CN116209543A - 研磨装置及研磨垫的更换时期的决定方法 - Google Patents

研磨装置及研磨垫的更换时期的决定方法 Download PDF

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Publication number
CN116209543A
CN116209543A CN202180065798.6A CN202180065798A CN116209543A CN 116209543 A CN116209543 A CN 116209543A CN 202180065798 A CN202180065798 A CN 202180065798A CN 116209543 A CN116209543 A CN 116209543A
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CN
China
Prior art keywords
polishing
polishing pad
index value
wear
output values
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180065798.6A
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English (en)
Chinese (zh)
Inventor
铃木佑多
高桥太郎
大泷裕史
鸟越恒男
西田弘明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN116209543A publication Critical patent/CN116209543A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/003—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Acoustics & Sound (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN202180065798.6A 2020-09-29 2021-08-05 研磨装置及研磨垫的更换时期的决定方法 Pending CN116209543A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020163274A JP7421460B2 (ja) 2020-09-29 2020-09-29 研磨装置、および研磨パッドの交換時期を決定する方法
JP2020-163274 2020-09-29
PCT/JP2021/029120 WO2022070607A1 (ja) 2020-09-29 2021-08-05 研磨装置、および研磨パッドの交換時期を決定する方法

Publications (1)

Publication Number Publication Date
CN116209543A true CN116209543A (zh) 2023-06-02

Family

ID=80951343

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180065798.6A Pending CN116209543A (zh) 2020-09-29 2021-08-05 研磨装置及研磨垫的更换时期的决定方法

Country Status (6)

Country Link
US (1) US20230356350A1 (enExample)
JP (1) JP7421460B2 (enExample)
KR (1) KR102772031B1 (enExample)
CN (1) CN116209543A (enExample)
TW (1) TWI881169B (enExample)
WO (1) WO2022070607A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117718876A (zh) * 2024-02-07 2024-03-19 华海清科股份有限公司 用于化学机械抛光的监测方法和化学机械抛光设备
CN119141329A (zh) * 2024-09-30 2024-12-17 东风汽车集团股份有限公司 一种汽车车身自动化精饰方法及系统

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115541703B (zh) * 2022-09-27 2025-07-18 厦门理工学院 一种风电叶片连接处细小缺陷的检测方法和装置以及设备
KR102748383B1 (ko) * 2022-10-26 2024-12-31 주식회사 슈텍 화학기계적 연마장비용 검사 모니터링 장치, 이를 포함하는 화학기계적 연마장비 및 이의 제어방법
JP2024067256A (ja) * 2022-11-04 2024-05-17 株式会社荏原製作所 研磨装置、情報処理装置及びプログラム

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6191038B1 (en) * 1997-09-02 2001-02-20 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
JP2001079752A (ja) * 1999-09-08 2001-03-27 Hitachi Ltd 化学的機械研磨装置およびこれを用いた半導体集積回路装置の製造方法
JP2005022028A (ja) * 2003-07-02 2005-01-27 Tokyo Seimitsu Co Ltd 研磨パッドのドレッシング装置及び該装置を有する加工装置
JP2006255851A (ja) * 2005-03-18 2006-09-28 Ebara Corp 研磨装置
JP2010226007A (ja) * 2009-03-25 2010-10-07 Renesas Electronics Corp 研磨工程制御方法および半導体ウエハ研磨システム
CN102248486A (zh) * 2011-07-25 2011-11-23 清华大学 抛光垫修整方法
CN104608055A (zh) * 2013-11-01 2015-05-13 株式会社荏原制作所 研磨装置及研磨方法
CN204954631U (zh) * 2015-09-21 2016-01-13 青岛理工大学 一种声发射和测力仪集成的砂轮堵塞检测清洗装置
CN106826565A (zh) * 2017-03-16 2017-06-13 中国人民解放军装甲兵工程学院 一种利用磨削力监控砂轮磨损与磨削烧伤的方法
US20180093363A1 (en) * 2016-09-30 2018-04-05 Ebara Corporation Substrate polishing apparatus
CN107877356A (zh) * 2016-09-30 2018-04-06 株式会社荏原制作所 研磨系统以及研磨方法
JP2020069638A (ja) * 2018-10-31 2020-05-07 株式会社ノリタケカンパニーリミテド ドレッシング面評価装置、ドレッシング装置、および、研削加工装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100877383B1 (ko) * 2001-11-13 2009-01-07 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
JP5219600B2 (ja) 2008-04-18 2013-06-26 株式会社東京精密 砥石成形状態判定装置及び砥石成形状態判定方法
JP5511600B2 (ja) 2010-09-09 2014-06-04 株式会社荏原製作所 研磨装置
JP5927083B2 (ja) 2012-08-28 2016-05-25 株式会社荏原製作所 ドレッシングプロセスの監視方法および研磨装置
JP6704244B2 (ja) * 2015-12-03 2020-06-03 株式会社ディスコ 研磨装置
JP6829653B2 (ja) * 2017-05-17 2021-02-10 株式会社荏原製作所 研磨装置および研磨方法
JP7265848B2 (ja) 2018-08-23 2023-04-27 株式会社荏原製作所 研磨パッド高さを決定する方法、および研磨システム
KR20200043216A (ko) * 2018-10-17 2020-04-27 주식회사 케이씨텍 화학 기계적 연마 장치의 컨디셔너

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6191038B1 (en) * 1997-09-02 2001-02-20 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
JP2001079752A (ja) * 1999-09-08 2001-03-27 Hitachi Ltd 化学的機械研磨装置およびこれを用いた半導体集積回路装置の製造方法
JP2005022028A (ja) * 2003-07-02 2005-01-27 Tokyo Seimitsu Co Ltd 研磨パッドのドレッシング装置及び該装置を有する加工装置
JP2006255851A (ja) * 2005-03-18 2006-09-28 Ebara Corp 研磨装置
JP2010226007A (ja) * 2009-03-25 2010-10-07 Renesas Electronics Corp 研磨工程制御方法および半導体ウエハ研磨システム
CN102248486A (zh) * 2011-07-25 2011-11-23 清华大学 抛光垫修整方法
CN104608055A (zh) * 2013-11-01 2015-05-13 株式会社荏原制作所 研磨装置及研磨方法
CN204954631U (zh) * 2015-09-21 2016-01-13 青岛理工大学 一种声发射和测力仪集成的砂轮堵塞检测清洗装置
US20180093363A1 (en) * 2016-09-30 2018-04-05 Ebara Corporation Substrate polishing apparatus
CN107877356A (zh) * 2016-09-30 2018-04-06 株式会社荏原制作所 研磨系统以及研磨方法
CN106826565A (zh) * 2017-03-16 2017-06-13 中国人民解放军装甲兵工程学院 一种利用磨削力监控砂轮磨损与磨削烧伤的方法
JP2020069638A (ja) * 2018-10-31 2020-05-07 株式会社ノリタケカンパニーリミテド ドレッシング面評価装置、ドレッシング装置、および、研削加工装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117718876A (zh) * 2024-02-07 2024-03-19 华海清科股份有限公司 用于化学机械抛光的监测方法和化学机械抛光设备
CN117718876B (zh) * 2024-02-07 2024-06-18 华海清科股份有限公司 用于化学机械抛光的监测方法和化学机械抛光设备
US12151335B1 (en) 2024-02-07 2024-11-26 Hwatsing Technology Co., Ltd. Monitoring method for chemical mechanical polishing and chemical mechanical polishing device
TWI877018B (zh) * 2024-02-07 2025-03-11 大陸商華海清科股份有限公司 用於化學機械拋光的監測方法和化學機械拋光設備
CN119141329A (zh) * 2024-09-30 2024-12-17 东风汽车集团股份有限公司 一种汽车车身自动化精饰方法及系统

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Publication number Publication date
TW202215521A (zh) 2022-04-16
KR20230078720A (ko) 2023-06-02
WO2022070607A1 (ja) 2022-04-07
JP7421460B2 (ja) 2024-01-24
JP2022055703A (ja) 2022-04-08
US20230356350A1 (en) 2023-11-09
KR102772031B1 (ko) 2025-02-26
TWI881169B (zh) 2025-04-21

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