CN116428985B - Edge coordinate acquisition method, wafer alignment identification method and wafer circular cutting method - Google Patents

Edge coordinate acquisition method, wafer alignment identification method and wafer circular cutting method Download PDF

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CN116428985B
CN116428985B CN202310692468.0A CN202310692468A CN116428985B CN 116428985 B CN116428985 B CN 116428985B CN 202310692468 A CN202310692468 A CN 202310692468A CN 116428985 B CN116428985 B CN 116428985B
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image
wafer
main body
image acquisition
hole
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CN116428985A (en
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高阳
葛凡
张宁宁
孙志超
曹伟
王永强
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Jiangsu Jingchuang Advanced Electronic Technology Co Ltd
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Jiangsu Jingchuang Advanced Electronic Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/13—Edge detection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30—Computing systems specially adapted for manufacturing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses an edge coordinate acquisition method, a wafer alignment recognition method and a wafer circular cutting method, wherein in the coordinate acquisition method, in the process of acquiring an image acquisition coordinate according to a four-point alignment method, determining whether an image acquired by an image acquisition device at a through hole meets a preset condition or not, and if not, moving a lens optical axis of the image acquisition device by one position in the through hole for image acquisition and recognition again; if yes, determining whether the edge of the wafer main body on the image is a normal edge, and if yes, acquiring corresponding image acquisition coordinates during image acquisition; if not, the lens optical axis of the image acquisition device moves one position in the through hole to acquire the image again. When an image meeting the preset condition is acquired, the image acquisition coordinates are determined when the edge of the wafer main body on the image is a normal edge, so that the acquisition of the wrong image acquisition coordinates is effectively avoided, and the accuracy of coordinate acquisition is ensured.

Description

Edge coordinate acquisition method, wafer alignment identification method and wafer circular cutting method
Technical Field
The invention relates to the field of semiconductor device processing, in particular to an edge coordinate acquisition method, a wafer alignment identification method and a wafer circular cutting method.
Background
Before the wafer is cut, it is necessary to confirm whether the wafer is aligned with the table (the concentric state of the wafer and the table is aligned), and the method for determining whether the wafer is aligned effectively may be a method disclosed in the grant publication CN 114628299B.
However, in actual dicing, as shown in fig. 1, when a small notch 111 is formed at the edge of the wafer main body 11 of the tai-drum wafer, and after the tai-drum wafer is adjusted on the table 2 by the alignment device, when the broken edge 112 corresponding to the small notch 111 is located in the through hole 21 on the table 2, the light-dark boundary line on the image acquired at the through hole is likely to belong to the broken edge 112, the acquired image acquisition coordinate is incorrect, and when the wafer is identified based on the incorrect image acquisition coordinate, the corresponding result is incorrect, which causes failure of wafer alignment identification, and thus the subsequent dicing cannot be performed.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides an edge coordinate acquisition method, a wafer alignment identification method and a wafer circular cutting method.
The aim of the invention is achieved by the following technical scheme:
the edge coordinate acquisition method is characterized in that in the process of acquiring the image acquisition coordinates according to the four-point alignment method, whether an image acquired by an image acquisition device at a through hole meets a preset condition or not is determined, and if not, a lens optical axis of the image acquisition device moves by one position in the through hole to acquire the image again; if so, determining whether the edge of the wafer main body on the image is a normal edge of the wafer main body, and if so, acquiring corresponding image acquisition coordinates during image acquisition; if not, the lens optical axis of the image acquisition device is moved by one position in the through hole to acquire the image again.
Preferably, the predetermined condition is that the image has a light-dark boundary line passing through or in close proximity to the center of the image, the light-dark boundary line being a straight line.
Preferably, when an image is acquired at a through hole, determining whether the image is a blurred image, and if not, determining whether the image meets a predetermined condition; if so, blowing air into the through hole for a period of time, carrying out image acquisition again at the original position and determining whether the image is a blurred image, if so, moving the lens optical axis of the image acquisition device by one position in the through hole for carrying out image acquisition again, and if not, determining whether the image meets the preset condition.
Preferably, the acquired image is compared to a blurred image template to determine if the acquired image is a blurred image.
Preferably, the edge coordinate acquiring method further includes:
information of whether the wafer main body has a small notch or not is obtained,
when the information of the wafer main body with the small notch is obtained, determining whether the edge of the wafer main body on an image is a normal edge of the wafer main body or not when determining that the image meets a preset condition;
when the information that the wafer main body has no small notch is obtained, when an image is determined to meet the preset condition, the corresponding image acquisition coordinates during image acquisition are obtained.
Preferably, when no image acquired at one through hole identifies a normal edge of the wafer body, a compensation point is found on the normal edge of the wafer body through image identification and the coordinates of the compensation point are determined.
Preferably, when the image collected at one through hole does not identify the normal edge of the wafer main body, the through hole is recorded and the image collection and identification at the next through hole are carried out;
after image acquisition and recognition at the four through holes are completed, determining the number of through holes at which the normal edge of the wafer main body is not recognized;
at least one compensation point is found on the normal edge of the wafer body through image recognition and coordinates of the compensation point are determined, wherein the number of the compensation points is the same as the number of through holes without recognizing the normal edge of the wafer body.
Preferably, the coordinates of the corresponding number of compensation points are obtained in different ways according to the number of through holes at which the normal edge of the wafer body is not identified.
The edge coordinate acquisition method is characterized in that in the process of acquiring the image acquisition coordinates according to the four-point alignment method, whether the image has the normal edge of a wafer main body or not is determined for an image acquired by an image acquisition device at a through hole, and if the image has the normal edge of the wafer main body, the lens optical axis of the image acquisition device moves by one position in the through hole to acquire the image again; if yes, determining whether the image meets a preset condition; if so, acquiring the corresponding image acquisition coordinates during image acquisition, and if not, moving the lens optical axis of the image acquisition device by one position in the through hole to acquire the image again.
The wafer alignment recognition method comprises any one of the edge coordinate acquisition methods.
The wafer circular cutting method comprises the wafer alignment identification method.
The technical scheme of the invention has the advantages that:
when an image meeting the preset condition is acquired, the image acquisition coordinates are not directly acquired, but the image acquisition coordinates are further determined whether the edge of the wafer main body on the image is a normal edge or not, and the image acquisition coordinates are determined when the edge is determined to be the normal edge, so that the acquisition of the wrong image acquisition coordinates is effectively avoided, accurate data is provided for the subsequent confirmation of the wafer alignment state, and the identification precision is improved.
When the image is acquired, whether the image is a blurred image or not is judged first, and the subsequent identification can not be carried out when the image is the blurred image, so that the efficiency is improved, and the interference of water mist on the quality of the acquired image can be eliminated as much as possible by blowing the air into the through hole.
When the normal edge of the wafer main body does not exist at the through hole, the invention can effectively supplement coordinate information required by wafer alignment identification by searching at least one point position on the part, which is positioned outside the through hole, of the normal edge and determining the corresponding point position coordinates, thereby ensuring the effective realization of the wafer alignment.
Drawings
FIG. 1 is a schematic view of a wafer body on a stage and having a small notch corresponding to a through hole according to the prior art;
FIG. 2 is a schematic illustration of the process of the method of the present invention;
FIG. 3 is a schematic diagram of the method of the present invention with blurred image identification.
Detailed Description
The objects, advantages and features of the present invention are illustrated and explained by the following non-limiting description of preferred embodiments. These embodiments are only typical examples of the technical scheme of the invention, and all technical schemes formed by adopting equivalent substitution or equivalent transformation fall within the scope of the invention.
In the description of the embodiments, it should be noted that the positional or positional relationship indicated by the terms such as "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in the specific orientation, and thus are not to be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Example 1
The edge coordinate acquisition method disclosed in the present invention is explained below with reference to the accompanying drawings, which are implemented based on the structure disclosed in the prior patent exemplified in the background art. On the basis of the structure disclosed in the above prior patent, the method further provides an upper light source for polishing the tai drum wafer on the workbench 2, wherein the upper light source can be a known annular light source and is coaxially arranged with the lens of the image acquisition device, and the upper light source can be directly arranged on the image acquisition device or arranged on the same moving mechanism with the image acquisition device so that the upper light source and the image acquisition device can synchronously move. Of course, the upper light source may be one or more, and is fixedly arranged above the workbench 2.
As in the prior art, the method also includes collecting images at four through holes 21 of the workbench by the image collecting device and analyzing whether the images meet the requirements, if yes, acquiring coordinates of any point on the optical axis of the lens in a predetermined coordinate system as image collecting coordinates. The satisfactory image is provided with a light-shade boundary line passing through the center of the image or abutting against the center of the image, and the light-shade boundary line is a straight line.
However, when the small notch 111 exists on the edge of the wafer main body 11 described in the background art and the small notch 111 is located at the through hole, at this time, the bright-dark boundary line on the image is likely not the normal edge 113 of the wafer main body (the edge excluding the small notch area in the edge of the wafer main body) but the broken edge 112 of the wafer main body (the edge at the small notch 111).
Therefore, in order to avoid obtaining the wrong image acquisition coordinates, as shown in fig. 2, in the process of obtaining the image acquisition coordinates according to the four-point alignment method, the invention firstly determines whether an image acquired by the image acquisition device at a through hole meets a preset condition or not, and if not, the lens optical axis of the image acquisition device moves by one position in the through hole to acquire the image again; if yes, determining whether the edge of the wafer main body on the image is a normal edge 113 of the wafer main body, and if yes, acquiring corresponding image acquisition coordinates during image acquisition; if not, the lens optical axis of the image acquisition device is moved by one position in the through hole to acquire the image again.
The predetermined condition is that the image has a light-dark boundary line passing through or abutting the center of the image, the light-dark boundary line being a straight line.
When determining whether the edge of the wafer main body on the image is the normal edge 113 of the wafer main body, the image comparison may be implemented by comparing the acquired image with a template image with the normal edge of the wafer main body, and performing final judgment according to the similarity of the acquired image and the template image, where the specific technology of image comparison is a known technology and is not described herein.
In another embodiment, when determining whether the edge of the wafer main body on the image is the normal edge 113, the image acquisition device may be switched from the high power mirror to the low power mirror, the image of the low power mirror is acquired again in the original position, and the shape or curvature of the bright-dark boundary line on the image is determined, because the broken edge 112 is not usually in a regular shape, the normal edge 113 or the broken edge 112 can be determined by the shape of the bright-dark boundary line on the center of the over-image or the immediate vicinity of the center of the image on the re-acquired image, and at the same time, the acquired bright-dark boundary line is larger in size due to the increase of the acquired image range, the shape or curvature of the bright-dark boundary line is easier to determine, and therefore, whether the bright-dark boundary line is the normal edge 113 or the broken edge 112 is easier to determine. If it is determined that the light-dark boundary line on the image collected by the low power mirror is the broken edge 112, it may be determined that the light-dark boundary line on the image previously collected under the high power mirror condition, which satisfies the predetermined condition, is a segment of the broken edge 112. On the contrary, if it is determined that the light-dark boundary line on the image collected by the low power mirror is the normal edge 113, it is determined that the light-dark boundary line satisfying the predetermined condition on the image collected under the high power mirror condition is a section of the normal edge.
When no image acquired at one through hole identifies the normal edge 113 of the wafer body, a compensation point is found on the normal edge 113 of the wafer body by image identification and the coordinates of the compensation point are determined.
Specifically, the upper light source is turned on to enable the image acquisition device to move to a position where the lens of the image acquisition device is coaxial with the through hole or to move the optical axis of the lens of the image acquisition device to other specified positions in the through hole, and the position is not limited herein. And then, enabling the Taihe drum wafer to rotate and enabling an image acquisition device to acquire images under the condition of a low power mirror. At this time, the image acquisition range of the image acquisition device is larger, and under the low power lens, the acquisition range of the image acquisition device can be designed according to the needs, for example, the acquisition range of the image acquisition device can cover one through hole, and the image acquisition device is not limited herein. During the rotation of the tai drum wafer, the broken edge 112 at the small notch 111 may rotate out of the collection range of the image collection device, and the normal edge 113 of the wafer main body 11 may rotate into the lens range of the image collection device. At this time, there is a normal edge 113 of the wafer main body on the image collected by the image collection device, so when it is determined that there is a normal edge 113 of the wafer main body on the image collected under the condition of the low power mirror, the rotation of the tai drum wafer is stopped.
The image acquisition device is then switched from the low power mirror to the high power mirror, and the image acquisition device is moved under the high power mirror condition to perform image acquisition and analysis, and the analysis is also performed to determine whether the image acquired at each position meets the requirements under the high power mirror condition, so that the principle of judging whether the image meets the requirements is the same as that of judging whether the image meets the requirements or not. If the image is in accordance with the requirement, determining the point where the optical axis of the lens is located as the compensation point, and determining the coordinate of any point on the optical axis of the lens in a preset coordinate system as the coordinate of the compensation point to be found. If the coordinates do not meet the requirements, the image acquisition device moves to another position again to acquire and identify the images until the coordinates of the required compensation points are acquired.
In the above embodiment, if it is determined that the normal edge 113 of the wafer main body is not recognized on the image collected at one through hole, the coordinates of one compensation point are immediately found, and then the image collecting device is moved to other through holes for image collection and recognition after the coordinates of the compensation point are found.
In another embodiment, image acquisition and identification may be performed at each via first, and the vias for which the normal edge 113 of the wafer body is not identified are recorded. That is, when no image collected at one through hole is recognized at the normal edge 113 of the wafer main body, the through hole is recorded, and the image collection and recognition at the next through hole are continued; after the image acquisition and recognition at the four through holes are completed, the number of through holes at which the normal edge 113 of the wafer main body is not recognized is determined, and then a compensation point located outside the small notch 111 is found on the normal edge 113 of the wafer main body through image recognition and the coordinates of the compensation point are determined, wherein the number of the compensation points is the same as the number of through holes at which the normal edge 113 of the wafer main body is not recognized.
The acquisition of the coordinates of the compensation points can be performed as described above.
Further, before acquiring the compensation points, it is determined whether the number of through holes at which the normal edge 113 of the wafer main body is not recognized is greater than 1, and if so, coordinates of a plurality of the compensation points are sequentially acquired according to the above-mentioned method.
If the number of through holes at which the normal edge 113 of the wafer body is not recognized is equal to 1, only the coordinates of one compensation point need be acquired. Since three image acquisition coordinates acquired at the other three through holes can already determine a circle, the circle is generally almost the same as the outline of the edge of the wafer main body, and therefore, the lens optical axis of the image acquisition device can be moved to different points of the circle for image acquisition and identification.
Specifically, a circle is determined according to the acquired three image acquisition coordinates; at this time, the coordinates of any point on the circle can also be determined.
Then, an upper light source is turned on, so that relative movement is generated between the image acquisition device and the tai drum wafer, and the lens optical axis of the image acquisition device performs image acquisition when at least one specific position of the circle is located outside the four through holes, so as to acquire the coordinate of the compensation point.
Specifically, the lens optical axis of the image acquisition device moves along the circle, an image is acquired after the lens optical axis moves to a point on the circle outside the small notch, and whether the acquired image meets the requirement is determined. Because of the difference in material quality between the wafer body 11 and the film, the images are significantly different, if there is a film on the acquired image and there is a wafer body 11 on the acquired image, there will be a significant boundary between the wafer body 11 and the film on the image, so that when determining whether the image is satisfactory, it is determined whether there is a straight boundary on the image, and the boundary passes through or is close to the center point of the image. If the image acquired at one point of the circle meets the requirement, determining that the point where the optical axis of the lens is positioned is a compensation point when the image is acquired, wherein the coordinate corresponding to the point or the coordinate of any point on the optical axis of the lens in a preset coordinate system is the coordinate of the compensation point to be found. If the image acquired at one point on the circle does not meet the requirements, the image acquisition device moves to the other point on the circle again for image acquisition and identification until the image meeting the requirements is acquired at one point on the circle.
In addition, because the cooling liquid is needed to be used in the circular cutting process, water mist formed by the cooling liquid can enter the through holes, so that the water mist in the through holes can greatly influence the image quality when the images are acquired later, and meanwhile, the bright and dark boundary lines formed on the images are likely to be caused by water waves in the through holes.
Therefore, as shown in fig. 3, when an image is obtained at a through hole, it is determined whether the image is a blurred image, specifically, the obtained image is compared with a blurred image template to determine whether the obtained image is a blurred image, and a specific technique of graphic comparison is a known technique and will not be described herein. Of course, other ways known to identify whether the image is a blurred image may be used.
If it is determined that one image is not a blurred image, determining whether the image meets a predetermined condition; if one image is determined to be a blurred image, blowing air into the through hole for a period of time; and carrying out image acquisition again at the original position and determining whether the image is a blurred image, if so, moving the lens optical axis of the image acquisition device by one position in the through hole to carry out image acquisition again, and if not, determining whether the image meets the preset condition.
Further, in actual operation, a lot of tai-gu wafers to be processed may be tai-gu wafers with small gaps, and only a small number of tai-gu wafers may have corresponding small gaps. When the device works, the serial numbers of the Taiwan wafers with the small gaps and the positions of the Taiwan wafers on the feeder can be sent to the controller in advance, when each Taiwan wafer is processed, the controller determines whether the Taiwan wafer to be aligned and identified currently is the Taiwan wafer with the small gaps or not according to the acquired information, and different flows are adopted according to the identification results.
Namely, the edge coordinate acquisition method further comprises the following steps:
information of whether the wafer main body has a small notch or not is obtained,
when the information of the wafer main body with the small notch is obtained, determining whether a normal edge of the wafer main body exists on an image when the image is determined to meet a preset condition;
when the information that the wafer main body has no small notch is obtained, when an image is determined to meet the preset condition, the corresponding image acquisition coordinates during image acquisition are obtained.
Therefore, different processing modes can be selected according to the actual condition of the Taihe wafer, unnecessary processing procedures are avoided, and the identification efficiency is improved.
Example 2
The present embodiment discloses an edge coordinate acquisition method, which differs from the above embodiment in that: in this embodiment, whether the edge of the wafer main body on the image acquired at each position is a normal edge or a damaged edge is determined first, and when the edge is determined to be a normal edge, whether the normal edge on the image meets other requirements is further determined.
Specifically, in the process of acquiring the image acquisition coordinates according to the four-point alignment method, determining whether a normal edge of a wafer main body exists on an image acquired by an image acquisition device at a through hole, and if the normal edge exists on the image, moving a lens optical axis of the image acquisition device by one position in the through hole to acquire the image again; if yes, determining whether the image meets a preset condition; if so, acquiring the corresponding image acquisition coordinates during image acquisition, and if not, moving the lens optical axis of the image acquisition device by one position in the through hole to acquire the image again.
Example 3
The embodiment discloses a wafer alignment recognition method, which comprises the edge coordinate acquisition method of the embodiment. Whether the wafer is aligned is determined according to the disclosure of the prior patent when four or more image acquisition coordinates are acquired.
Examples
The embodiment discloses a wafer circular cutting method, which comprises the wafer alignment identification method of the embodiment.
The invention has various embodiments, and all technical schemes formed by equivalent transformation or equivalent transformation fall within the protection scope of the invention.

Claims (8)

1. The method for acquiring the edge coordinates of the wafer main body is characterized in that in the process of acquiring the image acquisition coordinates according to a four-point alignment method, whether an image acquired by an image acquisition device at a through hole meets a preset condition or not is determined, and if not, a lens optical axis of the image acquisition device moves by one position in the through hole to acquire the image again; if so, determining whether the edge of the wafer main body on the image is a normal edge of the wafer main body, and if so, acquiring corresponding image acquisition coordinates during image acquisition; if not, the lens optical axis of the image acquisition device moves one position in the through hole to acquire the image again;
when the normal edge of the wafer main body is not identified by the image acquired at one through hole, finding a compensation point on the normal edge of the wafer main body through image identification and determining the coordinates of the compensation point;
or when the image collected at one through hole does not identify the normal edge of the wafer main body, recording the through hole and carrying out image collection and identification at the next through hole;
after image acquisition and recognition at the four through holes are completed, determining the number of through holes at which the normal edge of the wafer main body is not recognized;
at least one compensation point is found on the normal edge of the wafer body through image recognition and coordinates of the compensation point are determined, wherein the number of the compensation points is the same as the number of through holes without recognizing the normal edge of the wafer body.
2. The method according to claim 1, wherein the predetermined condition is that the image has a bright-dark boundary line passing through or immediately adjacent to an image center, the bright-dark boundary line being a straight line.
3. The method according to claim 1, wherein when an image is acquired at a through hole, it is determined whether it is a blurred image, and if not, it is determined whether the image satisfies a predetermined condition; if so, blowing air into the through hole for a period of time, carrying out image acquisition again at the original position and determining whether the image is a blurred image, if so, moving the lens optical axis of the image acquisition device by one position in the through hole for carrying out image acquisition again, and if not, determining whether the image meets the preset condition.
4. The method of claim 1, further comprising:
information of whether the wafer main body has a small notch or not is obtained,
when the information of the wafer main body with the small notch is obtained, determining whether the edge of the wafer main body on an image is a normal edge of the wafer main body or not when determining that the image meets a preset condition;
when the information that the wafer main body has no small notch is obtained, when an image is determined to meet the preset condition, the corresponding image acquisition coordinates during image acquisition are obtained.
5. The method according to claim 1, wherein the coordinates of the corresponding number of compensation points are obtained in different manners according to the number of through holes at which the normal edge of the wafer body is not recognized.
6. The method for acquiring the edge coordinates of the wafer main body is characterized in that in the process of acquiring the image acquisition coordinates according to a four-point alignment method, whether the image has the normal edge of the wafer main body or not is determined for an image acquired by an image acquisition device at a through hole, and if not, the lens optical axis of the image acquisition device moves by one position in the through hole to acquire the image again; if yes, determining whether the image meets a preset condition; if so, acquiring corresponding image acquisition coordinates during image acquisition, and if not, moving a lens optical axis of the image acquisition device by one position in the through hole to acquire the image again;
when the normal edge of the wafer main body is not identified by the image acquired at one through hole, finding a compensation point on the normal edge of the wafer main body through image identification and determining the coordinates of the compensation point;
or when the image collected at one through hole does not identify the normal edge of the wafer main body, recording the through hole and carrying out image collection and identification at the next through hole;
after image acquisition and recognition at the four through holes are completed, determining the number of through holes at which the normal edge of the wafer main body is not recognized;
at least one compensation point is found on the normal edge of the wafer body through image recognition and coordinates of the compensation point are determined, wherein the number of the compensation points is the same as the number of through holes without recognizing the normal edge of the wafer body.
7. A wafer alignment recognition method, comprising the wafer main body edge coordinate acquisition method according to any one of claims 1 to 6.
8. The wafer circular cutting method is characterized in that: comprising a wafer alignment recognition method as claimed in claim 7.
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