CN116254094A - Diamond micro powder aggregate based on ceramic bond and preparation method thereof - Google Patents
Diamond micro powder aggregate based on ceramic bond and preparation method thereof Download PDFInfo
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- CN116254094A CN116254094A CN202310011666.6A CN202310011666A CN116254094A CN 116254094 A CN116254094 A CN 116254094A CN 202310011666 A CN202310011666 A CN 202310011666A CN 116254094 A CN116254094 A CN 116254094A
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- 239000010432 diamond Substances 0.000 title claims abstract description 80
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 80
- 239000000919 ceramic Substances 0.000 title claims abstract description 71
- 239000000843 powder Substances 0.000 title claims abstract description 66
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 238000009495 sugar coating Methods 0.000 claims abstract description 26
- 238000000227 grinding Methods 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000002844 melting Methods 0.000 claims abstract description 12
- 239000011230 binding agent Substances 0.000 claims abstract description 11
- 239000008187 granular material Substances 0.000 claims description 70
- 238000005245 sintering Methods 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 20
- 239000011812 mixed powder Substances 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 16
- 239000011734 sodium Substances 0.000 claims description 16
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 14
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 12
- 239000007767 bonding agent Substances 0.000 claims description 11
- 229910018068 Li 2 O Inorganic materials 0.000 claims description 10
- 238000007873 sieving Methods 0.000 claims description 10
- 229910052708 sodium Inorganic materials 0.000 claims description 10
- 238000007790 scraping Methods 0.000 claims description 8
- 238000000498 ball milling Methods 0.000 claims description 6
- 229920001353 Dextrin Polymers 0.000 claims description 5
- 239000004375 Dextrin Substances 0.000 claims description 5
- 239000002202 Polyethylene glycol Substances 0.000 claims description 5
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 5
- 235000019425 dextrin Nutrition 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 229920001223 polyethylene glycol Polymers 0.000 claims description 5
- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 claims description 4
- 238000012216 screening Methods 0.000 claims description 4
- 235000019812 sodium carboxymethyl cellulose Nutrition 0.000 claims description 4
- 229920001027 sodium carboxymethylcellulose Polymers 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 238000003756 stirring Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000005096 rolling process Methods 0.000 abstract description 5
- 238000005498 polishing Methods 0.000 abstract description 4
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 238000003837 high-temperature calcination Methods 0.000 abstract 1
- 238000009776 industrial production Methods 0.000 abstract 1
- 239000010935 stainless steel Substances 0.000 description 8
- 229910001220 stainless steel Inorganic materials 0.000 description 8
- 229910002114 biscuit porcelain Inorganic materials 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 4
- 238000003892 spreading Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000010431 corundum Substances 0.000 description 3
- 229910052593 corundum Inorganic materials 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000010791 quenching Methods 0.000 description 3
- 230000000171 quenching effect Effects 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910001751 gemstone Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/91—Use of waste materials as fillers for mortars or concrete
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- Composite Materials (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
The invention relates to a diamond micro powder aggregate based on a ceramic bond and a preparation method thereof. The invention is characterized in that diamond micro powder (0-50 μm), low-melting ceramic bond and temporary binder are evenly mixed according to a proper proportion and then put into a sugar coating machine, a diamond aggregate blank similar to a sphere is obtained by a rolling method, and then a fine diamond aggregate abrasive is obtained after high-temperature calcination, the shape of the fine diamond aggregate abrasive is similar to a sphere, and the grain diameter can be controlled to be 40-150 μm according to actual production requirements. The diamond aggregate has uniform size and adjustable tissue structure and performance, can be used for preparing a resin bond diamond grinding wheel, has higher grinding efficiency and service life, is mainly used for grinding and polishing brittle and hard materials such as ceramics, glass, hard alloy and the like, and can be used for industrial production.
Description
Technical Field
The invention belongs to the field of manufacturing of diamond grinding tools, and relates to a diamond micro powder aggregate based on ceramic bond and a preparation method thereof, which are mainly applied to the manufacturing aspect of diamond polishing tools.
Background
The diamond grinding tool is mainly used for grinding and polishing hard and brittle materials such as glass, ceramics, precious stone, hard alloy and the like. The traditional diamond grinding tool is mainly prepared by taking single crystal diamond micro powder as an abrasive material and taking ceramic bond, resin bond and metal bond as a matrix. The grinding tools of the same kind, such as diamond grinding wheel, diamond grinding disc, diamond abrasive belt, etc. can be prepared according to different purposes. Diamond abrasive tools are the most used abrasive tools in industrial grinding and polishing processes due to their unique high wear resistance and hardness relative to other abrasives (e.g., silicon carbide, corundum, etc.). However, in practical application, the use efficiency of the diamond abrasive is low, tiny diamond particles fall off from the matrix without fully playing a role, the service life of the grinding tool is seriously affected, although a method of plating other metals on the surface of the diamond is adopted to increase the holding force of the matrix on the diamond, firm interface bonding between the plating metal and the diamond does not exist, and the diamond is easy to fall off under a larger load; if the coating is thickened, the grinding wheel is easy to block, a large amount of grinding heat generated by work is difficult to dissipate in time, and the work piece is burnt. The polycrystalline diamond has good wear resistance and self-sharpening property, and the surface roughness makes the matrix have higher holding force, so the polycrystalline diamond is an ideal abrasive, but the prior art is limited, has the problem of high manufacturing cost, and is difficult to industrialize. This problem can be solved if the single crystal diamond micropowder is prepared by a suitable process into a granular abrasive having a structure and properties similar to those of polycrystalline diamond.
Disclosure of Invention
To this end, the present invention provides a method for preparing fine diamond granules using a low-melting ceramic binder as a binder. The invention solves the technical problems by adopting the technical proposal that,
the preparation method of the diamond micro powder aggregate based on the ceramic bond comprises the following steps:
(1) The diamond micro powder and the ceramic bond are mixed according to the mass ratio (60-80 wt%): uniformly mixing (20-40 wt%) and adding temporary adhesive to obtain mixed powder material;
(2) Placing the mixed powder into a sugar coating machine, starting the sugar coating machine, keeping the rotating speed at 30-50r/min, starting a sprayer to uniformly spray atomized water onto the mixed powder, controlling the water content of the mixed powder to be 10-25wt%, stirring a material pot by a scraping plate when the sugar coating machine works, scraping off powder adhered to the surface of the sugar coating machine until no dry powder is seen, and preparing primary granules after 20-30 min;
(3) Drying the primary granules at 50-60 ℃ for 120-180min, and sieving through a selected sieve number to obtain secondary granules; the rest is left for the next reuse;
(4) And sub-packaging the secondary granules by using a high-temperature resistant container, placing the secondary granules into a muffle furnace for high-temperature sintering, and sieving the sintered granules again according to the required granularity to obtain the diamond micro powder granules based on the ceramic bond.
Preferably, in step (1), the diamond micropowder has a particle size of 0 to 50. Mu.m.
Preferably, in the step (1), the mass ratio of the temporary bonding agent to the mixed powder of the ceramic bond and the diamond micro powder is (3-5 wt%): 100wt% of temporary binder selected from at least one of dextrin powder, sodium carboxymethyl cellulose and polyethylene glycol.
Preferably, in step (1), the ceramic bond is selected from Li 2 O-Na 2 O-Al 2 O 3 -B 2 O 3 -SiO 2 Is a low-melting ceramic bonding agent.
Preferably, the ceramic bond comprises the following components in percentage by weight: 55.5-67.5wt% SiO 2 The method comprises the steps of carrying out a first treatment on the surface of the 7.5 to 8.5wt% of Al 2 O 3 The method comprises the steps of carrying out a first treatment on the surface of the 10.5 to 16.5wt% of B 2 O 3 The method comprises the steps of carrying out a first treatment on the surface of the 12.5 to 22.5wt% of Li 2 O and Na 2 O，Li 2 O and Na 2 O is mixed in any ratio.
Preferably, the preparation method of the ceramic bond comprises the following steps: mixing SiO according to a certain proportion 2 、Al 2 O 3 、B 2 O 3 、Li 2 O and Na 2 O, after being melted for 0.5 to 1.5 hours at 1350 to 1450 ℃, is quenched by water, and then is formed according to the following ball: and (3) material: the mass ratio of water is 3:1 (0.8-1), ball milling is carried out for 2-3 hours at the rotating speed of 300-400rpm, and the ceramic bond is obtained after drying.
Preferably, in step (2), the primary granules are prepared by a roll method.
Preferably, in the step (4), the high-temperature sintering temperature is 580-650 ℃.
Preferably, in the step (4), the high temperature resistant container is selected from one of a bisque, quartz and corundum.
Preferably, the diamond micropowder aggregate based on the ceramic bond has a particle size of 40 μm to 150 μm.
The invention also provides the diamond micro powder granules based on the ceramic bond, which are prepared by the preparation method.
The invention also provides application of the ceramic bond-based diamond micro powder granules prepared by the preparation method in preparation of diamond grinding tools.
Compared with the prior art, the invention has the beneficial effects that:
the invention selects proper low-melting ceramic bond as main bond of the aggregate, adds diamond micropowder and other temporary bond (such as dextrin powder, sodium carboxymethyl cellulose (CMC), polyethylene glycol (PEG-400) and the like), and prepares the diamond micropowder aggregate based on ceramic bond bonding by using a sugar coating machine.
The invention solves the problems of low utilization rate and poor self-sharpening property of diamond in the diamond grinding tool, and can improve the processing efficiency by more than 30 percent. The process of the aggregate is simple to operate, the prepared diamond micro powder aggregate is suitable for manufacturing a diamond precise polishing grinding tool, has machining precision equivalent to that of original diamond micro powder, and effectively improves the service life and efficiency of the grinding tool. Meanwhile, the invention has simple operation and low cost, and is suitable for mechanized and automated production.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention, wherein:
fig. 1 is an SEM photograph of the ceramic bond-based diamond micro powder granules prepared in example 1 of the present invention.
Fig. 2 is a stereomicroscope photograph of fig. 1.
Detailed Description
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed.
Example 1
Preparing 170/200 mesh (75-90 μm) diamond micropowder aggregate. The preparation method comprises the following steps:
step (1):
preparing diamond micropowder with granularity of 600/800 mesh (about 20 μm), and self-made low-temperature high-strength ceramic bond (Li) 2 O-Na 2 O-Al 2 O 3 -B 2 O 3 -SiO 2 The ceramic bonding agent is a low-melting ceramic bonding agent, and comprises the following components: 55.5wt% SiO 2 ，7.5wt％Al 2 O 3 ，16.5wt％B 2 O 3 ，12.5wt％Li 2 O and 8wt% Na 2 O, water quenching after high-temperature melting at 1350 ℃/1h, and ball-grinding by a planetary ball mill: and (3) material: ball milling with water (mass ratio) =3:1:0.8-1 at a rotation speed of 350rpm for 2-3h, and drying to obtain the ceramic bond powder; the granularity of the ceramic bond powder is 1.5-3.5 mu m, the sintering temperature is 515 ℃, the flexural strength is 73.8 MPa), and the powder is uniformly mixed according to the mass ratio of 6:4 and the same amount of dextrin powder (accounting for 3 weight percent of the mixed powder of the diamond micro powder and the ceramic bond).
Step (2):
placing the mixed powder into a pan of a sugar coating machine, starting the sugar coating machine, and keeping the rotating speed at 30r/min; simultaneously, the sprayer is started, the sprayer is closed after 5min (the water content is 10-25 wt%) and the material pot is stirred by a scraping plate when the sugar coating machine works, and the powder adhered on the surface of the sugar coating machine is scraped until no dry powder is seen, and the primary granules are prepared after 30 min.
Step (3):
spreading the primary granules prepared in the step (2), drying in an oven at 50-60 ℃ for 120min, and screening by a selected 170-mesh and 200-mesh screen, wherein the granules on the 200-mesh screen are reserved to obtain secondary granules; the 200 mesh undersize particles and 170 mesh oversize particles are left for the next reuse.
Step (4):
and (3) placing the secondary granules obtained in the step (3) into a container of a bisque crucible (quartz, corundum and the like can be replaced) for sintering in a muffle furnace, wherein the set temperature is 650 ℃.
Step (5):
cooling the granules subjected to high-temperature sintering, sieving with a 170-mesh and 200-mesh sieve again, bonding a small amount of granules after high-temperature sintering, lightly rolling the granules on a stainless steel tray by using a stainless steel roller, sieving again for separation, controlling the granularity of the granules, and taking a 170-mesh/200-mesh sieve intermediate as the diamond micro powder granules finally based on a ceramic binder.
As can be seen from fig. 1 and 2, the diamond micro powder granules prepared by the method have uniform size and approximate spherical shape.
Example 2
140/170 mesh (100 μm) diamond micropowder granules were prepared. The preparation method comprises the following steps:
step (1):
preparing diamond micropowder with granularity of 500 meshes/600 meshes (about 25 μm), and self-made low-temperature high-strength ceramic binder powder (Li) 2 O-Na 2 O-Al 2 O 3 -B 2 O 3 -SiO 2 The ceramic bonding agent is a low-melting ceramic bonding agent, and comprises the following components: 57.5wt% SiO 2 ，7.5wt％Al 2 O 3 ，13.5wt％B 2 O 3 ，10.5wt％Li 2 O，11wt％Na 2 O, water quenching after high-temperature melting at 1380 ℃/1.5h, and ball grinding by a planetary ball mill: and (3) material: ball milling with water (mass ratio) =3:1:0.8-1 at 400rpm for 2-3h, and drying to obtain the ceramic bond powder; the ceramic bond has a sintering temperature of 520 ℃ and a flexural strength of 64.6MPa, and sodium carboxymethylcellulose (accounting for about diamond micropowder and ceramic bond) with the mass ratio of 7:3 and the same amount4wt% of the mixed powder) was uniformly mixed.
Step (2):
placing the mixed powder into a pan of a sugar coating machine, starting the sugar coating machine, and keeping the rotating speed at 30r/min; simultaneously, the sprayer is started, the sprayer is closed after 5min (the water content is 10-25 wt%) and the material pot is stirred by a scraping plate when the sugar coating machine works, and the powder adhered on the surface of the sugar coating machine is scraped until no dry powder is seen, and the primary granules are prepared after 30 min.
Step (3):
spreading the primary granules prepared in the step (2), drying in an oven at 50-60 ℃ for 120min, and sieving through a selected 140-mesh and 170-mesh sieve, wherein particles on the 170-mesh sieve are reserved, so as to obtain secondary granules; the 170 mesh undersize particles and the 140 mesh oversize particles are left for the next reuse.
Step (4):
and (3) placing the secondary granules obtained in the step (3) into a bisque crucible container, and sintering in a muffle furnace, wherein the set temperature is 630 ℃.
Step (5):
cooling the granules subjected to high-temperature sintering, sieving with a 140 mesh/170 mesh screen again, bonding a small amount of granules after high-temperature sintering, lightly rolling the granules on a stainless steel tray by using a stainless steel roller, sieving again, separating, controlling the granularity of the granules, and taking 140 mesh/170 mesh screen spacers as diamond micro powder granules finally based on ceramic bond.
Example 3
120/140 mesh (110 μm) diamond micropowder granules were prepared. The preparation method comprises the following steps:
step (1):
preparing diamond micropowder with particle size of 325/400 mesh (about 40 μm), and self-made low-temperature high-strength ceramic binder powder (Li) 2 O-Na 2 O-Al 2 O 3 -B 2 O 3 -SiO 2 The ceramic bonding agent is a low-melting ceramic bonding agent, and comprises the following components: 67.5wt% SiO 2 ，8.5wt％Al 2 O 3 ，10.5wt％B 2 O 3 ，5.7wt％Li 2 O，7.8wt％Na 2 O, after being melted at a high temperature of 1450 ℃/0.5h, is quenched by water and is recycledThe planetary ball mill is used for mixing balls: and (3) material: the ceramic bond powder is obtained by ball milling water (mass ratio) =3:1:0.8-1 for 2-3 hours at the rotating speed of 300rpm, and then drying, and the ceramic bond powder is uniformly mixed with dextrin powder (accounting for about 5wt% of the mixed powder of diamond micro powder and ceramic bond) according to the mass ratio of 7:3 and with the same amount, wherein the sintering temperature is 530 ℃ and the flexural strength is 69.6 MPa.
Step (2):
placing the mixed powder into a pan of a sugar coating machine, starting the sugar coating machine, and keeping the rotating speed at 30r/min; simultaneously, the sprayer is started, the sprayer is closed after 5min (the water content is 10-25 wt%) and the material pot is stirred by a scraping plate when the sugar coating machine works, and the powder adhered on the surface of the sugar coating machine is scraped until no dry powder is seen, and the primary granules are prepared after 30 min.
Step (3):
spreading the primary granules prepared in the step (2), drying in an oven at 50-60 ℃ for 120min, and screening by a selected 120-mesh and 140-mesh screen, wherein the granules on the 140-mesh screen are reserved to obtain secondary granules; the 140 mesh undersize particles and the 120 mesh oversize particles are left for the next reuse.
Step (4):
and (3) placing the secondary granules obtained in the step (3) into a bisque crucible container, and sintering in a muffle furnace, wherein the set temperature is 615 ℃.
Step (5):
the granules after high temperature sintering are cooled and then are screened by a 120 mesh/140 mesh screen again, a small amount of granules are bonded with each other after high temperature sintering, the granules can be screened and separated again after being lightly rolled on a stainless steel tray by a stainless steel roller, the granularity of the granules is controlled, and the 120 mesh/140 mesh screen spacers are taken as diamond micro powder granules finally based on ceramic bond.
Example 4
100/120 mesh (130 μm) diamond micropowder granules were prepared. The preparation method comprises the following steps:
step (1):
preparing diamond micropowder with particle size of 270/325 mesh (about 50 μm), and self-made low-temperature high-strength ceramic binder powder (Li) 2 O-Na 2 O-Al 2 O 3 -B 2 O 3 -SiO 2 The ceramic bonding agent is a low-melting ceramic bonding agent, and comprises the following components: 59.5wt% SiO 2 ，8.2wt％Al 2 O 3 ，12.5wt％B 2 O 3 ，5.5wt％Li 2 O，14.3wt％Na 2 O, water quenching after high-temperature melting at 1400 ℃/1h, and ball grinding by a planetary ball mill: and (3) material: the ceramic bond powder is obtained by ball milling water (mass ratio) =3:1:0.8-1 for 2-3 hours at the rotating speed of 300rpm, and then drying, and the ceramic bond powder is uniformly mixed with polyethylene glycol (accounting for about 4wt% of the mixed powder of diamond micro powder and ceramic bond) according to the mass ratio of 8:2 and with the same amount, wherein the sintering temperature is 525 ℃, and the flexural strength is 67.5 MPa.
Step (2):
placing the mixed powder into a pan of a sugar coating machine, starting the sugar coating machine, and keeping the rotating speed at 30r/min; simultaneously, the sprayer is started, the sprayer is closed after 5min (the water content is 10-25 wt%) and the material pot is stirred by a scraping plate when the sugar coating machine works, and the powder adhered on the surface of the sugar coating machine is scraped until no dry powder is seen, and the primary granules are prepared after 30 min.
Step (3):
spreading the primary granules prepared in the step (2), drying in an oven at 50-60 ℃ for 120min, and screening by a selected 100-mesh and 120-mesh screen, wherein the particles on the 120-mesh screen are left for use, so as to obtain secondary granules; the 120 mesh undersize particles and the 100 mesh oversize particles are left for the next reuse.
Step (4):
and (3) placing the secondary granules obtained in the step (3) into a bisque crucible container, and sintering in a muffle furnace, wherein the set temperature is 580 ℃.
Step (5):
cooling the granules subjected to high-temperature sintering, sieving with a 100 mesh/120 mesh screen again, bonding a small amount of granules after high-temperature sintering, lightly rolling the granules on a stainless steel tray by using a stainless steel roller, sieving again, separating, controlling the granularity of the granules, and taking 100 mesh/120 mesh screen spacers as diamond micro powder granules finally based on ceramic bond.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention herein. This invention is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
It is to be understood that the invention is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the invention is limited only by the appended claims.
Claims (10)
1. The preparation method of the diamond micro powder aggregate based on the ceramic bond is characterized by comprising the following steps:
(1) The diamond micro powder and the ceramic bond are mixed according to the mass ratio (60-80 wt%): uniformly mixing (20-40 wt%) and adding temporary adhesive to obtain mixed powder material;
(2) Placing the mixed powder into a sugar coating machine, starting the sugar coating machine, keeping the rotating speed at 30-50r/min, starting a sprayer to uniformly spray atomized water onto the mixed powder, controlling the water content of the mixed powder to be 10-25wt%, stirring a material pot by a scraping plate when the sugar coating machine works, scraping off powder adhered to the surface of the sugar coating machine until no dry powder is seen, and preparing primary granules after 20-30 min;
(3) Drying the primary granules at 50-60 ℃ for 120-180min, and screening through a selected screen number to obtain secondary granules; the rest is left for the next reuse;
(4) And subpackaging the secondary granules by using a high-temperature resistant container, placing the secondary granules into a muffle furnace for high-temperature sintering, and sieving the sintered granules again according to the required granularity to obtain the diamond micro powder granules based on the ceramic bond.
2. The method of producing diamond micro powder granules based on ceramic binder according to claim 1, wherein the diamond micro powder has a particle size of 0 to 50 μm in step (1).
3. The method of producing diamond micro powder granules based on ceramic bond according to claim 1, wherein in step (1), the mass ratio of the temporary binder and the mixed powder of the ceramic bond and the diamond micro powder is (3-5 wt%): 100wt% of temporary binder selected from at least one of dextrin powder, sodium carboxymethyl cellulose and polyethylene glycol.
4. The method of producing diamond micro powder granules based on ceramic bond according to claim 1, wherein in step (1), the ceramic bond is selected from Li 2 O-Na 2 O-Al 2 O 3 -B 2 O 3 -SiO 2 Is a low-melting ceramic bonding agent.
5. The method for preparing diamond micro powder granules based on ceramic bond as claimed in claim 4, wherein the ceramic bond comprises the following components in percentage by weight: 55.5-67.5wt% SiO 2 The method comprises the steps of carrying out a first treatment on the surface of the 7.5 to 8.5wt% of Al 2 O 3 The method comprises the steps of carrying out a first treatment on the surface of the 10.5 to 16.5wt% of B 2 O 3 The method comprises the steps of carrying out a first treatment on the surface of the 12.5 to 22.5wt% of Li 2 O and Na 2 O，Li 2 O and Na 2 O is mixed in any ratio.
6. The method for preparing diamond micro powder granules based on ceramic bond according to claim 5, wherein the method for preparing ceramic bond comprises the following steps: mixing SiO according to a certain proportion 2 、Al 2 O 3 、B 2 O 3 、Li 2 O and Na 2 O, after being melted for 0.5 to 1.5 hours at 1350 to 1450 ℃, is quenched by water, and then is formed according to the following ball: and (3) material: the mass ratio of water is 3:1 (0.8-1), ball milling is carried out for 2-3 hours at the rotating speed of 300-400rpm, and the ceramic bond is obtained after drying.
7. The method of preparing ceramic bond-based diamond micro powder granules according to claim 1, wherein in step (4), the high-temperature sintering temperature is 580-650 ℃.
8. The method of preparing ceramic bond-based diamond micro powder granules according to claim 1, wherein the size of the ceramic bond-based diamond micro powder granules is 40 μm to 150 μm.
9. The diamond micro powder aggregate based on ceramic bond prepared by the preparation method according to any one of claims 1 to 8.
10. Use of the ceramic bond-based diamond micro powder granules prepared by the preparation method according to any one of claims 1 to 8 in the preparation of diamond grinding tools.
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