CN114628299B - Wafer alignment confirmation method and Taizhou ring cutting method - Google Patents
Wafer alignment confirmation method and Taizhou ring cutting method Download PDFInfo
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
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- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
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Abstract
The invention discloses a wafer alignment confirmation method and a Taizhou ring cutting method, wherein the alignment confirmation method comprises the steps of collecting a local image in a through hole on a cutting table through an image collecting device after a wafer is fixed on the cutting table and determining whether the local image meets the requirement, if so, obtaining an accounting coordinate during local image collection, and executing S5; otherwise, judging whether the image count is reached, if so, determining that the image count is not centered, and giving an alarm; if not, after the lens moves to a position, acquiring the local image in the through hole again and determining whether the local image meets the requirement; s5, judging whether the checking coordinates are sufficient or not; if not, the image acquisition device acquires a local image in the next through hole on the cutting table and determines whether the local image meets the requirements; if so, determining whether the check coordinate is accurate, and if so, determining centering; otherwise, if the centering is not performed, an alarm is given. The scheme can improve centering confirmation efficiency, can provide numerical support for cutting the Taizhou ring, and is favorable for improving cutting precision.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a wafer centering confirmation method and a Taizhou ring cutting method during wafer processing.
Background
When the Taiwan ring of the wafer is cut, the following processes are included:
the wafer is placed on a cutting table.
The wafer is adjusted through structures such as a three-jaw centering chuck, the wafer and the cutting table are kept in a centering state (the wafer and the cutting table are coaxial) as far as possible, and after adjustment, the wafer is fixed on the cutting table.
And then cutting according to preset cutting parameters.
Although the three-jaw centering chuck and other structures can adjust the wafer to be coaxial with the cutting table as much as possible, due to various machining errors, installation errors and other reasons, the following often exist: after adjustment, the center of the wafer and the center of the cutting table still have a certain position deviation, thereby causing the cutting failure.
Disclosure of Invention
The present invention is directed to solving the above-mentioned problems in the prior art, and provides a method for confirming wafer alignment.
The purpose of the invention is realized by the following technical scheme:
the wafer centering confirmation method is characterized by comprising the following steps: the cutting table for placing the wafer is provided with at least 4 through holes with axes parallel to the axis of the cutting table, and when the wafer and the cutting table are coaxial, the outer circumference of the Taiwan ring of the wafer is positioned at each through hole;
after the wafer is adjusted and fixed on the cutting table, the following steps are carried out:
s1, collecting a local image in a through hole on a cutting table through an image collecting device;
s2, determining whether the local image meets the requirements, and if so, executing S3; otherwise, executing S4;
s3, acquiring the check coordinates during local image acquisition, and executing S5;
s4, judging whether the image count reaches a set value, if not, moving the image acquisition device to a position, acquiring the local image in the through hole again, and executing S2; if yes, determining that the wafer and the cutting table are not aligned, and sending an alarm;
s5, judging whether the number of the acquired check coordinates reaches a target value; if not, executing S6, and if so, executing S7;
s6, collecting local images in the next through hole on the cutting table by the image collecting device, and executing S2;
s7, determining whether the obtained group of check coordinates are accurate or not, and determining that the wafer is aligned with the cutting table when the check coordinates are accurate; otherwise, the wafer and the cutting table are determined not to be aligned, and an alarm is sent out.
Preferably, the cutting table has four through holes, and the through holes are distributed in a square shape.
Preferably, the image acquisition device is a camera microscope.
Preferably, when there is a boundary between light and shade on the local image, and the boundary between light and shade is a straight line passing through the center of the local image or a preset distance from the center of the local image, the image is determined to be satisfactory.
Preferably, when the image acquisition device acquires the first image at each through hole, the lens of the image acquisition device is moved to be coaxial with the through hole.
Preferably, the cutting table enables the through holes on the cutting table to correspond to the light source positions respectively through autorotation;
in S1, the image acquisition device moves to a through hole corresponding to the light source for image acquisition;
in S6, other through holes are rotated one by one to correspond to the light source through the rotation of the cutting table, and then the image acquisition is carried out through the image acquisition device.
Preferably, each through hole corresponds to one light source, and when an image is collected, the image collecting device is moved to correspond to the position of each through hole.
Preferably, said S7 comprises, in combination,
s71, calculating the radius of a group of circles according to the group of check coordinates;
and S72, comparing the maximum value and the minimum value in the set of calculated radiuses, and if the difference value of the maximum value and the minimum value is smaller than the error, determining that the set of check coordinates is accurate.
Preferably, the reference coordinate system is a coordinate system in which a specific point on an optical axis of a lens of the image pickup device at the time of the partial image pickup is in a reference coordinate system, and the reference coordinate system is a coordinate system configured by at least two straight lines perpendicular to an axis of the cutting table and perpendicular to each other.
The Taizhou ring cutting method comprises the wafer centering confirmation method, and when the wafer is determined to be centered with the cutting table, the control device controls the cutting mechanism to cut according to preset cutting parameters.
The technical scheme of the invention has the advantages that:
according to the scheme, the alignment state of the wafer and the cutting table is determined by finding a proper image at each through hole, the continuous finding is stopped after finding an accounting coordinate at each through hole, and the alignment failure of the wafer and the cutting table is judged when the accounting coordinate is not found at one through hole, so that the efficiency can be effectively improved, and the data processing amount is reduced; meanwhile, numerical support can be provided for cutting of the Taizhou ring, so that the cutting precision is improved, and the cutting quality is improved.
This scheme makes the mode that through-hole and light source correspond one by one through the cutting bed rotation, can make full use of the original rotating-structure of cutting bed to only need a light source, also need not make image acquisition device remove on a large scale, can reduce light source quantity and simplify the structure that drive image acquisition device removed, also be favorable to raising the efficiency.
The scheme adopts the image pickup microscope, so that the shot image is clear as much as possible, and the boundary of the too-drumhead ring is convenient to recognize according to the mode of finding a straight line, thereby greatly improving the recognition precision and being beneficial to improving the efficiency.
Drawings
FIG. 1 is a schematic view of the present invention with the wafer positioned on the cutting table and held as co-axial as possible with the cutting table;
fig. 2 is a process diagram of the centering confirmation method of the present invention.
Detailed Description
Objects, advantages and features of the present invention will be illustrated and explained by the following non-limiting description of preferred embodiments. The embodiments are merely exemplary for applying the technical solutions of the present invention, and any technical solution formed by replacing or converting the equivalent thereof falls within the scope of the present invention claimed.
In the description of the schemes, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the embodiment, the operator is used as a reference, and the direction close to the operator is a proximal end, and the direction away from the operator is a distal end.
The method for confirming the alignment of the wafer and the cutting table disclosed by the invention is explained by combining the attached drawings, and is characterized in that the confirming process of the alignment state of the wafer 3 and the cutting table 1 is added on the basis of the existing cutting process, and the cutting action of the cutting mechanism is controlled according to the confirmed alignment condition.
As shown in fig. 1, the present solution provides at least 4 through holes 5 on the existing cutting table 1, the axes of the through holes 5 are parallel to the axis of the cutting table 1, the actual number of the through holes 5 can be designed as required, and the positions of several through holes 5 are satisfied, when the wafer 3 is coaxial with the cutting table 1, the outer circumference of the tambour ring 4 of the wafer 3 is located at each through hole 5.
As shown in fig. 1, the through holes 5 are preferably four, four through holes 5 are distributed in a square shape, the distance from the axis of the four through holes 5 to the axis of the cutting table 1 is equal, and the distance is equivalent to the radius of the tympanum 4. The aperture of each through hole 5 can be designed according to the requirement, and for example, can be designed to be 5-15mm, and more preferably about 10 mm.
In the scheme, an image acquisition device (not shown in the figure) is used for acquiring images of the through holes of the wafer 3 on the cutting table so as to judge whether the wafer 3 is aligned with the cutting table. The image acquisition device can adopt various known cameras, CCDs, cameras and the like, preferably, the image acquisition device is a known shooting microscope and can acquire images of local areas in the through hole 5, the image acquisition device is arranged above the cutting table 1, a lens of the image acquisition device faces the cutting table 1 and is connected with a driving and moving structure (not shown in the figure), and the image acquisition device drives the image acquisition device to at least translate.
In order to ensure the image acquisition quality and improve the accuracy of image identification, the scheme is also provided with a light source (not shown in the figure) irradiating the through hole 5. The light source is a point light source with adjustable brightness and is positioned below the cutting table 1. In addition, in order to reduce the moving range of the image capturing device, the cutting table 1 is driven by the driving device to rotate, the cutting table 1 rotates to enable the through holes 5 to correspond to the light source positions in sequence, when one through hole 5 corresponds to the light source position, the light source can preferably face the through hole 5 rotated above the light source, the light of the light source can penetrate through the through hole 5, and the structure can reduce the light source as much as possible and simplify the structure for driving the visual capturing device to move.
As shown in fig. 2, the centering confirmation method specifically includes the following steps:
s0, placing a wafer 3 on the cutting table 1; in specific implementation, the wafer 3 in the material box is moved to the cutting table 1 through the feeding mechanical arm; of course, in other embodiments, the wafer 3 may be placed on the cutting table 1 by manual loading. Then, after the wafer 3 is adjusted to be concentric with the cutting table 1 as much as possible by the centering manipulator, the position of the wafer 3 is fixed, the wafer 3 can be fixed by vacuum adsorption, and the wafer 3 can be pressed on the cutting table 1 by combining a pressing piece on the basis of the vacuum adsorption. Generally, after adjustment, the outer circumference of the tera-drum ring 4 of the wafer 3 is located at four through holes 5 and covers a partial area of each through hole 5. Of course, in some special cases, there may be a case where a certain through hole 5 is located completely inside the outer circumference of the pseudodrum ring 4, or a case where one through hole 5 is located completely outside the outer circumference of the pseudodrum ring 4.
When the wafer 3 is aligned with the cutting table 1, the first part of each through hole 5 is positioned at the inner side of the outer circumference of the Taiko ring 4, and the second part is positioned at the outer side, when one through hole 5 rotates to correspond to the light source position, the first part cannot transmit light, so that the image acquired by the image acquisition device is black; the second part is a section of annular membrane 2 which is arranged outside the tympanum 4 and can transmit light, so that the image acquired by the image acquisition device is close to white, and an obvious bright-dark boundary line can appear in the image acquired by the image acquisition device, wherein the bright-dark boundary line is the outer circumference of the tympanum 4. Of course, if the through hole 5 is located completely inside the outer circumference of the tambour ring 4, the area of the through hole 5 is nearly black when the image is captured, and conversely, the image in the through hole 5 is nearly white.
S1, collecting a local image in a through hole 5 in a cutting table 1 on which a wafer 3 is placed through an image collecting device; the size of the partial image may be, for example, 1/10 of the cross-sectional area of the through hole, and may be larger or smaller, and is selected according to actual needs.
S2, determining whether the local image meets the requirements, and if so, executing S3; otherwise, executing S4; when the local image has a bright-dark boundary which is a straight line passing through the center of the local image or a preset distance away from the center of the local image, the image is determined to meet the requirement, otherwise, the image does not meet the requirement. The preset distance may be designed according to needs, and may be, for example, within 1mm, which is not limited herein. The reason for judging whether the straight-line bright-dark boundary line exists is that the image acquisition device only acquires a small part of the image of the reference hole, only a small section of the outer circumference of the Taizhou ring exists in the image, and the circle can be regarded as formed by sequentially connecting a plurality of straight lines end to end, so that the straight line position can be determined only by determining whether the straight line exists or not.
S3, taking the coordinate of a specific point on the optical axis of the lens of the image acquisition device in the reference coordinate system as a check coordinate when the local image is acquired, and executing S5; wherein the specific point can be any one of the optical center, the focal point or the intersection point of the optical axis and the cutting table top or an artificially designated point. The reference coordinate system is a coordinate system constructed with two straight lines perpendicular to the axis of the cutting table 1 and perpendicular to each other.
For example, the reference coordinate system uses two axes in the table top of the table 1 as an X axis and a Y axis and uses the axis of the table as a Z axis, and correspondingly, the center of the table top of the table 1 is the origin, and then the X coordinate and the Y coordinate of any point on the axis of the table are determined. Meanwhile, when the lens is at the initial position, the coordinate of the specific point on the optical axis in the reference coordinate system is determined, and since the lens only translates, the Z coordinate of the specific point in the reference coordinate system is unchanged, and only the X coordinate and the Y coordinate change. And calculating the coordinates of the specific point in the reference coordinate system after the specific point moves to different positions according to the translation data of the lens and the initial coordinates of the specific point. When the wafer 3 and the workbench are coaxial, the X coordinate and the Y coordinate of any point on the axes of the wafer and the workbench in the reference coordinate system are the same; when they are not coaxial, the Z coordinate of the same height point on the axis of the wafer 3 and the table 1 is the same, but the X coordinate and the Y coordinate are different.
S4, judging whether the image count reaches a set value or not, if not, after the image acquisition device moves to a position, acquiring the local image in the through hole 5 again, and executing S2; if yes, determining that the cutting table 1 and the wafer 3 are not aligned, and sending an alarm. The image count can be designed according to the actual needs, for example, 5-15 images can be acquired at one through hole 5. In this step, when the image pickup device is moved, the optical axis of the lens is moved in the vicinity of the axis of the through hole 5, for example, the lens is moved within a range of 2mm from the axis of the through hole 5.
S5, judging whether the number of the acquired check coordinates reaches a target value; if not, executing S6, and if so, executing S7; because there are four through holes 5, every through hole 5 department gathers one and checks the coordinate, correspondingly, check the quantity of coordinate and be 4.
S6, the image acquisition device acquires local images in the upper through hole 5 and the lower through hole 5 of the cutting table 1 and executes S2;
s7, determining whether the obtained group of check coordinates are accurate or not, and determining that the cutting table 1 is aligned with the wafer 3 when the check coordinates are accurate; otherwise, the cutting table 1 and the wafer 3 are determined not to be aligned, and an alarm is sent out.
The step S7 specifically includes determining whether the acquired set of collation coordinates is accurate,
s71, calculating the radius of a group of circles according to the group of check coordinates; taking four collation coordinates as an example, three collation coordinates can find the radius of one circle and the circle, so that four collation coordinates can find the radius of four circles.
And S72, comparing the maximum value and the minimum value in the set of calculated radiuses, and if the difference value of the maximum value and the minimum value is smaller than the error, determining that the set of check coordinates is accurate. I.e. the maximum value of the four radii is compared with the minimum value, and when their difference is less than the error, a set of said check coordinates is determined to be accurate. The error may be designed according to the requirement, for example, may be set to be less than 1mm, and is not limited herein.
By adopting the method, the continuous searching can be stopped after the accounting coordinate is found at each through hole 5, and the failure of the alignment between the wafer 3 and the cutting table 1 can be judged when the accounting coordinate is not found at one through hole 5, so that the efficiency can be effectively improved, meanwhile, the numerical support can be provided for the cutting of the Taichou ring 4, the cutting precision can be improved, and the cutting quality can be improved.
During actual image acquisition, the cutting table 1 enables the through holes 5 on the cutting table to correspond to the light source positions respectively through autorotation; in S1, the cutting table 1 enables a first through hole 5 on the cutting table to correspond to the light source position, and the image acquisition device moves to the first through hole 5 to acquire an image. If the image acquisition at the first through hole 5 is finished and a check coordinate is obtained, the cutting table 1 rotates by 90 degrees, so that the second through hole 5 corresponds to the light source, and then the image acquisition device acquires an image at the second through hole 5. If the image acquisition at the second through hole 5 is finished and a check coordinate is obtained, the cutting table 1 rotates 90 degrees again, so that the third through hole 5 corresponds to the light source, and then the image acquisition device acquires an image at the third through hole 5. If the image acquisition of the third through hole 5 is completed and a check coordinate is obtained, the cutting table 1 rotates 90 degrees again, so that the fourth through hole 5 corresponds to the light source, and then the image acquisition device acquires an image at the fourth through hole 5. After the image acquisition at the fourth through hole 5 is completed, the cutting table 1 is not rotated any more.
When a first image is collected at each through hole 5, the lens of the image collecting device is moved to be coaxial with each through hole 5, that is, in S1, the image collecting device is moved to be coaxial with the first through hole 5, and in S6, after the next through hole 5 rotates to correspond to the light source, the lens of the image collecting device is moved to be coaxial with the through hole 5.
The specific method for analyzing each local image is known in the art, and will not be described herein.
Example 2
This embodiment differs from embodiment 1 described above in that: in this embodiment, a light source may be configured for each through hole, so that when the image acquisition device needs to acquire images of through holes at different positions, the cutting table does not rotate, but the lens acquisition device sequentially moves to the first through hole, the second through hole, the third through hole and the fourth through hole to acquire images respectively.
Example 3
The embodiment discloses a method for cutting a taidrum ring, which includes the method for confirming alignment of the wafer 3, wherein when the method for confirming alignment of the wafer 3 confirms that the cutting table 1 is aligned with the wafer 3, the control device controls the cutting mechanism to cut according to preset cutting parameters. Otherwise, after alarming, the wafer 3 is adjusted manually, and then the cutting parameters are called for cutting.
The invention has various embodiments, and all technical solutions formed by adopting equivalent transformation or equivalent transformation are within the protection scope of the invention.
Claims (9)
1. The wafer centering confirmation method is characterized by comprising the following steps: the cutting table for placing the wafer is provided with at least 4 through holes with axes parallel to the axis of the cutting table, and when the wafer and the cutting table are coaxial, the outer circumference of the Taiwan ring of the wafer is positioned at each through hole;
after the wafer is adjusted and fixed on the cutting table, the following steps are carried out:
s1, collecting a local image in a through hole on a cutting table through an image collecting device;
s2, determining whether the local image meets the requirements, and if so, executing S3; otherwise, executing S4; when the local image has a bright-dark boundary which is a straight line passing through the center of the local image or a preset distance away from the center of the local image, determining that the image meets the requirement;
s3, acquiring the check coordinates during local image acquisition, and executing S5;
s4, judging whether the image count reaches a set value, if not, moving the image acquisition device to a position, acquiring the local image in the through hole again, and executing S2; if yes, determining that the wafer and the cutting table are not aligned, and sending an alarm;
s5, judging whether the number of the acquired check coordinates reaches a target value; if not, executing S6, and if so, executing S7;
s6, collecting local images in the next through hole on the cutting table by the image collecting device, and executing S2;
s7, determining whether the obtained group of check coordinates are accurate or not, and determining that the wafer is aligned with the cutting table when the check coordinates are accurate; otherwise, the wafer and the cutting table are determined not to be aligned, and an alarm is sent out.
2. The wafer centering confirmation method of claim 1, wherein: the cutting table is provided with four through holes which are distributed in a square shape.
3. The wafer centering confirmation method of claim 1, wherein: the image acquisition device is a camera microscope.
4. The method of claim 1, wherein: when the image acquisition device acquires a first image at each through hole, the lens of the image acquisition device is moved to be coaxial with the through hole.
5. The wafer centering confirmation method of claim 1, wherein: the cutting table enables the through holes on the cutting table to correspond to the light source positions respectively through autorotation;
in S1, the image acquisition device moves to a through hole corresponding to the light source for image acquisition;
in S6, other through holes are rotated one by one to correspond to the light source through the rotation of the cutting table, and then the image acquisition is carried out through the image acquisition device.
6. The wafer centering confirmation method of claim 1, wherein: each through hole corresponds to one light source, and when an image is collected, the image collecting device is moved to correspond to the position of each through hole.
7. The wafer centering confirmation method of claim 1, wherein: the S7 comprises the following steps:
s71, calculating the radius of a group of circles according to the group of check coordinates;
and S72, comparing the maximum value and the minimum value in the set of calculated radiuses, and if the difference value of the maximum value and the minimum value is smaller than the error, determining that the set of check coordinates is accurate.
8. The method of any one of claims 1-7, wherein: the reference coordinate system is a coordinate system in which a specific point on an optical axis of a lens of the image pickup device at the time of the local image pickup is in a reference coordinate system, and the reference coordinate system is constructed by at least two straight lines perpendicular to an axis of the cutting table and perpendicular to each other.
9. The Taizhou ring cutting method is characterized by comprising the following steps: the method for confirming wafer alignment as claimed in any of claims 1 to 8, wherein the control device controls the cutting mechanism to perform the cutting according to the preset cutting parameters when the wafer is aligned with the cutting table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210256899.8A CN114628299B (en) | 2022-03-16 | 2022-03-16 | Wafer alignment confirmation method and Taizhou ring cutting method |
Applications Claiming Priority (1)
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