CN116063852A - High-flexibility heat-conducting gasket and preparation process thereof - Google Patents
High-flexibility heat-conducting gasket and preparation process thereof Download PDFInfo
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- CN116063852A CN116063852A CN202211441899.1A CN202211441899A CN116063852A CN 116063852 A CN116063852 A CN 116063852A CN 202211441899 A CN202211441899 A CN 202211441899A CN 116063852 A CN116063852 A CN 116063852A
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- vinyl
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- silicone oil
- heat
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- 238000002360 preparation method Methods 0.000 title abstract description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 48
- -1 polydimethylsiloxane Polymers 0.000 claims abstract description 48
- 229920002545 silicone oil Polymers 0.000 claims abstract description 45
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 43
- 239000001257 hydrogen Substances 0.000 claims abstract description 40
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 40
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 33
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 26
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 26
- 239000000945 filler Substances 0.000 claims abstract description 14
- 239000003054 catalyst Substances 0.000 claims abstract description 12
- 239000003112 inhibitor Substances 0.000 claims abstract description 11
- 239000007822 coupling agent Substances 0.000 claims abstract description 9
- 239000002994 raw material Substances 0.000 claims abstract description 6
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 46
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 45
- 239000011787 zinc oxide Substances 0.000 claims description 23
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 16
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 13
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- 239000002041 carbon nanotube Substances 0.000 claims description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000011231 conductive filler Substances 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000004132 cross linking Methods 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000002245 particle Substances 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical compound [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to the technical field of heat-conducting gaskets, in particular to the field of IPC C08L83, and further relates to a high-flexibility heat-conducting gasket and a preparation process thereof. The adhesive comprises the following raw materials in parts by weight: 20-50 parts of vinyl silicone oil, 10-20 parts of hydrogen-containing silicone oil, 50-200 parts of heat conducting filler, 0.1-2 parts of catalyst, 1-5 parts of coupling agent and 0.1-2 parts of inhibitor. According to the invention, the vinyl-terminated polydimethylsiloxane with different viscosities is selected, and the weight ratio is controlled, so that the moderate crosslinking degree between the vinyl-terminated polydimethylsiloxane and the hydrogen-containing silicone oil can be formed, and the heat-conducting filler has good dispersibility, so that the flexibility of the heat-conducting gasket is improved, and the heat-conducting property of the heat-conducting gasket is also improved.
Description
Technical Field
The invention relates to the technical field of heat-conducting gaskets, in particular to the field of IPC C08L83, and further relates to a high-flexibility heat-conducting gasket and a preparation process thereof.
Background
With the gradual development of the electronic components to the high integration and high power, the heat flux density of the components is rapidly increased, and the efficient heat transfer and dissipation becomes a problem to be solved in the electronic industry.
The heat conducting gasket is a heat conducting medium material which is synthesized by taking silica gel as a base material and adding heat conducting filler through various processes, is specially used for filling an air gap between a heating device and a radiating fin or a metal base, has good flexibility, and is used for covering a very uneven surface, so that heat is transferred out, and the effect of protecting the components is achieved.
Chinese patent CN 107880842A discloses a flexible heat-conducting gasket and a method for preparing the same, wherein the flexible heat-conducting gasket comprises a component a and a component B according to a certain proportion, the raw materials for preparing the component a are a base adhesive and a catalyst, and the raw materials for preparing the component B mainly comprise the base adhesive, a cross-linking agent, a chain extender and hydrogen-containing silane. According to the technical scheme, the flexibility of the heat conduction gasket is improved to a certain extent, the viscosity is also controlled properly, good adhesion with a base material is ensured, the heat conduction gasket is easily peeled off from the release film and is convenient to use, but the heat conduction filler consumption is large, and the heat conduction performance of the heat conduction gasket is also to be improved.
Disclosure of Invention
The invention provides a high-flexibility heat-conducting gasket, which comprises the following raw materials in parts by weight: 20-50 parts of vinyl silicone oil, 10-20 parts of hydrogen-containing silicone oil, 50-200 parts of heat conducting filler, 0.1-2 parts of catalyst, 1-5 parts of coupling agent and 0.1-2 parts of inhibitor.
In some preferred embodiments, the vinyl silicone oil is selected from vinyl-terminated polydimethylsiloxanes and/or vinyl-terminated polymethylvinylsiloxanes.
Preferably, the vinyl silicone oil is vinyl terminated polydimethylsiloxane.
Preferably, the viscosity of the vinyl-terminated polydimethylsiloxane is from 250 to 60000 mPas.
Preferably, the vinyl-terminated polydimethylsiloxane has a vinyl content of from 0.08 to 0.7 weight percent.
Preferably, the viscosity of the vinyl-terminated polydimethylsiloxane is 300-20000 mpa.s.
