CN116690399A - Bonding wire polishing coating integrated device - Google Patents
Bonding wire polishing coating integrated device Download PDFInfo
- Publication number
- CN116690399A CN116690399A CN202310980015.8A CN202310980015A CN116690399A CN 116690399 A CN116690399 A CN 116690399A CN 202310980015 A CN202310980015 A CN 202310980015A CN 116690399 A CN116690399 A CN 116690399A
- Authority
- CN
- China
- Prior art keywords
- pipe
- liquid
- coating
- guide blocks
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 64
- 239000011248 coating agent Substances 0.000 title claims abstract description 63
- 238000005498 polishing Methods 0.000 title claims abstract description 25
- 239000007788 liquid Substances 0.000 claims abstract description 114
- 238000004140 cleaning Methods 0.000 claims abstract description 64
- 238000003860 storage Methods 0.000 claims description 10
- 230000007704 transition Effects 0.000 claims description 6
- 239000002893 slag Substances 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 230000001050 lubricating effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
- 238000005457 optimization Methods 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 238000011010 flushing procedure Methods 0.000 description 3
- 239000012634 fragment Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
- B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
- B05C3/12—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating work of indefinite length
- B05C3/125—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating work of indefinite length the work being a web, band, strip or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to the technical field of bonding wire processing equipment, in particular to an integrated bonding wire polishing coating device which comprises a liquid inlet part and a liquid outlet part, wherein a cleaning pipe is rotationally connected between the liquid inlet part and the liquid outlet part, a coating pipe is connected between the liquid inlet part and the liquid outlet part, the coating pipe is vertically arranged in parallel with the cleaning pipe, a plurality of guide blocks are arranged in the cleaning pipe, guide holes are formed between the guide blocks and the inner wall of the cleaning pipe, coating liquid is injected into the cleaning pipe and the coating pipe through the liquid inlet part, bonding wires are polished through the guide blocks in the cleaning pipe, the coating liquid is used as lubricating liquid in the cleaning pipe, the polishing effect on the bonding wires is improved, chips generated by polishing can be washed, the coating liquid coats the surfaces of the bonding wires in the coating pipe, the surfaces of the bonding wires can be washed, the bonding wires are prevented from carrying chips, and the coating procedure of the bonding wires is completed.
Description
Technical Field
The invention relates to the technical field of bonding wire processing equipment, in particular to a bonding wire polishing coating integrated device.
Background
At present, integrated circuits and semiconductor components are increasingly used, and bonding wires of the integrated circuits and the semiconductor components are increasingly used, but the bonding wires in products of the prior art are generally expensive, and then the packaging density of the integrated circuits for the bonding wires is increased, so that the requirements for the bonding wires are also increased.
In order to ensure the high conductivity of the bonding wire, the outer part of the bonding wire needs to be polished, so that the outer wall of the bonding wire is kept smooth and free from burrs, and then the outer part of the bonding wire is coated with a coating to ensure the high conductivity of the bonding wire.
However, the conventional bonding wire treatment device is inconvenient to polish the outside of the bonding wire in a circumferential efficient manner, and polishing dead angles are easy to appear, so that burrs are reserved on the outside of the bonding wire, and the quality of a finished product of the bonding wire is affected. Therefore, the outer part of the bonding wire needs to be polished efficiently to remove burrs.
Like a key alloy wire raw materials burring device that chinese patent publication No. CN109773607a, including frame, last brush roll, lower brush roll and jet apparatus, through having designed two last brush rolls and two lower brush rolls at drive mechanism front end, under the drive of second motor, through the transmission of first driven gear and second driven gear, make last brush roll and lower brush roll carry out the homodromous rotation, carry out two-sided burring work simultaneously to the key alloy wire raw materials that pass through between them, changed the defect that prior art carried out the burring work by single brush roll, made its burring work efficiency improve.
However, in this application, the upper and lower sides of the bond wire are polished by the upper and lower brush rolls, and there is still a certain polishing dead angle for the left and right sides of the bond wire, resulting in a certain disadvantage in polishing effect.
The invention aims to solve the technical problems that: the bonding wire polishing coating integrated device is designed to polish the surface of the bonding wire with high efficiency, remove burrs on the surface of the bonding wire, coat the surface of the bonding wire with high efficiency, and guarantee the finished product performance of the bonding wire.
Disclosure of Invention
In order to solve the problems, the invention provides a bonding wire polishing coating integrated device.
The technical scheme adopted for solving the technical problems is as follows: the bonding wire polishing coating integrated device comprises a liquid inlet part and a liquid outlet part, wherein a cleaning pipe is rotationally connected between the liquid inlet part and the liquid outlet part, a coating pipe is connected between the liquid inlet part and the liquid outlet part, the coating pipe and the cleaning pipe are vertically and parallelly arranged, a plurality of guide blocks are arranged inside the cleaning pipe, and guide holes are formed between the guide blocks and the inner wall of the cleaning pipe;
a driving paddle is fixed on the upper part of the cleaning pipe, a fixed rod is connected between the driving paddle and the inner wall of the cleaning pipe, a wire moving channel is arranged in the axial direction of the driving paddle, and the wire moving channel and the cleaning pipe are coaxially arranged;
the guide blocks comprise a plurality of first guide blocks and a plurality of second guide blocks, the first guide blocks and the second guide blocks are oppositely arranged, the plurality of first guide blocks and the plurality of second guide blocks are arranged in a crossing manner, and an S-shaped channel is formed between the plurality of first guide blocks and the plurality of second guide blocks.
As optimization, the liquid inlet part comprises a liquid storage tank and a liquid inlet pipe, wherein the liquid inlet pipe is vertically arranged at the top of the liquid storage tank, and the top of the liquid inlet pipe is an opening.
As optimization, the liquid draining part comprises a liquid draining box, a liquid draining pipe is arranged at the upper part of the liquid draining box, a filter screen is arranged at the inner side of the liquid draining pipe, the bottom surface of the liquid draining box is obliquely arranged, and a slag discharging pipe is arranged at the bottom of the side elevation of the liquid draining box;
the inside of flowing back case is equipped with the leading wheel, and the leading wheel is located between Tu Cengguan and the wash pipe.
As optimization, the cleaning pipe is in sealing connection with the liquid inlet part and the liquid outlet part, the cleaning pipe and the liquid inlet pipe are arranged coaxially, the middle part of the coating pipe is connected with an outlet pipe, and the bottom surface of the outlet pipe is in smooth transition with the coating pipe.
As optimization, the middle part of the guide block is outwards protruded to be an arc surface, the guide block and the inner wall of the cleaning pipe are in smooth transition, the cross section of the maximum width of the guide block is crescent, and the maximum width of the guide block is larger than the radius of the cleaning pipe.
The bonding wire polishing coating integrated device has the beneficial effects that:
injecting coating liquid into the cleaning pipe and the coating pipe through the liquid inlet part, polishing the bonding wire through a plurality of guide blocks in the cleaning pipe, taking the coating liquid as lubricating liquid in the cleaning pipe, improving the polishing effect on the bonding wire, flushing fragments generated by polishing, coating the bonding wire surface through the coating liquid in the coating pipe, flushing the bonding alloy wire surface, preventing the bonding wire from carrying fragments, and finishing the coating process of the bonding wire;
the multiple guide blocks are arranged in a crossed and opposite mode, the driving paddles are arranged at the top of the cleaning tube, the coating liquid of the liquid inlet part enters the cleaning tube through the driving paddles, the driving paddles and the cleaning tube are driven to rotate under the action of liquid flow, the cleaning tube drives the multiple guide blocks to polish the surface of the bonding wire in a circumferential and omnibearing mode, and the polishing effect on the bonding wire is improved.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a schematic front view of the present invention.
FIG. 3 is a schematic view of the structure of FIG. 2, taken along line A-A, according to the present invention.
Fig. 4 is an enlarged schematic view of the portion a of fig. 3 according to the present invention.
FIG. 5 is a schematic view of the structure of the invention taken along line B-B of FIG. 3.
The device comprises a cleaning pipe 1, a cleaning pipe 2, a coating pipe 3, a liquid storage tank 4, a liquid inlet pipe 5, a liquid discharge tank 6, a liquid discharge pipe 7, a filter screen 8, a slag discharge pipe 9, a guide wheel 10, an outlet pipe 11, a driving paddle 12, a wire feeding channel 13, a first guide block 14, a second guide block 15 and a guide hole.
Detailed Description
As shown in FIG. 5, the bonding wire polishing coating integrated device comprises a liquid inlet part and a liquid outlet part, wherein a cleaning pipe 1 is rotationally connected between the liquid inlet part and the liquid outlet part, a coating pipe 2 is connected between the liquid inlet part and the liquid outlet part, the coating pipe 2 and the cleaning pipe 1 are vertically and parallelly arranged, a plurality of guide blocks are arranged in the cleaning pipe 1, and guide holes 15 are formed between the guide blocks and the inner wall of the cleaning pipe 1.
The bonding wire enters the cleaning tube 1 through the liquid inlet part, is discharged upwards from the coating tube 2 after passing through the liquid discharge part, is filled with coating liquid in the liquid inlet part, and is used for flushing scraps on the bonding wire and coating the surface of the bonding wire in the coating tube 2.
As shown in fig. 4, a driving paddle 11 is fixed on the upper portion of the cleaning tube 1, a fixing rod is connected between the driving paddle 11 and the inner wall of the cleaning tube 1, a wire moving channel 12 is arranged in the axial direction of the driving paddle 11, and the wire moving channel 12 and the cleaning tube 1 are coaxially arranged.
The driving paddle 11 can drive the cleaning pipe 1 to rotate under the liquid impact of the cleaning part, and when the cleaning pipe 1 rotates, the bonding wire moves in the plurality of guide holes 15 and can polish and polish the surface of the bonding wire with high efficiency.
As shown in fig. 3, the guide blocks include a plurality of first guide blocks 13 and a plurality of second guide blocks 14, the first guide blocks 13 are disposed opposite to the second guide blocks 14, the plurality of first guide blocks 13 are disposed intersecting the plurality of second guide blocks 14, and an S-shaped channel is formed between the plurality of first guide blocks 13 and the plurality of second guide blocks 14.
The quantity of guide blocks can be set up according to actual production demand, and a plurality of guide blocks also can be set up in the inner wall of cleaning tube 1 in proper order in the spiral, strengthen the polishing effect to the bonding silk.
As shown in fig. 5, the liquid inlet part comprises a liquid storage tank 3 and a liquid inlet pipe 4, the liquid inlet pipe 4 is vertically arranged at the top of the liquid storage tank 3, and the top of the liquid inlet pipe 4 is an opening.
The height of the liquid inlet pipe 4 is used for providing a certain pressure to the coating liquid and increasing the liquid pressure at the driving paddle 11.
As shown in fig. 3, the liquid draining part comprises a liquid draining box 5, a liquid draining pipe 6 is arranged at the upper part of the liquid draining box 5, a filter screen 7 is arranged at the inner side of the liquid draining pipe 6, the bottom surface of the liquid draining box 5 is obliquely arranged, and a slag discharging pipe 8 is arranged at the bottom of a side elevation of the liquid draining box 5;
the inside of the liquid discharge box 5 is provided with a guide wheel 9, and the guide wheel 9 is positioned between the coating pipe 2 and the cleaning pipe 1.
The drain pipe 6 level sets up, and the bottom surface slope of scum pipe 8 sets up, and the bottom surface of scum pipe 8 flushes with the bottom surface of flowing back case 5, and the outer end of scum pipe 8 is equipped with the sediment valve, is connected with the flowing back valve on the drain pipe 6, and detachable construction connection can be used to filter screen 7, and the aperture of filter screen 7 sets up according to actual production demand.
As shown in fig. 3, the cleaning tube 1 is in sealing connection with the liquid inlet portion and the liquid outlet portion, the cleaning tube 1 and the liquid inlet tube 4 are coaxially arranged, an outlet tube 10 is connected to the middle of the coating tube 2, and a smooth transition is formed between the bottom surface of the outlet tube 10 and the coating tube 2.
The bonding wire enters the cleaning tube 1 after passing through the liquid inlet tube 4 and the liquid storage tank 3, enters the coating tube 2 from bottom to top for coating after being guided by the guide wheel 9, and leaves the device after coating by the outlet tube 10.
As shown in fig. 4 and 5, the middle part of the guide block protrudes outwards to form an arc surface, the guide block and the inner wall of the cleaning pipe 1 are in smooth transition, the cross section of the maximum width of the guide block is crescent, and the maximum width of the guide block is larger than the radius of the cleaning pipe 1.
The bonding wire moves between the adjacent guide holes 15 in a Z shape, and meanwhile, the cleaning tube 1 drives the bonding wire to rotate so as to polish the bonding wire circumferentially.
Working principle:
when the device is specifically used, bonding wires sequentially pass through the liquid inlet pipe 4, the liquid storage tank 3, the wire feeding channel 12 and the cleaning pipe 1 from top to bottom, finally enter the liquid discharge tank 5, enter the coating pipe 2 after being guided by the guide wheel 9, and finally leave the device through the outlet pipe 10.
The coating liquid is added into the liquid storage tank 3 through the liquid inlet pipe 4, enters the cleaning pipe 1 through the top of the cleaning pipe 1, and impacts the driving paddle 11 by the coating liquid, so that the driving paddle 11 drives the cleaning pipe 1 to rotate;
when the cleaning tube 1 rotates, the guide block can jack up the bonding wire, so that the guide block continuously polishes the moving bonding wire, the guide block toggles the bonding wire to repeatedly move in the cleaning tube 1, the guide block contacts the bonding wire in the direction of Xiang Quan, and the polishing effect is guaranteed;
the coating liquid enters the cleaning tube 1 from top to bottom to wash surface scraps of the bonding wire, so that the scraps are prevented from adhering to the surface of the bonding wire, and meanwhile, the excessive friction force between the bonding wire and the guide block can be prevented;
after the bonding wires enter the liquid discharge tank 5, the bonding wires are soaked in the liquid discharge tank, so that the adhesion of scraps is further reduced;
the bonding wire enters the coating tube 2 after being guided by the guide wheel 9, coating liquid in the coating tube 2 flows from top to bottom, chips on the surface of the bonding wire are further washed, and meanwhile, the surface of the bonding wire is coated;
after coating is completed, it exits the device through outlet tube 10.
The coating liquid in the liquid discharge box 5 can be discharged through the liquid discharge pipe 6 after being filtered, so that the coating liquid is convenient to reuse;
and the scraps in the liquid discharge box 5 are discharged by the slag discharge pipe 8 after being precipitated.
The above embodiments are merely specific examples of the present invention, and the scope of the present invention includes, but is not limited to, the product forms and styles of the above embodiments, any suitable changes or modifications made by one of ordinary skill in the art, which are consistent with the claims of the present invention, shall fall within the scope of the present invention.
Claims (5)
1. The utility model provides a bonding silk polishing coating integrated device, includes feed liquor part and flowing back part, its characterized in that: the cleaning device is characterized in that a cleaning pipe (1) is rotationally connected between the liquid inlet part and the liquid outlet part, a coating pipe (2) is connected between the liquid inlet part and the liquid outlet part, the coating pipe (2) and the cleaning pipe (1) are vertically arranged in parallel, a plurality of guide blocks are arranged in the cleaning pipe (1), and guide holes (15) are formed between the guide blocks and the inner wall of the cleaning pipe (1);
a driving paddle (11) is fixed on the upper part of the cleaning pipe (1), a fixed rod is connected between the driving paddle (11) and the inner wall of the cleaning pipe (1), a wire feeding channel (12) is arranged in the axial direction of the driving paddle (11), and the wire feeding channel (12) and the cleaning pipe (1) are coaxially arranged;
the guide blocks comprise a plurality of first guide blocks (13) and a plurality of second guide blocks (14), the first guide blocks (13) and the second guide blocks (14) are oppositely arranged, the plurality of first guide blocks (13) and the plurality of second guide blocks (14) are arranged in a crossing mode, and an S-shaped channel is formed between the plurality of first guide blocks (13) and the plurality of second guide blocks (14).
2. A bonding wire polishing coating integrated device according to claim 1, wherein: the liquid inlet part comprises a liquid storage tank (3) and a liquid inlet pipe (4), the liquid inlet pipe (4) is vertically arranged at the top of the liquid storage tank (3), and the top of the liquid inlet pipe (4) is an opening.
3. A bonding wire polishing coating integrated device according to claim 1, wherein: the liquid draining part comprises a liquid draining box (5), a liquid draining pipe (6) is arranged at the upper part of the liquid draining box (5), a filter screen (7) is arranged at the inner side of the liquid draining pipe (6), the bottom surface of the liquid draining box (5) is obliquely arranged, and a slag discharging pipe (8) is arranged at the bottom of a side elevation of the liquid draining box (5);
the inside of flowing back case (5) is equipped with leading wheel (9), and leading wheel (9) are located between coating pipe (2) and cleaning tube (1).
4. A bonding wire polishing coating integrated device according to claim 2, wherein: the cleaning pipe (1) is in sealing connection with the liquid inlet part and the liquid outlet part, the cleaning pipe (1) and the liquid inlet pipe (4) are arranged coaxially, the middle part of the coating pipe (2) is connected with an outlet pipe (10), and smooth transition is realized between the bottom surface of the outlet pipe (10) and the coating pipe (2).
5. A bonding wire polishing coating integrated device according to claim 1, wherein: the middle part of guide block outwards protrudes and is the arc surface, smooth transition between guide block and the inner wall of wash pipe (1), and the cross section of guide block maximum width department is crescent, the maximum width of guide block is greater than the radius of wash pipe (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310980015.8A CN116690399B (en) | 2023-08-07 | 2023-08-07 | Bonding wire polishing coating integrated device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310980015.8A CN116690399B (en) | 2023-08-07 | 2023-08-07 | Bonding wire polishing coating integrated device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116690399A true CN116690399A (en) | 2023-09-05 |
| CN116690399B CN116690399B (en) | 2023-09-26 |
Family
ID=87841774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310980015.8A Active CN116690399B (en) | 2023-08-07 | 2023-08-07 | Bonding wire polishing coating integrated device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116690399B (en) |
Citations (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2433642A (en) * | 1945-04-24 | 1947-12-30 | Gen Electric | Wire coating die |
| JPS55140258A (en) * | 1979-04-19 | 1980-11-01 | Osada Michio | Device for working lead wire of electronic component |
| JPS6370548A (en) * | 1986-09-12 | 1988-03-30 | Mitsubishi Electric Corp | Lead frame for semiconductor device |
| JPH04214644A (en) * | 1990-12-12 | 1992-08-05 | Nec Kyushu Ltd | Wire bonding device |
| US5164010A (en) * | 1990-10-02 | 1992-11-17 | Seiko Epson Corporation | Solder coating method and apparatus for semiconductor devices |
| JPH05154757A (en) * | 1991-12-03 | 1993-06-22 | Kawasaki Steel Corp | Semiconductor package terminal polishing device |
| EP0683278A2 (en) * | 1994-05-16 | 1995-11-22 | Karl Wiedemann | Sewer cleaning vehicle |
| US6110823A (en) * | 1993-11-16 | 2000-08-29 | Formfactor, Inc. | Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method |
| TW423351U (en) * | 1999-12-20 | 2001-02-21 | He Jin Rung | Shelling grinding wheel for eliminating ferric oxide membrane and pollutants on iron wire, tube surface |
| CN1450269A (en) * | 2002-04-09 | 2003-10-22 | 考特克斯·特克斯罗恩有限公司及两合公司 | Washing fluid pump |
| US6659116B1 (en) * | 2000-06-26 | 2003-12-09 | Lam Research Corporation | System for wafer carrier in-process clean and rinse |
| KR20080019526A (en) * | 2006-08-28 | 2008-03-04 | 한미반도체 주식회사 | A controlling system of semiconductor package and a method thereof |
| US20100213619A1 (en) * | 2007-01-15 | 2010-08-26 | Nippon Steel Materials Co., Ltd. | Bonding structure of bonding wire and method for forming same |
| CN102121077A (en) * | 2011-01-21 | 2011-07-13 | 宁波康强电子股份有限公司 | Gold bonding wire and preparation method thereof |
| US20140319671A1 (en) * | 2013-04-26 | 2014-10-30 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device and grinding method of semiconductor device |
| JP2016215361A (en) * | 2015-05-15 | 2016-12-22 | 株式会社サカタ製作所 | Polishing device |
| US20190286010A1 (en) * | 2018-03-19 | 2019-09-19 | Fuji Xerox Co., Ltd. | Method of producing foil formed member, method of producing wiring substrate, and method of producing integrated circuit |
| CN210476537U (en) * | 2019-09-03 | 2020-05-08 | 江苏聚润硅谷新材料科技有限公司 | Burnishing device is used in production of gold bonding wire |
| CN211989429U (en) * | 2019-12-10 | 2020-11-24 | 泉州品创知识产权服务有限公司 | Paint splashing prevention mechanism for paint brushing box of steel pipe straightening machine |
| CN214418399U (en) * | 2021-01-21 | 2021-10-19 | 上海欣庆机械有限公司 | Carbon beam polishing production line |
| CN216911208U (en) * | 2022-03-21 | 2022-07-08 | 烟台一诺电子材料有限公司 | Bonding wire processing is with surperficial dirt cleaning device |
| CN217043789U (en) * | 2022-04-20 | 2022-07-26 | 烟台一诺电子材料有限公司 | Ultrasonic cleaning machine is used in bonding wire processing |
| CN114918814A (en) * | 2022-06-30 | 2022-08-19 | 江苏稳润光电有限公司 | Single deburring equipment for LED devices |
-
2023
- 2023-08-07 CN CN202310980015.8A patent/CN116690399B/en active Active
Patent Citations (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2433642A (en) * | 1945-04-24 | 1947-12-30 | Gen Electric | Wire coating die |
| JPS55140258A (en) * | 1979-04-19 | 1980-11-01 | Osada Michio | Device for working lead wire of electronic component |
| JPS6370548A (en) * | 1986-09-12 | 1988-03-30 | Mitsubishi Electric Corp | Lead frame for semiconductor device |
| US5164010A (en) * | 1990-10-02 | 1992-11-17 | Seiko Epson Corporation | Solder coating method and apparatus for semiconductor devices |
| JPH04214644A (en) * | 1990-12-12 | 1992-08-05 | Nec Kyushu Ltd | Wire bonding device |
| JPH05154757A (en) * | 1991-12-03 | 1993-06-22 | Kawasaki Steel Corp | Semiconductor package terminal polishing device |
| US6110823A (en) * | 1993-11-16 | 2000-08-29 | Formfactor, Inc. | Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method |
| EP0683278A2 (en) * | 1994-05-16 | 1995-11-22 | Karl Wiedemann | Sewer cleaning vehicle |
| TW423351U (en) * | 1999-12-20 | 2001-02-21 | He Jin Rung | Shelling grinding wheel for eliminating ferric oxide membrane and pollutants on iron wire, tube surface |
| US6659116B1 (en) * | 2000-06-26 | 2003-12-09 | Lam Research Corporation | System for wafer carrier in-process clean and rinse |
| CN1450269A (en) * | 2002-04-09 | 2003-10-22 | 考特克斯·特克斯罗恩有限公司及两合公司 | Washing fluid pump |
| KR20080019526A (en) * | 2006-08-28 | 2008-03-04 | 한미반도체 주식회사 | A controlling system of semiconductor package and a method thereof |
| US20100213619A1 (en) * | 2007-01-15 | 2010-08-26 | Nippon Steel Materials Co., Ltd. | Bonding structure of bonding wire and method for forming same |
| CN102121077A (en) * | 2011-01-21 | 2011-07-13 | 宁波康强电子股份有限公司 | Gold bonding wire and preparation method thereof |
| US20140319671A1 (en) * | 2013-04-26 | 2014-10-30 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device and grinding method of semiconductor device |
| JP2016215361A (en) * | 2015-05-15 | 2016-12-22 | 株式会社サカタ製作所 | Polishing device |
| US20190286010A1 (en) * | 2018-03-19 | 2019-09-19 | Fuji Xerox Co., Ltd. | Method of producing foil formed member, method of producing wiring substrate, and method of producing integrated circuit |
| CN210476537U (en) * | 2019-09-03 | 2020-05-08 | 江苏聚润硅谷新材料科技有限公司 | Burnishing device is used in production of gold bonding wire |
| CN211989429U (en) * | 2019-12-10 | 2020-11-24 | 泉州品创知识产权服务有限公司 | Paint splashing prevention mechanism for paint brushing box of steel pipe straightening machine |
| CN214418399U (en) * | 2021-01-21 | 2021-10-19 | 上海欣庆机械有限公司 | Carbon beam polishing production line |
| CN216911208U (en) * | 2022-03-21 | 2022-07-08 | 烟台一诺电子材料有限公司 | Bonding wire processing is with surperficial dirt cleaning device |
| CN217043789U (en) * | 2022-04-20 | 2022-07-26 | 烟台一诺电子材料有限公司 | Ultrasonic cleaning machine is used in bonding wire processing |
| CN114918814A (en) * | 2022-06-30 | 2022-08-19 | 江苏稳润光电有限公司 | Single deburring equipment for LED devices |
Non-Patent Citations (1)
| Title |
|---|
| 曹文辉: "单晶铜制备键合丝的性能研究", 硕士电子期刊出版 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116690399B (en) | 2023-09-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203677024U (en) | Dish washer and cleaning device thereof | |
| CN201372372Y (en) | Pulsator washing machine | |
| CN107824544A (en) | Supersonic wave cleaning machine | |
| CN109778469A (en) | A kind of water-saving type water washing cycles system | |
| CN116690399B (en) | Bonding wire polishing coating integrated device | |
| CN207413856U (en) | One planting sand washes five metalworking cleaning equipment of formula | |
| CN215881213U (en) | Automatic polishing equipment for surface treatment of complex curved surface contour part | |
| CN207872679U (en) | Supersonic wave cleaning machine | |
| CN107971287A (en) | A kind of thin-wall bush automatic cleaning equipment | |
| CN208695745U (en) | A kind of ginseng cleaning equipment | |
| CN210078925U (en) | Rotary recoil type inclined plate sedimentation device | |
| CN108816925A (en) | A kind of circulating water to flush device of the steel band with high-efficiency water-saving function | |
| CN208976351U (en) | A kind of building material template cleaning device | |
| CN106858655A (en) | Circulating cleaning equipment | |
| CN211452046U (en) | Rubber ball cleaning device | |
| CN208728171U (en) | A kind of circulating water to flush device of the steel band with high-efficiency water-saving function | |
| CN207823479U (en) | A kind of tempered glass production automatic rinser | |
| CN220637398U (en) | Sheet metal part rust removing device | |
| CN117600272A (en) | Metal wire surface cleaning device | |
| CN210308470U (en) | Silicon wafer cutting machine | |
| CN116651824B (en) | Bond alloy wire cleaning device | |
| CN220590860U (en) | Oxide skin cleaning machine | |
| CN214078092U (en) | Modified asphalt waterproofing membrane cooling device | |
| CN201592020U (en) | Cutting fluid filter device | |
| CN218283076U (en) | Lifting flushing system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |