, the offset X axis of the suction nozzle is increased by 0.1mm, the suction speed is prolonged at 0.10s time intervals, the suction vacuum pressure is input to be 60% +/-10% of the input pressure, the fine adjustment of the suction height is reduced, and the suction is carried out when the suction nozzle fully contacts the flat surface of a product.
Further, surface illumination brightness is adopted for appearance recognition, when the illumination level is set, the clear visibility of devices in a lens must be ensured, the edge illumination intensity cannot be too strong, the parameters are optimized after being set, and the edge limit value is set to be 20% in the setting process; meanwhile, the lowest matching degree of the identification is above 75%, and the identification is lower than the minimum matching degree, so that the identification is unqualified; wherein the edge margin value refers to the contour floor value at which the device recognizes.
Further, in order to improve the mounting precision of the special-shaped device, two methods are adopted for control, namely, in the process of checking the adsorption vacuum sensor, the suction vacuum pressure input value is refilled for calculation, so that the suction process of the device is precisely judged, and the suction action is changed from the conventional straight up and down type to the pulse type, each pulse interval is independently set, and the overall method is from fast to slow, so that the accurate suction process of the special-shaped device is realized.
Further, the mounting selects a standard suction nozzle special for the miniaturized device: TYPE-301.
The mounting process of the special-shaped device is mainly used for improving the design requirement that the verticality and the levelness of the special-shaped device are smaller than or equal to 5 degrees in the mounting process, the verticality deviation of the special-shaped device is larger in the prior production process, the circuit performance of the special-shaped device is seriously influenced, the process method is summarized after multiple tests and verification, in the process, the process method improvement and design in the solder paste printing and reflow soldering process are combined, the verticality requirement of the special-shaped device in the production process is reduced to be within the range of 3 degrees, the process is widely applied in batch production, and the product quality and the production efficiency are improved.
Drawings
FIG. 1 is a schematic diagram of a small profile device;
FIG. 2 is a schematic diagram of a large profile device;
FIG. 3 is a schematic view of the appearance of a profiled device;
FIG. 4 is a profile of a profile device mounting;
fig. 5 is a schematic of the product process flow.
Detailed Description
As shown in fig. 5, in a mounting process of a special device, a bonding pad is printed by slurry, and after the mounting of elements is performed on the bonding pad, the bonding pad is packaged in a piece-by-piece manner, and the specific process steps are as follows:
the first step: printing and drying a conductor; and (3) printing the circuit of the bottom layer of the paste and removing the organic solvent in the paste, and shaping the printed pattern.
A second part: sintering; removing organic components in the circuit slurry, and reacting other components in the slurry to generate sintering and densification phenomena.
And a third step of: overprinting and drying the bonding pad; the thickness of the mounting pad is increased, and the organic solvent in the pad slurry is removed.
Fourth step: first sintering (850 ℃); removing organic components in the bonding pad slurry, and reacting other components in the slurry to generate sintering and densification phenomena.
Fifth step: printing and drying glass; glass printing is a protective function for the underlying circuit surface.
Sixth step: second sintering (500 ℃); removing organic components in the glass slurry, and reacting other components in the slurry to generate sintering and densification phenomena.
Seventh step: printing soldering paste; and (3) carrying out corresponding solder paste printing on the distribution and the requirements of the surface-mounted devices, and mainly controlling the thickness, uniformity and laminating property of the solder paste.
Eighth step: mounting; the method mainly aims at programming setting and parameter exploration of the special-shaped devices, and ensures that the verticality and levelness of the mounting of the special-shaped devices on the front side and the back side meet the design requirement (less than or equal to 5 ℃). The exploration of the mounting parameters of the special-shaped device is mainly carried out by taking the structure of the device as a starting point and programming the mounting equipment according to the circuit design requirement.
Ninth step: reflux (270 ℃); and (3) carrying out high-temperature curing on the mounted product, and carrying out different printing thickness, mounting modes and the like of soldering paste according to the type of the electronic element, wherein the reflow modes also adopt different mode methods, and the product is produced by adopting reflow processes with the same plate and different temperatures.
Tenth step: slicing; the whole plate after reflow is subjected to the slicing operation, and the tool is adopted to assist slicing, so that the phenomenon of ceramic lack and ceramic lack can be reduced, and the qualification rate of products is improved.
