CN111359985A - Precise cleaning method for cavity parts of production equipment in electronic information industry - Google Patents
Precise cleaning method for cavity parts of production equipment in electronic information industry Download PDFInfo
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- CN111359985A CN111359985A CN202010271239.8A CN202010271239A CN111359985A CN 111359985 A CN111359985 A CN 111359985A CN 202010271239 A CN202010271239 A CN 202010271239A CN 111359985 A CN111359985 A CN 111359985A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/06—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for producing matt surfaces, e.g. on plastic materials, on glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B31/00—Packaging articles or materials under special atmospheric or gaseous conditions; Adding propellants to aerosol containers
- B65B31/04—Evacuating, pressurising or gasifying filled containers or wrappers by means of nozzles through which air or other gas, e.g. an inert gas, is withdrawn or supplied
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/14—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam, e.g. inert gases
Abstract
The invention discloses a precise cleaning method for cavity parts of production equipment in the electronic information industry, which relates to the technical field of electronic precise equipment cleaning and comprises the following steps of classifying parts to be cleaned; checking the loss condition of the part to be cleaned; removing the membrane; rinsing and ultrasonic soaking; drying the part; cleaning the back part for rechecking; sand blasting and meltallizing treatment; the component packaging has the advantages that various films and chemical substances stained on the surfaces of precision components of cavity components of production equipment can be effectively removed, the cleaning and regeneration of the precision components are realized, the replacement time and cost are saved, and the working performance of the precision equipment is improved.
Description
Technical Field
The invention belongs to the technical field of electronic precision equipment cleaning, and particularly relates to a precision cleaning method for cavity parts of production equipment in the electronic information industry.
Background
In the electronic information industry, a large number of precision devices are used, and the use environment of the precision devices needs very high cleanliness requirement. With the rapid development of semiconductor and photoelectric display technologies, the integration level of products is continuously improved, the requirements of the working environment and maintenance of precision equipment used in the production of the electronic information industry are continuously improved, and the requirements of the class 10000 clean room are gradually improved to the requirements of class 1000, 100 and 10 clean rooms. However, after the precision parts of the cavity parts of the production equipment are used for a period of time, the surfaces of the precision parts are contaminated by various films, chemicals and the like, and the working performance of the precision equipment is directly affected.
Disclosure of Invention
The invention aims to: aiming at the problem that the surface of a precision part of a cavity part of production equipment in the prior art is stained with various films and chemical substances after being used for a period of time and is difficult to effectively clean, the precision cleaning method for the cavity part of the production equipment in the electronic information industry is provided.
The technical scheme adopted by the invention is as follows:
a precise cleaning method for cavity parts of production equipment in electronic information industry comprises the following steps,
classifying parts to be cleaned: distinguishing a sealing surface, an assembling hole, a working surface and a structural surface according to the production working environment and external characteristics of the precision part;
and (3) checking the loss condition of the part to be cleaned: checking the classified components, and screening the components which meet the use standard;
and (3) stripping treatment: according to the condition of the film layer, carrying out physical film removal or chemical film removal treatment on each screened part;
rinsing and ultrasonic soaking treatment: rinsing the component subjected to the membrane removal treatment by using deionized water and performing ultrasonic soaking operation;
and (3) drying the part: drying the rinsed and ultrasonically soaked parts by using nitrogen or compressed air;
rechecking the cleaned parts, namely rechecking the flatness, the angle and the roughness of the dried parts to ensure that the parts meet the use standard;
sand blasting and spray welding treatment: carrying out sand blasting and meltallizing treatment on the component subjected to rechecking;
and (3) packaging the components: and (4) carrying out nitrogen packaging or vacuum packaging on the part subjected to sand blasting and meltallizing treatment, and storing for later use.
Preferably, the rinsing and ultrasonic soaking steps and the part drying step are performed in a clean room.
Preferably, the clean room grade is 100 grade or 10 grade.
Preferably, the specific conditions of the rinsing and ultrasonic soaking treatment are as follows: rinsing time is 5-10 s, ultrasonic intensity is controlled to be 4-20W/sq inch, and ultrasonic soaking time is controlled to be more than 30 minutes.
Preferably, the physical stripping is: and (3) flushing the parts by adopting a high-pressure water jet with the water pressure of 50-150 bar or an ultrahigh-pressure water jet with the water pressure of 1800-2400 bar.
Preferably, the chemical stripping is: according to the material, the film quality and the chemical attachment condition of the component, acid, alkali, oxidant and the like with chemical reaction selectivity are selected for soaking and removing the film, and the selected acid, alkali, oxidant and the like have no reaction or weak reaction on the component.
Preferably, the sandblasting treatment is performed by high-speed impacting the surface of the component with a high-strength white corundum sand material to form an uneven layer.
Preferably, the white corundum sand material has the following types: 24#, 36#, 46#, 80#, 220#, 400 #.
Preferably, the roughness Ra value of the part after the sand blasting treatment is 0.5-15 microns.
Preferably, the roughness Ra value of the part after the melting and jetting treatment is 10-40 micrometers.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. the scheme of the invention can effectively remove various films and chemical substances stained on the surfaces of the precision parts of the cavity parts of the production equipment aiming at the characteristics of the precision parts, realizes the cleaning and regeneration of the precision equipment parts, saves the replacement time and cost, and improves the working performance of the precision equipment.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic flow chart of the steps of the present invention;
the labels in the figure are: S1-S8 represent the respective steps.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: reference numerals and letters in the specification denote similar items in the following drawings, and thus, once an item is defined in one drawing, it is not necessary to further define and explain it in the following drawings.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention usually place when in use, and are simply used for simplifying the description of the present invention, but do not indicate or imply that the devices or elements indicated must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two original pieces can be directly connected or indirectly connected through an intermediate medium, or the two original pieces can be communicated with each other. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
A precise cleaning method for cavity parts of production equipment in electronic information industry comprises the following steps,
classifying parts to be cleaned: distinguishing a sealing surface, an assembling hole, a working surface and a structural surface according to the production working environment and external characteristics of the precision part;
and (3) checking the loss condition of the part to be cleaned: checking the classified components, and screening the components which meet the use standard;
and (3) stripping treatment: according to the condition of the film layer, carrying out physical film removal or chemical film removal treatment on each screened part;
rinsing and ultrasonic soaking treatment: rinsing the component subjected to the membrane removal treatment by using deionized water and performing ultrasonic soaking operation;
and (3) drying the part: drying the rinsed and ultrasonically soaked parts by using nitrogen or compressed air;
rechecking the cleaned parts, namely rechecking the flatness, the angle and the roughness of the dried parts to ensure that the parts meet the use standard;
sand blasting and spray welding treatment: carrying out sand blasting and meltallizing treatment on the component subjected to rechecking;
and (3) packaging the components: and (4) carrying out nitrogen packaging or vacuum packaging on the part subjected to sand blasting and meltallizing treatment, and storing for later use.
The features and properties of the present invention are described in further detail below with reference to examples.
Example 1
The invention provides a precise cleaning method for cavity parts of production equipment in electronic information industry, which comprises the following steps,
and (4) classification:
according to the production working environment and the external characteristics of the precision parts, a sealing surface, an assembly hole, a working surface, a structural surface and the like are distinguished. The sealing surface refers to the surface of a component with isolation requirements or vacuum requirements in the working process, and special protection treatment is needed in the precise cleaning process, so that the damage problem is avoided; the assembly hole refers to a hole position which needs to be fixed when a part is assembled on precision equipment, the management and control requirements are general, but when damage which can be identified by naked eyes occurs, the normal use of the part can be influenced; the working surface refers to the part of the part which is stained with a film layer and chemical substances after the part is used in a cavity of precision equipment, and the production and use processes of the part can be met only by meeting certain treatment requirements; the structural surface refers to the surface of the component except the working surface, and generally meets the requirement of clean treatment.
And (4) checking:
according to the classification of the surface of the component, the phenomena of deformation, scratch, damage and cracking on the sealing surface, the phenomena of deformation, sliding tooth and hole blocking of an assembly hole, the phenomena of deformation, scratch, damage and cracking of a working surface, the phenomena of deformation, damage and cracking of a structural surface and the like are respectively checked.
The inspection requirements are different according to different working environments and working requirements of precision parts in equipment, for example, the inspection requirements of the sealing surface are based on the sealing effect of the sealing surface, and the problems of deformation, scratch, damage and cracking which influence the sealing effect cannot exist and occur in the parts and the precision cleaning process; the inspection requirement of the assembly hole is based on the assembly requirement and the assembly effect of the component on equipment, and the component can be used after being repaired when the problems of deformation, tooth slippage and hole blockage exist; the inspection requirement of the working surface is based on the production and use requirements of the component, and the surface cleanliness, uniformity and film adsorption effect are the main control aspects; the structural surface plays a role in structural support for the working surface, and the using effect of the component cannot be influenced by the phenomena of deformation, defect and cracking under the conventional condition.
Removing the film:
the method is divided into two directions of physical stripping and chemical stripping according to the material of the component, the surface film layer and the attachment and contamination condition of chemical substances.
And the physical membrane removal adopts a high-pressure water jet with the water pressure of 50-150 bar or an ultrahigh-pressure water jet with the water pressure of 1800-2400 bar to wash the parts, so as to remove the surface membrane layer and the chemical attachments. The auxiliary physical polishing mode achieves the effect of completely removing the surface film layer and the chemical attachments. The high-pressure water jet knife with the bar of 50-100 is used for cleaning a small amount of film layers and chemical attachments on the surfaces of metal parts or ceramic and quartz parts with the thickness of less than 3mm, and the high-pressure water jet knife with the bar of 1800-2400 is used for cleaning a large amount of film layers and chemical attachments on the surfaces of metal parts with the thickness of more than 3 mm. The specific value of the water pressure of the high-pressure water jet can be 50, 100, 150, 1800, 2100 and 2400 bar.
The chemical stripping is to select acid, alkali, oxidant and the like with high chemical reaction selectivity to soak and strip the film according to the material, film quality and chemical attachment condition of the component, wherein the selected acid, alkali, oxidant and the like have no or weak reaction to the component and generate obvious chemical reaction to the film layer and the chemical attachment on the surface of the component.
According to the cleaning effect of different methods on the surface film layer and the chemical attachments of the component, the physical cleaning and the chemical cleaning can be selected independently or used together, and the final cleaning purpose is achieved by respectively utilizing the non-corrosiveness effect of the physical cleaning and the isotropic effect of the chemical cleaning.
Rinsing and ultrasonic soaking:
the parts after the stripping operation need to be rinsed and ultrasonically soaked with deionized water. Rinsing is primarily directed to parts that have been chemically stripped, with the objective of removing chemical solution components that remain on the surface of the part after chemical cleaning. Soaking is required after both physical and chemical stripping, and aims to remove dust particles remaining on the surface of the component after physical stripping and chemical residues penetrating into the surface and the interior of the component after chemical stripping.
The rinsing time is controlled to be 5-10S, specifically 5S, 7S and 10S, the ultrasonic intensity is controlled to be 4-20W/sq inch, specifically 4, 12 and 20W/sq inch, and the ultrasonic soaking time is controlled to be more than 30 minutes.
Drying/airing:
and (3) blowing the part soaked in the deionized water by using nitrogen or compressed air, and if the part is easy to damage, controlling the air pressure below 3MPa or airing the part under natural conditions.
And (3) detection:
and detecting whether the flatness, the angle, the roughness and the like of the surface of the component meet the use requirements. If the detection result exceeds the use standard of the component, the flatness and the angle of the component can be improved by a correction mode, and the roughness condition of the component can be improved by a sand blasting mode and a fusion jetting mode.
Sand blasting and meltallizing:
according to the adsorption requirement of the working surface of the component on the film layer in the production and use processes, the roughness condition of the surface of the component is improved through sand blasting and meltallizing. The sandblasting is that the high-purity white corundum sand material is driven by compressed air to quickly impact the surface of a part to form a microscopic uneven structure, so that the roughness and the surface area of the working surface of the part are increased, and the adsorption effect of the part on a film layer is improved. The common white corundum sand model has 24#, 36#, 46#, 80#, 220#, 400#, the mesh number is higher, the smaller the particle size is, the lower the corresponding sandblast roughness is, according to the difference of material and sand model, the sandblast roughness Ra value that can reach under the conventional condition is at 0.5 ~ 15 microns, specifically can be 0.5,1,5,7,10,13,15 microns, through adjusting different sand model and equipment parameter, can reach different roughness range intervals, satisfy the production demand of part. The meltallizing is through the high temperature environment that produces under special gas burning or the electric field effect, makes metal aluminum wire, aluminite powder, stainless steel powder etc. form the molten state, then sprays the part surface under the effect of high velocity gas flow, can promote the roughness on part surface by a wide margin, and the meltallizing roughness Ra value that can reach under the conventional circumstances is at 10 ~ 40 microns, specifically can be 10,20,30,35,40 microns, through adjusting the meltallizing equipment parameter, can reach different roughness scope intervals.
Cleaning a dust-free room:
according to the development condition of the electronic information industry and the requirements of semiconductor chips and photoelectric display technologies, the clean in the clean room refers to the operation process of performing deionized water ultrasonic cleaning, nitrogen blow-drying/vacuum baking in 100-grade clean rooms or 10-grade clean rooms.
The ultrasonic intensity of the deionized water is controlled to be 4-20 watts per square inch, specifically 4,10,15 and 20 watts per square inch, and the time is 5-10 minutes, specifically 5,6,7,9 and 10 minutes. The vacuum baking operation is carried out by drying at 40-50 ℃ or 150-160 ℃ according to the temperature resistance of the part.
Packaging:
the packaging method is divided into nitrogen packaging and vacuum packaging according to the requirements of the structure, the oxidability and the humidity control of the part. The nitrogen packaging means that the part is put into a dust-free bag and then high-purity nitrogen is filled into the dust-free bag to isolate the influence of oxygen and moisture in the air on the part; vacuum packaging refers to placing the component into a dust-free bag, then using a vacuum packaging machine/air extractor to extract air from the dust-free bag, so as to form a vacuum environment and avoid the influence of the air on the component.
Conventionally, dust free bags need to have both dust free and antistatic characteristics. The dust-free packaging bag has no particles with the particle size larger than 1 micron inside and on the surface, and the number of the particles with the particle size larger than 0.5 micron in each square centimeter is less than 1; the anti-static finger component can not generate static electricity in the process of contacting and rubbing with the packaging bag, so that electrostatic adsorption or potential influence on the component is avoided.
The precision cleaning process provided by the scheme can be used for cleaning and regenerating precision parts of equipment cavities in the processes of manufacturing semiconductor chips, liquid crystal display panels and organic display panels, and the inspection requirements, the process method, the environmental requirements and the like mentioned in the invention are closely related to the quality of the parts.
On the basis of the scheme, according to the material of the component, the surface film layer and the chemical attachment condition, the cleaning method can be extended to various types of precision components, and the types of equipment covered in the electronic information industry mainly comprise PVD (physical vapor deposition), CVD (chemical vapor deposition), ETCH (etching), Implant (ion implantation) and the like.
The above description is an embodiment of the present invention. The foregoing is a preferred embodiment of the present invention, and the preferred embodiments in each preferred embodiment can be combined and used in any combination if not obviously contradictory or prerequisite to a certain preferred embodiment, and the specific parameters in the examples and the embodiments are only for the purpose of clearly explaining the inventor's invention verification process and are not intended to limit the patent protection scope of the present invention, which is defined by the claims and the equivalent structural changes made by the content of the description of the present invention are also included in the protection scope of the present invention.
Claims (10)
1. A precise cleaning method for cavity parts of production equipment in electronic information industry is characterized by comprising the following steps,
classifying parts to be cleaned: distinguishing a sealing surface, an assembling hole, a working surface and a structural surface according to the production working environment and external characteristics of the precision part;
and (3) checking the loss condition of the part to be cleaned: checking the classified components, and screening the components which meet the use standard;
and (3) stripping treatment: according to the condition of the film layer, carrying out physical film removal or chemical film removal treatment on each screened part;
rinsing and ultrasonic soaking treatment: rinsing the component subjected to the membrane removal treatment by using deionized water and performing ultrasonic soaking operation;
and (3) drying the part: drying the rinsed and ultrasonically soaked parts by using nitrogen or compressed air;
rechecking the cleaned parts, namely rechecking the flatness, the angle and the roughness of the dried parts to ensure that the parts meet the use standard;
sand blasting and spray welding treatment: carrying out sand blasting and meltallizing treatment on the component subjected to rechecking;
and (3) packaging the components: and (4) carrying out nitrogen packaging or vacuum packaging on the part subjected to sand blasting and meltallizing treatment, and storing for later use.
2. The method for precisely cleaning cavity parts of production equipment in the electronic information industry as claimed in claim 1, wherein the rinsing and ultrasonic soaking treatment steps and the part drying treatment step are performed in a dust-free room.
3. The method for precisely cleaning the cavity parts of the production equipment in the electronic information industry as claimed in claim 2, wherein the clean room grade is 100 grade or 10 grade.
4. The precision cleaning method for cavity parts of production equipment in the electronic information industry as claimed in claim 1, wherein the specific conditions of the rinsing and the ultrasonic soaking treatment are as follows: rinsing time is 5-10 s, ultrasonic intensity is controlled to be 4-20W/sq inch, and ultrasonic soaking time is controlled to be more than 30 minutes.
5. The precision cleaning method for cavity parts of production equipment in the electronic information industry as claimed in claim 1, wherein the physical stripping is: and (3) flushing the parts by adopting a high-pressure water jet with the water pressure of 50-150 bar or an ultrahigh-pressure water jet with the water pressure of 1800-2400 bar.
6. The precision cleaning method for cavity parts of production equipment in the electronic information industry as claimed in claim 1, wherein the chemical stripping is: according to the material, the film quality and the chemical attachment condition of the component, acid, alkali, oxidant and the like with chemical reaction selectivity are selected for soaking and removing the film, and the selected acid, alkali, oxidant and the like have no reaction or weak reaction on the component.
7. The method for precisely cleaning the cavity part of the production equipment in the electronic information industry according to claim 1, wherein the sand blasting is performed by using a high-strength white corundum sand material to impact the surface of the part at a high speed to form a concave-convex layer.
8. The precision cleaning method for cavity parts of production equipment in the electronic information industry according to claim 7, wherein the type of the white corundum sand material is as follows: 24#, 36#, 46#, 80#, 220#, 400 #.
9. The method for precisely cleaning the cavity part of the production equipment in the electronic information industry as claimed in claim 7, wherein the roughness Ra value of the part after the sand blasting treatment is 0.5-15 microns.
10. The precision cleaning method for cavity parts of production equipment in the electronic information industry as claimed in claim 1, wherein after the meltallizing treatment, the roughness Ra value of the parts is 10-40 microns.
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| CN112226742A (en) * | 2020-07-29 | 2021-01-15 | 安徽富乐德科技发展股份有限公司 | Method for cleaning holes of gas distribution aluminum component in CVD (chemical vapor deposition) equipment |
| CN112170276A (en) * | 2020-08-28 | 2021-01-05 | 富乐德科技发展（大连）有限公司 | Cleaning process for parts in grinding device in semiconductor equipment |
| CN112354976A (en) * | 2020-10-14 | 2021-02-12 | 富乐德科技发展（天津）有限公司 | Cleaning method for removing deposited pollutants on surface of anodized aluminum |
| CN112553630A (en) * | 2020-12-02 | 2021-03-26 | 江苏凯威特斯半导体科技有限公司 | Process for removing titanium or titanium nitride film on surface of semiconductor equipment |
| CN112676286A (en) * | 2020-12-09 | 2021-04-20 | 四川富乐德科技发展有限公司 | Method for cleaning Parylene-C filling material bag |
| CN112845343A (en) * | 2021-01-14 | 2021-05-28 | 安徽富乐泰水泵系统有限公司 | Production process of high-cleanliness pump |
| CN112845343B (en) * | 2021-01-14 | 2023-11-24 | 安徽富乐泰水泵系统有限公司 | Production process of high-cleanliness pump |
| CN113967610A (en) * | 2021-10-13 | 2022-01-25 | 四川富乐德科技发展有限公司 | Technology for cleaning and removing ultra-thick copper film of anti-sticking plate |
| CN113967610B (en) * | 2021-10-13 | 2023-03-14 | 四川富乐德科技发展有限公司 | Cleaning and removing technology for ultra-thick copper film of anti-sticking plate |
| CN114226327A (en) * | 2021-12-17 | 2022-03-25 | 富乐德科技发展（天津）有限公司 | Cleaning method for removing composite sediment deposited on surface of ceramic substrate |
| CN114535186A (en) * | 2022-01-12 | 2022-05-27 | 合肥微睿光电科技有限公司 | Method for regenerating a component in a cavity of a PECVD or DRY ETCH apparatus |
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Application publication date: 20200703 |