CN116787253A - Driving mechanism, wafer surface cleaning equipment and polishing equipment - Google Patents
Driving mechanism, wafer surface cleaning equipment and polishing equipment Download PDFInfo
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- CN116787253A CN116787253A CN202311042729.0A CN202311042729A CN116787253A CN 116787253 A CN116787253 A CN 116787253A CN 202311042729 A CN202311042729 A CN 202311042729A CN 116787253 A CN116787253 A CN 116787253A
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- wafer
- liquid
- output shaft
- water storage
- driving
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- 238000004140 cleaning Methods 0.000 title claims abstract description 62
- 238000005498 polishing Methods 0.000 title claims abstract description 15
- 239000007788 liquid Substances 0.000 claims abstract description 139
- 238000003860 storage Methods 0.000 claims abstract description 110
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 89
- 239000000463 material Substances 0.000 claims abstract description 38
- 230000002093 peripheral effect Effects 0.000 claims abstract description 13
- 238000001125 extrusion Methods 0.000 claims description 11
- 230000001105 regulatory effect Effects 0.000 claims description 10
- 239000012535 impurity Substances 0.000 abstract description 6
- 230000035939 shock Effects 0.000 abstract description 4
- 230000003139 buffering effect Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000013016 damping Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 210
- 238000009966 trimming Methods 0.000 description 11
- 238000012546 transfer Methods 0.000 description 9
- 238000001514 detection method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 230000001680 brushing effect Effects 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 230000004323 axial length Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000010808 liquid waste Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a driving mechanism, wafer surface cleaning equipment and polishing equipment, wherein the driving mechanism comprises a material rotating driving piece, an output shaft, a wheel body support and a driven wheel, the output shaft is connected to the material rotating driving piece and can rotate, the driven wheel is rotatably arranged on the wheel body support, the output shaft and/or the driven wheel is sleeved with an elastically deformable water storage sleeve, and the water storage sleeve releases liquid under a pressed state. The water storage sleeve can be pressurized under the pressure action of the edge of the wafer so as to discharge liquid with a certain initial speed, so that the peripheral edge of the wafer can be cleaned by using the liquid discharged from the water storage sleeve, impurities and grain residues on the surface of the wafer can be better removed, and the cleaning quality of the wafer is improved; in addition, the water storage sleeve can play a certain buffering and damping role on the wafer, reduces the probability of damage of the wafer caused by shock impact, and is beneficial to improving the yield of the wafer.
Description
Technical Field
The invention relates to the technical field of semiconductor material processing, in particular to a driving mechanism, wafer surface cleaning equipment and polishing equipment.
Background
Wafers are a widely used material in the fields of photovoltaic products, semiconductor devices, etc. The wafer is polished after cutting the ingot into a plurality of sheet-like structures to obtain a round thin plate-like wafer, and in order to improve the quality and reliability of a product made of the wafer, the wafer needs to be cleaned with a cleaning liquid.
The prior wafer surface cleaning equipment comprises a brush roller and a driving mechanism, wherein the brush roller is used for brushing the round end face of a wafer, the driving mechanism comprises a rotatable rotating wheel, the rotating wheel contacts the periphery of the wafer to drive the wafer to rotate, and the brush roller repeatedly brushes the wafer along with the reciprocating rotation of the wafer.
The wafer surface cleaning equipment is difficult to fully meet the current requirements, the periphery of the wafer cannot be sufficiently brushed and showered, the cleaning waste liquid mixed with impurities can generate wall-hanging liquid drops on the periphery of the wafer, and the periphery of the wafer is required to be specially cleaned to eliminate residual impurities and waste liquid; in addition, a large pressure is required to be generated between the runner and the outer periphery of the wafer to avoid slipping of the runner relative to the wafer, which increases the probability of wafer damage and decreases the resistance of the wafer to environmental shock impact.
Disclosure of Invention
In view of the above, it is necessary to provide a driving mechanism capable of improving insufficient wafer cleaning and improving wafer cleaning effect.
The driving mechanism comprises a material rotating driving piece, an output shaft, a wheel body support and a driven wheel, wherein the output shaft is connected to the material rotating driving piece and can rotate, the driven wheel is rotatably arranged on the wheel body support, the output shaft and/or the driven wheel is sleeved with an elastically deformable water storage sleeve, and the water storage sleeve releases liquid under a pressed state.
Compared with the prior art, the driving mechanism has the following beneficial effects:
1) The water storage sleeve is directly contacted with the periphery of the wafer, the water storage sleeve releases the liquid stored in the water storage sleeve after being subjected to the pressure of the wafer, and under the condition that the water storage sleeve is subjected to the pressure deformation, the liquid in the water storage sleeve is pressurized, so that the liquid is discharged from the water storage sleeve at a certain initial speed, the effect of Zhou Penlin liquid outside the wafer is achieved, impurities remained on the periphery of the wafer can be eliminated, the cleaning waste liquid on the periphery of the wafer is flushed, the wafer is thoroughly cleaned under the cooperation of the driving mechanism and the brush roller, and the cleaning quality of the wafer is improved;
2) After the water storage sleeve is deformed under pressure, a V-shaped groove is formed in a region, which is contacted with the periphery of the wafer, so that the water storage sleeve can simulate a roller with an annular groove, and the wafer is axially limited and clamped through the V-shaped groove, so that the wafer can be prevented from moving or tilting sideways along the axis direction in the rotation process;
3) No matter the retaining cover sets up in output shaft or follow driving wheel, the contact between wafer and the retaining cover is no longer rigid hard contact, and the retaining cover has played the effect to the wafer buffering shock attenuation, has reduced the probability that the wafer is damaged because of environmental shock impact.
In one embodiment, the water storage sleeve comprises a sponge sleeve.
So set up, the sponge cover is as a loose porous material, not only can save a large amount of liquid, has better elastic deformation performance moreover, and is showing the buffering protection effect to the wafer.
In one embodiment, the water storage sleeve is sleeved on the output shaft, the driving mechanism further comprises a base, the base and the wheel body support are relatively fixedly arranged, the material rotating driving piece is movably arranged on the base, and the relative position of the output shaft and the wafer can be adjusted.
The arrangement can adjust the position of the material rotating driving piece relative to the base according to actual needs to change the contact pressure between the water storage sleeve and the wafer.
In one embodiment, the water storage sleeve is detachably sleeved on the output shaft and/or the driven wheel.
The water storage sleeve can be detached and replaced or maintained according to actual needs.
In one embodiment, the output shaft sleeve is provided with a water storage sleeve, the output shaft comprises a first limiting part and a second limiting part which are axially arranged, one end of the water storage sleeve is abutted against the first limiting part, and the other end of the water storage sleeve is abutted against the second limiting part.
So set up, the installation of water storage jacket on the output shaft is firm, is difficult for taking place to drop.
The invention also provides wafer surface cleaning equipment which comprises the wafer surface cleaning mechanism and the driving mechanism provided by the invention.
In one embodiment, the wafer surface cleaning apparatus further comprises a liquid supply system comprising a liquid storage chamber and having a liquid supply channel with one end communicating with the liquid storage chamber and the other end extending toward the water storage sleeve.
The liquid supply system can supply liquid required by cleaning the wafers to the water storage sleeve, so that the water storage sleeve can be used for a long time, and the wafer surface cleaning equipment is suitable for the occasion of cleaning a large number of wafers.
In one embodiment, the liquid storage chamber is mounted on the output shaft, and the liquid supply channel is formed on the output shaft.
So set up, the output shaft rotates and does not influence the liquid supply system and supply liquid to retaining cover, and the structure and the overall arrangement of liquid supply system simplify, have reduced the supporting degree of difficulty of combination and the cost of liquid supply system and actuating mechanism to the liquid supply system can supply liquid to retaining cover in real time, has avoided the retaining cover to cause the wafer cleaning process to be forced to suspend because of lack of water solidification.
In one embodiment, the output shaft comprises a hollow section, a liquid supply channel is formed in a cavity of the hollow section, a liquid inlet and a liquid outlet are formed in the hollow section, the liquid inlet is communicated with the liquid supply channel and the liquid storage chamber, and the liquid outlet is communicated with the liquid supply channel and extends to the inner ring of the water storage sleeve.
So set up, liquid storage room exhaust liquid can flow in the output shaft and be absorbed by the retaining cover, can prevent that liquid from leaking outward to reduce the risk that actuating mechanism appears trouble such as corrosion.
In one embodiment, the liquid storage chamber is of an annular structure sleeved on the output shaft, the driving mechanism further comprises an extrusion part, and the extrusion part and the material rotating driving part are relatively fixedly arranged and are abutted to the peripheral wall of the liquid storage chamber.
So set up, along with the reservoir follower output shaft rotation, the extrusion piece can be to the continuous exerting pressure of the outer peripheral wall of reservoir to make the reservoir keep in the pressurized state, the pressure in the final reservoir keeps in higher level, ensures that the liquid feeding system can supply liquid to the retaining cover in real time.
In one embodiment, the liquid supply system further comprises a regulating valve, wherein the regulating valve is arranged on the liquid supply channel and is used for regulating the flow area of the liquid supply channel.
The liquid flow of the liquid supply system can be regulated by the regulating valve, so that the proper liquid amount obtained by the water storage sleeve is ensured, and the phenomenon that the water storage sleeve is lack of water for solidification or liquid waste is caused by water storage saturation is avoided.
The invention also provides polishing equipment, which comprises a dressing device and a driving mechanism of the invention, wherein the dressing device comprises a gear frame, a dressing wheel and a dressing driver, the gear frame carries the dressing wheel, the dressing wheel is meshed with the gear frame and comprises a dressing ring, and the dressing driver is connected with the dressing wheel and is used for driving the dressing ring to rotate relative to the polishing pad.
Drawings
FIG. 1 is a schematic perspective view of a wafer surface cleaning apparatus according to one embodiment of the present invention;
FIG. 2 is a schematic view showing the positional relationship between a wafer placement area and a brush roll in accordance with one embodiment of the present invention;
FIG. 3 is a schematic view showing the positional relationship between a wafer placement area and a brush roll in accordance with one embodiment of the present invention;
FIG. 4 is a schematic view of a wafer surface cleaning apparatus according to one embodiment of the present invention brushing a wafer;
FIG. 5 is an enlarged schematic view of a portion of the wafer surface cleaning apparatus shown in FIG. 4 at A;
FIG. 6 is a schematic view showing a part of a structure of a wafer surface cleaning apparatus according to an embodiment of the present invention;
FIG. 7 is an enlarged schematic view of a portion of the wafer surface cleaning apparatus shown in FIG. 6 at B;
fig. 8 is a schematic perspective view of a driving unit according to an embodiment of the present invention;
fig. 9 is a cross-sectional view of a drive unit according to one embodiment of the invention;
FIG. 10 is a schematic perspective view of a wafer surface cleaning apparatus according to one embodiment of the present invention;
fig. 11 is a partially enlarged schematic illustration of the wafer surface cleaning apparatus of fig. 10 at D.
Reference numerals: 100. wafer surface cleaning equipment; 10. a driving mechanism; 11. a driving unit; 111. a drive sleeve; 1111. a water storage jacket; 112. a material transferring driving piece; 1121. a drive shaft; 1122. a driving motor; 113. an output shaft; 1131. a hollow section; 1132. a liquid inlet; 1133. a liquid outlet; 1134. a first limit part; 1135. a second limit part; 1136. a seal; 12. a carrying unit; 121. driven wheel; 1211. a detected module; 122. a wheel body bracket; 13. a detection module; 131. a sensing region; 14. an extrusion; 15. a base; 16. mounting a loading plate; 20. a wafer surface cleaning mechanism; 21. a brush roller; 211. a contact section; 22. a brush roller bracket; 23. an adjusting unit; 24. a cleaning drive; 30. a wafer placement area; 31. wafer plane; 40. a liquid supply system; 41. a liquid storage chamber; 42. a liquid supply channel; 200. a wafer.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "or/and" as used herein includes any and all combinations of one or more of the associated listed items.
The present invention provides a wafer surface cleaning apparatus 100 for removing impurities, fine grains, and slurry crystals from the surface of a wafer. The wafer mentioned in the invention is a material widely used in the fields of photovoltaic product manufacture, semiconductor device manufacture and the like, and is a round thin plate-like structure obtained by cutting a crystal bar. After dicing the wafer, the polishing tool inevitably leaves dirt on the wafer surface during the polishing process, the polishing liquid is crystallized on the wafer surface after drying, cleaning is required, and fine grains, dust and other impurities during dicing are also adhered to the wafer surface, so that cleaning of the wafer is necessary.
Referring to fig. 1 and 4, a wafer surface cleaning apparatus 100 of the present invention is capable of performing shower water cleaning on a wafer, and includes a driving mechanism 10, a wafer surface cleaning mechanism 20, and a shower mechanism not shown in the drawings. The driving mechanism 10 comprises a driving unit 11 and a bearing unit 12, wherein the driving unit 11 is used for driving the wafer 200 to rotate around the axis of the wafer 200, the bearing unit 12 is used for bearing the wafer 200 and supporting the wafer 200 when the wafer 200 rotates so as to ensure that the wafer 200 does not move; the wafer surface cleaning mechanism 20 comprises two or more brush rolls 21, a brush roll support 22 and a cleaning driving piece 24, wherein the brush rolls 21 are rotatably arranged on the brush roll support 22, and the cleaning driving piece 24 is in driving connection with the brush rolls 21 and can drive the brush rolls 21 to rotate around the axis of the brush rolls 21; the shower mechanism is used to shower the wafer 200 and the brush roller 21 with the cleaning liquid.
The carrying unit 12 has a wafer placement area 30 for carrying the wafer 200, the wafer placement area 30 is actually present in the carrying unit 12, the boundary of the wafer placement area 30 is an imaginary boundary, the spatial shape of the wafer placement area 30 is a cylinder with a short axial length, the shape of the wafer 200 is the same as the shape of the wafer placement area 30, and the brush roller 21 is provided at the axial end of the wafer placement area 30.
When the wafer 200 is mounted on the carrier unit 12, the wafer 200 is entirely located in the wafer placement area 30 and occupies the wafer placement area 30 entirely, and at least two brush rollers 21 are respectively located at both axial ends of the wafer 200, the outer peripheral walls of the brush rollers 21 contact the end face of the wafer 200, and the axis of the wafer placement area 30 coincides with the axis of the wafer 200. As the brush roller 21 rotates about its own axis and the wafer 200 rotates about its own axis, the outer peripheral wall of the brush roller 21 brushes the end face of the wafer 200.
Specifically, the driving unit 11 includes a material-turning driving member 112 and a driving sleeve 111, the material-turning driving member 112 includes a driving motor 1122 and an output shaft 113, the driving motor 1122 includes a driving shaft 1121, the output shaft 113 is connected to the driving shaft 1121, the driving sleeve 111 is connected to the output shaft 113, and the driving sleeve 111 can rotate following the rotation of the driving shaft 1121 and the output shaft 113; the carrier unit 12 includes a wheel support 122 and a driven wheel 121 rotatably mounted to the wheel support 122. The driving sleeve 111 and the driven wheel 121 are circumferentially spaced around the axis of the wafer placement area 30, the driving sleeve 111 and the driven wheel 121 abut against the periphery of the wafer 200 and bear the wafer 200, and after the wafer 200 is borne by the driving sleeve 111 and the driven wheel 121, the space occupied by the wafer 200 is the wafer placement area 30, which is equivalent to the wafer placement area 30 being filled with the wafer 200.
The driving sleeve 111 is driven by the output shaft 113 to rotate under the driving of the material-rotating driving piece 112, and contact pressure exists between the periphery of the wafer 200 and the peripheral wall of the driving sleeve 111, so that the wafer 200 is driven by the driving sleeve 111 to rotate; there is also a contact pressure between the outer periphery of the wafer 200 and the outer peripheral wall of the followers 121, and as the wafer 200 rotates about its own axis, all of the followers 121 rotate, thereby reducing the resistance to rotation of the wafer 200.
For convenience of description, the axis of the wafer placement area 30 will be referred to as a rotation axis hereinafter, which is a reference for determining the mounting position of the driven wheel 121 on the wheel support 122, and a reference for determining the relative positions of the rotation driving member 112 and the wheel support 122. The wafer 200 rotates about its own axis in the wafer placement area 30, corresponding to the rotation of the wafer 200 about the spindle axis; the maximum dimension of the wafer placement area 30 in the direction perpendicular to the transfer axis is defined as the load diameter, and the shortest distance of the transfer axis to the drive sleeve 111 or the driven wheel 121 is defined as the load radius. The length of the loading radius is one half of the length of the loading diameter, the loading radius corresponds to the radius of the wafer 200 after the wafer 200 is placed in the wafer placement area 30, the loading diameter corresponds to the diameter of the wafer 200, and the vertical direction of the transfer axis corresponds to the set of innumerable radial directions of the wafer 200.
Optionally, the number of the driven wheels 121 is at least two, the length of the shortest distance line from the material transferring axis to the driving sleeve 111 is equal to the length of the shortest distance line from the material transferring axis to any one of the driven wheels 121, the driving sleeve 111 and all the driven wheels 121 are arranged along the circumference of the wafer placing area 30, and the circumference of the wafer placing area 30 is also the circumference of the material transferring axis.
Preferably, the number of driven wheels 121 is three or more, and the positions of the wafer placement area 30 and the transfer axis in the wafer surface cleaning apparatus 100 depend on the position of the carrying unit 12 in the wafer surface cleaning apparatus 100, and all the driven wheels 121 are arranged in a circumferential direction of one axis, namely the transfer axis, and after the driven wheels 121 carry the wafer 200, the axes coincide with the axis of the wafer 200.
Alternatively, the wafer 200 is rotated about the rotation axis, and the axis of the brush roller 21 is fixedly disposed with respect to the rotation axis when the shower mechanism sprays the cleaning liquid to the wafer 200 and the brush roller 21.
Alternatively, a water channel may be provided inside the brush roller 21 instead of the shower mechanism, the water channel penetrating through the outer periphery of the brush roller 21, and the cleaning liquid being able to flow into the water channel and be sprayed from the outer periphery of the brush roller 21.
Referring to fig. 1 and 4, the number of the brush rolls 21 is two, the two brush rolls 21 are respectively located at two axial ends of the wafer placing area 30, and when the wafer 200 rotates around the material axis in the wafer placing area 30, the two brush rolls 21 are respectively located at two axial ends of the wafer 200, and peripheral walls of the two brush rolls can respectively contact and brush two end surfaces of the wafer 200.
Optionally, the brush roller support 22, the material turning driving member 112 and the wheel support 122 are all mounted on the same base (not numbered in the figure), and any one of the brush roller support 22, the material turning driving member 112 and the wheel support 122 can move relative to the base so as to change the mounting position on the base.
The present invention configures the brush roller 21 and the wafer placement area 30 as follows: whether the number of brush rolls 21 is one or plural, a portion of the outer circumference of each brush roll 21 can enter the wafer placement area 30 to form a contact section 211, and the brush rolls 21 contact and brush the end face of the wafer 200 through the contact section 211. Of the contact sections 211 formed by the brush rolls 21, at least one contact section 211 has a length smaller than the carrier diameter, wherein the length of the contact section 211 refers to the dimension of the contact section 211 in the axial direction of the brush roll 21.
The contact section 211 may be a line segment or a curved surface. When the outer periphery of the brush roller 21 makes an intersection line with the end surface of the wafer placing area 30, the intersection line forms a contact section 211, in which case the brush roller 21 makes line contact with the end surface of the wafer 200; when the outer periphery of the brush roller 21 enters the wafer placing area 30, the curved surface portion of the brush roller 21 entering the wafer placing area 30 forms a contact section 211, in which case the brush roller 21 and the end surface of the wafer 200 form surface contact.
Optionally, any contact section 211 formed for the brush roller 21 has a length less than the carrier diameter.
It is to be noted that the entry of the outer periphery of the brush roller 21 into the wafer placement area 30 does not mean that the outer periphery of the brush roller 21 enters the wafer 200, and that the outer peripheral wall of the brush roller 21 is covered with a soft brush material such as a brush, porous plastic, cloth, or the like, which deforms after being pressed, and thus does not intrude into the wafer 200.
In some embodiments, the transfer axis passes through any one of the contact sections 211, and each contact section 211 extends at least to the periphery of the wafer placement area 30. Referring to fig. 2, both brush rolls 21 are in a cylindrical structure, and looking at the contact section 211 formed by any one brush roll 21, it can be determined that the material transfer axis passes through the contact section 211, and the contact section 211 extends to the periphery of the wafer placement area 30, when the wafer 200 is located in the wafer placement area 30, the contact area of the end face of the wafer 200 of any one brush roll 21 passes through the center of the end face of the wafer 200, and the contact area extends to the edge of the end face of the wafer 200.
So arranged, as the rotation of the wafer 200 around the material axis and the rotation of the brush roller 21 are simultaneously performed, all areas on the end face of the wafer 200 can be in contact with the outer periphery of the brush roller 21, and thus the circular end face of the wafer 200 can be completely brushed without brushing omission.
It will be appreciated that in other embodiments, the brushroll 21 may also extend beyond the periphery of the wafer placement area 30, and that one end of the brushroll 21 may protrude radially outward relative to the end edge of the wafer 200 when the wafer 200 is in the wafer placement area 30.
Optionally, in the case that the material transferring axis passes through any one of the contact sections 211, the axial dimension of the brush roller 21 is greater than or equal to the material loading radius and smaller than the material loading diameter, so that the brush roller 21 can be ensured to brush the end face of the wafer 200 completely, and the possibility of brushing omission is eliminated. During the rotation of the wafer 200, the contact section 211 rotates relative to the wafer 200 with the rotation axis as the rotation center, and the radius of the circular track surface formed by the contact section 211 is greater than or equal to the radius of the wafer 200.
In some embodiments, the brush roller 21 is cylindrical, and the axis of the brush roller 21 forms an inclined angle with the material transferring axis, and the inclined angle defines that the axis of the brush roller 21 and the material transferring axis are not perpendicular. Referring to fig. 2, a straight line S represents a material transferring axis, two brush rollers 21 are respectively arranged in V-shape at two ends of the wafer placing area 30, that is, the axes of the two brush rollers form a V-shaped included angle, and an inclined included angle is formed between the axis of at least one brush roller 21 and the material transferring axis. Referring to fig. 3, two contact sections 211 formed by the two brush rolls 21 are arranged in a V-shape.
The inclined angle is set so that an included angle is formed between the axes of the two brush rolls 21, in the wafer surface cleaning apparatus 100 shown in fig. 1, the two brush rolls 21 are respectively arranged in a V-shape at two ends of the wafer placing area 30, and both the two brush rolls are inclined relative to the material transferring axis, that is, the axes of the two brush rolls 21 are not perpendicular to the material transferring axis, and an included angle β between the two brush rolls is shown in fig. 1.
Of course, it is also possible to tilt the axis of one of the brush rolls 21 relative to the transfer axis, the axis of the other brush roll 21 being perpendicular to the transfer axis.
It will be appreciated that in other embodiments, the brush roller 21 may have a conical truncated cone structure, in which case, even if the axes of the two brush rollers 21 are parallel and both axes are perpendicular to the feeding axis, the two contact sections 211 formed by the two brush rollers 21 may also take on the V-shaped arrangement shown in fig. 3.
Further, referring to fig. 3, for convenience of description, a wafer plane 31 of the wafer placement area 30 is defined, the wafer plane 31 being an imaginary plane parallel to both end surfaces of the wafer placement area 30, and the wafer plane 31 bisects the wafer placement area 30 in a radial direction of the wafer placement area 30. When the wafer 200 is positioned in the wafer placement area 30, the wafer plane 31 is parallel to the end face of the wafer 200 and bisects the wafer 200 in the radial direction of the wafer 200. If two contact segments 211 are each orthographically projected onto wafer plane 31, then the projected patterns formed by two contact segments 211 at least partially coincide.
Alternatively, in some embodiments, two brush rolls 21 are symmetrically arranged about wafer plane 31 and two contact segments 211 are symmetrically arranged about wafer plane 31.
In other embodiments, the brush roller 21 may be configured as follows: the two brush rolls 21 are of cylindrical structures, are arranged in parallel, and have axes perpendicular to the material transferring axis, and the axial length of any one brush roll 21 is smaller than the diameter of the wafer placing area 30.
In some embodiments, the wafer surface cleaning mechanism 20 further includes an adjusting unit 23, where the adjusting unit 23 is connected to the brush roller support 22, and the adjusting unit 23 is configured to drive the brush roller support 22 to move so as to change an angle of the brush roller 21 relative to the rotation axis, and the movement of the brush roller support 22 refers to the movement of the brush roller support 22 relative to the base. Referring to fig. 1, 4 and 6, the brush roll supports 22 and the brush rolls 21 are in corresponding number and are connected in a one-to-one correspondence, and the brush roll supports 22 are independent, that is, each brush roll support 22 can move relative to the other brush roll support 22. By means of the adjusting unit 23, the V-shaped angle between the axes of the two brush rolls 21 can be changed, whereby the shape and size of the two contact sections 211 can be changed, thereby changing the contact area and pressure distribution of the brush rolls 21 contacting the wafer 200.
It will be appreciated that in other embodiments, the adjustment unit 23 may also move the brushroll support 22 in a relative translational motion, thereby changing the distance between the brushrolls 21, and thus the amount of pressure that the brushrolls 21 apply to the wafer 200.
In some embodiments, the wafer surface cleaning mechanism 20 further includes a self-aligning bearing mounted on the brush roller support 22, an inner ring of the self-aligning bearing is fixedly connected to the brush roller 21, an outer ring of the self-aligning bearing is fixedly connected to the brush roller support 22, and the self-aligning bearing is adopted, so that an axis of the brush roller 21 can move relative to an axis of the outer ring of the self-aligning bearing, and therefore, an angle of the brush roller 21 relative to the material transferring axis can be changed as required.
In some embodiments, the driving mechanism 10 further includes a detection module 13, where the detection module 13 itself has a sensing area 131, the driven wheel 121 includes a wheel body and a detected module 1211 connected to the wheel body, and the detection module 13 is fixedly disposed relative to the wheel body support 122, and referring to fig. 10 and 11, the axes of the detection module 13 and the driven wheel 121 provided with the detected module 1211 are relatively fixed. The detecting module 13 may measure the frequency of the detected module 1211 passing through the sensing area 131 when the detected module 1211 rotates along with the wheel body of the driven wheel 121, that is, count the number of times the detected module 1211 rotates through the sensing area 131 in a period of time.
So configured, the rotational speed of the driven wheel 121 can be determined, the linear speed of the outer periphery of the driven wheel 121 can be determined in combination with the radius of the driven wheel 121, and since the radius and rotational speed of the wafer 200 are both known conditions, the linear speed of the outer periphery of the wafer 200 can be determined, and by comparing the linear speed of the outer periphery of the driven wheel 121 with the linear speed of the outer periphery of the wafer 200, it can be known whether or not the wafer 200 has slipped relative to the driven wheel 121; whether the slave wheel 121 rotates may also be used as a decision criterion for determining whether the wafer 200 rotates, whether there is a virtual contact between the wafer 200 and the slave wheel 121.
Specifically, the detection module 13 may generate the sensing light in the sensing area 131, and the detected module 1211 can block the sensing light when rotating to the sensing area 131, so that the number of times that the detected module 1211 passes through the sensing area 131 in a certain period of time can be determined according to the number of times that the detected module 1211 blocks the sensing light in a certain period of time, thereby realizing that whether the driven wheel 121 rotates and determining the rotation speed of the driven wheel 121 in a non-physical contact manner, and not affecting the rotation of the driven wheel 121.
The invention also provides a driving mechanism 10 applied to the wafer surface cleaning device 100, and the wafer surface cleaning device 100 comprising the driving mechanism 10, wherein the wafer surface cleaning device 100 comprising the driving mechanism 10 provided by the invention can adopt the brush roller 21 arrangement mode adopted by the existing similar device or the brush roller 21 arrangement mode introduced above.
Referring to fig. 1 and 6, the driving mechanism 10 includes a rotary driving member 112 mounted on a base, a wheel body support 122 mounted on the base, an output shaft 113 connected to the rotary driving member 112, and a driven wheel 121 rotatably mounted on the wheel body support 122. In addition, the driving mechanism 10 further includes a water storage jacket 1111, wherein the water storage jacket 1111 is made of porous loose material, such as foamed plastic, porous rubber, sponge, etc., and the water storage jacket 1111 is capable of being elastically deformed and has a capacity of storing liquid, and when the water storage jacket 1111 is in a pressurized state, the volume of the water storage jacket 1111 is contracted to release the liquid outwards, and after the pressure acting on the water storage jacket 1111 is released, the water storage jacket 1111 is deformed and expanded to absorb the liquid.
The water storage jacket 1111 may be only sleeved on the output shaft 113, or only sleeved on the driven wheel 121, or a plurality of water storage jackets 1111 may be provided, so that the output shaft 113 and the driven wheel 121 are both sleeved with the water storage jacket 1111, and the water storage jackets 1111 may be sleeved on part of the driven wheel 121 or all of the driven wheels 121. The final water storage jacket 1111 is in contact with the outer periphery of the wafer 200, and there is a certain contact pressure between the water storage jacket 1111 and the wafer 200. Referring to fig. 8, fig. 8 illustrates a water storage jacket 1111 as the driving jacket 111 is sleeved on the output shaft 113.
Since the output shaft 113 needs to apply a large pressure to the outer periphery of the wafer 200 to ensure that there is enough static friction force to drive the wafer 200 to rotate the wafer 200, as a preferred embodiment, the outer periphery of the output shaft 113 is sleeved with the water storage sleeve 1111, and the water storage sleeve 1111 is fixedly connected with the output shaft 113, on the basis of this, the water storage sleeve 1111 can be sleeved for all the driven wheels 121, and the non-rigid mode of carrying the wafer 200 can be completely realized.
Specifically, the output shaft 113 includes a first limiting portion 1134 and a second limiting portion 1135 that are disposed along an axial direction, one end of the water storage sleeve 1111 is abutted to the first limiting portion 1134, the other end is abutted to the second limiting portion 1135, and the first limiting portion 1134 and the second limiting portion 1135 cooperate together to fixedly clamp the water storage sleeve 1111 in the middle.
Referring to fig. 9, the first limiting portion 1134 and the second limiting portion 1135 are respectively two annular protrusions extending along the circumferential direction of the output shaft 113, an annular groove is formed on the output shaft 113 in the axial direction of the output shaft, the water storage sleeve 1111 is fixedly sleeved in the annular groove, and two ends of the water storage sleeve 1111 are respectively in tight fit with the first limiting portion 1134 and the second limiting portion 1135.
In some embodiments, the water storage jacket 1111 is removably sleeved over the output shaft 113 and/or the driven wheel 121, such that the water storage jacket 1111 may be maintained or replaced for replacement after removal.
Optionally, the output shaft 113 includes a shaft body and an end cover detachably mounted at an end of the shaft body, the first limiting portion 1134 and the second limiting portion 1135 are respectively disposed at an outer periphery of the shaft body and an outer periphery of the end cover, when the water storage jacket 1111 is mounted to the output shaft 113, the end cover is first detached, one end of the water storage jacket 1111 is abutted to the first limiting portion 1134, then the end cover is mounted back to the shaft body, and the other end of the water storage jacket 1111 is abutted to the second limiting portion 1135.
The tiny loose holes on the surface layer of the water storage sleeve 1111 can not only absorb and contain liquid, when the water storage sleeve 1111 is compressed and deformed, the water storage sleeve 1111 can also pressurize the liquid therein, the liquid is released from the tiny loose holes at a certain initial speed, the more obvious the elastic deformation performance of the water storage sleeve 1111 is, the better the pressurizing effect on the liquid is, and the liquid can be discharged from the water storage sleeve 1111 at a faster initial speed.
Optionally, the water storage sleeve 1111 is a hollow cylindrical sleeve-like structure made of sponge.
In some embodiments, the water storage sleeve 1111 is sleeved on the output shaft 113, the driving mechanism 10 further includes a base 15 fixedly mounted on the base and a mounting carrier plate 16 movably mounted on the base 15, the pose of the wheel body support 122 is adjusted by the adjusting unit 23, the wheel body support 122 is fixedly disposed relative to the base 15, and the material transferring driving member 112 is mounted on the mounting carrier plate 16 and can move relative to the base 15, so that the function of adjusting the relative position of the output shaft 113 and the wafer 200 is provided. So configured, the position of the water retaining sleeve 1111 relative to the wafer 200 can be adjusted, and the contact pressure and maximum static friction between the two can be varied accordingly.
Referring to fig. 4 to 7, fig. 4 and 6 are schematic views of a wafer surface cleaning apparatus 100 including a driving mechanism 10 according to the present invention, and the arrangement relationship of the wafer surface cleaning mechanism 20 and the driving mechanism 10 refers to the wafer surface cleaning apparatus 100 shown in fig. 1. The wafer surface cleaning apparatus 100 shown in fig. 4 and 6 further includes a liquid supply system 40 for supplying liquid to the water storage jacket 1111, and the liquid supplied to the water supply system 40 may be cleaning liquid or pure water. The liquid supply system 40 includes a liquid storage chamber 41 for storing liquid, and a liquid supply passage 42, one end of the liquid supply passage 42 communicates with the liquid storage chamber 41, and the other end extends toward the water storage jacket 1111.
Referring to fig. 5 and 7, fig. 5 and 7 illustrate the mating between the fluid supply system 40 and the water storage jacket 1111 that is nested within the output shaft 113. The liquid storage chamber 41 is installed in the output shaft 113, can rotate along with the rotation of the output shaft 113, the liquid supply channel 42 is formed in the output shaft 113, liquid in the liquid storage chamber 41 can flow to the water storage sleeve 1111 through the output shaft 113, the rotation of the output shaft 113 can not influence the liquid supply channel 42, the liquid can still flow normally, the liquid storage chamber 41 and the liquid supply channel 42 are relatively fixedly arranged, and the liquid supply channel 42 is prevented from being distorted or blocked due to the fact that the liquid supply system 40 is arranged at other positions.
Specifically, referring to fig. 7 and 9, the output shaft 113 includes a hollow section 1131 at one end, the cavity of the hollow section 1131 forms the liquid supply channel 42, in addition, the hollow section 1131 is further provided with a liquid inlet 1132 and a liquid outlet 1133, the liquid inlet 1132 is communicated with the liquid supply channel 42 and the hollow liquid storage chamber 41, and the liquid outlet 1133 is communicated with the liquid supply channel 42 and extends to the inner ring of the water storage sleeve 1111. The following is the manner in which the liquid supply system 40 operates: after being discharged from the liquid storage chamber 41, the liquid firstly enters the liquid supply channel 42 through the liquid inlet 1132, then flows in the hollow section 1131 and approaches the liquid outlet 1133, then leaves the liquid supply channel 42, finally flows to the inner ring of the water storage sleeve 1111 through the liquid outlet 1133, and is absorbed by the water storage sleeve 1111, so that the water storage sleeve 1111 can be ensured to maintain a wet state, and the water shortage and solidification damage of the water storage sleeve 1111 can be prevented.
Alternatively, referring to fig. 5 and 9, the liquid storage chamber 41 is of an annular structure sleeved on the output shaft 113, the driving mechanism 10 further includes an extrusion member 14, the extrusion member 14 is fixedly arranged relative to the material rotating driving member 112, both are mounted on the mounting carrier plate 16, the extrusion member 14 is abutted to the peripheral wall of the liquid storage chamber 41, and a certain pre-tightening pressing force is provided between the extrusion member 14 and the liquid storage chamber 41, so that the liquid storage chamber 41 is always in a pressed deformation state, and liquid in the liquid storage chamber 41 can be simply pressurized by using the extrusion member 14.
Optionally, in some embodiments, the liquid supply system 40 further includes a regulating valve disposed in the liquid supply channel 42 for regulating the flow area of the liquid supply channel 42, thereby regulating the flow rate of the liquid in the liquid supply system 40.
Referring to fig. 9, the output shaft 113 is further sleeved with a sealing member 1136, an inner ring of the sealing member 1136 is tightly matched with the peripheral wall of the output shaft 113, an outer ring of the sealing member 1136 is tightly matched with the liquid storage chamber 41, and the sealing member is used for providing sealing protection between the output shaft 113 and the liquid storage chamber 41, so that waste and pollution caused by overflow of liquid in the liquid storage chamber 41 along the peripheral wall of the output shaft 113 are prevented.
The invention also provides polishing equipment, which comprises a trimming device and the driving mechanism, wherein the trimming device comprises a gear frame, a trimming wheel and a trimming driver, the gear frame carries the trimming wheel, the trimming wheel is meshed with the gear frame and comprises a trimming ring, the trimming driver is connected with the trimming wheel and is used for driving the trimming ring to rotate relative to the polishing pad, and the trimming device aims to timely remove fine grains generated when the polishing pad grinds a wafer, so that the purpose of improving the flatness of the polishing pad is achieved, and the quality of subsequent polishing is ensured.