Eleventh step: the lead is inserted, and the lead is preassembled at the bonding pad of the separated product, and the production quality and the production rate of the product can be improved by adopting the fixture due to the structure of the lead and the thickness of the product substrate.
Twelfth step: dip soldering; and after the lead is inserted, dip soldering and fixing are carried out on the lead.
Thirteenth step: cleaning; cleaning the surface of the product subjected to dip soldering, cleaning the pollution generated on the surface of the product in the production process, ensuring the dry and clear appearance of the product, and preventing the problem of circuit performance caused by surface pollution.
Fourteenth step: breaking off the lead wire; and cutting off redundant leads of the washed product according to design requirements, and meeting product insertion requirements.
Fifteenth step: and packaging the product by using a special packaging box.
The main control of the special-shaped device is in the aspect of the mounting process, but the printing size and shape of the bonding pad can also influence the verticality of the special-shaped device. Different bonding pads can influence the surface tension of the solder paste, and if the perpendicularity of the device cannot be guaranteed to meet the requirement in the mounting process, the abnormal device on the reflowed product can incline at a larger angle, so that the design requirement cannot be met. The design of the bonding pad is the same as the shape of the solder paste screen printing, so that the surface tension of the solder paste at the bottom of the special-shaped device is consistent during reflow, and the difficulty is how to solve the requirements on the verticality and the stability of the special-shaped device during mounting production.
As shown in fig. 1, 2, 3 and 4, the abnormal-shaped devices are divided into two types, namely, the size of the larger abnormal-shaped device is as follows: l2.70 x W1.20 x h2.00mm, smaller dimensions are: L1.70W 1.0H 2.00mm, the device is characterized by narrow bottom and high length, the thickness of the substrate of the product is thicker, and the substrate is made of ceramic material, so that the stability and consistency of the mounting are more difficult. When the special-shaped device is mounted, the contact point exists at the top, so that the suction position of the suction nozzle cannot be positioned at the central position of the device, the position deviation can occur during mounting the device, and the product performance is affected. In the reflow process, because of the surface tension characteristic of the soldering paste, the bottom center and the surface center of the soldering paste screen printing are required to be mutually overlapped (the precision is required to be 0.1 mm) in the mounting process of the device, so that the surface tension of the soldering paste is uniform for the bottom of the device in the reflow process, and the device can be finally positioned between the designed verticality and levelness range.
The programming of the program is mainly divided into three major modules, namely:
(1) picking and braiding the special-shaped devices on the material tray;
(2) identification and programming in the process;
(3) packaging and braiding on a substrate;
and in the early stage, the basic parameters of the special-shaped devices are required to be measured and recorded, and then fine setting and programming of three modules are respectively carried out. The function of modularized programming and the action mode thereof are as follows:
sucking: the method mainly comprises the steps of selecting a proper suction nozzle according to the size and the type of a special-shaped device, setting a proper action mode and time, perfecting the process of picking up process parameters, taking the device out of a braid perfectly, and ensuring the primary condition of mounting effect in the whole process, wherein the whole process is the front end of mounting programming.
And (3) sticking: the device picked up from the braiding is attached to the surface of a product, and the stability and consistency of the device attachment are ensured in the process according to the device height and the moving speed of a device shaft and the setting process of parameters such as an action mode during attachment, so that the device is the most important action in the attachment action, belongs to core programming, and is used for ensuring the attachment of the device and the surface of the product, and does not influence the electrical performance of the product and the subsequent procedure operation.
And (3) identification: the recognition action penetrates through the whole mounting process, whether the device is sucked or mounted, is extremely important for the recognition of the device and the recognition of the positioning point, and relates to the accuracy of the mounting position and the accuracy of the device recognition, and only the recognition is accurate and the response is quick, so that the efficiency and quality effect of the whole mounting process can be improved.
Description of the embodiments
Firstly, the physical characteristics, the appearance size and other data of the special-shaped device are measured and known, the program of the device type can be recorded according to the size and the physical characteristics, the establishment of a database of the special-shaped device is facilitated, and meanwhile, the identification programming of subsequent equipment is facilitated. The general equipment will automatically perform size recognition and automatic adjustment of the suction nozzle height for suction and mounting according to this size. The automatic recognition after equipment optimization marks that the device has corresponding data in a database, is critical to the recognition process of the device, and can confirm the suction and mounting height of the device suction nozzle, but the device recognition after fine adjustment is more accurate after fine adjustment. Because the flat part of the top of the special-shaped device is not positioned in the center of the device, different measures of transverse movement can be generated during mounting; therefore, the offset compensation in the left-right direction can be correspondingly increased, and the deviation of the top end leveling position can be compensated by program control. The offset X axis of the suction nozzle can be increased by 0.1mm for improvement, and the moving amount can better conform to the transverse offset of the device.
The suction module is provided with: after the basic data is set and compiled, parameters of the abnormal device are compiled, wherein the parameters are directly related to the verticality of the device, namely the absorption speed item, the verticality of the device is influenced due to the fact that the speed is too high, the timeliness is reduced due to the fact that the speed is too low, the absorption speed is adjusted by combining the recognition speed and the recognition result, and the absorption speed is prolonged at intervals of 0.10s generally; the braiding carrying the special-shaped devices cannot be guaranteed to be on the same horizontal plane during conveying, the height of the special-shaped devices is high, the bottom of the special-shaped devices is narrow, the special-shaped devices are easy to shake in the braiding during equipment operation, the original suction position is deviated, and accordingly the problem of sucking the special-shaped devices occurs, delay setting is carried out on the suction speed, fine adjustment of the suction height is reduced, and the suction is carried out when the suction nozzle fully contacts the flat surface of a product; after the drawing is carried out on the basis, the mechanical moving speed (namely the X.Y axis moving speed) of the drawing module can be not specially set, and the drawing speed of the drawing module can be accelerated; because the whole equipment adopts a pneumatic device, particularly the pneumatic device is about whether the device generates vibration in the rapid movement of the shaft so that the abnormal device position is deviated and falls, under the condition that the pressure of the equipment is stable, the higher the vacuum pressure input is, the better the suction effect is, but the higher the air pressure can cause the device to be easily brought back during mounting, and the material throwing loss of the device is caused; in order to improve the mounting precision of the special-shaped device, two methods can be adopted for control, namely, the process of accurately judging the suction of the device by re-filling the set suction vacuum pressure calculation in the inspection of the suction vacuum sensor, and the process of accurately judging the suction of the device are changed from a conventional straight up-down type to a pulse type aiming at the suction action, and all pulse intervals are independently set, so that the whole method is from fast to slow, and the accurate suction process of the special-shaped device is realized.
And (3) setting a mounting module: the mounting process mainly comprises the mounting operation, before which the mounting must be provided with the suction nozzle parameters, and the standard suction nozzle special for the miniaturized device is selected: TYPE-301, mainly the top of the special-shaped device is flat and the area for sucking and mounting is smaller; the time of the mounting module and the moving speed of the shaft are unchanged from that of the suction module, the efficiency of the whole process is mainly improved, and the time of the mounting module is proved to have no obvious influence on the mounting precision after the test; in the process of the action of the mounting module, the special-shaped device can be directly contacted with the surface of the substrate, the mounting height setting at the moment can directly influence the mounting position precision, the special-shaped device has certain elastic deformation, the solder paste on the surface of the substrate has certain thickness, in order to ensure that the bottom of the device is fully contacted with the solder paste in a printing way, the vertical angle when the mounting is still maintained after the suction nozzle leaves the device is ensured, the mounting height of the special-shaped device is required to be lower in the height setting, namely the mounting height is lower than the height of the device, and the solder paste can be fully contacted and wrapped with the bottom of the device during reflow, so that the vertical degree meets the design requirement; however, when the suction nozzle leaves the surface of the device, the adsorbed vacuum pressure cannot disappear all at once, and the vacuum pressure in the whole process always exists, so that the vacuum pressure item setting must be reduced during mounting, and the suction nozzle can be ensured to leave and cannot influence the device, so that the vacuum pressure input in the mounting process is between 20 and 40 percent, and the vacuum pressure can be flexibly changed according to the size of the special-shaped device; due to the nature of the device itself, along with the fact that the offset adjustment has been made for the top planar surface during suction, no modification of the contact surface offset term is required during mounting.
And (5) compiling an auxiliary identification module: because the packaging of the special-shaped device is different from that of the electronic component, the special-shaped device is of a simple mechanical structure, the device shape identification can be carried out by adopting illumination brightness, the identification speed can be improved, the identification accuracy can be ensured, when the device identification is carried out by adopting a data type, the high-accuracy data analysis and acquisition are required to be carried out on the size, edge pins, top contact surface and the like of the device, and the size and the accuracy of the special-shaped device are not the standard device type, so that the appearance identification is carried out by adopting the surface illumination brightness. Therefore, when the illumination level is set, the device in the lens is required to be clearly visible, the edge illumination intensity cannot be too strong, the parameters are optimized after being set, the edge limit value item is mainly low as much as possible in the setting process, the identification speed and the identification accuracy are improved, and the identification speed and the identification accuracy are set to 20% (the edge limit value refers to the minimum value of the outline of the device at the identification position); meanwhile, the minimum value of the identification, namely the minimum matching degree, is set, namely the identification degree is more than 75%, and the identification degree is lower than the tolerance limit of unqualified display, mainly aiming at different brightness and different environments, so that the identification is more rapid and accurate.
Claims (5)
1. A mounting process of special-shaped devices is characterized in that the center of the bottom and the center of the surface of solder paste screen printing are required to be overlapped when the devices are mounted, and the verticality and levelness of the mounting of the special-shaped devices on the front side and the back side are ensured to be less than or equal to 5 degrees;
the mounting height is lower than the height of the device, the vacuum pressure input in the mounting process is between 20% and 40%, and the suction nozzle is ensured not to influence the device when leaving;
before mounting, a proper suction nozzle is selected according to the size and type of the special-shaped device, and a proper action mode and time are set to perfect the suction process, so that the device is accurately identified and positioned in terms of suction or mounting.
2. The mounting process of the special-shaped device according to claim 1, wherein the appearance recognition is performed by adopting the surface illumination brightness, when the illumination level is set, the device in the lens must be ensured to be clearly visible, the edge illumination intensity cannot be too strong, the optimization is performed after the parameter setting, and the edge limit value is set to be 20% in the setting process; meanwhile, the lowest matching degree of the identification is above 75%, and the identification is lower than the minimum matching degree, so that the identification is unqualified; wherein the edge margin value refers to the contour floor value at which the device recognizes.
3. The mounting process of the special-shaped device according to claim 2, wherein the device size recognition is automatically performed, the suction and the automatic adjustment of the height of the suction nozzle for mounting are performed according to the size, the offset X axis of the suction nozzle is increased by 0.1mm, the suction speed is prolonged at intervals of 0.10s, the suction vacuum pressure is input to be 60% ± 10%, the suction height is finely adjusted to be reduced, and the suction is performed when the suction nozzle is fully contacted with the flat surface of the product.
4. The mounting process of the special-shaped device according to claim 3, wherein in order to improve the mounting precision of the special-shaped device, two methods are adopted for control, namely, in the process of checking an adsorption vacuum sensor, the suction vacuum pressure input value is refilled for calculation so as to enable the suction process of the special-shaped device to be fine, and the suction action is changed from the conventional straight up and down type into the pulse type, each pulse interval is independently set, and the overall method is from fast to slow, so that the accurate suction process of the special-shaped device is realized.
5. The mounting process of the special-shaped device according to claim 1, wherein the mounting selects a standard suction nozzle dedicated to the miniaturized device: TYPE-301.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311243244.8A CN117373929A (en) | 2023-09-25 | 2023-09-25 | Mounting technology of special-shaped device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311243244.8A CN117373929A (en) | 2023-09-25 | 2023-09-25 | Mounting technology of special-shaped device |
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| Publication Number | Publication Date |
|---|---|
| CN117373929A true CN117373929A (en) | 2024-01-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311243244.8A Pending CN117373929A (en) | 2023-09-25 | 2023-09-25 | Mounting technology of special-shaped device |
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| Country | Link |
|---|---|
| CN (1) | CN117373929A (en) |
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2023
- 2023-09-25 CN CN202311243244.8A patent/CN117373929A/en active Pending
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