CN116749365A - Semiconductor chip cutting equipment and spindle vibration self-adaptive control method - Google Patents
Semiconductor chip cutting equipment and spindle vibration self-adaptive control method Download PDFInfo
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- CN116749365A CN116749365A CN202311062714.0A CN202311062714A CN116749365A CN 116749365 A CN116749365 A CN 116749365A CN 202311062714 A CN202311062714 A CN 202311062714A CN 116749365 A CN116749365 A CN 116749365A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 75
- 239000004065 semiconductor Substances 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000003384 imaging method Methods 0.000 claims abstract description 31
- 238000006073 displacement reaction Methods 0.000 claims description 13
- 238000007667 floating Methods 0.000 claims description 9
- 230000003044 adaptive effect Effects 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000005259 measurement Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 239000005068 cooling lubricant Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
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- 230000036632 reaction speed Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The invention relates to the technical field of semiconductor production, in particular to semiconductor chip cutting equipment and a main shaft vibration self-adaptive control method. The first vibration tester is arranged on the end face of the main shaft, the second vibration tester is arranged on the top face of the main shaft, the first CCD camera and the first CCD imaging plate are arranged on two sides of the main shaft respectively, are oppositely arranged along the X direction, the center connecting line passes through the blade, and the second CCD camera and the second CCD imaging plate are arranged on two sides of the main shaft respectively, are oppositely arranged along the Y direction, and the center connecting line passes through the blade. According to the measured error value, accurate adjustment can be performed, and good alignment between the blade and the working disc in the cutting process is ensured, so that accurate cutting operation is realized. Therefore, the capacity of real-time monitoring and self-adaptive adjustment of the vibration of the main shaft and the alignment degree of the blade and the working disc can be accurately adjusted, so that the cutting quality is improved and accurate cutting is realized.
Description
Technical Field
The invention relates to the technical field of semiconductor production, in particular to semiconductor chip cutting equipment and a main shaft vibration self-adaptive control method.
Background
In the field of machining, "spindle" generally refers to the primary axis of a machine tool responsible for rotating a cutting tool or fixture, which is typically driven by a motor or drive. The spindle performs the function of transmitting cutting forces to the tool or the holder during machining. In the semiconductor chip cutting process, the main shaft is used for driving the cutting tool to finish the cutting operation of the chip.
During cutting, vibrations generated by the high-speed rotation of the spindle may affect the cutting quality. The presence of vibrations can result in unstable movements of the cutting tool across the work surface, thereby affecting the depth of cut and the edge chipping condition. In order to ensure the cutting quality, measures are taken to reduce the vibration of the main shaft and to achieve adaptive control of the vibration.
Therefore, a semiconductor chip dicing apparatus and a spindle vibration adaptive control method are needed to solve the above-mentioned problems.
Disclosure of Invention
The invention aims to provide semiconductor chip cutting equipment which can adjust the amplitude of main shaft vibration and improve the cutting quality of products.
To achieve the purpose, the invention adopts the following scheme:
the semiconductor chip cutting equipment comprises an X slide carriage, a driving piece, a working disc, a bearing frame, a main shaft, a blade, a first vibration tester, a second vibration tester, a first CCD camera, a second CCD camera, a first CCD imaging plate and a second CCD imaging plate, wherein the driving piece is arranged on the X slide carriage, the working disc is connected with the output end of the driving piece, the driving piece is configured to drive the working disc to rotate, the bearing frame is arranged on the working disc, the bearing frame is configured to bear chip products, the blade is arranged at the tail end of the main shaft, the axial direction of the main shaft is Y direction, the first vibration tester is arranged on the end face of the main shaft, the second vibration tester is arranged on the top face of the main shaft, the first CCD camera and the first CCD imaging plate are respectively arranged on two sides of the main shaft, the first CCD camera and the second CCD imaging plate are oppositely arranged along the X direction, the center connecting line passes through the blade, the second CCD camera and the second CCD imaging plate are respectively arranged on two sides of the main shaft, and the second CCD camera and the second CCD imaging plate are oppositely arranged along the Y direction, and the center connecting line passes through the blade.
The spindle is illustratively an air-floating spindle.
Illustratively, the first CCD camera is a high frame rate CCD camera.
Illustratively, the second CCD camera is a high frame rate CCD camera.
The drive element is illustratively a torque motor.
The semiconductor chip dicing apparatus further includes a waterproof cover disposed between the work tray and the driving member. Away from the electronic components and circuits, preventing moisture intrusion and resulting short circuit, damage or functional failure of the circuits.
Illustratively, the semiconductor chip dicing apparatus further comprises a waterproof support bar, one end of which is disposed on the X-slide, and the other end of which is disposed on the waterproof cover.
The semiconductor chip dicing apparatus further includes an adjustment pad disposed between the X-carriage and the driving member.
The invention aims to provide a self-adaptive control method for spindle vibration, which can adjust the amplitude of spindle vibration and improve the cutting quality of products.
To achieve the purpose, the invention adopts the following scheme:
the self-adaptive control method of the spindle vibration is applied to the semiconductor chip cutting equipment according to any one of the above steps, and comprises the following steps:
s100, measuring a displacement value my of the main shaft in the Y direction by using the first vibration tester;
s200, measuring a displacement value mz of the main shaft in the Z direction by using the second vibration tester;
s300, detecting error values a1 and a2 of the blade and the working disk in the Y direction by using the first CCD camera and the first CCD imaging plate respectively;
s400, detecting error values b1 and b2 of the blade and the working disc in the Z direction by using the second CCD camera and the second CCD imaging plate respectively;
s500, respectively comparing the myz, mz, a1, a2, b1 and b2 with the technological parameters, and adjusting the cutting depth of the blade and the power and the rotating speed of the main shaft.
Illustratively, step S500 includes:
s510, if the cutting precision requirement of the chip product in the Y direction is greater than a1+a2, the cutting precision requirement can be met, and the vibration of the main shaft in the Y direction does not need to be regulated;
s520, the cutter depth of the main shaft is larger than b1+b2;
and S530, if the value of the main shaft is greater than the preset process parameter, adjusting the power and the rotating speed of the main shaft to reduce the value of the main shaft.
The beneficial effects of the invention are as follows:
in the semiconductor chip cutting equipment provided by the invention, the displacement values (my and mz) of the main shaft in the Y direction and the Z direction can be measured in real time by arranging the first vibration tester and the second vibration tester. Meanwhile, by providing the first CCD camera and the first CCD imaging plate and the second CCD camera and the second CCD imaging plate, the error values (a 1, a2, b1, and b 2) of the blade and the working disk in the Y direction and the Z direction can be detected. Thus, when the displacement value and the error value are detected, the error can be adjusted by adjusting the power and the rotating speed of the main shaft, so that vibration is reduced, and the cutting quality is improved. By using the first vibration tester and the second vibration tester, the vibration condition of the main shaft can be monitored in real time. According to the measurement result, the vibration of the main shaft can be adaptively adjusted, and the displacement values (my and mz) of the main shaft in the Y direction and the Z direction are reduced by adjusting the power and the rotating speed of the main shaft, so that the stability and the cutting quality of the main shaft are maintained. By using the first CCD camera and the first CCD imaging plate and the second CCD camera and the second CCD imaging plate, the error values (a 1, a2, b1, and b 2) of the blade and the working disk in the Y direction and the Z direction can be detected. Based on these error values, precise adjustments can be made to ensure that the blade and the working disk remain well aligned during the cutting process, thereby achieving precise cutting operations. Therefore, the capacity of real-time monitoring and self-adaptive adjustment of the vibration of the main shaft and the alignment degree of the blade and the working disc can be accurately adjusted, so that the cutting quality is improved and accurate cutting is realized.
In the self-adaptive control method for the vibration of the main shaft, the control and the adjustment of the vibration of the main shaft are realized through real-time measurement, error detection and analysis and self-adaptive adjustment of the cutting depth, the power and the rotating speed of the main shaft. This can improve dicing accuracy, stability, and dicing quality, thereby improving performance and effect of the semiconductor chip dicing apparatus.
Drawings
Fig. 1 is a schematic view of a semiconductor chip dicing apparatus according to the present invention in a view angle;
fig. 2 is a schematic structural view of the semiconductor chip dicing apparatus according to the present invention at another view angle;
fig. 3 is a flowchart of a spindle vibration adaptive control method provided by the invention.
In the figure:
1. an X slide carriage; 2. a driving member; 3. a working plate; 4. a carrier; 5. a main shaft; 6. a blade; 7. a first vibration tester; 8. a second vibration tester; 9. a first CCD camera; 10. a second CCD camera; 11. a first CCD imaging plate; 12. a second CCD imaging plate; 13. a chip product; 14. a waterproof cover; 15. a waterproof support rod; 16. and (5) adjusting the pad.
Detailed Description
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the drawings related to the present invention are shown.
In the present invention, directional terms, such as "upper", "lower", "left", "right", "inner" and "outer", are used for convenience of understanding and are not to be construed as limiting the scope of the present invention unless otherwise specified.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1 and 2 in combination, the present embodiment provides a semiconductor chip dicing apparatus. The semiconductor chip cutting equipment comprises an X slide carriage 1, a driving piece 2, a working disc 3, a bearing frame 4, a main shaft 5, a blade 6, a first vibration tester 7, a second vibration tester 8, a first CCD camera 9, a second CCD camera 10, a first CCD imaging plate 11 and a second CCD imaging plate 12, wherein the driving piece 2 is arranged on the X slide carriage 1, the output end of the driving piece 2 is connected with the working disc 3, the driving piece 2 is configured to drive the working disc 3 to rotate, the bearing frame 4 is arranged on the working disc 3, the bearing frame 4 is configured to bear chip products 13, the blade 6 is arranged at the tail end of the main shaft 5, the axial direction of the main shaft 5 is Y-direction, the first vibration tester 7 is arranged on the end face of the main shaft 5, the second vibration tester 8 is arranged on the top surface of the main shaft 5, the first CCD camera 9 and the first CCD imaging plate 11 are respectively arranged on two sides of the main shaft 5, the second CCD camera 10 and the second CCD imaging plate 12 are respectively arranged on two sides of the main shaft 5 along the X-direction opposite installation and the center line passes through the blade 6, and the center line passes through the blade 6 along the Y-direction opposite installation and the center line.
By providing the first vibration tester 7 and the second vibration tester 8, the displacement values (my and mz) of the spindle 5 in the Y direction and the Z direction can be measured in real time. Meanwhile, by providing the first CCD camera 9 and the first CCD imaging plate 11 and the second CCD camera 10 and the second CCD imaging plate 12, the error values (a 1, a2, b1, and b 2) of the blade 6 and the work plate 3 in the Y direction and the Z direction can be detected. Thus, when the displacement value and the error value are detected, the error can be adjusted by adjusting the power and the rotating speed of the main shaft 5, so that the vibration is reduced, and the cutting quality is improved. By using the first vibration tester 7 and the second vibration tester 8, the vibration condition of the spindle 5 can be monitored in real time. According to the measurement result, the vibration of the spindle 5 can be adaptively adjusted, and the displacement values (my and mz) of the spindle 5 in the Y direction and the Z direction are reduced by adjusting the power and the rotating speed of the spindle 5, so that the stability and the cutting quality of the spindle 5 are maintained. By using the first CCD camera 9 and the first CCD imaging plate 11 and the second CCD camera 10 and the second CCD imaging plate 12, the error values (a 1, a2, b1, and b 2) of the blade 6 and the work plate 3 in the Y direction and the Z direction can be detected. Based on these error values, a precise adjustment is possible, ensuring that the blade 6 and the working disk 3 remain well aligned during cutting, thus achieving a precise cutting operation. Thus, the ability of the spindle 5 to vibrate, and the degree of alignment of the blade 6 and the working disk 3, can be monitored and adaptively adjusted in real time, thereby improving the cutting quality and achieving accurate cutting. The X-direction, Y-direction, and Z-direction are as shown in the directions of fig. 1 and 2.
Further, the spindle 5 is an air-floating spindle. The air floating main shaft supports and absorbs shock by utilizing the aerostatic pressure principle. Compared with the traditional mechanical supporting mode, the air floating main shaft can provide better damping effect and reduce the vibration level of the main shaft 5. Therefore, the vibration problem in the cutting process can be remarkably improved, and the cutting quality of products is improved. The air-floating main shaft has higher rigidity and stability, and can more accurately control the position and rotation of the main shaft 5. By reducing the vibration of the spindle 5, the air-floating spindle can provide a more stable cutting environment, thereby improving cutting accuracy. Compared with the traditional mechanical supporting mode, the air floating main shaft has lower friction and energy loss. This is because the air bearing spindle does not require contact support, but rather provides support and suspension by gas pressure, reducing friction and energy loss. Therefore, the air floating main shaft can reduce energy consumption and improve the efficiency and energy conservation of the equipment.
Preferably, the first CCD camera 9 is a high frame rate CCD camera. The second CCD camera 10 is a high frame rate CCD camera. By doing so, image acquisition can be performed at a higher frame rate. The high frame rate camera can capture image information during the cutting process faster, providing more data for analysis and control. This allows finer control of the cleavage and faster reaction speed. The high frame rate CCD camera can capture rapid movements and changes during the cutting process. It can record and analyze dynamic changes of the blade 6 and the working disc 3 during cutting, such as positional deviations, vibrations and changes of the cutting surface. Such dynamic monitoring can help to detect and correct any anomalies in time, thereby improving the quality and stability of the cut. The use of a high frame rate CCD camera can provide more accurate cutting process monitoring and control. By monitoring the image information in the cutting process in real time, the cutting error can be found and corrected in time, and the cutting precision and the surface quality are improved. This helps to reduce edge chipping, improve cut consistency, and reduce the occurrence of defective products.
Preferably, the driving member 2 is a torque motor. A torque motor is a motor specifically designed to provide a high torque output. The torque machine is capable of providing a greater torque density than conventional motors. This means that the torque motor can provide a higher torque output at the same size and weight, meeting the demand for high torque of the semiconductor chip dicing apparatus. The torque motor has excellent control characteristics and can realize accurate torque control. In semiconductor chip dicing equipment, precise torque control is very important to ensure stability and accuracy of the dicing process. The torque motor can quickly respond to the control signal and provide stable torque output in a wide rotating speed range, so that the cutting process is more reliable and accurate. The torque motor has a rapid control response speed, and can rapidly adjust the output torque. This is important for cutting operations that require rapid changes. The torque motor can rapidly adjust output torque according to real-time control signals, so that requirements of different workpieces and cutting parameters in the cutting process are met, and the cutting efficiency and the production efficiency are improved.
Further, the semiconductor chip dicing apparatus further includes a waterproof cover 14, the waterproof cover 14 being provided between the work tray 3 and the driving member 2. The waterproof cover 14 is provided to effectively protect the semiconductor chip dicing apparatus from moisture and liquid. Cooling fluid, lubricant or other liquids may be generated during cutting, and the waterproof cover 14 may prevent these liquids from entering critical components and mechanical structures of the apparatus, thereby protecting the stable operation of the apparatus and extending its useful life. Semiconductor chip dicing apparatus typically involves electronic components and circuits that are very sensitive to moisture and humidity. By providing the waterproof cover 14, the electronic components and circuits can be effectively isolated, preventing moisture intrusion and resulting electrical shorting, damage or functional failure.
Preferably, the semiconductor chip cutting apparatus further includes a waterproof support bar 15, one end of the waterproof support bar 15 is disposed on the X-carriage 1, and the other end of the waterproof support bar 15 is disposed on the waterproof cover 14. The waterproof support rod 15 may be provided to provide support and securement to the waterproof cover 14. By connecting one end of the waterproof support rod 15 to the X-carriage 1 and the other end to the waterproof cover 14, a stable connection between the waterproof cover 14 and the X-carriage 1 can be ensured. This prevents the waterproof cover 14 from loosening or shifting during cutting due to vibration or other factors.
Further, the semiconductor chip dicing apparatus further includes an adjustment pad 16, the adjustment pad 16 being disposed between the X-carriage 1 and the driving member 2. The provision of the adjustment pad 16 provides the ability to adjust the clearance and alignment between the X-carriage 1 and the drive member 2. In semiconductor chip dicing equipment, accurate clearance and alignment are critical to ensuring dicing quality. By selecting an adjustment pad 16 of a suitable thickness, the clearance between the X-carriage 1 and the drive member 2 can be adjusted to ensure a tight fit and alignment between the components. In practical manufacturing, dimensional and assembly variations between parts are unavoidable. The use of the adjustment pad 16 may help compensate for these assembly deviations to achieve more accurate assembly and alignment. By selecting an adjusting pad 16 of a suitable thickness, adding or removing an adjusting pad 16 between the X-carriage 1 and the driving member 2, fine adjustment and compensation of the components can be achieved to meet the requirements of the cutting apparatus.
Referring to fig. 3 in combination, the present embodiment further provides a spindle vibration adaptive control method, which is applied to the semiconductor chip cutting device, and includes the following steps:
s100, measuring a displacement value my of the main shaft 5 in the Y direction by using a first vibration tester 7;
s200, measuring a displacement value mz of the main shaft 5 in the Z direction by using a second vibration tester 8;
s300, detecting error values a1 and a2 of the blade 6 and the working disk 3 in the Y direction by using the first CCD camera 9 and the first CCD imaging plate 11 respectively;
s400, detecting error values b1 and b2 of the blade 6 and the working disk 3 in the Z direction by using the second CCD camera 10 and the second CCD imaging plate 12 respectively;
s500, respectively comparing the my, mz, a1, a2, b1 and b2 with the technological parameters, and adjusting the cutting depth of the blade 6 and the power and the rotating speed of the spindle 5.
The control and adjustment of the vibration of the spindle 5 are realized by real-time measurement, error detection and analysis, and self-adaptive adjustment of the cutting depth and the power and rotation speed of the spindle 5. This can improve dicing accuracy, stability, and dicing quality, thereby improving performance and effect of the semiconductor chip dicing apparatus.
Further, step S500 includes:
s509, if mz is larger than 3 μm, adjusting the assembly error of the semiconductor chip cutting device to make mz smaller than 3 μm, and performing the subsequent steps; the measurement of the displacement value mz of the spindle 5 in the Z direction by the second vibration tester 8 can reflect the fluctuation width of the spindle 5 in the Z direction. If mz is greater than 3. Mu.m, it is indicated that the assembly error of the semiconductor chip dicing apparatus is excessive at this time, and adjustment of the assembly error is required. And after the assembly error is adjusted to mz smaller than 3 mu m, the subsequent steps are carried out, so that the cutting precision, stability and cutting quality can be improved, and the performance and effect of the semiconductor chip cutting equipment are improved.
S510, if the cutting precision requirement of the chip product 13 in the Y direction is greater than a1+a2, the cutting precision requirement can be met, and the vibration of the main shaft 5 in the Y direction is not required to be regulated;
s520, the lower cutter depth of the main shaft 5 is larger than b1+b2 so as to ensure that the product is cut thoroughly in the Z direction;
s530, if the value of my is larger than the preset process parameters, the power and rotational speed of the spindle 5 are adjusted to reduce the value of my.
It is to be understood that the above-described embodiments of the present invention are provided by way of illustration only and not limitation of the embodiments thereof. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are desired to be protected by the following claims.
Claims (10)
1. The semiconductor chip cutting equipment is characterized by comprising an X slide carriage (1) and a driving piece (2), a working disc (3), a bearing frame (4), a main shaft (5), a blade (6), a first vibration tester (7), a second vibration tester (8), a first CCD camera (9), a second CCD camera (10), a first CCD imaging plate (11) and a second CCD imaging plate (12) which are arranged on the X slide carriage (1), wherein the output end of the driving piece (2) is connected with the working disc (3), the driving piece (2) is configured to drive the working disc (3) to rotate, the bearing frame (4) is mounted on the working disc (3), the bearing frame (4) is configured to bear chip products (13), the blade (6) is arranged at the tail end of the main shaft (5), the axial direction of the main shaft (5) is in the Y direction, the first vibration tester (7) is arranged on the end face of the main shaft (5), the second vibration tester (8) is arranged on the main shaft (5) and opposite to the first CCD camera (9) and passes through the first vibration tester (5) and the first CCD camera (9) and the second vibration tester (5) are arranged on the two sides of the main shaft (5), the second CCD camera (10) and the second CCD imaging plate (12) are respectively arranged on two sides of the main shaft (5), are oppositely arranged along the Y direction, and pass through the blade (6) through a central connecting line.
2. Semiconductor chip dicing apparatus according to claim 1, characterized in that the spindle (5) is an air-floating spindle (5).
3. Semiconductor chip dicing apparatus according to claim 1, characterized in that the first CCD camera (9) is a high frame rate CCD camera.
4. The semiconductor chip dicing apparatus according to claim 1, wherein the second CCD camera (10) is a high frame rate CCD camera.
5. Semiconductor chip dicing apparatus according to claim 1, characterized in that the driving member (2) is a torque motor.
6. The semiconductor chip dicing apparatus according to claim 1, further comprising a waterproof cover (14), the waterproof cover (14) being disposed between the work tray (3) and the driving member (2).
7. The semiconductor chip dicing apparatus according to claim 6, further comprising a waterproof support bar (15), one end of the waterproof support bar (15) being provided on the X-carriage (1), the other end of the waterproof support bar (15) being provided on the waterproof cover (14).
8. Semiconductor chip dicing apparatus according to claim 1, characterized in that the semiconductor chip dicing apparatus further comprises an adjusting pad (16), the adjusting pad (16) being arranged between the X-carriage (1) and the driving member (2).
9. A spindle vibration adaptive control method applied to the semiconductor chip dicing apparatus according to any one of claims 1 to 8, characterized by comprising the steps of:
s100, measuring a displacement value my of the main shaft (5) in the Y direction by using the first vibration tester (7);
s200, measuring a displacement value mz of the main shaft (5) in the Z direction by using the second vibration tester (8);
s300, detecting error values a1 and a2 of the blade (6) and the working disc (3) in the Y direction by using the first CCD camera (9) and the first CCD imaging plate (11) respectively;
s400, detecting error values b1 and b2 of the blade (6) and the working disc (3) in the Z direction by using the second CCD camera (10) and the second CCD imaging plate (12) respectively;
s500, respectively comparing the my, mz, a1, a2, b1 and b2 with the technological parameters, and adjusting the cutting depth of the blade (6) and the power and the rotating speed of the main shaft (5).
10. The method according to claim 9, wherein step S500 includes:
s509, if mz is larger than 3 μm, adjusting the assembly error of the semiconductor chip cutting device to make mz smaller than 3 μm, and performing the subsequent steps;
s510, if the cutting precision requirement of the chip product (13) in the Y direction is greater than a1+a2, the cutting precision requirement can be met, and the vibration of the main shaft (5) in the Y direction does not need to be regulated;
s520, the cutter setting depth of the main shaft (5) is larger than b1+b2;
s530, if the value of my is larger than the preset process parameters, the power and rotational speed of the spindle (5) are adjusted to reduce the value of my.
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| CN202311062714.0A CN116749365B (en) | 2023-08-23 | 2023-08-23 | Semiconductor chip cutting equipment and spindle vibration self-adaptive control method |
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| CN202311062714.0A CN116749365B (en) | 2023-08-23 | 2023-08-23 | Semiconductor chip cutting equipment and spindle vibration self-adaptive control method |
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| CN217786505U (en) * | 2022-06-22 | 2022-11-11 | 深圳市大成自动化设备有限公司 | Detection and correction device for semiconductor laser LED chip |
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| CN105666246A (en) * | 2016-04-12 | 2016-06-15 | 山东大学 | Tool parameter measurement device based on CCD and measurement method of device |
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