CN116314159A

CN116314159A - Lighting panel, manufacturing method thereof and desk lamp

Info

Publication number: CN116314159A
Application number: CN202310152255.9A
Authority: CN
Inventors: 王恺君; 闫春辉; 孙伟
Original assignee: Naweilang Technology Shenzhen Co ltd
Current assignee: Naweilang Technology Shenzhen Co ltd
Priority date: 2023-02-07
Filing date: 2023-02-07
Publication date: 2023-06-23

Abstract

The application discloses an illumination panel, a manufacturing method thereof and a desk lamp. The illumination panel includes a flexible substrate, a circuit layer, a reflective layer, and a plurality of light emitting chips. The circuit layer is arranged on the flexible substrate. The reflecting layer is arranged on the circuit layer in a bending way. The light emitting chips are arranged on the reflecting layer at intervals. The reflective layer is formed with a first contact via. One electrode of the light emitting chip is electrically connected with the circuit layer through the first contact channel. The reflecting layer is provided with a second contact channel, and the other electrode of the light emitting chip is electrically connected with the circuit layer through the second contact channel. Through the mode, the illumination panel has flexible characteristics and can be deformed as required.

Description

Lighting panel, manufacturing method thereof and desk lamp

Technical Field

The application relates to the technical field of illumination, in particular to an illumination panel, a manufacturing method thereof and a desk lamp.

Background

The desk lamp is mainly placed on a writing desk, a workbench or a clothes closet for illumination, is a movable lamp and is flexible to use. In the related art, a rigid lamp tube or a lamp strip is generally used as a light emitting element. Thus, the range of illumination of the desk lamp is relatively small and concentrated. At present, the desk lamp generally only can change the direction of illumination through changing the shape of its support column to can not change rigid light-emitting component, lead to the mode of desk lamp illumination comparatively singlely, can't be according to the arbitrary deformation of demand, adapt to the poor ability of different scenes.

Disclosure of Invention

The embodiment of the application provides an illumination panel, a manufacturing method thereof and a desk lamp, wherein the illumination panel has flexible characteristics and can be deformed as required.

In a first aspect, embodiments of the present application provide an illumination panel. The illumination panel includes a flexible substrate, a circuit layer, a reflective layer, and a plurality of light emitting chips. The circuit layer is arranged on the flexible substrate. The reflecting layer is arranged on the circuit layer in a bending way. The light emitting chips are arranged on the reflecting layer at intervals. The reflective layer is formed with a first contact via. One electrode of the light emitting chip is electrically connected with the circuit layer through the first contact channel. The reflecting layer is provided with a second contact channel, and the other electrode of the light emitting chip is electrically connected with the circuit layer through the second contact channel.

In a second aspect, embodiments of the present application provide a method for manufacturing an illumination panel. The manufacturing method of the illumination panel comprises the following steps:

providing a flexible substrate on a rigid substrate;

manufacturing a circuit layer on a flexible substrate;

connecting the light emitting chip with the circuit layer;

manufacturing a first heat dissipation layer on the circuit layer and the light-emitting chip

Peeling the flexible substrate from the rigid substrate;

manufacturing a second heat dissipation layer on one side of the flexible substrate far away from the circuit layer;

and manufacturing a packaging body for packaging.

In a third aspect, embodiments of the present application provide a desk lamp. The desk lamp comprises a base, a supporting piece, a cover plate and the lighting panel. The apron has relative first side and second side, and support piece one end is connected with the base, and the other end is connected with first side, and the illumination panel sets up in the second side.

The beneficial effects of this application are: unlike the case of the prior art, the flexible substrate can carry a circuit layer, a reflective layer, and a light emitting chip laminated thereon. The circuit layer is connected with the anode and the cathode of the light-emitting chip through the first contact channel and the second contact channel to form a loop. Wherein, the circuit layer and the reflecting layer arranged on the flexible substrate can be bent. The light emitting chips are disposed on the reflective layer at intervals. So make the illumination panel can have flexible characteristic, can change the orientation of luminous chip through crooked to make the illumination panel can carry out corresponding deformation as required, in order to match different service scenario.

Drawings

FIG. 1 is a schematic diagram of an embodiment of a desk lamp of the present application;

FIG. 2 is a schematic view of the desk lamp illumination panel of FIG. 1 removed from the cover plate;

FIG. 3 is a schematic diagram of an embodiment of a desk lamp according to the present application;

FIG. 4 is a schematic view of the desk lamp illumination panel of FIG. 2 removed from the cover plate;

FIG. 5 is a schematic diagram of an embodiment of a desk lamp according to the present application;

FIG. 6 is a schematic diagram of an embodiment of a lighting panel of the present application;

FIG. 7 is a detailed schematic view of the illumination panel of FIG. 6;

FIG. 8 is a schematic view of an embodiment of an illumination panel of the present application

FIG. 9 is a schematic view of another embodiment of an illumination panel of the present application;

fig. 10 is a schematic step diagram of a method of manufacturing an illumination panel of the present application.

Detailed Description

The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

The embodiment of the application provides a desk lamp 1. Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a desk lamp 1 of the present application. The desk lamp 1 includes a lighting panel 100, a base 200, a supporter 300, and a cover 400. The base 200 enables the desk lamp 1 to be placed on a desk, table or closet. The base 200 may house therein a circuit assembly for controlling the desk lamp 1. A switch may also be provided on the base 200 to control the switch, color, brightness, etc. of the desk lamp 1. The base 200 may be configured to have a clamping function to clamp onto a bed head or rail.

The support 300 can connect the cover plate 400 and the base 200, thereby stably supporting or suspending the cover plate 400. The support 300 may be in the form of a bellows or a strip of metal, etc., so that the support 300 has a bendable function, so that the desk lamp 1 can change the lighting pattern by bending the support posts 105. The support 300 may be provided hollow, the interior of which may be used for routing.

The cover plate 400 has opposite first and

second sides

401 and 402, and the support 300 has one end connected to the base 200 and the other end connected to the first side 401, and the lighting panel 100 is disposed on the second side 402. The cover plate 400 is capable of mounting the lighting panel 100, providing mechanical support for the lighting panel 100. The material of the cover plate 400 may be made of a stiffer material. The cover plate 400 having a relatively high rigidity may have a predetermined shape when being designed and manufactured, and the flexible lighting panel 100 may be formed to have a shape similar to the predetermined shape by bending and deforming, thereby being attached to the cover plate 400.

In an embodiment, referring to fig. 1 and 2, the edge of the illumination panel 100 is bent and provided with a mounting groove 1001, and the cover plate 400 is disposed in the mounting groove 1001 to mount the illumination panel 100 to the cover plate 400. By the arrangement, the lighting panel 100 not only can cover the second side 402 of the cover plate 400, but also can cover other side surfaces of the cover plate 400 by the lighting panel 100, so that light generated by the lighting panel 100 can be emitted towards more directions, and the desk lamp 1 has a larger lighting range.

In an embodiment, referring to fig. 3 and 4, at least a portion of the edge of the second side 402 of the cover plate 400 protrudes toward the direction approaching the lighting panel 100, and the flange 410 and the cover plate 400 enclose a receiving groove 403, so that the lighting panel 100 is received in the receiving groove 403. After the illumination panel 100 is accommodated in the accommodating groove 403, the flange 410 can shield the light propagation path of the illumination panel 100 in the direction of the flange 410, so that when the desk lamp 1 is used on the side of the support 300 facing the flange 410, the light can be less directly irradiated to eyes of a user, and an eye protection effect is achieved.

In one embodiment, referring to fig. 5, the cover plate 400 may be flexibly disposed. For example, the cover plate 400 is made of metal, and the thickness of the cover plate 400 is 0.5-10 micrometers. Such as 0.8-8 microns, 1-6 microns, or 3-5 microns. The cover plate 400 has a rigidity greater than that of the illumination panel 100. So configured, since the cover plate 400 has a stiffness greater than that of the lighting panel 100, the cover plate 400 is still able to provide mechanical support for the lighting panel 100. The cover plate 400 has a certain flexibility since it is made of 0.5-10 μm metal. As such, a user can apply an external force to the cover plate 400 as needed, bend the cover plate 400 into a desired shape, and the cover plate 400 is sufficiently rigid to maintain the shape under the weight of the lighting panel 100 and itself. The flexible lighting panel 100 can follow the deformation of the cover plate 400, so that the lighting mode of the desk lamp 1 can be freely set by a user. Alternatively, the material of the cover plate 400 may be an organic plastic such as polymethyl methacrylate (PMMA), acryl, polyimide, or the like.

The embodiments of the lighting panel 100 described above are described in detail below.

Referring to fig. 6, the illumination panel 100 includes a flexible substrate 101, a circuit layer 102, a reflective layer 103, and a plurality of light emitting chips 104.

The material of the flexible substrate 101 may be any of polyimide, triacetate film, and the like. The flexible substrate 101 may be a metal sheet with good bending properties, such as copper or aluminum, or a glass sheet. Alternatively, the flexible substrate 101 has a thickness of 10-100 microns. Such as 20-40 microns, 25-35 microns, or 30 microns. The flexible substrate 101 within this thickness range enables the lighting panel 100 to have proper flexibility. The minimum thickness of the flexible substrate 101 is limited by the current material characteristics, and if the thickness of the flexible substrate 101 is greater than 100 micrometers, the overall thickness of the lighting panel 100 is greater, the rigidity is greater, and the bending radius is greater.

Further, a buffer layer 108 may be further provided between the flexible substrate 101 and the circuit layer 102. The material of the buffer layer 108 may be polyimide, silicon oxide, silicon nitride, or the like. The buffer layer 108 can improve stress distribution between the flexible substrate 101 and the circuit layer 102, thereby avoiding failure of the circuit layer 102 such as cracking due to stress. Optionally, the thickness of buffer layer 108 is 0.1-2 microns. If the thickness of the buffer layer 108 is less than 0.1 μm, its ability to improve stress distribution may be impaired, and its strength may be reduced, affecting the connection between the circuit layer 102 and the flexible substrate 101. If the thickness of the buffer layer 108 is greater than 2 micrometers, stress may be generated by itself, which affects the connection between the circuit layer 102 and the flexible substrate 101. And may result in an increase in thickness and a decrease in flexibility of the illumination panel 100.

The circuit layer 102 may be a single-layer patterned metal circuit that is designed to be able to connect with the positive and negative poles of a power supply or different phases of alternating current and conduct the current to the positive and negative poles of a light emitting chip, respectively. In some embodiments, the circuit layer 102 is a multi-layer structure. The circuit layer 102 includes a bendable first metal layer 1021, a bendable second metal layer 1022, and a bendable insulating layer 1023. The first metal layer 1021 is disposed on the flexible substrate 101. The second metal layer 1022 is disposed on the first metal layer 1021. The insulating layer 1023 is disposed between the first metal layer 1021 and the second metal layer 1022. The first metal layer 1021 and the second metal layer 1022 can be connected to the positive and negative of direct current or alternating current of different phases. The first metal layer 1021 and the second metal layer 1022 may be connected to two electrodes of the light emitting chip 104, respectively, so that direct current or alternating current is supplied to the light emitting chip 104 to cause the light emitting chip 104 to emit light. The insulating layer 1023 can insulate the first metal layer 1021 and the second metal layer 1022, thereby avoiding a short circuit therebetween.

Wherein the first metal layer 1021 has a thickness of 0.1-20 microns, such as 0.5-15 microns, 2-10 microns, or 4-6 microns. The second metal layer 1022 has a thickness of 0.1-20 microns, such as 0.5-15 microns, 2-10 microns, or 4-6 microns. The material of the insulating layer 1023 may be polyimide, silicon oxide, or silicon nitride. The insulating layer 1023 has a thickness of 0.4-20 microns, such as 0.5-15 microns, 2-10 microns, or 4-6 microns. If the thickness of the insulating layer 1023 is too small, the insulating performance may be deteriorated, and the risk of short-circuiting between the first metal layer 1021 and the second metal layer 1022 may be increased. If the thickness of insulating layer 1023 is too thick, the via process may be difficult to achieve.

Referring to fig. 7, the reflective layer 103 may be disposed on the circuit layer 102 in a bendable manner. The light emitting chips 104 are disposed on the reflective layer 103 at intervals. The light emitting chip 104 emits light on the reflective layer 103, and the reflective layer 103 can reflect the light emitted from the light emitting chip 104, thereby improving the light emitting efficiency of the illumination panel 100. Wherein the reflective layer 103 is formed with a first contact channel 113. One of the electrodes of the light emitting chip 104 is electrically connected to the circuit layer 102 through the first contact via 113. The reflective layer 103 is formed with a second contact via 114, and the other electrode of the light emitting chip 104 is electrically connected to the circuit layer 102 through the second contact via 114. Alternatively, the material of the reflective layer 103 is reflective ink, silver, or aluminum. The thickness of the reflective layer 103 is 0.1-100 microns.

Further, a side of the reflective layer 103 remote from the circuit layer 102 is provided with a first heat dissipation layer 106. The material of the first heat dissipation layer 106 may be a transparent heat dissipation material such as a graphite film. The light emitting chip 104 generates heat during the light emitting process, and if the heat cannot be timely dissipated, the light emitting efficiency of the light emitting chip 104 is reduced or even damaged. The first heat dissipation layer 106 is configured to timely transfer heat generated by the light emitting chip 104, so as to reduce heat concentration. Optionally, the light emitting chip 104 is embedded in the first heat dissipation layer 106, so that the contact area between the light emitting chip 104 and the first heat dissipation layer 106 can be increased, and the heat dissipation capability is enhanced.

The side of the flexible substrate 101 remote from the circuit layer 102 is provided with a second heat dissipation layer 107. Heat generated from the light emitting chip 104, the circuit layer 102, and the like can be transferred from the second heat dissipation layer 107. The material of the second heat dissipation layer 107 may be graphite, aluminum, copper, or the like. Further, the first heat dissipation layer 106 and the second heat dissipation layer 107 are disposed on both sides of the flexible substrate 101, the circuit layer 102, and the light emitting chip 104, respectively, that constitute a whole. Thereby, heat generated from the light emitting chip 104, the circuit layer 102, and the like can be transferred from two different directions, thereby facilitating improvement of heat dissipation efficiency.

In one embodiment, referring to fig. 6, an encapsulation layer 109 is disposed on the first heat dissipation layer 106. The encapsulation layer 109 can protect the underlying circuit layer 102 and the light emitting chip 104 from other layers or the outside world above the encapsulation layer 109. The encapsulation layer 109 is provided with a diffusion layer 110 and a conversion layer 111 stacked thereon. The diffusion layer 110 is used for correcting light into a uniform area light source, and can diffuse light emitted by the light emitting chip 104, so as to improve uniformity of the light. The conversion layer 111 is used to convert light generated by the light emitting chip 104 into illumination light, for example, to convert light emitted by the light emitting chip 104 into white light or other light having a specific wavelength. The conversion layer 111 may be a fluorescent powder color conversion layer, a quantum dot color conversion layer, or the like, and is not particularly limited. The conversion layer 111 and the diffusion layer 110 may be stacked in such a manner that the conversion layer 110 is disposed on the diffusion layer 110. In this way, the light emitted by the light emitting chip 104 is uniformly diffused by the diffusion layer 110, and then converted into illumination light by the conversion layer 111. The conversion layer 111 and the diffusion layer 110 may be stacked in such a manner that the diffusion layer 110 is disposed on the conversion layer 111. In this way, the light emitted by the light emitting chip 104 is converted into the light required for illumination through the conversion layer 111, and then uniformly diffused through the diffusion layer 110. Alternatively, the thickness of the diffusion layer 110 is 0.05-0.5 mm. If the thickness of the diffusion layer 110 is greater than 0.5 mm, the thickness and flexibility of the entire lighting panel 100 may be affected, and if the thickness of the diffusion layer 110 is less than 0.05 mm, the uniformity of the diffusion of light by the diffusion layer 110 may be reduced. The thickness of the conversion layer 111 is 0.05-0.5 mm. If the thickness of the conversion layer 111 is less than 0.05 mm, the capability of the conversion layer 111 to convert illumination light is reduced, resulting in direct emission of light from the light emitting chip 104, which affects the illumination effect. The thickness of the conversion layer 111, if greater than 5 mm, affects the thickness and flexibility of the entire lighting panel 100.

In another embodiment, referring to fig. 8, an encapsulation color conversion layer 115 is disposed on the first heat dissipation layer 106, and the composition of the encapsulation color conversion layer 115 includes an encapsulation adhesive and a phosphor. The encapsulant can protect the layers below the encapsulant color conversion layer 115 from the layers above the encapsulant color conversion layer 115 and from the outside world physically to reduce the effects of extraneous factors on the layers below the encapsulant color conversion layer 115. The phosphor is mixed in the encapsulant to provide the color conversion function of the encapsulated color conversion layer 115. The phosphor can absorb light of the light emitting chip 104 and then convert it into light of a specific wavelength, thereby realizing a color conversion function. The phosphor may be, for example, a phosphor emitting light having a spectral wavelength of 500 to 600 nm, and may specifically be 520nm, 550nm or 580nm. The mass ratio of the encapsulation glue to the fluorescent powder is between 1:0.3 and 1:1, so that the encapsulation color conversion layer 115 has proper color conversion function and has less influence on the encapsulation function of the encapsulation color conversion layer 115.

The lighting panel 100 further includes an encapsulant 112 having an encapsulant cavity, where the flexible substrate 101, the circuit layer 102, the insulating layer 1023, the reflective layer 103, the light emitting chip 104, the encapsulant layer 109, the diffusion layer 110, and the conversion layer 111 are disposed. The package 112 can isolate the layers stacked inside the package 112 from the outside, so as to reduce corrosion or interference of the outside to the layers.

The two electrodes of the light emitting chip 104 are connected to the circuit layer 102, thereby enabling the light emitting chip to emit light by energization. The connection method between the light emitting chip 104 and the circuit layer 102 may be solder or metal bonding, and is not particularly limited herein. The light emitting chip 104 may be, for example, a miniLED chip, and specifically may be a single-color chip, such as a blue light chip or a violet light chip. The light emitting chip 104 may employ a chip without a substrate, thereby enhancing flexibility of the entire lighting panel 100.

In an embodiment, the light emitting chip 104 includes a first light emitting diode, a second light emitting diode, and a third light emitting diode for emitting different color light, and the first light emitting diode, the second light emitting diode, and the third light emitting diode are alternately disposed on the reflective layer 103. Wherein the first, second and third light emitting diodes may be used for emitting red, green and blue light, respectively, i.e. the three primary colors of light. Therefore, the light emitting diodes emit light in a matched mode and then are diffused to form white light. The above-described manner of emitting white light enables the illumination panel 100 to emit white light without providing the color conversion layer 111, thereby simplifying the laminated structure of the illumination panel 100 and facilitating an increase in flexibility of the entire illumination panel 100.

After the light emitted by the adjacent light emitting chips 104 irradiates the diffusion layer 110, the light emitted by the different light emitting chips 104 may overlap on the diffusion layer 110, in other words, the light of the light emitting chips 104 has a certain light mixing distance on the diffusion layer 110. This may result in that after the diffusion layer 110 diffuses, part of the light is stronger and part of the light is weaker, resulting in uneven light emission of the illumination panel 100. The light emitting chips 104 can reduce the light mixing distance and increase the uniformity of light through the interval arrangement.

Further, in an embodiment, referring to fig. 9, the illumination panel 100 further includes a plurality of support columns 105, and the support columns 105 are disposed between the light emitting chips 104 on the reflective layer 103, and the height of the support columns 105 is higher than the height of the light emitting chips 104. By such arrangement, the support columns 105 can shield part of the light emitting chip 104, so as to avoid the light mixing phenomenon caused by the fact that the part of the light irradiates the diffusion layer 110, and further increase the uniformity of light emission of the illumination panel 100.

Referring to fig. 10, an exemplary description is made below of a method for manufacturing the above-described illumination panel 100.

The manufacturing method of the illumination panel 100 includes:

s10, arranging a flexible substrate 101 on a rigid substrate;

the lighting panel 100 is fabricated by stacking multiple layers of different materials, and the flatness of each layer is ensured when stacking the materials. The rigid substrate can provide mechanical support to the flexible substrate 101 that is sufficiently rigid to facilitate stacking of the layers.

Providing the flexible substrate 101 on the rigid substrate includes: the flexible substrate 101 is attached to the rigid substrate by a releasable adhesive.

In the fabrication, the flexible base 101 needs to be stably supported on a rigid substrate so as to facilitate stacking of the layers. Upon completion of fabrication, the completed illumination panel 100 needs to be removed from the rigid substrate. Attaching the flexible base 101 to the rigid substrate by a releasable adhesive enables the flexible base 101 to be stably supported to the rigid substrate. When the manufacturing is completed, the releasable adhesive may be released by heating, laser, ultraviolet light, infrared light, or the like, so that the illumination panel 100 is removed from the rigid substrate. The peelable glue can be high-temperature peelable glue, low-temperature peelable glue, ultraviolet peelable glue or infrared peelable glue.

The releasable adhesive may be applied to the flexible substrate 101 by spin coating, knife coating, or spray coating, and the flexible substrate 101 is then attached to the rigid substrate.

S19, a buffer layer 108 is formed on the flexible substrate 101.

The buffer layer 108 may be formed by depositing a film of silicon oxide or silicon nitride on the flexible substrate 101 by chemical vapor deposition or physical vapor deposition. The buffer layer 108 can improve stress distribution between the flexible substrate 101 and the first circuit layer 102, thereby avoiding failure of the circuit layer 102 such as cracking due to stress.

S20, manufacturing a circuit layer 102 on a flexible substrate 101;

the circuit layer 102 may be a single-layered patterned metal circuit that is capable of being connected to the positive and negative electrodes of a power supply or different phases of alternating current by being disposed, and conducting current to the positive and negative electrodes of the light emitting chip, respectively.

The circuit layer 102 may also include multiple layers, specifically fabricated as follows:

s21 producing a first Metal layer 1021 on the Flexible substrate 101

The first metal layer 1021 may be formed by film formation, photoresist coating, exposure, development, etching using a conductive metal such as copper, silver, or gold. The first metal layer 1021 can form a circuit matching the mounting position of the light emitting chip 104, and can be connected to one electrode of the light emitting chip 104.

S22, manufacturing an insulating layer 1023 on the first metal layer 1021;

the insulating layer 1023 may be formed by chemical vapor deposition or physical vapor deposition. The insulating layer 1023 may be formed by attaching a thin film. The presence of the insulating layer 1023 can insulate the first metal layer 1021 and the second metal layer 1022 from shorting. The insulating layer 1023 may be further patterned to form pads, thereby facilitating connection of the light emitting chip 104 to the first metal layer 1021. Alternatively, the insulating layer 1023 may be processed to form a portion of the first contact via 113.

S23, manufacturing a second metal layer 1022 on the insulating layer 1023;

the second metal layer 1022 may be formed by film formation, photoresist coating, exposure, development, etching using a conductive metal such as copper, silver, or gold. The second metal layer 1022 can form a circuit matching the mounting position of the light emitting chip 104, and can be connected to one pole of the light emitting chip 104. The second metal layer 1022 may be formed by simultaneously forming a portion of the first contact channel 113, so that the first metal layer 1021 is connected to the light emitting chip 104 through the portion.

In one embodiment, before the light emitting chip 104 is connected to the first metal layer 1021 and the second metal layer 1022, the manufacturing method of the lighting panel 100 further includes:

s29 forms a reflective layer 103 on the circuit layer 102. The plurality of light emitting chips 104 are disposed on the reflective layer 103 at intervals.

The material of the reflective layer 103 may be reflective ink, silver, or aluminum. The reflective layer 103 may be manufactured by a coating method or a metal sputtering method. After the reflective layer 103 is fabricated on the circuit layer 102, the reflective layer 103 is patterned so that a portion of the first contact channel 113 and the second contact channel 114 are formed in the reflective layer 103. So that the light emitting chips 104 spaced apart on the reflective layer 103 can be connected to the circuit layer 102 through the first contact channels 113 and the second contact channels 114.

S30, connecting the light emitting chip 104 with the circuit layer 102;

the circuit layer 102 can provide the light emitting chip 104 with power required for light emission. The light emitting chip 104 may be connected to the circuit layer 102 by soldering or metal bonding.

In another embodiment, after the light emitting chip 104 is connected to the circuit layer 102, the manufacturing method of the lighting panel 100 further includes:

s31 forms a reflective layer 103 on the circuit layer 102.

The material of the reflective layer 103 may be reflective ink, silver, or aluminum. The reflective layer 103 may be manufactured by a coating method or a metal sputtering method. Since the light emitting chip 104 has been connected to the circuit layer 102 by the connection element, the connection element can function as a "core" during the process of manufacturing the reflective layer 103 on the circuit layer 102, and a portion of the first contact channel 113 and the second contact channel 114 are naturally formed. This can simplify the patterning step of the reflective layer 103.

S40, manufacturing a first heat dissipation layer 106 on the circuit layer 102 and the light emitting chip 104

The first heat dissipation layer 106 may be made of a transparent material having a high thermal conductivity, such as transparent graphene. The coating may be applied to the circuit layer 102 and the light emitting chip 104 by spraying, spin coating, knife coating, or the like. In the coating process, the position of the light emitting chip 104 is convex, other parts are concave, and after a certain thickness is coated, the light emitting chip 104 can be naturally embedded in the first heat dissipation layer 106.

Before peeling the flexible substrate 101 from the rigid substrate, the manufacturing method of the illumination panel 100 includes:

s47, the encapsulation layer 109 is fabricated on the first heat dissipation layer 106.

The encapsulation layer 109 may be made of glue with good light transmittance such as epoxy resin or silica gel. Encapsulation layer 109 may be formed using a coating or molding process. Optionally, diffusing ions may be added to the encapsulation layer 109, thereby increasing the diffusion of light and increasing the uniformity of the light emitted by the illumination panel 100.

S48, a diffusion layer 110 is formed on the encapsulation layer 109.

The diffusion layer 110 may employ a diffusion film or a diffusion plate. Alternatively, the diffusion layer 110 may be formed on the encapsulation layer 109 by diffusion colloid coating. The diffusion layer 110 can diffuse the light of the light emitting chip 104, and improve the uniformity of the emitted light.

S49, a color conversion layer 111 is formed on the diffusion layer 110.

The color conversion layer 111 may be a phosphor color conversion layer or a quantum dot color conversion layer. The color conversion layer 111 may be selected according to the light emission color of the illumination panel 100, so as to convert the light of the light emitting chip 104 into white light or light of a specific wavelength.

S50, peeling the flexible substrate 101 from the rigid substrate;

after the first heat dissipation layer 106 is fabricated, the illumination panel 100 may be peeled off from the rigid substrate, so as to stack the flexible substrate 101 on a side structure away from the light emitting chip 104. Since the semi-finished product of the illumination panel 100 stacked by the above-described method already has a certain rigidity, the stacking of the structures on the side of the flexible substrate 101 remote from the light emitting chip 104 may not require the assistance of a rigid substrate. The glass of the flexible substrate 101 and the rigid substrate can adopt a laser, high temperature, low temperature, ultraviolet or infrared irradiation mode to change the property of the strippable glue, so that the flexible substrate 101 is stripped from the rigid substrate.

S60, a second heat dissipation layer 107 is fabricated on a side of the flexible substrate 101 away from the circuit layer 102.

The material of the second heat dissipation layer 107 may be copper foil or graphene film, etc. The second heat dissipation layer 107 may be formed using a deposition or coating method. The second heat dissipation layer 107 may also be directly attached by adopting other heat dissipation materials or combination materials through soft attachment and soft technology.

S70, manufacturing a package 112 for packaging.

The encapsulation 112 may be glue, which may be encapsulated by coating. The glue may be an acrylic system, an epoxy system, a polyurethane system, or the like. The package 112 may be an organic film layer such as an organic waterproof nano-coating film. The package 112 may be a thin film of an inorganic material with good waterproof performance, such as alumina, and the thin film may be formed by physical vapor deposition, chemical vapor deposition, or atomic layer deposition. The package 112 may also be a multi-layered structure formed by stacking organic materials and inorganic materials, and is not particularly limited herein.

The foregoing is only examples of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent processes using the descriptions and the contents of the present application or other related technical fields are included in the scope of the patent application.

Claims

1. A lighting panel, comprising:

a flexible substrate;

the circuit layer is arranged on the flexible substrate;

the reflecting layer can be arranged in a bending way and is arranged on the circuit layer;

the light-emitting chips are arranged on the reflecting layer at intervals, the reflecting layer is provided with a first contact channel, and one electrode of the light-emitting chips is electrically connected with the circuit layer through the first contact channel; the reflecting layer is provided with a second contact channel, and the other electrode of the light emitting chip is electrically connected with the circuit layer through the second contact channel.

2. A lighting panel as recited in claim 1, wherein:

the circuit layer comprises a bendable first metal layer, a bendable second metal layer and a bendable insulating layer, wherein the first metal layer is arranged on the flexible substrate, the second metal layer is arranged on the first metal layer, and the insulating layer is arranged between the first metal layer and the second metal layer;

the reflecting layer, the second metal layer and the insulating layer are provided with the first contact channel, and one electrode of the light emitting chip is electrically connected with the first metal layer through the first contact channel; the reflecting layer is formed with the second contact channel, and the other electrode of the light emitting chip is electrically connected with the second metal layer through the second contact channel.

3. A lighting panel as recited in claim 2, wherein:

the flexible substrate is made of polyimide, copper or triacetate fiber film, and the thickness of the flexible substrate is 10-50 micrometers;

the thickness of the first metal layer is 0.1-20 micrometers;

the material of the second metal layer is 0.1-20 microns;

the insulating layer is made of polyimide, silicon oxide or silicon nitride, and the thickness of the insulating layer is 0.4-20 microns;

the reflective layer is made of reflective ink, silver or aluminum, and the thickness of the reflective layer is 0.1-100 microns.

4. A lighting panel as recited in claim 1, wherein:

the light emitting diode comprises a light emitting chip and is characterized in that a first radiating layer is arranged on one side, far away from the circuit layer, of the reflecting layer, a second radiating layer is arranged on one side, far away from the circuit layer, of the flexible substrate, and the light emitting chip is embedded in the first radiating layer.

5. A lighting panel as recited in claim 4, wherein:

the first heat dissipation layer is provided with a packaging layer, the packaging layer is provided with a diffusion layer and a conversion layer in a lamination mode, the diffusion layer is used for correcting light into a uniform area light source, and the thickness of the diffusion layer is 0.05-0.5 mm; the conversion layer is used for converting light rays generated by the light-emitting chip into illumination light, and the thickness of the conversion layer is 0.05-0.5 mm;

the diffusion layer is arranged on the conversion layer, or

The conversion layer is disposed over the diffusion layer.

6. A lighting panel as recited in claim 5, wherein:

the lighting panel further comprises a packaging body with a packaging cavity, wherein the flexible substrate, the circuit layer, the reflecting layer, the light emitting chip, the packaging layer, the diffusion layer and the conversion layer are arranged in the packaging cavity.

7. A lighting panel as recited in claim 4, wherein:

the first heat dissipation layer is provided with an encapsulation color conversion layer, the components of the encapsulation color conversion layer comprise encapsulation glue and fluorescent powder, and the mass ratio of the encapsulation glue to the fluorescent powder is between 1:0.3 and 1:1.

8. A lighting panel as recited in claim 1, wherein:

the light emitting chip comprises a first light emitting diode, a second light emitting diode and a third light emitting diode which are used for emitting light rays with different colors, and the first light emitting diode, the second light emitting diode and the third light emitting diode are alternately arranged on the reflecting layer.

9. A lighting panel as recited in claim 1, wherein:

and a buffer layer is further arranged between the flexible substrate and the circuit layer, the buffer layer is used for improving stress between the flexible substrate and the circuit layer, and the thickness of the buffer layer is 0.1-2 microns.

10. A lighting panel as recited in claim 1, wherein:

the illumination panel further comprises a plurality of support columns, wherein the support columns are arranged between every two light-emitting chips on the reflecting layer, and the heights of the support columns are higher than those of the light-emitting chips.

11. A method of making an illumination panel, comprising:

providing a flexible substrate on a rigid substrate;

manufacturing a circuit layer on the flexible substrate;

connecting a light emitting chip with the circuit layer;

a first heat dissipation layer is manufactured on the circuit layer and the light-emitting chip

Peeling the flexible substrate from the rigid substrate;

and manufacturing a packaging body for packaging.

12. The method of manufacturing a lighting panel of claim 11, wherein:

disposing the flexible substrate on the rigid substrate includes: the flexible substrate is attached to the rigid substrate by a peelable glue.

13. The method of manufacturing a lighting panel of claim 11, wherein:

the method for manufacturing the lighting panel further comprises the following steps before the circuit layer is manufactured on the flexible substrate: and manufacturing a buffer layer on the flexible substrate.

14. The method of manufacturing a lighting panel of claim 11, wherein:

the manufacturing method of the lighting panel further comprises the following steps before the light emitting chip is connected with the circuit layer:

manufacturing a reflecting layer on the circuit layer;

and arranging a plurality of light emitting chips on the reflecting layer at intervals.

15. The method of manufacturing a lighting panel of claim 11, wherein:

after the light emitting chip is connected with the circuit layer, the manufacturing method of the lighting panel further comprises the following steps:

and manufacturing a reflecting layer on the circuit layer.

16. The method of manufacturing a lighting panel of claim 11, wherein:

the manufacturing method of the lighting panel before the flexible substrate and the rigid substrate are peeled off further comprises the following steps:

manufacturing a packaging layer on the first heat dissipation layer;

and manufacturing a diffusion layer on the packaging layer.

17. The method of manufacturing a lighting panel of claim 16, wherein:

after the diffusion layer is manufactured on the packaging layer, the manufacturing method of the lighting panel further comprises the following steps:

and manufacturing a color conversion layer on the diffusion layer.

18. A desk lamp, comprising:

a base, a support, a cover plate and a lighting panel as claimed in any one of claims 1 to 8; the cover plate is provided with a first side and a second side which are opposite, one end of the supporting piece is connected with the base, the other end of the supporting piece is connected with the first side, and the lighting panel is arranged on the second side.

19. A desk lamp as recited in claim 18, wherein:

the edge of the illumination panel is bent and provided with a mounting groove, and the cover plate is arranged in the mounting groove so as to mount the illumination panel on the cover plate.

20. A desk lamp as recited in claim 18, wherein:

at least part of the edge of the second side is convexly provided with a flange towards the direction close to the illumination panel, the flange and the cover plate are enclosed to form a containing groove, and the illumination panel is contained in the containing groove.

21. A desk lamp as recited in claim 18, wherein:

the cover plate can be arranged in a bending way, the cover plate is made of metal or organic plastic, the thickness of the cover plate is 0.5-10 micrometers, and the rigidity of the cover plate is larger than that of the illumination panel.