CN116724664B - 加热装置 - Google Patents

加热装置

Info

Publication number
CN116724664B
CN116724664B CN202280010642.2A CN202280010642A CN116724664B CN 116724664 B CN116724664 B CN 116724664B CN 202280010642 A CN202280010642 A CN 202280010642A CN 116724664 B CN116724664 B CN 116724664B
Authority
CN
China
Prior art keywords
heating
fixing
plate
heating device
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202280010642.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN116724664A (zh
Inventor
前田浩幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN116724664A publication Critical patent/CN116724664A/zh
Application granted granted Critical
Publication of CN116724664B publication Critical patent/CN116724664B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H05B3/42—Heating elements having the shape of rods or tubes non-flexible

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Resistance Heating (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
CN202280010642.2A 2021-01-26 2022-01-18 加热装置 Active CN116724664B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021010679 2021-01-26
JP2021-010679 2021-01-26
PCT/JP2022/001671 WO2022163444A1 (ja) 2021-01-26 2022-01-18 加熱装置

Publications (2)

Publication Number Publication Date
CN116724664A CN116724664A (zh) 2023-09-08
CN116724664B true CN116724664B (zh) 2026-04-21

Family

ID=82653408

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280010642.2A Active CN116724664B (zh) 2021-01-26 2022-01-18 加热装置

Country Status (3)

Country Link
JP (1) JP7483951B2 (https=)
CN (1) CN116724664B (https=)
WO (1) WO2022163444A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005032842A (ja) * 2003-07-08 2005-02-03 Ibiden Co Ltd 電極構造およびセラミック接合体
JP2016207595A (ja) * 2015-04-28 2016-12-08 日本特殊陶業株式会社 加熱装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184557A (ja) 2000-12-12 2002-06-28 Ibiden Co Ltd 半導体製造・検査装置用ヒータ
JP3572412B2 (ja) * 2001-11-12 2004-10-06 坂口電熱株式会社 ホットプレート
JP3821075B2 (ja) 2002-09-20 2006-09-13 住友電気工業株式会社 セラミックスヒータ及びその製造方法
JP6626277B2 (ja) * 2015-07-01 2019-12-25 株式会社アガツマ 綿菓子製造装置
KR20200021818A (ko) * 2018-08-21 2020-03-02 세메스 주식회사 가열 플레이트, 이를 구비하는 기판 열처리 장치 및 가열 플레이트의 제조 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005032842A (ja) * 2003-07-08 2005-02-03 Ibiden Co Ltd 電極構造およびセラミック接合体
JP2016207595A (ja) * 2015-04-28 2016-12-08 日本特殊陶業株式会社 加熱装置

Also Published As

Publication number Publication date
JPWO2022163444A1 (https=) 2022-08-04
WO2022163444A1 (ja) 2022-08-04
JP7483951B2 (ja) 2024-05-15
CN116724664A (zh) 2023-09-08

Similar Documents

Publication Publication Date Title
TW575934B (en) A heating apparatus
US20030183616A1 (en) Ceramic heater
KR20180096745A (ko) 정전 척
US6958462B2 (en) Ceramic heaters
CN118776371A (zh) 用于脉动运行的热管散热器和这种热管散热器的制造方法
CN103628955B (zh) 热传递单元
CN116724664B (zh) 加热装置
JP7331107B2 (ja) 半導体製造装置用部材
CN115602406B (zh) 用于产生等离子体的线圈装置及半导体工艺设备
US7525071B2 (en) Power-supplying member and heating apparatus using the same
JP2021176192A (ja) 流路構造体および半導体製造装置
CN114799456A (zh) 脉冲压头及热压装置
TW202038677A (zh) 陶瓷加熱器
JP7706552B2 (ja) 加熱装置
JP2022106994A (ja) 加熱装置
US20250275018A1 (en) Heating device
JP7833347B2 (ja) 加熱装置
CN117652203A (zh) 加热装置
CN116671253A (zh) 加热装置
WO2022137769A1 (ja) 加熱装置
CN220252030U (zh) 压头结构、控温装置及电子元件测试系统
KR20220096801A (ko) 물 가열기 및 물 가열기용 버플 조립체
KR102387882B1 (ko) 플래튼 지지 구조체 및 플래튼
JP7703415B2 (ja) 保持装置
US12250752B2 (en) Heater

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant