CN116277917A - Equipment cleaning process - Google Patents
Equipment cleaning process Download PDFInfo
- Publication number
- CN116277917A CN116277917A CN202310243879.1A CN202310243879A CN116277917A CN 116277917 A CN116277917 A CN 116277917A CN 202310243879 A CN202310243879 A CN 202310243879A CN 116277917 A CN116277917 A CN 116277917A
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- Prior art keywords
- cavity
- film
- covered
- dust
- roughness
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- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000004140 cleaning Methods 0.000 title claims abstract description 36
- 239000002245 particle Substances 0.000 claims abstract description 100
- 239000000428 dust Substances 0.000 claims abstract description 65
- 210000002489 tectorial membrane Anatomy 0.000 claims abstract description 35
- 238000010030 laminating Methods 0.000 claims abstract description 8
- 239000004744 fabric Substances 0.000 claims description 14
- 230000000694 effects Effects 0.000 abstract description 11
- 239000007888 film coating Substances 0.000 description 58
- 238000009501 film coating Methods 0.000 description 58
- 239000010408 film Substances 0.000 description 20
- 238000000576 coating method Methods 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 15
- 230000002411 adverse Effects 0.000 description 10
- 239000011859 microparticle Substances 0.000 description 7
- 238000005240 physical vapour deposition Methods 0.000 description 6
- 239000008186 active pharmaceutical agent Substances 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 4
- 210000002381 plasma Anatomy 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 210000003200 peritoneal cavity Anatomy 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0004—Component parts, details or accessories; Auxiliary operations
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The application relates to the field of equipment cleaning, in particular to an equipment cleaning process, which comprises the steps of measuring roughness data of a cavity wall of a film laminating equipment cavity, and carrying out average treatment on the roughness data to obtain a roughness average value; judging whether the roughness average value exceeds a preset roughness threshold value or not to obtain a judging result; if the judgment result is yes, closing an air hole in the film covering cavity and covering a film covering device in the film covering cavity; closing the film-covered cavity, and coarsely grinding the cavity wall of the film-covered cavity; absorbing dust particles generated in the film-covered cavity. The application has the effect of being convenient for guarantee that the yields of tectorial membrane product is in qualified level.
Description
Technical Field
The application relates to the field of equipment cleaning, in particular to an equipment cleaning process.
Background
In the current manufacturing process of panels and numerous semiconductors, a thin film is generally coated on the surfaces of the panels and the semiconductors as a protective film.
The prior art method of coating a thin film on a panel and a plurality of semiconductors is as follows: the method comprises the steps of placing a panel or a semiconductor to be coated in a coating cavity of a coating device, coating a thin film on the surface of the panel or the semiconductor to be coated by adopting a PVD (Physical Vapor Deposition physical vapor deposition) sputtering process, specifically, generating working gas with plasma through the coating device, and introducing the working gas into the coating cavity, so that particles such as the plasma are sputtered on the surface of the panel or the semiconductor to be coated in a collision manner, and gradually deposited on the surface of the panel or the semiconductor to be coated, thereby forming the thin film on the surface of the panel or the semiconductor to be coated.
In the course of implementing the present application, it has been found that the above technique has at least the following problems: particles such as plasmas in the working gas introduced into the film coating cavity are deposited on the surface of a panel or a semiconductor to be coated, and are also deposited on the cavity wall of the film coating cavity, and a layer of film is formed on the cavity wall of the film coating cavity, so that the film formed on the cavity wall of the film coating cavity is thickened and even blocks some air holes in the film coating cavity along with the increase of the service time of the film coating equipment, the quality of the film coating is reduced, and the yield of film coating products is reduced.
Disclosure of Invention
In order to facilitate ensuring that the yield of the laminated product is at a qualified level, the application provides a cleaning process for equipment.
The equipment cleaning process provided by the application adopts the following technical scheme:
a device cleaning process comprising:
measuring roughness data of the cavity wall of the laminating equipment, and carrying out average treatment on the roughness data to obtain a roughness average value; judging whether the roughness average value exceeds a preset roughness threshold value or not to obtain a judging result;
if the judgment result is yes, closing an air hole in the film covering cavity and covering a film covering device in the film covering cavity; closing the film-covered cavity, and coarsely grinding the cavity wall of the film-covered cavity;
absorbing dust particles generated in the film-covered cavity.
By adopting the technical scheme, under the condition that whether the average roughness exceeds the preset roughness threshold value is judged, the condition that the accumulated particle layer on the cavity wall of the film-covered cavity is too thick is indicated, cleaning is needed, then, the air hole opening in the film-covered cavity is closed firstly so as to prevent dust particles generated in the process of cleaning the particle layer on the cavity wall of the film-covered cavity from entering the air hole opening, so that the air hole opening is blocked, or the subsequent working process of the air hole opening is influenced, and meanwhile, the film-covered device in the film-covered cavity is covered, so that the dust particles are prevented from adhering to the surface of the film-covered device or entering the film-covered device, and the normal use process of the film-covered device is ensured conveniently; after the work is finished, the workers are sent to enter a film covering cavity of the film covering equipment, and then all outlets of the film covering cavity are closed, so that dust particles generated in the process of cleaning a particle layer adhered on the cavity wall of the film covering cavity are prevented from being discharged outwards from the film covering cavity, and the air quality of the external environment is influenced; and then, carrying out coarse grinding on the particle layer adhered on the cavity wall of the film-covered cavity, grinding the particle layer adhered on the cavity wall of the film-covered cavity into dust particles, and dispersing the dust particles in the film-covered cavity, and finally absorbing the dust particles dispersed in the film-covered cavity, so that the recovery of the dust particles dispersed in the film-covered cavity can be realized, the air quality in the film-covered cavity is ensured, the cleaning of the particle layer adhered on the cavity wall of the film-covered cavity is facilitated, the adverse effect of the particle layer on the film-covered process of film-covered equipment is prevented, and the qualified rate of film-covered products is ensured.
In a specific embodiment, the step after absorbing dust particles generated in the film-covered cavity includes:
and finely grinding the cavity wall of the film-covered cavity.
Through adopting above-mentioned technical scheme, after clearing up the microparticle layer of adhesion on the tectorial membrane chamber body cavity wall through the mode of coarse grinding, still can remain the microparticle piece of adhesion on the tectorial membrane chamber body cavity wall, can not realize the clearance of the microparticle layer of adhesion on the tectorial membrane chamber body cavity wall completely through the mode of coarse grinding, so after the coarse grinding of the microparticle layer of adhesion on the tectorial membrane chamber body cavity wall of completion, carry out the fine grinding to the microparticle piece of remaining on the tectorial membrane chamber body cavity wall again to be convenient for get rid of the microparticle of remaining on the tectorial membrane chamber body cavity wall as far as possible, so be convenient for further promote the cleanliness of tectorial membrane chamber body cavity wall on the basis of coarse grinding.
In a specific embodiment, the step after refining the cavity wall of the film-covered cavity comprises:
dust collection treatment is carried out on corners and edges in the film-covered cavity.
By adopting the technical scheme, in the process of rough grinding and fine grinding of the particle layer adhered to the cavity wall of the film-coated cavity, the particles in the ground particle layer are light in weight, and under the action of disturbance air flow in the film-coated cavity caused in the rough grinding and fine grinding processes, the particles in the ground particle layer can be deposited at corners and edges in the film-coated cavity, so that the particles are easy to lift again and have adverse effects on air holes and film-coated devices in the film-coated cavity; therefore, under the condition that particles in the ground particle layer are deposited at the corners and edges in the film coating cavity, the particles deposited at the corners and edges in the film coating cavity are absorbed, so that the particles scattered in the film coating cavity can be prevented from adversely affecting the air hole opening in the film coating cavity and the film coating device, the air quality in the film coating cavity is conveniently ensured, and a good working environment is conveniently provided for the film coating cavity.
In a specific embodiment, the step of performing dust collection treatment on corners and edges in the film-covered cavity includes:
and dust collection treatment is carried out on the tectorial membrane cavity at preset time intervals.
By adopting the technical scheme, when absorbing particles deposited at the corners and edges in the film coating cavity, part of the particles can escape into the space of the film coating cavity and diffuse into the space of the film coating cavity, so that adverse effects can be caused on the air hole opening in the film coating cavity and the film coating device, adverse effects can be caused on the working environment in the next film coating cavity, suspended particles in the film coating cavity are absorbed again at preset intervals, and part of the particles can be deposited on the bottom wall of the film coating cavity within a time range at intervals, so that more deposited particles can be absorbed in the process of absorbing the particles, the particle content in the film coating cavity can be reduced, adverse effects on the air hole opening in the film coating cavity and the film coating device can be prevented, and good working environment can be conveniently built in the film coating cavity.
In a specific embodiment, the step after absorbing dust particles generated in the film-covered cavity includes:
and cleaning the cavity wall of the tectorial membrane cavity by using dust-free cloth until no dust marks are formed on the dust-free cloth.
By adopting the technical scheme, the particle layer on the cavity wall of the tectorial membrane cavity still can remain some dust particles after coarse grinding and fine grinding, and some dust particles are stuck on the cavity wall of the tectorial membrane cavity by the dust scattered in the cavity space of the tectorial membrane through deposition; after finishing the rough grinding, fine powder and dust absorption operation, dust particles on the cavity wall of the tectorial membrane cavity are erased through the dust-free cloth, so that the cleanliness of the cavity wall of the tectorial membrane cavity is conveniently improved.
In a specific embodiment, a mill is used for the rough grinding of the cavity walls of the film-covered cavity.
Through adopting above-mentioned technical scheme, be convenient for realize the coarse grinding of tectorial membrane chamber cavity wall on the microparticle layer through the mill to grind down most dust particle from tectorial membrane chamber cavity wall.
In a specific embodiment, the refining of the wall of the film-covered cavity uses a strong light flashlight irradiation method.
By adopting the technical scheme, the dust blocks or dust particles still adhered on the cavity wall of the tectorial membrane cavity can be found conveniently by a strong light flashlight irradiation method.
In a specific embodiment, the dust cloth is a ten-level API dust cloth.
Through adopting above-mentioned technical scheme, be convenient for promote the cleaning effect of the dust particle of adhesion on tectorial membrane chamber cavity wall through ten level API dustless cloth.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the yield of the film-covered product is conveniently ensured to be in a qualified level;
2. the cleanliness of the cavity wall of the tectorial membrane cavity is further improved on the basis of rough grinding;
3. the particle that is convenient for prevent to fly away in the tectorial membrane cavity causes adverse effect to the air vent in the tectorial membrane cavity and tectorial membrane device, still is convenient for build good operational environment in the tectorial membrane cavity.
Drawings
Fig. 1 is a first portion of a schematic flow diagram of a device cleaning process in an embodiment of the present application.
Fig. 2 is a second portion of a schematic flow diagram of a device cleaning process in an embodiment of the present application.
Detailed Description
The present application is described in further detail below in conjunction with figures 1-2.
The embodiment of the application discloses a device cleaning process. Referring to fig. 1, the apparatus cleaning process includes:
and S100, measuring roughness data of the cavity wall of the laminating equipment, and carrying out average treatment on the roughness data to obtain a roughness average value.
At preset time intervals, a worker holds the surface roughness measuring instrument to measure roughness data of the cavity wall of the film laminating equipment once, and it is to be noted that the film laminating equipment is used for coating a layer of film on the surface of a panel or a semiconductor to be laminated by adopting a PVD (Physical Vapor Deposition physical vapor deposition) sputtering process, and the specific implementation steps are as follows: working gas with particles such as plasma is generated through a film coating device, then the working gas is led into a film coating cavity in the film coating device, an air hole opening for leading the working gas into the film coating cavity is formed in the cavity wall of the film coating cavity, and film coating devices for coating the surface of a panel or a semiconductor are also arranged in the film coating cavity, wherein the film coating devices are in the prior art and are not specifically described. In the process of coating the surface of the panel or the semiconductor, particles in the working gas can be deposited on the surface of the panel or the semiconductor, can be deposited on the cavity wall of the coating cavity, can form a particle layer on the cavity wall of the coating cavity, can be increased continuously along with the increase of time, can even block the air hole opening on the cavity wall of the coating cavity, and can be deposited on the surface of the coating device, so that the working process of the air hole opening and the coating device is influenced, and the coating process of the surface of the panel or the semiconductor is further adversely influenced.
In practice, it is found that the roughness of the surface of the particulate layer is higher as the thickness of the particulate layer is increased, and in order to facilitate detection of the thickness of the particulate layer, the thickness of the particulate layer can be reflected laterally by measuring the surface roughness, and the specific embodiment is as follows:
the staff detects the roughness data Ra of the cavity wall of the laminating equipment at different positions through the surface roughness measuring instrument each time, and then obtains a group of roughness data Ra for reflecting the overall roughness degree of the cavity wall surface of the laminating equipment.
After each group of roughness data Ra is obtained, the staff performs average calculation on the collected group of roughness data Ra, then calculates the average value of the group of roughness data Ra, and marks the average value as roughness average value
And S200, judging whether the average roughness value exceeds a preset roughness threshold value, and obtaining a judging result.
Roughness average
A predetermined roughness threshold a is associated, which serves as a determination as to whether the thickness of the particle layer is within an acceptable range.
The worker calculates the average roughness value
Immediately after that, the roughness average +.>
Whether the preset roughness threshold a is exceeded or not, specifically, in this embodiment, the roughness threshold a is 0.5um; the obtained judging structure comprises the following two types:
first, roughness average
Exceeding a preset roughness threshold A;
second, roughness average
The preset roughness threshold a is not exceeded.
And S300, if the judgment result is yes, closing the air hole opening in the film coating cavity and coating the film coating device in the film coating cavity.
If the judgment result is roughness average value
If the preset roughness threshold a is exceeded, it is indicated that the thickness of the particulate layer has exceeded an acceptable range, and there is a risk that the particulate layer blocks the air hole on the cavity wall of the film-covered cavity and deposits on the film-covered device to affect the normal operation of the film-covered device.
After judging the roughness average value
Under the condition that the roughness threshold A exceeds a preset roughness threshold A, cleaning the particle layer deposited on the cavity wall of the tectorial membrane cavity is needed to be judged, and in order to prevent particles generated by cleaning the particle layer from entering into the air hole opening to block the air hole opening or escaping into an external environment through the air hole opening, the air hole opening on the cavity wall of the tectorial membrane cavity is completely closed before cleaning the particle layer; in order to prevent particles which are generated by cleaning the particle layer and scattered in the film coating cavity from further depositing on the film coating device, thereby causing adverse effect on the normal operation of the film coating device, the film coating device is further coated by a plastic film and the like before the particle layer is cleaned.
S400, closing the film-covered cavity, and coarsely grinding the cavity wall of the film-covered cavity.
In order to facilitate preventing particles which are generated during cleaning of the particle layer and float in the film-covered cavity from leaking to an external environment from through holes communicated with the outside, such as an orifice of the film-covered cavity, before the particle layer is cleaned, a worker firstly carries particle layer cleaning equipment such as a grinding machine and the like to enter the film-covered cavity, and then the through holes communicated with the outside, such as the orifice of the film-covered cavity, are completely sealed; then, the staff rough grinds the particle layer on the cavity wall of the film-covered cavity by the grinding machine, so that most of dust particles in the particle layer are separated from the cavity wall of the film-covered cavity and dispersed in the film-covered cavity.
S500, absorbing dust particles generated in the film-covered cavity.
Because the mass of the dust particles is lighter, the dust particles can be dispersed in the film-covered cavity for a long time, in order to be convenient for preventing the dust particles from being in a dispersion state in the film-covered cavity for a long time, so as to prevent the dispersed dust particles from affecting the working environment in the film-covered cavity for a long time, and causing adverse effects on an air hole in the film-covered cavity and a film-covered device, after the coarse grinding of a particle layer on the cavity wall of the film-covered cavity is completed, workers also absorb the dispersed dust particles in the film-covered cavity through a carried dust collection device until the concentration of the dispersed dust particles in the film-covered cavity reaches a preset level.
S600, finely grinding the cavity wall of the film-covered cavity.
After finishing the rough grinding of the particle layer on the cavity wall of the film-covered cavity through the step S400, after absorbing the dispersed dust particles through the step S500, further fine grinding is needed to be carried out on the particle block still remained on the cavity wall of the film-covered cavity, so as to eliminate the particle block remained on the cavity wall of the film-covered cavity.
In order to determine the approximate position of the particle block remained on the cavity wall of the film-covered cavity, a worker firstly determines the approximate position of the particle block through a strong light flashlight irradiation method, specifically, the worker irradiates the cavity wall of the film-covered cavity from an inclined angle through a carried strong light flashlight, if the particle block exists in the irradiated part, shadows are generated on the corresponding positions, and therefore the approximate position of the particle block can be determined through the pain shadows.
After the approximate position of the particle block is determined, a worker finely grinds the particle block on the cavity wall of the tectorial membrane cavity by a portable fine grinding machine, and the rest particle blocks on the cavity wall of the tectorial membrane cavity are completely ground by analogy.
S700, dust collection treatment is carried out on corners and edges in the film-covered cavity.
When the particle blocks remained on the cavity wall of the film coating cavity are finely milled, the remained particle blocks are milled into dust particles and fall at corners and edges in the film coating cavity, so that the dispersed dust particles are conveniently prevented from being dispersed in the film coating cavity when air flow is disturbed and enter air holes in the film coating cavity or are deposited on a film coating device, and workers absorb the dust particles falling at the corners and edges in the film coating cavity through a carried dust collection device.
It should be noted that, when the dust collection device carried by the staff absorbs dust particles at the corners and edges in the film-covered cavity, the dust particles at the corners and edges in the film-covered cavity are disturbed by the air flow at the corners and edges, so that part of dust particles at the corners and edges in the film-covered cavity are further dispersed into the film-covered cavity and are dispersed in the film-covered cavity for a long time.
S800, dust collection treatment is carried out on the film covering cavity at intervals of preset time intervals.
In order to prevent dispersed dust particles generated in the execution process of the step S700 from entering an air hole opening in the film coating cavity or being deposited on the surface of the film coating device, a worker leaves the film coating cavity after the step S700 is executed, and then carries dust collection equipment to reenter the film coating cavity after the step S700 is executed for two hours, so that the dispersed dust particles in the film coating cavity fall on the inner bottom wall of the film coating cavity as much as possible in the time interval of the two hours, and the worker can absorb the dust particles falling on the inner bottom wall of the film coating cavity by using the dust collection equipment conveniently.
S900, cleaning the cavity wall of the film-covered cavity by using the dust-free cloth until no dust marks are formed on the dust-free cloth.
In the process of absorbing dust particles through the step S800, the dust collection equipment can cause disturbance of air flow in the peritoneal cavity, so that a small part of dust particles continue to be dispersed in the tectorial membrane cavity, and are deposited on the cavity wall of the tectorial membrane cavity, in order to facilitate the cleanliness of the cavity wall of the tectorial membrane cavity to be improved as much as possible, thereby further preventing the dust particles from affecting the tectorial membrane process of a panel or a semiconductor and the like, and after the step of absorbing dust is completed, a worker further wipes the cavity wall of the tectorial membrane cavity through the carried ten-stage API dust-free cloth until marks of the dust particles cannot be found on the ten-stage API dust-free cloth.
Through the execution of the steps S100-S200, the cleaning degree of the film coating cavity in the film coating equipment can be improved to a great extent, so that the yield of film coating products is improved conveniently.
The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.
Claims (8)
1. A process for cleaning equipment, characterized by: comprising the following steps:
measuring roughness data of the cavity wall of the laminating equipment, and carrying out average treatment on the roughness data to obtain a roughness average value;
judging whether the roughness average value exceeds a preset roughness threshold value or not to obtain a judging result;
if the judgment result is yes, closing an air hole in the film covering cavity and covering a film covering device in the film covering cavity;
closing the film-covered cavity, and coarsely grinding the cavity wall of the film-covered cavity;
absorbing dust particles generated in the film-covered cavity.
2. The equipment cleaning process of claim 1, wherein: the step after absorbing dust particles generated in the film-covered cavity comprises the following steps:
and finely grinding the cavity wall of the film-covered cavity.
3. The equipment cleaning process of claim 2, wherein: the step after the cavity wall of the film-covered cavity is finely ground comprises the following steps:
dust collection treatment is carried out on corners and edges in the film-covered cavity.
4. A device cleaning process according to claim 3, wherein: the dust collection treatment of corners and edges in the film-covered cavity comprises the following steps:
and dust collection treatment is carried out on the tectorial membrane cavity at preset time intervals.
5. The equipment cleaning process of claim 1, wherein: the step after absorbing dust particles generated in the film-covered cavity comprises the following steps:
and cleaning the cavity wall of the tectorial membrane cavity by using dust-free cloth until no dust marks are formed on the dust-free cloth.
6. The equipment cleaning process of claim 1, wherein: and a grinding machine is adopted when the cavity wall of the film-covered cavity is coarsely ground.
7. The equipment cleaning process of claim 2, wherein: and the cavity wall of the film-covered cavity is precisely polished by adopting a strong light flashlight irradiation method.
8. The equipment cleaning process of claim 5, wherein: the dust-free cloth is ten-level API dust-free cloth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310243879.1A CN116277917B (en) | 2023-03-14 | 2023-03-14 | Equipment cleaning process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310243879.1A CN116277917B (en) | 2023-03-14 | 2023-03-14 | Equipment cleaning process |
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| Publication Number | Publication Date |
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| CN116277917A true CN116277917A (en) | 2023-06-23 |
| CN116277917B CN116277917B (en) | 2024-01-26 |
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| CN202310243879.1A Active CN116277917B (en) | 2023-03-14 | 2023-03-14 | Equipment cleaning process |
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| US20090183764A1 (en) * | 2008-01-18 | 2009-07-23 | Tenksolar, Inc | Detachable Louver System |
| JP2009231697A (en) * | 2008-03-25 | 2009-10-08 | Dainippon Screen Mfg Co Ltd | Heat treatment equipment |
| CN107322423A (en) * | 2017-09-04 | 2017-11-07 | 凯盛重工有限公司 | A kind of technique for grinding of metal vacuum cavity sealing surface |
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| CN112301424A (en) * | 2020-09-14 | 2021-02-02 | 杭州盾源聚芯半导体科技有限公司 | Silicon boat for CVD process and repairing and cleaning method thereof |
| CN113182153A (en) * | 2021-03-23 | 2021-07-30 | 哈尔滨锅炉厂有限责任公司 | Boiler steel structure outer surface defect repairing construction method |
| CN113463068A (en) * | 2021-05-31 | 2021-10-01 | 上海中欣晶圆半导体科技有限公司 | Maintenance method for dry-wet combination of semiconductor film forming APCVD machine process cavity |
-
2023
- 2023-03-14 CN CN202310243879.1A patent/CN116277917B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090183764A1 (en) * | 2008-01-18 | 2009-07-23 | Tenksolar, Inc | Detachable Louver System |
| JP2009231697A (en) * | 2008-03-25 | 2009-10-08 | Dainippon Screen Mfg Co Ltd | Heat treatment equipment |
| CN107322423A (en) * | 2017-09-04 | 2017-11-07 | 凯盛重工有限公司 | A kind of technique for grinding of metal vacuum cavity sealing surface |
| CN109536922A (en) * | 2018-12-19 | 2019-03-29 | 聚灿光电科技股份有限公司 | Metal-organic chemical vapor deposition equipment is answered a pager's call method |
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| CN113182153A (en) * | 2021-03-23 | 2021-07-30 | 哈尔滨锅炉厂有限责任公司 | Boiler steel structure outer surface defect repairing construction method |
| CN113463068A (en) * | 2021-05-31 | 2021-10-01 | 上海中欣晶圆半导体科技有限公司 | Maintenance method for dry-wet combination of semiconductor film forming APCVD machine process cavity |
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| Publication number | Publication date |
|---|---|
| CN116277917B (en) | 2024-01-26 |
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