CN116507024A - Method for manufacturing printed circuit board and printed circuit board - Google Patents
Method for manufacturing printed circuit board and printed circuit board Download PDFInfo
- Publication number
- CN116507024A CN116507024A CN202310237751.4A CN202310237751A CN116507024A CN 116507024 A CN116507024 A CN 116507024A CN 202310237751 A CN202310237751 A CN 202310237751A CN 116507024 A CN116507024 A CN 116507024A
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- Prior art keywords
- copper
- hole
- back drilling
- clad layer
- drilling hole
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- 238000000034 method Methods 0.000 title claims abstract description 65
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 238000005553 drilling Methods 0.000 claims abstract description 204
- 239000000758 substrate Substances 0.000 claims abstract description 75
- 229910052802 copper Inorganic materials 0.000 claims abstract description 59
- 239000010949 copper Substances 0.000 claims abstract description 59
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 58
- 238000007747 plating Methods 0.000 claims description 25
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 15
- 238000009713 electroplating Methods 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 7
- 238000005234 chemical deposition Methods 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 238000007514 turning Methods 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The application provides a manufacturing method of a printed circuit board and the printed circuit board, wherein the method comprises the following steps: providing a substrate, wherein the substrate comprises N copper layers which are arranged in a stacked manner and are not connected with each other; drilling a first back drilling hole on the first side of the substrate, wherein the first back drilling hole penetrates through M1 copper layers; drilling a second back drilling hole on the second side of the substrate, wherein the second back drilling hole penetrates through the M2 copper layers; the first back drilling hole and the second back drilling hole are conical holes; preparing a first copper-clad layer on the wall of the first back drilling hole; preparing a second copper-clad layer on the hole wall of the second back drilling hole; and drilling a through hole in the bottom wall of the first back drilling hole or the bottom wall of the second back drilling hole, wherein the through hole is communicated with the first back drilling hole and the second back drilling hole. According to the printed circuit board wiring structure, the electronic element can be buried in the first back drilling hole and the second back drilling hole, conduction with other circuit layers is achieved, the quantity of copper layers of the non-connectable circuit in the printed circuit board is reduced, the wiring space of the printed circuit board is improved, and the size of the printed circuit board is reduced.
Description
Technical Field
The present disclosure relates to printed circuit board processing technologies, and in particular, to a method for manufacturing a printed circuit board and a printed circuit board.
Background
Printed circuit boards (Printed circuit boards; PCBs), also known as printed circuit boards, are providers of electrical connections for electronic components, and are widely used in a variety of electronic products. As electronic technologies further permeate all industries, more and more electronic technologies tend to be fused, electronic products develop faster and more, and requirements on various aspects of printed circuit boards are higher and more; among them, the development of miniaturization and thinning of the printed circuit board is an important trend.
In order to pre-embed an electronic component on a printed circuit board and connect the electronic component with an internal copper layer, a printed circuit board is provided in the related art, a first side of the printed circuit board is provided with a conical back drilling hole, a second side is communicated with the back drilling hole through a through hole, a copper-clad layer is arranged on a hole wall of the back drilling hole, and the copper-clad layer is not arranged on a hole wall of the through hole. Through the structure, the electronic element can be buried in the conical back drilling hole, the electronic element is conducted with other circuit layers through the copper-clad layer on the wall of the back drilling hole, and the influence of the redundant copper-clad layer on the connecting signal wire can be reduced because the copper-clad layer is not arranged on the wall of the through hole.
However, the printed circuit board adopting the above scheme is large in size and small in wiring space.
Disclosure of Invention
In order to overcome the above-mentioned drawbacks of the related art, an object of the present application is to provide a method for manufacturing a printed circuit board and a printed circuit board, which are beneficial to improving the wiring space of the printed circuit board and reducing the volume of the printed circuit board.
In one aspect, the present application provides a method for manufacturing a printed circuit board, including:
providing a substrate, wherein the substrate comprises N copper layers which are arranged in a laminated manner and are not connected with each other, and an insulating layer is arranged between two adjacent copper layers;
drilling a first back drilling hole on the first side of the substrate, wherein the first back drilling hole penetrates through M1 copper layers along the thickness direction of the substrate; drilling a second back drilling hole on the second side of the substrate, wherein the second back drilling hole penetrates through M2 copper layers along the thickness direction of the substrate, and the first back drilling hole and the second back drilling hole are coaxially arranged; the first back drilling hole and the second back drilling hole are conical holes;
preparing a first copper-clad layer on the hole wall of the first back drilling hole; preparing a second copper-clad layer on the hole wall of the second back drilling hole;
drilling a through hole in the bottom wall of the first back drilling hole or the bottom wall of the second back drilling hole, wherein the through hole is communicated with the first back drilling hole and the second back drilling hole;
wherein M1, M2 and N are all positive integers, and the sum of M1 and M2 is smaller than N.
The method for manufacturing a printed circuit board as described above, optionally, the drilling a first back hole on a first side of the substrate and drilling a second back hole on a second side of the substrate, includes:
machining a first center point on a first side of the substrate; aligning the conical drill bit to the first center point to control the depth back drilling to obtain the first back drilling;
turning over the substrate, processing a second center point on the second side of the substrate, wherein the first center point corresponds to the second center point along the thickness direction of the substrate; and aligning the conical drill bit to the second center point depth-control back drill to obtain the second back drill.
In the method for manufacturing a printed circuit board, optionally, preparing a first copper-clad layer on the hole wall of the first back drilling hole; preparing a second copper-clad layer on the hole wall of the second back drilling hole, wherein the second copper-clad layer comprises the following components:
depositing a first sub-copper-clad layer on the hole wall of the first back drilling hole by adopting a chemical deposition method; electroplating copper on the surface of the first sub-copper-clad layer to obtain the first copper-clad layer;
depositing a second sub-copper-clad layer on the hole wall of the second back drilling hole by adopting a chemical deposition method; and electroplating copper on the surface of the second sub-copper-clad layer to obtain the second copper-clad layer.
The manufacturing method of the printed circuit board comprises the steps of adopting a blind-passing co-plating process to electroplate copper on the surface of the first sub-copper-clad layer to obtain the first copper-clad layer; and electroplating copper on the surface of the second sub-copper-clad layer by adopting a blind-passing co-plating process to obtain the second copper-clad layer.
In the method for manufacturing a printed circuit board as described above, optionally, before the bottom wall of the first back drilling hole or the bottom wall of the second back drilling hole is drilled with a through hole, the through hole is in communication with the first back drilling hole and the second back drilling hole, the method further includes:
preparing a first tin plating layer on the surface of the first copper-clad layer; and preparing a second tin plating layer on the surface of the second copper-clad layer.
In the method for manufacturing a printed circuit board, optionally, a first tin plating layer is prepared on the surface of the first copper-clad layer; after preparing the second tin-plated layer on the surface of the second copper-clad layer, the method further includes:
etching the copper layer on the first side of the substrate and the copper layer on the second side of the substrate to obtain an outer layer circuit.
In the method for manufacturing a printed circuit board as described above, optionally, after the through hole is drilled in the bottom wall of the first back drilling hole or the bottom wall of the second back drilling hole, the through hole is in communication with the first back drilling hole and the second back drilling hole, the method further includes:
and removing the first tin plating layer and the second tin plating layer.
In the method for manufacturing a printed circuit board as described above, the thickness of the first copper-clad layer may be 25 μm or more, and the thickness of the second copper-clad layer may be 25 μm or more.
In another aspect, the present application provides a printed circuit board manufactured using the method of any one of the above.
In the printed circuit board as described above, optionally, in a direction perpendicular to the substrate, a cross-sectional area of the first back drilling hole is gradually increased in a direction away from the through hole, and a cross-sectional area of the second back drilling hole is gradually increased in a direction away from the through hole.
The application provides a manufacturing method of a printed circuit board and the printed circuit board, wherein the method comprises the following steps: providing a substrate, wherein the substrate comprises N copper layers which are arranged in a laminated manner and are not connected with each other, and an insulating layer is arranged between two adjacent copper layers; drilling a first back drilling hole on the first side of the substrate, wherein the first back drilling hole penetrates through M1 copper layers along the thickness direction of the substrate; drilling a second back drilling hole on the second side of the substrate, wherein the second back drilling hole penetrates through M2 copper layers along the thickness direction of the substrate, and the first back drilling hole and the second back drilling hole are coaxially arranged; the first back drilling hole and the second back drilling hole are conical holes; preparing a first copper-clad layer on the wall of the first back drilling hole; preparing a second copper-clad layer on the hole wall of the second back drilling hole; drilling a through hole in the bottom wall of the first back drilling hole or the bottom wall of the second back drilling hole, wherein the through hole is communicated with the first back drilling hole and the second back drilling hole; wherein M1, M2 and N are all positive integers, and the sum of M1 and M2 is smaller than N. According to the method, the first back drilling hole, the second back drilling hole and the through hole are processed in the substrate, the first back drilling hole and the second back drilling hole are conical holes, the first copper-clad layer is arranged on the hole wall of the first back drilling hole, and the second copper-clad layer is arranged on the hole wall of the second back drilling hole, so that the electronic element can be buried in the first back drilling hole and the second back drilling hole, the connection with other circuit layers is realized, the copper-clad layer is not arranged on the hole wall of the through hole, the signal transmission capacity can be improved, and the heat dissipation efficiency is improved; compared with the scheme in the related art, the copper layer quantity of the unconnectable circuit in the printed circuit board is reduced, so that the wiring space of the printed circuit board is increased, and the size of the printed circuit board is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the related art, the following description will briefly describe the drawings that are required to be used in the embodiments or the related technical descriptions, and it is obvious that, in the following description, the drawings are some embodiments of the present application, and other drawings may be obtained according to these drawings without any inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method of manufacturing a printed circuit board according to the related art;
fig. 2 (a) -2 (e) are schematic diagrams corresponding to each step in the manufacturing process of the printed circuit board shown in fig. 1;
fig. 3 is a flowchart of a method for manufacturing a printed circuit board according to an embodiment of the present disclosure;
fig. 4 (a) -4 (d) are schematic diagrams of the printed circuit board shown in fig. 3, corresponding to each step in the manufacturing process;
fig. 5 is a schematic diagram of a printed circuit board according to an embodiment of the present application.
Reference numerals:
100-a substrate; 110-copper layer; 120-an insulating layer; 130-process holes; 131-a copper layer of the process hole; 140-back drilling; 141-back drilling a copper-clad layer; 150-through holes;
200-a first back drilling; 210-a first copper-clad layer;
300-second back drilling; 310-a second copper-clad layer;
400-through holes.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments.
All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure. The following embodiments and features of the embodiments may be combined with each other without conflict.
As described in the background art, in order to pre-embed an electronic component on a printed circuit board and connect the electronic component with an internal copper layer, there is provided a printed circuit board in the related art, in which a first side of the printed circuit board is provided with a tapered back drilling hole, a second side is communicated with the back drilling hole through a through hole, and a copper-clad layer is provided on a wall of the back drilling hole, and no copper-clad layer is provided on a wall of the through hole. Through the structure, the electronic element can be buried in the conical back drilling hole, the electronic element is conducted with other circuit layers through the copper-clad layer on the wall of the back drilling hole, and the influence of the redundant copper-clad layer on the connecting signal wire can be reduced because the copper-clad layer is not arranged on the wall of the through hole.
Specifically, fig. 1 is a flowchart of a method for manufacturing a printed circuit board in the related art; fig. 2 (a) -2 (e) are schematic diagrams of the printed circuit board shown in fig. 1, corresponding to each step in the manufacturing process. Referring to fig. 1, 2 (a) -2 (e), a related art printed circuit board may be manufactured by the following steps:
step S110, providing a substrate, wherein the substrate comprises N copper layers which are arranged in a stacked mode and are not connected with each other, and an insulating layer is arranged between two adjacent copper layers.
As illustrated in fig. 2 (a), the substrate 100 may include a plurality of copper layers 110 and a plurality of insulating layers 120 stacked, and the number N of the copper layers 110 in the substrate 100 may be determined as needed, where N is a positive integer, preferably N is a positive integer greater than or equal to 5. The insulating layer 120 is disposed between two adjacent copper layers 110, and the number of insulating layers 120 may be N-1.
Step S120, a process hole is drilled on the substrate, and the process hole penetrates through the substrate.
Illustratively, as shown in fig. 2 (b), a process hole 130 is provided in the substrate 100 therethrough. The process holes 130 may be machined, for example, by mechanical drilling. Alternatively, the aperture of the process hole 130 is smaller than the aperture of the final through hole (e.g., may be 0.3mm smaller).
Step S130, drilling back holes on the first side of the process holes, wherein the back holes are conical holes, and the back holes penetrate through the M copper layers along the thickness direction of the substrate.
As shown in fig. 2 (c), the back-drilled holes 140 are formed on the first side of the process holes 130, and the back-drilled holes 140 penetrate through the M copper layers 110, where M is a positive integer and M is less than N. That is, the back-drilled holes 140 do not penetrate the substrate 100.
And S140, preparing a back drilling copper-clad layer on the wall of the back drilling hole, and preparing a process hole copper-clad layer on the wall of the process hole.
Illustratively, as shown in fig. 2 (d), a back-drilled copper-clad layer 141 is deposited in the back-drilled hole 140, and a process-hole copper-clad layer 131 is deposited in the process hole 130. In depositing the copper-clad layer, a method of chemical deposition followed by electroplating may be employed.
And S150, secondarily drilling, widening the process hole, and simultaneously removing the copper-clad layer of the process hole to obtain a through hole communicated with the back drilling.
For example, as shown in fig. 2 (e), during secondary drilling, a drill bit with a drill bit size larger than the diameter of the process hole may be selected, and during drilling, the drill bit is preferably aligned with the axis of the process hole to drill, thereby widening the process hole uniformly and obtaining the through hole 150.
However, only one electronic component can be connected in one hole by adopting the scheme, the size of the printed circuit board is large, and the wiring space is small. And the operation of twice drilling the through holes is needed, the same-hole positioning capability of the mechanical drill is poor, the drill is easy to deviate during the secondary drilling, and the copper-clad layer of the process hole is possibly not cleaned.
In view of this, the embodiment of the present application aims to provide a method for manufacturing a printed circuit board and a printed circuit board, by processing a first back drilling hole, a second back drilling hole and a through hole in a substrate, wherein the first back drilling hole and the second back drilling hole are tapered holes, a first copper-clad layer is arranged on the wall of the first back drilling hole, and a second copper-clad layer is arranged on the wall of the second back drilling hole, so that an electronic element can be buried in the first back drilling hole and the second back drilling hole, conduction with other circuit layers is realized, no copper-clad layer is arranged on the wall of the through hole, signal transmission capability can be improved, and heat dissipation efficiency is improved; compared with the scheme in the related art, the copper layer quantity of the unconnectable circuit in the printed circuit board is reduced, so that the wiring space of the printed circuit board is increased, and the size of the printed circuit board is reduced.
The following detailed description of embodiments of the present application will be presented in conjunction with the accompanying drawings to enable one skilled in the art to more fully understand the present application.
Fig. 3 is a flowchart of a method for manufacturing a printed circuit board according to an embodiment of the present disclosure; fig. 4 (a) -4 (d) are schematic diagrams of the printed circuit board shown in fig. 3, which correspond to the steps in the manufacturing process.
Referring to fig. 3, 4 (a) -4 (d), the present embodiment provides a method for manufacturing a printed circuit board, which includes:
step S210, providing a substrate, wherein the substrate comprises N copper layers which are arranged in a stacked mode and are not connected with each other, and an insulating layer is arranged between two adjacent copper layers.
As shown in fig. 4 (a), the substrate 100 of the present embodiment includes a plurality of copper layers 110 and a plurality of insulating layers 120 stacked, where the number N of the copper layers 110 in the substrate 100 may be determined according to need, N is a positive integer, and preferably N is a positive integer greater than or equal to 5. The insulating layer 120 is disposed between two adjacent copper layers 110, and the number of insulating layers 120 may be N-1.
Step S220, drilling a first back drilling hole on the first side of the substrate, wherein the first back drilling hole penetrates through M1 copper layers along the thickness direction of the substrate; drilling a second back drilling hole on the second side of the substrate, wherein the second back drilling hole penetrates through M2 copper layers along the thickness direction of the substrate, and the first back drilling hole and the second back drilling hole are coaxially arranged; the first back drilling hole and the second back drilling hole are conical holes.
Illustratively, as shown in fig. 4 (b), a first side of the substrate 100 is provided with a first back-drilled hole 200, and the first back-drilled hole 200 penetrates M1 copper layers 110. A second back-drilled hole 300 is provided on the second side of the substrate 100, the second back-drilled hole 300 penetrating the M2 copper layers 110. Wherein M1 and M2 are positive integers, and the sum of M1 and M2 is smaller than N. That is, the first back drilling 200 and the second back drilling 300 do not penetrate the substrate 100.
In one possible embodiment, step S120 may be manufactured by the following method:
firstly, processing a first center point on a first side of a substrate; and aiming the conical drill bit at the first center point to control the depth of the back drilling to obtain a first back drilling hole.
Then, turning over the substrate, and processing a second center point on the second side of the substrate, wherein the first center point corresponds to the second center point along the thickness direction of the substrate; and aiming the conical drill bit at a second center point to control the depth of the back drilling to obtain a second back drilling hole.
Step S230, preparing a first copper-clad layer on the hole wall of the first back drilling hole; and preparing a second copper-clad layer on the hole wall of the second back drilling hole.
Illustratively, as shown in fig. 4 (c), a first copper-clad layer 210 is deposited in the first back-drilled hole 200, and a second copper-clad layer 310 is deposited in the second back-drilled hole 300.
In one possible embodiment, step S130 may be manufactured by the following method:
firstly, depositing a first sub-copper-clad layer on the hole wall of a first back drilling hole by adopting a chemical deposition method, and simultaneously depositing a second sub-copper-clad layer on the hole wall of a second back drilling hole, wherein the thickness of the first sub-copper-clad layer is less than or equal to 1 mu m; the thickness of the second sub-copper-clad layer is less than or equal to 1 mu m.
Then, copper is electroplated on the surface of the first sub-copper-clad layer to obtain a first copper-clad layer 210, copper is electroplated on the surface of the second sub-copper-clad layer to obtain a second copper-clad layer 310, and the thickness of the first copper-clad layer 210 is greater than or equal to 25 μm in this embodiment, and the thickness of the second copper-clad layer 310 is greater than or equal to 25 μm.
Optionally, electroplating copper on the surface of the first sub-copper-clad layer by adopting a blind-passing co-plating process to obtain a first copper-clad layer; and electroplating copper on the surface of the second sub-copper-clad layer by adopting a blind-passing co-plating process to obtain the second copper-clad layer so as to reduce the copper electroplating times on the printed circuit board.
Step S240, drilling a through hole in the bottom wall of the first back drilling hole or the bottom wall of the second back drilling hole, wherein the through hole is communicated with the first back drilling hole and the second back drilling hole.
Illustratively, as shown in fig. 4 (d), the first back drilling 200 and the second back drilling 300 are communicated with each other through a through hole 400. Alternatively, the aperture of the through hole 400 may be smaller than that of the first back drilling 200.
In one possible embodiment, step S240 may be manufactured by the following method:
first, a third center point is processed on the bottom wall of the first back drilling hole or the bottom wall of the second back drilling hole, and the third center point is positioned on the axes of the first back drilling hole and the second back drilling hole along the thickness direction of the substrate.
And then drilling by taking the third center point as the center in a laser or mechanical drilling mode to obtain the through hole.
In one possible implementation, before the bottom wall of the first back drilling or the bottom wall of the second back drilling drills a through hole, the method of the present embodiment further includes:
preparing a first tin plating layer on the surface of the first copper-clad layer; and preparing a second tin plating layer on the surface of the second copper-clad layer. The first tin plating layer can protect the first copper-clad layer from subsequent processes, and the second tin plating layer can protect the second copper-clad layer from subsequent processes.
Further, preparing a first tin plating layer on the surface of the first copper-clad layer; after preparing the second tin-plated layer on the surface of the second copper-clad layer, the method of the present embodiment further includes:
and etching the copper layer on the first side of the substrate and the copper layer on the second side of the substrate to obtain an outer layer circuit.
Further, after drilling a through hole in the bottom wall of the first back drilling or the bottom wall of the second back drilling, the through hole being in communication with the first back drilling and the second back drilling, the method of the present embodiment further comprises:
get rid of first tin-plating layer and second tin-plating layer, can get rid of burr between first back drilling and the through-hole, the burr between second back drilling and the through-hole in the lump when getting rid of first tin-plating layer and second tin-plating layer to be favorable to improving the quality of printed circuit board.
According to the embodiment, the first back drilling hole, the second back drilling hole and the through hole are machined in the substrate, the first back drilling hole and the second back drilling hole are conical holes, the first copper-clad layer is arranged on the hole wall of the first back drilling hole, and the second copper-clad layer is arranged on the hole wall of the second back drilling hole, so that the electronic element can be buried in the first back drilling hole and the second back drilling hole, the connection with other circuit layers is realized, the copper-clad layer is not arranged on the hole wall of the through hole, the signal transmission capacity can be improved, and the heat dissipation efficiency is improved; compared with the scheme in the related art, the copper layer quantity of the unconnectable circuit in the printed circuit board is reduced, so that the wiring space of the printed circuit board is increased, and the size of the printed circuit board is reduced.
The embodiment only needs one through hole drilling process, is beneficial to reducing process steps and improving productivity, and has no copper-clad layer in the wall of the through hole, thereby solving the problem of residual copper-clad layer in the through hole in the related technology.
Fig. 5 is a schematic diagram of a printed circuit board according to an embodiment of the present application.
Referring to fig. 5, the present embodiment provides a printed circuit board manufactured by any of the above methods.
Specifically, the printed circuit board includes a substrate 100, a first back drilling hole 200 is disposed on a first side of the substrate 100, and a first copper-clad layer 210 is disposed on a hole wall of the first back drilling hole 200; a second back drilling hole 300 is formed on the second side of the substrate 100, and a second copper-clad layer 310 is formed on the hole wall of the second back drilling hole 300; the first back drilling 200 and the second back drilling 300 are communicated through the through hole 400, and a copper-clad layer is not arranged on the side wall of the through hole 400. In this embodiment, the first back drilling hole 200 and the second back drilling hole 300 are tapered holes, that is, the cross-sectional area of the first back drilling hole 200 increases gradually in a direction away from the through hole 400 and the cross-sectional area of the second back drilling hole 300 increases gradually in a direction away from the through hole 400 along a direction perpendicular to the substrate 100.
In this embodiment, the electronic components may be buried in the first back drilling hole 200 and the second back drilling hole 300, so as to realize conduction with other circuit layers, which is beneficial to reducing the number of copper layers of the unconnectable circuit in the printed circuit board, thereby improving the wiring space of the printed circuit board.
In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.
In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
It should be noted that in the description of the present application, the terms "first," "second," and the like are merely used for convenience in describing the various components and are not to be construed as indicating or implying a sequential relationship, relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature.
In this application, each embodiment or implementation is described in a progressive manner, and each embodiment focuses on a difference from other embodiments, and identical and similar parts between the embodiments are only needed to see each other.
In the description of the present application, descriptions of the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this application, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. A method of manufacturing a printed circuit board, comprising:
providing a substrate, wherein the substrate comprises N copper layers which are arranged in a laminated manner and are not connected with each other, and an insulating layer is arranged between two adjacent copper layers;
drilling a first back drilling hole on the first side of the substrate, wherein the first back drilling hole penetrates through M1 copper layers along the thickness direction of the substrate; drilling a second back drilling hole on the second side of the substrate, wherein the second back drilling hole penetrates through M2 copper layers along the thickness direction of the substrate, and the first back drilling hole and the second back drilling hole are coaxially arranged; the first back drilling hole and the second back drilling hole are conical holes;
preparing a first copper-clad layer on the hole wall of the first back drilling hole; preparing a second copper-clad layer on the hole wall of the second back drilling hole;
drilling a through hole in the bottom wall of the first back drilling hole or the bottom wall of the second back drilling hole, wherein the through hole is communicated with the first back drilling hole and the second back drilling hole;
wherein M1, M2 and N are all positive integers, and the sum of M1 and M2 is smaller than N.
2. The method of manufacturing a printed circuit board of claim 1, wherein drilling a first back borehole in a first side of the substrate and a second back borehole in a second side of the substrate comprises:
machining a first center point on a first side of the substrate; aligning the conical drill bit to the first center point to control the depth back drilling to obtain the first back drilling;
turning over the substrate, processing a second center point on the second side of the substrate, wherein the first center point corresponds to the second center point along the thickness direction of the substrate; and aligning the conical drill bit to the second center point depth-control back drill to obtain the second back drill.
3. The method of manufacturing a printed circuit board according to claim 2, wherein a first copper-clad layer is prepared on the wall of the first back-drilled hole; preparing a second copper-clad layer on the hole wall of the second back drilling hole, wherein the second copper-clad layer comprises the following components:
depositing a first sub-copper-clad layer on the hole wall of the first back drilling hole by adopting a chemical deposition method; electroplating copper on the surface of the first sub-copper-clad layer to obtain the first copper-clad layer;
depositing a second sub-copper-clad layer on the hole wall of the second back drilling hole by adopting a chemical deposition method; and electroplating copper on the surface of the second sub-copper-clad layer to obtain the second copper-clad layer.
4. The method for manufacturing a printed circuit board according to claim 3, wherein copper is electroplated on the surface of the first sub-copper-clad layer by a blind-passing co-plating process to obtain the first copper-clad layer; and electroplating copper on the surface of the second sub-copper-clad layer by adopting a blind-passing co-plating process to obtain the second copper-clad layer.
5. The method of manufacturing a printed circuit board according to any one of claims 1 to 4, wherein the through-hole is drilled in a bottom wall of the first back drilling hole or a bottom wall of the second back drilling hole, the through-hole being in communication with the first back drilling hole and the second back drilling hole, the method further comprising:
preparing a first tin plating layer on the surface of the first copper-clad layer; and preparing a second tin plating layer on the surface of the second copper-clad layer.
6. The method of manufacturing a printed circuit board according to claim 5, wherein a first tin plating layer is prepared on the surface of the first copper-clad layer; after preparing the second tin-plated layer on the surface of the second copper-clad layer, the method further includes:
etching the copper layer on the first side of the substrate and the copper layer on the second side of the substrate to obtain an outer layer circuit.
7. The method of manufacturing a printed circuit board of claim 6, wherein after the bottom wall of the first back drilling or the bottom wall of the second back drilling has drilled a through hole, the through hole communicates with the first back drilling and the second back drilling, the method further comprises:
and removing the first tin plating layer and the second tin plating layer.
8. The method according to claim 1, wherein the first copper-clad layer has a thickness of 25 μm or more and the second copper-clad layer has a thickness of 25 μm or more.
9. A printed circuit board, characterized in that it is manufactured by the method according to any one of claims 1-8.
10. The printed circuit board of claim 9, wherein the cross-sectional area of the first back-drilled hole increases gradually in a direction away from the through-hole and the cross-sectional area of the second back-drilled hole increases gradually in a direction away from the through-hole in a direction perpendicular to the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310237751.4A CN116507024A (en) | 2023-03-10 | 2023-03-10 | Method for manufacturing printed circuit board and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310237751.4A CN116507024A (en) | 2023-03-10 | 2023-03-10 | Method for manufacturing printed circuit board and printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116507024A true CN116507024A (en) | 2023-07-28 |
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ID=87317337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310237751.4A Pending CN116507024A (en) | 2023-03-10 | 2023-03-10 | Method for manufacturing printed circuit board and printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116507024A (en) |
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2023
- 2023-03-10 CN CN202310237751.4A patent/CN116507024A/en active Pending
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