CN116790227A - High-performance heat-conducting phase-change material based on organic silicon system and preparation method thereof - Google Patents
High-performance heat-conducting phase-change material based on organic silicon system and preparation method thereof Download PDFInfo
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- CN116790227A CN116790227A CN202211569550.6A CN202211569550A CN116790227A CN 116790227 A CN116790227 A CN 116790227A CN 202211569550 A CN202211569550 A CN 202211569550A CN 116790227 A CN116790227 A CN 116790227A
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- 239000012782 phase change material Substances 0.000 title claims abstract description 40
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 21
- 239000010703 silicon Substances 0.000 title claims abstract description 21
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 239000000945 filler Substances 0.000 claims abstract description 124
- 239000002245 particle Substances 0.000 claims abstract description 30
- 229920001558 organosilicon polymer Polymers 0.000 claims abstract description 28
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 25
- 239000002994 raw material Substances 0.000 claims abstract description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 17
- 238000002156 mixing Methods 0.000 claims description 16
- 229920001296 polysiloxane Polymers 0.000 claims description 16
- 229920002545 silicone oil Polymers 0.000 claims description 16
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 13
- 239000011231 conductive filler Substances 0.000 claims description 10
- 239000011787 zinc oxide Substances 0.000 claims description 10
- 229920002050 silicone resin Polymers 0.000 claims description 8
- 239000000499 gel Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- -1 alkyl methoxy silane Chemical compound 0.000 claims description 4
- 239000007822 coupling agent Substances 0.000 claims description 4
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 150000004645 aluminates Chemical class 0.000 claims description 2
- OHAPIZYOVBUCCX-UHFFFAOYSA-N amino(methoxy)silicon Chemical compound CO[Si]N OHAPIZYOVBUCCX-UHFFFAOYSA-N 0.000 claims description 2
- 239000002041 carbon nanotube Substances 0.000 claims description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 2
- IBKNSIPMTGYUNZ-UHFFFAOYSA-N ethenyl(methoxy)silane Chemical compound CO[SiH2]C=C IBKNSIPMTGYUNZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- 230000007704 transition Effects 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 7
- 239000007788 liquid Substances 0.000 abstract description 6
- 238000004146 energy storage Methods 0.000 abstract description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- SCPWMSBAGXEGPW-UHFFFAOYSA-N dodecyl(trimethoxy)silane Chemical group CCCCCCCCCCCC[Si](OC)(OC)OC SCPWMSBAGXEGPW-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- RSKGMYDENCAJEN-UHFFFAOYSA-N hexadecyl(trimethoxy)silane Chemical group CCCCCCCCCCCCCCCC[Si](OC)(OC)OC RSKGMYDENCAJEN-UHFFFAOYSA-N 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000013523 DOWSIL™ Substances 0.000 description 1
- 229920013731 Dowsil Polymers 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000011232 storage material Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical compound [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/02—Materials undergoing a change of physical state when used
- C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
- C09K5/063—Materials absorbing or liberating heat during crystallisation; Heat storage materials
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The application discloses a high-performance heat-conducting phase-change material based on an organosilicon system, which comprises the following preparation raw materials in parts by weight: 0-10 parts of organosilicon wax, 0-15 parts of organosilicon polymer, 80-95 parts of heat conducting filler and 0-8 parts of treating agent. The application adopts the organic silicon wax with the phase transition temperature of 30-80 ℃ to play a role in hardening in the system, so that the system is easy to tear at a proper temperature, becomes liquid when the temperature is higher, has a certain energy storage effect, has higher compatibility with the organic silicon polymer, and can not overflow in a liquid state. And the heat conducting fillers with different types and different particle sizes are combined and matched, so that the heat conducting film has excellent heat conducting performance on the basis of improving the high filling quantity of the heat conducting fillers, and meanwhile, certain strength is met, and the film tearing is convenient.
Description
Technical Field
The application relates to a high-performance heat-conducting phase-change material based on an organosilicon system, and relates to C09K5/06, in particular to a heat transfer, heat exchange or heat storage material.
Background
With the development of technology and technology, electronic technology products increasingly tend to be miniaturized, and heat generated in the work of electronic products can cause damage to a machine body, so that devices are aged, the service life is shortened, and the functions are abnormal, so that the rapid conduction and emission of the heat are important technical problems to be solved by the electronic products. The common heat conducting material is heat conducting silicone grease, which has low heat resistance, but has pumping effect and is easy to pollute equipment. The heat-conducting phase-change material is solid at room temperature and is in a flowing paste state at the working temperature, so that heat can be absorbed, and the heat-conducting efficiency is improved. The filling amount of the heat conduction filler of the heat conduction phase change material on the market at present is not high, the heat conduction coefficient is smaller, and the actual requirement is difficult to meet.
Chinese patent No. 113956852a discloses a heat-conducting phase-change gel material, wherein the phase-change material is fixed in a three-dimensional cross-linked network of organic silicon, and is not precipitated even if heated to be liquid, and the state characteristics of the gel material can extrude the heat-conducting filler more tightly, thereby improving the heat-conducting efficiency, but the gel material is inconvenient to use, and the gel material has lower strength and is not easy to tear when being torn by using a release film. Chinese patent No. CN104650817a discloses a heat-conducting phase-change material and a preparation method thereof, wherein the heat-conducting phase-change material is made into a sheet, and is solid at room temperature after being pressed, formed and cooled, so that the heat-conducting phase-change material is convenient to use, but the addition amount of the heat-conducting filler is not high, and better heat-conducting property is difficult to achieve.
Disclosure of Invention
In order to improve the compatibility of a heat conduction system and the heat conduction performance of the heat conduction system, and simultaneously facilitate the tearing of a release film, the first aspect of the document of the application provides a high-performance heat conduction phase change material based on an organosilicon system, and the preparation raw materials comprise, by weight: 0-10 parts of organosilicon wax, 0-15 parts of organosilicon polymer, 80-95 parts of heat conducting filler and 0-8 parts of treating agent.
In one embodiment of the present application, the weight part of the heat conductive filler is 85 to 95 parts, and more preferably, the weight part of the heat conductive filler is 90 to 95 parts.
In one embodiment of the application, the preparation raw materials comprise, in parts by weight: 0-5 parts of organosilicon wax, 0-8 parts of organosilicon polymer and 0-5 parts of treating agent.
In one embodiment of the present application, the silicone polymer is selected from one or a combination of several of linear silicone oils, silicone resins, silicone gels.
In one embodiment of the application, the viscosity of the linear silicone oil is from 100 to 1000000mpa.s and the viscosity of the silicone resin is from 1000 to 100000mpa.s.
In one embodiment of the present application, the linear silicone oil is selected from one or a combination of several of methyl silicone oil, vinyl silicone oil and hydroxyl silicone oil. The viscosity of the linear silicone oil is 1000-100000mPa.s.
In one embodiment of the present application, the silicone resin is selected from one or a combination of methyl silicone resin and vinyl silicone resin.
In one embodiment of the application, the organic silicon gel is prepared by reaction and solidification of vinyl silicone oil, hydrogen-containing silicone oil, platinum catalyst and inhibitor.
In one embodiment of the application, the silicone wax has a phase transition temperature of 30-80 ℃.
In one embodiment of the application, the silicone wax has a phase transition temperature of 40-60 ℃.
The organic silicon wax with the phase transition temperature of 40-60 ℃ is used, the synergistic effect with the organic silicon resin can be regulated, a film layer with proper mechanical property is formed, the film is easy to tear at proper temperature, the system has certain energy storage effect, the compatibility with the organic silicon resin is better, and the liquid state is not easy to overflow.
In one embodiment of the present application, the treating agent is selected from one or a combination of several of aluminate coupling agent, silane coupling agent, titanate coupling agent.
In one embodiment of the present application, the silane coupling agent is selected from one or a combination of several of alkyl methoxy silane coupling agents, alkyl ethoxy silane coupling agents, amino methoxy silane coupling agents, vinyl methoxy silane coupling agents.
And the surface of the heat conducting filler is modified, so that the compatibility between the filler and the base polymer is improved, and the viscosity of the system is reduced.
In one embodiment of the present application, the heat conductive filler is selected from one or a combination of several of aluminum oxide, zinc oxide, boron nitride, aluminum powder, silver powder, graphene, and carbon nanotubes.
The heat-conducting filler is used for improving the heat-conducting property of a heat-conducting phase-change system, and the matching of the heat-conducting phase-change fillers with different types and different particle sizes can improve the filling quantity of the heat-conducting filler of the system, ensure excellent heat-conducting property and meet certain strength requirements.
In one embodiment of the present application, the thermally conductive filler is a combination of aluminum oxide, zinc oxide and aluminum powder.
In one embodiment of the present application, the particle size of the thermally conductive filler is 0.1 to 100. Mu.m, preferably the thermally conductive filler comprises 3 different particle size ranges selected from the group consisting of combinations of several of the particle size ranges of 5 to 100. Mu.m, 1 to 50. Mu.m, 0.1 to 20. Mu.m, 0.1 to 5. Mu.m.
In one embodiment of the application, the thermally conductive filler comprises 3 different particle size ranges, the thermally conductive filler being a combination of 3 filler species particle sizes.
In one embodiment of the present application, the first filler is aluminum powder having a particle size in the range of 5 to 100 μm; the second filler is aluminum powder with the particle size range of 1-50 mu m; the third filler is zinc oxide with the particle size range of 0.1-20 μm.
In one embodiment of the present application, the first filler is aluminum powder having a particle size in the range of 5 to 30 μm; the second filler is aluminum powder with the particle size range of 1-10 mu m; the third filler is zinc oxide with the particle size range of 0.1-5 μm.
In one embodiment of the present application, the first filler comprises 30-90% by mass of the total filler; the second filler accounts for 10-90% of the total filler by mass; the third filler accounts for 0-90% of the total filler by mass.
The applicant finds that in the experimental process, the heat conduction performance can be improved and the heat resistance can be reduced by introducing the filler with the mass ratio of more than 90%, but the compatibility between the heat conduction filler and the resin polymer can be reduced, so that the heat conduction performance is reduced and the expected high heat conduction performance cannot be realized. The possible reasons for the guess are: when a heat conducting filler with single particle size and mass ratio of more than 90% is introduced, gaps are generated between the filler and the resin polymer when the particle size of the filler is large, the filler forms an island effect in the resin polymer, and the existence of the gaps can reduce the heat conducting performance, so that the expected ideal heat conducting effect cannot be realized; when the particle size of the heat conducting filler is small, the strength of the filler in the resin polymer is low, and the formed phase change material and the release film are not easy to tear, so that the use effect is poor.
The second aspect of the present application provides a method for preparing a high-performance heat-conducting phase-change material based on an organosilicon system, comprising the following steps:
(1) Uniformly mixing the organosilicon polymer and the organosilicon wax at a certain temperature;
(2) Adding the heat conducting filler and the treating agent in batches and uniformly mixing;
(3) Treating the low volatile components at 100-150 ℃ under vacuum;
(4) Pressing into different thicknesses by a calender.
In one embodiment of the application, the mixing temperature in the step 1 is 40-80 ℃ and the treatment time is 0-1h;
wherein the organosilicon polymer and the organosilicon wax are mixed by a kneader; wherein the silicone polymer is preferably 0-8 parts, and the silicone wax is preferably 0-5 parts.
In one embodiment of the present application, the treatment temperature in the step 2 is 40-80 ℃ and the treatment time is 0-3h. The heat conducting filler is preferably 90-95 parts, the treating agent is preferably 0-5 parts, and the heat conducting filler and the treating agent are sequentially added into the mixture after being uniformly mixed in the step 1 in batches.
In one embodiment of the application, the vacuum pressure of step 3 is greater than-100 kPa, preferably at 120 ℃.
Compared with the prior art, the application has the following beneficial effects:
(1) The high-performance heat-conducting phase-change material based on the organic silicon system provided by the application adopts the organic silicon wax with the phase-change temperature of 30-80 ℃ to play a role in hardening in the system, so that the system is easy to tear a film at a proper temperature, becomes liquid when the temperature is higher, has a certain energy storage effect, has higher compatibility with an organic silicon polymer, and cannot overflow in a liquid state.
(2) The high-performance heat-conducting phase-change material based on the organic silicon system adopts the combination and collocation of the heat-conducting fillers with different types and different particle sizes, has excellent heat-conducting performance on the basis of improving the high filling quantity of the heat-conducting fillers, meets certain strength, and is convenient for tearing films.
(3) According to the high-performance heat-conducting phase-change material based on the organic silicon system, the silane coupling agent is used for treating the heat-conducting filler, so that the compatibility between the heat-conducting filler and the organic silicon polymer is increased, the viscosity of the system is reduced, the filling amount of the heat-conducting filler is increased, and the heat-conducting property is improved.
(4) The high-performance heat-conducting phase-change material based on the organic silicon system adopts the linear organic silicone oil with the viscosity of 1000-100000mPa.s, so that the system can be pressed to a thinner thickness under the condition of working temperature and pressure on the basis of ensuring easy film tearing, is suitable for heat-conducting environments with various thicknesses, is solid at normal temperature, can be directly pasted, and is vacuumized in the preparation process, thereby avoiding the influence of bubbles.
Detailed Description
Example 1
The high-performance heat-conducting phase-change material based on the organic silicon system comprises the following preparation raw materials in parts by weight: 0.8 parts of organosilicon wax, 4.9 parts of organosilicon polymer, 93 parts of heat conducting filler and 1.3 parts of treating agent.
The phase transition temperature of the silicone wax was 58 ℃ and was purchased from the company of the company Anhui Aijia silicone oil Co.
The organosilicon polymer is methyl linear organosilicon oil, the viscosity is 10000 Pa.s, and the organosilicon polymer is purchased from German Wake, and the model is AK-10000.
The heat-conducting filler comprises a first filler, a second filler, a third filler and a fourth filler, wherein the first filler is aluminum powder, the particle size range is 10 mu m, and the mass fraction of the first filler is 40% of the total filler; the second filler is aluminum powder, the grain diameter range is 3 mu m, and the mass fraction of the second filler is 30% of the total filler; the third filler is zinc oxide, the particle size range is 0.9 mu m, and the third filler accounts for 20% of the total filler by mass.
The treating agent is hexadecyl trimethoxy silane.
A preparation method of a high-performance heat-conducting phase-change material based on an organosilicon system comprises the following steps:
(1) Uniformly mixing the organosilicon polymer and the organosilicon wax at 60 ℃ for 0.5h;
(2) Adding the heat conducting filler and the treating agent in batches, uniformly mixing, wherein the treatment temperature is 60 ℃, and the treatment time is 2 hours;
(3) Treating the low volatile components at 120 ℃ under vacuum, wherein the vacuum pressure is-90 kPa;
(4) Pressing into specific thickness by a calender.
Example 2
The high-performance heat-conducting phase-change material based on the organic silicon system comprises the following preparation raw materials in parts by weight: 0.8 parts of organosilicon wax, 4.9 parts of organosilicon polymer, 93 parts of heat conducting filler and 1.3 parts of treating agent.
The phase transition temperature of the silicone wax was 58 ℃ and was purchased from the company of the company Anhui Aijia silicone oil Co.
The organosilicon polymer is methyl linear organosilicon oil, the viscosity is 10000 Pa.s, and the organosilicon polymer is purchased from German Wake, and the model is AK-10000.
The heat-conducting filler comprises a first filler, a second filler, a third filler and a fourth filler, wherein the first filler is aluminum powder, the particle size range is 10 mu m, and the mass fraction of the first filler is 40% of the total filler; the second filler is aluminum powder, the grain diameter range is 3 mu m, and the mass fraction of the second filler is 30% of the total filler; the third filler is zinc oxide, the particle size range is 0.9 mu m, and the third filler accounts for 20% of the total filler by mass.
The treating agent is dodecyl trimethoxy silane.
A preparation method of a high-performance heat-conducting phase-change material based on an organosilicon system comprises the following steps:
(1) Uniformly mixing the organosilicon polymer and the organosilicon wax at 60 ℃ for 0.5h;
(2) Adding the heat conducting filler and the treating agent in batches, uniformly mixing, wherein the treatment temperature is 60 ℃, and the treatment time is 2 hours;
(3) Treating the low volatile components at 120 ℃ under vacuum, wherein the vacuum pressure is-90 kPa;
(4) Pressing into specific thickness by a calender.
Example 3
The high-performance heat-conducting phase-change material based on the organic silicon system comprises the following preparation raw materials in parts by weight: 0.8 parts of organosilicon wax, 5.9 parts of organosilicon polymer and 92 parts of heat conducting filler. 1.3 parts of treating agent.
The phase transition temperature of the silicone wax was 58 ℃ and was purchased from the company of the company Anhui Aijia silicone oil Co.
The organosilicon polymer is methyl linear organosilicon oil, the viscosity is 10000 Pa.s, and the organosilicon polymer is purchased from German Wake, and the model is AK-10000.
The heat-conducting filler comprises a first filler, a second filler, a third filler and a fourth filler, wherein the first filler is aluminum powder, the particle size range is 10 mu m, and the mass fraction of the first filler is 40% of the total filler; the second filler is aluminum powder, the grain diameter range is 3 mu m, and the mass fraction of the second filler is 30% of the total filler; the third filler is zinc oxide, the particle size range is 0.9 mu m, and the third filler accounts for 20% of the total filler by mass.
The treating agent is dodecyl trimethoxy silane.
A preparation method of a high-performance heat-conducting phase-change material based on an organosilicon system comprises the following steps:
(1) Uniformly mixing the organosilicon polymer and the organosilicon wax at 60 ℃ for 0.5h;
(2) Adding the heat conducting filler and the treating agent in batches, uniformly mixing, wherein the treatment temperature is 60 ℃, and the treatment time is 2 hours;
(3) Treating the low volatile components at 120 ℃ under vacuum, wherein the vacuum pressure is-90 kPa;
(4) Pressing into specific thickness by a calender.
Example 4
The high-performance heat-conducting phase-change material based on the organic silicon system comprises the following preparation raw materials in parts by weight: 0.8 parts of organosilicon wax, 5.9 parts of organosilicon polymer and 92 parts of heat conducting filler. 1.3 parts of treating agent.
The phase transition temperature of the silicone wax was 58 ℃ and was purchased from the company of the company Anhui Aijia silicone oil Co.
The organosilicon polymer is methyl linear organosilicon oil, the viscosity is 10000 Pa.s, and the organosilicon polymer is purchased from German Wake, and the model is AK-10000.
The heat-conducting filler comprises a first filler, a second filler, a third filler and a fourth filler, wherein the first filler is aluminum powder, the particle size range is 10 mu m, and the mass fraction of the first filler is 40% of the total filler; the second filler is aluminum powder, the grain diameter range is 3 mu m, and the mass fraction of the second filler is 30% of the total filler; the third filler is zinc oxide, the particle size range is 0.9 mu m, and the third filler accounts for 20% of the total filler by mass.
The treating agent is a combination of hexadecyl trimethoxy silane and dodecyl trimethoxy silane, and the weight ratio is 0.6:0.7.
a preparation method of a high-performance heat-conducting phase-change material based on an organosilicon system comprises the following steps:
(1) Uniformly mixing the organosilicon polymer and the organosilicon wax at 60 ℃ for 0.5h;
(2) Adding the heat conducting filler and the treating agent in batches, uniformly mixing, wherein the treatment temperature is 60 ℃, and the treatment time is 2 hours;
(3) Treating the low volatile components at 120 ℃ under vacuum, wherein the vacuum pressure is-90 kPa;
(4) Pressing into specific thickness by a calender.
Example 5
The high-performance heat-conducting phase-change material based on the organic silicon system comprises the following preparation raw materials in parts by weight: 0.8 parts of organosilicon wax, 5.9 parts of organosilicon polymer and 92 parts of heat conducting filler. 1.3 parts of treating agent.
The phase transition temperature of the silicone wax was 58 ℃ and was purchased from the company of the company Anhui Aijia silicone oil Co.
The silicone polymer was a methyl silicone resin with a viscosity of 11000mpa.s, available from dow, usa under the trade designation DOWSIL 1 9770 release.
The heat-conducting filler comprises a first filler, a second filler, a third filler and a fourth filler, wherein the first filler is aluminum powder, the particle size range is 10 mu m, and the mass fraction of the first filler is 40% of the total filler; the second filler is aluminum powder, the grain diameter range is 3 mu m, and the mass fraction of the second filler is 30% of the total filler; the third filler is zinc oxide, the particle size range is 0.9 mu m, and the third filler accounts for 20% of the total filler by mass.
The treating agent is a combination of hexadecyl trimethoxy silane and dodecyl trimethoxy silane, and the weight ratio is 0.6:0.7.
a preparation method of a high-performance heat-conducting phase-change material based on an organosilicon system comprises the following steps:
(1) Uniformly mixing the organosilicon polymer and the organosilicon wax at 60 ℃ for 0.5h;
(2) Adding the heat conducting filler and the treating agent in batches, uniformly mixing, wherein the treatment temperature is 60 ℃, and the treatment time is 2 hours;
(3) Treating the low volatile components at 120 ℃ under vacuum, wherein the vacuum pressure is-90 kPa;
(4) Pressing into specific thickness by a calender.
The specific procedure is as in example 1, except that
Performance testing
1. Thermal resistance: the thermal resistance of the prepared heat-conducting phase-change material is tested according to the ASTM D5470 standard under the conditions of 80 ℃ and 50 kPa.
2. Interface thickness: the prepared heat-conducting phase-change material is tested according to the ASTM D5470 standard, and the interface thickness of the heat-conducting phase-change material is 50kPa at 80 ℃.
The test results are shown in Table 1.
TABLE 1
Claims (10)
1. The high-performance heat-conducting phase-change material based on the organic silicon system is characterized by comprising the following preparation raw materials in parts by weight: 0-10 parts of organosilicon wax, 0-15 parts of organosilicon polymer, 80-95 parts of heat conducting filler and 0-8 parts of treating agent.
2. The high performance thermally conductive phase change material based on a silicone system of claim 1, wherein the silicone polymer is selected from one or a combination of several of linear silicone oils, silicone resins, silicone gels.
3. The high performance thermally conductive phase change material based on a silicone system according to claim 2, wherein the viscosity of the linear silicone oil is 100-1000000mpa.s and the viscosity of the silicone resin is 1000-100000mpa.s.
4. The high performance thermally conductive phase change material based on a silicone system of claim 1, wherein the phase change temperature of the silicone wax is 30-80 ℃.
5. The high-performance heat-conducting phase change material based on an organosilicon system according to claim 1, wherein the treating agent is one or a combination of several of aluminate coupling agents, silane coupling agents and titanate coupling agents.
6. The high-performance heat-conducting phase change material based on an organosilicon system according to claim 1, wherein the silane coupling agent is selected from one or a combination of several of alkyl methoxy silane coupling agents, alkyl ethoxy silane coupling agents, amino methoxy silane coupling agents and vinyl methoxy silane coupling agents.
7. The high-performance heat-conducting phase-change material based on an organic silicon system according to claim 1, wherein the heat-conducting filler is selected from one or a combination of several of aluminum oxide, zinc oxide, boron nitride, aluminum powder, silver powder, graphene and carbon nanotubes.
8. The high performance thermally conductive phase change material based on a silicone system according to claim 1, wherein the particle size of the thermally conductive filler is 0.1-100 μm; the thermally conductive filler comprises 3 different particle size ranges selected from the group consisting of combinations of several of the particle size ranges of 5-100 μm,1-50 μm,0.1-20 μm.
9. A method for preparing a high performance thermally conductive phase change material based on an organosilicon system according to any one of claims 1-8, comprising the steps of:
(1) Uniformly mixing the organosilicon polymer and the organosilicon wax at a certain temperature;
(2) Adding the heat conducting filler and the treating agent in batches and uniformly mixing;
(3) Treating the low volatile components at 100-150 ℃ under vacuum;
(4) Pressing into different thicknesses by a calender.
10. The method for preparing the high-performance heat-conducting phase-change material based on the organic silicon system according to claim 9, wherein the mixing temperature in the step 1 is 40-80 ℃ and the treatment time is 0-1h.
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