CN116379398A - 高分辨率光源的布线 - Google Patents

高分辨率光源的布线 Download PDF

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Publication number
CN116379398A
CN116379398A CN202310213566.1A CN202310213566A CN116379398A CN 116379398 A CN116379398 A CN 116379398A CN 202310213566 A CN202310213566 A CN 202310213566A CN 116379398 A CN116379398 A CN 116379398A
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CN
China
Prior art keywords
electroluminescent
interposer
lighting
lighting element
source
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Pending
Application number
CN202310213566.1A
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English (en)
Inventor
尼古拉斯·利夫德路丝
安东尼·德朗贝特里
纪尧姆·廷
萨米拉·姆巴塔
托马斯·卡侬
万-泰伊·霍安吉
文森特·杜布瓦
弗朗西斯-泽维尔·阿米耶尔
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Valeo Vision SAS
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Valeo Vision SAS
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Publication of CN116379398A publication Critical patent/CN116379398A/zh
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/0017—Devices integrating an element dedicated to another function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/0088—Details of electrical connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/02—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments
    • B60Q1/04—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/02—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments
    • B60Q1/04—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights
    • B60Q1/14—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights having dimming means
    • B60Q1/1415—Dimming circuits
    • B60Q1/1423—Automatic dimming circuits, i.e. switching between high beam and low beam due to change of ambient light or light level in road traffic
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    • B60Q1/26—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic
    • B60Q1/30—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating rear of vehicle, e.g. by means of reflecting surfaces
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    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
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Abstract

本发明特别涉及一种地面车辆照明模块，该照明模块包括：电致发光源，该电致发光源包括至少一个电致发光元件；电子装置，该电子装置被设计用于控制电致发光元件；以及插入器，该插入器电连接电致发光源和电子装置。

Description

高分辨率光源的布线
本申请是申请号为201780057004.5的中国发明专利申请(申请日：2017年08月04日；发明名称：高分辨率光源的布线)的分案申请。
技术领域
本发明涉及用于地面车辆的照明模块领域，换句话说，可以集成到车辆的照明装置中的模块，以及当使用车辆时，允许投射照亮道路或乘客室的光和/或允许车辆自身更加可见的模块。这种照明装置的示例是标位灯或近光灯和/或远光灯(通常称为“前照灯”)。
背景技术
地面车辆配备有诸如前大灯或后灯之类的照明装置，特别是用于照亮和/或信号指示，这些照明装置被设计用于在夜间或在减少照明条件的情况下照亮车辆前方的道路。照明装置还可以用于照亮车辆的乘客室。这些照明装置可以包括一个或更多个照明模块。每种照明功能可以由一个或更多个模块提供。
在这些用于地面车辆的照明模块中，越来越多地使用半导体光源。这些光源可以包括发光二极管(或LED)、有机发光二极管(或OLED)或者聚合物发光二极管(或PLED)。与常规光源(诸如灯丝灯泡)相比，这些光源特别地提供尺寸和寿命优势。
这些新光源的使用为改善由车辆的照明装置提供的照亮特性提供了新的前景。特别地，使用单片LED阵列允许以非常高的精度选择待照亮并且以什么亮度照亮的场景区域。单片阵列包括位于同一基板上的数百或数千个LED，LED通过通道或通路彼此分离。在这种单片阵列环境中，LED也称为像素。然而，每个LED在电气上独立于其他LED，并且因此独立于阵列的其他LED自发地照明。为此目的，阵列中的每个LED由管理其电源的电子电路(称为“驱动器”的电路)单独控制，这意味着LED的密度越高，则用于为LED供电的线的数量也越大。
为了使阵列中的LED的电源的布线可行，已知称为“堆叠”的技术，该技术包括将LED阵列与管理其电源(或“驱动器”)的电路堆叠在一起。然而，存在许多限制这种堆叠的可行性的技术约束。首先，由于LED阵列与其驱动器的充分堆叠，因此散热降低。这是一个重要的问题，因为由LED产生的热导致部件内的温度升高，这可以使部件劣化和/或妨碍部件的最佳使用。此外，驱动器自身产生热，并且可能被LED产生的热破坏。另外，在驱动器的几何形状方面存在约束，该驱动器通常在ASIC上(“专用集成电路(Application-SpecificIntegrated Circuit)”的首字母缩写)实现。实际上，ASIC的标准化尺寸必须对应于符合其他标准的阵列的尺寸，以便获得尺寸尽可能最小的照明模块。然而，当前的标准没有提供这些不同尺寸之间的任何对应关系，使得驱动器和LED阵列之间的尺寸差异过大。
发明内容
为此目的，提供一种用于地面车辆的照明模块，该照明模块包括：电致发光源，该电致发光源包括至少一个电致发光元件；电子装置，该电子装置被设计用于控制电致发光元件；插入器，该插入器电连接电致发光源和电子装置。
根据各个示例，根据本发明的照明元件可以包括组合在一起的以下特征中的一个或更多个：
-电致发光源和电子装置布置在插入器的至少一个面上；
-在插入器的一个面上布置散热器；
-电致发光源和电子装置布置在插入器的第一面上，并且在插入器的第二面上布置散热器；
-散热器经由中间元件抵靠插入器的面布置，该中间元件包括下列中的至少一个：导热膏、铜层、粘合剂；
-插入器包括无机材料和有机材料中的至少一种；
-无机材料包括下列材料中的至少一种：硅、玻璃、陶瓷；
-电子装置包括至少一个功率转换器和/或一个集成电路；
-无源电子部件和/或有源电子部件；
-电子部件布置在插入器上和/或插入器中；
-插入器包括至少一个金属轨道，所述至少一个金属轨道电连接电子装置和电致发光源的所述至少一个电致发光元件；
-电致发光源包括串联地电连接的至少两个电致发光元件，并且插入器包括至少一个金属轨道，所述至少一个金属轨道电连接电子装置和串联地电连接的所述至少两个电致发光元件；
-至少一个电连接器，所述至少一个电连接器布置在插入器上并且电连接到电子装置；
-电致发光源是单片发光二极管阵列。
还提供了一种照明装置，特别是优选用于地面车辆的照明和/或信号指示装置，所述照明装置包括上述的照明元件。
附图说明
现在将参照附图，通过非限制性示例描述本发明的各种实施例，附图中：
图1示意性地示出了根据现有技术的电子装置；
图2示意性地示出了根据本发明的照明元件的一个示例；和
图3示意性地示出了根据本发明的单片阵列LED的布线的一个示例。
具体实施方式
图1示出了现有技术中已知的照明元件的一个示例，在术语“堆叠ASIC”下：LED阵列搁置在ASIC电路上以允许其被供电。LED阵列和驱动器之间的界面用阴影线表示。该界面可以包括粘合剂，以确保LED阵列保持与驱动器接触。
图2示出了根据本发明的照明元件的一个示例。照明元件可以是地面车辆照明模块。一个或更多个照明模块可以构造成照明装置或者可以集成到照明装置中。照明装置可以是前大灯、后灯或用于乘客室的照明设备。还提供了一种地面车辆，其包括一种或更多种样式的这种照明装置(例如，对于四轮车辆，在前部的一对或更多对样式和/或在后部的一对或更多对样式，或者对于两轮车辆或三轮车辆，在前部的一个或更多个样式和/或在后部的一个或更多个样式。
照明元件20包括至少一个电致发光源200，该电致发光源包括至少一个电致发光元件202。电致发光源是固态发光源，其包括至少一个电致发光元件。电致发光元件可以是但不限于发光二极管(LED)、有机发光二极管(OLED)、聚合物发光二极管(PLED)。因此，电致发光源是半导体光源，并且其包括基板204，电致发光元件从该基板204延伸。电致发光元件更通常地被称为像素。因此，照明元件至少包括沉积在基板204的第一面上或者从基板204的第一面延伸的多个像素。
电致发光元件均可以是半导体元件，换言之，电致发光元件均包括至少一种半导体材料。电致发光元件大部分可以由半导体材料制成。该半导体材料可以与基板的半导体材料相同或不同。电致发光元件更通常地可以全部由相同的一种或多种材料制成。电致发光元件可以具有相同的性质，例如基本上相同或相似的性质。可以定位所有电致发光元件以便形成规则图案，例如网格。
元件是电致发光的。这意味着当电致发光元件的材料被供电时这些元件发光。因此，当电致发光元件发光时，像素被称为点亮。电致发光元件使用电致发光来发光。电致发光是光学和电学现象，在此期间材料响应于从其流过的电流或者响应于高电场而发光。这与由于温度(炽热)或化学产品的作用(化学发光)引起的光发射不同。
在第一示例中，电致发光源是单片电致发光源，也称为单片LED阵列。单片阵列包括数百或数千个电致发光元件，这些电致发光元件位于同一基板204上，并且优选地位于基板的同一面上，该基板例如可以由蓝宝石制成。单片阵列的LED通过“通道”或“通路”彼此分离。因此，单片阵列是电致发光元件的网格或者是像素网格。阵列的每个电致发光元件与其他电致发光元件电气上独立，并且独立于阵列的其他元件发光或不发光。阵列的每个元件由称为“驱动器”的电子电路单独控制。另选地，电致发光元件可以被电分组，例如通过借助于并联或串联的配置对电致发光元件供电，以减少待管理的元件的数量。例如，这些组可以包括两到四个电致发光元件，该数量允许保留足够像素化的光束。驱动器管理单片阵列的电源，这相当于说其单独地控制每个电致发光元件的电源。因此，驱动器是一种电子装置，其被设计成控制电致发光元件的单片阵列的元件。
在第二示例中，照明元件包括至少一个半导体电致发光源，该半导体电致发光源包括基板204，该基板204大部分由半导体材料制成。因此，可以使用表述“半导体基板”来指代基板。基板可以包括一种或更多种其他材料，例如非半导体。电致发光源还包括从基板的第一面延伸的电致发光元件的一个或更多个组件。因此，照明元件至少包括从基板的第一面延伸的多个这样的元件。每个组件由从基板的第一面的相应部分延伸的若干元件构成。因此，电致发光元件可以分布在各个发光区域内。在一个示例中，各个这些区域可以是可选择性激活区域。元件可具有杆的一般形状，并且因此被称为“杆”。
同样，在该第二示例中，电致发光元件可以在一侧经由基板(例如，基板例如形成阴极)并且在另一侧经由导电材料层(例如，导电材料层例如形成阳极)供电，该导电材料层将电致发光元件电连接在一起。因此，每个电致发光元件的半导体材料与基板的半导体材料之间的接触可以适合于导电。导电材料层可以覆盖电致发光元件。导电材料层还可以覆盖电致发光元件从其延伸的基板的表面的每个部分，或者覆盖电致发光元件的组件从其延伸的基板的整个表面或面。导电材料层可以通过任何手段与基板的半导体材料电绝缘。这允许电致发光元件经由基板供电。因此，可以以简单的方式向电致发光元件供电，换句话说，通过向基板的导电材料提供一种极性并且向导电材料层提供另一种极性而向电致发光元件供电。
同样，在该第二示例中，电致发光源可以通过下列方法制造，该方法包括至少一个用于供应基板的步骤，然后通过从基板开始生长而使杆与基板一体形成的步骤。导电材料层可以通过沉积金属饰面(例如铜)的步骤形成，以便提供杆的驱动。该步骤还可以包括在基板的一个面上形成铝或铜垫，该垫被设计用于通过在源和驱动器部件之间的线而进行布线。通过线进行布线(“线接合”或“带接合”)是用于在电致发光源和用于向该源供电的装置之间进行电连接的技术之一。通过在每个元件上为此目的而设置的两个连接凸耳之间焊接的线(或桥)简单地形成布线。焊接可以通过超声波进行。线材可以是铝、金或铜。线的直径可以是20μm的量级。也可以使用具有矩形横截面的线。
优选地，电致发光源是单片电致发光源，例如在前面的第一示例中描述的电致发光源。单片源是具有高密度像素(或电致发光元件)的源。实际上，如果像素密度大于或等于400像素/平方厘米(cm2)，则可以认为电致发光源是单片电致发光源。换句话说，第一像素的中心与和第一像素相邻的第二像素的中心之间的距离等于或小于500微米(μm)；该距离也称为“像素间距”。
根据本发明的照明元件包括一个(或若干个)电子装置220，电子装置被设计成控制电致发光源的电致发光元件。这种电子装置例如可以是集成电路或功率转换器。
功率转换器是这样的装置，该装置用于将电源从车辆的电源系统转换成适于实现期望的照明功能的电源并且潜在地提供适合于电致发光源以实现所述期望照明功能的所述电源。
集成电路，也称为电子芯片，是再现一个或更多个电子功能的电子部件，并且该电子部件能够例如以减小的体积(即，在小的基板上)集成若干类型的基本电子部件。这使得电路易于实现。
集成电路例如可以是ASIC或ASSP。
ASIC(“专用集成电路(Application-Specific Integrated Circuit)”的首字母缩写)是为至少一个特定应用(换言之，为客户)开发的集成电路。因此，ASIC是专用(微电子)集成电路。通常，其将大量独特或定制的功能组合在一起。
ASSP(“专用标准产品(Application-Specific Standard Product)”的首字母缩写)是组合大量功能的集成电子(微电子)电路，以满足通常标准化的应用。ASIC被设计用于满足比ASSP更具体的需求。
电致发光源以及因此电致发光元件的电源经由电子装置实现，该电子装置自身借助于例如至少将其连接到电源的连接器供电。然后，电子装置向电致发光元件供电。因此，电子装置被设计为控制电致发光元件。
照明元件还包括插入器210，该插入器210电连接电致发光源200和电子装置220。插入器是允许在两个连接器之间按路线发送电力的电气接口。换句话说，插入器是允许至少两个连接器连接在一起的基板。两个连接器之间的连接的路线可以借助于导电轨道实现。轨道可以形成在插入器的基板上，换言之，可以形成在插入器的一个或更多个面的表面处。可以在插入器的基板内形成轨道，换句话说，轨道位于插入器的基板内部。轨道可以包括在基板上的部分和在插入器的基板中的部分。插入器可以包括先前描述的三种类型的轨道的任何给定组合。轨道包括至少两个连接器，这两个连接器位于轨道的每个端部中的任一端处并且允许与电致发光源的连接器和电子装置的连接器电接触。在图2中，轨道230形成在插入器的基板的内部，并且包括与电致发光源200的电致发光元件202的连接器连接的第一端232和与ASIC 220的连接器连接的第二端234，以实现电致发光源200的驱动器。
插入器的轨道通常是金属，因为金属提供良好的导电性；例如，轨道由铜制成。
插入器包括基板，该基板在其包括的各个轨道之间提供电绝缘。构成插入器的基板的一种或更多种材料可以是无机和/或有机材料。
无机材料主要包括但不限于合成和天然玻璃、搪瓷、陶瓷、石头等。优选地，插入器的基板可包括选自硅、玻璃、陶瓷的材料或材料的组合；硅和玻璃是有利的材料，因为他们的物理性质允许获得的轨道密度大于由其他材料提供的轨道密度。换句话说，硅和玻璃允许在两个轨道之间提供电绝缘，这两个轨道之间的距离小于另一种材料(例如陶瓷)所需的距离。与提供了更廉价的优点的玻璃相比，硅是使得散热最佳的材料。
有机材料包括但不限于环氧树脂、聚酰亚胺(诸如以名称Kapton销售的聚酰亚胺)、硅树脂。
一般而言，形成插入器的基板必须具有良好的耐热性。使用诸如先前提出的那些材料的无机材料有助于将热传递到照明元件外部。
插入器可以具有板的一般形状，该板具有两个相对的面。电致发光源和电子装置可以均布置在插入器的不同面上，或者布置在插入器的同一面上。布置意味着在插入器的一个面与电致发光源之间存在第一接触，并且在插入器的面与电子装置之间存在第二接触。接触优选是永久的。永久接触例如通过焊接，接合，诸如“倒装芯片”、“回流焊”、“铜柱”、“微管”、热超声AuSn”、“混合接合”等的任何给定工艺制成。
照明元件还可以包括至少一个散热器，该散热器布置在插入器的至少一个面上。散热器允许来自电致发光源的热传递，使得在使用照明元件期间来自电致发光源的热传送到插入器。因此，散热器与插入器之间的配合和电致发光源允许获得易于生产并易于安装在车辆照明装置中的地面车辆照明模块，从而产生相对小的尺寸，紧凑并且表现出良好的散热性能。
散热器允许经由与插入器的基板的协作来散热，换句话说，散热器接收由电致发光源产生的热。因此，散热器与插入器热连通，该插入器自身与电致发光源热连通。
可以通过以下事实提供传送：在一个示例中，散热器直接抵靠插入器布置。这意味着散热器与插入器物理(即材料)接触。
然而，散热器可以另选地经由中间元件抵靠插入器布置，该中间元件改善了热传递。中间元件布置在插入器和散热器之间。中间元件可以包括例如热化合物或相变材料。中间元件可以包括铜；例如，中间元件是铜板。中间元件也可以是粘合剂，该粘合剂保持抵靠插入器保持的散热器。
图2示出了其中电致发光源200和电子装置220布置在插入器210的同一面上的一个示例。这种配置是特别有利的，因为其允许散热器(图中未示出)布置在插入器的相对面上。
同样，在图2的示例中，电子装置包括控制电子装置，应该理解电子装置可以包括若干个控制电子装置。该电子装置可以被配置为与照明元件的电致发光元件相互作用，例如以便单独地控制来自每个元件的光的发射或不发射。应当理解，图2中的布置允许用于控制照明元件的电子器件尽可能靠近散热器。由于这些电子器件也产生热，因此该方案使得散热最佳。此外，该方案通过主要避免与照明元件分离的控制电子装置并因此提供额外的空间和附加必要的连接器，而允许改善照明元件的紧凑性。实际上，在诸如图1所示的现有技术中，固定在LED模块的部件上的驱动器导致因驱动器而使LED自加热，这会降低光强度的性能。类似地，驱动器继而由LED加热，因此热敏感性更高。在现有技术中，出于给定冷却水平的目的，这可能导致散热器尺寸的增加。
根据本发明的照明元件还可以包括一个或更多个无源电子部件，换句话说，不放大电信号的电子部件。另选地，根据本发明的照明元件还可以包括一个或更多个有源电子部件，换句话说，放大电信号的电子部件。应该理解，照明元件可以既包括无源电子部件又包括有源电子部件。这些电子部件例如可以是ESD保护能力、保护齐纳二极管、箱式电阻器。这些部件可以形成电子电路的一部分，用于控制和保护电致发光源。还应该理解，照明元件的其他元件可以包括无源电子部件和/或有源电子部件；例如，控制件可以是有源电子装置和/或无源电子装置的部件。
该(或这些)无源电子部件和/或有源电子部件可以至少部分地布置在插入器的一个面上；该布置例如如先前针对光源和电子装置所讨论的那样实现。
该(或这些)无源电子部件和/或有源电子部件可以布置在插入器中，换句话说，其被实施在插入器的基板内。换句话说，插入器不仅起到用于导电轨道的支撑介质的作用，而且起到用于电子部件的支撑介质的作用。例如，可以设想插入器用作电致发光源的电致发光元件的基板204。还可以设想插入器实现被设计用于控制电致发光元件的电子装置。
照明元件还可以包括至少一个电连接器240，所述至少一个电连接器布置在插入器上并且电连接到电子装置。当连接器240连接到照明元件外部的电源时，连接器允许照明元件被供电。在实践中，照明元件包括至少三个连接器，用于向照明元件提供DC电流；例如，第一连接器利用正电压为模块供电，第二连接器利用负电压为模块供电，以及第三连接器提供接地。大地可以作为低电压(0伏)。连接器的存在有助于基于SiP(“系统级封装(Systemin Package)”的首字母缩写)的原理在使用该照明元件的装置中附加或移除照明元件。例如，根据本发明的照明元件可以通过卡扣配合或拧入汽车前照灯中而容易地附加；其在有缺陷时同样可以容易地从前照灯中移除并更换。
单片电致发光源具有高密度的像素。根据本发明的照明元件的插入器提供了一种基板，经由该基板可以将光源与电子装置电连接，因为插入器允许提供足够多数量的电气轨道，使得电致发光源的每个元件能够由电子装置控制。然而，为了减少需要布线在插入器上的轨道的数量，电致发光源的若干电致发光元件可以串联地电连接。然后，串联连接的元件仅需要单个公共电源，换句话说，仅需要插入器的单个轨道，以便电连接电子装置和串联地电连接的电致发光元件。应当理解，当源的像素密度太高时，可以减少需要“布线”在插入器上的轨道数量。
串联的电致发光元件的选择可以是任意选择；例如，源的元件成对地串联连接。该选择还可以取决于照明元件的使用条件。例如，如果照明元件用作地面车辆的照亮源和/或信号产生源，则仅电致发光源的某些区域需要全分辨率(换句话说，所有电致发光元件必须被单独控制)，而其他区域需要较低的分辨率(换句话说，电致发光元件不需要被单独控制)。
图3示出了其中单片LED阵列200已被细分为九个区域的一个示例。标为B、D、F、H、I的区域是已保存最大分辨率的区域：每个LED由电子装置220单独控制。标为A、C、E、G的区域是LED已被序列化以创建组的区域。例如，区域A被细分为六个组A1、A2、A3、A4、A5和A6，并且在这些组中的每一组内，LED串联连接，使得仅需要单个轨道来控制他们。区域A、C、E、G位于阵列的拐角上，因为在使用照明元件作为地面车辆的光源时，由这些区域照亮的空间不需要高分辨率，因为该空间在正被照亮的场景的周边。

Claims (10)

1.一种用于地面车辆的照明元件(20)，所述照明元件包括：
-电致发光源(200)，所述电致发光源包括至少一个电致发光元件(202)；
-电子装置(220)，所述电子装置被设计用于控制所述电致发光元件；
-插入器(210)，所述插入器电连接(230、232、234)所述电致发光源和所述电子装置。
2.根据权利要求1所述的照明元件，其中，所述电致发光源(200)和所述电子装置(220)布置在所述插入器的至少一个面上。
3.根据权利要求1和2中的任一项所述的照明元件，其中，在所述插入器的一个面上布置散热器。
4.根据权利要求2和3所述的照明元件，其中：
-所述电致发光源和所述电子装置布置在所述插入器的第一面上；并且
-所述散热器抵靠所述插入器的第二面布置。
5.根据权利要求3和4中的任一项所述的照明元件，其中，所述散热器经由中间元件抵靠所述插入器的面布置，所述中间元件包括下列中的至少一个：
-导热膏；
-铜层；
-粘合剂。
6.根据权利要求1至5中的任一项所述的照明元件，其中，所述插入器包括下列材料中的至少一种：
-无机材料；
-有机材料。
7.根据权利要求6所述的模块，其中，所述无机材料包括下列材料中的至少一种：
-硅；
-玻璃；
-陶瓷。
8.根据权利要求1至7中的任一项所述的照明元件，其中，所述电子装置包括至少一个功率转换器和/或一个集成电路。
9.根据权利要求1至8中的任一项所述的照明元件，还包括无源电子部件和/或有源电子部件。
10.根据权利要求9所述的照明元件，其中，所述电子部件布置在所述插入器上和/或所述插入器中。
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