CN116564827A - High-conductivity silver-based alloy bonding wire and preparation method thereof - Google Patents
High-conductivity silver-based alloy bonding wire and preparation method thereof Download PDFInfo
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- CN116564827A CN116564827A CN202310541599.9A CN202310541599A CN116564827A CN 116564827 A CN116564827 A CN 116564827A CN 202310541599 A CN202310541599 A CN 202310541599A CN 116564827 A CN116564827 A CN 116564827A
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- 239000000956 alloy Substances 0.000 title claims abstract description 185
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 181
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 99
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 97
- 239000004332 silver Substances 0.000 title claims abstract description 96
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 239000012535 impurity Substances 0.000 claims abstract description 14
- 239000010949 copper Substances 0.000 claims description 58
- 229910052751 metal Inorganic materials 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 39
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 35
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 30
- 239000010931 gold Substances 0.000 claims description 29
- 238000010438 heat treatment Methods 0.000 claims description 28
- 230000007246 mechanism Effects 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 26
- 238000007670 refining Methods 0.000 claims description 25
- 238000007790 scraping Methods 0.000 claims description 25
- 229910052746 lanthanum Inorganic materials 0.000 claims description 22
- 229910052733 gallium Inorganic materials 0.000 claims description 19
- 229910052737 gold Inorganic materials 0.000 claims description 19
- 239000011701 zinc Substances 0.000 claims description 19
- 238000003723 Smelting Methods 0.000 claims description 17
- 238000005266 casting Methods 0.000 claims description 17
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 16
- 239000002994 raw material Substances 0.000 claims description 16
- 238000003756 stirring Methods 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- 239000000126 substance Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 13
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 12
- 238000000137 annealing Methods 0.000 claims description 12
- 238000005275 alloying Methods 0.000 claims description 10
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 9
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 9
- 241001330002 Bambuseae Species 0.000 claims description 9
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 9
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 9
- 239000011425 bamboo Substances 0.000 claims description 9
- 238000005491 wire drawing Methods 0.000 claims description 9
- 229910052725 zinc Inorganic materials 0.000 claims description 9
- 229910017944 Ag—Cu Inorganic materials 0.000 claims description 8
- 239000012298 atmosphere Substances 0.000 claims description 8
- 229910001020 Au alloy Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910000858 La alloy Inorganic materials 0.000 claims description 7
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 7
- 229910000807 Ga alloy Inorganic materials 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 229910002696 Ag-Au Inorganic materials 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- BSWGGJHLVUUXTL-UHFFFAOYSA-N silver zinc Chemical compound [Zn].[Ag] BSWGGJHLVUUXTL-UHFFFAOYSA-N 0.000 claims description 5
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010272 inorganic material Inorganic materials 0.000 claims description 3
- 239000011147 inorganic material Substances 0.000 claims description 3
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 3
- 230000008569 process Effects 0.000 description 21
- 229910052763 palladium Inorganic materials 0.000 description 17
- 239000007787 solid Substances 0.000 description 17
- 239000006104 solid solution Substances 0.000 description 16
- 239000012071 phase Substances 0.000 description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- 230000000694 effects Effects 0.000 description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000012299 nitrogen atmosphere Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 238000005303 weighing Methods 0.000 description 5
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000004512 die casting Methods 0.000 description 4
- 238000002845 discoloration Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000005987 sulfurization reaction Methods 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- -1 Ag3Al Chemical class 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010981 drying operation Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005486 sulfidation Methods 0.000 description 1
- 238000004781 supercooling Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/03—Making non-ferrous alloys by melting using master alloys
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/52—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for wires; for strips ; for rods of unlimited length
- C21D9/525—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for wires; for strips ; for rods of unlimited length for wire, for rods
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
- C22C5/08—Alloys based on silver with copper as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/43—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
- H01L2224/435—Modification of a pre-existing material
- H01L2224/4351—Sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
- H01L2224/438—Post-treatment of the connector
- H01L2224/4381—Cleaning, e.g. oxide removal step, desmearing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
- H01L2224/43985—Methods of manufacturing wire connectors involving a specific sequence of method steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Abstract
The high-conductivity silver-based alloy bonding wire prepared by the preparation method of the high-conductivity silver-based alloy bonding wire comprises the following components in percentage by mass: 0.2 to 0.9wt% of Cu, 0.001 to 0.005wt% of Au, 0.001 to 0.005wt% of Pd, 0.001 to 0.005wt% of Zn, 0.001 to 0.005wt% of Ga, 0.0001 to 0.002wt% of La, 99.9 to 99.9999wt% of silver, and impurities.
Description
Technical Field
The invention relates to the technical field of bonding wire materials for packaging integrated circuit ICs and LED devices, in particular to a high-conductivity silver-based alloy bonding wire and a preparation method thereof.
Background
Wire bonding (wirebonding) is also known as wire bonding, a technique in which bare chip electrode pads are interconnected with input/output leads of an electronic package or metal wire pads on a substrate by pressure, heat, ultrasonic wave, etc. energy and by means of bonding methods (ball-wedge or wedge-wedge, etc.) using metal bonding wires. Wire bonding technology is still dominant in electronic package interconnect technology. Bonding wires mainly used in the market include gold wires, copper wires, silver wires and aluminum wires. Gold wire is the earliest widely used in electronic packaging and LED industry due to its excellent chemical stability, but gold wire has been developed to the bottleneck after decades of research due to its high price, and the packaging industry needs to search for bonding wires with excellent performance and low price.
The presently disclosed data, such as the patent number CN201110128217.7 entitled "silver-based microalloy bonding wire and method for preparing same", adopts the following materials in percentage by weight: the bonding wire has the advantages that the silver content is 99.982-99.993%, the indium content is 0.003-0.008%, the copper content is 0.002-0.006%, the gold content is 0.002-0.004%, the silver-based microalloy bonding wire is good in mechanical and electrical properties, the breaking strength of the silver-based microalloy bonding wire with the diameter of 0.023mm reaches 72mN, the elongation is 8-12%, the resistivity is 1.7X10Ω.m, but when the silver-based microalloy bonding wire is bonded, abnormal wire breakage is caused due to the fact that the elongation of the bonding wire is unstable, and eccentric ball phenomena such as a golf ball and the like can be formed during ball bonding, so that the bonding efficiency is influenced.
Secondly, when wire drawing is carried out on bonding wires, particularly when annealing is carried out in the wire drawing process of alloy wires, in order to realize rapid heat dissipation, a water cooling mode is often adopted to rapidly conduct heat dissipation, a water film is easily formed on the surface of the alloy wires after the alloy wires are cooled, the existence of the water film influences the operations such as oiling the alloy wires, and when the wire drawing process is carried out, a certain amount of scrap iron and the like remain on the surface of the alloy wires due to contact between the alloy wires and a wire drawing device, the quality of the alloy wires is influenced due to the existence of the scrap iron, and burrs and the like are easily formed on the outer wall of the alloy wires in the wire drawing process. At present, when water film removal is performed, a hot air blowing mode is adopted, but the water removal effect is affected due to the hot air blowing mode of the surface for hot air separation.
Disclosure of Invention
The invention provides a high-conductivity silver-based alloy bonding wire and a preparation method thereof, which are used for solving the defects of the prior art, providing a silver-based alloy bonding wire with high conductivity and low cost, and improving the quality of the silver-based alloy bonding wire when the silver-based alloy bonding wire is drawn.
In order to achieve the object of the present invention, the following techniques are proposed:
in one aspect, the invention provides a method for preparing a high-conductivity silver-based alloy bonding wire, which comprises the following steps:
mixing less than 1 weight percent of first metal auxiliary materials and more than 99 weight percent of silver according to weight percent, and then carrying out vacuum melting to obtain a first melt;
wherein the metal element contained in the first metal auxiliary material is at least one of Pd, au and Zn which are mainly Cu;
adding less than 1 weight percent of second metal auxiliary materials into the first molten mass under the protective atmosphere for refining to obtain a second molten mass;
wherein the metal element contained in the second metal auxiliary material is at least one of Ga and La;
drawing and casting the second melt into round bars;
carrying out the procedures of large drawing, medium drawing, fine drawing and fine drawing on the round bar formed by the drawing and casting in sequence to obtain a silver-based alloy bonding wire;
Wherein, the total content of Cu, ga, pd, au, zn and La in the silver alloy bonding wire is less than or equal to 1wt percent according to the weight percentage.
Further, the first metal auxiliary material is one or more of elemental copper, elemental palladium, elemental gold and elemental zinc;
the second metal auxiliary material is one or more of elemental gallium and elemental lanthanum.
Further, the first metal auxiliary material is one or more of Ag-Cu intermediate alloy, ag-Au intermediate alloy, ag-Zn alloy and Ag-Pd intermediate alloy, wherein the Ag-Cu intermediate alloy is Ag-1wt% to 10wt% Cu alloy, the Ag-Au intermediate alloy is Ag-0.5wt% to 1.5wt% Au alloy, the Ag-Pd intermediate alloy is Ag-0.5wt% to 1.5wt% Pd alloy, and the Ag-Zn intermediate alloy is Ag-0.5wt% to 1.5wt% Zn alloy;
the second metal auxiliary material is one or more of Ag-Ga intermediate alloy and Ag-La intermediate alloy, the Ag-Ga intermediate alloy is Ag-0.5-1.5 wt% Ga alloy, and the Ag-La intermediate alloy is Ag-0.5-1.5 wt% La alloy.
Further, the preparation method further comprises the step of preheating the raw materials before smelting, wherein the preheating temperature is 150-250 ℃, and the preheating time is 10-50 min.
Further, the vacuum melting temperature is 1200-1350 ℃, the time is 10-30 min, and the vacuum degree is 1.1X10 -2 Pa ~2×10 -2 Pa。
Further, the refining temperature is 1200-1300 ℃ and the refining time is 5-10 min;
the refining further includes stirring the second melt using electromagnetic stirring.
Further, after the second molten body is refined, the temperature of the second molten body is reduced to 1100-1200 ℃ and kept stand for 5-10 min.
Further, the speed of the round bar is 50-150 mm/min when the round bar is drawn and cast;
the diameter of the round bar formed by drawing and casting is 8-10 mm;
the diameter of the silver-based alloy bonding wire is 15-30 mu m;
after the silver-based alloy bonding wire is subjected to wiredrawing annealing, the outer wall of the silver-based alloy bonding wire is treated by a wire outer wall treatment device so as to remove water films and impurities on the silver-based alloy bonding wire;
the silk thread outer wall treatment device comprises a substrate, wherein one end of the substrate is provided with a scraping mechanism, the other end of the substrate is provided with a water removing mechanism, and the upper end of the scraping mechanism is provided with an air heater;
the scraping mechanism comprises a vertical plate arranged at one end of a base plate, a through hole is formed in the lower end of the vertical plate, a guide plate is arranged at the upper end of the outer wall of the vertical plate, a sliding block is arranged on the guide plate in a sliding manner, concave parts are rotatably arranged at the front side and the rear side of the sliding block, a movable plate is movably arranged in the concave parts, support plates are vertically arranged at the outer ends of the movable plate, the lower ends of the support plates are respectively hinged to the vertical plate through pin shafts, connecting arms are respectively arranged at the lower ends of the support plates, an inner protruding plate is arranged at the inner wall of the upper end of each connecting arm, an inclined plate is arranged at the lower end of each connecting arm, a concave installation frame is arranged at the lower end of each inclined plate, a convex strip is arranged at the inner wall of each concave installation frame, a scraping plate is arranged at the inner wall of each scraping plate, a semicircular arc scraper is arranged at the outer end of each semicircular arc scraper, concave seat is rotatably arranged at the inner protruding plate, a connecting screw rod is arranged at the other end of one concave seat, a connecting screw is arranged at the other, a connecting cylinder is arranged at the other, a plug pin is arranged at the outer periphery of the inner side of each connecting cylinder, and is provided with a limiting ring groove;
The water removing mechanism comprises a mounting seat mounted on a substrate, a driving seat is mounted at the upper end of the mounting seat, a driving motor is mounted on the driving seat, a driving wheel is arranged on an output shaft of the driving motor, the driving wheel is meshed with a driven wheel, an outer cylinder penetrates through the mounting seat, a pair of mounting bosses are arranged on the outer wall of the outer cylinder, an inner cylinder is arranged in the outer cylinder, a connector is arranged at one end of the outer cylinder, a connecting pipe is connected to the outer side end of the connector, a first end ring is mounted at one end of the inner cylinder, an embedded ring is arranged on the inner wall of the first end ring, an annular groove is arranged at the other end of the inner cylinder, an overhanging cylinder is arranged at the other end of the inner cylinder, the driven wheel is sleeved on the overhanging cylinder, the periphery of the inner cylinder is provided with a spiral groove in a circumferential array, the bottom of the spiral groove is provided with a plurality of spray holes along the spiral line of the spiral groove, one end of the spiral groove is communicated with the inner annular semicircular groove, one end plate is mounted at one end of the outer cylinder, the semicircular end plate is arranged in the annular groove, the other end ring groove is arranged at the other end of the outer cylinder, the inner end of the annular semicircular groove is connected with the annular groove, the annular inner annular groove is arranged on the inner circumference of the inner end of the outer cylinder, and the annular semicircular groove is positioned at the same end of the annular groove and is located at the same end as the end of the annular groove;
The air heater is including installing in the installation hypoplastron of riser upper end, install the shell on the installation hypoplastron, the end closure board is installed respectively at the both ends of shell, be equipped with thermal-insulated section of thick bamboo in the shell, the both ends of thermal-insulated section of thick bamboo are closed through the blind end dish respectively, be equipped with the heliciform coil in the thermal-insulated section of thick bamboo, be equipped with the heating jar in the heliciform coil, the one end of heating jar is equipped with the discharge pipe, the discharge pipe is connected on the other end of connecting pipe, the one end intercommunication of heating jar has the intake pipe, the outside end of intake pipe is connected with the pressurization air inlet pump, discharge pipe and intake pipe wear in proper order in blind end dish and end closure board, the exhaust end of heating jar is hemispherical structure, thermal-insulated section of thick bamboo and blind end dish are made by refractory inorganic material, it has refractory felt to fill between thermal-insulated section of thick bamboo and the shell, the heating jar is ironwork.
On the other hand, the invention provides a high-conductivity silver-based alloy bonding wire, which is prepared by a preparation method of the high-conductivity silver-based alloy bonding wire and comprises the following chemical components in percentage by mass: 1wt% or less of an alloying element, 99wt% or more of silver, and impurities, wherein the alloying element is at least one of Ga, pd, au, zn and La mainly containing Cu.
Further, the high-conductivity silver-based alloy bonding wire comprises, in mass percent: 0.2 to 0.9wt% of Cu, 0.001 to 0.005wt% of Au, 0.001 to 0.005wt% of Pd, 0.001 to 0.005wt% of Zn, 0.001 to 0.005wt% of Ga, 0.0001 to 0.002wt% of La, and 99.9 to 99.9999wt% of silver, and impurities.
In the high-conductivity silver-based alloy bonding wire, when the copper content is in the range of 0.2-0.9 wt%, ag and Cu can form Ag (Cu) solid solution in a solid phase, and the strength of the alloy is improved through solid solution strengthening, so that the breaking force is higher than that of a pure silver wire, and the wire drawing process and the bonding process are facilitated. The maximum equilibrium solid solubility of Cu in the solid Ag phase is 8.8wt% at 779.1 ℃, but below 200 ℃, the equilibrium solid solubility is reduced to below 0.2 wt%. In the high-conductivity silver-based alloy bonding wire, cu is designed to exist in a mode of Ag (Cu) solid solution phase, if the Cu exists in a mode of simple substance Cu phase, eccentric balls can be formed during ball bonding, under the actual solidification condition and production process condition, the solid solubility of Cu in Ag is higher than the equilibrium solid solubility of Cu, the Cu content is controlled below 0.9wt%, and the Cu exists in a mode of Ag (Cu) solid solution phase in cooperation with the production process condition.
The invention adds 10-50ppm Pd and 10-50ppm Au on the basis of the silver-copper alloy. Pd, au and Ag can form infinite solid solution, and in the component range of the invention, the Pd, au and Ag exist in a solid solution mode, have a certain solid solution strengthening effect, and can properly improve the corrosion resistance and high temperature resistance of the alloy, and the content of Pd and Au is controlled to be 10-50ppm so as to ensure the conductivity, the material cost and a certain corrosion resistance of the alloy.
The invention adds 10-50ppm Ga based on the silver-copper alloy. The solid solubility of Ga in Ag can reach 8wt%, ga in the range of 0.02-0.3wt% exists in the form of Ag (Ga) solid solution phase, the surface tension of alloy liquid can be improved, the balling performance of the alloy during bonding is improved, the wettability of the alloy on the surfaces of Al discs and the like is further improved, the sulfuration discoloration resistance and the oxidation resistance are also facilitated, the plasticity and toughness of the silver alloy are properly improved, and the processing performance of the silver alloy is improved.
The invention adds 10-50ppm Zn on the basis of the silver-copper alloy. The solid solubility of Zn in Ag can reach 20wt%, zn in 10-50ppm exists in the form of Ag (Zn) solid solution phase, the surface tension of alloy liquid can be properly reduced, the wettability of the alloy liquid on the surface of Al disc and the like can be properly improved, and the casting performance can be better improved, so that the balling performance of the alloy during bonding is improved, the sulfuration discoloration resistance and oxidation resistance are also facilitated, the plasticity and toughness of the silver alloy are properly improved, and the processing performance of the silver alloy is improved.
The invention adds 1-20ppm La element on the basis of the silver copper alloy containing trace Ga, zn, pd, au. La has very low solid solubility in Ag and has certain grain refinement effect in Ag matrix. At the use temperature, la may diffuse and be pushed to the Ag/Al interface, and La present here has an effect of blocking the growth of interfacial compounds such as Ag3Al, thereby improving the reliability of use thereof.
The Cu, pd, au, ga, zn, la alloy elements contained in the invention act on the silver-based bonding wire cooperatively, play a role of multi-element alloying, effectively solve the problem of corrosion resistance, maintain high electric conductivity and heat conductivity, reduce material cost and promote comprehensive performance of the silver-based bonding wire.
The technical scheme has the advantages that:
(1) The preparation method of the high-conductivity silver-based alloy bonding wire provided by the invention has the advantages of simple preparation process and easiness in operation;
(2) The preparation method of the high-conductivity silver-based alloy bonding wire can improve the mechanical property of the alloy material while ensuring the resistivity of the alloy material;
(3) The preparation method of the high-conductivity silver-based alloy bonding wire can improve the FAB balling stability of the alloy material;
(4) When the bonding wire is drawn, the outer wall of the bonding wire can be processed, so that the quality of the bonding wire is improved to a certain extent, and the impurity content in the bonding wire is reduced.
Drawings
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings.
Fig. 1 is a perspective view showing a structure of a wire outer wall treatment device.
Fig. 2 shows a perspective view of the scraping mechanism.
Fig. 3 shows a perspective view of a part of the scraping mechanism.
Fig. 4 shows a perspective view of a scraper in the scraping mechanism.
Fig. 5 shows a perspective view of the water removal mechanism.
Fig. 6 shows a perspective view of a portion of the water removal mechanism from a first perspective.
Fig. 7 shows a perspective view of a portion of the water removal mechanism from a second perspective.
Fig. 8 shows a perspective view of the inner cylinder.
Fig. 9 shows a perspective view of the outer cylinder.
Fig. 10 shows a perspective view of the air heater.
Fig. 11 shows a cross-sectional view of the air heater.
Fig. 12 shows a graph of measured data in example 1.
Fig. 13 shows a graph of measured data in example 2.
Fig. 14 shows a graph of measured data in example 3.
Fig. 15 shows a graph of measured data in example 4.
Reference numerals illustrate:
the device comprises a base plate-1, a scraping mechanism-2, a dewatering mechanism-3, an air heater-4, a vertical plate-200, a guide plate-201, a sliding block-202, a concave part-203, a movable plate-204, a supporting plate-205, a pin shaft-206, a connecting arm-207, a sloping plate-208, a concave mounting frame-209, a convex strip-210, an inward protruding plate-211, a concave seat-212, a connecting screw rod-213, a connecting nut-214, a connecting cylinder-215, a scraping plate-216, a semicircular arc groove-217, a semicircular arc scraper-218, an assembly groove-219, a through hole-220, a mounting seat-300, a driving seat-301, a driving motor-302, a driving wheel-303, a driven wheel-304, an outer cylinder-305, an inner cylinder-306, a connector-307, a connecting tube-308, a mounting boss-309, a first end ring-310, a semicircular-311, a spiral groove-312, a spray hole-313, an annular groove-314, an outward protruding cylinder-316, an inner annular semicircular groove-317, an end ring groove-318, an outer annular semicircular groove-40, a mounting lower plate-40, a housing end-41, a spiral coil-43, a closed coil-43, a heating cylinder-43, a closed coil-48, a heating cylinder-46 and an air inlet pipe-48.
Detailed Description
The preparation method of the high-conductivity silver-based alloy bonding wire mainly comprises the following steps: according to weight percentage, the first metal auxiliary material with the weight percentage of less than 1 percent and the silver with the weight percentage of more than 99 percent are mixed and then added into a smelting furnace to be subjected to vacuum smelting, so as to obtain a first melt. Wherein the metal element contained in the first metal auxiliary material is at least one of Au, zn and Pd which mainly contains Cu. The addition of Cu, au, zn and Pd alloy elements to Ag can exert the multi-element alloying effect, for example, ag and Cu can form Ag (Cu) solid solution when in a solid phase, and the strength of the alloy is improved through solid solution strengthening. The Au and Pd elements can properly improve the corrosion resistance and the high temperature resistance of the alloy.
And adding less than 1wt% of a second metal auxiliary material into the first molten mass under a protective atmosphere for refining to obtain a second molten mass. Wherein the metal element contained in the second metal auxiliary material is at least one of Ga and La. Here, the protective atmosphere may be nitrogen, argon, or the like.
And drawing and casting the second melt into round bars, and sequentially carrying out multi-pass drawing processes such as large drawing, medium drawing, fine drawing and the like and annealing process procedures on the round bars formed by drawing and casting to obtain the silver alloy bonding wires.
The silver used in the preparation process may be high-purity silver of 5N or more, for example, 5N silver, 6N silver, 7N silver, or the like. The metal elements of the first metal auxiliary material and the second metal auxiliary material can be added in the form of simple substances or can be added in the form of intermediate alloys. If the metal is in the form of simple substance, the first metal auxiliary material can be one or more of simple substance copper, simple substance gold, simple substance zinc and simple substance palladium which mainly comprise copper, and the second metal auxiliary material can be one or more of simple substance gallium and simple substance lanthanum. If the metal is added in a mode of intermediate alloy, the first metal auxiliary material can be one or more of Ag-Cu intermediate alloy, ag-Au intermediate alloy, ag-Zn intermediate alloy and Ag-Pd intermediate alloy, and the second metal auxiliary material can be one or more of Ag-Ga intermediate alloy and Ag-La intermediate alloy. The added metal element content can be distributed more uniformly by adding the metal element in an alloy mode, and secondly, the metal element can be weighed more conveniently when the metal element is mixed in a master alloy mode in consideration of the specificity of the industry (the quantity of one furnace is smaller).
According to the weight percentage, the contents of Cu, au, pd, zn, ga and La in the prepared high-conductivity silver-based alloy bonding wire are respectively 0.2-0.9wt% Cu, 0.001-0.005wt% Au, 0.001-0.005wt% Pd, 0.001-0.005wt% Zn, 0.001-0.005wt% Ga and 0.0001-0.002wt% La. And the total content of Cu, au, pd, zn, ga and La in the high-conductivity silver-based alloy bonding wire is less than or equal to 1 weight percent. For example, the total content may be 0.3wt%, 0.60wt%, 0.75wt%, or 0.95wt%. Here, the maximum equilibrium solid solubility of Cu in the solid Ag phase is 8.8wt% at 779.1 ℃, but at 200 ℃ or less, the equilibrium solid solubility is reduced to 0.2wt% or less. In the high conductive silver-based alloy bonding wire prepared by the preparation method of the high conductive silver-based alloy bonding wire, cu exists in the form of an Ag (Cu) solid solution phase, and if the Cu exists in the form of an elemental Cu phase, an eccentric ball phenomenon may be formed during ball bonding. Considering that the solid solubility of Cu in Ag is higher than the equilibrium solid solubility under the actual solidification condition and the production process condition, the Cu content should be controlled below 0.8wt% and the production process condition is matched to ensure that Cu exists in the form of Ag (Cu) solid solution phase. For Ga, the solid solubility of Ga in Ag can reach 8wt%, and Ga in the range of 0.02-0.3wt% exists in a mode of Ag (Ga) solid solution phase, so that the surface tension of alloy liquid can be improved, the balling performance of the alloy during bonding can be improved, the wetting capability of the alloy on Al discs and the like can be further improved, meanwhile, the sulfuration discoloration resistance and oxidation resistance can be facilitated, the plasticity and toughness of the silver alloy can be properly improved, and the processing performance of the silver alloy can be improved.
For Zn, the solid solubility of Zn in Ag can reach 20wt%, zn in the range of 10-50ppm exists in the form of Ag (Zn) solid solution phase, the surface tension of alloy liquid can be properly reduced, the wettability of the alloy liquid on Al discs and the like can be properly improved, and the effect of better improving the casting performance is achieved, so that the balling performance of the alloy during bonding is improved, the sulfuration discoloration resistance and the oxidation resistance are also facilitated, the plasticity and toughness of the silver alloy are properly improved, and the processing performance of the silver alloy is improved. When Zn element is added in combination with Ga, the effect is better than that of the equivalent single element. For Au and Pd, pd and Ag can form infinite solid solution, the solid solubility of Au in Ag can reach 55wt%, but the occurrence of ordered phases needs to be prevented so as to prevent eccentric balls from forming during ball welding. La has very low solid solubility in Ag and has certain grain refinement effect in Ag matrix. At the use temperature, la may diffuse and be pushed to the Ag/Al interface, and La present here has an effect of blocking the growth of interfacial compounds such as Ag3Al, thereby improving the reliability of use thereof. The range of other element content theory control can be obtained through the same or similar principle judgment. If Cu, ga, pd, au, zn and La elements act on the silver-based bonding wire cooperatively, the multi-element alloying effect can be exerted, the corrosion resistance problem of the bonding wire can be effectively solved, the high electric conductivity and the heat conductivity are maintained, and the comprehensive performance of the silver-based bonding wire is improved.
In the present exemplary embodiment, the Ag-Cu intermediate alloy may be Ag-1 to 10wt% Cu alloy, for example, ag-3.5wt% Cu alloy, ag-4.0wt% Cu alloy, ag-7.3wt% Cu alloy, or Ag-8.7wt% Cu alloy may be selected. The Ag-Au intermediate alloy can be Ag-0.5-1.5 wt% Au alloy, for example, ag-0.5wt% Au alloy, ag-0.55wt% Au alloy or Ag-8.0wt% Au alloy can be selected. The Ag-Zn intermediate alloy may be Ag-0.5-1.5 wt% Zn alloy, for example, ag-0.75wt% Zn alloy, ag-0.8wt% Zn alloy or Ag-1.1wt% Zn alloy may be selected. The Ag-Pd intermediate alloy can be Ag-0.5-1.5 wt% Pd alloy, for example, ag-0.7wt% Pd alloy, ag-1.0wt% Pd alloy or Ag-1.3wt% Pd alloy can be selected. The Ag-Ga intermediate alloy may be Ag-0.5-1.5 wt% Ga alloy, for example, ag-0.5wt% Ga alloy, ag-1.0wt% Ga alloy or Ag-1.2wt% Ga alloy may be selected. The Ag-La intermediate alloy may be Ag-0.5-1.5 wt% La alloy, for example, ag-0.6wt% La alloy, ag-0.85wt% La alloy or Ag-1.15wt% La alloy may be selected.
If the alloy is added in the form of intermediate alloy, 0.05-0.5wt% of Ag-Cu intermediate alloy, 0.005-0.05wt% of Ag-Au intermediate alloy, 0.005-0.05wt% of Ag-Pd intermediate alloy, 0.005-0.05wt% of Ag-Zn intermediate alloy and the balance of high-purity silver with more than 5N are mixed and then vacuum melted to obtain a first melt, and 0.05-0.5wt% of Ag-Ga intermediate alloy and 0.005-0.05wt% of Ag-La intermediate alloy are added into the first melt to refine to obtain a second melt. For example, in weight percent, 0.05wt%, 0.32wt%, or 0.48wt% of an Ag-Cu master alloy, 0.007wt%, 0.028wt% or 0.035wt% of an Ag-Au master alloy, 0.007wt%, 0.029wt% or 0.05wt% of an Ag-Zn master alloy, 0.006wt%, 0.024wt% or 0.045wt% of an Ag-Pd master alloy, 0.0018wt%, 0.025wt% or 0.04wt% of an Ag-Ga master alloy, 0.01wt% or 0.037wt% or 0.05wt% of an Ag-La master alloy may be selected. Here, the intermediate alloy may be added in a bowl feed manner.
In the present exemplary embodiment, the method for preparing the high-conductivity silver-based alloy bonding wire may further include a step of preheating the raw materials before smelting, the preheating step may be performed in a vacuum oven with a protective atmosphere being introduced into the oven, and the vacuum degree in the oven is 6.0X10 -2 Pa ~10.0×10 -2 Pa, e.g. 7.0X10 -2 Pa、7.5×10 -2 Pa or 8.5X10 -2 Pa. The preheating temperature may be 150 to 250 ℃, for example 160 ℃, 180 ℃ or 220 ℃. The preheating time may be 10 to 50 minutes, for example, 10 minutes, 15 minutes or 35 minutes. Here, the water in the raw material can be removed by preheating the raw material, and the drying of the raw material is ensured.
In the present exemplary embodiment, the temperature of the vacuum melting may be 1200 to 1350 ℃, for example, 1200 ℃, 1230 ℃, 1270 ℃, or 1350 ℃. The time may be 10 to 30 minutes, for example, 10 minutes, 17 minutes, or 25 minutes. The vacuum degree in the vacuum melting furnace is 1.1X10 -2 Pa ~2×10 -2 Pa, e.g. 1.1X10 -2 Pa、1.35×10 -2 Pa、1.57×10 -2 Pa or 1.79×10 - 2 Pa。
The smelting temperature is 1200-1350 ℃, the alloy and the base material are fully melted, and the alloying elements are fully alloyed for 10-30 min. If the temperature exceeds the standard, firstly, the volatilization of the material is increased, secondly, the smelting danger is increased, thirdly, the energy required by smelting is increased, the temperature exceeds the lower limit, the material is insufficiently melted, the time exceeds the lower limit, alloy elements cannot be fully alloyed, and the phenomenon of uneven smelting of the material is caused.
In the present exemplary embodiment, the temperature of the refining may be 1200 to 1300 ℃, for example, 1260 ℃, 1270 ℃, or 1290 ℃. The time may be 5-10 min, for example, 6min, 8min or 10min. The refining has the advantages that alloy elements in the material are more uniformly mixed, the material performance is more uniform, the temperature and the time exceed the upper limit, the temperature and the heat preservation time of the material are increased, the material is unnecessarily volatilized, and the temperature and the time exceed the lower limit, so that the material can be nonuniform.
The refining process may further include stirring the second melt using electromagnetic stirring. Here, the electromagnetic stirring mode can strengthen the convection, heat transfer and mass transfer processes of the molten mass, and can control the flow direction and form of the molten mass. The melt may be in a rotational, linear or spiral motion. The electromagnetic stirring mode can be used for adjusting parameters according to the quality requirement of a material finished product so as to obtain different stirring effects, and compared with other stirring methods (such as vibration and blowing), the electromagnetic stirring method has the positive effect of improving the quality of the final product.
Further, the preparation method of the high-conductivity silver-based alloy bonding wire can further comprise the following steps: and (3) after the refining is finished, reducing the temperature of the second melt to 1100-1200 ℃ and standing for 5-10 min. For example, the temperature may be reduced to 1150 ℃ for 5min, reduced to 1170 ℃ for 8min, or reduced to 1190 ℃ for 10min. Here, if the second melt is directly drawn and cast at too high a temperature, the supercooling degree is too high, and the crystallization is too fast, which may result in failure to normally complete the drawing operation, so that the cooling process is required. And the second molten body is kept still, so that the temperature of the whole second molten body is consistent, and the next step of drawing casting and traction is convenient.
In the present exemplary embodiment, the speed of the drawing casting may be 50 to 150mm/min, for example, 60mm/min, 68mm/min, 79mm/min, or 100mm/min. The diameter of the round bar formed may be 8-10 mm, for example 8mm, 9mm or 10mm. The diameter of the highly conductive silver-based alloy bonding wire may be 15 to 30 μm, for example, 18 μm, 22 μm, 27 μm or 30 μm.
In this exemplary embodiment, the method of preparing the highly conductive silver-based alloy bonding wire may further include: and annealing the bonding wire subjected to multi-pass drawing processes such as large drawing, medium drawing, fine drawing and micro drawing in an inert atmosphere at 350-550 ℃. Here, the temperature of annealing may be 375 ℃, 425 ℃ or 480 ℃. The bonding wire is placed under a protective atmosphere, so that oxygen can be isolated. Meanwhile, the protective atmosphere can be used as a heat transfer medium, which is favorable for uniformly heating the bonding wire during annealing. Here, the drawing speed in the drawing process is less than 1000m/min, for example, 750m/min, 825m/min or 950m/min. The diameter of the drawn wire is greater than 1.5mm, for example, 1.7mm, 1.9mm or 2.0mm. The diameter of the drawn wire may be 0.082mm to 1.5mm, for example, 0.082mm, 1.2mm or 1.40mm. The diameter of the drawn wire may be 0.036mm to 0.082mm, for example, 0.038mm, 0.058mm or 0.070mm. The diameter of the drawn wire by micro-drawing is less than 0.036mm, for example, 0.019mm, 0.023mm or 0.030mm.
After the silver-based alloy bonding wire is subjected to wiredrawing annealing, the outer wall of the silver-based alloy bonding wire is treated by a wire outer wall treatment device so as to remove water films and impurities on the silver-based alloy bonding wire.
The device for treating the outer wall of the silk thread in the embodiment, as shown in fig. 1, comprises a substrate 1, wherein one end of the substrate 1 is provided with a scraping mechanism 2, the other end of the substrate 1 is provided with a water removing mechanism 3, and the upper end of the scraping mechanism 2 is provided with an air heater 4. The scraping mechanism can scrape the water film, impurities, burrs and the like on the outer wall of the bonding wire, the scraping thorn of the water is lower, the water film is removed by the mechanism, the water removing mechanism 3 is mainly used for removing the water film, the air heater 4 can provide hot air for the water removing mechanism 3, the water film on the bonding wire is dried rapidly, and meanwhile, in the drying process, scraps adhered to the bonding wire can be removed in an auxiliary mode through an air injection mode, so that the quality of the bonding wire is improved.
As shown in fig. 2 to 4, the scraping mechanism 2 comprises a vertical plate 200 mounted at one end of a base plate 1, a through hole 220 is formed at the lower end of the vertical plate 200, a guide plate 201 is mounted at the upper end of the outer wall of the vertical plate 200, a sliding block 202 is slidably arranged on the guide plate 201, concave parts 203 are rotatably arranged at the front side and the rear side of the sliding block 202, movable plates 204 are movably arranged in the concave parts 203, support plates 205 are vertically arranged at the outer side ends of the movable plates 204, the lower ends of the support plates 205 are respectively hinged on the vertical plate 200 through pin shafts 206, connecting arms 207 are respectively arranged at the lower ends of the support plates 205, inward extending convex plates 211 are arranged on the inner walls of the upper ends of the connecting arms 207, inclined plates 208 are arranged at the lower ends of the connecting arms 207, concave mounting frames 209 are arranged at the lower ends of the inclined plates 208, the inner wall of concave mounting frame 209 is equipped with sand grip 210, scraper blade 216 is installed to concave mounting frame 209, semicircular groove 217 has been seted up on the inner wall of scraper blade 216, the periphery of scraper blade 216 is equipped with mounting groove 219, sand grip 210 inlays in mounting groove 219, the outer wall of scraper blade 216 is equipped with semicircular scraper 218, semicircular scraper 218's outside end is the cutting edge, it is equipped with concave seat 212 to stretch in the rotation on the flange 211, connecting lead screw 213 is installed to the other end of one of them concave seat 212, be equipped with coupling nut 214 on the connecting lead screw 213, connecting cylinder 215 is installed to the other end of another concave seat 212, spacing annular has been seted up to the inner end periphery of connecting cylinder 215, be equipped with the bolt on the coupling nut 214, the bolt is inserted and is located in the spacing annular. The two scrapers 216 can be opened, so that the bonding wires can be conveniently penetrated in the semicircular grooves 217, and meanwhile, the scrapers 216 can be conveniently replaced as required. The provision of the protruding strips 210 and the fitting grooves 219 improves the stability of fixing the scraper 216, and prevents the scraper 216 from damaging the outer wall of the bonding wire due to tilting or the like during the scraping operation. The guide plate 201, the sliding block 202 and the concave piece 203 can synchronously carry out the rotation of the scraping plate 216, thereby being convenient for an operator to carry out the disassembly and assembly operations. The semicircular groove 217 is a hole through which the bonding wire passes, and the main scraping cutter is designed as a semicircular arc scraper 218, by which the contact area between the scraping cutter and the bonding wire can be increased, thereby improving the scraping effect.
When the scraper 216 is replaced, the operator rotates the coupling nut 214 so that the coupling screw 213 moves outwardly in the axial direction thereof, thereby moving the two inwardly projecting lugs 211 away from each other, and when the inwardly projecting lugs 211 move away, the two scrapers 216 rotate outwardly about the pins 206, and when the scrapers 216 rotate outwardly, the movable plate 204 rotates inwardly about the pins 206, the movable plate 204 rotates inwardly, thereby moving the female member 203 outwardly relative to the movable plate 204 along the movable plate 204, and the sliding block 202 moves downwardly in the length direction of the guide plate 201 until the two scrapers 216 are opened to a certain extent, and then the scraper 216 is replaced, and after the replacement, the operator closes the scraper 216 by reversing the operation.
As shown in fig. 5 to 9, the water removing mechanism 3 comprises a mounting seat 300 mounted on a substrate 1, a driving seat 301 is mounted at the upper end of the mounting seat 300, a driving motor 302 is mounted on the driving seat 301, a driving wheel 303 is arranged on an output shaft of the driving motor 302, a driven wheel 304 is engaged with the driving wheel 303, an outer cylinder 305 is penetrated on the mounting seat 300, a pair of mounting bosses 309 are arranged on the outer wall of the outer cylinder 305, an inner cylinder 306 is arranged in the outer cylinder 305, a connector 307 is arranged at one end of the outer cylinder 305, a connecting pipe 308 is connected with the outer end of the connector 307, a first end ring 310 is mounted at one end of the inner cylinder 306, an inner embedded ring is arranged on the inner wall of the first end ring 310, an annular groove 314 is arranged at the other end of the inner cylinder 306, an overhanging cylinder 315 is arranged at the other end of the inner cylinder 306, the driven wheel 304 is sleeved on the overhanging cylinder 315, the periphery of inner tube 306 is equipped with helical groove 312 in circumference array, the bottom of helical groove 312 is equipped with a plurality of orifices 313 along helical line of helical groove 312, interior annular semicircle groove 316 has been seted up to the one end of inner tube 306, the one end of helical groove 312 communicates in interior annular semicircle groove 316, a pair of semicircle end plates 311 is installed to the one end of urceolus 305, semicircle end plates 311 card is located in annular groove 314, the end annular groove 317 has been seted up to the other end of urceolus 305, the embedded ring wears in end annular groove 317, the one end inner periphery of urceolus 305 is equipped with outer annular semicircle groove 318, outer annular semicircle groove 318 and interior annular semicircle groove 316 are located the same end, and it holds the chamber to surround and form an annular air current, the inboard end of connector 307 communicates in annular air current and holds the chamber.
When the water is removed, the jet holes 313 along the spiral line array form a spiral-like airflow knife, the inner side ends of the airflow knives act on the outer wall of the bonding wire, so that the bonding wire can be dried quickly, and in the drying process, impurities are blown off conveniently.
The helical groove 312 communicates with the annular air flow receiving chamber to form a passage for the supply of hot air, thereby facilitating the water removal operation.
The first end ring 310, the inner insert ring, and the semicircular end plate 311 are provided to connect the outer cylinder 305 and the inner cylinder 306, and also prevent a large amount of hot air from leaking to some extent, thereby improving the heat utilization rate.
When the dewatering operation is carried out, the bonding wire penetrates through the inner cylinder 306, then the driving motor 302 is started, the driving wheel 303 is driven by the driving motor 302 to rotate, the driven wheel 304 is driven to rotate by the rotation of the driving wheel 303, the inner cylinder 306 is driven to rotate when the driven wheel 304 rotates, the outer wall of the bonding wire is dried by the spiral airflow knife in the rotating process of the inner cylinder 306, and impurities adhered to the outer wall of the bonding wire are cleaned during drying. And the heated air enters the annular air flow receiving chamber through the connection head 307 and then enters each of the spiral grooves 312 and finally is ejected from the nozzle holes 313.
As shown in fig. 10 and 11, the air heater 4 includes a mounting lower plate 40 mounted on the upper end of a vertical plate 200, a housing 41 is mounted on the mounting lower plate 40, end closing plates 42 are mounted at two ends of the housing 41, a heat insulation cylinder 43 is arranged in the housing 41, two ends of the heat insulation cylinder 43 are respectively closed by a closed end disc 44, a spiral coil 46 is arranged in the heat insulation cylinder 43, a heating tank 45 is arranged in the spiral coil 46, one end of the heating tank 45 is provided with a discharge pipe 47, the discharge pipe 47 is connected to the other end of a connecting pipe 308, one end of the heating tank 45 is communicated with an air inlet pipe 48, the outer end of the air inlet pipe 48 is connected with a booster air pump, the discharge pipe 47 and the air inlet pipe 48 sequentially penetrate through the closed end disc 44 and the end closing plates 42, the air outlet end of the heating tank 45 is of a hemispherical structure, the heat insulation cylinder 43 and the closed end disc 44 are made of refractory inorganic materials, a refractory felt is filled between the heat insulation cylinder 43 and the housing 41, and the heating tank 45 is made of iron products. The arrangement of the heat insulating cylinder 43 and the refractory felt can insulate heat, so that the safety during heating and the heat utilization rate are ensured, low-frequency alternating current is introduced into the spiral coil 46, when the low-frequency alternating current passes through the spiral coil 46, vortex is formed in the spiral coil 46, the vortex heats the iron heating tank 45, the air flow introduced into the heating tank 45 is heated to a certain temperature, and then the heated air flows are conveyed into the water removing mechanism 3, and the water removing operation of the bonding wire outer wall is performed through the water removing mechanism 3. Of course, the heating is not continuous, and in actual operation, the temperature is detected by a temperature sensor and the heating temperature is controlled by an automatic on-off switch. And the pressurizing air inlet pump can enable the air flow to be sprayed out at high speed, so that the drying operation of the bonding wire is convenient.
For a better understanding of the above-described exemplary embodiments of the present invention, they are further described below in connection with specific embodiments.
Example 1
(1) Weighing the raw materials: 53.3g of Ag-6wt% Cu master alloy, 2.0g of Ag-1.0wt% Au master alloy, 1.5g of Ag-1.0wt% Zn master alloy, 1.4g of Ag-1.0wt% Pd master alloy, 2.4g of Ag-0.5wt% Ga master alloy, 1.2g of Ag-0.5wt% La master alloy and 938.2g of 5N silver.
(2) Symmetrically taking raw materials, respectively preheating in vacuum oven under nitrogen atmosphere, and vacuumizing the oven to 6.5X10 -2 Pa, the preheating temperature is 200 ℃, and the preheating time is 30min.
(3) Mixing preheated 5N silver, ag-Cu intermediate alloy, ag-Au intermediate alloy and Ag-Pd intermediate alloy in a smelting furnace, and vacuumizing the smelting furnace to 1.6X10 -2 Pa, heating a vacuum melting furnace, and melting for 30min at 1220 ℃ to obtain a first melt.
(4) And (3) nitrogen is injected for protection, and then the preheated Ag-Ga intermediate alloy and the preheated Ag-La intermediate alloy are added into the first molten body in a bowl feeding mode. And refining for 5min at 1180 ℃ by adopting an electromagnetic stirring mode in the refining process to obtain a second melt.
(5) After the refining was completed, the temperature of the second melt was lowered to 1150 ℃ and allowed to stand for 5min.
(6) The second melt was die-cast into round bars with a diameter of 8mm at a die-casting speed of 60 mm/min.
(7) And carrying out multi-pass drawing processes such as large drawing, medium drawing, fine drawing and the like on the round bar formed by the drawing casting, and then carrying out annealing treatment in the nitrogen atmosphere protection at 350-500 ℃ to obtain the high-conductivity silver-based alloy bonding wire with the diameter of 20 mu m and the Elongation (EL) of 10 wt%.
Example 2
(1) Weighing the raw materials: 91.6g of Ag-6wt% Cu master alloy, 3.5g of Ag-1.0wt% Au master alloy, 2.5g of Ag-1.0wt% Zn master alloy, 1.8g of Ag-1.0wt% Pd master alloy, 4g of Ag-0.5wt% Ga master alloy, 1.8g of Ag-0.5wt% La master alloy and 894.8g of 5N silver.
(2) Symmetrically taking raw materials in nitrogen atmospherePreheating the vacuum ovens in the protection, and vacuumizing the ovens to 6.5X10 -2 Pa, the preheating temperature is 200 ℃, and the preheating time is 30min.
(3) Mixing preheated 5N silver, ag-Cu intermediate alloy, ag-Au intermediate alloy and Ag-Pd intermediate alloy in a smelting furnace, and vacuumizing the smelting furnace to 1.6X10 -2 Pa, heating a vacuum melting furnace, and melting for 30min at 1220 ℃ to obtain a first melt.
(4) And (3) nitrogen is injected for protection, and then the preheated Ag-Ga intermediate alloy and the preheated Ag-La intermediate alloy are added into the first molten body in a bowl feeding mode. And refining for 5min at 1180 ℃ by adopting an electromagnetic stirring mode in the refining process to obtain a second melt.
(5) After the refining was completed, the temperature of the second melt was lowered to 1150 ℃ and allowed to stand for 5min.
(6) The second melt was die-cast into round bars with a diameter of 8mm at a die-casting speed of 60 mm/min.
(7) And carrying out multi-pass drawing processes such as large drawing, medium drawing, fine drawing and the like on the round bar formed by the drawing casting, and then carrying out annealing treatment in the nitrogen atmosphere protection at 350-500 ℃ to obtain the high-conductivity silver-based alloy bonding wire with the diameter of 20 mu m and the EL of 10 wt%.
Example 3
(1) Weighing the raw materials: 125g of Ag-6wt% Cu master alloy, 3.2g of Ag-1.0wt% Au master alloy, 2.8g of Ag-1.0wt% Zn master alloy, 2.5g of Ag-1.0wt% Pd master alloy, 6g of Ag-0.5wt% Ga master alloy, 2.4g of Ag-0.5wt% La master alloy and 858.1g of 5N silver.
(2) Symmetrically taking raw materials, respectively preheating in vacuum oven under nitrogen atmosphere, and vacuumizing the oven to 6.5X10 -2 Pa, the preheating temperature is 200 ℃, and the preheating time is 30min.
(3) Mixing preheated 5N silver, ag-Cu intermediate alloy, ag-Au intermediate alloy and Ag-Pd intermediate alloy in a smelting furnace, and vacuumizing the smelting furnace to 1.6X10 -2 Pa, heating a vacuum melting furnace, and melting for 30min at 1220 ℃ to obtain a first melt.
(4) And (3) nitrogen is injected for protection, and then the preheated Ag-Ga intermediate alloy and the preheated Ag-La intermediate alloy are added into the first molten body in a bowl feeding mode. And refining for 5min at 1180 ℃ by adopting an electromagnetic stirring mode in the refining process to obtain a second melt.
(5) After the refining was completed, the temperature of the second melt was lowered to 1150 ℃ and allowed to stand for 5min.
(6) The second melt was die-cast into round bars with a diameter of 8mm at a die-casting speed of 60 mm/min.
(7) And carrying out multi-pass drawing processes such as large drawing, medium drawing, fine drawing and the like on the round bar formed by the drawing casting, and then carrying out annealing treatment in the nitrogen atmosphere protection at 350-500 ℃ to obtain the high-conductivity silver-based alloy bonding wire with the diameter of 20 mu m and the EL of 10 wt%.
Example 4 (comparative example)
(1) Weighing the raw materials: weighing the raw materials: 53.3g of Ag-6wt% Cu master alloy, 2.0g of Ag-1.0wt% Au master alloy, 1.4g of Ag-1.0wt% Pd master alloy and 944.3g of 5N silver.
(2) Symmetrically taking raw materials, respectively preheating in vacuum oven under nitrogen atmosphere, and vacuumizing the oven to 6.5X10 -2 Pa, the preheating temperature is 200 ℃, and the preheating time is 30min.
(3) Mixing preheated 5N silver, ag-Cu intermediate alloy and Ag-Pd intermediate alloy in a smelting furnace, and vacuumizing the smelting furnace to 1.6X10 -2 Pa, heating a vacuum melting furnace, and melting for 30min at 1180 ℃ to obtain a first melt.
(4) And (3) nitrogen is injected for protection, and then the preheated Ag-La intermediate alloy is added into the first molten body in a bowl feeding mode. And refining for 5min at 1220 ℃ by adopting an electromagnetic stirring mode in the refining process to obtain a second melt.
(5) After the refining was completed, the temperature of the second melt was lowered to 1150 ℃ and allowed to stand for 5min.
(6) The second melt was die-cast into round bars with a diameter of 8mm at a die-casting speed of 60 mm/min.
(7) And carrying out multi-pass drawing processes such as large drawing, medium drawing, fine drawing and the like on the round bar formed by the drawing and casting, and then carrying out annealing treatment at 300-500 ℃ in nitrogen atmosphere protection to obtain the silver alloy bonding wire with the diameter of 20 mu m and the EL of about 10 wt%.
The same bonding wire preparation steps are adopted in examples 1-4, and only the weight percentages of the adopted alloy raw materials are different, and some performance parameters of the bonding wires in examples 1-4 are compared. Performance parameters may include mechanical properties, resistivity, resistance to sulfidation, wire bond gag smoothness.
As shown in table 1, the mechanical properties and the resistivity of the silver alloy bonding wires prepared in examples 1 to 4 were measured, respectively, and as shown in table 1, the bonding wires in examples 1 to 3 had higher strength than the bonding wires in comparative examples in the case that the EL elongation was 10%. And examples 1-3 have a resistivity close to that of example 4. This demonstrates that Cu, au, zn, pd, ga, la synergistic effect can ensure the resistivity of the alloy material and enhance the mechanical properties thereof.
TABLE 1 mechanical blood energy and resistivity of bonding wire under the same conditions
| Sample of | BL/g | EL/% | Resistivity of |
| Example 1 | 9.66 | 9.98 | 1.73 |
| Example 2 | 10.05 | 9.95 | 1.81 |
| Example 3 | 10.27 | 10.08 | 1.85 |
| Example 4 | 10.47 | 10.11 | 1.91 |
The bonding wires of comparative examples 1 to 4 were subjected to WB wire bonding test, and the wire bonding smoothness was counted. As can be seen from fig. 12, the bonding wires in examples 1 to 3 have better smoothness, which indicates that the Cu, au, zn, pd, ga, la element can enhance the FAB balling stability of the alloy wire.
TABLE 2 bonding wire FAB balling stability
| Sample of | Number of burned balls | Number of defective spheres | Poor spherical duty cycle |
| Example 4 | 13824 | 6 | 0.043% |
| Example 1 | 13824 | 4 | 0.028% |
| Example 2 | 13824 | 2 | 0.014% |
| Example 3 | 13824 | 2 | 0.014% |
By measuring the smoothness of the bonding wires of the silver alloy wires prepared in examples 1 to 4, it can be seen from the graph that under the same conditions, examples 1 to 3 have better smoothness of the bonding wires than example 4, and the synergy of Cu, au, zn, pd, ga, la elements can effectively improve the smoothness of the bonding wires.
TABLE 3 example 1-example 4 wire bonding smoothness verification
| Sample of | Example 4 | Example 1 | Example 2 | Example 3 |
| MTBA/min | 73 | 98 | 133 | 138 |
Wherein the MTBA is Mean Time between assistance mean time to failure (MTBA) and the mean length of time to failure (MTBA) is equal to the mean length of time to failure (MTBA) in combination with the measured data shown in fig. 12-15.
In a second exemplary embodiment of the present invention, the high conductive silver-based alloy bonding wire may include a product prepared by the preparation method of the high conductive silver-based alloy bonding wire described in the first exemplary embodiment, and the silver-based alloy bonding wire includes the following chemical components in percentage by mass: 1wt% or less of an alloying element, 99wt% or more of silver, and unavoidable impurities, wherein the alloying element is at least one of Au, pd, zn, ga, la mainly containing Cu.
In the present exemplary embodiment, the highly conductive silver-based alloy bonding wire may include: the weight percentage of the components is calculated according to the mass percentage,
0.2-0.9 wt% Cu, 0.001-0.005 wt% Au, 0.001-0.005 wt% Pd, 0.001-0.005 wt% Zn, 0.001-0.005 wt% Ga, 0.0001-0.002 wt% La and 99.9-99.9999 wt% silver, and unavoidable impurities. For example, the silver alloy bond wire may include 0.2wt% Cu, 0.004wt% Au, 0.004wt% Pd, 0.004Zn, 0.008wt% Ga, 0.002wt% La and the balance silver or may include 0.5wt% Cu, 0.003wt% Au, 0.003Zn0.005wt% Pd, 0.0035wt% Ga, 0.0009wt% La and the balance silver or may include 0.7wt% Cu, 0.003wt% Au, 0.002wt% Pd, 0.0032wt% Ga, 0.0015wt% La and the balance silver. And, the total content of Cu, au, zn, pd, ga, la in the silver alloy bonding wire is 1wt% or less, for example, 0.68wt%, 0.9wt% or 1.0wt%.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the invention, and it will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. The preparation method of the high-conductivity silver-based alloy bonding wire is characterized by comprising the following steps of:
mixing less than 1 weight percent of first metal auxiliary materials and more than 99 weight percent of silver according to weight percent, and then carrying out vacuum melting to obtain a first melt; wherein, the metal element contained in the first metal auxiliary material is at least one of Ga, pd, au, zn and La which are mainly Cu;
adding less than 1 weight percent of second metal auxiliary materials into the first molten mass under the protective atmosphere for refining to obtain a second molten mass;
wherein the metal element contained in the second metal auxiliary material is at least one of Ga and La;
drawing and casting the second melt into round bars;
carrying out the procedures of large drawing, medium drawing, fine drawing and fine drawing on the round bar formed by the drawing and casting in sequence to obtain a silver-based alloy bonding wire;
Wherein, the total content of Cu, ga, pd, au, zn and La in the silver alloy bonding wire is less than or equal to 1wt percent according to the weight percentage.
2. The method for preparing the high-conductivity silver-based alloy bonding wire according to claim 1, wherein the first metal auxiliary material is one or more of elemental copper, elemental palladium, elemental gold and elemental zinc;
the second metal auxiliary material is one or more of elemental gallium and elemental lanthanum.
3. The method for preparing the high-conductivity silver-based alloy bonding wire according to claim 1, wherein the first metal auxiliary material is one or more of Ag-Cu intermediate alloy, ag-Au intermediate alloy, ag-Zn alloy and Ag-Pd intermediate alloy, wherein the Ag-Cu intermediate alloy is Ag-1wt% to 10wt% Cu alloy, the Ag-Au intermediate alloy is Ag-0.5wt% to 1.5wt% Au alloy, the Ag-Pd intermediate alloy is Ag-0.5wt% to 1.5wt% Pd alloy, and the Ag-Zn intermediate alloy is Ag-0.5wt% to 1.5wt% Zn alloy;
the second metal auxiliary material is one or more of Ag-Ga intermediate alloy and Ag-La intermediate alloy, the Ag-Ga intermediate alloy is Ag-0.5-1.5 wt% Ga alloy, and the Ag-La intermediate alloy is Ag-0.5-1.5 wt% La alloy.
4. The method for preparing the high-conductivity silver-based alloy bonding wire according to claim 1, further comprising the step of preheating raw materials before smelting, wherein the preheating temperature is 150-250 ℃, and the preheating time is 10-50 min.
5. The method for preparing the high-conductivity silver-based alloy bonding wire according to claim 1, wherein the vacuum melting temperature is 1200-1350 ℃, the time is 10-30 min, and the vacuum degree is 1.1X10 -2 Pa ~2×10 -2 Pa。
6. The method for preparing the high-conductivity silver-based alloy bonding wire according to claim 1, wherein the refining temperature is 1200-1300 ℃ and the refining time is 5-10 min;
the refining further includes stirring the second melt using electromagnetic stirring.
7. The method for producing a highly conductive silver-based alloy bonding wire according to claim 1, wherein after the second melt is refined, the temperature of the second melt is lowered to 1100 to 1200 ℃ and allowed to stand for 5 to 10 minutes.
8. The method for preparing the high-conductivity silver-based alloy bonding wire according to claim 1, wherein the speed of drawing and casting into a round bar is 50-150 mm/min;
the diameter of the round bar formed by drawing and casting is 8-10 mm;
the diameter of the silver-based alloy bonding wire is 15-30 mu m;
after the silver-based alloy bonding wire is subjected to wiredrawing annealing, the outer wall of the silver-based alloy bonding wire is treated by a wire outer wall treatment device so as to remove water films and impurities on the silver-based alloy bonding wire;
the silk thread outer wall treatment device comprises a substrate (1), wherein one end of the substrate (1) is provided with a scraping mechanism (2), the other end of the substrate (1) is provided with a water removing mechanism (3), and the upper end of the scraping mechanism (2) is provided with an air heater (4);
The scraping mechanism (2) comprises a vertical plate (200) arranged at one end of a base plate (1), a through hole (220) is formed in the lower end of the vertical plate (200), a guide plate (201) is arranged at the upper end of the outer wall of the vertical plate (200), a sliding block (202) is arranged on the guide plate (201) in a sliding mode, concave parts (203) are arranged on the front side and the rear side of the sliding block (202) in a rotating mode, a movable plate (204) is arranged in the concave parts (203) in an inner moving mode, supporting plates (205) are vertically arranged at the outer side ends of the movable plate (204), the lower ends of the supporting plates (205) are hinged to the vertical plate (200) through pin shafts (206) respectively, connecting arms (207) are respectively arranged at the lower ends of the supporting plates (205), inner walls of the upper ends of the connecting arms (207) are provided with inner protruding plates (211), inclined plates (208) are arranged at the lower ends of the connecting arms (207), concave mounting frames (209) are arranged at the lower ends of the inclined plates (208), concave mounting frames (210) are arranged on the inner walls of the concave mounting frames (209), scraping plates (216) are arranged on the inner walls of the concave mounting frames (216), semicircular grooves (216) are arranged on the inner walls of the concave mounting frames, the concave scraping plates (216) are arranged on the outer walls, the outer walls of the semicircular plates (216), the outer sides of the semicircular plates (218) are arranged on the arc-shaped rotary bases, and the arc-shaped scraper bases (212) respectively, a connecting screw rod (213) is arranged at the other end of one concave seat (212), a connecting screw cap (214) is arranged on the connecting screw rod (213), a connecting cylinder (215) is arranged at the other end of the other concave seat (212), a limit ring groove is formed in the periphery of the inner side end of the connecting cylinder (215), a bolt is arranged on the connecting screw cap (214), and the bolt is inserted into the limit ring groove;
The water removing mechanism (3) comprises a mounting seat (300) mounted on a substrate (1), a driving seat (301) is mounted at the upper end of the mounting seat (300), a driving motor (302) is mounted on the driving seat (301), a driving wheel (303) is arranged on an output shaft of the driving motor (302), a driven wheel (304) is meshed with the driving wheel (303), an outer cylinder (305) is penetrated on the mounting seat (300), a pair of mounting bosses (309) are arranged on the outer wall of the outer cylinder (305), an inner cylinder (306) is arranged in the outer cylinder (305), a connector (307) is arranged at one end of the outer cylinder (305), a connecting pipe (308) is connected at the outer end of the connector (307), a first end ring (310) is mounted at one end of the inner cylinder (306), an inner embedded ring is arranged on the inner wall of the first end ring (310), an annular groove (314) is formed at the other end of the inner cylinder (306), an overhanging cylinder (315) is further arranged at the other end of the inner cylinder (306), the driven wheel (304) is sleeved on the overhanging cylinder (315), the periphery of the inner cylinder (306) and is provided with spiral grooves (312) in a circumferential array, the bottoms of the spiral grooves (312) are provided with a plurality of spiral grooves (313) along the spiral lines of the spiral grooves of the inner cylinder (312), one end of the inner cylinder (306) is provided with a plurality of semicircular grooves (316), one end of the spiral groove (312) is communicated with the inner annular semicircular groove (316), one end of the outer cylinder (305) is provided with a pair of semicircular end plates (311), the semicircular end plates (311) are clamped in the annular grooves (314), the other end of the outer cylinder (305) is provided with an end annular groove (317), an inner embedded ring penetrates through the end annular groove (317), the inner periphery of one end of the outer cylinder (305) is provided with an outer annular semicircular groove (318), the outer annular semicircular groove (318) and the inner annular semicircular groove (316) are positioned at the same end and are encircled to form an annular airflow accommodating cavity, and the inner side end of the connector (307) is communicated with the annular airflow accommodating cavity;
The air heater (4) is including installing in the installation hypoplastron (40) of riser (200) upper end, install shell (41) on installing hypoplastron (40), end closure plate (42) are installed respectively at the both ends of shell (41), be equipped with thermal-insulated section of thick bamboo (43) in shell (41), the both ends of thermal-insulated section of thick bamboo (43) are closed through blind end dish (44) respectively, be equipped with heliciform coil (46) in thermal-insulated section of thick bamboo (43), be equipped with heating jar (45) in heliciform coil (46), the one end of heating jar (45) is equipped with discharge pipe (47), discharge pipe (47) are connected on the other end of connecting pipe (308), the one end intercommunication of heating jar (45) has intake pipe (48), the outside end of intake pipe (48) is connected with the pressurization air pump, discharge pipe (47) wear in blind end dish (44) and end closure plate (42) in proper order, the exhaust end of heating jar (45) is hemispherical structure, thermal-insulated section of thick bamboo (43) and blind end dish (44) are made by refractory inorganic material, it has refractory felt to fill between heating jar (43) and shell (41), heating jar (45) is the product.
9. The high-conductivity silver-based alloy bonding wire is characterized by being prepared by the preparation method of the high-conductivity silver-based alloy bonding wire according to any one of claims 1-8, and comprises the following chemical components in percentage by mass: 1wt% or less of an alloying element, 99wt% or more of silver, and impurities, wherein the alloying element is at least one of Ga, pd, au, zn and La mainly containing Cu.
10. The highly conductive silver-based alloy bonding wire according to claim 9, wherein the highly conductive silver-based alloy bonding wire comprises, in mass percent: 0.2 to 0.9wt% of Cu, 0.001 to 0.005wt% of Au, 0.001 to 0.005wt% of Pd, 0.001 to 0.005wt% of Zn, 0.001 to 0.005wt% of Ga, 0.0001 to 0.002wt% of La, and 99.9 to 99.9999wt% of silver, and impurities.
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