CN116489581A

CN116489581A - Vibration sensor and electronic product

Info

Publication number: CN116489581A
Application number: CN202310445339.1A
Authority: CN
Inventors: 齐利克; 毕训训; 闫文明
Original assignee: Goertek Microelectronics Inc
Current assignee: Goertek Microelectronics Inc
Priority date: 2023-04-23
Filing date: 2023-04-23
Publication date: 2023-07-25

Abstract

The invention discloses a vibration sensor and an electronic product. The vibration sensor comprises a circuit board, an ASIC chip, a vibration pickup assembly and an MEMS sensor; the ASIC chip is arranged on the circuit board and is electrically connected with the circuit board; the vibration pickup assembly is overlapped on the surface of the ASIC chip, which is away from the circuit board; the MEMS sensor is stacked on the surface, away from the ASIC chip, of the vibration pickup assembly, and is electrically connected with the ASIC chip. According to the technical scheme of the invention, other supporting structures are not required to be additionally arranged for supporting and fixing the ASIC chip, the vibration pickup assembly and the MEMS sensor, so that a supporting shell structure for mounting and supporting the MEMS sensor in the prior art is omitted, the purposes of simplifying the internal structure of the vibration sensor and reducing the product size of the vibration sensor are achieved, and the convenience of mounting and application is improved.

Description

Vibration sensor and electronic product

Technical Field

The present invention relates to the field of electronic technologies, and in particular, to a vibration sensor and an electronic product.

Background

Vibration sensors are used to convert vibration signals into electrical signals, for example bone voiceprint sensors use the slight vibration of the head and neck bones caused by a person speaking to collect sound signals into electrical signals. Because it is different from traditional microphone through air conduction collection sound, so can also pass out sound high definition in very noisy environment, with consumer electronics's development, bone voiceprint product's application is more and more extensive.

Bone voiceprint sensors typically include a vibration pickup assembly for picking up external bone vibration signals and a sensor assembly for converting the vibration signals into electrical signals. In the related art, in the bone voiceprint sensing, a supporting shell is arranged above a vibration pickup assembly to support a sensor assembly, so that the bone voiceprint sensor is complex in structure, large in size and unfavorable for the assembly of a complete machine.

Disclosure of Invention

The invention mainly aims to provide a vibration sensor, which aims to simplify the structure of the vibration sensor and reduce the size of a product.

To achieve the above object, the present invention provides a vibration sensor comprising:

a circuit board;

the ASIC chip is arranged on the circuit board and is electrically connected with the circuit board;

the vibration pickup assembly is overlapped on the surface of the ASIC chip, which is away from the circuit board;

and the MEMS sensor is overlapped on the surface of the vibration pickup assembly, which is away from the ASIC chip, and is electrically connected with the ASIC chip.

In an embodiment of the present invention, the vibration pickup assembly includes a vibration ring and a vibration film disposed on the vibration ring, the vibration ring is fixedly mounted on the ASIC chip, and the vibration film is located at one end of the vibration ring away from the ASIC chip;

the MEMS sensor is arranged on one surface of the vibrating diaphragm, which is away from the vibrating ring.

In an embodiment of the invention, the vibrating diaphragm comprises a vibrating area and a connecting area positioned at the peripheral outer edge of the vibrating area, wherein the connecting area is fixed on the vibrating ring, and the vibrating area is suspended in an inner cavity of the vibrating ring;

the MEMS sensor is fixedly connected with the connecting area, and a back cavity is arranged on the MEMS sensor corresponding to the vibration area.

In an embodiment of the invention, the MEMS sensor includes an annular substrate, and a MEMS diaphragm and a back electrode structure disposed on the substrate, wherein the substrate is fixedly connected to a surface of the connection region facing away from the vibration ring, the MEMS diaphragm and the back electrode structure are disposed opposite to the vibration region, and the MEMS diaphragm and the back electrode structure, the substrate and the vibration region enclose to form the back cavity.

In one embodiment of the present invention, the radial dimension of the inner contour of the substrate is not smaller than the radial dimension of the inner contour of the vibrating ring.

In an embodiment of the present invention, a mass is disposed on the vibration area, and the vibration pickup assembly is provided with a first through hole penetrating the mass and the vibration area.

In one embodiment of the present invention, the vibration ring is adhered and fixed to the ASIC chip; and/or the MEMS sensor is adhered and fixed with the vibrating diaphragm.

In an embodiment of the present invention, the ASIC chip has a radial dimension greater than or equal to a radial dimension of the vibration pickup assembly.

In an embodiment of the present invention, the vibration sensor further includes a housing disposed on the circuit board, the housing and the circuit board enclose to form a package structure, the vibration pickup assembly, the MEMS sensor, and the ASIC chip are all disposed in the package structure, and the housing is provided with a venting hole.

In order to achieve the above purpose, the invention also provides an electronic product, which comprises the vibration sensor. The vibration sensor includes:

a circuit board;

In the vibration sensor of the technical scheme, the ASIC chip is arranged on the circuit board, the vibration pickup assembly is overlapped on the surface of the ASIC chip, which is away from the circuit board, and the MEMS sensor is overlapped on the surface of the vibration pickup assembly, which is away from the ASIC chip, so that the ASIC chip can support and fix the ASIC chip, the ASIC chip supports and fixes the vibration pickup assembly, and the vibration pickup assembly supports and fixes the MEMS sensor without additionally arranging other support structures to support and fix the ASIC chip, the vibration pickup assembly and the MEMS sensor, thereby eliminating a support shell structure for installing and supporting the MEMS sensor in the prior art, achieving the purposes of simplifying the internal structure of the vibration sensor and reducing the product size of the vibration sensor, and improving the convenience of installation and application.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a bone voiceprint sensor according to an embodiment of the present invention.

Reference numerals illustrate:

reference numerals	Name of the name	Reference numerals	Name of the name
				1	Circuit board	31	MEMS sensor
2	Vibration pickup assembly	311	Substrate and method for manufacturing the same
				21	Vibrating ring	312	MEMS vibrating diaphragm and back electrode structure
22	Vibrating diaphragm	301	Back cavity
				221	Vibration region	32	ASIC chip
222	Connection region	4	Outer casing
				23	Mass block	401	Air leakage hole
201	First through hole

The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.

Meanwhile, the meaning of "and/or" and/or "appearing throughout the text is to include three schemes, taking" a and/or B "as an example, including a scheme, or B scheme, or a scheme that a and B satisfy simultaneously.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.

The invention provides a vibration sensor, which aims to achieve the purposes of simplifying the internal structure of the vibration sensor and reducing the size of a product by improving the structural layout of a sensor assembly and a vibration pickup assembly and eliminating a supporting shell structure for supporting the sensor assembly. It will be appreciated that the electronic product to which the vibration sensor is applied is not limited to a particular type of product, such as headphones, microphones, head-mounted products or other wearable devices, etc., and the product to which the vibration sensor is applied may not be limited herein. The following will take a vibration sensor as an example of a bone voiceprint sensor.

In an embodiment of the present invention, as shown in fig. 1, the vibration sensor includes a circuit board 1, an ASIC chip 32, a vibration pickup assembly 2, and a MEMS sensor 31.

The ASIC chip 32 is disposed on the circuit board 1 and electrically connected to the circuit board 1;

the vibration pickup assembly 2 is overlapped on the surface of the ASIC chip 32, which is away from the circuit board 1;

the MEMS sensor 31 is stacked on the surface of the vibration pickup assembly 2 facing away from the ASIC chip 32, and the MEMS sensor 31 is electrically connected to the ASIC chip 32.

It can be understood that the circuit board 1 is provided with an internal circuit of the vibration sensor, the vibration pickup assembly 2 is used for collecting bone vibration signals of a user and transmitting the bone vibration signals to the MEMS sensor 31, the MEMS sensor 31 converts the bone vibration signals into electrical signals and transmits the electrical signals to the ASIC chip 32 for amplification, and the amplified signals are transmitted to the circuit board 1 for signal analysis by an external signal processing device. In this embodiment, the ASIC chip 32 is disposed on the circuit board 1, the vibration pickup assembly 2 is disposed on a surface of the ASIC chip 32 facing away from the circuit board 1, and the MEMS sensor 31 is disposed on a surface of the vibration pickup assembly 2 facing away from the ASIC chip 32, that is, in a direction perpendicular to the circuit board 1, the ASIC chip 32, the vibration pickup assembly 2 and the MEMS sensor 31 are stacked, then the circuit board 1 supports and fixes the ASIC chip 32, the ASIC chip 32 supports and fixes the vibration pickup assembly 2, and the vibration pickup assembly 2 supports and fixes the MEMS sensor 31, thereby eliminating a support shell structure for mounting and supporting the MEMS sensor 31 in the prior art, simplifying an internal structure of the vibration sensor, so that a volume of the vibration sensor is more miniaturized, and convenience in mounting and application is improved.

The MEMS sensor 31 is arranged on the surface of the vibration pickup assembly 2, which is away from the ASIC chip 32, and when the vibration pickup assembly 2 picks up bone vibration signals of a user, the bone vibration signals can be directly and rapidly transmitted to the MEMS sensor 31 without additionally arranging vibration transmission channels, so that the transmission path of the vibration signals is reduced, the loss of the vibration signals is further reduced, and the sensitivity of the vibration sensor is improved. In addition, ASIC chip 32, vibration pickup assembly 2 and MEMS sensor 31 stack the setting, compare with setting up ASIC chip 32 in the one side of vibration pickup assembly 2 and MEMS sensor 31, further reduced the area occupied to circuit board 1 to can reduce vibration sensor's product overall dimension, further promote assembly efficiency.

In the practical application process, the connection structure between the ASIC chip 32 and the circuit board 1 may be determined according to the practical situation, for example, the ASIC chip 32 may be adhered to the circuit board 1 by an adhesive layer, in this way, the ASIC chip 32 is electrically connected to the circuit board 1 by a wire, and optionally, the wire is a gold wire or a copper wire. Alternatively, the ASIC chip 32 may be soldered directly to the pads on the circuit board 1 by solder joints in such a way as to achieve both structural fixation and electrical conduction functions.

Optionally, the vibration pickup assembly 2 is adhered to the surface of the ASIC chip 32 by a glue layer.

Optionally, the MEMS transducer 31 is bonded to the surface of the vibration pickup assembly 2 by a glue layer.

In the vibration sensor of the technical scheme of the invention, the ASIC chip 32 is arranged on the circuit board 1, the vibration pickup assembly 2 is overlapped on the surface of the ASIC chip 32, which is far away from the circuit board 1, and the MEMS sensor 31 is overlapped on the surface of the vibration pickup assembly 2, which is far away from the ASIC chip 32, so that the ASIC chip 32 can be supported and fixed by the circuit board 1, the ASIC chip 32 supports and fixes the vibration pickup assembly 2, and the vibration pickup assembly 2 supports and fixes the MEMS sensor 31, and other supporting structures are not required to be additionally arranged to support and fix the ASIC chip 32, the vibration pickup assembly 2 and the MEMS sensor 31, so that the supporting shell structure for installing and supporting the MEMS sensor 31 in the prior art is omitted, the purposes of simplifying the internal structure of the vibration sensor and reducing the product size of the vibration sensor are achieved, and the convenience of installation and application is improved.

In an embodiment of the present invention, referring to fig. 1, the vibration pickup assembly 2 includes a vibration ring 21 and a vibration film 22 disposed on the vibration ring 21, the vibration ring 21 is fixedly mounted on the ASIC chip 32, and the vibration film 22 is located at an end of the vibration ring 21 facing away from the ASIC chip 32; the MEMS sensor 31 is arranged on the side of the diaphragm 22 facing away from the vibrating ring 21.

In this embodiment, the vibration ring 21 plays a role in supporting and tensioning the vibration film 22, the vibration ring 21 is fixedly mounted on the surface of the ASIC chip 32, and the vibration film 22 is connected to the surface of the vibration ring 21 away from the ASIC chip 32, so that the vibration film 22 and the ASIC chip 32 are arranged at intervals, and thus the vibration film 22 cannot be interfered by the ASIC chip 32 when vibrating. The MEMS sensor 31 is disposed on a surface of the diaphragm 22 facing away from the vibration ring 21, and when the vibration sensor is vibrated externally, the vibration sensor drives the diaphragm 22 to vibrate therewith, and then the vibration signal is directly transmitted to the MEMS sensor 31 and converted into an electrical signal.

Optionally, the diaphragm 22 is a plastic film, and is adhered to the surface of the vibrating ring 21 through an adhesive layer.

Alternatively, the vibration ring 21 is adhesively fixed to the surface of the ASIC chip 32, and the vibration ring 21 may be brass, zinc white copper, stainless steel, or the like.

In an embodiment of the present invention, referring to fig. 1, the diaphragm 22 includes a vibration area 221 and a connection area 222 located at a circumferential outer edge of the vibration area 221, the connection area 222 is fixed on the vibration ring 21, and the vibration area 221 is suspended in an inner cavity of the vibration ring 21; the MEMS sensor 31 is fixedly connected with the connection area 222, and the MEMS sensor 31 is provided with a back cavity 301 corresponding to the vibration area 221.

In this embodiment, the vibrating diaphragm 22 is divided into the vibrating area 221 and the connecting area 222, the connecting area 222 is an area fixedly connected with the vibrating ring 21, the vibrating area 221 is an area which is arranged in the connecting area 222 and can vibrate in the vibrating ring 21, the function of supporting and fixing the MEMS sensor 31 by using the vibrating ring 21 is achieved by fixedly connecting the MEMS sensor 31 with the connecting area 222, meanwhile, the MEMS sensor 31 is provided with the back cavity 301 corresponding to the vibrating area 221, when the vibrating sensor is subjected to external vibration, the vibrating area 221 is driven to vibrate along with the vibration area, and then gas in the back cavity 301 is driven to vibrate, the MEMS sensor 31 can pick up gas vibration signals in the back cavity 301 and convert the gas vibration signals into electric signals, and the function of the vibrating sensor for picking up bone vibration signals of a user and converting the bone vibration signals into electric signals is achieved.

It can be understood that the back cavity 301 is disposed at the position of the MEMS sensor 31 corresponding to the vibration area 221, so that the MEMS sensor 31 will not contact with the vibration area 221, and will not affect the vibration of the vibration area 221, thereby ensuring the authenticity of the vibration area 221 and improving the sensitivity of the signal acquisition of the vibration sensor.

Alternatively, the connection region 222 of the diaphragm 22 is adhesively fixed to the vibration ring 21, and the connection region 222 is adhesively fixed to the MEMS sensor 31, for example, by using a DAF (Die Attach Film) adhesive Film.

In an embodiment of the present invention, referring to fig. 1, the MEMS sensor 31 includes a ring-shaped substrate 311 and a MEMS diaphragm and back electrode structure 312 disposed on the substrate 311, wherein the substrate 311 is fixedly connected to a surface of the connection region 222 facing away from the vibrating ring 21, the MEMS diaphragm and back electrode structure 312 is disposed opposite to the vibrating region 221, and the MEMS diaphragm and back electrode structure 312, the substrate 311 and the vibrating region 221 enclose the back cavity 301.

In this embodiment, the substrate 311 plays a role in supporting and fixing the MEMS diaphragm and the back electrode structure 312, and the substrate 311 is fixedly mounted on the vibrating ring 21 and is adhered and fixed to the connection region 222 on the vibrating ring 21 by an adhesive layer. The MEMS diaphragm and back electrode structure 312 is disposed on a side of the substrate 311 away from the diaphragm 22, and the MEMS diaphragm and back electrode structure 312, the substrate 311 and the vibration region 221 enclose to form the back cavity 301, so that when the vibration region 221 vibrates, air pressure in the back cavity 301 can be changed, and thus the MEMS sensor 31 can be stimulated to work, and a function of converting a vibration signal into an electrical signal is realized. In addition, the back cavity 301 of the MEMS sensor 31 is directly connected with the vibration area 221, so that the vibration of the vibration area 221 directly acts on the gas in the back cavity 301, and a vibration transmission channel is not required to be additionally arranged, so that the transmission path of vibration signals is reduced, the loss of the vibration signals is further reduced, and the sensitivity of the vibration sensor is further improved.

It can be appreciated that the substrate 311 is in a ring structure and is fixedly connected to the connection region 222 of the diaphragm 22, so as not to contact with the vibration region 221, thereby not affecting the vibration of the vibration region 221 and ensuring the authenticity of the vibration pickup assembly 2 for collecting the vibration signal. Alternatively, the substrate 311 is a circular ring structure or a square ring structure.

In practical application, the connection structure between the substrate 311 and the vibration ring 21 may be determined according to practical situations, so long as the substrate 311 is ensured not to affect the vibration of the vibration region 221. In one embodiment, the inner radial dimension of the substrate 311 is not smaller than the inner radial dimension of the vibration ring 21. It is understood that the diaphragm 22 is connected to the vibration ring 21, the area in contact with the vibration ring 21 is a connection area 222, the connection area 222 is fixed, the area disposed in the middle of the connection area 222 is a vibration area 221, and the vibration area 221 is an area in the middle of the vibration ring 21 not in contact with the vibration ring 21. Based on this, in order to avoid the substrate 311 from affecting the vibration region 221, the inner-profile radial dimension of the substrate 311 is set to be not smaller than the inner-profile radial dimension of Yu Zhenhuan, so that the substrate 311 is only in contact with the connection region 222, not with the vibration region 221, ensuring the vibration performance of the vibration pickup assembly 2.

In this embodiment, the radial dimension of the inner contour of the substrate 311 is not smaller than the radial dimension of the inner contour of the vibration ring 21, which can be understood that the inner wall of the substrate 311 is flush with the inner wall of the vibration ring 21 in the axial direction; alternatively, the inner wall of the substrate 311 is located between the inner wall and the outer wall of the vibration ring 21. In practical application, considering the stability of the connection structure, the inner wall of the substrate 311 is set to be flush with the inner wall of the vibration ring 21 in the axial direction, so as to ensure the connection area of the end face of the substrate 311 and the end face of the vibration ring 21, and improve the structural reliability.

Further, the outer radial dimension of the substrate 311 is identical to the outer radial dimension of the vibration ring 21. In this embodiment, the radial dimension of the substrate 311 is set to be consistent with the radial dimension of the vibration ring 21, so that the shape and dimension of the end face of the substrate 311 are adapted to the shape and dimension of the end face of the vibration ring 21, and the structural layout of the MEMS sensor 31 and the vibration pickup assembly 2 is more compact while the reliability of the connection structure between the two is ensured.

In an embodiment of the present invention, referring to fig. 1, a mass 23 is disposed on the vibration area 221, and the vibration pickup assembly 2 is provided with a first through hole 201 penetrating the mass 23 and the vibration area 221.

The mass block 23 plays a role in adjusting the vibration of the vibrating diaphragm 22, and the mass block 23 is arranged on the vibration area 221, so that the mass of the vibrating diaphragm 22 can be increased, the acoustic interference is effectively avoided, and the matching between the vibration of the vibrating diaphragm 22 and the bone vibration signal of a wearer is better. The mass 23 may be disposed on the upper surface or the lower surface of the diaphragm 22. In practical application, the mass block 23 can be fixedly combined with the vibrating diaphragm 22 through colloid, the mass block 23 can be made of metal or nonmetal, and the size and the mass of the mass block can be matched according to the performance requirement of the final bone voiceprint recognition sensor.

It can be appreciated that two cavities are provided on two sides of the vibration area 221, in order to prevent the influence of the uneven pressure of the cavities on two sides on the vibration of the vibration area 221, the first through hole 201 is provided to penetrate through the mass block 23 and the vibrating diaphragm 22 so as to conduct the cavities on two sides of the vibration area 221, so that the air pressures of the cavities on two sides of the vibration area 221 are balanced, thereby eliminating the influence on the vibration of the vibration area 221 and improving the sensitivity of signal acquisition.

It should be noted that, the mass 23 is adhered to the vibration area 221 by the colloid, the elastic function of the portion where the vibration area 221 is connected to the mass 23 is reduced, and vibration is achieved by the elastic performance of the portion where the mass 23 is not connected to the vibration area 221, based on this, the first through hole 201 is opened on the mass 23 and penetrates the diaphragm 22, so that compared with the region where the mass 23 is not connected to the vibration area 221, the vibration performance of the diaphragm 22 is not affected, and the vibration pickup performance of the vibration pickup assembly 2 is further improved.

In one embodiment of the present invention, referring to fig. 1, the ASIC chip 32 has an outer radial dimension that is greater than or equal to the outer radial dimension of the vibration pickup assembly 2.

It can be understood that, in this embodiment, the ASIC chip 32, the vibration pickup assembly 2 and the MEMS sensor 31 are stacked in sequence, where the ASIC chip 32 is located at the lowest part (in the direction in the drawing) of the vibration pickup assembly 2 and the MEMS sensor 31, and the radial dimension of the ASIC chip 32 is set to be greater than or equal to the radial dimension of the vibration pickup assembly 2, so that the vibration pickup assembly 2 is all located within the range of the ASIC chip 32, and sufficient supporting strength is ensured, and meanwhile, the ASIC chip 32 can also seal the vibration cavity of the vibration pickup assembly 2, so that the vibration film 22 is not interfered by the outside in the vibration process, and the vibration pickup authenticity of the vibration pickup assembly 2 is ensured.

In addition, the MEMS sensor 31 is disposed on a surface of the vibration pickup assembly 2 facing away from the ASIC chip 32, and then the MEMS sensor 31 and the ASIC chip 32 are disposed at intervals, so that in order to realize that the MEMS sensor 31 is electrically connected with the ASIC chip 32, the outer radial dimension of the ASIC chip 32 is set to be greater than or equal to the outer radial dimension of the vibration pickup assembly 2, so that a part of the ASIC chip 32 is exposed outside the vibration pickup assembly 2, a worker can conveniently install a wire for electrically connecting the MEMS sensor 31, and the electrical conduction function of the MEMS sensor 31 and the ASIC chip 32 is ensured.

In an embodiment of the present invention, referring to fig. 1, the vibration sensor further includes a housing 4 disposed on the circuit board 1, where the housing 4 and the circuit board 1 enclose to form a package structure, and the vibration pickup assembly 2, the MEMS sensor 31, and the ASIC chip 32 are disposed in the package structure, and the housing 4 is provided with a venting hole 401, so as to balance air pressure inside and outside the housing 4 during the manufacturing process of the vibration sensor, and ensure performance of the vibration sensor. It will be appreciated that when the vibration sensor is applied to a product, the venting hole 401 needs to be plugged, that is, after the bone voiceprint recognition sensor of this embodiment is assembled, a procedure needs to be added to plug the venting hole 401. The vent 401 may be sealed by means of a sealant, a tape, a sealing plug, or the like.

Optionally, the housing 4 is a metal piece, and the housing 4 is soldered to the circuit board 1 by solder paste or silver paste.

Alternatively, the bleed holes 401 are micro-scale holes that are laser-processable.

The invention also provides an electronic product, which comprises the vibration sensor, and the specific structure of the vibration sensor refers to the embodiment, and because the electronic product adopts all the technical schemes of all the embodiments, the electronic product at least has all the beneficial effects brought by the technical schemes of the embodiments, and the detailed description is omitted.

Alternatively, the electronic product may be a headset, a microphone, or a wearable device, etc.

The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.

Claims

1. A vibration sensor, comprising:

a circuit board;

2. The vibration sensor of claim 1, wherein the vibration pickup assembly comprises a vibration ring and a vibration film disposed on the vibration ring, the vibration ring being fixedly mounted on the ASIC chip, the vibration film being located at an end of the vibration ring facing away from the ASIC chip;

3. The vibration sensor of claim 2, wherein the diaphragm comprises a vibration region and a connection region located at a circumferential outer edge of the vibration region, the connection region being fixed to the vibration ring, the vibration region being suspended in an inner cavity of the vibration ring;

4. The vibration sensor of claim 3, wherein the MEMS sensor comprises a ring-shaped substrate, and a MEMS diaphragm and a back electrode structure disposed on the substrate, wherein the substrate is fixedly connected to a surface of the connection region facing away from the vibration ring, the MEMS diaphragm and the back electrode structure are disposed opposite to the vibration region, and the MEMS diaphragm and the back electrode structure, the substrate, and the vibration region enclose the back cavity.

5. The vibration sensor of claim 4, wherein the substrate has an inner radial dimension that is not less than an inner radial dimension of the vibration ring.

6. A vibration transducer according to claim 3, wherein the vibration region is provided with a mass, and the vibration pickup assembly is provided with a first through hole extending through the mass and the vibration region.

7. The vibration sensor according to any one of claims 2 to 6, wherein the vibration ring is adhesively fixed to the ASIC chip; and/or the MEMS sensor is adhered and fixed with the vibrating diaphragm.

8. A vibration sensor according to any one of claims 1 to 6, wherein the ASIC chip has a radial dimension greater than or equal to the radial dimension of the vibration pickup assembly.

9. A vibration sensor according to any one of claims 1 to 6, further comprising a housing provided on the circuit board, the housing enclosing with the circuit board to form a package structure, the vibration pickup assembly, the MEMS sensor and the ASIC chip being provided within the package structure, the housing being provided with an air vent.

10. An electronic product comprising a vibration sensor according to any one of claims 1 to 9.