CN116525507B - Flip-chip brush belt cleaning device - Google Patents
Flip-chip brush belt cleaning device Download PDFInfo
- Publication number
- CN116525507B CN116525507B CN202310813813.1A CN202310813813A CN116525507B CN 116525507 B CN116525507 B CN 116525507B CN 202310813813 A CN202310813813 A CN 202310813813A CN 116525507 B CN116525507 B CN 116525507B
- Authority
- CN
- China
- Prior art keywords
- fixed
- magnet
- flip
- rod
- close
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 63
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910052742 iron Inorganic materials 0.000 claims abstract description 24
- 230000005540 biological transmission Effects 0.000 claims description 16
- 241001170716 Garra gotyla Species 0.000 claims description 7
- 239000007921 spray Substances 0.000 claims description 5
- 210000005056 cell body Anatomy 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims 2
- 238000003780 insertion Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000011010 flushing procedure Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 62
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000001680 brushing effect Effects 0.000 description 4
- 238000005119 centrifugation Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000017105 transposition Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B08B1/12—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Abstract
The invention belongs to the technical field of wafer production, in particular to a flip brush cleaning device, which aims at solving the problem that the existing high-pressure flushing mechanism from the upper surface is easy to damage a wafer. According to the invention, when the sucker unit drives the wafer to move to a position above the flip brush mechanism, namely, when the counterweight iron ball moves to the end part of the double-head electromagnet, the wafer rod shaft and the fixing support plate are automatically adsorbed and fixed, so that the surface of the wafer is cleaned in a fixed state.
Description
Technical Field
The invention relates to the technical field of wafer production, in particular to a flip brush cleaning device.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because of its circular shape, and various circuit element structures can be manufactured on the silicon wafer to form an IC product having a specific electrical function. The starting material for the wafer is silicon, while the crust surface is useful with inexhaustible silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon. The wafer fabrication plant then melts the polysilicon, seed crystals are seeded into the melt, and then slowly pulled out to form a cylindrical monocrystalline silicon ingot, which is called "growing crystals" because the silicon ingot is gradually grown from a single crystal plane oriented seed crystal in the molten silicon feedstock. The silicon crystal bar is cut, rolled, sliced, chamfered, polished, laser-etched and packaged to obtain the basic raw material of integrated circuit factory-silicon wafer, i.e. wafer.
Today, in semiconductor manufacturing processes, wafers are wet etched or cleaned by wafer cleaning equipment, such as a single wafer spin machine. For example, when residues such as residual glue are present on the wafer surface, the chemical solution can be sprayed on the wafer surface through the chemical solution spray head of the wafer cleaning device, and then the wafer surface is cleaned by the brush. In this step, the brush applies a pressing force to the surface of the wafer, and removes the residual glue on the surface of the wafer by means of physical friction. However, when the pressure exerted by the brush on the wafer surface exceeds the load value that the wafer can withstand, breakage or damage to the wafer may result.
Therefore, the flip brush cleaning device is developed, and the flip brush is arranged at the bottom of the wafer in an inverted manner, so that the problem that the wafer is extruded and damaged due to overlarge pressure is avoided, and the cleaning from the bottom is beneficial to the rapid cleaning of residues.
Disclosure of Invention
In order to achieve the above purpose, the present invention adopts the following technical scheme: the inverted brush cleaning device comprises a tank body table top with a rectangular mounting hole in the middle, a cleaning tank with an arc-shaped groove-shaped structure which is downwards sunken is embedded in the middle of the tank body table top, a mounting table with the table top higher than the tank body table top is fixed on the upper surface of the tank body table top close to the rear side, a large bearing seat is fixed in the middle of the upper surface of the mounting table, a main transmission pipe extending to the upper part of the middle of the cleaning tank is rotatably connected in the middle of the large bearing seat, a self-locking rotating wheel is fixed at one end of the main transmission pipe close to the cleaning tank, three mounting holes are formed in the surface of the self-locking rotating wheel, a round rod shaft is rotatably connected in each hole, a counterweight iron ball and a fixing supporting plate are respectively fixed at two ends of the round rod shaft, a sucker unit is arranged at one end of the fixing supporting plate far away from the self-locking rotating wheel, the whole body of the fixing supporting plate is inclined by 5 degrees, the sucker unit comprises a fixing pipe and a sucker head, and the sucker head can be immersed into the cleaning tank with a wafer adsorbed on the lower surface of the sucker unit when the sucker unit rotates to the lowest end, and the sucker unit drives the wafer to rotate out of the liquid surface, and the wafer is slightly inclined, so that liquid and impurities on the surface of the wafer are favorable for sliding down; the mounting table is close to one end of sucking disc unit and is provided with two extension tables, and two extension tables are located the both sides of auto-lock runner, the upper surface that one of them extension table that extends table that the suction disc head lower surface was oriented is provided with flip-chip brush mechanism, and flip-chip brush mechanism is including fixing two opening relative and parallel slot type slide rails of cell body mesa upper surface, sliding connection has same sliding table between two slot type slide rails, and the one end that the sliding table is close to the sucking disc unit is fixed with the main motor of slope five degrees, the output shaft top of main motor is fixed with the slip sleeve shaft that the opening upwards is barreled structure, and slip sleeve shaft's top mouth of pipe department slides and pegging graft has anti-torsion extension pole, anti-torsion extension pole's top is fixed with eccentric brush board, the surface of eccentric brush board is parallel to each other with the wafer surface of suction disc head lower surface.
The further setting is that all inlay in the installation hole site and be equipped with radial bearing, and every counter weight iron ball all opens perpendicular tangent plane near one side of flip-chip brush mechanism, the rear side that the upper surface of mount pad is close to the auto-lock runner is fixed with magnet mount, and the top joint of magnet mount has double-end electro-magnet, and the one end position that the counter weight iron ball is close to the auto-lock runner is located counter weight iron ball and removes one side on the right, and counter weight iron ball can not be blocked by double-end electro-magnet at the in-process of whole rotation transposition, through the double-end electro-magnet of setting, can be when sucking disc unit drive the wafer and remove the position to flip-chip brush mechanism top, when the counter weight iron ball removes the tip of double-end electro-magnet promptly, adsorb fixed plate with wafer axle and fixed to be favorable to carrying out the surface cleaning under fixed state to the wafer.
The self-locking rotary wheel is further provided with a circular jack in the middle, two rows of parallel annular ball grooves are formed in the inner wall of the circular jack, and two rows of balls are embedded in the position, close to the annular ball grooves, of the outer wall of the main transmission pipe; the side that auto-lock runner is close to big bearing frame is close to edge department and opens there is spacing hole that the equidistance distributes, and the lower surface of mount table is close to auto-lock runner department be provided with spacing hole looks adaptation automatically controlled locating pin, through ball and annular ball groove that set up, can let auto-lock runner reduce frictional resistance when rotating, and only need with automatically controlled locating pin circular telegram can when needs the location.
The sliding table is further provided with a return spring, wherein one side of the sliding table, which is far away from the main motor, is fixed with a spring baffle, and two ends of the spring baffle are respectively fixed at the end parts of the two groove-shaped sliding rails; through sliding connection who sets up sliding table and reset spring between two groove type slide rails, can only need when the clearance with the sliding table push away to sucking disc unit department with the main motor that fixes at its tip can, clear up and finish again removing the restraint and can accomplish the reset under reset spring's effect.
The brush is further arranged in that a plurality of radially distributed grooves are formed in the upper surface of the eccentric brush plate, and bristles are arranged on the upper surface of the eccentric brush plate; through the eccentric brush board that has the slot that sets up, can be favorable to the clearance of the spot of striking off in brushing, throw away fast under the effect of centrifugation.
The anti-torsion extension rod is further arranged in that the bottom end of the anti-torsion extension rod is fixedly provided with a tight-propping spring, and the bottom end of the tight-propping spring is fixed at the barrel bottom of the sliding sleeve shaft; through the tight spring that supports that sets up, can let the brush hair of eccentric brush board upper surface tightly support in the lower surface of wafer.
The high-pressure cleaning device is characterized in that a fixed rod is fixed on one side, far away from the sucker unit, of the upper surface of the sliding table, and a high-pressure cleaning spray head is arranged at the top end of the fixed rod; the end part of the high-pressure cleaning spray head faces the lower surface of the sucker unit when rotating to the working position; through the high-pressure cleaning nozzle, the lower surface of the wafer can be cleaned again when the wafer is brushed.
The eccentric brush is characterized in that a first magnet is fixed on the lower surface of the short shaft end of the eccentric brush plate, and a second magnet attracted with the bottom end of the first magnet is embedded in one side, close to the self-locking rotating wheel, of the top end of the sliding sleeve shaft; through magnet one and magnet two that set up, can be after holistic flip-chip brush mechanism withdraws from the cleaning position, ensure that eccentric brush board can not block the operation to the wafer.
The device is further arranged in that a shaft rod frame is fixed on the upper surface of the mounting table, a transmission rod extending longitudinally and horizontally is rotationally connected in the middle of the shaft rod frame, a large gear and a small gear are respectively fixed at the front end and the rear end of the transmission rod, and a rack push rod meshed with the large gear is fixed at the top end of the sliding table; the end part of the mounting table is fixedly provided with a guide rod frame, the top end of the guide rod frame is fixedly provided with a straight groove guide rod coaxial with the double-head electromagnet, the end part of the straight groove guide rod is sleeved with a magnet sleeve rod, the magnet sleeve rod is a permanent magnet, and the magnetic pole of one end of the magnet sleeve rod, which is close to the double-head electromagnet, is opposite to that of the magnet sleeve rod; the lower surface of the magnet loop bar is provided with a rack which is meshed with the pinion; through the magnet loop bar that is driven the removal by double-end electro-magnet that sets up, can also push away eccentric brush board to the cleaning position at the moment that the double-end electro-magnet adsorbs the counter weight iron ball fixed, begin to clear up the wafer.
The further setting is that the tip of magnet loop bar is opened has the direction perforation that runs through, and the diameter of pinion equals the tenth of gear wheel diameter, through the direction perforation that sets up for magnet loop bar can be vertical throughout and control the removal.
The beneficial effects of the invention are as follows:
1. through the eccentric brush board that sets up mutually parallel with inclined state's wafer, can be when dragging for the wafer that gets up in the washing liquid and wash, the dirty clearance of adhering to its surface is easier to the eccentric brush board that inclines after the clearance also is more easy to throw away the dirty under the effect of centrifugation, in order to ensure its own clean.
2. Through the double-end electro-magnet that sets up, can be when sucking disc unit drives the wafer and remove the position to flip-chip brush mechanism top, when the counter weight iron ball removes the tip to double-end electro-magnet promptly, adsorb fixed with wafer pole axle and fixed layer board voluntarily to be favorable to carrying out the surface cleaning to the wafer under fixed state.
3. Through sliding connection who sets up sliding table and reset spring between two groove type slide rails, can only need when the clearance with the sliding table push away to sucking disc unit department with the main motor that fixes at its tip can, clear up and finish again removing the restraint and can accomplish the reset under reset spring's effect.
4. Through the magnet loop bar that is driven the removal by double-end electro-magnet that sets up, can also push away eccentric brush board to the cleaning position at the moment that the double-end electro-magnet adsorbs the counter weight iron ball fixed, begin to clear up the wafer.
Drawings
FIG. 1 is a schematic diagram of the whole structure of a flip brush cleaning device according to the present invention;
FIG. 2 is a schematic view of the rear side of the inverted brush cleaning apparatus according to the present invention;
FIG. 3 is a front view of a flip brush cleaning device according to the present invention;
FIG. 4 is an enlarged view of the brush cleaning apparatus according to the present invention at A in FIG. 3;
FIG. 5 is a schematic view showing the whole structure of the flip brush cleaning device according to the present invention when the suction cup units are switched;
FIG. 6 is a schematic cross-sectional view of the flip brush cleaning device of FIG. 3 taken along line A-A;
FIG. 7 is a schematic view of an exploded view of an eccentric brush plate in a flip brush cleaning apparatus according to the present invention;
fig. 8 is a schematic structural view of a magnet loop bar in the inverted brush cleaning device according to the present invention.
In the figure: 1. a mounting table; 2. a magnet fixing frame; 3. a double-headed electromagnet; 4. a large bearing seat; 5. self-locking rotating wheel; 6. fixing the supporting plate; 7. a suction cup unit; 8. a pool body table top; 9. a cleaning pool; 10. a sliding sleeve shaft; 11. a main motor; 12. a sliding table; 13. a slot-type slide rail; 14. a return spring; 15. a spring baffle; 16. a rack push rod; 17. a large gear; 18. a shaft rod frame; 19. a transmission rod; 20. a guide bar frame; 21. a magnet sleeve rod; 2101. straight groove guide rod; 2102. guiding perforation; 2103. a rack; 22. a main drive tube; 23. a counterweight iron ball; 24. a round bar shaft; 25. a radial bearing; 26. an eccentric brush plate; 27. an anti-torsion extension rod; 28. brushing; 29. a first magnet; 30. a second magnet; 31. high-pressure cleaning of the spray head; 32. the spring is abutted tightly.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
In this embodiment: referring to fig. 1-8, the flip brush cleaning device comprises a tank body table top 8 with a rectangular mounting hole in the middle, a cleaning tank 9 with an arc-shaped groove structure which is sunken downwards is embedded in the middle of the tank body table top 8, a mounting table 1 with a table top higher than the tank body table top 8 is fixed on the upper surface of the tank body table top 8 near the rear side, a large bearing seat 4 is fixed in the middle of the upper surface of the mounting table 1, a main transmission pipe 22 extending to the upper part of the middle of the cleaning tank 9 is rotatably connected in the middle of the large bearing seat 4, a self-locking rotating wheel 5 is fixed at one end of the main transmission pipe 22 near the cleaning tank 9, three mounting holes are arranged on the surface of the self-locking rotating wheel 5, a round rod shaft 24 is rotatably connected in each hole, a counterweight iron ball 23 and a fixing supporting plate 6 are respectively fixed at two ends of the round rod 24, a sucker unit 7 is arranged at one end of the fixing supporting plate 6 far away from the self-locking rotating wheel 5, the whole body of the fixing supporting plate 6 is in an inclined 5-degree state, the sucker unit 7 comprises a fixing pipe and a sucker head, when the sucker unit 7 rotates to the lowest end along with the sucker unit 7, the sucker head automatically dips into the cleaning tank 9 with a wafer to the wafer surface to be absorbed by the lower surface of the sucker unit, and the wafer rod shaft is in the inclined state, and the wafer sucker unit is easy to slide down due to the wafer sucker unit and the wafer liquid after the wafer sucker unit is in the inclined state; the mounting table 1 is provided with two extension tables near one end of the sucker unit 7, the two extension tables are positioned on two sides of the self-locking rotating wheel 5, the upper surface of one extension table, namely the upper surface of the extension table facing the lower surface of the sucker head, is provided with a flip brush mechanism, the flip brush mechanism comprises two groove-type sliding rails 13 which are fixed on the upper surface of the pool body table 8 and are opposite and parallel to each other, the same sliding table 12 is connected between the two groove-type sliding rails 13 in a sliding way, one end of the sliding table 12 near the sucker unit 7 is fixed with a main motor 11 which is inclined by five degrees, the top end of an output shaft of the main motor 11 is fixed with a sliding sleeve shaft 10 with an opening of which is in a barreled structure upwards, a top pipe orifice of the sliding sleeve shaft 10 is in a sliding connection manner with an anti-torsion extension rod 27, the top end of the anti-torsion rod 27 is fixed with an eccentric brush plate 26, and the surface of the eccentric brush plate 26 is parallel to the surface of a wafer on the lower surface of the sucker head; through the eccentric brush plate 26 that sets up mutually parallel with the wafer of inclination, can be when the wafer that drags for in the washing liquid washs, the dirty clearance of adhering to its surface more easily to the eccentric brush plate 26 that inclines after the clearance also more easily throws away the dirty under the effect of centrifugation, in order to ensure its own clean.
The radial bearing 25 is embedded in the installation hole site, and one side of each counterweight iron ball 23 close to the flip brush mechanism is provided with a vertical tangential surface, the rear side of the upper surface of the installation table 1 close to the self-locking rotating wheel 5 is fixed with the magnet fixing frame 2, and the top end of the magnet fixing frame 2 is clamped with the double-end electromagnet 3, one end position of the double-end electromagnet 3 close to the self-locking rotating wheel 5 is located on one side of the counterweight iron ball 23 which is far right, namely the counterweight iron ball 23 cannot be blocked by the double-end electromagnet 3 in the whole rotation transposition process, and when the sucker unit 7 drives a wafer to move to the position above the flip brush mechanism, namely the counterweight iron ball 23 moves to the end part of the double-end electromagnet 3, the round rod shaft 24 and the fixing supporting plate 6 are automatically adsorbed and fixed, so that the surface cleaning of the wafer is facilitated under the fixed state.
Wherein, the middle of the self-locking rotating wheel 5 is provided with a circular jack, the circumferential inner wall of the circular jack is provided with two rows of mutually parallel annular ball grooves, and the circumferential outer wall of the main transmission pipe 22 is embedded with two rows of balls at the position close to the annular ball grooves; the side of the self-locking rotating wheel 5, which is close to the big bearing seat 4, is provided with limit holes distributed at equal distance, and the lower surface of the mounting table 1, which is close to the self-locking rotating wheel 5, is provided with an electric control locating pin matched with the limit holes, and friction resistance of the self-locking rotating wheel 5 can be reduced when the self-locking rotating wheel rotates through the arranged balls and the annular ball grooves, and the electric control locating pin is electrified when the self-locking rotating wheel needs to be positioned.
Referring to fig. 1, a return spring 14 is fixed to one side of the sliding table 12 away from the main motor 11, a spring baffle 15 is fixed to one end of the return spring 14 away from the sliding table 12, and two ends of the spring baffle 15 are respectively fixed to end portions of two groove-shaped sliding rails 13; through the sliding connection who sets up sliding table 12 and reset spring 14 between two groove type slide rail 13, can only need with the sliding table 12 with fix the main motor 11 of its tip push away to sucking disc unit 7 department in the clearance can, clear up and finish again removing the restraint and can accomplish the reset under reset spring 14's effect.
Referring to fig. 7, the upper surface of the eccentric brush plate 26 is provided with a plurality of radially distributed grooves, and the upper surface of the eccentric brush plate 26 is provided with bristles 28; the eccentric brush plate 26 with the grooves can be used for cleaning dirt scraped during brushing and can be thrown out rapidly under the action of centrifugation.
In the invention, the bottom end of the anti-torsion extension rod 27 is fixed with a tight-supporting spring 32, and the bottom end of the tight-supporting spring 32 is fixed at the barrel bottom of the sliding sleeve shaft 10; the bristles 28 on the upper surface of the eccentric brush plate 26 can be tightly abutted against the lower surface of the wafer by the abutment springs 32.
Referring to fig. 5 and 7, a fixing rod is fixed to a side of the upper surface of the slide table 12 away from the suction cup unit 7, and a high-pressure cleaning nozzle 31 is provided at the top end of the fixing rod; the end of the high-pressure cleaning head 31 is turned toward the lower surface of the suction cup unit 7 when it is in the working position; the lower surface of the wafer can be cleaned again at the time of brushing by the high-pressure cleaning nozzle 31.
Referring to fig. 3 to 4, a first magnet 29 is fixed on the lower surface of the short shaft end of the eccentric brush plate 26, and a second magnet 30 attracted with the bottom end of the first magnet 29 is embedded in one side of the top end of the sliding sleeve shaft 10, which is close to the self-locking rotating wheel 5; by providing first magnet 29 and second magnet 30, it is ensured that eccentric brush plate 26 does not block the operation of the wafer after the entire flip brush assembly is withdrawn from the cleaning position.
Referring to fig. 5 and 8, a shaft lever frame 18 is fixed on the upper surface of the mounting table 1, a transmission rod 19 extending longitudinally and horizontally is rotatably connected in the middle of the shaft lever frame 18, a large gear 17 and a small gear are respectively fixed at the front end and the rear end of the transmission rod 19, and a rack push rod 16 meshed with the large gear 17 is fixed at the top end of the sliding table 12; the end part of the mounting table 1 is fixed with a guide rod frame 20, the top end of the guide rod frame 20 is fixed with a straight groove guide rod 2101 coaxial with the double-head electromagnet 3, the end part of the straight groove guide rod 2101 is sleeved with a magnet sleeve rod 21, the magnet sleeve rod 21 is a permanent magnet, and the magnetic pole of one end of the magnet sleeve rod 21 close to the double-head electromagnet 3 is opposite to that of the magnet sleeve rod 21; the lower surface of the magnet bar 21 is provided with a rack 2103 which is meshed with the pinion gear; through the magnet loop bar 21 that is driven by double-end electro-magnet 3 and removes that sets up, can also push away eccentric brush board 26 to the cleaning position at the moment that double-end electro-magnet 3 adsorbs fixed with counter weight iron ball 23, begin to clear up the wafer.
Referring to fig. 5, the end of the magnet rod 21 is provided with a guide hole 2102 penetrating therethrough, and the diameter of the pinion is equal to one tenth of the diameter of the large gear 17, so that the magnet rod 21 can always move vertically left and right by the guide hole 2102.
Before use, the double-headed electromagnet 3 is controlled to be powered off, at the moment, the eccentric brush plate 26 is moved to one side of the self-locking rotating wheel 5 under the action of the reset spring 14, then the self-locking rotating wheel 5 is controlled to integrally and slowly rotate, at the moment, the suction disc head is immersed into the cleaning pool 9 along with the wafer adsorbed on the lower surface of the suction disc head when the suction disc unit 7 rotates to the lowest end, and after the suction disc unit 7 drives the wafer to rotate out of the liquid level, the suction disc unit 7 is in a slightly inclined state, so that the automatic sliding of liquid and impurities on the surface of the wafer is facilitated; continuing to rotate until the counterweight iron ball 23 and the sucker unit 7 move to the position above the inverted hairbrush mechanism, namely, when the counterweight iron ball 23 moves to the end part of the double-head electromagnet 3, the double-head electromagnet 3 is electrified, and then the counterweight iron ball 23, the round rod shaft 24 and the fixed supporting plate 6 can be automatically adsorbed and fixed; meanwhile, through the magnet sleeve rod 21 which is driven to move by the double-headed electromagnet 3, the eccentric brush plate 26 is pushed to the cleaning position at the moment when the double-headed electromagnet 3 adsorbs and fixes the counterweight iron balls 23, and then the main motor 11 is started to start cleaning the wafer.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (10)
1. The flip brush cleaning device comprises a tank body table top (8) with a rectangular mounting hole in the middle, a cleaning tank (9) with an arc groove-shaped structure which is sunken downwards is embedded in the middle of the tank body table top (8), a mounting table (1) with the table top higher than the tank body table top (8) is fixed on the upper surface of the tank body table top (8) close to the rear side, a large bearing seat (4) is fixed in the middle of the upper surface of the mounting table (1), a main transmission pipe (22) extending to the upper part of the middle of the cleaning tank (9) is rotatably connected in the middle of the large bearing seat (4), a self-locking rotary wheel (5) is fixed at one end of the main transmission pipe (22) close to the cleaning tank (9), three mounting hole sites are arranged on the surface of the self-locking rotary wheel (5), round rod shafts (24) are rotatably connected in each hole site, iron balls (23) and fixed at two ends of each round rod shaft (6) are respectively, and a sucker unit (7) is arranged at one end of each fixed supporting plate (6) far away from the self-locking rotary wheel (5), and the sucker unit (7) is characterized in that the whole fixed supporting plate (6) is in a sucker unit in a tilting state, and the sucker unit (7) comprises a sucker head; the mounting table (1) is close to one end of sucking disc unit (7) and is provided with two extension tables, and two extension tables are located the both sides of auto-lock runner (5), the upper surface that one of them extension table is the suction disc head lower surface orientation extends the table upper surface and is provided with flip-chip brush mechanism, and flip-chip brush mechanism is including fixing two opening relative and mutually parallel groove type slide rail (13) at cell body mesa (8) upper surface, sliding connection has same sliding table (12) between two groove type slide rail (13), and the one end that sliding table (12) is close to sucking disc unit (7) is fixed with main motor (11) of slope five degrees, the output shaft top of main motor (11) is fixed with opening upwards and is barreled sliding sleeve axle (10) of structure, and the top mouth of pipe department sliding grafting of sliding sleeve axle (10) has anti-torsion extension pole (27), the top of anti-torsion extension pole (27) is fixed with eccentric brush board (26), the surface of eccentric brush board (26) is parallel to the wafer surface of suction disc head lower surface each other.
2. The flip brush cleaning device according to claim 1, wherein radial bearings (25) are embedded in the mounting hole sites, one side of each counterweight iron ball (23) close to the flip brush mechanism is provided with a vertical tangential surface, the rear side of the upper surface of the mounting table (1) close to the self-locking rotating wheel (5) is fixedly provided with a magnet fixing frame (2), the top end of the magnet fixing frame (2) is clamped with a double-end electromagnet (3), and one end position of the double-end electromagnet (3) close to the self-locking rotating wheel (5) is located on one side of the counterweight iron ball (23) which moves to the rightmost side.
3. The flip brush cleaning device according to claim 1, wherein a circular insertion hole is formed in the middle of the self-locking rotating wheel (5), two rows of mutually parallel annular ball grooves are formed in the circumferential inner wall of the circular insertion hole, and two rows of balls are embedded in the circumferential outer wall of the main transmission pipe (22) at positions close to the annular ball grooves; the side of the self-locking rotating wheel (5) close to the large bearing seat (4) is provided with limit holes distributed equidistantly close to the edge, and the lower surface of the mounting table (1) close to the self-locking rotating wheel (5) is provided with an electric control locating pin matched with the limit holes.
4. The flip brush cleaning device according to claim 1, wherein a return spring (14) is fixed on one side of the sliding table (12) away from the main motor (11), a spring baffle (15) is fixed on one end of the return spring (14) away from the sliding table (12), and two ends of the spring baffle (15) are respectively fixed on the end parts of the two groove-shaped sliding rails (13).
5. The flip brush cleaning device according to claim 1, wherein a plurality of radially distributed grooves are formed on the upper surface of the eccentric brush plate (26), and bristles (28) are provided on the upper surface of the eccentric brush plate (26).
6. The flip brush cleaning device according to claim 1, wherein the bottom end of the anti-twisting extension rod (27) is fixed with a tightening spring (32), and the bottom end of the tightening spring (32) is fixed at the barrel bottom of the sliding sleeve shaft (10).
7. The flip brush cleaning device according to claim 1, wherein a fixed rod is fixed on one side of the upper surface of the sliding table (12) far away from the sucker unit (7), and a high-pressure cleaning spray head (31) is arranged at the top end of the fixed rod; the end of the high-pressure cleaning nozzle (31) faces the lower surface of the sucker unit (7) when rotating to the working position.
8. The flip brush cleaning device according to claim 1, wherein a magnet one (29) is fixed on the lower surface of the short shaft end of the eccentric brush plate (26), and a magnet two (30) attracted with the bottom end of the magnet one (29) is embedded in one side of the top end of the sliding sleeve shaft (10) close to the self-locking rotating wheel (5).
9. The flip brush cleaning device according to claim 1, wherein an axle bracket (18) is fixed on the upper surface of the mounting table (1), a transmission rod (19) extending longitudinally and horizontally is rotatably connected in the middle of the axle bracket (18), a large gear (17) and a small gear are respectively fixed at the front end and the rear end of the transmission rod (19), and a rack push rod (16) meshed with the large gear (17) is fixed at the top end of the sliding table (12); a guide rod frame (20) is fixed at the end part of the mounting table (1), a straight groove guide rod (2101) coaxial with the double-head electromagnet (3) is fixed at the top end of the guide rod frame (20), a magnet sleeve rod (21) is sleeved at the end part of the straight groove guide rod (2101), the magnet sleeve rod (21) is a permanent magnet, and one end of the magnet sleeve rod (21) close to the double-head electromagnet (3) is opposite to the magnetic pole of the magnet sleeve rod; the lower surface of the magnet sleeve rod (21) is provided with a rack (2103) which is meshed with the pinion gear.
10. A flip brush cleaning device according to claim 9, characterized in that the end of the magnet bar (21) is provided with a through-going guiding aperture (2102) and the diameter of the pinion is equal to one tenth of the diameter of the gearwheel (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310813813.1A CN116525507B (en) | 2023-07-05 | 2023-07-05 | Flip-chip brush belt cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310813813.1A CN116525507B (en) | 2023-07-05 | 2023-07-05 | Flip-chip brush belt cleaning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116525507A CN116525507A (en) | 2023-08-01 |
| CN116525507B true CN116525507B (en) | 2023-08-29 |
Family
ID=87401597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310813813.1A Active CN116525507B (en) | 2023-07-05 | 2023-07-05 | Flip-chip brush belt cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116525507B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117276142B (en) * | 2023-11-15 | 2024-02-09 | 拓思精工科技(苏州)有限公司 | Double-sided brushing device for wafer processing |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09321004A (en) * | 1996-05-28 | 1997-12-12 | Sony Corp | Wafer cleaning method and wafer cleaning device |
| JP2006181488A (en) * | 2004-12-27 | 2006-07-13 | Dainippon Screen Mfg Co Ltd | Substrate treatment apparatus and method |
| WO2009154075A1 (en) * | 2008-06-16 | 2009-12-23 | 東京エレクトロン株式会社 | Processing device |
| KR101643508B1 (en) * | 2015-09-18 | 2016-07-27 | 주식회사 아이엠티 | Wafer test machine capable of brush cleaning and laser cleaning |
| JP2018113393A (en) * | 2017-01-13 | 2018-07-19 | 株式会社ディスコ | Wafer cleaning device |
| KR20210115433A (en) * | 2020-03-13 | 2021-09-27 | 에스케이실트론 주식회사 | Wafer polishing apparatus |
| JP2023050877A (en) * | 2021-09-30 | 2023-04-11 | 芝浦メカトロニクス株式会社 | Cleaning device |
-
2023
- 2023-07-05 CN CN202310813813.1A patent/CN116525507B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09321004A (en) * | 1996-05-28 | 1997-12-12 | Sony Corp | Wafer cleaning method and wafer cleaning device |
| JP2006181488A (en) * | 2004-12-27 | 2006-07-13 | Dainippon Screen Mfg Co Ltd | Substrate treatment apparatus and method |
| WO2009154075A1 (en) * | 2008-06-16 | 2009-12-23 | 東京エレクトロン株式会社 | Processing device |
| KR101643508B1 (en) * | 2015-09-18 | 2016-07-27 | 주식회사 아이엠티 | Wafer test machine capable of brush cleaning and laser cleaning |
| JP2018113393A (en) * | 2017-01-13 | 2018-07-19 | 株式会社ディスコ | Wafer cleaning device |
| KR20210115433A (en) * | 2020-03-13 | 2021-09-27 | 에스케이실트론 주식회사 | Wafer polishing apparatus |
| JP2023050877A (en) * | 2021-09-30 | 2023-04-11 | 芝浦メカトロニクス株式会社 | Cleaning device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116525507A (en) | 2023-08-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN116525507B (en) | Flip-chip brush belt cleaning device | |
| CN106362827B (en) | A kind of mosaic tiles porcelain stone grinding device | |
| CN215507994U (en) | Lifting and cleaning device for cleaning shed | |
| CN210695856U (en) | Seed belt cleaning device | |
| CN111616499A (en) | Bed sheet cleaner | |
| CN109392618A (en) | Robot is intelligently cleared up on a kind of playground rubber lawn | |
| CN112122252B (en) | Double-sided dust removal system of textile machine and dust removal method thereof | |
| CN111632960B (en) | Automatic processing equipment is used in processing of PE pipe | |
| CN209564071U (en) | A kind of cloth-handling mechanism and sweeping robot applied in automatic cleaning robot | |
| CN208047981U (en) | A kind of small berries cleaning machine | |
| CN116408282A (en) | Cleaning device for cleaning brush non-contact magnetic levitation transmission assembly | |
| CN109077681A (en) | A kind of porcelain wall cleaning device | |
| CN211437149U (en) | Sweeper for textile equipment | |
| CN113427381A (en) | Tool is used in pinion surface polishing | |
| CN207845797U (en) | A kind of cleaning device for copper strip | |
| CN111136111A (en) | Steel pipe deoiling device | |
| CN115415229B (en) | Medical instrument flushing device | |
| CN115446021B (en) | Semiconductor silicon material cleaning device | |
| CN219113591U (en) | Portable polishing device for heald lifting shaft production | |
| CN108514132A (en) | A kind of small berries cleaning machine | |
| CN113458913B (en) | Rotary type-based grinding device for valve ball | |
| CN214394868U (en) | Wafer cutting device | |
| CN219485253U (en) | Polishing device for semiconductor material production | |
| CN117074397B (en) | Detection equipment for Chinese chives pesticide residues | |
| CN220516500U (en) | Automatic brushing device and brushing equipment for double-sided grinding polishing pad |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |