CN116519706A - Double-loop detection device and detection method thereof - Google Patents

Double-loop detection device and detection method thereof Download PDF

Info

Publication number
CN116519706A
CN116519706A CN202210065159.6A CN202210065159A CN116519706A CN 116519706 A CN116519706 A CN 116519706A CN 202210065159 A CN202210065159 A CN 202210065159A CN 116519706 A CN116519706 A CN 116519706A
Authority
CN
China
Prior art keywords
displacement
detection
displacement mechanism
point
loop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210065159.6A
Other languages
Chinese (zh)
Inventor
高宏典
吕孟恭
陈建名
罗文期
陈庭玮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chroma ATE Suzhou Co Ltd
Original Assignee
Chroma ATE Suzhou Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chroma ATE Suzhou Co Ltd filed Critical Chroma ATE Suzhou Co Ltd
Priority to CN202210065159.6A priority Critical patent/CN116519706A/en
Publication of CN116519706A publication Critical patent/CN116519706A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/89Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8914Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the material examined
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Textile Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)

Abstract

The application provides a double-loop detection device and a detection method thereof, wherein the device at least comprises a test platform, a bearing disc and a detection unit, wherein one side of the test platform is provided with a first displacement mechanism and a third displacement mechanism, and the other side of the test platform is provided with a second displacement mechanism and a fourth displacement mechanism; the first displacement mechanism and the second displacement mechanism drive the bearing disc on one side, the third displacement mechanism and the fourth displacement mechanism drive the bearing disc on the other side, when the bearing discs are staggered in displacement, the third displacement mechanism and the fourth displacement mechanism can displace to enable the bearing discs to avoid each other, further grooves on the bearing discs sequentially pass through the lower part of the detection unit, and the components to be detected in each groove are detected.

Description

Double-loop detection device and detection method thereof
Technical Field
The present invention relates to a dual-loop detection device and a detection method thereof, and more particularly to a detection device and a detection method thereof for detecting appearance defects at the rear end of a semiconductor device process, which have a detection path for running dual-loop by time difference so as to greatly shorten the detection time.
Background
Generally, integrated circuit fabrication is complete and mainly includes initial integrated circuit design and wafer fabrication, intermediate wafer electrical testing, and final testing and product shipment. The detection and classification are a very important ring after the product is manufactured, and in the current tested link, the detection and classification are performed by an automatic device for detecting appearance flaws so as to judge the appearance images captured by the back and front surfaces of the packaged product, thereby ensuring that the appearance of the packaged product meets the required specification after leaving the factory.
In the testing industry, the time cost is a circle of important importance of owners, the testing cost of each object to be tested is calculated by taking seconds as a time unit, so that the most direct way is to use a machine with more simplified and high production (Higher Throughput) without the effort of shortening the testing time and designing a better testing flow, if the testing machine is continuously transported and delayed to wait in the testing process, unnecessary time waste is formed once the scattered time consumed by each component is accumulated under huge yield, and considerable time cost is paid.
The problem of the fine-going detection flow is urgent for the market demand of the semiconductor components at present, the applicant is in charge of the technology of automatic test for many years, the technology is continuously improved in the field, the time spent for transporting the objects to be tested can be greatly saved, the elasticity of the machine is kept, the test flow is changed timely according to the test condition of the objects to be tested, the test productivity of the objects to be tested can be improved, most of the similar test machines are tested by adopting a single track/path, therefore, the double-loop detection method disclosed by the application adopts the design of adopting double tracks/paths on the same test machine, and adopts the time difference to enable the two tracks/paths to be carried complementarily and delayed for waiting time, so that the yield per unit hour of UPH (Unit Per Hour), the capacity and the productivity are improved.
Disclosure of Invention
The technical problem to be solved in the present application is to provide a dual-loop detection method, which includes: setting a picking and placing device, a detection unit, a first displacement device and a second displacement device which are arranged on two sides of the detection unit, a third displacement device and a fourth displacement device which are arranged on the first displacement device and the second displacement device, and a bearing disc which is arranged on the third displacement device and the fourth displacement device; a plurality of first control points are set and are respectively positioned on an X-axis direction of the movement of the first displacement device and the second displacement device; a plurality of second control points are set and are respectively positioned on the third displacement device and a Y-axis direction moved by the fourth displacement device; the first displacement device is displaced upwards in the X-axis direction through each first control point, the third displacement device is displaced upwards in the Y-axis direction through each second control point, each first control point and each second control point where the first displacement device and the third displacement device are located form a first detection loop, and the bearing disc on the third displacement device is arranged on the first detection loop to sequentially finish the actions of placing the component to be detected, detecting operation and removing the component to be detected; the second displacement device is displaced upwards in the X-axis direction through each first control point, the fourth displacement device is displaced upwards in the Y-axis direction through each second control point, and each first control point and each second control point where the second displacement device and the fourth displacement device are located form a second detection loop; after the carrying disc on the first detection loop starts to act for a preset time, the carrying disc on the fourth displacement device sequentially completes the actions of placing the component to be detected, detecting operation and removing the component to be detected on the second detection loop; and the carrying disc on the first detection loop and the carrying disc on the second detection loop are continuously and alternately detected by using the same picking and placing device and the detection unit.
More specifically, a start point, a turning point, a detection start point and a detection completion point are set at each first control point in the X-axis, a pick-and-place point, an avoidance point and a detection point are set at each second control point in the Y-axis, the start point corresponds to the pick-and-place point for performing the actions of placing the component to be tested and removing the component to be tested, and the detection unit is located above the detection point corresponding to the detection start point for performing the detection operation.
More specifically, when the operation of placing the component to be tested is completed and the test operation is to be performed, each carrying tray enters the test starting point again through the starting point and the turning point in the X-axis direction, and when the starting point reaches the turning point, each carrying tray corresponds to the avoidance point.
More specifically, when the detecting operation is completed and the component to be detected is to be removed, each carrying tray returns to the starting point through the detecting completion point, and when the detecting completion point returns to the starting point, each carrying tray corresponds to the avoiding point.
More specifically, the carrying tray on the second detection loop starts each motion of the second detection loop at the turning point after the carrying tray on the first detection loop completes the motion of placing the component to be detected.
More specifically, a distance meter is disposed on the first and second detecting loops, respectively, and the distance meter is used to detect a linear distance between the detecting unit and the component to be detected in advance before the detecting operation is performed, so as to control the detecting unit to adjust the detecting distance.
More specifically, the component to be measured is an image sensor.
A dual-loop detection device at least comprises: the test platform is provided with a first displacement mechanism and a second displacement mechanism at two sides, and the first displacement mechanism and the second displacement mechanism do X-axis displacement on the test platform; the third displacement mechanism is arranged on the first displacement mechanism and is used for carrying out Y-axis displacement on the first displacement mechanism; the fourth displacement mechanism is arranged on the second displacement mechanism, and the fourth displacement mechanism performs Y-axis displacement on the second displacement mechanism; the bearing discs are respectively arranged on the third displacement mechanism and the fourth displacement mechanism, and each bearing disc is provided with a slot for placing at least one component to be tested; the picking and placing mechanism is arranged beside the test platform and used for carrying or placing the component to be tested to the slot position; the detection unit is positioned above the test platform and is used for detecting each component to be tested which passes below the bearing disc; the first displacement mechanism and the second displacement mechanism drive each bearing disc to perform X-axis reciprocating displacement at the opposite sides of the test platform in a staggered manner, when each bearing disc is staggered in the X-axis displacement, the third displacement mechanism and the fourth displacement mechanism can perform Y-axis displacement to enable each bearing disc to avoid each other, and further the groove positions on each bearing disc sequentially pass through the lower part of the detection unit and detect each component to be tested.
In a preferred embodiment, the number of slots on the carrier plate is one or more.
In a preferred embodiment, a distance meter is disposed above the first displacement mechanism and the second displacement mechanism in the X-axis displacement direction.
In a preferred embodiment, each distance meter is provided with a limiting displacement mechanism for driving the distance meter to perform the Y-axis displacement, so as to drive each distance meter to move in a matching manner to a position above each slot, thereby ensuring that each slot sequentially passes through the position below each distance meter to detect the Z-axis linear distance of each component to be tested.
In a preferred embodiment, the first displacement mechanism has a first track mounted on one side of the test platform, a first slider mounted on the first track, and a first driver for driving the first slider, and the second displacement mechanism has a second track mounted on the other side of the test platform, a second slider mounted on the second track, and a second driver for driving the second slider, wherein the first track and the second track are parallel to the X-axis.
In a preferred embodiment, the third displacement mechanism has a third track mounted on the first slider, a third slider mounted on the third track, and a third driver for driving the third slider, and the fourth displacement mechanism has a fourth track mounted on the second slider, a fourth slider mounted on the fourth track, and a fourth driver for driving the fourth slider, wherein the third track and the fourth track are parallel to the Y axis, and each of the carrier plates is mounted on the third slider and the fourth slider, respectively.
Other details of the other functions and embodiments of the present application are described below with reference to the drawings.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic configuration diagram of a dual-loop detection method of the present application;
FIG. 2 is a schematic diagram of each point of the dual-loop detection method of the present application;
FIG. 3 is a partial perspective view of the dual-lane detection apparatus of the present application;
FIG. 4 is a schematic plan view of a portion of a dual-lane detector apparatus of the present application;
FIG. 5 is a schematic partial cross-sectional view of a dual-loop detection device of the present application;
FIG. 6 is a schematic diagram of a bit-back lane of the dual-lane detection apparatus of the present application;
FIG. 7 is a schematic diagram of a bit-shift-back track and area distribution of the dual-track detection device of the present application;
FIG. 8A is a schematic diagram of a first step of implementing the dual-loop detection device of the present application;
FIG. 8B is a schematic diagram of a second step of implementing the dual-loop detection device of the present application;
FIG. 8C is a schematic diagram of a third step of implementing the dual-loop detection device of the present application;
FIG. 8D is a schematic diagram of a fourth step of implementing the dual-loop detection device of the present application;
FIG. 8E is a schematic diagram of a fifth step of implementing the dual-loop detection device of the present application;
FIG. 8F is a schematic diagram of a sixth step of implementing the dual-loop detection device of the present application;
FIG. 8G is a schematic diagram of a seventh step of implementing the dual-loop detection device of the present application;
FIG. 8H is a schematic diagram of an eighth step of implementing the dual-loop detection device of the present application;
FIG. 8I is a schematic diagram of a ninth step of implementing the dual-loop detection device of the present application;
FIG. 8J is a schematic diagram of a tenth step of performing a test of the dual-lane detector apparatus of the present application;
FIG. 8K is a schematic diagram of an eleventh step of implementing the dual-loop detection device of the present application;
FIG. 8L is a schematic diagram of a twelfth step of implementing the dual-loop detection device of the present application;
FIG. 8M is a schematic diagram of a thirteenth step of implementing the dual-loop detection device of the present application;
FIG. 8N is a schematic diagram illustrating a fourteenth step of performing detection of the dual-loop detection apparatus of the present application;
FIG. 8O is a schematic diagram of a fifteenth step of implementing the dual-loop detection device of the present application;
FIG. 8P is a schematic diagram of a sixteenth step of implementing the dual-loop detection device of the present application.
Symbol description
1: test platform 11: first displacement mechanism 111: first track
112: first slider 113: first track 12: second displacement mechanism
121: second rail 122: second slider 123: second track
13: third displacement mechanism 131: third rail 132: third slide block
133: third track 14: fourth displacement mechanism 141: fourth track
142: fourth slider 143: fourth track 2: bearing plate
21: slot 3: pick-and-place mechanism 31: suction nozzle
32: automatic arm 4: the detection unit 5: distance measuring instrument
51: limit displacement mechanism 6: the component A1 to be tested: initial region
A2: avoidance displacement region A3: swivel area 4A: detection area
W1: first detection loop W2: second detection loop X1: starting point
X2: swivel point X3: detecting a starting point X4: detection completion point
Y1: pick-and-place point Y2: avoidance point Y3: detection point
Detailed Description
The positional relationship described in the following embodiments includes: the upper, lower, left and right, unless otherwise indicated, are relative to the orientation of the elements shown in the drawings.
Please refer to fig. 1-2:
a picking and placing device 3, a detecting unit 4, a first displacement device 11 and a second displacement device 12 symmetrically arranged at two sides of the detecting unit 4, a third displacement device 13 and a fourth displacement device 14 symmetrically arranged on the first displacement device 11 and the second displacement device 12, and a bearing disc 2 arranged on the third displacement device 13 and the fourth displacement device 14 are arranged;
a plurality of first control points (X1-X4) are set in the previous step, and are respectively positioned on the X axis direction of the first displacement device 11 and the second displacement device 12;
a plurality of second control points (Y1-Y3) are set in the last step, and are respectively and symmetrically positioned on the third displacement device 13 and a Y axis direction moved by the fourth displacement device 14;
continuing the previous step, the first displacement device 11 is displaced in the X axial direction through each first control point location (X1-X4), the third displacement device 13 is displaced in the Y axial direction through each second control point location (Y1-Y3), each first control point location (X1-X4) where the first displacement device 11 and the third displacement device 13 are located and each second control point location (Y1-Y3) are matched with each other to form a first detection loop W1, and the carrying disc 2 on the third displacement device 13 sequentially completes each actions of placing components to be detected (such as square coating on the carrying disc 2 in the figure), detecting operation and removing the components to be detected on the first detection loop W1;
continuing the previous step, the second displacement device 12 is displaced in the X axial direction by each of the first control points (X1 to X4), the fourth displacement device 14 is displaced in the Y axial direction by each of the second control points (Y1 to Y3), each of the first control points (X1 to X4) where the second displacement device 12 and the fourth displacement device 14 are located and each of the second control points (Y1 to Y3) are matched with each other to form a second detection loop W2, and after the carrier disc 2 on the first detection loop W1 starts to act for a predetermined time, the carrier disc 2 on the fourth displacement device 14 sequentially completes each of the acts of placing the component to be detected, detecting the operation and removing the component to be detected on the second detection loop W2;
the carrier tray on the first detection loop W1 and the carrier tray on the second detection loop W2 are continuously and alternately used for detecting each action by the same pick-and-place device 3 and the detection unit 4.
In the above method, referring to fig. 1 to 2, a start point X1, a rotation point X2, a detection start point X3 and a detection completion point X4 are respectively set at each of the first control points (X1 to X4) in the X-axis direction, and a pick-and-place point Y1, an avoidance point Y2 and a detection point Y3 are respectively set at each of the second control points (Y1 to Y3) in the Y-axis direction, wherein the purposes of each point are as follows:
A. the starting point X1 corresponds to the picking and placing point Y1 and is used for carrying out the actions of placing the component to be tested and removing the component to be tested;
B. the detecting unit 4 is located above the detecting point Y3 corresponding to the detecting start point X3 for performing the detecting operation;
C. when the operation of placing the component to be tested is completed and the detection operation is to be performed, each carrying disc enters the detection starting point X3 through the starting point X1 and the revolving point X2 in the X axis direction, and each carrying disc corresponds to the avoidance point Y2 when the starting point X1 to the revolving point X2;
D. when the detecting operation is completed and the component to be detected is to be removed, each carrying tray returns to the starting point X1 through the detecting completion point X4, and when the detecting completion point X4 returns to the starting point X1, each carrying tray corresponds to the avoidance point Y2;
E. the carrying tray on the second detection loop W2 starts each operation of the second detection loop W2 at the turning point X2 after the carrying tray on the first detection loop W1 completes the operation of placing the component to be tested.
In the above method, a symmetrical distance meter 5 is disposed on the first detection loop W1 and the second detection loop W2, respectively, and before the detection operation is performed, the distance meter 5 is used to detect the linear distance between the component to be detected in advance, so as to control the detection unit 4 to adjust the detection distance.
The detection device of the present application is described below:
as used herein, the articles "a," "an," and "any" refer to grammars of one or more (i.e., at least one) articles. For example, "a component" means one component or more than one component.
As used herein, the term "disposed" describing a combination of structures generally refers to a plurality of structures that are not easily separated or dropped after combination, and may be fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, or directly physically connected, or indirectly connected through an intermediate medium, for example: using threads, tenons, fasteners, nails, adhesives or any combination of high frequency.
As used herein, the terms "protruding," "recessed," "formed," or "extending" describing a structure in combination refer generally to one or more structures being joined together as one body or corresponding structures on one body due to different locations, shapes, and functions.
As used herein, the terms "inboard" and "internal" describing a structural position refer to a position near the center of the structural body, or a position that is not exposed in use; the term "inwardly" refers to toward a central location near the structural body, or toward a location that is not exposed in use; the terms "outboard" and "external" refer to a position away from the center of the structural body, or where exposed above is used; the term "outwardly" refers to toward a central location away from the structural body, or toward a location exposed in use.
As used herein, the term "upper" describing the location of a structure refers to any surface location of the structure, and is not colloquially referred to as "above" or "over" having directionality. The terms "above" and "below" used to describe a structural position refer to the orientation of the structural position as conventionally used.
The apparatus of the present application is useful for implementing the method described above, and the following is a description of the structural configuration of the apparatus:
referring to fig. 3, in this embodiment, the device at least includes a test platform 1, a set of carrier plates 2, a pick-and-place mechanism 3, a detection unit 4 and a set of rangefinders 5;
the test platform 1 is designed as a long rectangle, the long side of the test platform 1 is set as an X-axis, the short side is set as a Y-axis, a first displacement mechanism 11 and a second displacement mechanism 12 are symmetrically arranged on the long sides of the two sides, the first displacement mechanism 11 is provided with a first rail 111 installed on one side of the test platform, a first sliding block 112 installed on the first rail 111 and a first driver 113 for driving the first sliding block 112, the second displacement mechanism 12 is provided with a second rail 121 installed on the other side of the test platform, a second sliding block 122 installed on the second rail 121 and a second driver 123 for driving the second sliding block 122, the first rail 111 and the second rail 121 are all parallel to the X-axis, so that the first displacement mechanism 11 and the second displacement mechanism 12 are displaced on the test platform 1 in the X-axis direction;
referring to fig. 4 to 6, a third displacement mechanism 13 is disposed on the first displacement mechanism 11, the third displacement mechanism 13 has a third rail 131 mounted on the first slider 112, a third slider 132 mounted on the third rail 131, and a third driver 133 for driving the third slider 132, the third rail 131 is parallel to the Y axis, so that the third displacement mechanism 13 performs Y axial displacement on the first displacement mechanism 11, and a first detection loop W1 is designed by using X axis and Y axis displacement action as a path for performing detection on the first displacement mechanism 11 and the third displacement mechanism 13;
that is, the second displacement mechanism 12 is provided with a fourth displacement mechanism 14, the fourth displacement mechanism 14 has a fourth rail 141 mounted on the second slider 122, a fourth slider 142 mounted on the fourth rail 141, and a fourth driver 143 for driving the fourth slider 142, the fourth rail 141 is parallel to the Y axis, so that the fourth displacement mechanism 14 performs Y axial displacement on the second displacement mechanism 12, and a second detection loop W2 is designed by using the displacement action of the X axis and the Y axis as a path for performing detection on the second displacement mechanism 12 and the fourth displacement mechanism 14;
referring to fig. 6 to 7, the test platform 1 is divided into two blocks with the X-axis as the center, and the two blocks are used as the path ranges of the first detection loop W1 and the second detection loop W2, a start area A1, an avoidance displacement area A2, a rotation area A3 and a detection area A4 are symmetrically divided into each block, and the first detection loop W1 and the second detection loop W2 sequentially pass through the start area A1, the avoidance displacement area A2, the rotation area A3 and the detection area A4, enter the detection area A2 again after completing detection, and finally return to the start area A1.
The initial area A1 is a range for the pick-and-place mechanism 3 to perform placement or retrieval of the object to be measured; the avoidance shift region A2 is a safety range in which the first shift mechanism 11 and the second shift mechanism 12 can effectively avoid collision during a shift operation; the rotation area A3 is a safety range for the first displacement mechanism 11 and the second displacement mechanism 12 to rotate during displacement operation; the detection area A4 is a range for the detection unit 4 to perform image capturing detection on the object to be detected, wherein the avoidance shift area A2 is also a range for the range finder 5 to perform focusing distance detection on the object to be detected. In this embodiment, the initial area A1 is set at a position where the test platform 1 is close to one of the short sides while being adjacent to the center of the test platform 1; the turning area A3 is set at the position of the test platform 1 close to the other short side (the other end far from the starting area A1); the detection area A4 is set between the start area A1 and the rotation area A3 and is adjacent to the center of the test platform 1; the avoidance shift region A2 is set outside the start region A1 and the detection region A4.
Referring to fig. 3 to 5, the carrier plates 2 are two in a group and are respectively disposed on the third slider 132 of the third displacement mechanism 13 and the fourth slider 142 of the fourth displacement mechanism 14, and eight slots 21 are concavely disposed on each carrier plate 2 in a configuration of 2X4, and each slot 21 can be used for placing one component 6 to be tested. The pick-and-place mechanism 3 is provided with four suction nozzles 31 corresponding to the single side position (1X 4 arrangement) of each slot 21, and the suction nozzles 31 can simultaneously suck the front faces of the four components 6 to be tested, transfer the components to the upper side of each slot 21 at one side, and then lay the components flat in each slot 21. The number of the slots 21 and the number of the suction nozzles 31 are matched with each other, and the number of the components 6 to be tested that can be transferred on each carrying tray 2 depends on the area of each component 6 to be tested, for example: if the specification of the components 6 to be tested is 10mm x 10mm, the picking and placing mechanism 3 can carry four components 6 to be tested at a time; if the size of the component 6 to be tested is larger 20mm x 20mm, the pick-and-place mechanism 3 only carries two components 6 to be tested at a time (not shown), and so on.
In this embodiment, the Pick-and-Place mechanism 3 is controlled by an robot arm 32, and the robot arm 32 is carried by a Pick-and-Place arm (Pick & Place Handler) with a robot arm or a track, and the front end of the robot arm 32 includes a set of suction nozzles 31 that can be picked and placed by positive and negative pressure adjustment, regardless of the robot arm or the Pick-and-Place arm.
Referring to fig. 3 to 4, the detecting unit 4 is located above the testing platform 1 for detecting the components 6 to be tested passing below each carrier plate 2, the detecting unit 4 is an automatic optical inspection (Automated Optical Inspection, AOI for short), and is a high-speed high-precision optical image detecting system, which uses an optical instrument to obtain the surface state of the finished product, and uses a computer image processing technology to detect defects such as foreign matters or abnormal patterns.
Referring to fig. 3 to 4, the distance meters 5 are disposed on opposite sides of the upper side of the test platform 1 in pairs, and each distance meter 5 is located above the first detection channel W1 and the second detection channel W2, and when each carrying tray 2 carries each component 6 to be tested to pass under each distance meter 5, each distance meter 5 can sequentially detect a height distance between each distance meter 5 and each component 6 to be tested through infrared rays, wherein the height distance is a distance between each distance meter 5 and a central position of each component 6 to be tested;
in this embodiment, eight slots 21 are concavely arranged on the carrier plate 2 in a configuration of 2X4, wherein two rows are arranged in the Y-axis direction, and the distance meters 5 must be able to displace in the Y-axis direction if the to-be-measured components 6 in the slots 21 are to be measured, so a third displacement mechanism 51 is respectively disposed on each distance meter 5, and the limit displacement mechanism 51 is used for driving the distance meters 5 to perform Y-axis horizontal displacement, so that each distance meter 5 can be displaced to a position directly above the center of each to-be-measured component 6 for measuring distance.
The following is an explanation of the operation of performing the test:
referring to fig. 3 (for better illustration of the detection operations, the following description will simplify the first displacement mechanism 11 and the second displacement mechanism 12), the first displacement mechanism 11 is activated prior to the second displacement mechanism 12, and the second displacement mechanism 12 is activated after the first displacement mechanism 11 is activated for a predetermined time or a specific procedure (the condition can be self-defined) is completed, so that the time difference is utilized to sequentially transport each component 6 to be tested on the opposite sides of the test platform 1 on the first detection loop W1 and the second detection loop W2 for detection.
Next, the decomposition operation is described one by one to facilitate understanding of the setting of the time difference:
A. referring to fig. 8A, the first displacement mechanism 11 and the third displacement mechanism 13 enter the initial area A1, and each slot 21 closer to the inner side of the test platform 1 is aligned to the center of the test platform 1 to serve as a target position for placing the components 6 to be tested, and the pick-and-place mechanism 3 sucks four components 6 to be tested at a time and simultaneously places the components 6 to be tested in the target position to complete the placement of the first batch of components 6 to be tested; at this time, the second displacement mechanism 12 and the fourth displacement mechanism 14 are located in the revolving area A3 for standby;
B. referring to fig. 8B, the first displacement mechanism 11 and the third displacement mechanism 13 move out of the initial area A1 and enter the avoidance displacement area A2, move towards the rotation area A3, move the rangefinder 5 on the same side towards the inner side of the test platform 1, and allow the first batch of components 6 to be tested to sequentially pass under the rangefinder 5 on the same side for ranging; the second displacement mechanism 12 and the fourth displacement mechanism 14 move out of the turning area A3 and into the avoidance displacement area A2, and move toward the start area A1;
C. referring to fig. 8C and 8D, the first displacement mechanism 11 and the third displacement mechanism 13 enter the rotation area A3 to rotate and move towards the detection area A4, and when the first lot of components 6 to be detected sequentially pass under the detection unit 4, the detection unit 4 performs image capturing detection one by one to complete the first lot of detection; the second displacement mechanism 12 and the fourth displacement mechanism 14 enter the initial area A1, and the slot 21 closer to the inner side of the test platform 1 is aligned to the center of the test platform 1 to serve as a target position for placing the components 6 to be tested, the pick-and-place mechanism 3 sucks four components 6 to be tested at a time and simultaneously places the components 6 to be tested into the target position to complete the placing action of the components 6 to be tested in the second batch, and then enters the avoidance displacement area A2 for standby;
D. referring to fig. 8E, the first displacement mechanism 11 and the third displacement mechanism 13 move out of the detection area A4 and into the avoidance displacement area A2 after the first batch detection is completed, and move towards the initial area A1; after the first displacement mechanism 11 and the third displacement mechanism 13 enter the avoidance displacement area A2, the second displacement mechanism 12 and the fourth displacement mechanism 14 move towards the rotation area A3, the rangefinder 5 on the same side moves towards the inner side of the test platform 1, and the second batch of components 6 to be tested sequentially pass under the rangefinder 5 on the same side for ranging;
E. referring to fig. 8F and 8G, the first displacement mechanism 11 and the third displacement mechanism 13 enter the initial area A1, and the slots 21 far from the inner side of the test platform 1 are aligned to the center of the test platform 1 to serve as target positions for placing the components 6 to be tested, the pick-and-place mechanism 3 sucks four components 6 to be tested at a time and simultaneously places the components in the target positions to complete the placing of the components 6 to be tested in the third batch, then the first displacement mechanism 11 and the third displacement mechanism 13 perform Y axial displacement to align the slots 21 near to the inner side of the test platform 1 to the center of the test platform 1 to serve as target positions for taking out the components 6 to be tested, and the pick-and-place mechanism 3 enters the target positions to suck four components 6 to be tested in the first batch at a time to complete the pick-up operation of the components 6 to be tested in the first batch and then enter the avoidance displacement area A2; the second displacement mechanism 12 and the fourth displacement mechanism 14 enter the rotation area A3 to rotate and move towards the detection area A4, and when each component 6 to be detected in the second batch passes under the detection unit 4 successively, the detection unit 4 performs image capturing detection one by one to complete the detection in the second batch;
F. referring to fig. 8H, the first displacement mechanism 11 and the third displacement mechanism 13 move towards the rotation area A3, the rangefinder 5 on the same side moves towards the outside of the test platform 1, and the third batch of components 6 to be tested sequentially pass under the rangefinder 5 on the same side for ranging; the second displacement mechanism 12 and the fourth displacement mechanism 14 move out of the detection area A4 and enter the avoidance displacement area A2 after the second batch detection is completed, and move towards the initial area A1;
G. referring to fig. 8I and 8J, the first displacement mechanism 11 and the third displacement mechanism 13 enter the rotation area A3 to rotate and move towards the detection area A4, and when the components 6 to be detected in the third batch sequentially pass under the detection unit 4, the detection unit 4 performs image capturing detection one by one to complete the detection in the third batch; the second displacement mechanism 12 and the fourth displacement mechanism 14 enter the initial area A1, and make the slots 21 far from the inner side of the test platform 1 align with the center position of the test platform 1 to serve as target positions for placing the components 6 to be tested, the pick-and-place mechanism 3 sucks four components 6 to be tested at a time and simultaneously places the components 6 to be tested into the target positions to complete the placement of the components 6 to be tested in the fourth batch, then the first displacement mechanism 11 and the third displacement mechanism 13 do Y axial displacement to make the slots 21 near to the inner side of the test platform 1 align with the center position of the test platform 1 to serve as target positions for picking up the components 6 to be tested, the pick-and-place mechanism 3 enters the target positions to suck four components 6 to be tested in the second batch at a time to complete the pick-up action of the components 6 to be tested in the second batch, and then enters the avoidance displacement area A2 for standby;
H. referring to fig. 8K, the first displacement mechanism 11 and the third displacement mechanism 13 move out of the detection area A4 and into the avoidance displacement area A2 after the third batch of detection is completed, and move towards the initial area A1; after the first displacement mechanism 11 and the third displacement mechanism 13 enter the avoidance displacement area A2, the second displacement mechanism 12 and the fourth displacement mechanism 14 move towards the rotation area A3, the rangefinder 5 on the same side moves towards the outside of the test platform 1, and the fourth batch of components 6 to be tested sequentially pass under the rangefinder 5 on the same side for ranging;
I. referring to fig. 8L and 8M, the first displacement mechanism 11 and the third displacement mechanism 13 enter the initial area A1, and the slots 21 closer to the inner side of the test platform 1 are aligned to the center of the test platform 1 to serve as target positions for placing the components 6 to be tested, the pick-and-place mechanism 3 sucks four components 6 to be tested at a time and simultaneously places the components in the target positions to complete the placement of the fifth components 6 to be tested, then the first displacement mechanism 11 and the third displacement mechanism 13 perform Y axial displacement to align the slots 21 farther from the inner side of the test platform 1 to the center of the test platform 1 to serve as target positions for taking out the components 6 to be tested, and the pick-and-place mechanism 3 enters the target positions to suck four components 6 to be tested of the third batch at a time to complete the pick-up operation of the components 6 to be tested and then enter the avoidance displacement area A2; the second displacement mechanism 12 and the fourth displacement mechanism 14 enter the rotation area A3 to rotate and move towards the detection area A4, and when the fourth batch of components 6 to be detected sequentially pass under the detection unit 4, the detection unit 4 performs image capturing detection one by one to complete the fourth batch of detection;
J. referring to fig. 8N, the first displacement mechanism 11 and the third displacement mechanism 13 move toward the rotation area A3, the rangefinder 5 on the same side moves toward the outside of the test platform 1, and the fifth batch of components 6 to be tested sequentially pass under the rangefinder 5 on the same side for ranging; after the second displacement mechanism 12 and the fourth displacement mechanism 14 complete the fourth batch of detection, they move out of the detection area A4 and enter the avoidance displacement area A2, and move toward the start area A1, please refer to fig. 8O and 8P, after entering the start area A1 and making the slots 21 closer to the inner side of the test platform 1 align with the center position of the test platform 1, so as to serve as a target position for placing the components 6 to be tested, the pick-and-place mechanism 3 sucks four components 6 to be tested at a time and simultaneously places them into the target position, so as to complete the placement of the sixth batch of components 6 to be tested, and then the first displacement mechanism 11 and the third displacement mechanism 13 make Y axial displacement so that the slots 21 farther from the inner side of the test platform 1 align with the center position of the test platform 1, so as to serve as a target position for taking out the components 6 to be tested, and the pick-and-place mechanism 3 enters the target position to suck four components 6 to be tested at a time, so as to complete the pick-and-up of the fourth batch of components 6 to be tested. Follow-up actions the fifth is to repeat the actions of the first, the sixth is to repeat the actions of the second, and so on.
The above examples and/or embodiments are merely for illustrating the preferred examples and/or embodiments for implementing the technology of the present application, and are not limited in any way to the embodiments of the technology of the present application, and any person skilled in the art should be able to make some changes or modifications to other equivalent examples without departing from the scope of the technical means disclosed in the present application, but should still consider the technology or examples substantially identical to the present application.

Claims (13)

1. A dual-loop detection method, comprising:
setting a picking and placing device, a detection unit, a first displacement device and a second displacement device which are arranged on two sides of the detection unit, a third displacement device and a fourth displacement device which are arranged on the first displacement device and the second displacement device, and a bearing disc which is arranged on the third displacement device and the fourth displacement device;
a plurality of first control points are set and are respectively positioned on an X-axis direction of the movement of the first displacement device and the second displacement device;
a plurality of second control points are set and are respectively positioned on a Y-axis direction of the movement of the third displacement device and the fourth displacement device;
the first displacement device is displaced upwards in the X-axis direction through each first control point, the third displacement device is displaced upwards in the Y-axis direction through each second control point, each first control point and each second control point where the first displacement device and the third displacement device are located form a first detection loop, and the bearing disc on the third displacement device is arranged on the first detection loop to sequentially finish the actions of placing the component to be detected, detecting operation and removing the component to be detected;
the second displacement device is displaced upwards in the X-axis direction through each first control point, the fourth displacement device is displaced upwards in the Y-axis direction through each second control point, and each first control point and each second control point where the second displacement device and the fourth displacement device are located form a second detection loop;
after the carrying disc on the first detection loop starts to act for a preset time, the carrying disc on the fourth displacement device sequentially completes the actions of placing the component to be detected, detecting operation and removing the component to be detected on the second detection loop; and
the carrying disc on the first detection loop and the carrying disc on the second detection loop are continuously and alternately detected by using the same picking and placing device and the detection unit.
2. The method of claim 1, wherein each of the first control points in the X-axis is provided with a start point, a rotation point, a detection start point and a detection completion point, each of the second control points in the Y-axis is provided with a pick-and-place point, an avoidance point and a detection point, the start point corresponds to the pick-and-place point for placing the component to be tested and removing the component to be tested, and the detection unit is located above the detection point corresponding to the detection start point for performing the detection operation.
3. The method of claim 2, wherein each of the carriers is moved from the start point to the turn point in the X-axis direction to the start point, and each of the carriers corresponds to the avoidance point when the start point is reached to the turn point.
4. The method of claim 2, wherein each of the carriers returns to the start point via the detection completion point when the detection completion point returns to the start point, and each of the carriers corresponds to the avoidance point when the detection completion point returns to the start point.
5. The method of claim 2, wherein the carrier tray on the second test track starts each operation of the second test track at the turning point after the carrier tray on the first test track completes the operation of placing the component to be tested.
6. The method of claim 2, wherein a distance meter is disposed on the first and second detecting loops, respectively, and the distance meter is used to detect a linear distance between the detecting unit and the component to be detected before the detecting operation is performed, so as to control the detecting unit to adjust the detecting distance.
7. The method of claim 1, wherein the device under test is an image sensor.
8. A dual-loop detection device, comprising:
the test platform is provided with a first displacement mechanism and a second displacement mechanism at two sides, and the first displacement mechanism and the second displacement mechanism do X-axis displacement on the test platform;
the third displacement mechanism is arranged on the first displacement mechanism and is used for carrying out Y-axis displacement on the first displacement mechanism;
the fourth displacement mechanism is arranged on the second displacement mechanism, and the fourth displacement mechanism performs Y-axis displacement on the second displacement mechanism;
the bearing discs are respectively arranged on the third displacement mechanism and the fourth displacement mechanism, and each bearing disc is provided with a slot for placing at least one component to be tested;
the picking and placing mechanism is arranged beside the test platform and used for carrying the component to be tested to the slot position; and
the detection unit is positioned above the test platform and is used for detecting the components to be tested which are positioned on the bearing disc and pass through the lower part;
the first displacement mechanism and the second displacement mechanism drive each bearing disc to perform X-axis reciprocating displacement at the opposite sides of the test platform in a staggered manner, when each bearing disc is staggered in the X-axis displacement, the third displacement mechanism and the fourth displacement mechanism can perform Y-axis displacement to enable each bearing disc to avoid each other, and further the groove positions on each bearing disc sequentially pass through the lower part of the detection unit and detect each component to be tested.
9. The dual-loop detecting device according to claim 8, wherein the first displacement mechanism has a first rail mounted on one side of the test platform, a first slider mounted on the first rail, and a first driver for driving the first slider, and the second displacement mechanism has a second rail mounted on the other side of the test platform, a second slider mounted on the second rail, and a second driver for driving the second slider, both of which are parallel to the X-axis direction.
10. The dual-loop detecting device according to claim 8, wherein the third displacement mechanism has a third rail mounted on the first slider, a third slider mounted on the third rail and a third driver for driving the third slider, the fourth displacement mechanism has a fourth rail mounted on the second slider, a fourth slider mounted on the fourth rail and a fourth driver for driving the fourth slider, the third rail and the fourth rail are parallel to the Y-axis, and each of the carrier plates is mounted on the third slider and the fourth slider, respectively.
11. The dual-loop detection apparatus of claim 8, wherein the number of slots on the carrier plate has one or more than one.
12. The dual-loop detection device according to claim 8, wherein a distance meter is disposed above the first displacement mechanism and the second displacement mechanism in the X-axis displacement direction.
13. The dual-loop detection device of claim 12, wherein each distance meter is provided with a limiting displacement mechanism for driving the distance meter to perform the Y-axis displacement, and the distance meter is driven to cooperatively displace to a position above each slot, so as to ensure that each slot sequentially passes below each distance meter to detect the Z-axis linear distance of each component to be detected.
CN202210065159.6A 2022-01-20 2022-01-20 Double-loop detection device and detection method thereof Pending CN116519706A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210065159.6A CN116519706A (en) 2022-01-20 2022-01-20 Double-loop detection device and detection method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210065159.6A CN116519706A (en) 2022-01-20 2022-01-20 Double-loop detection device and detection method thereof

Publications (1)

Publication Number Publication Date
CN116519706A true CN116519706A (en) 2023-08-01

Family

ID=87406836

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210065159.6A Pending CN116519706A (en) 2022-01-20 2022-01-20 Double-loop detection device and detection method thereof

Country Status (1)

Country Link
CN (1) CN116519706A (en)

Similar Documents

Publication Publication Date Title
TWI682487B (en) Component centralization
US5956134A (en) Inspection system and method for leads of semiconductor devices
CN101308193B (en) Probe apparatus
US5894218A (en) Method and apparatus for automatically positioning electronic dice within component packages
US7724007B2 (en) Probe apparatus and probing method
JPH04233245A (en) System and method for inspection and alignment at semiconductor chip and conductor lead frame
KR101020396B1 (en) Probe apparatus and probing method
KR101338181B1 (en) Device Inspection Apparatus
CN216094907U (en) Sorting device for front-end integrated wafers of semiconductor equipment
CN108288593B (en) Multi-size compatible automatic device for detecting thickness of LED and detection method thereof
KR101275133B1 (en) Flip chip bonding device
KR20130096976A (en) Flip chip bonding device
CN115274484A (en) Wafer detection device and detection method thereof
CN116953590B (en) Omnibearing probe measuring device and method
US8275188B2 (en) System and method for inspecting chips in a tray
US11856705B2 (en) Apparatus for handling components
US20240068955A1 (en) Component inspection
CN116519706A (en) Double-loop detection device and detection method thereof
CN216871901U (en) Double-loop semiconductor component detection system
TWI815281B (en) Dual-loop inspection device and inspection system
US20220102189A1 (en) Apparatus and method for bonding a plurality of dies to a carrier panel
TWM629404U (en) Dual-channel semiconductor component inspection system
KR20220097135A (en) Semiconductor package sawing and sorting apparatus
CN118077043A (en) System and method for sorting dies from a wafer using an angled wafer table and an angled turret
KR20220097136A (en) Semiconductor package sawing and sorting apparatus

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination