CN116575008B - Vacuum coating carrier plate for solar cell - Google Patents
Vacuum coating carrier plate for solar cell Download PDFInfo
- Publication number
- CN116575008B CN116575008B CN202310847948.XA CN202310847948A CN116575008B CN 116575008 B CN116575008 B CN 116575008B CN 202310847948 A CN202310847948 A CN 202310847948A CN 116575008 B CN116575008 B CN 116575008B
- Authority
- CN
- China
- Prior art keywords
- carrier plate
- panel
- connecting part
- step surface
- solar cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001771 vacuum deposition Methods 0.000 title claims abstract description 13
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 33
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims description 7
- 239000007770 graphite material Substances 0.000 claims description 6
- 238000005253 cladding Methods 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 abstract description 16
- 239000010703 silicon Substances 0.000 abstract description 16
- 230000000694 effects Effects 0.000 abstract description 9
- 235000012431 wafers Nutrition 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009192 sprinting Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to the technical field of carrier plates, in particular to a vacuum coating carrier plate of a solar cell, which comprises a carrier plate body, wherein the carrier plate body comprises a panel, carrier plate guide bars oppositely arranged on two sides of the panel, reinforcing ribs oppositely arranged on the other two sides of the panel and a plurality of bearing areas which are arranged on the panel and are suitable for placing silicon chips, the bearing areas comprise first step surfaces fixedly arranged on the panel, the first step surfaces extend towards the center of the bearing areas, and a plurality of clamping points are arranged on the first step surfaces at intervals. The reinforcing rib can change positions according to the use scene of the carrier plate body so as to solve the problem of the edge effect of the reinforcing rib; the carrier plate guide bars can guide the carrier plate body to circularly move; the clamping point can ensure that the silicon wafer cannot collapse due to high-temperature deformation, and the carrier plate body and the panel for carrying the silicon wafer adopt a discontinuous design, so that the carrying stability is ensured, and the uncoated area is reduced.
Description
Technical Field
The invention relates to the technical field of carrier plates, in particular to a vacuum coating carrier plate for a solar cell.
Background
Vacuum plating of photovoltaic thin films is one of the necessary process steps for solar cell fabrication. The industrial process of Chinese solar energy has been put into the 25% of conversion efficiency, and the chain type vacuum coating technology in the process of the next step of sprinting the conversion efficiency to 26% is the pillar technology. From the technical mass productivity aspect, the carrier board manufacturing needs to solve two contradictory points: 1. the contradiction between the technological effect and the stability of the carrier plate, wherein the carrier plate is a necessary carrier for the silicon wafer, but in a technological system, the carrier plate is an additional variable influencing the technological effect, and the thicker the carrier plate structure is, the better the carrying stability and the thermal deformation resistance are (the temperature of the vacuum coating technology is usually higher than 200 ℃), but the carrying structure of the carrier plate can certainly influence the uniform coating on the surface of the silicon wafer; 2. the contradiction between productivity and stability of the carrier plate, the larger the carrier plate is, the higher the productivity per unit time of the machine is, and the increase of the area of the carrier plate also puts higher demands on the weight, the thermal deformation amount, the strength and the rigidity of the carrier plate. In the prior art, for example, patent numbers: CN 209873097U is a silicon wafer carrier and carrier for a flat plate type film plating system, wherein in order to solve the contradiction between the process effect and the stability of the carrier, the carrier surface of the silicon wafer is modified to be in line contact. The technological effect of this system is emphasized in industrial applications, and inclined line contact in high temperature environments necessarily results in carrier cards. Meanwhile, the line contact concept is only suitable for upper coating and is not suitable for a lower coating structure. The inclined surface can aggravate the edge effect around the silicon wafer in the lower coating.
Disclosure of Invention
The invention aims to solve the technical problems that: in order to overcome the technical problems in the prior art, the invention provides a vacuum coating carrier plate for a solar cell, which comprises a carrier plate body, wherein the carrier plate body comprises a panel, carrier plate guide bars oppositely arranged on two sides of the panel, reinforcing ribs oppositely arranged on the other two sides of the panel and a plurality of bearing areas which are arranged on the panel and are suitable for placing silicon chips, the bearing areas comprise first step surfaces fixedly arranged on the panel, the first step surfaces extend towards the center of the bearing areas, and a plurality of clamping points are arranged on the first step surfaces at intervals.
Further, the first step surface is located at the lower end of the panel, a second step surface is further arranged above the first step surface, and a landslide is further connected between the second step surface and the upper end of the panel, wherein the width of the second step surface is smaller than that of the first step surface.
Further, the bearing areas are arranged in a rectangular mode, and carrier plate reinforcing ribs are arranged between the two rows of bearing areas, wherein the carrier plate reinforcing ribs are located at the bottom of the carrier plate body.
Further, the reinforcing rib comprises a first connecting part, a second connecting part and a third connecting part which are connected in sequence, wherein the first connecting part and the second connecting part are obliquely arranged, the inclination angle of the first connecting part and the second connecting part is 3-5 degrees, the inclination angle of the third connecting part is 0 degree, the first connecting part and the second connecting part are obliquely arranged,
the first connecting part, the second connecting part and the third connecting part are fixedly connected through metal buckles.
Further, the carrier plate conducting bar comprises an upper layer conducting bar and a lower layer conducting bar, and graphite materials are filled in the upper layer conducting bar, wherein the upper layer conducting bar is fixedly connected with the lower layer conducting bar through bolts.
Further, the upper layer conducting bar is formed by cladding a metal shell.
Further, the upper guide bar is formed by splicing a plurality of sections of guide bars, wherein two adjacent guide bars are spliced by connectors.
Further, the minimum distance between the two bearing areas close to the upper end and the lower end of the panel and the outer side wall of the panel is 10-50 mm.
Further, rectangular positioning holes are formed in the periphery of the carrier plate body.
Further, the length direction of the carrier plate guide bar is parallel to the movement direction of the carrier plate body.
Advantageous effects
1. The reinforcing ribs can change thickness according to the deformation direction of the carrier plate body, and meanwhile, the reinforcing ribs can change positions according to the use scene of the carrier plate body so as to solve the problem of the edge effect of the reinforcing ribs; the panel can stably erect the bearing area so as to enable the bearing area to stably bear the silicon wafer, and the carrier guide bar can guide the carrier body to circularly move;
2. the clamping points can ensure that the silicon wafer cannot collapse due to high-temperature deformation, the carrier plate body and the panel for carrying the silicon wafer adopt a discontinuous design, and the convex clamping points are added on the carrying area as small as possible, so that the carrying stability is ensured, and the uncoated area is reduced.
Drawings
FIG. 1 is a schematic view of a first structure of a vacuum-coated carrier plate for a solar cell according to the present invention;
FIG. 2 is a schematic diagram of a second structure of a vacuum-coated carrier plate for a solar cell according to the present invention;
FIG. 3 is a schematic view of the structure of the load bearing area and the panel of the present invention;
FIG. 4 is an enlarged block diagram of FIG. 3 at A;
FIG. 5 is a schematic side view of a carrier guide bar according to the present invention;
FIG. 6 is a schematic cross-sectional view of a carrier guide bar according to the present invention;
fig. 7 is a schematic structural view of the integral reinforcing bars of the present invention.
In the figure:
100. the support plate body, 110, support plate reinforcing ribs, 120 and rectangular positioning holes;
200. the device comprises a panel, 210, a bearing area, 211, a first step surface, 2111, a clamping point, 212, a second step surface, 2121 and a landslide;
300. the support plate conducting bars 310, the upper layer conducting bars 311, the conducting bars 312, the graphite material 313, the bolts 314, the outer shell 320 and the lower layer conducting bars;
400. reinforcing rib 410, connecting parts I, 420, connecting parts II, 430, connecting parts III, 440 and metal buckles.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
Reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic may be included in at least one implementation of the invention. In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "top", "bottom", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may include one or more of the feature, either explicitly or implicitly. Moreover, the terms "first," "second," and the like, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein.
1-7, the invention provides a vacuum film plating carrier plate for a solar cell, which comprises a carrier plate body 100, wherein the carrier plate body 100 comprises a panel 200, carrier plate guide bars 300 oppositely arranged at two sides of the panel 200, reinforcing ribs 400 oppositely arranged at the other two sides of the panel 200 and a plurality of bearing areas 210 which are arranged on the panel 200 and are suitable for placing silicon wafers, the reinforcing ribs 400 can change thickness according to the deformation direction of the carrier plate body 100, meanwhile, the reinforcing ribs 400 can change positions according to the use situation of the carrier plate body 100, and particularly, when the carrier plate body 100 is plated with a film, the reinforcing ribs 400 are arranged above the carrier plate body 100 to solve the problem of edge effect of the reinforcing ribs 400, the carrier areas 210 can be firmly erected by the panel 200 so that the bearing areas 210 bear the silicon wafers stably, and the carrier plate guide bars 300 can guide the carrier plate body 100 to move circularly; the carrying area 210 includes a first step surface 211 fixedly disposed on the panel 200, the first step surface 211 extends toward the center of the carrying area 210, and a plurality of clamping points 2111 are disposed on the first step surface 211 at intervals, the clamping points 2111 can ensure that the silicon wafer cannot collapse due to high temperature deformation, the carrier plate body 100 and the panel 200 carrying the silicon wafer adopt a discontinuous design, and the clamping points 2111 are raised on the carrying area as small as possible, so that the carrying stability is ensured, and the uncoated area is reduced.
The first step surface 211 is located at the lower end of the panel 200, a second step surface 212 is further disposed above the first step surface 211, a sliding slope 2121 is further connected between the second step surface 212 and the upper end of the panel 200, wherein the width of the second step surface 212 is smaller than that of the first step surface 211, different steps are designed in the bearing area 210, silicon wafers with different sizes can be assembled, and compatibility of the bearing area 210 is improved.
The bearing areas 210 are arranged in a rectangular shape, and carrier plate reinforcing ribs 110 are arranged between the two rows of bearing areas 210, wherein the carrier plate reinforcing ribs 110 are positioned at the bottom of the carrier plate body 100, and the carrier plate reinforcing ribs 110 play a role in reinforcing the carrier plate body 100 and resisting deformation.
The reinforcing rib 400 comprises a first connecting part 410, a second connecting part 420 and a third connecting part 430 which are sequentially connected, the first connecting part 410 and the second connecting part 420 are obliquely arranged, the inclination angle of the first connecting part 410 and the second connecting part 420 is 3-5 degrees, the inclination angle of the third connecting part 430 is 0 degree, the first connecting part 410, the second connecting part 420 and the third connecting part 430 are fixedly connected through a metal buckle 440, the sectional length of the reinforcing rib 400 is trisected according to the deformation of materials, the strength of the reinforcing rib 400 is higher at the places with large deformation, and the horizontality of the carrier plate body 100 can be improved through the design.
The carrier guide bar 300 comprises an upper guide bar 310 and a lower guide bar 320, wherein the upper guide bar 310 is filled with a graphite material 312, and the graphite material 312 can improve the ability of the carrier guide bar 300 to resist thermal deformation; the upper layer conductive bars 310 and the lower layer conductive bars 320 are fixedly connected by bolts 313, so that the structure is stable and reliable, and the carrier plate conductive bars 300 can continuously work.
The upper layer conductive strip 310 is formed by cladding a metal shell 314, the abrasion of the upper layer conductive strip 310 can be reduced due to the fact that the metal material is arranged outside, and the upper layer conductive strip 310 is filled with the graphite material 312, so that the carrier plate conductive strip 300 can cope with deformation and resist abrasion, and the service life of the carrier plate conductive strip 300 is prolonged;
the upper layer conducting bars 310 are formed by splicing a plurality of sections of conducting bars 311, wherein two adjacent conducting bars 311 are formed by splicing connectors, and the sectional design of the conducting bars solves the problems that the thermal expansion coefficient of the metal material of the upper layer conducting bars 310 is high and the expansion deformation amount of the whole section of the metal material of the carrier plate conducting bars 300 is large in a high-temperature process environment, so that the maintenance cost is reduced.
The minimum distance between the two bearing areas 210 near the upper and lower ends of the panel 200 and the outer side walls of the panel 200 is 10-50 mm, so that the interval between the carrier plate and the edge of the bearing place is increased, and the influence of the plating around the silicon wafer borne by the carrier plate is avoided.
Rectangular positioning holes 120 are formed in the periphery of the carrier plate body 100, and the rectangular positioning holes 120 can be used for rapidly positioning the carrier plate body 100 during installation, so that the installation speed is increased, and the working efficiency is improved.
The length direction of the carrier guide 300 is parallel to the movement direction of the carrier body 100, and the carrier guide 300 plays a role in supporting the carrier and reducing abrasion of transmission components.
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the invention are intended to be included within the scope of the invention.
Claims (7)
1. The vacuum coating carrier plate for the solar cell is characterized in that: comprises a carrier plate body, wherein the carrier plate body comprises a panel, carrier plate guide bars oppositely arranged at two sides of the panel, reinforcing ribs oppositely arranged at the other two sides of the panel and a plurality of bearing areas which are arranged on the panel and are suitable for placing silicon chips,
the bearing area comprises a first step surface fixedly arranged on the panel, the first step surface extends towards the center of the bearing area, and a plurality of clamping points are arranged on the first step surface at intervals; the first step surface is positioned at the lower end of the panel, a second step surface is arranged above the first step surface, a landslide is also connected between the second step surface and the upper end of the panel, wherein,
the width of the second step surface is smaller than that of the first step surface;
the bearing areas are arranged in a rectangular shape, carrier plate reinforcing ribs are arranged between the two rows of bearing areas,
the support plate reinforcing ribs are positioned at the bottom of the support plate body;
the reinforcing rib comprises a first connecting part, a second connecting part and a third connecting part which are connected in sequence, wherein the first connecting part and the second connecting part are obliquely arranged, the inclination angle of the first connecting part and the second connecting part is 3-5 degrees, the inclination angle of the third connecting part is 0 degree, the reinforcing rib comprises a first reinforcing rib body, a second reinforcing rib body and a third reinforcing rib body,
the first connecting part, the second connecting part and the third connecting part are fixedly connected through metal buckles.
2. The solar cell vacuum coating carrier plate of claim 1, wherein:
the carrier plate conducting bar comprises an upper layer conducting bar and a lower layer conducting bar, graphite materials are filled in the upper layer conducting bar, wherein,
the upper layer conducting bars are fixedly connected with the lower layer conducting bars through bolts.
3. The solar cell vacuum coating carrier plate of claim 2, wherein:
the upper layer conducting bar is formed by cladding a metal shell.
4. A solar cell vacuum coated carrier plate as claimed in claim 3, wherein:
the upper layer guide bar is formed by splicing a plurality of sections of guide bars, wherein,
and two adjacent guide strips are spliced by connectors.
5. The solar cell vacuum coating carrier plate of claim 1, wherein:
the minimum distance between the two bearing areas close to the upper end and the lower end of the panel and the outer side wall of the panel is 10-50 mm.
6. The solar cell vacuum coating carrier plate of claim 1, wherein:
rectangular positioning holes are formed in the periphery of the carrier plate body.
7. The solar cell vacuum coating carrier plate of claim 1, wherein:
the length direction of the carrier plate guide bars is parallel to the movement direction of the carrier plate body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310847948.XA CN116575008B (en) | 2023-07-12 | 2023-07-12 | Vacuum coating carrier plate for solar cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310847948.XA CN116575008B (en) | 2023-07-12 | 2023-07-12 | Vacuum coating carrier plate for solar cell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116575008A CN116575008A (en) | 2023-08-11 |
| CN116575008B true CN116575008B (en) | 2023-09-22 |
Family
ID=87536237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310847948.XA Active CN116575008B (en) | 2023-07-12 | 2023-07-12 | Vacuum coating carrier plate for solar cell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116575008B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111647877A (en) * | 2020-07-09 | 2020-09-11 | 梅耶博格光电设备(上海)有限公司 | Plate type PECVD (plasma enhanced chemical vapor deposition) coating carrier plate |
| CN215560655U (en) * | 2021-05-26 | 2022-01-18 | 安徽华晟新能源科技有限公司 | Coating film carrier plate |
| CN216849881U (en) * | 2021-12-20 | 2022-06-28 | 江苏杰太光电技术有限公司 | Guide strip of silicon wafer support plate |
| CN218203036U (en) * | 2022-10-08 | 2023-01-03 | 常州比太科技有限公司 | Vacuum coating support plate for solar cell |
| CN218677076U (en) * | 2022-11-22 | 2023-03-21 | 苏州迈为科技股份有限公司 | Silicon wafer carrier and film coating system |
-
2023
- 2023-07-12 CN CN202310847948.XA patent/CN116575008B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111647877A (en) * | 2020-07-09 | 2020-09-11 | 梅耶博格光电设备(上海)有限公司 | Plate type PECVD (plasma enhanced chemical vapor deposition) coating carrier plate |
| CN215560655U (en) * | 2021-05-26 | 2022-01-18 | 安徽华晟新能源科技有限公司 | Coating film carrier plate |
| CN216849881U (en) * | 2021-12-20 | 2022-06-28 | 江苏杰太光电技术有限公司 | Guide strip of silicon wafer support plate |
| CN218203036U (en) * | 2022-10-08 | 2023-01-03 | 常州比太科技有限公司 | Vacuum coating support plate for solar cell |
| CN218677076U (en) * | 2022-11-22 | 2023-03-21 | 苏州迈为科技股份有限公司 | Silicon wafer carrier and film coating system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116575008A (en) | 2023-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20230155046A1 (en) | Back contact solar cell assembly | |
| WO2006137746A1 (en) | Stress relieving ribbons | |
| JP2019519119A (en) | Inter-cell wiring | |
| CN116575008B (en) | Vacuum coating carrier plate for solar cell | |
| CN213184235U (en) | Graphite boat and graphite boat coating equipment | |
| JP2008218278A (en) | Flat plate stacking type fuel cell | |
| US7011904B2 (en) | Fluid passages for power generation equipment | |
| CN111243998A (en) | Silicon wafer loader for preventing silicon wafers from being adhered | |
| CN218203036U (en) | Vacuum coating support plate for solar cell | |
| KR102586968B1 (en) | Boat apparatus | |
| CN101517832B (en) | Electric connector | |
| CN211670179U (en) | Silicon wafer loader for preventing silicon wafers from being adhered | |
| CN216919401U (en) | Coating carrier and coating equipment | |
| JPH04162364A (en) | Fuel cell and method for molding its corrugated plate | |
| CN109545908A (en) | A kind of solar cell inactivating mold and the equipment of solar battery production | |
| CN215869408U (en) | Grid line electrode of solar cell and solar cell | |
| CN110993726A (en) | Printing process of solar cell | |
| CN219752429U (en) | Plate-type coating film carrier plate | |
| CN219180522U (en) | Copper grid line electrode and solar cell | |
| CN216299052U (en) | Bearing tool and machining equipment | |
| CN217922309U (en) | PECVD graphite boat compatible with solar cells of various sizes | |
| CN214411145U (en) | Quartz boat | |
| KR101681192B1 (en) | Transfer robot | |
| CN216354253U (en) | Deposition device of N-type battery POLY silicon | |
| CN220526876U (en) | Silicon wafer flower basket |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |