CN116487513A - Production method of COB lamp strip - Google Patents
Production method of COB lamp strip Download PDFInfo
- Publication number
- CN116487513A CN116487513A CN202310482193.8A CN202310482193A CN116487513A CN 116487513 A CN116487513 A CN 116487513A CN 202310482193 A CN202310482193 A CN 202310482193A CN 116487513 A CN116487513 A CN 116487513A
- Authority
- CN
- China
- Prior art keywords
- cob
- chip
- lamp strip
- glue
- fpc board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000005476 soldering Methods 0.000 claims abstract description 12
- 238000004806 packaging method and process Methods 0.000 claims abstract description 11
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- 230000000694 effects Effects 0.000 claims abstract description 8
- 230000001788 irregular Effects 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000000843 powder Substances 0.000 claims abstract description 6
- 238000007790 scraping Methods 0.000 claims abstract description 6
- 238000005507 spraying Methods 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims description 52
- 239000000084 colloidal system Substances 0.000 claims description 12
- 239000003086 colorant Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 230000008859 change Effects 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract 6
- 230000001070 adhesive effect Effects 0.000 abstract 6
- 238000010923 batch production Methods 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 239000000047 product Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 238000010073 coating (rubber) Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Abstract
The invention discloses a production method of a COB lamp strip, which comprises the following steps of S1: fixing the metal tin on a position to be spot-welded on the FPC board by using tin spraying or tin scraping equipment; s2: using semiconductor packaging equipment or die bonding equipment and a chip mounter to fixedly place COB chips, resistors, ICs and other devices on the positions to be spot-welded; s3: carrying out reflow soldering by a laser reflow soldering device or a connection table (buffer device), and fixing the COB chip on the FPC board through tin by high-temperature curing; s5: and mixing the fluorescent powder with one or more adhesives to obtain different fluorescent adhesives, and forming regular or irregular fluorescent adhesives on the surface of the COB chip in a continuous adhesive pulling mode or an intermittent adhesive pulling mode of a self adhesive pulling device. The invention has high production efficiency, low production cost and good light mixing effect, is easy to change the self-luminous color and primary color index of the COB lamp strip, has good control of light color and color temperature, and is beneficial to batch production of the COB lamp strip.
Description
Technical Field
The invention relates to the technical field of COB lamp strips, in particular to a production method of a COB lamp strip.
Background
COB (Chip on Board) technology originated in the 60 s of the last century at the earliest and was an "electrical design" aimed at simplifying the packaging structure of ultra-fine electronic components and improving the stability of the final product. In short, the COB package is constructed by directly bonding the most primitive, bare chip or electronic component to a circuit board and integrally covering the same with a special resin. The COB light source has significant advantages over conventional illumination sources, such as lower power requirements, better driving characteristics, faster response speed, higher shock resistance, longer service life, green environmental protection, etc. At present, most of COB light sources adopt the following two production modes, one is to independently package a single COB chip, and the mode is specifically as follows: and (3) encapsulating the COB chip packaging material on the top of the single COB chip in a dispensing mode, and curing to obtain the light source. And secondly, packaging a plurality of COB chips of the whole lamp strip together, wherein the mode specifically comprises the following steps: and packaging materials to the COB chips in a continuous glue pulling mode at the tops of the COB chips, and curing to obtain the light source. However, the two production modes have low production efficiency, high production cost and poor light mixing effect, and the light color and the color temperature of the COB lamp strip are not well controlled, so that the mass production of the COB lamp strip is not facilitated. Accordingly, there is a need for improvements in the art to avoid the disadvantages of the prior art.
Disclosure of Invention
The invention aims to overcome the defects and shortcomings in the prior art and provide a production method of a COB lamp strip with high production efficiency, low production cost and good luminous effect.
The invention is realized by the following technical scheme:
a production method of a COB lamp strip comprises the following steps,
s1: fixing the metal tin on a position to be spot-welded on the FPC board by using tin spraying or tin scraping equipment;
s2: using semiconductor packaging equipment or die bonding equipment and a chip mounter to fixedly place COB chips, resistors, ICs and other devices on the positions to be spot-welded;
s3: the chip is conveyed by a laser reflow soldering device directly or a connection table (buffer device) for reflow soldering, and after high-temperature solidification, the COB chip is fixed on the FPC board through tin;
s4: the qualified products are tested by an AI detector and flow to the next working procedure, and the unqualified products are repaired;
s5: mixing fluorescent powder with one or more kinds of glue to obtain different fluorescent glue, and forming regular or irregular fluorescent glue on the surface of the COB chip in a continuous glue pulling mode or an intermittent glue pulling mode of a self-glue pulling device;
s6: the self-luminous color and the primary color index of the COB chip are changed by adopting color fluorescent colloid, or the self-luminous color and the primary color index of the COB chip are not changed by adopting white fluorescent colloid;
s7: the finished fluorescent colloid is baked and solidified by high-temperature heating equipment such as a laser furnace or a tunnel furnace, and the like, so that the aim of required softness is fulfilled.
Further, the continuous glue pulling mode specifically comprises the following steps: and according to the shape of the arrangement track of the COB chip on the FPC board, adopting a continuous line drawing and glue pulling mode.
Further, the intermittent glue pulling mode specifically comprises the following steps: and according to the position of the COB chip on the FPC board, adopting a movable dispensing or glue dripping mode.
Further, the high-temperature curing temperature in the step S3 is 100-400 ℃.
Further, one or more circuit boards are arranged on the FPC board.
Further, the COB chip is a COB flip chip.
In step S2, one or more semiconductor packaging devices or die bonding devices or chip mounter are connected and combined together to fix and place COB chips, resistors, ICs and other devices on the positions to be spot-welded.
Further, in S5, fluorescent glue with different colors is coated on the surfaces of COB chips with different light-emitting colors, so as to obtain different light-emitting effects.
Further, the resistor is a chip resistor, and the resistor is coated on the inner side of the fluorescent colloid.
Further, the FPC board is a coiled FPC board, and one or more circuit boards with the width of 3-20 mm and coil-to-coil circuit boards are arranged on the FPC board.
Compared with the prior art, the invention fixes metal tin by using tin spraying or tin scraping equipment, fixes components by using semiconductor packaging equipment or die bonding equipment, uses laser reflow soldering equipment to directly or by conveying through a connection table (buffer equipment) for reflow soldering and high-temperature curing, mixes fluorescent powder and one or more glue to obtain different fluorescent glue, forms regular or irregular fluorescent glue on the surface of the COB chip by a continuous glue pulling mode or an intermittent glue pulling mode of a self-glue pulling equipment, adopts colored fluorescent glue to change the self-luminous color and primary color index of the COB chip or adopts white fluorescent glue to not change the self-luminous color and primary color index of the COB chip, and finally adopts high-temperature heating equipment such as a laser furnace or a tunnel furnace to bake and cure to achieve the aim of required softness.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
Fig. 1 is a production flow chart of a production method of the COB lamp strip of the invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The production method of the COB lamp strip shown in fig. 1 comprises the following steps,
s1: fixing the metal tin on a position to be spot-welded on the FPC board by using tin spraying or tin scraping equipment;
s2: using semiconductor packaging equipment or die bonding equipment and a chip mounter to fixedly place COB chips, resistors, ICs and other devices on the positions to be spot-welded;
s3: the chip is conveyed by a laser reflow soldering device directly or a connection table (buffer device) for reflow soldering, and after high-temperature solidification, the COB chip is fixed on the FPC board through tin;
s4: the qualified products are tested by an AI detector and flow to the next working procedure, and the unqualified products are repaired;
s5: mixing fluorescent powder with one or more kinds of glue to obtain different fluorescent glue, and forming regular or irregular fluorescent glue on the surface of the COB chip in a continuous glue pulling mode or an intermittent glue pulling mode of a self-glue pulling device;
s6: the self-luminous color and the primary color index of the COB chip are changed by adopting color fluorescent colloid, or the self-luminous color and the primary color index of the COB chip are not changed by adopting white fluorescent colloid;
s7: the finished fluorescent colloid is baked and solidified by high-temperature heating equipment such as a laser furnace or a tunnel furnace, and the like, so that the aim of required softness is fulfilled.
The continuous glue pulling mode specifically comprises the following steps: according to the shape of the arrangement track of the COB chip on the FPC board, a continuous line drawing and glue pulling mode is adopted. In specific implementation, the COB chips may be arranged in a straight line, a curved line or an irregular continuous shape, and the glue is continuously pulled according to different shapes of the COB chip arrangement, so as to cover all COB chips and improve the waterproofness and the luminous uniformity.
The intermittent glue pulling mode specifically comprises the following steps: according to the position of the COB chip on the FPC board, a movable dispensing or glue dripping mode is adopted, one or a plurality of COB chips can be singly formed into a group, and according to the position of the COB chip, a single COB chip or a group of COB chips are covered, so that glue pulling materials are saved, and the illumination effect of different COB chips or COB chip groups is improved.
In the implementation, the high-temperature curing temperature in the S3 is 100-400 ℃, so that the curing quality and speed are improved, and the COB chip is stably fixed on the FPC board through tin.
In the specific implementation, one or more circuit boards are arranged on the FPC board, and the whole FPC board is cut into one or more circuit boards after being glued.
In the specific implementation, the COB chip is a COB flip chip, the COB is more resistant to high current and is free of gold wire production, and the mounting and connection are more convenient.
In S2, one or more semiconductor packaging devices or die bonding devices and chip mounter are connected and combined together to fixedly place COB chips, resistors, ICs and other devices on the positions to be spot-welded, and a plurality of machines work together to improve die bonding efficiency.
In S5, fluorescent glue with different colors is coated on the surfaces of COB chips with different luminous colors, so that different luminous effects are obtained, the luminous diversity of the COB lamp strip is improved, and the effects of different brightness and color temperature are achieved.
In the implementation, the resistor is a chip resistor, and the resistor is coated on the inner side of the fluorescent colloid, so that the resistor can be effectively protected from external influences.
The FPC board is coiled FPC board, is equipped with one or more circuit boards and reel-to-reel line boards that are 3mm ~ 20mm wide on the FPC board, does benefit to unreeling, paster, rubber coating, cutting and rolling of FPC board, automatic pipelining, reduction in production cost.
The method comprises the steps of fixing metal tin by using tin spraying or tin scraping equipment, fixing components by using semiconductor packaging equipment or die bonding equipment, directly carrying out reflow soldering by using laser reflow soldering equipment or conveying by a connection table (buffer equipment) and curing at high temperature, mixing fluorescent powder with one or more types of glue to obtain different fluorescent glue, forming regular or irregular fluorescent glue on the surface of a COB chip by using a continuous glue pulling mode or an intermittent glue pulling mode of a self-glue pulling equipment, changing self-luminous color and primary color index of the COB chip by using colored fluorescent glue or not changing self-luminous color and primary color index of the COB chip by using white fluorescent glue, and finally baking and curing by using high-temperature heating equipment such as a laser furnace or a tunnel furnace to achieve the required softness.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (10)
1. A production method of a COB lamp strip is characterized by comprising the following steps: comprises the steps of,
s1: fixing the metal tin on a position to be spot-welded on the FPC board by using tin spraying or tin scraping equipment;
s2: using semiconductor packaging equipment or die bonding equipment and a chip mounter to fixedly place COB chips, resistors, ICs and other devices on the positions to be spot-welded;
s3: the chip is conveyed by a laser reflow soldering device directly or a connection table (buffer device) for reflow soldering, and after high-temperature solidification, the COB chip is fixed on the FPC board through tin;
s4: the qualified products are tested by an AI detector and flow to the next working procedure, and the unqualified products are repaired;
s5: mixing fluorescent powder with one or more kinds of glue to obtain different fluorescent glue, and forming regular or irregular fluorescent glue on the surface of the COB chip in a continuous glue pulling mode or an intermittent glue pulling mode of a self-glue pulling device;
s6: the self-luminous color and the primary color index of the COB chip are changed by adopting fluorescent colloid, or the self-luminous color and the primary color index of the COB chip are not changed by adopting white fluorescent colloid;
s7: the finished fluorescent colloid is baked and solidified by high-temperature heating equipment such as a laser furnace or a tunnel furnace, and the like, so that the aim of required softness is fulfilled.
2. The method for producing a COB lamp strip as claimed in claim 1, wherein: the continuous glue pulling mode specifically comprises the following steps: and according to the shape of the arrangement track of the COB chip on the FPC board, adopting a continuous line drawing and glue pulling mode.
3. The method for producing a COB lamp strip as claimed in claim 1, wherein: the intermittent glue pulling mode specifically comprises the following steps: and according to the position of the COB chip on the FPC board, adopting a movable dispensing or glue dripping mode.
4. The method for producing a COB lamp strip as claimed in claim 1, wherein: the high-temperature curing temperature in the step S3 is 100-400 ℃.
5. The method for producing a COB lamp strip as claimed in claim 1, wherein: one or more circuit boards are arranged on the FPC board.
6. The method for producing a COB lamp strip as claimed in claim 1, wherein: the COB chip is a COB flip chip.
7. The method for producing a COB lamp strip as claimed in claim 1, wherein: in the step S2, one or more semiconductor packaging devices or die bonding devices or chip mounter are connected and combined together to fixedly place COB chips, resistors, ICs and other devices on the positions to be spot-welded.
8. The method for producing a COB lamp strip as claimed in claim 1, wherein: in the step S5, fluorescent glue with different colors is coated on the surfaces of COB chips with different luminous colors, so that different luminous effects are obtained.
9. The method for producing a COB lamp strip as claimed in claim 1, wherein: the resistor is a chip resistor and is coated on the inner side of the fluorescent colloid.
10. The method for producing a COB lamp strip as claimed in claim 1, wherein: the FPC board is a coiled FPC board, and one or more circuit boards with the width of 3-20 mm and coiled pair coiling circuit boards are arranged on the FPC board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310482193.8A CN116487513A (en) | 2023-04-29 | 2023-04-29 | Production method of COB lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310482193.8A CN116487513A (en) | 2023-04-29 | 2023-04-29 | Production method of COB lamp strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116487513A true CN116487513A (en) | 2023-07-25 |
Family
ID=87213617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310482193.8A Pending CN116487513A (en) | 2023-04-29 | 2023-04-29 | Production method of COB lamp strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116487513A (en) |
-
2023
- 2023-04-29 CN CN202310482193.8A patent/CN116487513A/en active Pending
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