CN116709739A - Heat pipe-based indirect liquid cooling radiator for server - Google Patents
Heat pipe-based indirect liquid cooling radiator for server Download PDFInfo
- Publication number
- CN116709739A CN116709739A CN202310710258.XA CN202310710258A CN116709739A CN 116709739 A CN116709739 A CN 116709739A CN 202310710258 A CN202310710258 A CN 202310710258A CN 116709739 A CN116709739 A CN 116709739A
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- liquid cooling
- section
- shaped
- runner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 83
- 239000007788 liquid Substances 0.000 title claims abstract description 83
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 42
- 238000001704 evaporation Methods 0.000 claims abstract description 30
- 230000008020 evaporation Effects 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000009833 condensation Methods 0.000 claims abstract description 16
- 230000005494 condensation Effects 0.000 claims abstract description 16
- 239000002131 composite material Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 5
- 238000005219 brazing Methods 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 4
- 229910021641 deionized water Inorganic materials 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 18
- 239000003507 refrigerant Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000006262 metallic foam Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention relates to the technical field of electronic equipment heat dissipation, in particular to a server indirect liquid cooling radiator based on a heat pipe, and aims to solve the problem that in the prior art, the space utilization rate and the heat exchange efficiency of a microchannel liquid cooling plate are low. The invention comprises the following steps: the liquid cooling body is provided with a water inlet and a water outlet; a liquid cooling cavity is arranged in the liquid cooling body, and a runner connected with the water inlet and the water outlet respectively is arranged in the liquid cooling cavity; two substrates which are symmetrically arranged at two sides of the liquid cooling body and are bonded with the CPU; the two ends of each U-shaped heat pipe are respectively provided with an evaporation section and a condensation section, the evaporation sections are connected with the substrate, and the condensation sections are inserted into the liquid cooling cavity; the U-shaped heat pipes are symmetrically arranged. The invention can fully utilize the internal space of the server, improve the space utilization rate and make the internal arrangement of the server more compact. In addition, the heat transfer distance of the U-shaped heat pipe is short, the bearing maximum heat dissipation capacity is strong, and the symmetrical arrangement of the U-shaped heat pipes can enhance the stability of the heat pipe.
Description
Technical Field
The invention belongs to the technical field of heat dissipation of electronic equipment, and particularly relates to a server indirect liquid cooling radiator based on a heat pipe.
Background
With the rapid increase of traffic in the information industry, the position of data centers is higher and higher, and becomes one of the most important infrastructures. At present, most data centers still adopt an air cooling technology to cool power electronic equipment of the data centers, but the cooling mode of forced air convection is low in heat dissipation efficiency due to high heat resistance of air, so that the problem of high energy consumption of the cooling equipment of the data centers is solved under the environment of green, low-carbon and cyclic development nowadays. Meanwhile, with the arrangement of high or ultra-high density cabinets, the air cooling heat dissipation cannot meet the requirement of too high heat dissipation, so that the air cooling technology is limited in the application of large-scale data centers. In order to improve the heat dissipation performance of the server, the development direction of cooling of the high-power electronic equipment is that a liquid working medium with a high heat conductivity coefficient is used as a cooling medium for heat dissipation of the server instead of air.
The server liquid cooling technology is divided into direct liquid cooling and indirect liquid cooling, at present, the indirect cooling of practical application is mainly to using microchannel liquid cooling plate (liquid cooling body) to dispel the heat to the interior high heating electronic component of server, runner size in the microchannel liquid cooling plate is generally at O.15 ~ 1mm, because runner size is less, lead to the liquid cooling plate heat exchange inefficiency, in addition, the space utilization of microchannel liquid cooling plate structure is lower, can occupy the inside unnecessary space of server in practical application, and the indirect liquid cooling technology post maintenance input of adopting the microchannel liquid cooling plate is big, the reliability is lower.
Disclosure of Invention
The invention provides a server indirect liquid cooling radiator based on a heat pipe, and aims to solve the problem that a microchannel liquid cooling plate in the prior art is low in space utilization rate and heat exchange efficiency.
In order to solve the technical problems, the invention adopts the following technical scheme:
the invention provides a server indirect liquid cooling radiator based on a heat pipe, which comprises:
the liquid cooling body is provided with a water inlet and a water outlet; the liquid cooling body is internally provided with a liquid cooling cavity, a flow passage is arranged in the liquid cooling cavity, and two ends of the flow passage are respectively connected with the water inlet and the water outlet;
the two substrates are symmetrically arranged on two sides of the liquid cooling body, and the two substrates are attached to the CPU;
the two ends of each U-shaped heat pipe are respectively provided with an evaporation section and a condensation section, the evaporation sections are connected with the substrate, and the condensation sections are inserted into the liquid cooling cavity; the U-shaped heat pipes are symmetrically arranged.
The further scheme is as follows: the runner comprises an upper runner and a lower runner, and the upper runner is positioned above the lower runner; and ribs are arranged on the path of each flow passage.
Based on the scheme, the refrigerant is uniformly led in the upper flow channel and the lower flow channel, so that the heat exchange efficiency is improved; and the structure inside the liquid cooling body is more compact, and the space utilization rate inside the liquid cooling body is improved.
The further scheme is as follows: the upper runner is S-shaped formed by connecting a plurality of upper runner sections; the two ends of each upper runner section are provided with arc-shaped flow guiding structures, and each upper runner section is provided with a plurality of fins which are transversely and parallelly arranged.
The further scheme is as follows: the lower runner is S-shaped formed by connecting a plurality of lower runner sections; the two ends of each lower runner section are provided with arc-shaped flow guiding structures, and each lower runner section is internally provided with a plurality of fins which are transversely and parallelly arranged.
Based on the scheme, the circular arc-shaped flow guiding structures at the ends of the upper flow passage section and the lower flow passage section enable the local resistance of the refrigerant flowing in the liquid cooling cavity to be smaller and the pressure drop to be lower.
The further scheme is as follows: the thickness of each fin is 0.5-3 mm; the spacing between the ribs in each upper runner section and/or each lower runner section is 1-5 mm.
The further scheme is as follows: the bottoms of the two substrates are respectively provided with a plurality of heat pipe grooves, and the openings of the heat pipe grooves face downwards; the evaporation section is arranged in the heat pipe groove.
Based on the scheme, the substrate is attached to the CPU, and the evaporation section is arranged in the heat pipe groove of the substrate, so that resistance of heat transfer can be reduced, and heat can be absorbed to the maximum extent by the evaporation section.
The further scheme is as follows: a flat surface is arranged at the bottom of the evaporation section of the U-shaped heat pipe and is flush with the opening of the heat pipe groove; the condensing section of the U-shaped heat pipe is inserted between the upper runner and the lower runner.
Based on the scheme, the flat surface is flush with the lower port of the heat pipe groove, so that the contact area of the substrate and the CPU can be increased, the evaporation section of the U-shaped heat pipe is directly contacted with the surface of the CPU, and the thermal resistance can be reduced.
The further scheme is as follows: a heat insulation section is arranged between the evaporation section and the condensation section; the liquid suction core on the inner wall of the U-shaped heat pipe is of a groove structure or a composite structure, and working medium is filled in the U-shaped heat pipe.
Based on the scheme, the heat insulation section can prevent heat in the U-shaped heat pipe from being dissipated to the outside, and ensures that the heat is transferred from the evaporation section to the condensation section. In addition, the liquid suction core adopts a groove structure or a composite structure, so that the reflux resistance of working media is smaller, and the maximum heat dissipation capability can be borne is stronger.
The further scheme is as follows: the working medium is deionized water.
The further scheme is as follows: the indirect liquid cooling radiator of the server based on the heat pipe also comprises two pagoda joints; the two pagoda joints are respectively arranged at the water inlet and the water outlet on the liquid cooling body in a brazing or integral forming mode.
Based on the scheme, the pagoda joint adopts a brazing or integrated forming process, so that liquid leakage is avoided when the refrigerant in the liquid cooling cavity flows through the water inlet and the water outlet.
The beneficial effects of the invention are as follows:
1. the invention is applied to the chip-level heat dissipation of the server, the flow channel structure in the liquid cooling cavity is more compact, and the heat dissipation efficiency is improved; the heat dissipation requirement of the ultra-high density cabinet can be met. The space arrangement of the radiator is more reasonable, the situation that the expansion slot of the main board in the server cannot be used because the radiator occupies space is avoided, and the space utilization rate is higher.
2. The heat pipe is based on the U-shaped heat pipe, the heat transfer distance of the U-shaped heat pipe is short, heat is prevented from being dissipated to the outside in the process of transferring, and the heat transfer efficiency and the heat dissipation capacity are improved.
3. The symmetrical arrangement of the substrate and the plurality of U-shaped heat pipes ensures that the structure of the whole radiator is more stable; the probability of the radiator being problematic in use is reduced, so that the investment of later maintenance is reduced, and the reliability of the radiator is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a heat pipe-based indirect liquid-cooled radiator for a server according to the present invention;
FIG. 2 is a schematic diagram of the bottom of a U-shaped heat pipe according to the present invention;
FIG. 3 is a schematic view of the structure of the bottom of the substrate according to the present invention;
FIG. 4 is a schematic diagram of an exploded view of a first view of a liquid cooling body according to the present invention;
FIG. 5 is a schematic diagram of an exploded view of a second view of a liquid cooling body according to the present invention;
FIG. 6 is a cross-sectional view of a liquid cooling chamber in accordance with the present invention.
The reference numerals in the figures illustrate:
1-liquid cooling; 11-water inlet; 12-water outlet; 13-an annular groove; 14-upper flow channel; 141-an upper cover plate; 15-a lower runner; 151-lower cover plate; 16-ribs; 17-bolt holes; 18-through holes; 19-heat dissipation channels; 2-a substrate; 21-a heat pipe groove; 3-U-shaped heat pipes; 31-an evaporation section; 311-flat surfaces; 32-an insulation section; 33-condensing section; 4-pagoda joint.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. All other embodiments, which can be obtained by a person skilled in the art without creative efforts, are included in the protection scope of the present invention based on the embodiments of the present invention.
As shown in fig. 1, this embodiment provides a server indirect liquid cooling radiator based on a heat pipe, including:
the liquid cooling body 1 is provided with a water inlet 11 and a water outlet 12; a liquid cooling cavity is arranged in the liquid cooling body 1, a flow passage is arranged in the liquid cooling cavity, and two ends of the flow passage are respectively connected with the water inlet 11 and the water outlet 12;
specifically, a cooling circuit is arranged in the server, a refrigerant (for example, deionized water) is filled in the cooling circuit, the liquid cooling body 1 is positioned on the path of the cooling circuit, the refrigerant in the cooling circuit enters the flow passage from the water inlet 11, flows out of the flow passage from the water outlet 12, and then returns to the cooling circuit.
The liquid cooling body 1 further comprises an upper cover plate 141, a lower cover plate 151 and bolt holes 17 arranged at two ends of the liquid cooling body 1, and the liquid cooling body 1 is fixed inside the server through the bolt holes 17.
Two substrates 2 are symmetrically arranged on two sides of the liquid cooling body 1, and the two substrates 2 are attached to a CPU;
the two ends of each U-shaped heat pipe 3 are respectively provided with an evaporation section 31 and a condensation section 33, the evaporation sections 31 are connected with the base plate 2, and the condensation sections 33 are inserted into the liquid cooling cavity; the U-shaped heat pipes 3 are symmetrically arranged.
Specifically, in this embodiment, the indirect liquid cooling radiator of the server based on the heat pipe is symmetrically distributed in space, the evaporation section 31 of the U-shaped heat pipe 3 is disposed in the heat pipe groove 21 of the substrate 2, the condensation section 33 of the U-shaped heat pipe 3 is inserted into the liquid cooling cavity, and the liquid cooling body 1 is connected with the cooling circuit of the refrigerant passing in and out through the pagoda joint 4.
Preferably, the liquid cooling body 1 and the two substrates 2 may be made of aluminum alloy, the plurality of U-shaped heat pipes 3 are made of copper pipes, and the inside of the pipes is in a vacuum state.
The scheme as an improved type is as follows:
as shown in fig. 4 and 5, the flow channel includes an upper flow channel 14 and a lower flow channel 15, and the upper flow channel 14 is located above the lower flow channel 15; the path of each flow channel is provided with ribs 16.
Specifically, the upper runner 14 is S-shaped formed by connecting a plurality of upper runner segments; both ends of each upper runner section are provided with arc-shaped flow guiding structures, and each upper runner section is provided with a plurality of ribs 16 which are transversely arranged in parallel.
As one of the preferable schemes:
five upper runner sections are sequentially connected end to end and are distributed at the upper end of the liquid cooling cavity in an S-shaped mode, and arc-shaped flow guiding structures are arranged at the connecting positions of two adjacent upper runner sections. The two upper runner sections at the head and the tail are respectively connected with the water inlet 11 and the water outlet 12. In the upper flow channel 14, four ribs 16 which are transversely arranged in parallel and are trapezoidal are arranged in the two upper flow channel sections at the head and the tail. Four fins 16 which are transversely arranged in parallel and are in parallelogram are arranged in the rest three upper runner sections; the parallelogram structures of the ribs 16 in the remaining three of said upper flow path sections are symmetrical to each other.
Specifically, the structures of the lower flow channel 15 and the upper flow channel 14 are the same, that is: the lower runner 15 is S-shaped formed by connecting a plurality of lower runner sections; both ends of each lower runner section are provided with arc-shaped flow guiding structures, and each lower runner section is provided with a plurality of ribs 16 which are transversely arranged in parallel.
As one of the preferable schemes:
five lower runner sections are sequentially connected end to end and are distributed at the lower end of the liquid cooling cavity in an S-shaped mode, and arc-shaped flow guiding structures are arranged at the connecting positions of two adjacent lower runner sections. The two lower runner sections at the head and the tail are respectively connected with the water inlet 11 and the water outlet 12. In the lower flow passage 15, four ribs 16 which are transversely arranged in parallel and are trapezoidal are arranged in the two lower flow passage sections at the head and the tail. Four ribs 16 which are transversely arranged in parallel and are in parallelogram are arranged in the rest three lower runner sections; the parallelogram structures of the ribs 16 in the remaining three of said lower flow path sections are symmetrical to each other.
Of course, the number of the upper runner section and the lower runner section is not fixed, and may be six, eight, etc., and the number of the fins 16 in the upper runner section and the lower runner section is not fixed, and may be five, six, etc.
Preferably, each of the ribs 16 has a thickness of 0.5 to 3mm; for example, the ribs 16 may have a thickness of 0.5mm, 1mm, 1.5mm, 2mm, 2.5mm, or 3mm. The spacing between the ribs 16 in each of the upper runner segments and/or each of the lower runner segments is 1-5 mm; for example: the spacing between the ribs 16 may be 1mm, 3mm or 5mm.
As shown in fig. 3, the bottoms of the two substrates 2 are respectively provided with a plurality of heat pipe grooves 21, and the openings of the heat pipe grooves 21 face downwards; the evaporation section 31 is disposed in the heat pipe groove 21.
Specifically, the heat pipe groove 21 is in a circular arc shape, and can be matched with the evaporation section 31 of the U-shaped heat pipe 3. The base plate 2 is provided with bolt holes 17 for fixing.
As shown in fig. 2, a flat surface 311 is disposed at the bottom of the evaporation section 31 of the U-shaped heat pipe 3, the flat surface 311 is flush with the opening of the heat pipe groove 21, and the upper surface of the evaporation section 31 is attached to the bottom of the heat pipe groove 21.
When in use, the evaporation section 31 of the U-shaped heat pipe 3 is fixed in the heat pipe groove 21, the flat surface 311 of the evaporation section 31 is flush with the opening of the heat pipe groove 21, the bottom surface of the substrate 2 is attached to the heat dissipation surface of the CPU, the bottom surface of the substrate 2 and the flat surface 311 of the evaporation section 31 are both coated with heat-conducting silicone grease, and the substrate 2 is fixed on the CPU or in the server through the bolt hole 17.
As shown in fig. 6, a heat dissipation channel 19 is formed between the upper flow channel 14 and the lower flow channel 15, and the condensation section 33 of the U-shaped heat pipe 3 is inserted into the heat dissipation channel 19.
Specifically, as shown in fig. 1, a plurality of through holes 18 are provided on the side wall of the liquid cooling body 1, and the condensation section 33 of the U-shaped heat pipe 3 penetrates through the through holes 18 and is fixed, and is inserted into the heat dissipation channel 19 in the liquid cooling cavity.
Preferably, the through holes 18 are circular, and the number of the through holes 18 is greater than or equal to the number of the U-shaped heat pipes 3.
As shown in fig. 2, a heat insulation section 32 is arranged between the evaporation section 31 and the condensation section 33; the liquid suction core on the inner wall of the U-shaped heat pipe 3 is of a groove structure or a composite structure, and the inside of the U-shaped heat pipe 3 is vacuum and filled with working medium.
Preferably, as shown in fig. 1, the U-shaped heat pipes 3 are provided with eight, two groups, four groups, and symmetrically arranged in this embodiment. The liquid suction core is one of copper braid belts, copper powder or metal foam; the wick is sintered to the surface of the channel structure. The working medium can be deionized water.
As shown in fig. 1 and 5, the present embodiment further includes two pagoda connectors 4; annular grooves 13 are formed in the water inlet 11 and the water outlet 12, and the two pagoda joints 4 are respectively arranged at the water inlet 11 and the water outlet 12 through the annular grooves 13.
Preferably, the two pagoda joints 4 are respectively arranged at the water inlet 11 and the water outlet 12 on the liquid cooling body 1 by brazing or integrally forming.
The present embodiment is further described below in conjunction with the working principle:
the substrate 2 is attached to the heat dissipation surface of the CPU, the heat on the CPU is absorbed by the evaporation section 31 of the U-shaped heat pipe 3, and the working medium is heated and evaporated to form a vapor working medium which flows to the condensation section 33, on one hand, the vapor working medium is condensed back to a liquid state, and flows back to the evaporation section 31 through the liquid absorption core with a groove structure or a composite structure to continue absorbing heat; on the other hand, the condensing section 33 discharges heat into the liquid cooling chamber. The refrigerant enters the flow passage of the liquid cooling cavity from the water inlet 11, heat is taken away in the flowing process, and the heat flows out from the water outlet 12 along with the refrigerant.
The invention is not limited to the above-described alternative embodiments, and any person who may derive other various forms of products in the light of the present invention, however, any changes in shape or structure thereof, all falling within the technical solutions defined in the scope of the claims of the present invention, fall within the scope of protection of the present invention.
Claims (10)
1. A heat pipe-based server indirect liquid-cooled radiator, comprising:
the liquid cooling body is provided with a water inlet and a water outlet; the liquid cooling body is internally provided with a liquid cooling cavity, a flow passage is arranged in the liquid cooling cavity, and two ends of the flow passage are respectively connected with the water inlet and the water outlet;
the two substrates are symmetrically arranged on two sides of the liquid cooling body, and the two substrates are attached to the CPU;
the two ends of each U-shaped heat pipe are respectively provided with an evaporation section and a condensation section, the evaporation sections are connected with the substrate, and the condensation sections are inserted into the liquid cooling cavity; the U-shaped heat pipes are symmetrically arranged.
2. The heat pipe-based server indirect liquid-cooled radiator of claim 1, wherein: the runner comprises an upper runner and a lower runner, and the upper runner is positioned above the lower runner; and ribs are arranged on the path of each flow passage.
3. A heat pipe based server indirect liquid cooled radiator according to claim 2, wherein: the upper runner is S-shaped formed by connecting a plurality of upper runner sections; the two ends of each upper runner section are provided with arc-shaped flow guiding structures, and each upper runner section is provided with a plurality of fins which are transversely and parallelly arranged.
4. A heat pipe based server indirect liquid cooled radiator according to claim 2, wherein: the lower runner is S-shaped formed by connecting a plurality of lower runner sections; the two ends of each lower runner section are provided with arc-shaped flow guiding structures, and each lower runner section is internally provided with a plurality of fins which are transversely and parallelly arranged.
5. A heat pipe based server indirect liquid cooled radiator according to claim 3 or 4, wherein: the thickness of each fin is 0.5-3 mm; the spacing between the ribs in each upper runner section and/or each lower runner section is 1-5 mm.
6. A heat pipe based server indirect liquid cooled radiator according to claim 2, wherein: the bottoms of the two substrates are respectively provided with a plurality of heat pipe grooves, and the openings of the heat pipe grooves face downwards; the evaporation section is arranged in the heat pipe groove.
7. The heat pipe-based server indirect liquid-cooled radiator of claim 6, wherein: a flat surface is arranged at the bottom of the evaporation section of the U-shaped heat pipe and is flush with the opening of the heat pipe groove; the condensing section of the U-shaped heat pipe is inserted between the upper runner and the lower runner.
8. The heat pipe-based server indirect liquid-cooled radiator of claim 1, wherein: a heat insulation section is arranged between the evaporation section and the condensation section; the liquid suction core on the inner wall of the U-shaped heat pipe is of a groove structure or a composite structure, and working medium is filled in the U-shaped heat pipe.
9. The heat pipe-based server indirect liquid-cooled radiator of claim 8, wherein: the working medium is deionized water.
10. The heat pipe-based server indirect liquid-cooled radiator of claim 1, wherein: the device also comprises two pagoda joints; the two pagoda joints are respectively arranged at the water inlet and the water outlet on the liquid cooling body in a brazing or integral forming mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310710258.XA CN116709739A (en) | 2023-06-14 | 2023-06-14 | Heat pipe-based indirect liquid cooling radiator for server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310710258.XA CN116709739A (en) | 2023-06-14 | 2023-06-14 | Heat pipe-based indirect liquid cooling radiator for server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116709739A true CN116709739A (en) | 2023-09-05 |
Family
ID=87825335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310710258.XA Pending CN116709739A (en) | 2023-06-14 | 2023-06-14 | Heat pipe-based indirect liquid cooling radiator for server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116709739A (en) |
-
2023
- 2023-06-14 CN CN202310710258.XA patent/CN116709739A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI525300B (en) | Composite heat sink assembly for power module | |
| US7106589B2 (en) | Heat sink, assembly, and method of making | |
| CN108362148B (en) | Combined cold plate | |
| CN108362144B (en) | Composite flat heat pipe | |
| US20220046827A1 (en) | Server | |
| CN216818326U (en) | High-power chip efficient heat dissipation cooling device | |
| CN215003107U (en) | Heat pipe radiator | |
| CN110595242A (en) | Phase change radiator | |
| CN215725361U (en) | High heat conduction type radiator | |
| CN211291134U (en) | Phase change radiator | |
| US20050135061A1 (en) | Heat sink, assembly, and method of making | |
| CN210014475U (en) | Radiator, air condensing units and air conditioner | |
| CN210014478U (en) | Radiator, air condensing units and air conditioner | |
| CN210014476U (en) | Radiator, air condensing units and air conditioner | |
| CN210014477U (en) | Radiator, air condensing units and air conditioner | |
| CN111315192A (en) | Liquid cooling type cold plate heat pipe heat exchange device | |
| CN111664733A (en) | Heat radiator combining micro-channel heat exchanger with heat pipe | |
| CN115857644A (en) | Cold plate type heat dissipation device for server | |
| CN116709739A (en) | Heat pipe-based indirect liquid cooling radiator for server | |
| CN103542748A (en) | Needle-rib-concave composited array structure of heat sink and arrangement method for needle-rib-concave composited array | |
| CN113347856B (en) | Heat radiator for electronic equipment | |
| CN214852491U (en) | Heat radiator for electronic equipment | |
| CN115551301A (en) | Heat dissipation system and electronic equipment | |
| US11924996B2 (en) | Liquid-cooling devices, and systems, to cool multi-chip modules | |
| CN211578734U (en) | Heat conducting device for electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |