CN116581090A - Packaging structure and packaging method thereof - Google Patents

Packaging structure and packaging method thereof Download PDF

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Publication number
CN116581090A
CN116581090A CN202310569323.1A CN202310569323A CN116581090A CN 116581090 A CN116581090 A CN 116581090A CN 202310569323 A CN202310569323 A CN 202310569323A CN 116581090 A CN116581090 A CN 116581090A
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CN
China
Prior art keywords
cover plate
fixing
groove
plastic package
glue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310569323.1A
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Chinese (zh)
Inventor
衡文举
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stats Chippac Semiconductor Jiangyin Co Ltd
Original Assignee
Stats Chippac Semiconductor Jiangyin Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stats Chippac Semiconductor Jiangyin Co Ltd filed Critical Stats Chippac Semiconductor Jiangyin Co Ltd
Priority to CN202310569323.1A priority Critical patent/CN116581090A/en
Publication of CN116581090A publication Critical patent/CN116581090A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

The invention discloses a packaging structure and a packaging method. The packaging structure comprises a packaging substrate, a chip, a plastic package seat and a cover plate. Wherein, the packaging substrate is provided with an upper surface; the chip is arranged on the upper surface; the plastic package seat is arranged on the upper surface and surrounds the chip, and is provided with a cover plate fixing groove with an upward opening; the apron sets up in plastic envelope seat upside to have the apron body, from the fixed knot that the apron body stretched towards the plastic envelope seat direction, fixed knot constructs and is fixed in the apron fixed slot. According to the invention, the cover plate is mounted and fixed on the plastic package seat through the cooperation of the fixing structure and the cover plate, so that the mounting stability of the cover plate on the plastic package seat can be improved while the mounting and the fixing of the cover plate on the plastic package seat are conveniently realized, and the cover plate is more firmly fixed on the plastic package seat.

Description

Packaging structure and packaging method thereof
Technical Field
The invention relates to the technical field of chip packaging, in particular to a packaging structure and a packaging method thereof.
Background
The existing cavity packaging structure generally forms a plastic package seat on a packaging substrate through a plastic package process, so that the plastic package seat is arranged around a chip in a surrounding mode, and then a cover plate is covered above the plastic package seat, so that the chip is sealed in a chip sealing cavity formed among the cover plate, the plastic package seat and the packaging substrate.
The cover plate is usually fixed on the surface of the plastic package seat by using glue. However, because the surface of the plastic package seat formed by plastic package is generally higher in smoothness, when the cover plate is adhesively fixed on the surface of the plastic package seat, the binding force between the fixing glue and the cover plate is greater than that between the fixing glue and the plastic package seat, so that the shearing force of the cover plate is small, and the reliability of the whole package product is greatly reduced.
Disclosure of Invention
The invention aims to provide a packaging structure and a packaging method thereof, which are used for solving the defects in the prior art, and can be used for conveniently realizing the mounting and fixing of a cover plate on a plastic package seat and improving the mounting stability of the cover plate on the plastic package seat.
To achieve the above object, the present invention provides a package structure, including: a package substrate having an upper surface; the chip is arranged on the upper surface; the plastic package seat is arranged on the upper surface and surrounds the chip, and is provided with a cover plate fixing groove with an upward opening; the cover plate is arranged on the upper side of the plastic package seat and is provided with a cover plate body and a fixing structure protruding towards the plastic package seat from the cover plate body, and the fixing structure is fixed in the cover plate fixing groove.
Further, the fixing structure is provided with an elastic shrinkage part, and is elastically abutted with the inner side wall of the cover plate fixing groove through the elastic shrinkage part.
Further, the elastic shrinkage part comprises a plurality of elastic sheets arranged along the circumferential direction, and the elastic sheets are arched towards the direction deviating from the center of the elastic shrinkage part; a gap is formed between the adjacent elastic sheets.
Further, the fixing structure further comprises a fixing pin protruding from the cover plate body towards the direction of the plastic package seat, a plurality of elastic sheets are distributed around the fixing pin, and two ends of each elastic sheet are respectively and fixedly connected with the fixing pin.
Further, the packaging structure further comprises fixing glue filled in the cover plate fixing groove, and the fixing structure is adhered and fixed in the cover plate fixing groove through the fixing glue.
Further, the plastic package seat is also provided with a glue overflow groove which is arranged around the cover plate fixing groove, and the opening direction of the glue overflow groove is the same as that of the cover plate fixing groove.
Further, the fixing structure further comprises a buffer piece fixed on one side of the cover plate body, which faces the plastic package seat.
Further, the plastic package seat is provided with an avoidance groove which is matched with the buffer piece and is used for positioning the buffer piece, and the thickness of the buffer piece is not smaller than the depth of the avoidance groove; when the cover plate is covered, the buffer piece is clamped between the cover plate body and the bottom of the avoidance groove, and a gap is formed between the fixing structure and the bottom of the cover plate fixing groove.
Further, the cover plate fixing groove is concavely formed from the bottom of the avoidance groove, and the occupied area of the cover plate fixing groove on the bottom of the avoidance groove is smaller than the bottom area of the avoidance groove; the buffer piece is arranged around the fixing structure or fixedly arranged between the fixing structure and the cover plate body.
Further, the plastic package seat is further provided with a glue spraying groove with an upward opening, the glue spraying groove is in fluid communication with the avoiding groove, and when the cover plate is covered, the cover plate body covers the glue spraying groove and is fixed with the plastic package seat through fixing glue in the glue spraying groove.
Further, the plastic package seat is further provided with a glue spraying groove with an upward opening, the glue spraying groove is in fluid communication with the cover plate fixing groove, and when the cover plate is covered, the cover plate body covers the glue spraying groove and is fixed with the plastic package seat through fixing glue in the glue spraying groove.
Further, the cover plate fixing grooves are formed in a plurality, the glue spraying grooves are connected between two adjacent cover plate fixing grooves, and the glue spraying grooves and the cover plate fixing grooves integrally form an annular structure.
Further, the plastic package seat is further provided with a glue spraying groove with an upward opening and an annular shape, the glue spraying groove and the cover plate fixing groove are separately arranged, and when the cover plate is covered, the cover plate body covers the glue spraying groove and is fixed with the plastic package seat through fixing glue in the glue spraying groove.
In order to achieve the above object, the present invention further provides a packaging method of the packaging structure, which includes the following steps: providing a packaging substrate;
placing a chip on the upper surface of the packaging substrate, and electrically connecting the chip with the packaging substrate;
forming a plastic package seat around the chip on the upper surface of the packaging substrate, wherein a cover plate fixing groove with an upward opening is formed on the plastic package seat;
the method comprises the steps of providing a cover plate and arranging the cover plate on the upper side of the plastic package seat, wherein the cover plate is provided with a cover plate body and a fixing structure protruding towards the plastic package seat from the cover plate body, and after the cover plate is covered, the fixing structure is fixed in the cover plate fixing groove.
Further, before the fixing structure is fixed in the cover plate fixing groove, the method further comprises:
and fixing glue is arranged in the cover plate fixing groove.
Compared with the prior art, the invention realizes the installation and fixation of the cover plate on the plastic package seat in a mode that the fixing structure is fixedly matched with the cover plate fixing groove, on one hand, the requirement on the fixing environment of the cover plate is relatively low, and the smoothness of the surface of the plastic package seat can not influence the fixed connection mode; on the other hand, the cover plate is convenient to install, and the cover plate and the plastic package seat can be fixedly connected while the cover plate is covered; in addition, the fixing mode can also improve the installation stability of the cover plate on the plastic package seat, so that the cover plate is firmly fixed on the plastic package seat.
Drawings
Fig. 1 is a schematic structural view of a package structure according to a first embodiment of the present invention;
FIG. 2 is a schematic view of the package structure of FIG. 1 before the cover plate is mounted and fixed;
FIG. 3 is a bottom view of the cover plate of the package structure of FIG. 1;
FIG. 4 is a schematic view of a portion of a cover plate in the package structure of FIG. 1, mainly showing a structural arrangement of a fixing structure on the cover plate;
FIG. 5 is a front view of a cover plate of the package structure of FIG. 1;
FIG. 6 is an enlarged view of a portion of FIG. 2 at A;
FIG. 7 is a schematic view of the structure of the elastic contractions of the cover plate of the package structure in FIG. 1 before the cover plate is mounted and fixed;
FIG. 8 is a schematic view of the structure of the elastic contractions of the cover plate of the package structure of FIG. 1 after being mounted;
FIG. 9 is an enlarged schematic view of a part of the plastic package seat of the package structure in FIG. 1;
fig. 10 is a schematic structural view of a package structure according to a second embodiment of the present invention;
reference numerals illustrate:
1-a package substrate, 11-an upper surface, 12-a lower surface,
2-plastic package seat, 20-cavity, 21-cover plate fixing groove, 22-glue overflow groove, 23-avoiding groove, 24-glue spraying groove, 25-glue blocking part,
3-chip, 31-active surface, 4-cover plate, 41-cover plate body, 42-fixing structure, 421-elastic contraction part, 4211-elastic sheet, 4212-gap, 422-fixing pin, 423-buffer piece,
5-fixing glue and 6-connecting the chip.
Detailed Description
The following disclosure provides many different embodiments, or examples, for implementing different features of the disclosure. Specific components and examples of arrangements thereof are described below to illustrate the present disclosure. Of course, these embodiments are merely examples and are not intended to limit the scope of the present disclosure. Spatially relative terms, such as "upper," "lower," and the like, may be used for convenience in describing a relationship between one element or feature and another element or feature in the drawings. In addition to the orientations depicted in the drawings, these spatially relative terms are intended to encompass different orientations of the device in use or operation. The device may be turned to a different orientation (rotated 90 degrees or other orientations) and the spatially relative descriptors used herein interpreted accordingly.
As shown in fig. 1-9, the invention discloses a packaging structure, which comprises a packaging substrate, a plastic packaging seat, a chip and a cover plate; in the invention, the package substrate has an upper surface; the chip is arranged on the upper surface; the plastic package seat is arranged on the upper surface and surrounds the chip, and is provided with a cover plate fixing groove with an upward opening; the cover plate is arranged on the upper side of the plastic package seat and is provided with a cover plate body and a fixing structure protruding towards the plastic package seat from the cover plate body, and the fixing structure is fixed in the cover plate fixing groove.
According to the invention, through the arrangement, namely, the cover plate is fixedly arranged on the plastic package seat in a mode that the fixing structure is fixedly matched with the cover plate fixing groove, on one hand, the requirement on the fixing environment of the cover plate is relatively low, and the smoothness of the surface of the plastic package seat cannot influence the fixing connection mode; on the other hand, the cover plate is convenient to install, and the cover plate and the plastic package seat can be fixedly connected while the cover plate is covered; in addition, the fixing mode can also improve the installation stability of the cover plate on the plastic package seat, so that the cover plate is firmly fixed on the plastic package seat.
The above technical scheme of the present invention is further explained below with reference to specific embodiments.
Fig. 1 to 8 show a first embodiment of the present invention, wherein reference numerals of a package substrate, a plastic package base, a chip and a cover plate are respectively 1, 2, 3 and 4 as shown in fig. 1. The package substrate 1 may be a circuit board with wiring circuitry or a substrate formed of silicon (e.g., monocrystalline silicon), ceramic, glass, or any other suitable material and having an upper surface 11 and a lower surface 12 disposed opposite thereto.
The package substrate 1 is provided with a plurality of structures for forming electrical connection, such as a bonding pad, for electrical connection with other components. Wherein, in the thickness direction of the package substrate 1, the upper surface 11 is oppositely arranged on the upper side of the lower surface 12, and the bonding pad is at least arranged on the upper surface 11; the chip 3 is disposed on the upper surface of the package substrate 1 and is electrically connected to the package substrate 1.
Specifically, the chip 3 has an active surface 31 provided with bonding pads, the active surface 31 being disposed in a direction away from the package substrate 1, and conductive bonding pads being provided to realize electrical connection of the chip 3 with the outside. The conductive pads may be various materials having a conductive function. For example, the conductive material may be a metal conductive material such as aluminum, copper, silver, gold, nickel, titanium, palladium, tin, or a non-metal conductive material such as graphene.
In this embodiment, after the chip 3 is fixed on the upper surface of the package substrate 1 through the bonding layer, the conductive pads of the active surface 31 are electrically connected with the pads of the package substrate 1 through a lead structure, so as to further achieve fixation and electrical connection between the chip 3 and the package substrate 1. The bonding layer may be a glue layer arranged between the chip 3 and the package substrate 1.
In other embodiments, the active surface 31 of the chip 3 may face the package substrate 1, and the chip 3 may be further disposed on the package substrate 1 by flip-chip packaging.
Further, as shown in fig. 2, the plastic package 2 is also disposed on the upper surface 11 of the package substrate 1, and the plastic package 2 is disposed around the chip 3. In this embodiment, the inner side surfaces of the adjacent chips 3 of the plastic package base 2 are spaced from the chips 3, that is, a gap is formed between the plastic package base 2 and the chips 3. Of course, in other embodiments, the plastic package base 2 and the chip 3 may be disposed in close proximity, or the plastic package base 2 may also cover a portion of the chip 3, so that the plastic package base 2 is disposed around the center of the chip 3, and the plastic package base 2 covers the edge of the chip 3.
As shown in fig. 1 and fig. 2, for facilitating the cover setting and fixing of the cover plate 4, the plastic package base 2 is provided with a cover plate fixing groove 21 which is opened upwards, and the cover plate fixing groove 21 is opened in a direction away from the package substrate 1.
Specifically, the cover plate fixing groove 21 may be directly formed in the forming process of the plastic package base 2, or may be formed on the upper surface of the plastic package base 2 by etching or the like after the plastic package base 2 is formed.
As shown in fig. 1, the cover 4 is disposed on the upper side of the plastic package 2, and has a cover body 41 and a fixing structure 42 protruding from the cover body 41 toward the plastic package 2, and the fixing structure 42 is fixed in the cover fixing groove 21. The fixing structure 42 is opposite to the cover plate fixing groove 21 and protrudes into the cover plate fixing groove 21.
Since the plastic package base 2 is disposed around the chip 3, after the plastic package base 2 is disposed, a cavity disposed with an upward opening is formed between the plastic package base 2 and the package substrate 1, as shown in fig. 2, at least a portion of the chip 3 is exposed from the cavity. As shown in fig. 1, after the cover plate 4 is mounted and fixed on the upper side of the plastic package base 2, the cover plate body 41 covers the cavity, so that a chip sealing cavity 20 is formed among the cover plate 4, the plastic package base 2 and the package substrate 1, and the chip 3 is sealed in the chip sealing cavity 20.
In a specific embodiment, the chip 3 is a microwave radio frequency chip or a surface acoustic wave filter chip, and the functional area of the chip 3 cannot be contacted with other components during the operation of the chip 3 due to the performance requirement of the chip 3, so that a chip sealing cavity 20 is formed after the packaging is completed, and the functional area of the chip 3 is exposed to the chip sealing cavity 20. Meanwhile, the arranged cover plate body 41 covers the chip 3, plays a role in protecting the chip 3, and the cover plate 4 and the plastic package seat 2 jointly form the protection of the chip 3. The arrangement of the structure realizes that the chip 3 is effectively protected on the premise of not influencing the work of the chip 3.
The cover plate 4 is arranged on one side of the plastic package base 2, which is away from the package substrate 1, after the cover plate 4 is installed and fixed, the cover plate 4 is just positioned on the upper side of the chip 3, and the position of the cover plate 4 is opposite to that of the chip 3, so that the cover protection of the chip 3 is formed.
According to the invention, the cover plate 4 is mounted and fixed on the plastic package seat 2 through the cooperation of the fixing structure 42 and the cover plate fixing groove 21, so that on one hand, the requirement on the fixed environment is relatively low, and the smoothness of the surface of the plastic package seat 2 does not influence the fixed connection mode; on the other hand, the cover plate 4 is convenient to install, and the cover plate 4 and the plastic package seat 2 can be fixedly connected while the cover plate 4 is covered; in addition, the fixing mode can improve the installation stability of the cover plate 4 on the plastic package base 2, so that the cover plate 4 is firmly installed and fixed on the plastic package base 2.
As shown in fig. 4 and 5, the fixing structure 42 has an elastic contractions 421 in the present embodiment, and elastically abuts against the inner side walls of the cover fixing groove 21 by the elastic contractions 421.
The maximum outer diameter of the elastic shrinkage portion 421 before elastic deformation shrinkage is larger than the outer diameter of the cover plate fixing groove 21, and the maximum outer diameter of the elastic shrinkage portion 421 after elastic deformation is shrunk inwards under the action of external force, so that the elastic shrinkage portion 421 can penetrate into the cover plate fixing groove 21, and after penetrating into the cover plate fixing groove 21, the reset resilience force accumulated by the elastic shrinkage portion 421 elastic deformation drives the outer wall surface of the elastic shrinkage portion 421 to abut against the inner wall of the cover plate fixing groove 21, so that the elastic shrinkage portion 421 is installed and fixed in the cover plate fixing groove 21.
It will be appreciated that in other embodiments, the fixing structure 42 may be mounted and fixed in the cover fixing slot 21 by means of elastic snap, or the fixing structure 42 may be positioned on the plastic package base 2 by means of interference fit.
As shown in fig. 7, in the present embodiment, the elastic contractions 421 include a plurality of elastic sheets 4211 arranged along the circumferential direction, and the elastic sheets 4211 are arranged to arch in a direction away from the center of the elastic contractions 421; a gap 4212 is formed between adjacent elastic pieces 4211; a plurality of elastic sheets 4211 which are annularly arranged form a lantern-shaped frame.
In order to conveniently realize the arrangement of the elastic sheet 4211, the fixing structure 42 further includes a fixing pin 422 protruding from the cover plate body 41 toward the direction of the plastic package base 2, two ends of the elastic sheet 4211 are respectively fixedly connected with the fixing pin 422, and a plurality of elastic sheets 4211 are arranged along the direction surrounding the fixing pin 422 to form the elastic shrinkage portion 421. A fixing pin 422 is fixed to the cover body 41 and is used for fixedly supporting the elastic piece 4211, and the fixing pin 422 is extended along the opening direction of the cover fixing groove 21. Thus, on the one hand, effective fixation of the elastic sheet 4211 is achieved by the fixing pin 422, and also limitation and support can be provided for inward deformation of the elastic sheet 4211; on the other hand, the strength of the entire fixing structure 42 can also be improved.
As shown in fig. 1, in the present invention, in order to further improve the stability of the mounting and fixing of the cover plate 4 on the plastic package 2, the packaging structure further includes a fixing glue 5 filled in the cover plate fixing groove 21, and the fixing structure 42 is further adhered and fixed in the cover plate fixing groove 21 by the fixing glue 5.
The fixing glue 5 may be pre-filled in the cover plate fixing groove 21, and when the fixing structure 42 extends into the cover plate fixing groove 21, the fixing glue 5 may be finally solidified and formed at the contact position of the fixing glue and the cover plate fixing groove 21.
Compared with the prior art that the cover plate 4 is directly adhered to the surface of the plastic package base 2, the contact area between the plastic package base 2 and the cover plate 4 can be increased through the arrangement of the cover plate fixing groove 21 and the fixing structure 42, for example, the bonding area between the inner side wall surface of the cover plate fixing groove 21 and the outer surface of the fixing structure 42 is at least increased, not to mention that the glue containing space between the elastic sheets and the inside of the fixing structure is also provided, and then the connection stability between the cover plate 4 and the plastic package base 2 is enhanced.
It will be appreciated that in other embodiments, the fixing glue 5 may be provided between the fixing structure 42 and the inner walls of the cover fixing groove 21 for a more stable connection when the cover 4 is assembled to the plastic package base 2 by means of a snap or interference fit.
In this embodiment, the gap 4212 formed between two adjacent elastic sheets 4211 can be used as a space for flowing the fixing glue 5, and since the fixing glue 5 is preset in the cover fixing groove 21 before solidification forming, the space in the cover fixing groove 21 is occupied during the process of installing and fixing the elastic shrinkage portion 421 to the cover fixing groove 21, so that the fixing glue 5 preset in the cover fixing groove 21 overflows.
In order to avoid that the elastic contractions 421 form a complete cover for the cover fixing groove 21 and thus influence the up-and-down flow of the fixing glue 5. The gaps 4212 between the adjacent elastic sheets 4211 can be used as passages for the fixing glue 5 to flow up and down in the cover plate fixing groove 21, so that the fixing glue 5 can flow from the bottom of the cover plate fixing groove 21 towards the opening direction of the cover plate fixing groove 21 in the process of positioning the elastic shrinkage portion 421 towards the cover plate fixing groove 21, and the fixing glue 5 formed between the cover plate fixing groove 21 and the fixing structure 42 has larger size, so that the connection stability of the cover plate fixing groove 21 and the fixing structure 42 is enhanced.
In other embodiments, the elastic shrinkage portion 421 may be integrally made of rubber elastomer, and in order to facilitate the flow of the fixing glue 5 in the cover fixing groove 21, a flow space is further provided on the elastic shrinkage portion 421. The flowing space may specifically be a groove formed at the edge of the rubber elastic body, the groove is formed toward the opening of the inner side wall of the cover plate fixing groove 21, and the groove is formed along the opening direction of the cover plate fixing groove 21, so that the fixing glue 5 can flow along the flowing space from the bottom of the cover plate fixing groove 21 to the opening direction of the cover plate fixing groove 21. Of course, in other embodiments, the flow space may be a through hole penetrating the elastic contractions 421 in the vertical direction.
Further, as shown in fig. 6 and 9, the plastic package base 2 further has a glue overflow groove 22 surrounding the cover plate fixing groove 21, and the opening direction of the glue overflow groove 22 is the same as the opening direction of the cover plate fixing groove 21. The glue blocking part 25 is formed between the cover plate fixing groove 21 and the glue overflow groove 22, the cover plate fixing groove 21 and the glue overflow groove 22 are separated by the glue blocking part 25, and the fixing glue 5 is remained in the cover plate fixing groove 21 as much as possible, so as to ensure the fixing effect of the fixing structure 42.
In this embodiment, the cover fixing groove 21 and the glue overflow groove 22 are both opened upward, i.e., opened in a direction away from the package substrate 1. The glue overflow groove 22 surrounds the cover plate fixing groove 21, so that the glue overflow groove 22 can receive the fixing glue 5 overflowed from the cover plate fixing groove 21, and the fixing glue 5 in the cover plate fixing groove 21 is prevented from overflowing in the process of installing and fixing the cover plate 4.
As shown in fig. 9, the glue overflow groove 22 surrounds the cover plate fixing groove 21 to form a groove body with an annular structure, the cover plate fixing groove 21 is arranged at the geometric center position of the annular groove body formed by the glue overflow groove 22, and the glue 5 overflowed from the cover plate fixing groove 21 slowly flows to the glue overflow groove 22 from the geometric center position of the annular groove body, so that the glue overflow groove 22 can uniformly receive the glue 5 overflowed in the cover plate fixing groove 21, and the overflow condition of the glue 5 from the glue overflow groove 22 is avoided due to the fact that the glue 5 is concentrated at a certain position of the glue overflow groove 22 excessively.
As shown in fig. 7-9, the fixing structure 42 further includes a buffer member 423 fixed on the cover body 41 during actual use, where the buffer member 423 is disposed on a side of the cover body 41 facing the plastic package base 2.
The setting of bolster 423 can play the effect that suggestion elasticity constriction 421 is installed in place, and bolster 423 can be the elastic component, and bolster 423 is earlier with plastic envelope seat 2 completion contact to give the feedback after the contact, avoid because apron 4 receives excessive pressure, thereby cause elasticity constriction 421 and apron fixed slot 21 tank bottom to touch, reduce the influence that elasticity constriction 421 produced to plastic envelope seat 2, also can keep apron 4 holistic levelness to avoid apron 4 to produce the slope simultaneously.
Further, the plastic package base 2 has a recess 23 adapted to the buffer 423 and located on the buffer 423. It will be appreciated that the relief groove 23 is disposed to open upward, that is, in a direction away from the package substrate 1, and the opening direction of the relief groove 23 is oriented in the same direction as the opening direction of the cover plate fixing groove 21.
In order to better exert the feedback function after the positioning of the buffer member 423 is completed, the thickness of the buffer member 423 is not less than the depth of the escape groove 23. The thickness of the buffer piece 423 is slightly greater than the depth of the avoidance groove 23, so that excessive contact between the cover plate body 41 and the plastic package seat 2 is avoided, the cover plate 4 is damaged, and even if the thickness of the buffer piece 423 is set to be greater than the depth of the avoidance groove 23, the cover plate 41 and the plastic package seat 2 can be tightly attached due to the certain compressibility of the buffer piece 423.
As shown in fig. 8, when the cover plate 4 is covered, the buffer member 423 is clamped between the cover plate body 41 and the groove bottom of the avoiding groove 23, and a gap is provided between the fixing structure 42 and the groove bottom of the cover plate fixing groove 21. And finally solidifying the gap filled with the fixing glue 5 to form the fixing glue 5. The arrangement of such a structure can prevent the elastic contractions 421 from touching the bottom of the cover plate fixing groove 21, thereby affecting the mounting and fixing of the cover plate 4.
It will be appreciated that, in order to achieve more stable installation and fixation of the cover plate 4, a fixing adhesive 5 is also disposed between the inner wall of the avoidance groove 23 and the elastic contraction portion 421.
The avoiding groove 23 may be provided in parallel with the cover plate fixing groove 21 or may be provided coaxially; in this embodiment, in order to better set the cover plate 4, as shown in fig. 6 and 9, the cover plate fixing groove 21 is formed by recessing from the bottom of the avoiding groove 23; the occupied area of the cover plate fixing groove 21 to the groove bottom of the avoiding groove 23 is smaller than the area of the groove bottom of the avoiding groove 23; the opening of the escape groove 21 covers the opening of the escape groove 23.
Correspondingly, the buffer member 423 is disposed around the fixing structure 42, the fixing pin 422 penetrates through the buffer member 423 and is fixedly connected with the cover plate body 41, and a hole adapted to the fixing pin 422 is formed in the buffer member 423. Through this kind of setting, can all place same position department in relevant matching structure, make things convenient for the structure setting of apron 4.
In other embodiments, the buffer 423 may also be fixedly disposed between the fixing structure 42 and the cover body 41.
In this embodiment, the opening of the cover fixing groove 21 is disposed at the center of the bottom of the avoidance groove 23. It can be understood that the glue overflow groove 22 is also formed concave downward from the bottom of the avoiding groove 23.
Because the cover plate fixing groove 21 is exposed towards the avoiding groove 23, the avoiding groove 23 can also be used for receiving the fixing glue 5 overflowed from the cover plate fixing groove 21, and the overflowed fixing glue 5 can play a role in connecting and fixing the inner wall of the avoiding groove 23 and the outer wall of the buffer piece 423, so that the cover plate 4 is better fixed on the plastic package seat 2.
In the present invention, in order to more stably realize the connection and fixation of the cover plate 4 and the plastic package base 2, in this embodiment, the plastic package base 2 is further provided with an upward opening glue-pouring groove 24, and the glue-pouring groove 24 is in fluid communication with the avoiding groove 23. In this embodiment, since the cover plate fixing groove 21 is concavely formed from the bottom of the avoiding groove 23, the glue spraying groove 24 is communicated with the cover plate fixing groove 21 through the avoiding groove 23.
When the cover plate 4 is covered, the cover plate body 41 covers the glue spraying groove 24, and is fixed with the plastic package base 2 through the fixing glue in the glue spraying groove 24.
The avoidance grooves 23 are provided with a plurality of glue beating grooves 24, the glue beating grooves 24 are connected between two adjacent avoidance grooves 23, and the glue beating grooves 24 and the avoidance grooves 23 integrally form an annular structure.
In the embodiment of the invention, the cover plate 4 is rectangular, the fixing structures 42 are arranged at four corners of the cover plate 4, correspondingly, the number of the cover plate fixing grooves 21 is also four, the avoiding grooves 23 are also four, and the mounting and fixing of the cover plate 4 on the plastic package seat 2 can be better realized by fixing the four corners of the cover plate 4.
The glue spraying grooves 24 are communicated with two adjacent avoiding grooves 23, and the four avoiding grooves 23 are communicated through four glue spraying grooves 24, so that the glue spraying grooves 24 and the avoiding grooves 23 integrally form an annular structure.
In this embodiment, the glue dispensing slot 24 has an opening that is opened toward the cover plate body 41, the cover plate body 41 covers the glue dispensing slot 24, and a fixing glue 5 is disposed between the glue dispensing slot 24 and the cover plate body 41. The fixing glue filled in the glue applying groove 24 can be used for connecting and fixing with the cover plate body 41, thereby better realizing the installation and fixing of the cover plate 4.
In other embodiments, the glue slot 24 may be in fluid communication with the cover plate mounting slot 21 directly when no relief slot 23 is provided. When the cover plate 4 is covered, the cover plate body 41 covers the glue spraying groove 24, and is fixed with the plastic package base 2 through the fixing glue 5 in the glue spraying groove 24. In this embodiment, the cover plate fixing grooves 21 are provided in plurality, the glue beating grooves 24 are also provided in plurality, the adjacent cover plate fixing grooves 21 are communicated through the glue beating grooves 24, and the cover plate fixing grooves 21 and the glue beating grooves 24 form an annular structure integrally.
In the above embodiment, the glue dispensing groove 24 is communicated with the cover plate fixing groove 21, in another embodiment, the glue dispensing groove 24 and the cover plate fixing groove 21 may be separately disposed, and there is no fluid communication relationship between them, the glue dispensing groove 24 is an upward opening groove disposed on the plastic package base 2, and when the cover plate 4 is covered, the cover plate body 41 covers the glue dispensing groove 24, and is fixed with the plastic package base 2 through the fixing glue in the glue dispensing groove 24. The glue spraying groove 24 can increase the area of the connecting part between the cover plate 4 and the plastic package seat 2, so that the stability of fixed connection is enhanced. In this embodiment, the glue grooves 24 are arranged in a ring shape to seal the die seal cavity 20. The cover plate fixing groove 21 may be located inside or outside the annular glue spraying groove 24.
In other embodiments, as shown in fig. 10, the package structure further has a connection chip 6, the connection chip 6 is disposed between the chip 3 and the package substrate 1, the chip 3 is electrically connected to the connection chip 6, and the connection chip 6 is electrically connected to the package substrate 1. The connection chip 6 is disposed on the upper surface of the package base 1, and the chip 3 is disposed on the upper surface of the connection chip 6. Due to the arrangement of the connection chip 6, part of the plastic package base 2 can also cover part of the connection chip 6 in the process of forming the plastic package base 2, and a gap is formed between the plastic package base 2 and the chip 3 at intervals. The plastic package 2 needs to avoid the chip 3 so as not to affect the normal use of the chip 3.
The invention also discloses a packaging method of the packaging structure, which comprises the following steps:
providing a package substrate 1;
placing the chip 3 on the upper surface of the package substrate 1, attaching the chip 3 on the upper surface of the package substrate 1 in this embodiment, and electrically connecting the chip 3 with the package substrate 1; the chip 3 may be electrically connected to the package substrate 1 through leads;
forming a plastic package seat 2 around the periphery of the chip on the upper surface of the package substrate 1, wherein a plurality of cover plate fixing grooves 21 with upward openings are formed in a target area of the plastic package seat 2;
the cover plate 4 is provided, and the cover plate 4 is arranged on the upper side of the plastic package seat 2, wherein the cover plate 4 is provided with a cover plate body 41 and a fixing structure 42 protruding from the cover plate body 41 towards the direction of the plastic package seat 2, and after the cover plate is covered, the fixing structure 42 is protruding and fixed in the cover plate fixing groove 21.
Further, before fixing the fixing structure 42 in the cover plate fixing groove 21, it further includes: the cover plate fixing groove 21 is internally provided with a fixing adhesive 5. After the cover plate 4 is attached to the plastic package 2, the fixing glue 5 is connected between the fixing structure 42 and the inner walls of the cover plate fixing groove 21, thereby reinforcing the mounting and fixing of the cover plate 4 on the plastic package 2.
Further, before the cover plate 4 is covered to the plastic package base 2, the plastic package base further comprises a fixing glue 5 arranged in the glue spraying groove 24, and after the cover plate 4 is covered to the plastic package base, the fixing glue 5 is connected between the cover plate 4 and each inner wall of the glue spraying groove 24, so that the installation and fixation of the cover plate 4 on the plastic package base 2 are reinforced.
While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims (15)

1. A package structure, comprising:
a package substrate having an upper surface;
the chip is arranged on the upper surface;
the plastic package seat is arranged on the upper surface and surrounds the chip, and is provided with a cover plate fixing groove with an upward opening;
the cover plate is arranged on the upper side of the plastic package seat and is provided with a cover plate body and a fixing structure protruding towards the plastic package seat from the cover plate body, and the fixing structure is fixed in the cover plate fixing groove.
2. The package structure of claim 1, wherein the fixing structure has an elastic shrinkage portion and elastically abuts against an inner sidewall of the cover fixing groove through the elastic shrinkage portion.
3. The package structure of claim 2, wherein: the elastic contraction part comprises a plurality of elastic sheets arranged along the circumferential direction, and the elastic sheets are arched towards the direction deviating from the center of the elastic contraction part; a gap is formed between the adjacent elastic sheets.
4. A package structure according to claim 3, wherein: the fixing structure further comprises fixing pins protruding from the cover plate body towards the direction of the plastic package seat, a plurality of elastic sheets are arranged around the fixing pins, and two ends of each elastic sheet are fixedly connected with the fixing pins respectively.
5. The package structure according to any one of claims 1 to 4, wherein: the packaging structure further comprises fixing glue filled in the cover plate fixing groove, and the fixing structure is adhered and fixed in the cover plate fixing groove through the fixing glue.
6. The package structure of claim 5, wherein: the plastic package seat is also provided with a glue overflow groove which is arranged around the cover plate fixing groove, and the opening direction of the glue overflow groove is the same as that of the cover plate fixing groove.
7. The package structure of claim 1, wherein: the fixing structure further comprises a buffer piece fixed on one side, facing the plastic package seat, of the cover plate body.
8. The package structure of claim 7, wherein: the plastic package seat is provided with an avoidance groove which is matched with the buffer piece and used for positioning the buffer piece, and the thickness of the buffer piece is not smaller than the depth of the avoidance groove;
when the cover plate is covered, the buffer piece is clamped between the cover plate body and the bottom of the avoidance groove, and a gap is formed between the fixing structure and the bottom of the cover plate fixing groove.
9. The package structure of claim 8, wherein: the cover plate fixing groove is concavely formed from the bottom of the avoidance groove, and the occupied area of the cover plate fixing groove on the bottom of the avoidance groove is smaller than the bottom area of the avoidance groove; the buffer piece is arranged around the fixing structure or fixedly arranged between the fixing structure and the cover plate body.
10. The package structure of claim 9, wherein: the plastic package base is further provided with a glue spraying groove with an upward opening, the glue spraying groove is in fluid communication with the avoidance groove and is in fluid communication with the cover plate fixing groove through the avoidance groove, and when the cover plate is covered, the cover plate body covers the glue spraying groove and is fixed with the plastic package base through fixing glue in the glue spraying groove.
11. The package structure of claim 1, wherein: the plastic package seat is also provided with a glue spraying groove with an upward opening, the glue spraying groove is in fluid communication with the cover plate fixing groove, and when the cover plate is covered, the cover plate body covers the glue spraying groove and is fixed with the plastic package seat through fixing glue in the glue spraying groove.
12. The package structure according to claim 10 or 11, wherein: the cover plate fixing grooves are formed in a plurality, the glue spraying grooves are connected between two adjacent cover plate fixing grooves, and the glue spraying grooves and the cover plate fixing grooves integrally form an annular structure.
13. The package structure of claim 1, wherein: the plastic package base is also provided with a glue spraying groove with an upward opening and an annular shape, the glue spraying groove and the cover plate fixing groove are separately arranged, and when the cover plate is covered, the cover plate body covers the glue spraying groove and is fixed with the plastic package base through fixing glue in the glue spraying groove.
14. A packaging method of the packaging structure according to any one of claims 1 to 13, characterized in that: the method comprises the following steps:
providing a packaging substrate;
placing a chip on the upper surface of the packaging substrate, and electrically connecting the chip with the packaging substrate;
forming a plastic package seat around the chip on the upper surface of the packaging substrate, wherein the plastic package seat is provided with a cover plate fixing groove with an upward opening;
the method comprises the steps of providing a cover plate and arranging the cover plate on the upper side of the plastic package seat, wherein the cover plate is provided with a cover plate body and a fixing structure protruding towards the plastic package seat from the cover plate body, and after the cover plate is covered, the fixing structure is fixed in the cover plate fixing groove.
15. The method of packaging a package structure of claim 14, wherein: the method further comprises the step of before fixing the fixing structure in the cover plate fixing groove:
and fixing glue is arranged in the cover plate fixing groove.
CN202310569323.1A 2023-05-18 2023-05-18 Packaging structure and packaging method thereof Pending CN116581090A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310569323.1A CN116581090A (en) 2023-05-18 2023-05-18 Packaging structure and packaging method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310569323.1A CN116581090A (en) 2023-05-18 2023-05-18 Packaging structure and packaging method thereof

Publications (1)

Publication Number Publication Date
CN116581090A true CN116581090A (en) 2023-08-11

Family

ID=87543821

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310569323.1A Pending CN116581090A (en) 2023-05-18 2023-05-18 Packaging structure and packaging method thereof

Country Status (1)

Country Link
CN (1) CN116581090A (en)

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