CN116375495B - 一种黑色透气抗静电陶瓷板的制备方法 - Google Patents
一种黑色透气抗静电陶瓷板的制备方法 Download PDFInfo
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- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims description 4
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Abstract
本发明公开了一种黑色透气抗静电陶瓷板的制备方法，属于多孔透气陶瓷材料技术领域。本发明黑色透气抗静电陶瓷板包含以下质量百分比的原料：15％‑30％Al2O3、15％‑25％方解石或长石、着色剂40％‑50％、煤粉或木碳粉5％‑12％、碳酸钡0.5‑1％。本发明经过试验，通过选配合适原料和比例，采用特定的二次烧结工艺，最终烧成的陶瓷板，具有烧成温度低，收缩率小，无反光点，黑色均匀，中值孔径处于2‑5μm，孔隙度不低于30％等优点，可以加工成各种形状的真空陶瓷吸盘，应用范围广，能适应市场需求。
Description
技术领域
本发明属于陶瓷材料技术领域，具体涉及一种黑色透气抗静电陶瓷板的制备方法。
背景技术
在先进的大规模集成电路制造过程中有着几百种工艺步骤，圆片需要在多达几百种的工艺设备之间来回传输并进行加工检测。在加工过程中，圆片必须被十分平稳、固定地安放在工艺设备上。传统的夹持技术如真空吸盘、机械夹盘已经满足不了现在工艺技术的要求。静电卡盘技术因具有作用力分布均匀，圆片不会翘曲，非直接接触，污染少等技术优势而被广泛应用在等离子和真空环境下的半导体工艺过程中，比如刻蚀、化学气相沉淀、离子植入等。这种技术优势在于它对良率的提升、没有圆片边缘排除效应、圆片夹持均匀度好、可控温度等等。一个典型的静电吸盘夹持系统是一个三明治结构包括三部分：电介质吸附层、电极层、基底层，三部分都以层状结构叠合在静电吸盘内自表层到底座依次为电介质吸附层、电极层和基底层。实际应用中，圆片充当上表面的电极，下电极和电介质被整合制造在一个部件中。在圆片制造过程中，一个直流电压加在圆片和下电极之间，圆片由于静电吸引力被夹持在静电吸盘上。此外，圆片的热量可以通过流经圆片背面的热传导气体如氦气传导出去，达到温度控制的作用。
无机材料具有较复杂的显微结构、往往为多晶多相，含有晶粒、晶界、气孔等。陶瓷材料的导电机构有电子电导又有离子电导。一般杂质及缺陷的存在是影响导电性的主要内在因素，因而多晶多相材料中，如形成间隙或缺陷固溶体，其电导率增大。按照陶瓷材料导电能力的强弱(通常用电阻率ρv表示)可将其区分为三类：陶瓷电介质(ρv>109Ω.cm)、陶瓷半导体(ρv＝10-2Ω.cm～109Ω.cm)、陶瓷快离子导体(ρv<10-2Ω.cm)。陶瓷材料的导电能力取决于其结构与组成，影响电导率的主要因素有气孔率的大小，气孔率对电导的影响对等体积均匀分布的低气孔率来说，随着气孔率的增加，电导率按比例减小。
作为电子产品用途的氧化铝陶瓷，由于其应用领域的特殊性，其黑色着色色料的选择则必须要考虑到陶瓷材料的性能。例如，必须考虑到陶瓷材料应具有较高的电阻率，即黑色氧化铝陶瓷在制备的时候就要从色料的选择上考虑到其使用上的要求，不仅要保证陶瓷基板颜色的黑度、机械强度，同时也要保证陶瓷基板的电学性能、热学性质以及用作电子器件时应具备的其他性能。
目前国内市场的透气陶瓷板的颜色大多都是浅灰色和白色，不能达到纯黑色的程度，同时还存在有电导率低、反光点、透气率低的缺陷问题，不能满足现如今的市场需求，不适应现代的科技发展需求。
发明内容
针对现有技术存在的上述问题，本发明所要解决的技术问题在于提供一种黑色透气抗静电陶瓷板的制备方法，该方法制得的黑色透气抗静电陶瓷板纯黑色，无反光点，分布均匀，抗静电、透气性好。
为了解决上述技术问题，本发明所采用的技术方案如下：
一种黑色透气抗静电陶瓷板的制备方法，步骤包括：
1)称取以下质量百分比的原料：15％-30％Al2O3、15％-25％方解石或长石、着色剂40％-50％、煤粉或木碳粉5％-12％、碳酸钡0.5-1％，烘干备用；
2)将原料与球混合后，进行球磨，得到黑色混合粉末，进行筛分备用；
3)将黑色混合粉末干压成型后，放入电炉控温850-900℃烧结，保温1h以上；
4)自然冷却后，转入气压烧结炉中，在惰性气体氛围中升温至1050-1150℃以上，保温1h，自然冷却后，即得黑色透气抗静电陶瓷板。
所述的着色剂选自氧化铁、氧化锰、氧化镍、氧化钴、氧化铬、氧化钛中的一种或几种。
步骤1)中，烘干10-15h备用。
步骤2)中，球与原料按照1:1.2的比例分批进行球磨，球磨速度为40-50转/分钟，球磨时间为8-12小时。
步骤3)中，球磨结束后过100目筛得到黑色混合粉末。
步骤4)中，以1℃/3min的速度升温至850℃，保温1h。
步骤5)中，以1℃/2min的速度升温至1150℃，保温1h。
所述方法制得的黑色透气抗静电陶瓷板。
所述黑色透气抗静电陶瓷板在电子产品中的应用。
相比于现有技术，本发明的有益效果为：
本发明经过试验，通过选配合适原料和比例，采用特定的二次烧结工艺，最终烧成的陶瓷板，具有烧成温度低，收缩率小，无反光点，黑色均匀，中值孔径处于2-5μm(孔径可调)，孔隙度不低于30％等优点，可以加工成各种形状的真空陶瓷吸盘，应用范围广，能适应市场需求。
附图说明
图1为4倍镜头下产品1的表象影像图；
图2为4倍镜头下产品3与对比产品1的表象影像图。
具体实施方式
下面结合具体实施例对本发明进一步进行描述。这些实施例仅用于说明本发明而不用于限制本发明的范围。在不背离本发明精神和实质的情况下，对本发明方法、步骤或条件所作的修改或替换，均属于本发明的范围。以下实施例中如无特殊说明，实施例中所用的技术手段均为本领域技术人员所熟知的常规手段。
实施例1
按照表1的原料用量制备黑色透气抗静电陶瓷板，本实施例制备的产品尺寸为：直径550mm的圆板，厚度为20mm。
具体的制备步骤如下：
1)取表1中的原料组分进行混合，烘干备用；
2)将球与原料按照1:1.2的质量比分批进行球磨，球磨速度为40-50转/分钟，球磨时间为8-12h；
3)球磨结束后过100目筛，得到的黑色混合粉末在1000吨压力下干压成型；
4)将压制成型的板材放入普通电陶炉中以1℃/3min的速度升温至850℃，保温1小时；
5)自然冷却后转入气压烧结炉中，通入惰性气体，以1℃/2min的速度升温至1150℃，保温1h，自然冷却后即得黑色透气抗静电陶瓷板。
表1产品组分和用量(单位为份数)以及检测结果
其中，烧制是否合格直接采用肉眼观察，无开裂或其他肉眼可见的瑕疵即视为合格产品；反光点以及黑色均匀性均采用肉眼观测。电阻值采用表面电阻测试仪测定(DESCO19290重锤式表面电阻仪)；采用压汞法测试孔隙度和中值孔径(GB/T21650.1-2008/ISO15901-1:2005)。
如图1-2所示，本发明制得黑色透气抗静电陶瓷板产品1的气孔孔径小于2μm，无明显反光点；对比产品的气孔孔径大，有明显的反光点，反光点的存在会使作为电子产品用途的黑色透气抗静电陶瓷板的精确度降低。
实施例2
按照实施例1的方法制备产品3，不同在于，分别按照表2中的程序升温，进行产品烧制，并对产品的收缩率、开裂比例以及成品是否成瓷进行检测。
表2产品不同的制备方法以及检测结果
从表2可以看出，通过控制升温速率、烧结温度以及烧结次数，可以有效提高产品的烧结合格率，并在一定程度上控制产品的形变(收缩率)以及电阻值。
Claims (6)
1.一种黑色透气抗静电陶瓷板的制备方法，其特征在于，步骤包括：
1)称取以下质量百分比的原料：15％-30％Al2O3、15％-25％方解石或长石、着色剂40％-50％、煤粉或木碳粉5％-12％、碳酸钡0.5-1％，烘干备用；
2)将原料与球混合后，进行球磨，得到黑色混合粉末，进行筛分备用；
3)将黑色混合粉末干压成型后，放入电炉控温以1℃/3min的速度升温至850-900℃烧结，保温1h以上；
4)自然冷却后，转入气压烧结炉中，在惰性气体氛围中以1℃/2min的速度升温至1050-1150℃以上，保温1h，自然冷却后，即得黑色透气抗静电陶瓷板；
所述的着色剂选自氧化铁、氧化锰、氧化镍、氧化钴、氧化铬、氧化钛中的一种或几种；
所述的黑色透气抗静电陶瓷板：收缩率小，无反光点，黑色均匀，中值孔径处于2-5μm，孔径可调。
2.根据权利要求1所述的黑色透气抗静电陶瓷板的制备方法，其特征在于，步骤1)中，烘干10-15h备用。
3.根据权利要求1所述的黑色透气抗静电陶瓷板的制备方法，其特征在于，步骤2)中，球与原料按照1:1.2的比例分批进行球磨，球磨速度为40-50转/分钟，球磨时间为8-12小时。
4.根据权利要求1所述的黑色透气抗静电陶瓷板的制备方法，其特征在于，步骤2)中，球磨结束后过100目筛得到黑色混合粉末。
5.权利要求1-4任一所述方法制得的黑色透气抗静电陶瓷板。
6.权利要求5所述黑色透气抗静电陶瓷板在电子产品制备工艺中的应用。
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