The technical features of the above-described embodiments may be combined in any manner, and for brevity, all of the possible combinations of the technical features of the above-described embodiments are not described, however, all of the combinations of the technical features should be considered as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
It will be appreciated by persons skilled in the art that the above embodiments have been provided for the purpose of illustrating the invention and are not to be construed as limiting the invention, and that suitable modifications and variations of the above embodiments are within the scope of the invention as claimed.
Claims (12)
1. The utility model provides a drive mechanism for drive wafer rotates, its characterized in that includes changeing material driving piece (112), output shaft (113), wheel body support (122) and from driving wheel (121), output shaft (113) connect in changeing material driving piece (112) and can rotate, from driving wheel (121) rotate install in wheel body support (122), output shaft (113) and/or from driving wheel (121) cover is equipped with elastically deformable's retaining cover (1111), retaining cover (1111) release liquid under the pressurized state.
2. The drive mechanism of claim 1, wherein the water storage jacket (1111) comprises a sponge jacket.
3. The driving mechanism according to claim 1 or 2, wherein the water storage sleeve (1111) is sleeved on the output shaft (113), the driving mechanism (10) further comprises a base (15), the base (15) and the wheel body support (122) are relatively fixedly arranged, and the material transferring driving member (112) is movably mounted on the base (15) and can adjust the relative position of the output shaft (113) and the wafer (200).
4. The drive mechanism according to claim 1 or 2, characterized in that the water storage jacket (1111) is detachably sleeved on the output shaft (113) and/or the driven wheel (121).
5. The driving mechanism according to claim 1 or 2, wherein the water storage sleeve (1111) is sleeved on the output shaft (113), the output shaft (113) comprises a first limiting portion (1134) and a second limiting portion (1135) which are axially arranged, one end of the water storage sleeve (1111) is abutted to the first limiting portion (1134), and the other end of the water storage sleeve is abutted to the second limiting portion (1135).
6. A wafer surface cleaning apparatus comprising a wafer surface cleaning mechanism (20) and a drive mechanism (10) as claimed in any one of claims 1 to 5.
7. The wafer surface cleaning apparatus of claim 6, further comprising a liquid supply system (40), the liquid supply system (40) including a liquid storage chamber (41) and having a liquid supply passage (42), one end of the liquid supply passage (42) communicating with the liquid storage chamber (41), the other end extending toward the water storage jacket (1111).
8. The wafer surface cleaning apparatus of claim 7, wherein the liquid reservoir (41) is mounted to the output shaft (113), and the liquid supply passage (42) is opened to the output shaft (113).
9. The wafer surface cleaning apparatus of claim 8, wherein the output shaft (113) includes a hollow section (1131), a cavity of the hollow section (1131) forms the liquid supply channel (42), the hollow section (1131) is provided with a liquid inlet (1132) and a liquid outlet (1133), the liquid inlet (1132) is communicated with the liquid supply channel (42) and the liquid storage chamber (41), and the liquid outlet (1133) is communicated with the liquid supply channel (42) and extends to an inner ring of the water storage sleeve (1111).
10. The wafer surface cleaning apparatus as set forth in claim 8, wherein the liquid storage chamber (41) is an annular structure sleeved on the output shaft (113), the driving mechanism (10) further comprises an extrusion member (14), and the extrusion member (14) is fixedly disposed opposite to the material transferring driving member (112) and abuts against an outer peripheral wall of the liquid storage chamber (41).
11. The wafer surface cleaning apparatus of claim 7, wherein the liquid supply system (40) further comprises a regulating valve provided to the liquid supply passage (42) for regulating a flow area of the liquid supply passage (42).
12. A polishing apparatus comprising a dressing device and the drive mechanism of any one of claims 1 to 5, the dressing device comprising a carrier, a dressing wheel and a dressing drive, the carrier carrying the dressing wheel, the dressing wheel being engaged with the carrier and comprising a dressing ring, the dressing drive being coupled to the dressing wheel for driving the dressing ring in rotation relative to a polishing pad.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311042729.0A CN116787253A (en) | 2023-08-18 | 2023-08-18 | Driving mechanism, wafer surface cleaning equipment and polishing equipment |
| CN202410466700.3A CN118752387A (en) | 2023-08-18 | 2024-04-18 | Wafer surface cleaning apparatus and polishing apparatus |
| CN202410666895.6A CN118493204A (en) | 2023-08-18 | 2024-04-18 | Wafer surface cleaning apparatus and polishing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202311042729.0A CN116787253A (en) | 2023-08-18 | 2023-08-18 | Driving mechanism, wafer surface cleaning equipment and polishing equipment |
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| CN116787253A true CN116787253A (en) | 2023-09-22 |
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| CN202311042729.0A Pending CN116787253A (en) | 2023-08-18 | 2023-08-18 | Driving mechanism, wafer surface cleaning equipment and polishing equipment |
| CN202410466700.3A Pending CN118752387A (en) | 2023-08-18 | 2024-04-18 | Wafer surface cleaning apparatus and polishing apparatus |
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| CN202410466700.3A Pending CN118752387A (en) | 2023-08-18 | 2024-04-18 | Wafer surface cleaning apparatus and polishing apparatus |
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| CN118752387A (en) | 2024-10-11 |
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Application publication date: 20230922 |