CN116727928A - Soldering flux and preparation method thereof - Google Patents
Soldering flux and preparation method thereof Download PDFInfo
- Publication number
- CN116727928A CN116727928A CN202310667333.9A CN202310667333A CN116727928A CN 116727928 A CN116727928 A CN 116727928A CN 202310667333 A CN202310667333 A CN 202310667333A CN 116727928 A CN116727928 A CN 116727928A
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- CN
- China
- Prior art keywords
- flux
- soldering flux
- active ingredient
- mass fraction
- soldering
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- 230000004907 flux Effects 0.000 title claims abstract description 63
- 238000005476 soldering Methods 0.000 title claims abstract description 53
- 238000002360 preparation method Methods 0.000 title description 6
- 238000007716 flux method Methods 0.000 title description 2
- 239000004480 active ingredient Substances 0.000 claims abstract description 36
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid group Chemical group C(CC(O)(C(=O)O)CC(=O)O)(=O)O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000006184 cosolvent Substances 0.000 claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000654 additive Substances 0.000 claims abstract description 14
- 150000001412 amines Chemical class 0.000 claims abstract description 11
- 239000003242 anti bacterial agent Substances 0.000 claims abstract description 11
- 150000007524 organic acids Chemical class 0.000 claims abstract description 11
- 239000004094 surface-active agent Substances 0.000 claims abstract description 11
- 239000008367 deionised water Substances 0.000 claims abstract description 10
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 10
- 239000002904 solvent Substances 0.000 claims abstract description 10
- 230000000996 additive effect Effects 0.000 claims abstract description 8
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims abstract description 7
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000012964 benzotriazole Substances 0.000 claims abstract description 7
- 239000001630 malic acid Substances 0.000 claims abstract description 7
- 235000011090 malic acid Nutrition 0.000 claims abstract description 7
- 229920001213 Polysorbate 20 Polymers 0.000 claims abstract description 4
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 claims abstract description 4
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 claims abstract description 4
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 claims abstract description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 18
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 8
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- 150000002500 ions Chemical class 0.000 claims description 6
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims description 6
- 239000012065 filter cake Substances 0.000 claims description 4
- INZRPSKMDNSMJP-UHFFFAOYSA-N 2,3-bis(3-methylbutoxy)propan-1-ol Chemical compound CC(C)CCOCC(CO)OCCC(C)C INZRPSKMDNSMJP-UHFFFAOYSA-N 0.000 claims description 3
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical group OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 claims description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- 229920000604 Polyethylene Glycol 200 Polymers 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 3
- PLKATZNSTYDYJW-UHFFFAOYSA-N azane silver Chemical compound N.[Ag] PLKATZNSTYDYJW-UHFFFAOYSA-N 0.000 claims description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 3
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 3
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 3
- 239000000376 reactant Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910001961 silver nitrate Inorganic materials 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000005303 weighing Methods 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229920003169 water-soluble polymer Polymers 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 1
- 241000233866 Fungi Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009395 breeding Methods 0.000 description 1
- 230000001488 breeding effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 244000005700 microbiome Species 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A50/00—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE in human health protection, e.g. against extreme weather
- Y02A50/30—Against vector-borne diseases, e.g. mosquito-borne, fly-borne, tick-borne or waterborne diseases whose impact is exacerbated by climate change
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A soldering flux comprising a solvent, an active ingredient and an additive, wherein the solvent comprises deionized water and a cosolvent, the active ingredient comprises an organic amine active ingredient and an organic acid active ingredient, and the additive comprises a surfactant and a nano silver antibacterial agent; the organic amine active ingredient is benzotriazole, the organic acid active ingredient is citric acid and malic acid, and the surfactant is JFC-5 penetrant and Tween-20.
Description
Technical Field
The invention relates to a soldering flux and a preparation method thereof.
Background
With the continuous development of the electronic industry, the continuous updating of electronic products and the continuous upgrading of environmental protection regulations, the requirements of the market on soldering flux are increasing. As the SMT (surface mount technology) industry is developing, the demand of high-efficiency soldering flux is also increasing. The need for efficient soldering flux will increase year by year as one of the globally important SMT equipment manufacturing bases in our country. With the enhancement of human environmental awareness and the prohibition of implementation of lead-containing products and Freon policies, lead-free brazing technology and cleaning-free soldering flux matched with the lead-free brazing technology become hot spots for domestic and foreign research. However, most of the cleaning-free soldering fluxes applied in the SMT industry at present have potential safety hazards and are easy to cause environmental pollution. The water-based no-clean soldering flux not only can overcome the defect of solvent no-clean soldering flux, but also is suitable for the wave soldering process of lead-free solder, and is the research direction in the field of microelectronic packaging materials at present.
However, the solvent of the water-based no-clean soldering flux is mainly water, and the surface tension of the water is large, so that the wettability of the soldering flux is poor, the soldering flux is not easy to spread along the horizontal direction relative to the substrate, and the soldering flux is easy to stay between the electrodes when being melted. Adjacent molten solder is pulled by flux between the electrodes, and the solder pastes closely form a solder bridge with each other. Tin bridges become a cause of damaging the reliability of soldering. And most of the traditional soldering flux components are insoluble in water, so that the development of the water-based no-clean soldering flux is limited.
Disclosure of Invention
The invention aims to provide a soldering flux which can avoid tin bridge generation and improve the water-solubility of the soldering flux.
The above object of the present invention is achieved by the following means:
a soldering flux comprising a solvent, an active ingredient and an additive, wherein the solvent comprises deionized water and a cosolvent, the active ingredient comprises an organic amine active ingredient and an organic acid active ingredient, and the additive comprises a surfactant and a nano silver antibacterial agent;
the method is characterized in that: the organic amine active ingredient is benzotriazole, the organic acid active ingredient is citric acid and malic acid, and the surfactant is JFC-5 penetrant and Tween-20.
Further, the mass fraction of the organic amine active ingredient in the soldering flux is calculated by mass fraction: 0.1 to 0.2 percent of benzotriazole.
Further, the mass fraction of the organic acid active ingredient in the soldering flux is calculated by mass fraction: 1.6 to 2.0 percent of citric acid and 0.5 to 0.8 percent of malic acid.
Further, the mass fraction of the surfactant in the soldering flux is calculated by mass fraction: 200.5 to 0.6 percent of Tween-5 and 0.3 to 0.5 percent of JFC-5 penetrating agent.
Further, the mass fraction of the nano silver antibacterial agent in the soldering flux is 0.5-0.6% in terms of mass fraction.
Further, the cosolvent includes an alcohol cosolvent and an ether cosolvent.
Further, the alcohol cosolvent is PEG200 or isopropanol, and the ether cosolvent is ethylene glycol phenyl ether or glycerol diisoamyl ether.
Further, the mass fraction of the alcohol cosolvent is 1-2% of the mass fraction of the soldering flux, and the mass fraction of the ether cosolvent is 5-8% of the mass fraction of the soldering flux.
Another object of the present invention is to provide a method for preparing the above flux, comprising the steps of;
weighing active ingredients and additives, and the balance being deionized water, and putting the weighed active ingredients and additives into a stirrer;
stirring in a stirrer for 2 hours at the rotating speed of 800r/min, thus obtaining the water-based soldering flux.
Further, the preparation steps of the nano silver antibacterial agent are as follows: activating 12% silver nitrate solution and 15% concentrated ammonia water in nitric acid for 10 hours to obtain silver ammonia complex ion solution; the pH value of the silver ammino ion solution is adjusted to 9-10 and is added into a reaction kettle, and 5% polyvinylpyrrolidone and 8% hydrogen peroxide are added into the reaction kettle and are uniformly stirred; heating the reaction kettle to 40 ℃ for reaction for 4 hours, and then filtering and separating reactants; and (3) washing the filter cake by using deionized water and ethanol, and finally drying at 50 ℃ for 2 hours to obtain the water-soluble polymer.
The technical effects of the scheme of the invention can be achieved as follows:
the soldering flux overcomes the defect that the existing water-based no-clean soldering flux can not inhibit tin bridge formation of soft solder, has the characteristics of high welding activity, strong weldability, less residues and high surface insulation resistance, and has low corrosiveness, good storage stability, good applicability to lead-free welding and no-clean requirement.
The nano silver antibacterial agent is added into the soldering flux, so that the breeding of microorganisms such as bacteria and fungi is avoided, and the influence on weldability and postweld reliability is avoided.
Detailed Description
The following description of the technical solutions in the embodiments of the present invention will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
A soldering flux comprising a solvent, an active ingredient and an additive, wherein the solvent comprises deionized water and a cosolvent, the active ingredient comprises an organic amine active ingredient and an organic acid active ingredient, and the additive comprises a surfactant and a nano silver antibacterial agent; the organic amine active ingredient is benzotriazole, the organic acid active ingredient is citric acid and malic acid, and the surfactant is JFC-5 penetrant and Tween-20.
Further, the mass fraction of the organic amine active ingredient in the soldering flux is calculated by mass fraction: 0.2% of benzotriazole, wherein the mass fraction of the organic acid active ingredient in the soldering flux is calculated by mass fraction: citric acid 1.8%, malic acid 0.6%, wherein the mass fraction of the surfactant in the soldering flux is calculated by mass fraction: tween-20.5% and JFC-5 penetrant 0.3%.
The mass fraction of the nano silver antibacterial agent in the soldering flux is 0.5%, and the preparation steps of the nano silver antibacterial agent are as follows: activating 12% silver nitrate solution and 15% concentrated ammonia water in nitric acid for 10 hours to obtain silver ammonia complex ion solution; the pH value of the silver ammino ion solution is adjusted to 9-10 and is added into a reaction kettle, and 5% polyvinylpyrrolidone and 8% hydrogen peroxide are added into the reaction kettle and are uniformly stirred; heating the reaction kettle to 40 ℃ for reaction for 4 hours, and then filtering and separating reactants; and (3) washing the filter cake by using deionized water and ethanol, and finally drying at 50 ℃ for 2 hours to obtain the water-soluble polymer.
The cosolvent comprises an alcohol cosolvent and an ether cosolvent, wherein the alcohol cosolvent is PEG200 or isopropanol, the ether cosolvent is ethylene glycol phenyl ether or glycerol diisoamyl ether, the alcohol cosolvent accounts for 2% of the mass of the soldering flux in mass fraction, and the ether cosolvent accounts for 5% of the mass of the soldering flux.
The preparation method of the soldering flux comprises the following steps of; weighing active ingredients and additives, and the balance being deionized water, and putting the weighed active ingredients and additives into a stirrer; stirring in a stirrer for 2 hours at the rotating speed of 800r/min, thus obtaining the water-based soldering flux.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related arts are included in the scope of the present invention.
Claims (10)
1. A soldering flux comprising a solvent, an active ingredient and an additive, wherein the solvent comprises deionized water and a cosolvent, the active ingredient comprises an organic amine active ingredient and an organic acid active ingredient, and the additive comprises a surfactant and a nano silver antibacterial agent;
the method is characterized in that: the organic amine active ingredient is benzotriazole, the organic acid active ingredient is citric acid and malic acid, and the surfactant is JFC-5 penetrant and Tween-20.
2. The soldering flux of claim 1, wherein the mass fraction of the organic amine active ingredient in the soldering flux is calculated as mass fraction: 0.1 to 0.2 percent of benzotriazole.
The mass fraction of the organic acid active ingredient in the soldering flux is calculated by mass fraction: 1.6 to 2.0 percent of citric acid and 0.5 to 0.8 percent of malic acid.
3. The soldering flux of claim 2, wherein the surfactant is present in the soldering flux in mass fraction: tween-20.5-0.6% and JFC-5 penetrating agent 0.3-0.5%.
4. A soldering flux according to claim 3, wherein the nano silver antibacterial agent is present in the soldering flux in a mass fraction of 0.5 to 0.6%.
5. The flux of claim 4, wherein the flux comprises an alcohol flux and an ether flux.
6. The soldering flux of claim 5, wherein the alcohol-based co-solvent is PEG200 or isopropanol, and the ether-based co-solvent is ethylene glycol phenyl ether or glycerol diisoamyl ether.
7. The flux of claim 6, wherein the alcohol flux comprises 1-2% by mass of the flux and the ether flux comprises 5-8% by mass of the flux.
8. A method of preparing the flux of any one of claims 1-7, comprising the steps of;
weighing active ingredients and additives, and the balance being deionized water, and putting the weighed active ingredients and additives into a stirrer;
stirring in a stirrer for 2 hours at the rotating speed of 800r/min, thus obtaining the water-based soldering flux.
9. The method for preparing a soldering flux according to claim 8, wherein the nano silver antibacterial agent is prepared by the steps of: activating 12% silver nitrate solution and 15% concentrated ammonia water in nitric acid for 10 hours to obtain silver ammonia complex ion solution; the pH value of the silver ammino ion solution is adjusted to 9-10 and is added into a reaction kettle, and 5% polyvinylpyrrolidone and 8% hydrogen peroxide are added into the reaction kettle and are uniformly stirred; and heating the reaction kettle to 40 ℃ for reaction for 4 hours, filtering and separating reactants, and cleaning a filter cake.
10. The method for preparing soldering flux according to claim 9, wherein the filter cake is washed with deionized water and ethanol, and finally dried at 50 ℃ for 2 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310667333.9A CN116727928A (en) | 2023-06-07 | 2023-06-07 | Soldering flux and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310667333.9A CN116727928A (en) | 2023-06-07 | 2023-06-07 | Soldering flux and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116727928A true CN116727928A (en) | 2023-09-12 |
Family
ID=87903865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310667333.9A Pending CN116727928A (en) | 2023-06-07 | 2023-06-07 | Soldering flux and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116727928A (en) |
-
2023
- 2023-06-07 CN CN202310667333.9A patent/CN116727928A/en active Pending
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