JPS55140258A - Device for working lead wire of electronic component - Google Patents

Device for working lead wire of electronic component

Info

Publication number
JPS55140258A
JPS55140258A JP4857379A JP4857379A JPS55140258A JP S55140258 A JPS55140258 A JP S55140258A JP 4857379 A JP4857379 A JP 4857379A JP 4857379 A JP4857379 A JP 4857379A JP S55140258 A JPS55140258 A JP S55140258A
Authority
JP
Japan
Prior art keywords
lead wire
station
cutting blade
electronic component
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4857379A
Other languages
Japanese (ja)
Other versions
JPS6131628B2 (en
Inventor
Yotaro Onishi
Kazuo Bando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP4857379A priority Critical patent/JPS55140258A/en
Publication of JPS55140258A publication Critical patent/JPS55140258A/en
Publication of JPS6131628B2 publication Critical patent/JPS6131628B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/023—Feeding of components with bending or straightening of the terminal leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To automate the bending work of a lead wire by feeding an electronic component at predetermined interval via a feeding mechanism to a machining station for forming this device and elevationally moving an upper forming cutting blade and a lower forming cutting blade provided at the station. CONSTITUTION:There are provided a lower block having a lower forming cutting blade 1 and a lower work guide 2 and an upper block having an upper forming cutting blade 5 for bending the lead wire 3a of an electronic component 3 in cooperation with the lower blade 1 and an upper work guide 6 for fixing the componet 3 in a machining station B forming a lead wire machining device in cooperation with the lower guide 2 in the station B. The component 3 is supplied to the station B by the feeding means 4. When the component 3 is disposed at predetermined position, upward and downward moving means 7 and 9 are operated to elevationally move the blades 1 and 5 to bend the projected lead wire 3a. In this configuration the blades 1 and 5 are detachable and replaced in case of altering the specification.
JP4857379A 1979-04-19 1979-04-19 Device for working lead wire of electronic component Granted JPS55140258A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4857379A JPS55140258A (en) 1979-04-19 1979-04-19 Device for working lead wire of electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4857379A JPS55140258A (en) 1979-04-19 1979-04-19 Device for working lead wire of electronic component

Publications (2)

Publication Number Publication Date
JPS55140258A true JPS55140258A (en) 1980-11-01
JPS6131628B2 JPS6131628B2 (en) 1986-07-21

Family

ID=12807129

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4857379A Granted JPS55140258A (en) 1979-04-19 1979-04-19 Device for working lead wire of electronic component

Country Status (1)

Country Link
JP (1) JPS55140258A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5869951U (en) * 1981-11-02 1983-05-12 名商株式会社 Forming device for terminals in integrated circuit devices
JPH0228963A (en) * 1988-07-19 1990-01-31 Fujitsu Miyagi Electron:Kk Mold for cutting and shaping semiconductor
JPH0555425A (en) * 1991-08-28 1993-03-05 Mitsubishi Electric Corp Die set with rail, and apparatus and method for molding lead
JP2008098573A (en) * 2006-10-16 2008-04-24 Nippon Inter Electronics Corp Lead forming device of electronic component
CN116690399A (en) * 2023-08-07 2023-09-05 烟台一诺电子材料有限公司 Bonding wire polishing coating integrated device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5869951U (en) * 1981-11-02 1983-05-12 名商株式会社 Forming device for terminals in integrated circuit devices
JPH0228963A (en) * 1988-07-19 1990-01-31 Fujitsu Miyagi Electron:Kk Mold for cutting and shaping semiconductor
JPH0555425A (en) * 1991-08-28 1993-03-05 Mitsubishi Electric Corp Die set with rail, and apparatus and method for molding lead
JP2008098573A (en) * 2006-10-16 2008-04-24 Nippon Inter Electronics Corp Lead forming device of electronic component
CN116690399A (en) * 2023-08-07 2023-09-05 烟台一诺电子材料有限公司 Bonding wire polishing coating integrated device
CN116690399B (en) * 2023-08-07 2023-09-26 烟台一诺电子材料有限公司 Bonding wire polishing coating integrated device

Also Published As

Publication number Publication date
JPS6131628B2 (en) 1986-07-21

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