CN116469855A - Compact-structure chip efficient heat dissipation device - Google Patents
Compact-structure chip efficient heat dissipation device Download PDFInfo
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- CN116469855A CN116469855A CN202310599982.XA CN202310599982A CN116469855A CN 116469855 A CN116469855 A CN 116469855A CN 202310599982 A CN202310599982 A CN 202310599982A CN 116469855 A CN116469855 A CN 116469855A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 51
- 239000012530 fluid Substances 0.000 claims abstract description 182
- 238000009826 distribution Methods 0.000 claims abstract description 158
- 238000007789 sealing Methods 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 238000005219 brazing Methods 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 abstract description 13
- 238000013461 design Methods 0.000 abstract description 5
- 230000007774 longterm Effects 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 239000002826 coolant Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention relates to a heat dissipating device, in particular to a compact-structure chip high-efficiency heat dissipating device, which encapsulates a chip on a chip substrate, and comprises a sealing top cover, a hot fluid distribution plate, a cold fluid distribution plate and a heat dissipating runner bearing plate; the sealing top cover is covered on the chip substrate, and the chip, the heat dissipation runner bearing plate, the cold fluid distribution plate, the hot fluid distribution plate and the sealing top cover are sequentially and tightly overlapped on the chip substrate; the top surface of the sealing top cover is provided with a cold fluid inlet and a hot fluid outlet. Compared with the prior art, the heat dissipation device solves the problems that the heat dissipation device in the prior art is large in structural volume and difficult to adapt to the small specification and size of the chip, realizes compact design, plays an important role in improving cooling performance and reducing system size, and can effectively maintain long-term uniformity and stability of the temperature of the chip.
Description
Technical Field
The invention relates to a heat dissipation device, in particular to a chip efficient heat dissipation device with a compact structure.
Background
The performance of the computer chip is closely connected with the working temperature of the computer chip. Excessive operating temperatures may lead to unstable chip operation, shortened lifetime, and even chip damage. The chip heat dissipation device is used for transferring heat generated by the chip to the external environment, so that the normal operation of the chip is ensured. Therefore, an efficient and reliable heat sink has a significant position for computers.
Although the air-cooled radiator is the most widely applied radiator type at present, with the continuous improvement of the performance of chips and the increase of the heating value, the problem of heat control is increasingly serious, and the heat dissipation capacity of the air-cooled radiator is not good enough in front of certain chips with high heat flux density.
To address this challenge, flow boiling-based microchannel phase change cooling technology is recognized as one of the advanced technologies with great development potential. The technology can not only remarkably improve the heat transfer coefficient and realize the accurate control of the chip temperature by utilizing the heat transfer mechanism of boiling phase transition and combining the ultrahigh specific surface area characteristic of the micro-channel heat sink, but also effectively reduce the flow rate of cooling fluid and the power consumption of a pump, such as Chinese patent CN212378555U, CN201974078U and the like. The application of the technology has important significance for improving the performance, stability and reliability of the semiconductor chip, and provides key support for the sustainable development of the semiconductor industry.
However, in the current technical application, the phase-change heat dissipation device based on the flow boiling is often large in size, and is difficult to meet the demand of chip miniaturization.
Disclosure of Invention
The invention aims to solve at least one of the problems and provide the chip efficient heat dissipation device with a compact structure, so as to solve the problems that the heat dissipation device in the prior art has larger structure volume and is difficult to adapt to the small specification and size of a chip, realize compact design, play an important role in improving the cooling performance and reducing the system size, and effectively maintain the long-term uniformity and stability of the chip temperature.
The aim of the invention is achieved by the following technical scheme:
a compact-structure chip high-efficiency heat dissipation device packages a chip on a chip substrate and comprises a sealing top cover, a hot fluid distribution plate, a cold fluid distribution plate and a heat dissipation runner bearing plate;
the sealing top cover is covered on the chip substrate, and the chip, the heat dissipation runner bearing plate, the cold fluid distribution plate, the hot fluid distribution plate and the sealing top cover are sequentially and tightly overlapped on the chip substrate;
the top surface of the sealing top cover is provided with a cold fluid inlet and a hot fluid outlet;
the hot fluid distribution plate comprises a hot fluid distribution inlet, a hot fluid collection channel, a hot fluid collection outlet and a cold fluid guide hole; the heat flow collecting channel is communicated with the heat flow distribution inlet and the heat flow collecting outlet, and the heat flow outlet is communicated with the heat flow collecting outlet; the cold fluid inlet is communicated with the cold fluid guide hole;
the cold fluid distribution plate comprises a cold fluid distribution inlet, a cold fluid distribution channel, a cold fluid distribution outlet and a hot fluid guide channel; the cold flow distribution channel is communicated with a cold flow distribution inlet and a cold flow distribution outlet, and the cold flow distribution inlet is communicated with a cold flow guide hole; the hot fluid guide channel is communicated with the hot fluid distribution inlet;
the surface of the heat dissipation runner bearing plate is provided with a micro-channel array cluster, the center of the heat dissipation runner bearing plate is communicated with the cold flow distribution outlet, and the boundary of the heat dissipation runner bearing plate is communicated with the hot fluid guide channel.
Preferably, the heat flow collecting channel is in a tree structure, so that one-to-many communication between the heat flow distribution inlet and the heat flow collecting outlet is realized.
Preferably, the ratio of the depth of the heat flow collecting channel to the thickness of the heat fluid distribution plate is 0.1-0.9.
Preferably, the cold flow distribution channel is in a binary structure, so that one-to-many communication between the cold flow distribution inlet and the cold flow distribution outlet is realized.
Preferably, the ratio of the depth of the cold flow distribution channel to the thickness of the cold flow distribution plate is 0.1 to 0.9.
Preferably, the heat fluid guiding channel is an annular groove body with a notch, and the heat fluid distribution inlet is arranged in an annular through structure with a notch corresponding to the heat fluid guiding channel.
Preferably, the ratio of the depth of the cold flow distribution inlet to the thickness of the cold flow distribution plate is 0.1 to 0.9.
Preferably, the thickness ratio of the hot fluid distribution plate to the cold fluid distribution plate is 0.1-10, and the thickness ratio of the cold fluid distribution plate to the heat dissipation runner carrier plate is 0.1-10.
Preferably, the cold fluid inlet and the hot fluid outlet are sealed threaded joints.
Preferably, the heat dissipation runner carrier plate and the chip are welded and fixed through a brazing layer, the cold fluid distribution plate and the heat dissipation runner carrier plate are welded and fixed, the hot fluid distribution plate and the cold fluid distribution plate are welded and fixed, and the sealing top cover is welded and fixed with the hot fluid distribution plate.
The working principle of the invention is as follows:
cold flow is input into a cold flow distribution inlet of a cold flow distribution plate from a cold flow inlet through a cold flow guide hole, distributed to each cold flow distribution outlet through a cold flow distribution channel and input into the center of each micro-channel unit on a heat dissipation flow channel bearing plate;
the fluid flows from the center of the micro-channel unit to the boundary along the micro-channel and exchanges heat with the chip;
the heat fluid flowing to the boundary of the micro-channel unit after heat exchange is input into the heat flow distribution inlets of the heat fluid distribution plate through the heat fluid guide channel, and the heat flow input by each heat flow distribution inlet is collected by the heat flow collection channel and then output from the heat dissipating device through the heat fluid outlet after being collected at the heat flow collection outlet.
Compared with the prior art, the invention has the following beneficial effects:
the invention combines the heat dissipation runner and the chip top cover tightly by using the welding process integrated forming technology, and simultaneously fixes the heat dissipation equipment on the top of the integrated circuit chip (bare chip, DIE) by using the brazing process. The method can remarkably improve the compactness of the system, and the cold flow entering the cooling area can be quickly in place and exchange heat by dividing the preset mark of the cooling area, so that the heat dispersion caused by overlarge space is reduced, the cooling capacity is directly and uniformly acted on the high-temperature core area, the cooling performance of the cooling device is effectively improved, and the temperature of the chip is kept uniform and stable.
In addition, the invention effectively saves the internal space of the computer case, thereby further improving the integration level and the expandability of the computer; and the highly integrated design greatly simplifies the installation flow of a user, reduces the risk of liquid leakage caused by improper installation of the user, and enhances the compatibility of the radiator to various chassis models.
Drawings
FIG. 1 is a schematic diagram of a heat dissipating device mounted on a chip substrate at one view;
FIG. 2 is a schematic diagram of a heat dissipating device mounted on a chip substrate at another view angle;
FIG. 3 is a schematic side sectional structure of a heat sink mounted on a chip substrate;
FIG. 4 is a schematic view of a thermal fluid distribution plate;
FIG. 5 is a schematic illustration of fluid distribution on a hot fluid distribution plate;
FIG. 6 is a schematic view of a cold fluid distribution plate;
FIG. 7 is a schematic illustration of fluid distribution on a cold fluid distribution plate;
FIG. 8 is a schematic view of a heat dissipation runner carrier plate;
FIG. 9 is a schematic diagram of a configuration of one of the micro-channel units of a micro-channel array cluster;
in the figure: 1: a cold fluid inlet; 2: a hot fluid outlet; 3: sealing the top cover; 4: a chip substrate; 5: a hot fluid distribution plate; 5-1: a heat flow distribution inlet; 5-2: a heat flow collection channel; 5-3: a heat flow collection outlet; 5-4: cold fluid guiding holes; 6: a cold fluid distribution plate; 6-1: a cold flow distribution inlet; 6-2: a cold flow distribution channel; 6-3: a cold flow dispensing outlet; 6-4: a hot fluid guide channel; 7: a heat dissipation runner bearing plate; 8: a brazing layer; 9: and a chip.
Detailed Description
The invention will now be described in detail with reference to the drawings and specific examples.
Example 1
As shown in fig. 1-9, the heat dissipating device encapsulates a chip 9 on a chip substrate 4, and comprises a sealing top cover 3, a hot fluid distribution plate 5, a cold fluid distribution plate 6 and a heat dissipating runner carrier plate 7;
the sealing top cover 3 is covered on the chip substrate 4, and the chip 9, the heat dissipation runner bearing plate 7, the cold fluid distribution plate 6, the hot fluid distribution plate 5 and the sealing top cover 3 are sequentially and tightly overlapped on the chip substrate 4;
the top surface of the sealing top cover 3 is provided with a cold fluid inlet 1 and a hot fluid outlet 2;
the hot fluid distribution plate 5 comprises a hot fluid distribution inlet 5-1, a hot fluid collecting channel 5-2, a hot fluid collecting outlet 5-3 and a cold fluid guide hole 5-4; the heat flow collecting channel 5-2 is communicated with the heat flow distribution inlet 5-1 and the heat flow collecting outlet 5-3, and the heat flow outlet 2 is communicated with the heat flow collecting outlet 5-3; the cold fluid inlet 1 is communicated with the cold fluid guide hole 5-4;
the cold fluid distribution plate 6 comprises a cold fluid distribution inlet 6-1, a cold fluid distribution channel 6-2, a cold fluid distribution outlet 6-3 and a hot fluid guide channel 6-4; the cold flow distribution channel 6-2 is communicated with a cold flow distribution inlet 6-1 and a cold flow distribution outlet 6-3, and the cold flow distribution inlet 6-1 is communicated with a cold flow guide hole 5-4; the hot fluid guide channel 6-4 is communicated with the hot fluid distribution inlet 5-1;
the surface of the heat dissipation flow channel bearing plate 7 is provided with a micro-channel array cluster, the center of the heat dissipation flow channel bearing plate 7 is communicated with the cold flow distribution outlet 6-3, and the boundary of the heat dissipation flow channel bearing plate 7 is communicated with the hot fluid guide channel 6-4.
More specifically, in the present embodiment:
as shown in fig. 1, 2 and 3, the compact efficient heat dissipating device for chips comprises a cold fluid inlet 1, a hot fluid outlet 2, a sealing top cover 3, a hot fluid distribution plate 5, a cold fluid distribution plate 6 and a heat dissipating runner carrying plate 7, wherein the above components are sequentially overlapped and welded into a complete sealed heat dissipating device through a welding process. The heat dissipating device is further fixed with the chip substrate 4 to complete packaging of the chip 9, wherein the heat dissipating runner carrier 7 and the chip 9 are welded and fixed through the brazing layer 8.
As shown in fig. 8, a micro-channel array cluster is disposed on the surface of the heat dissipation runner carrier plate 7, and the micro-channel array cluster is formed by interconnecting a plurality of radial micro-channel units, and the number and arrangement manner of the micro-channel units can be designed according to the size and shape of the applicable chip 9, and in this embodiment, the arrangement takes a 4×4 array cluster as an example. The specific structure of the microchannel unit may adopt a structure shown in cn202110312428.X, as shown in fig. 9, each of the interconnected radial microchannel units adopts a multi-stage radial network structure, which includes multiple layers of short-range fork-shaped microchannels connected in sequence, wherein a first layer of short-range fork-shaped microchannels (innermost layer) surrounds the central cooling medium inlet of the unit, that is, the center of the microchannel unit is an inlet of cooling medium communicated with the cold fluid distribution plate 6, and short-range fork-shaped microchannels are arranged outside the inlet.
As shown in fig. 6 and 7, the cold fluid distribution plate 6 is tightly welded on top of the micro-channel carrier plate, and a cold fluid distribution inlet 6-1, a cold fluid distribution channel 6-2, a cold fluid distribution outlet 6-3 and a hot fluid guiding channel 6-4 are provided on the cold fluid distribution plate 6. The cold flow distribution outlet 6-3 and the hot fluid guide channel 6-4 are each arranged corresponding to the arrangement of the micro-channel array clusters, each arranged at 4 x 4. The cold flow distribution inlets 6-1 are provided with a groove in the shape of a hemisphere, receive the cooling working medium from the cold fluid inlet 1, guide the cooling working medium into the cold flow distribution channels 6-2 to be distributed to the cold flow distribution outlets 6-3, and then flow into the corresponding micro-channel units; the ratio of the depth of the groove to the thickness of the cold fluid distribution plate 6 is controlled in the range of 0.1 to 0.9. The cold flow distribution channel 6-2 is a fluid uniform distribution channel with a binary structure, and is communicated with the cold flow distribution inlet 6-1 and each cold flow distribution outlet 6-3 in one-to-many mode, and the ratio of the depth of the cold flow distribution channel 6-2 to the thickness of the cold flow distribution plate 6 is controlled within the range of 0.1-0.9. The cold flow distribution outlets 6-3 are circular through holes, which are equal in number to the interconnected radial micro-channel units and are respectively located above the fluid inlets (centers) of the interconnected radial micro-channel units, and the cold flow distribution outlets 6-3 inject the cooling medium in the cold flow distribution channels 6-2 into the interconnected radial micro-channel units. The hot fluid guiding channel 6-4 is an annular through structure with a notch, in this example, a square annular through structure is concrete, the cold fluid distributing outlet 6-3 is positioned at the square center formed by the hot fluid guiding channel 6-4, one side edge of the hot fluid guiding channel 6-4 is provided with a notch, and the cold fluid distributing channel 6-2 penetrates through the hot fluid guiding channel 6-4; the number of the thermal fluid guide channels 6-4 is equal to that of the interconnected radial micro-channel units and above the fluid outlets (sides of the micro-channel units) of the interconnected radial micro-channel units, and the thermal fluid guide channels 6-4 guide the heat-exchanged working fluid flowing out of the micro-channel units into the thermal fluid distribution plate 5.
As shown in fig. 4 and 5, the hot fluid distribution plate 5 is tightly welded above the cold fluid distribution plate 6 and also tightly welded to the inner side surface of the seal top cover 3, and the hot fluid distribution plate 5 is provided with a hot fluid distribution inlet 5-1, a hot fluid collecting channel 5-2, a hot fluid collecting outlet 5-3 and a cold fluid guide hole 5-4. The hot fluid distribution inlets 5-1 are arranged corresponding to the hot fluid guide channels 6-4 in a 4 x 4 arrangement, and the cold fluid guide holes 5-4 are arranged corresponding to the cold fluid distribution inlets 6-1, and communicate the cold fluid inlets 1 with the cold fluid distribution plate 6, so that the cooling medium can directly pass through the hot fluid distribution plate 5. The heat flow distribution inlet 5-1 is an annular through channel with a notch, has the same shape and position as those of the heat flow guide channels 6-4 on the cold fluid distribution plate 6, respectively receives the heat exchange working media passing through the heat flow guide channels 6-4 corresponding to the heat flow distribution inlet, guides the heat flow into the heat flow collection channel 5-2, and then discharges the heat flow out of the heat radiator through the heat flow collection outlet 5-3 and the heat flow outlet 2. The heat flow collecting outlet 5-3 is a hemispherical groove which is communicated with the heat flow outlet 2, and the heat flow in the heat flow collecting channel 5-2 is led out of the heat dissipating device. The heat flow collecting channels 5-2 are tree-shaped fluid collecting channels, and form many-to-one communication between each heat flow distribution inlet 5-1 and each heat flow collecting outlet 5-3, so that the heat flow introduced by each heat flow distribution inlet 5-1 is collected to the heat flow collecting outlet 5-3; the ratio of the depth of the heat flow collecting channel 5-2 to the thickness of the heat fluid distribution plate 5 is controlled within the range of 0.1-0.9. The cold fluid guiding hole 5-4 is a circular through hole, which is communicated with the cold fluid inlet 1 and the cold fluid distribution inlet 6-1, so that the cooling working medium entering the heat dissipating device from the cold fluid inlet 1 can be directly led into the cold fluid distribution plate 6 through the hot fluid distribution plate 5.
The thickness ratio between the hot fluid distribution plate 5 and the cold fluid distribution plate 6 is controlled within the range of 1-10, and the thickness ratio between the cold fluid distribution plate 6 and the heat dissipation runner carrier plate 7 is controlled within the range of 1-10, and can be determined according to actual conditions or pre-simulation results; the thickness ratio between the hot fluid distribution plate 5, the cold fluid distribution plate 6 and the heat dissipation runner carrier plate 7 is 1:1:1.
as shown in fig. 1 to 3, the lower end of the seal top cover 3 is integrally formed with a fixing leg extending outward, and the seal top cover 3 and the layers inside thereof can be integrally welded and fixed on the chip substrate 4 by welding the fixing leg and the chip substrate 4, so as to form encapsulation and protection of the chip 9 on the chip substrate 4. The packaged chips 9 can be bare chips or DIE, and the size and specification of the whole heat dissipation device and the setting number and arrangement mode of the internal parts such as micro-channel units and the like are designed according to the actual layout of the chips 9 so as to achieve the optimal heat exchange effect. In addition, when the seal top cover 3 is welded and fixed on the chip substrate 4, a brazing layer 8 closely attached to the surfaces of the two sides is formed between the bottom surface (flat surface) of the heat dissipation runner carrying plate 7 and the surface of the chip 9 through a brazing process, so that heat transfer between the chip 9 and the heat dissipation runner carrying plate 7 is uniform, and connection is tight and reliable.
The cold fluid inlet 1 and the hot fluid outlet 2 are welded on the top surface of the sealing top cover 3, and a joint with sealing threads is adopted, so that the cold fluid inlet and the hot fluid outlet can be quickly and tightly connected with an external fluid pipeline, and the condition of liquid leakage at the joint is reduced.
When the heat dissipation device exchanges heat:
cold flow (cooling working medium) is input into a cold flow distribution inlet 6-1 of a cold flow distribution plate 6 through a cold flow fluid inlet 1 through a cold flow guide hole 5-4, is distributed to each cold flow distribution outlet 6-3 through a cold flow distribution channel 6-2, and is input into the center of each micro-channel unit on a heat dissipation flow channel bearing plate 7;
the fluid (working medium) exchanges heat with the chip 9 while flowing from the center of the micro-channel unit to the boundary along the micro-channel;
the hot fluid flowing to the boundary of the micro-channel unit after heat exchange is input into the hot fluid distribution inlet 5-1 of the hot fluid distribution plate 5 through the hot fluid guide channel 6-4, and the heat flows input by the hot fluid distribution inlets 5-1 are collected by the hot fluid collection channel 5-2 and output from the heat dissipating device through the hot fluid outlet 2 after being collected by the hot fluid collection outlet 5-3.
Compared with the prior art, the heat dissipation device combines the heat dissipation runner with the top cover of the chip 9 through the welding process integrated forming technology, can be beneficial to improving the cooling capacity of the heat dissipation device and can maintain the uniformity and stability of the temperature of the chip 9. In addition, the compact design of the heat dissipating device can save precious space in the computer case, and is beneficial in the aspects of simplifying installation, improving compatibility, reducing leakage risk, enhancing design aesthetic feeling and the like.
The previous description of the embodiments is provided to facilitate a person of ordinary skill in the art in order to make and use the present invention. It will be apparent to those skilled in the art that various modifications can be readily made to these embodiments and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above-described embodiments, and those skilled in the art, based on the present disclosure, should make improvements and modifications without departing from the scope of the present invention.
Claims (10)
1. The efficient chip heat dissipation device with the compact structure is characterized in that the heat dissipation device packages a chip (9) on a chip substrate (4) and comprises a sealing top cover (3), a hot fluid distribution plate (5), a cold fluid distribution plate (6) and a heat dissipation flow channel bearing plate (7);
the sealing top cover (3) is covered on the chip substrate (4), and the chip (9), the heat dissipation flow channel bearing plate (7), the cold fluid distribution plate (6), the hot fluid distribution plate (5) and the sealing top cover (3) are sequentially and tightly overlapped on the chip substrate (4);
the top surface of the sealing top cover (3) is provided with a cold fluid inlet (1) and a hot fluid outlet (2);
the hot fluid distribution plate (5) comprises a hot fluid distribution inlet (5-1), a hot fluid collecting channel (5-2), a hot fluid collecting outlet (5-3) and a cold fluid guide hole (5-4); the heat flow collecting channel (5-2) is communicated with the heat flow distribution inlet (5-1) and the heat flow collecting outlet (5-3), and the heat flow outlet (2) is communicated with the heat flow collecting outlet (5-3); the cold fluid inlet (1) is communicated with the cold fluid guide hole (5-4);
the cold fluid distribution plate (6) comprises a cold fluid distribution inlet (6-1), a cold fluid distribution channel (6-2), a cold fluid distribution outlet (6-3) and a hot fluid guide channel (6-4); the cold flow distribution channel (6-2) is communicated with the cold flow distribution inlet (6-1) and the cold flow distribution outlet (6-3), and the cold flow distribution inlet (6-1) is communicated with the cold flow guide hole (5-4); the hot fluid guide channel (6-4) is communicated with the hot fluid distribution inlet (5-1);
the surface of the heat dissipation runner bearing plate (7) is provided with a micro-channel array cluster, the center of the heat dissipation runner bearing plate (7) is communicated with the cold flow distribution outlet (6-3), and the boundary of the heat dissipation runner bearing plate (7) is communicated with the hot fluid guide channel (6-4).
2. The efficient heat dissipating device for chips of claim 1, wherein said heat flow collecting channel (5-2) is a tree structure, realizing one-to-many communication of the heat flow distribution inlet (5-1) and the heat flow collecting outlet (5-3).
3. The efficient heat sink of a compact chip as claimed in claim 2, wherein the ratio of the depth of the heat flow collecting channel (5-2) to the thickness of the heat fluid distribution plate (5) is 0.1-0.9.
4. The compact chip high-efficiency heat dissipating device according to claim 1, wherein the cold flow distribution channel (6-2) has a binary structure, and one-to-many communication between the cold flow distribution inlet (6-1) and the cold flow distribution outlet (6-3) is realized.
5. The efficient heat sink of compact chip as recited in claim 4, characterized in that the ratio of the depth of said cold flow distribution channel (6-2) to the thickness of said cold flow distribution plate (6) is 0.1-0.9.
6. The compact chip high-efficiency heat dissipating device as set forth in claim 1, wherein said thermal fluid guiding channel (6-4) is a ring-shaped through structure with a notch, and said thermal fluid distribution inlet (5-1) is provided in a ring-shaped through structure with a notch corresponding to said thermal fluid guiding channel (6-4).
7. The efficient heat sink of compact chip as recited in claim 1, characterized in that the ratio of the depth of said cold flow distribution inlet (6-1) to the thickness of said cold flow distribution plate (6) is 0.1-0.9.
8. The efficient heat dissipating device for chips of claim 1, wherein the ratio of the thickness of said hot fluid distribution plate (5) to the thickness of said cold fluid distribution plate (6) is 0.1-10, and the ratio of the thickness of said cold fluid distribution plate (6) to said heat dissipating runner carrier plate (7) is 0.1-10.
9. The compact chip high-efficiency heat dissipating device according to claim 1, wherein said cold fluid inlet (1) and said hot fluid outlet (2) are sealed threaded joints.
10. The efficient heat dissipation device for chips with compact structures according to claim 1, wherein the heat dissipation runner carrier plate (7) and the chips (9) are welded and fixed through a brazing layer (8), the cold fluid distribution plate (6) and the heat dissipation runner carrier plate (7) are welded and fixed, the hot fluid distribution plate (5) and the cold fluid distribution plate (6) are welded and fixed, and the seal top cover (3) and the hot fluid distribution plate (5) are welded and fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310599982.XA CN116469855A (en) | 2023-05-25 | 2023-05-25 | Compact-structure chip efficient heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310599982.XA CN116469855A (en) | 2023-05-25 | 2023-05-25 | Compact-structure chip efficient heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116469855A true CN116469855A (en) | 2023-07-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310599982.XA Pending CN116469855A (en) | 2023-05-25 | 2023-05-25 | Compact-structure chip efficient heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116469855A (en) |
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2023
- 2023-05-25 CN CN202310599982.XA patent/CN116469855A/en active Pending
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