JP3161706B2 - Packaging semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a mounted semiconductor device, and more particularly, to a mounted semiconductor device joined by flip bonding.

[0002]

2. Description of the Related Art A semiconductor chip is mounted on a mounting board and shipped, and the mounting board is further surface-mounted on a printed wiring board. As shown in FIGS.
01 on the mounting board 102, the stiffener 103 forming the case, the stiffener 103 and the mounting board 102
A cap 104 for sealing the semiconductor chip 101 is used in the inner space formed by the above.

An epoxy resin 105 is filled between the cap 104 and the stiffener 103, the cap 104 and the stiffener 103 are fixed, and the semiconductor chip is formed in a package formed by the cap 104, the stiffener 103, and the mounting board 102. Sealed. At the time of this sealing,
The cap 104 must not exert pressure on the semiconductor chip 101 to break the semiconductor chip 101,
In addition, it is important that the cap 104 and the stiffener 103 are firmly fixed to each other and have a necessary rigidity. Further, it is preferable to prevent the epoxy resin 105 from protruding from the entire package and making it unsightly, and to prevent the external dimensions from being clearly determined.

[0004] A flip-bonding chip that ensures the toughness of the fixation and avoids destruction of the semiconductor chip is known from Japanese Patent Application Laid-Open No. H10-65071. This known device can control the pressure acting on the tip by controlling the distance between the case and the cap.

[0005] In addition to enabling such pressure control, the separation distance between the stiffener and the cap, which is a case, is kept constant, and the cap is securely and flatly maintained with respect to the stiffener to be strong. It is desired to perform resin sealing by fixing, and further, to prevent resin from protruding from the package.

[0006]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a mounted semiconductor device which can maintain a constant distance between a stiffener and a cap while controlling pressure on a semiconductor chip. Another object of the present invention is to maintain a constant distance between the stiffener and the cap while controlling the pressure on the semiconductor chip, and furthermore, securely and flatly maintain the cap with respect to the stiffener and toughly. It is an object of the present invention to provide a mounted semiconductor device that can be fixed to perform resin sealing. Still another object of the present invention is to maintain a constant distance between the stiffener and the cap while controlling the pressure on the semiconductor chip, and furthermore, to maintain the cap securely and flat with respect to the stiffener and toughness. Another object of the present invention is to provide a mounted semiconductor device which can be fixed to a semiconductor device and can be sealed with a resin, and can further prevent the resin from protruding from a package.

[0007]

Means for solving the problem are described as follows. The technical matters corresponding to the claims in the expression are appended with numbers, symbols, etc. in parentheses (). The number, the symbol, etc. are at least one of the technical items corresponding to the claims and the plurality / forms of implementation.
Although the agreement and correspondence with the technical matters of the two forms are clarified, it is not intended to show that the technical matters corresponding to the claims are limited to the technical matters of the embodiment.

[0008] A mounting semiconductor device according to the present invention comprises a mounting substrate (3), a semiconductor chip (6), and a stiffener (5) fixed to the mounting substrate (3) for sealing the semiconductor chip (6) inside. And a cap (2) fixed to the stiffener (5) and separated from the mounting substrate (3) by the stiffener (5) and surrounded by the mounting substrate (3) to seal the semiconductor chip (6). Nari, stiffener (5)
Opposing surface (13) opposing surface (12) of cap (2)
And the opposing surface (13) has a peripheral surface (14) extending outward from the periphery of the cap (2), and further, between the surface (12) of the cap (2) and the opposing surface (13). And a spacer (15) for defining an interval therebetween, between which the sealing resin (16) is provided with a peripheral surface (14).
Is filled.

The sealing resin filled over the peripheral surface (14) controls the tension relationship between the cap (2) and the package including the stiffener (5) by its surface tension, and is applied to the semiconductor chip. Avoids the application of shocking pressure. Furthermore, the fixation between the cap and the package (5) is made tough and elastic. Further, the sealing resin is effectively prevented from protruding from the package. The spacer (15) keeps the gap between the cap and the package component uniform and flat under such pressure control.

It is particularly important that the separator (15) is embedded in a sealing resin. Resin for sealing (16)
Has a smooth outer surface (18) and an outer surface (1).
8) is connected to the opposing surface (13) and the peripheral surface (17) of the cap, so that the control effect described above is obtained.

It is desirable that the outer surface (18) is smoothly connected to the facing surface (13) and the peripheral surface (17).
The semiconductor chip (6) is supported by the underfill with respect to the mounting substrate (3), and the semiconductor chip (6) is supported by the paste (11) with respect to the cap (2). The present invention is particularly effective when such a mounting semiconductor is a flip chip.

It is desirable that the plurality of spacers (15) are arranged at a distance from each other as a plurality of members. The separator (15) must be arranged as a singular body, and the separator (15) needs to be provided with a gap for connecting a space inside and outside the separator (15). It is effective that the semiconductor chip (6) is electrically connected to the mounting substrate (3) by flip bonding.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Corresponding to the drawings, an embodiment of a mounted semiconductor device according to the present invention is provided with a package. As shown in FIG. 1, the package 1
A cap 2 is provided. As shown in FIG. 2, the package 1 further includes a mounting substrate 3 and a stiffener 5 fixed to the upper surface of the mounting substrate 3 and surrounding the inner space 4.
And

The semiconductor chip 6 is mounted in the inner space 4 surrounded by the package 1, the stiffener 5, and the cap 2. The semiconductor chip 6 is supported by an underfill 7 with respect to the mounting substrate 3. Semiconductor chip 6
On the lower surface of the substrate, a projection / hemispherical chip-side connection terminal 8 is formed. On the upper surface side of the mounting substrate 3, a projection / hemispherical substrate side connection terminal 9 is formed. After assembly and mounting,
The chip-side connection terminals 8 can be reliably electrically connected to the board-side connection terminals 9. The semiconductor chip 6 is supported by the silver paste 11 on the cap 2.

The cap is fixed to the stiffener 5, is separated from the mounting substrate 3 by the stiffener 5, surrounds the cap with the mounting substrate 3, and seals the semiconductor chip 6. The upper surface of the stiffener 6 has a facing surface 13 facing the back surface 12 of the cap 2. The facing surface 13 has a peripheral surface 14 extending outward from the periphery of the cap 2. When the back surface 12 of the cap 2 is orthogonally projected on the facing surface 13,
This is the part of the opposing surface located outside the projected projection plane.

A plurality of spacers (spacers) 15 are provided between the back surface of the cap 2 and the opposing surface 13 which is the upper surface of the stiffener 5. All of the plurality / separators 15 have the same shape. The plural / separator 15 defines an interval between the stiffener 5 and the cap 2. The interval is uniformly constant. For this reason, the cap 2 is flat with respect to the stiffener 5.

A sealing resin 16 is filled between the cap 2 and the stiffener 5. The sealing resin 16 extends to the peripheral surface 14. At the time of this resin sealing, the cap 2
Is pressed against the stiffener 5 with an appropriate and finely controlled pressure. The pressure can be the weight of the cap 2.

When such a pressure acts, the sealing resin 16 which is a fluid before solidification, as shown in FIG.
It protrudes from between the cap 2 and the stiffener 5 and flows to the peripheral surface 14. The spacer 15 is made of a sealing resin 16.
Embedded in Further, the sealing resin 16 is drawn by the peripheral surface 17 of the cap 2 and flows and rises up the peripheral surface 17. The sealing resin 16 that has flowed in this way repels the cap 2 and the stiffener 5 due to surface tension and reaction, and has an outer surface 18 that is formed smoothly by itself.

The outer surface 18 of the sealing resin 16 is smoothly connected to the peripheral surface 14 and the peripheral surface 17. The connection points are naturally rounded microscopically due to the surface tension and viscous forces of the outer surface 18, but the connection is substantially smooth. The surface tension of the outer surface 18 finely controls the pressure relationship between the cap 2 and the stiffener 5. By this automatic control, the pressure of the semiconductor chip 6 on the mounting substrate 3 is not shocking. Under such control, the gap between the cap 2 and the stiffener 5 is set to a distance 15
Are defined substantially uniformly by

FIG. 4 shows a spacer 15 formed in a single form.
Is shown. The separating body 15 is formed of a plurality of main bodies 21 and a connecting portion 22 that integrally connects the plurality of main bodies 21. The spacer 15 is formed in a rectangular shape as a whole. Since the connecting portion 22 is formed thin, the sealing resin 16 can flow between the adjacent main body portions 21. FIG. 5 shows a further embodiment of the separator 15. The spacer 15 is formed as a rectangular body, and has many large holes 23 for flowing the sealing resin 16.

The spacer is fixed to the cap 2 and the stiffener 5 integrally with the sealing resin 16 when the sealing resin 16 is solidified. The outer surface 18 is, as already mentioned,
Elastically fix the cap 2 and the stiffener 5 and
Can be tough. When the spacer 15 is fixed, the opposing surfaces of the cap 2 and the stiffener 5 are formed flat and uniformly, and the separation interval is also formed uniformly.

[0022]

According to the mounted semiconductor device of the present invention, the fixation of the cap and the package component can be made elastic and tough, and the breakage of the semiconductor chip can be effectively avoided. At the same time, two birds with one stone to prevent resin leakage,
There is an effect of three birds.

[Brief description of the drawings]

FIG. 1 is a projection view showing an embodiment of a mounted semiconductor device according to the present invention.

FIG. 2 is a front sectional view of FIG. 1;

FIG. 3 is a front sectional view showing a physical action of a fluid.

FIG. 4 is an axial projection view showing another embodiment of the separator.

FIG. 5 is an axial projection view showing still another embodiment of the separator.

FIG. 6 is an axial projection view showing a known device.

FIG. 7 is a front view of FIG. 6;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Package 2 ... Cap 3 ... Mounting board 4 ... Inner space 5 ... Stiffener 6 ... Semiconductor chip 11 ... Paste 12 ... Cap surface 13 ... Opposite surface 14 ... Peripheral surface 15 ... Separator 16 ... Sealing resin 17 ... Cap 18 of the outer surface

Claims (8)

(57) [Claims] A mounting board; a semiconductor chip; a stiffener fixed to the mounting board for sealing the semiconductor chip inside; a mounting board fixed to the stiffener and separated from the mounting board by the stiffener. And a cap for sealing the semiconductor chip surrounded by the stiffener, wherein the stiffener has a facing surface facing the surface of the cap, and the facing surface extends outside the periphery of the cap. And a spacer interposed between the surface of the cap and the opposing surface to define an interval between the caps, and a sealing resin interposed between the cap and the peripheral surface. Mounted semiconductor devices that are filled throughout. 2. The mounting semiconductor device according to claim 1, wherein the spacer is embedded in the sealing resin. 3. The mounting according to claim 2, wherein the sealing resin has a smooth outer surface, and the outer surface is connected to the facing surface and a peripheral surface of the cap. Semiconductor device. 4. The mounted semiconductor device according to claim 3, wherein the outer surface is smoothly connected to the facing surface and the peripheral surface. 5. The mounting semiconductor device according to claim 1, wherein the semiconductor chip is supported on the mounting substrate by underfill, and the semiconductor chip is supported on the cap by a paste. apparatus. 6. The mounting semiconductor device according to claim 1, wherein the plurality of spaced members are arranged at intervals from each other as a plurality of members. 7. The separator according to claim 1, wherein the spacer is arranged as a singular body, and the spacer is provided with a gap for connecting a space inside and outside the separator. A mounted semiconductor device characterized by the above-mentioned. 8. The mounting semiconductor device according to claim 1, wherein the semiconductor chip is electrically connected to the mounting substrate by flip bonding.