Preferably, the vinyl-terminated polydimethylsiloxane has a vinyl content of from 0.55 to 0.7 weight percent.
Preferably, the vinyl-terminated polydimethylsiloxane comprises a vinyl-terminated polydimethylsiloxane having a viscosity of 500 mPas, a vinyl-terminated polydimethylsiloxane having a viscosity of 5000 mPas, and a vinyl-terminated polydimethylsiloxane having a viscosity of 10000 mPas.
Preferably, the weight ratio of the vinyl-terminated polydimethylsiloxane having a viscosity of 500 mPas, the vinyl-terminated polydimethylsiloxane having a viscosity of 5000 mPas, and the vinyl-terminated polydimethylsiloxane having a viscosity of 10000 mPas is (5-10): (1-3): (3-6).
The applicant has found that by adding three vinyl-terminated polydimethylsiloxanes of different viscosities, the flexibility of the thermal pad can be effectively improved, especially when the weight ratio of vinyl-terminated polydimethylsiloxanes of viscosity 500 mPa-s, vinyl-terminated polydimethylsiloxanes of viscosity 5000 mPa-s, vinyl-terminated polydimethylsiloxanes of viscosity 10000 mPa-s is (5-10): (1-3): and (3-6), the flexibility of the heat conduction gasket is improved, and the heat conduction property of the heat conduction gasket can be further improved. The applicant guesses that: on the one hand, the crosslinking degree formed between the vinyl-terminated polydimethylsiloxane with different viscosities and the hydrogen-containing silicone oil in the weight ratio is moderate, and insufficient crosslinking degree or excessive crosslinking points caused by excessive crosslinking degree can not be caused, so that the flexibility of the heat-conducting gasket is improved; on the other hand, the heat-conducting filler can be uniformly dispersed in vinyl-terminated polydimethylsiloxane with different viscosities in the weight ratio, so that the aggregation phenomenon of the heat-conducting filler is reduced, and the heat-conducting property of the heat-conducting gasket is improved.
In some preferred embodiments, the hydrogen-containing silicone oil is selected from side chain hydrogen-containing silicone oils and/or terminal hydrogen-containing silicone oils.
Preferably, the hydrogen-containing silicone oil is side chain hydrogen-containing silicone oil or terminal hydrogen-containing silicone oil.
Preferably, the weight ratio of the side chain hydrogen-containing silicone oil to the terminal hydrogen-containing silicone oil is (0.2-0.5): 1.
Preferably, the viscosity of the side chain hydrogen-containing silicone oil is 30-100 mPas, and the hydrogen content is 0.5-1.5%.
Preferably, the viscosity of the hydrogen-containing silicone oil at the end is 10-100 mPas, and the hydrogen content is 0.05-0.2%.
In some preferred embodiments, the thermally conductive filler is selected from one or more combinations of aluminum oxide, aluminum hydroxide, zinc oxide, boron nitride, aluminum nitride, ceramic powder, aluminum powder, graphite powder, silicon carbide powder, carbon fiber, carbon nanotubes, graphene.
Preferably, the heat conducting filler is a combination of zinc oxide, silicon carbide powder and graphite powder.
Preferably, the weight ratio of the zinc oxide to the silicon carbide to the graphite powder is (3-6): (1-3): (5-10).
Preferably, the particle size of the zinc oxide is 10-100nm.
Preferably, the zinc oxide includes zinc oxide having a particle size of 20nm and zinc oxide having a particle size of 80 nm.
Preferably, the weight ratio of 20nm zinc oxide to 80nm zinc oxide is (0.5-2): 1.
Preferably, the grain size of the silicon carbide powder is 50nm.
Preferably, the graphite powder is flake graphite powder, the thickness is smaller than 40nm, and the flake diameter is 3-6 mu m.
In some preferred embodiments, the catalyst is a platinum catalyst.
In some preferred embodiments, the coupling agent is selected from a silane coupling agent or a carbonate coupling agent.
In some preferred embodiments, the inhibitor is selected from any one of maleate, fumarate, hydrosilylation, alkynol inhibitors.
The invention also provides a preparation process of the high-flexibility heat-conducting gasket, which comprises the following steps of:
according to the weight parts, the heat conducting filler and the coupling agent are uniformly mixed, then vinyl silicone oil, hydrogen-containing silicone oil, a catalyst and an inhibitor are added, and the mixture is rolled after uniform mixing.
The beneficial effects are that: the present invention is prepared by selecting a vinyl-terminated polydimethylsiloxane having a viscosity of 500 mPas, a vinyl-terminated polydimethylsiloxane having a viscosity of 5000 mPas, and a vinyl-terminated polydimethylsiloxane having a viscosity of 10000 mPas, and controlling the weight ratio thereof to be (5-10): (1-3): (3-6) can form moderate crosslinking degree with hydrogen-containing silicone oil, and zinc oxide, silicon carbide powder and graphite powder in the system have good dispersibility, so that the flexibility of the heat-conducting gasket is improved, and the heat-conducting property of the heat-conducting gasket is also improved.
Detailed Description
Example 1
The embodiment 1 provides a high-flexibility heat-conducting gasket, which comprises the following raw materials in parts by weight: 40 parts of vinyl silicone oil, 15 parts of hydrogen-containing silicone oil, 100 parts of heat-conducting filler, 1 part of catalyst, 3 parts of coupling agent and 1 part of inhibitor.
The vinyl silicone oil comprises vinyl-terminated polydimethylsiloxane with the viscosity of 500 mPas, vinyl-terminated polydimethylsiloxane with the viscosity of 5000 mPas and vinyl-terminated polydimethylsiloxane with the viscosity of 10000 mPas; the vinyl-terminated polydimethylsiloxane having a viscosity of 500 mPas, the vinyl-terminated polydimethylsiloxane having a viscosity of 5000 mPas, and the vinyl-terminated polydimethylsiloxane having a viscosity of 10000 mPas have a vinyl content of 0.43wt%, 0.18wt% and 0.12wt%, respectively; purchased from Jiangsu Kong New materials Co., ltd, model numbers are V-500, V-5000 and V-10000, respectively.
The weight ratio of the vinyl-terminated polydimethylsiloxane with the viscosity of 500 mPas, the vinyl-terminated polydimethylsiloxane with the viscosity of 5000 mPas and the vinyl-terminated polydimethylsiloxane with the viscosity of 10000 mPas is 8:2:5.
the hydrogen-containing silicone oil is side chain hydrogen-containing silicone oil and terminal hydrogen-containing silicone oil.
The weight ratio of the side chain hydrogen-containing silicone oil to the terminal hydrogen-containing silicone oil is 0.3:1.
the viscosity of the side chain hydrogen-containing silicone oil is 30-100 mPas, and the hydrogen content is 0.75+/-0.02%; purchased from Shanghai Sibao high New Material Co., ltd., model: MH750.
The viscosity of the hydrogen-containing silicone oil at the end is 40-60 mPas, and the hydrogen content is 0.07+/-0.01%; purchased from Shanghai Sibao high New Material Co., ltd., model: MDH70.
The heat conducting filler is a combination of zinc oxide, silicon carbide powder and graphite powder.
The weight ratio of the zinc oxide to the silicon carbide to the graphite powder is 5:5:8.
the zinc oxide comprises zinc oxide with the particle size of 20nm and zinc oxide with the particle size of 80 nm; purchased from BoHuasi nanotechnology (Ningbo) Inc., model numbers Brofos-ZnO-20 and Brofos-ZnO-80, respectively.
The weight ratio of the zinc oxide with the particle size of 20nm to the zinc oxide with the particle size of 80nm is 1:1.
the grain diameter of the silicon carbide powder is 50nm, and the silicon carbide powder is purchased from Shanghai super-Wei nano technology Co., ltd., model: CW-TiC-001.
The graphite powder is flake graphite powder with the thickness of less than 40nm and the flake diameter of 3-6 mu m, and is purchased from Jiangsu Xianfeng nano materials science and technology Co.
The catalyst is a platinum catalyst, and is purchased from silicon friend new materials science and technology Co., ltd., model: PT-5000 series.
The coupling agent is a silane coupling agent, and is purchased from Anhui silicon Bao organosilicon New Material Co., ltd., model: GX-171.
The inhibitor is an alkynol inhibitor, and is purchased from Shanghai Sibao advanced materials Co., ltd., model: MA8900.
A preparation process of a high-flexibility heat-conducting gasket comprises the following steps:
according to the weight parts, zinc oxide, silicon carbide powder, graphite powder and a silane coupling agent are uniformly mixed, then polydimethylsiloxane with different viscosity and vinyl end caps, side chain hydrogen-containing silicone oil, terminal hydrogen-containing silicone oil, platinum catalyst and alkynol inhibitor are added, and the mixture is uniformly mixed and then rolled to obtain the modified silicon carbide.
Example 2
Example 2 provides a highly flexible thermally conductive gasket, the specific embodiment of which is the same as example 1, wherein the vinyl silicone oil comprises vinyl-terminated polydimethylsiloxane having a viscosity of 500 mPa-s and vinyl-terminated polydimethylsiloxane having a viscosity of 5000 mPa-s, and the weight ratio is 8:2.
example 3
Example 3 provides a highly flexible thermally conductive gasket, the specific embodiment of which is the same as example 1, wherein the vinyl silicone oil comprises vinyl-terminated polydimethylsiloxane having a viscosity of 5000 mPa-s and vinyl-terminated polydimethylsiloxane having a viscosity of 10000 mPa-s, in a weight ratio of 2:5.
example 4
Example 4 provides a highly flexible heat conductive gasket, the specific embodiment of which is the same as example 1, wherein the particle size of the zinc oxide is 150nm, and the zinc oxide is purchased from Bows nanotechnology (Ningbo) limited, and the types of the zinc oxide are respectively Brofos-ZnO-100.
Example 5
Embodiment 5 provides a high-flexibility heat-conducting gasket, and the specific implementation manner of the high-flexibility heat-conducting gasket is the same as that of embodiment 1, wherein the heat-conducting filler is a combination of zinc oxide and silicon carbide powder, and the weight ratio is 1:1.
example 6
Example 6 provides a highly flexible thermally conductive gasket, the specific embodiment of which is the same as example 1, except that the weight ratio of vinyl-terminated polydimethylsiloxane having a viscosity of 500 mPa-s, vinyl-terminated polydimethylsiloxane having a viscosity of 5000 mPa-s, vinyl-terminated polydimethylsiloxane having a viscosity of 10000 mPa-s is 15:2:2.
performance test: the highly flexible thermally conductive gaskets prepared in examples 1-6 were tested as follows:
1. thermal conductivity coefficient: the results are reported in Table 1, with reference to ASTM D5470 standard.
2. Tensile strength and elongation at break: the results are recorded in Table 1, with reference to the GB/T528-2009 standard.
3. Hardness: the results are recorded in table 1 using a shore durometer test in AM mode.
Test results
Table 1:
Claims (10)
1. the high-flexibility heat-conducting gasket is characterized by comprising the following raw materials in parts by weight: 20-50 parts of vinyl silicone oil, 10-20 parts of hydrogen-containing silicone oil, 50-200 parts of heat conducting filler, 0.1-2 parts of catalyst, 1-5 parts of coupling agent and 0.1-2 parts of inhibitor.
2. A highly flexible thermally conductive gasket according to claim 1 wherein said vinyl silicone oil is selected from vinyl terminated polydimethyl siloxane and/or vinyl terminated polymethylvinyl siloxane.
3. A highly flexible thermally conductive gasket as claimed in claim 2 wherein said vinyl terminated polydimethylsiloxane has a viscosity of 250 to 60000 mPa-s.
4. A highly flexible thermally conductive gasket according to claim 3 wherein said vinyl terminated polydimethylsiloxane has a vinyl content of 0.08 to 0.7 weight percent.
5. The highly flexible thermally conductive gasket of claim 4 wherein said vinyl terminated polydimethylsiloxane comprises a vinyl terminated polydimethylsiloxane having a viscosity of 500 mPa-s, a vinyl terminated polydimethylsiloxane having a viscosity of 5000 mPa-s, a vinyl terminated polydimethylsiloxane having a viscosity of 10000 mPa-s.
6. A highly flexible thermally conductive gasket according to claim 1, wherein the hydrogen containing silicone oil is selected from side chain hydrogen containing silicone oils and/or terminal hydrogen containing silicone oils.
7. The high-flexibility heat-conducting gasket according to claim 6, wherein the viscosity of the side-chain hydrogen-containing silicone oil is 30-100 mPa-s, and the hydrogen content is 0.5-1.5%.
8. The high-flexibility heat-conducting gasket according to claim 6, wherein the viscosity of the hydrogen-containing silicone oil is 10-100 mPa-s and the hydrogen content is 0.05-0.2%.
9. The high flexibility thermal conductive gasket of claim 1 wherein said thermal conductive filler is selected from one or more of aluminum oxide, aluminum hydroxide, zinc oxide, boron nitride, aluminum nitride, ceramic powder, aluminum powder, graphite powder, silicon carbide powder, carbon fiber, carbon nanotubes, graphene.
10. A process for preparing a highly flexible thermally conductive gasket according to any one of claims 1 to 9, comprising the steps of:
according to the weight parts, the heat conducting filler and the coupling agent are uniformly mixed, then vinyl silicone oil, hydrogen-containing silicone oil, a catalyst and an inhibitor are added, and the mixture is rolled after uniform mixing.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211441899.1A CN116063852A (en) | 2022-11-17 | 2022-11-17 | High-flexibility heat-conducting gasket and preparation process thereof |
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| CN202211441899.1A CN116063852A (en) | 2022-11-17 | 2022-11-17 | High-flexibility heat-conducting gasket and preparation process thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116515301A (en) * | 2023-06-02 | 2023-08-01 | 上海阿莱德实业股份有限公司 | Flexible high-heat-conductivity diamond-based heat-conducting gasket and preparation method thereof |
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2022
- 2022-11-17 CN CN202211441899.1A patent/CN116063852A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116515301A (en) * | 2023-06-02 | 2023-08-01 | 上海阿莱德实业股份有限公司 | Flexible high-heat-conductivity diamond-based heat-conducting gasket and preparation method thereof |
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