CN216871901U - Double-loop semiconductor component detection system - Google Patents

Abstract

The application provides a double-loop semiconductor component detection system, which at least comprises a test platform, a bearing disc and an optical detection device, wherein a first displacement mechanism and a second displacement mechanism are symmetrically arranged on two sides of the test platform; the bearing discs are respectively arranged on the first displacement mechanism and the second displacement mechanism, and each bearing disc is provided with a groove position for horizontally placing a component to be tested; the optical detection equipment is positioned above the test platform and used for detecting each passed component to be detected on the bearing disc; the first displacement mechanism and the second displacement mechanism respectively move along a displacement moving channel, and the first displacement mechanism and the second displacement mechanism are respectively controlled on the displacement moving channels through time difference to sequentially convey the bearing discs, so that the components to be detected sequentially pass through the optical detection equipment for detection.

Description

Double-loop semiconductor component detection system

Technical Field

The present application relates to a dual-circuit semiconductor device inspection system, which is used for detecting appearance defects at the back end of a semiconductor device manufacturing process, and particularly to a system having a detection path for operating dual circuits through a time difference to greatly shorten a detection time.

Background

Generally, a complete ic manufacturing process mainly includes an initial ic design and wafer fabrication, a middle wafer electrical test, and a final test and product shipment at a later stage. In the current testing process, automatic equipment for detecting appearance flaws is used to capture the appearance images of the back and the front of the packaged product for judgment so as to ensure that the appearance of the product can meet the required specification after the product leaves the factory.

The time cost in the testing industry is a ring which is very important for the owner, the testing cost of each object to be tested is calculated by taking seconds as a time unit, so that the purpose of shortening the testing time and designing a better testing process is not fully achieved, the most direct mode is to adopt a machine with more simplification and high Throughput (high Throughput), and if the testing machine is continuously carried and waits for delay in the testing process, the fragmentary time consumed by each component under the condition of large Throughput is accumulated, unnecessary time waste is formed, and considerable time cost is paid.

The applicant of the present invention has been able to improve the testing technique in the field of automatic testing for many years, so as to greatly save the time spent on carrying the object to be tested and maintain the flexibility of the machine, and to change the testing process in due time according to the testing conditions of the object to be tested, thereby improving the testing capacity of the object to be tested.

SUMMERY OF THE UTILITY MODEL

The technical problem to be solved in the present application is to provide a dual-channel semiconductor device inspection system, which at least comprises a test platform, a carrier, a pick-and-place mechanism, and an optical inspection apparatus: the test platform is symmetrically provided with a first displacement mechanism and a second displacement mechanism at two sides; the bearing discs are respectively arranged on the first displacement mechanism and the second displacement mechanism, and each bearing disc is provided with a groove position for horizontally placing at least one component to be tested; the optical detection equipment is positioned above the test platform and used for detecting each passed component to be detected on the bearing disc; the first displacement mechanism and the second displacement mechanism are respectively controlled on the displacement tracks through time difference to sequentially convey the components to be detected on the bearing discs to sequentially pass through the lower part of the optical detection equipment for detection.

In a preferred embodiment, a pair of distance measuring instruments is disposed on two opposite sides above the testing platform, each distance measuring instrument is electrically connected to the optical detection device, and each distance measuring instrument is disposed above each displacement return path, when each carrying tray passes through the lower part of each distance measuring instrument one by one, each distance measuring instrument can sequentially detect a linear distance from each component to be tested, and the linear distance is a distance from each distance measuring instrument to a central position of each component to be tested.

In a preferred embodiment, the number of the slots on the tray is one or more than one, a pair of distance measuring devices is disposed on two opposite sides above the testing platform, each distance measuring device is electrically connected to the optical detection equipment, each distance measuring device is disposed above each displacement return path, and a third displacement mechanism is disposed on each distance measuring device on each side.

In a preferred embodiment, the first displacement mechanism comprises a first axial displacement device for driving the first displacement mechanism to move in a first axial direction in a horizontal direction, and a second axial displacement device for driving the first displacement mechanism to move in a second axial direction in the horizontal direction.

In a preferred embodiment, the second displacement mechanism comprises a first axial displacement device and a second axial displacement device, the first axial displacement device is used for driving the second displacement mechanism to move towards a first axial direction of a horizontal direction, and the second axial displacement device is used for driving the second displacement mechanism to move towards a second axial direction of the horizontal direction.

Other features and embodiments of the present application will be described in detail below with reference to the drawings.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a partial perspective view of a dual-circuit semiconductor device inspection system according to the present application;

FIG. 2 is a schematic plan view of a portion of the dual-circuit semiconductor device inspection system of the present application;

FIG. 3 is a schematic partial cross-sectional view of a dual-loop inspection system according to the present application;

FIG. 4 is a schematic displacement loop of the dual-loop semiconductor device inspection system of the present application;

FIG. 5 is a schematic diagram of displacement loops and area distributions of the dual-loop semiconductor device inspection system of the present application;

FIG. 6A is a schematic diagram of a first step of the dual-circuit semiconductor device inspection system of the present application;

FIG. 6B is a schematic diagram of a second step of the dual-circuit semiconductor device inspection system of the present application;

FIG. 6C is a third step of the inspection process of the dual-circuit semiconductor device inspection system of the present application;

FIG. 6D is a fourth step of the dual-circuit semiconductor device inspection system of the present application;

FIG. 6E is a schematic diagram illustrating a fifth step of performing a testing process in the dual-circuit semiconductor device testing system of the present application;

FIG. 6F is a sixth step of the dual-circuit semiconductor device inspection system of the present application;

FIG. 6G is a seventh step of the dual-circuit semiconductor device inspection system of the present application;

FIG. 6H is a schematic view of an eighth step of performing a testing process in the dual-circuit semiconductor device testing system of the present application;

FIG. 6I is a ninth step of the dual-circuit semiconductor device inspection system of the present application;

FIG. 6J is a schematic diagram illustrating a tenth step in the inspection performed by the dual-circuit semiconductor device inspection system of the present application;

FIG. 6K is a schematic diagram illustrating an eleventh step of performing a dual-circuit semiconductor device inspection system according to the present application;

FIG. 6L is a twelfth step of the dual-circuit semiconductor device inspection system of the present application;

FIG. 6M is a schematic diagram illustrating a thirteenth step of performing the inspection of the dual-circuit semiconductor device inspection system of the present application;

FIG. 6N is a fourteenth step of performing a dual-circuit semiconductor device inspection system according to the present invention;

FIG. 6O is a fifteenth step of the present application for performing a dual-circuit semiconductor device inspection system;

FIG. 6P is a sixteenth step of performing a dual-circuit inspection system for semiconductor devices according to the present invention.

Description of the symbols

1: the test platform 11: first displacement mechanism

111: first axial displacement device 112: second axial displacement device

12: second displacement mechanism 121: first axial displacement device

122: second axial displacement device 2: bearing plate

21: slot position 3: pick and place mechanism

31: the suction nozzle 32: automatic arm

4: the optical detection device 5: distance measuring instrument

51: third displacement mechanism 6: component to be tested

A1: start area a 2: avoidance of displacement region

A3: turning region 4A: detection area

W1: shifted back lane W2: bit moving track

Detailed Description

Other technical matters, features and effects of the present application will become apparent from the following detailed description of preferred embodiments, which is to be read in connection with the accompanying drawings.

As used herein, the articles "a", "an", and "any" refer to the grammatical object of one or more than one (i.e., at least one) of the items. For example, "an element" means one element or more than one element.

As used herein, the term "disposed" used in describing the combination of structures refers to that the structures are not easily separated or dropped after being combined, and can be fixed, detachable, integrally formed, mechanically connected, electrically connected, or directly and indirectly connected through an intermediate medium, such as: using any one of the methods of screw thread, tenon, buckle, nail, adhesive or high frequency.

As used herein, the terms "convex", "concave", "formed" or "extended" describing the combination of structures generally refer to the combination of one or more structures combined into a single body during manufacture or the corresponding structures of the same body due to different positions, shapes and functions.

As used herein, the terms "inside" and "inner" describing a location of a structure refer to a location near the center of the structure's body, or, in use, a location that is not exposed; the term "inwardly" refers to a position toward the center of the structural body, or toward a position not exposed in use; the terms "outside" and "exterior" refer to positions away from the center of the structural body or exposed above the structural body; the term "outwardly" refers to a position that is away from the center of the structural body or exposed in use.

As used herein, the term "above" in describing the location of a structure refers to any surface location of the structure and is not intended to be colloquially referred to as "above" or "overlying" with a directional orientation. The terms "above" and "below" used to describe structure locations refer to the orientation of structure locations as conventionally used.

The following is a description about the structural configuration:

referring to fig. 1, as shown in the figure, the present embodiment at least includes a testing platform 1, a set of carrying trays 2, a pick-and-place mechanism 3, an optical detection device 4 and a set of distance measuring devices 5;

the testing platform 1 is designed to be a long rectangle, the long side of the testing platform 1 is set to be in the X-axis direction, the short side is set to be in the Y-axis direction, and a first displacement mechanism 11 and a second displacement mechanism 12 are symmetrically arranged on the long sides of the two sides;

referring to fig. 2 to 4, the first displacement mechanism 11 includes a first axial displacement device 111 and a second axial displacement device 112, the first axial displacement device 111 is used for driving the first displacement mechanism 11 to perform an X-axis horizontal displacement, the second axial displacement device 112 is used for driving the first displacement mechanism 11 to perform a Y-axis horizontal displacement, and a displacement path W1 is designed by using the X-axis and the Y-axis displacement to serve as a path for the first displacement mechanism 11 to perform a detection;

that is, the first displacement mechanism 11 and the second displacement mechanism 12 are symmetrically configured, and therefore, the second displacement mechanism 12 also includes a first axial displacement device 121 and a second axial displacement device 122, the first axial displacement device 121 is used for driving the second displacement mechanism 12 to perform X-axis horizontal displacement, the second axial displacement device 122 is used for driving the second displacement mechanism 12 to perform Y-axis horizontal displacement, and a displacement path W2 is designed by using the displacement motion of the X-axis and the Y-axis to be used as a path for the second displacement mechanism 12 to perform detection;

referring to fig. 4 to 5, the testing platform 1 is divided into two blocks in half by the center of the X axis to serve as the path range of the two displacement return paths W1/W2, each block is symmetrically divided into a start area a1, an avoidance displacement area a2, a rotation area A3 and a detection area a4, and the displacement return paths W1/W2 sequentially pass through the start area a1, the avoidance displacement area a2, the rotation area A3 and the detection area a4, enter the detection area a4, enter the avoidance displacement area a2 again after completing the detection, and finally return to the start area a 1.

The start area a1 is a range for the pick-and-place mechanism 3 to place or retrieve the object to be tested; the avoidance displacement region a2 is a safe range in which the first displacement mechanism 11 and the second displacement mechanism 12 can effectively avoid collision during displacement operation; the turning area a3 is a safety range for the first displacement mechanism 11 and the second displacement mechanism 12 to turn during displacement; the detection area a4 is a range for the optical detection apparatus 4 to perform image capture detection on the object to be detected, wherein the avoidance displacement area a2 is also a range for the distance meter 5 to perform focus distance detection on the object to be detected. In the present embodiment, the start area a1 is set near one of the short sides of the testing platform 1 and adjacent to the center of the testing platform 1; the turning area A3 is set at the other short side of the test platform 1 (the other end away from the start area a 1); the sensing area a4 is set between the start area a1 and the turn area A3 while being adjacent to the center of the test platform 1; the avoidance displacement area A2 is set outside the initial area A1 and the detection area A4.

Referring to fig. 1 to 3, the two carrier trays 2 are set as a group and are respectively disposed on the first displacement mechanism 11 and the second displacement mechanism 12, each carrier tray 2 is concavely provided with eight slot positions 21 arranged at 2X4, and each slot position 21 can be inserted by one component 6 to be tested. The pick-and-place mechanism 3 is provided with four suction nozzles 31 corresponding to one side of each slot 21 (1X4 configuration), and the suction nozzles 31 can simultaneously suck the front surfaces of four components 6 to be tested and move the front surfaces to the upper side of each slot 21 on one side, and then horizontally place the front surfaces into each slot 21. The number of the slots 21 and the number of the nozzles 31 are matched, and the number of the components 6 to be tested that can be carried on each tray 2 is determined according to the area of each component 6 to be tested, such as: if the specification of the component 6 to be tested is 10mm x 10mm, the pick-and-place mechanism 3 can carry four components 6 to be tested at one time; if the size of the device 6 to be tested is 20mm × 20mm, the pick-and-place mechanism 3 only carries two devices 6 to be tested at a time, and so on.

In the embodiment, the Pick-and-Place mechanism 3 is configured to operate on the periphery of the test platform 1, and the Pick-and-Place mechanism 3 is controlled by an automatic arm 32, and the automatic arm 32 is carried by a robot arm or a Pick-and-Place arm (Pick & Place Handler) with a track, and the front end of the automatic arm 32 includes a set of suction nozzles 31 capable of adjusting Pick-and-Place through positive and negative pressure, regardless of the robot arm or the Pick-and-Place arm.

Referring to fig. 1 to 2, the Optical Inspection apparatus 4 is located above the test platform 1 and is used to inspect the to-be-tested components 6 located below each of the through holes of the carrier tray 2, the Optical Inspection apparatus 4 is an Automatic Optical Inspection (AOI), which is a high-speed and high-precision Optical image Inspection system, and uses an Optical instrument to obtain the surface state of a finished product, and then uses a computer image processing technology to detect defects such as foreign objects or abnormal patterns.

Referring to fig. 1-2, the distance measuring devices 5 are disposed on two opposite sides of the top of the testing platform 1 in pairs, and each distance measuring device 5 is disposed above each displacement return path W1/W2, when each loading tray 2 moves each component 6 to be tested to pass under each distance measuring device 5 in a reciprocating manner, each distance measuring device 5 can sequentially detect the height distance from each component 6 to be tested through infrared rays, wherein the height distance is the distance from each distance measuring device 5 to the center of each component 6 to be tested;

in this embodiment, eight slots 21 are recessed in the carrier tray 2 in a configuration of 2X4, wherein two rows are arranged in the Y-axis direction, and the distance meter 5 must be capable of moving in the Y-axis direction to measure the components 6 to be measured in each slot 21, so that each distance meter 5 is further provided with a third displacement mechanism 51, and the third displacement mechanism 51 is used for driving the distance meter 5 to perform horizontal displacement in the Y-axis direction, so that each distance meter 5 can be displaced to a position right above the center of each component 6 to be measured to measure the distance.

The following is an operational description of the implementation of the detection:

referring to fig. 1 (for more clearly showing the detection operation, the following schematic diagram will be simplified to show the first displacement mechanism 11 and the second displacement mechanism 12), the first displacement mechanism 11 is activated prior to the second displacement mechanism 12, the second displacement mechanism 12 is activated after the first displacement mechanism 11 is activated for a predetermined time or after a specific procedure is completed (conditions can be set by itself), and then the components 6 to be tested are sequentially transported on the two opposite sides of the testing platform 1 by using time differences respectively on the displacement return lanes W1/W2 for detection.

The decomposition actions are described one by one to facilitate understanding of the setting of the time difference:

A. referring to fig. 6A, the first displacement mechanism 11 enters the initial area a1, and aligns the slots 21 closer to the inner side of the testing platform 1 with the center position of the testing platform 1 to serve as target positions for placing the components 6 to be tested, and the pick-and-place mechanism 3 picks up four components 6 to be tested at a time and simultaneously places the components in the target positions to complete the placing of the first batch of components 6 to be tested; at this time, the second displacement mechanism 12 is located in the turning area a3 to stand by;

B. referring to fig. 6B, the first displacement mechanism 11 moves out of the initial area a1 and enters the avoidance displacement area a2, and moves toward the rotation area A3, the distance measuring device 5 on the same side moves toward the inner side of the test platform 1, and the first batch of the components 6 to be measured sequentially pass under the distance measuring device 5 on the same side to measure the distance; the second displacement mechanism 12 moves out of the turning area A3 and into the avoidance displacement area a2, moving towards the starting area a 1;

C. referring to fig. 6C and 6D, the first displacement mechanism 11 enters the rotation area A3 to rotate and moves toward the detection area a4, and when the first batch of the devices 6 to be detected sequentially passes under the optical detection apparatus 4, the optical detection apparatus 4 performs image capture detection one by one to complete the first batch of detection; the second displacement mechanism 12 enters the initial area a1, and aligns the slots 21 closer to the inner side of the test platform 1 with the center position of the test platform 1 to serve as target positions for placing the components 6 to be tested, the pick-and-place mechanism 3 picks up four components 6 to be tested at a time and simultaneously places the components 6 into the target positions to complete the placement of the second batch of components 6 to be tested, and then enters the avoidance displacement area a2 to stand by;

D. referring to fig. 6E, after completing the first batch of tests, the first displacement mechanism 11 moves out of the testing area a4 and enters the avoidance displacement area a2, and moves toward the starting area a 1; after the first displacement mechanism 11 enters the avoidance displacement area a2, the second displacement mechanism 12 moves toward the rotation area A3, the distance measuring device 5 on the same side moves toward the inner side of the test platform 1, and a second batch of the components 6 to be measured successively pass below the distance measuring device 5 on the same side to measure distance;

E. referring to fig. 6F and 6G, the first displacement mechanism 11 enters the initial area a1, and aligns the slots 21 far away from the inner side of the test platform 1 with the center of the test platform 1 to serve as target positions for placing the components 6 to be tested, the pick-and-place mechanism 3 picks up four components 6 to be tested at a time and simultaneously places the components into the target positions to complete the placement of the components 6 to be tested in the third batch, then the first displacement mechanism 11 performs Y-axis displacement to align the slots 21 near the inner side of the test platform 1 with the center of the test platform 1 to serve as target positions for picking up the components 6 to be tested, the pick-and-place mechanism 3 enters the target positions to pick up four components 6 to be tested at a time to complete the picking up of the components 6 in the first batch, and then enters the avoidance displacement area a2 to stand by; the second displacement mechanism 12 enters the rotation area A3 to rotate and moves toward the detection area a4, and when a second batch of the components 6 to be detected successively pass under the optical detection device 4, the optical detection device 4 performs image capture detection one by one to complete a second batch of detection;

F. referring to fig. 6H, the first displacement mechanism 11 moves toward the rotation area a3, the distance measuring devices 5 on the same side move toward the outside of the testing platform 1, and a third set of the components 6 to be tested sequentially pass through the lower portions of the distance measuring devices 5 on the same side to measure distance; after the second batch of detection is completed, the second displacement mechanism 12 moves out of the detection area a4 and enters the avoidance displacement area a2, and moves towards the initial area a 1;

G. referring to fig. 6I and 6J, the first displacement mechanism 11 enters the rotation area A3 to rotate, and moves toward the detection area a4, when each of the third group of the to-be-detected components 6 passes under the optical detection apparatus 4, the optical detection apparatus 4 performs image capture detection one by one to complete the third group of detection; the second displacement mechanism 12 enters the initial area a1, and aligns the slot 21 far from the inner side of the test platform 1 with the center of the test platform 1 to serve as the target position for placing the device 6 to be tested, the pick-and-place mechanism 3 picks up four devices 6 to be tested at a time and simultaneously places the devices in the target position to complete the placement of the fourth group of devices 6 to be tested, then the first displacement mechanism 11 performs Y-axis displacement to align the slot 21 near the inner side of the test platform 1 with the center of the test platform 1 to serve as the target position for picking up the device 6 to be tested, the pick-and-place mechanism 3 enters the target position to pick up four devices 6 to be tested at a time to complete the picking up of the second group of devices 6 to be tested, and then enters the avoidance displacement area a2 to stand by;

H. referring to fig. 6K, after the third batch of detection is completed, the first displacement mechanism 11 moves out of the detection area a4 and enters the avoidance displacement area a2, and moves toward the start area a 1; after the first displacement mechanism 11 enters the avoidance displacement area a2, the second displacement mechanism 12 moves toward the rotation area A3, the distance measuring device 5 on the same side moves toward the outside of the test platform 1, and a fourth set of the components 6 to be measured successively passes under the distance measuring device 5 on the same side to measure distance;

I. referring to fig. 6L and 6M together, the first displacement mechanism 11 enters the initial area a1, and aligns the slots 21 closer to the inner side of the testing platform 1 with the central position of the testing platform 1 to serve as the target position for placing the components 6 to be tested, the pick-and-place mechanism 3 picks up four components 6 to be tested at a time and simultaneously places the components in the target position to complete the placement of the fifth set of components 6 to be tested, then the first displacement mechanism 11 performs Y-axis displacement to align the slots 21 farther from the inner side of the testing platform 1 with the central position of the testing platform 1 to serve as the target position for picking up the components 6 to be tested, the pick-and-place mechanism 3 enters the target position to pick up four components 6 to be tested at a time to complete the picking up of the third set of components 6 to be tested, and then enters the avoidance displacement area a2 to stand by; the second displacement mechanism 12 enters the rotation area A3 to rotate, and moves toward the detection area a4, when a fourth batch of the components 6 to be detected successively pass under the optical detection device 4, the optical detection device 4 captures images one by one to complete a fourth batch of detection;

J. referring to fig. 6N, the first displacement mechanism 11 moves toward the rotation area a3, the distance measuring device 5 on the same side moves toward the outer side of the testing platform 1, and the fifth set of the components 6 to be tested sequentially pass through the lower part of the distance measuring device 5 on the same side to measure the distance; the second displacement mechanism 12, after completing the fourth batch of testing, moves out of the testing area a4 and enters the avoidance displacement area a2, and moves toward the starting area a1, please refer to fig. 6O and 6P, after entering the starting area a1 and aligning each slot 21 closer to the inner side of the testing platform 1 with the central position of the testing platform 1 to serve as the target position for placing the device 6 to be tested, the pick-and-place mechanism 3 picks up four devices 6 to be tested at a time and simultaneously places them at the target position to complete the placement of the sixth batch of devices 6 to be tested, then the first displacement mechanism 11 performs Y-axis displacement to align each slot 21 farther from the inner side of the testing platform 1 with the central position of the testing platform 1 to serve as the target position for picking up the device 6 to be tested, the pick-and-place mechanism 3 enters the target position to pick up the fourth batch of devices 6 to be tested at a time, so as to complete the fourth batch of the components to be tested 6 pick-up action. The fifth batch of the follow-up actions is the action of repeating the first batch, the sixth batch is the action of repeating the second batch, and so on.

The above-described embodiments and/or implementations are only for illustrating the preferred embodiments and/or implementations of the technology of the present application, and are not intended to limit the implementations of the technology of the present application in any way, and those skilled in the art can make modifications or changes to other equivalent embodiments without departing from the scope of the technology disclosed in the present application, but should be construed as technology or implementations substantially the same as the present application.

Claims (7)

1. A dual-loop semiconductor device inspection system, comprising:

the test platform is symmetrically provided with a first displacement mechanism and a second displacement mechanism at two sides;

the bearing discs are respectively arranged on the first displacement mechanism and the second displacement mechanism, and each bearing disc is provided with a groove position for horizontally placing at least one component to be tested; and

the optical detection equipment is positioned above the test platform and used for detecting each passed component to be detected on the bearing disc;

the first displacement mechanism and the second displacement mechanism are respectively controlled on the displacement tracks through time difference to sequentially convey the components to be detected on the bearing discs to sequentially pass through the lower part of the optical detection equipment for detection.

2. The system of claim 1, wherein a pair of distance measuring devices are disposed on opposite sides of the top of the testing platform, each distance measuring device is electrically connected to the optical inspection apparatus, each distance measuring device is disposed above each displacement loop, and each distance measuring device sequentially detects a linear distance to each device under test when each carrier tray sequentially passes under each distance measuring device.

3. The dual-loop semiconductor device inspection system of claim 2, wherein the linear distance is a distance between each of the rangefinders to a center position of each of the devices under inspection.

4. The dual-circuit semiconductor device inspection system of claim 1, wherein the number of slots on the carrier platter is one or more than one.

5. The system of claim 4, wherein a pair of distance measuring devices are disposed on opposite sides of the testing platform, each distance measuring device is electrically connected to the optical inspection apparatus, each distance measuring device is disposed above each displacement track, and a third displacement mechanism is disposed on each distance measuring device on each side, wherein when each tray sequentially passes under each distance measuring device through each displacement track, each third displacement mechanism drives each distance measuring device to move above each slot to ensure that each slot sequentially passes under each distance measuring device to detect the linear distance of each device under inspection.

6. The dual-loop semiconductor device inspection system of claim 1, wherein the first displacement mechanism comprises a first axial displacement device for driving the first displacement mechanism to a first axial displacement in a horizontal direction and a second axial displacement device for driving the first displacement mechanism to a second axial displacement in the horizontal direction.

7. The dual-circuit semiconductor device inspection system of claim 1, wherein the second displacement mechanism comprises a first axial displacement device for driving the second displacement mechanism to a first axial displacement in a horizontal direction and a second axial displacement device for driving the second displacement mechanism to a second axial displacement in the horizontal direction.

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