CN116180171A - Method for preparing ceramic substrate with large copper layer thickness by one-time electroplating - Google Patents
Method for preparing ceramic substrate with large copper layer thickness by one-time electroplating Download PDFInfo
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- CN116180171A CN116180171A CN202211685199.7A CN202211685199A CN116180171A CN 116180171 A CN116180171 A CN 116180171A CN 202211685199 A CN202211685199 A CN 202211685199A CN 116180171 A CN116180171 A CN 116180171A
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- ceramic substrate
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- copper plate
- adhesive layer
- electroplating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/625—Discontinuous layers, e.g. microcracked layers
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- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
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- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention belongs to the technical field related to electronic packaging, and discloses a method for preparing a ceramic substrate with a large copper layer thickness by one-time electroplating, which comprises the following steps: (1) Selecting a clean and flat red copper plate, coating a thick adhesive layer on the upper surface of the red copper plate, and preparing a pattern by adopting a laser processing or LIGA process; (2) Reversely buckling the red copper plate containing the thick adhesive layer, pressing the red copper plate on a DPC ceramic substrate, taking the red copper plate as an anode, taking negative electricity of the DPC ceramic substrate as a cathode, and taking the distance between the cathode and the anode as the thickness of the thick adhesive layer; (3) Placing the whole device in the step (2) in electroplating solution, switching on a power supply, directly depositing an electroplated copper pattern on the DPC ceramic substrate, and electroplating to a proper thickness at one time; (4) And removing the copper plate containing the thick adhesive layer, and removing the redundant seed layer to obtain the ceramic substrate containing the large copper layer thickness. The invention ensures the processing precision and the miniaturization, simultaneously improves the thickness of the metal circuit layer, has high electroplating deposition efficiency and good plating uniformity, and greatly improves the production efficiency.
Description
Technical Field
The invention belongs to the technical field of electronic packaging, and particularly relates to a method for preparing a ceramic substrate with a large copper layer thickness by one-time electroplating.
Background
Ceramic substrates have become the base material for high power electronic device packaging and interconnection, with great current carrying capacity. In order to further increase the current carrying capacity of ceramic substrates, it is generally desirable to increase the thickness of the metal wiring layer on the surface thereof. The preparation of the large-thickness metal circuit layer with the thickness of more than 100 mu m is generally carried out by adopting a multi-layer pattern electroplating technology, but the thick dry film has higher cost, limited dry film thickness and has the requirement on the exposure strength of a photoetching machine, the preparation processes of repeated dry film pasting, exposure, development, electroplating thickening and the like are required, the production efficiency is low, and the dam is layered due to repeated exposure and alignment errors, the side wall is uneven, and the pattern precision and the encapsulation air tightness are influenced.
Disclosure of Invention
In order to meet the above defects or improvement demands of the prior art, the invention provides a method for preparing a ceramic substrate with a large copper layer thickness by one-time electroplating. Firstly, coating a thick adhesive layer on the upper surface of a red copper plate, then adopting a laser processing or LIGA technology to prepare a pattern, reversely buckling the red copper plate containing the thick adhesive layer on a DPC ceramic substrate, positively connecting the red copper plate, negatively connecting the DPC substrate, placing the whole device in electroplating liquid, switching on a power supply, directly depositing the electroplated copper pattern on the DPC ceramic substrate, electroplating to a proper thickness at one time, finally removing the red copper plate containing the thick adhesive layer, and removing an excessive seed layer to obtain the ceramic substrate containing a large copper layer thickness. The invention has high electroplating deposition efficiency, good plating uniformity and high pattern precision, and greatly improves the production efficiency.
In order to achieve the above object, the method for preparing the ceramic substrate with a large copper layer thickness by one-time electroplating comprises the following steps:
(1) Selecting a clean and flat red copper plate, coating a thick adhesive layer on the upper surface of the red copper plate, and preparing a pattern by adopting a laser processing or LIGA process;
(2) Reversely buckling the thick-adhesive-layer-containing red copper plate, pressing the red copper plate on a DPC ceramic substrate, and then connecting the red copper plate to positive electricity, wherein the DPC ceramic substrate is connected to negative electricity;
(3) Placing the whole device in the step (2) in electroplating solution, switching on a power supply, and directly depositing an electroplated copper pattern on the DPC ceramic substrate;
(4) And removing the copper plate containing the thick adhesive layer, and removing the redundant seed layer to obtain the ceramic substrate containing the large copper layer thickness.
Further, in the step (1), the thickness of the copper plate is larger than 0.5-3.0mm.
Further, in the step (1), the thick adhesive layer material is silica gel, SU-8 gel, PI film, or the like.
Further, in the step (1), the thickness of the thick adhesive layer is 1.0-5.0mm.
Further, in the step (2), the copper plate is positively charged and serves as an electroplating anode, the DPC substrate is negatively charged and serves as an electroplating cathode, and the distance between the cathode and the anode is a thick glue layer thickness.
Further, in the step (3), the electroplated copper pattern may be electroplated to a proper thickness at one time.
Further, in the step (3), the thickness of the electroplated copper pattern is 0.5-3.0mm and is smaller than the thickness of the thick adhesive layer.
In general, compared with the prior art, the method for preparing the ceramic substrate with the large copper layer thickness by one-time electroplating has the following main beneficial effects:
1. the anode with the thick adhesive layer structure consists of a metal copper plate and a surface thick adhesive layer pattern, is prepared by adopting a laser processing or LIGA technology, and can be used as a die for repeated recycling.
2. The copper plate with the thick adhesive layer structure can be used as an anode for one-time electroplating preparation of a large copper layer, and has high pattern precision and high production efficiency.
3. The electroplating anode and the electroplating cathode have small distance, so that the electroplating deposition efficiency is high, and the plating uniformity is good.
Drawings
FIG. 1 is a schematic flow chart of a method for preparing a ceramic substrate with a large copper layer thickness by one-time electroplating.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. In addition, the technical features of the embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
The invention provides a method for preparing a ceramic substrate with a large copper layer thickness by one-time electroplating, which mainly comprises the following steps:
firstly, selecting a clean and flat red copper plate 1, coating a thick adhesive layer 2 on the upper surface of the red copper plate 1, and then adopting a laser processing or LIGA technology to prepare a pattern.
Specifically, a clean and flat red copper plate 1 with the thickness of more than 0.5mm is selected, a thick adhesive layer 2 is coated on the upper surface of the red copper plate 1, the thickness of the thick adhesive layer 2 is 1.0-5.0mm, and then a laser processing or LIGA technology is adopted to prepare a pattern.
The thick adhesive layer 2 is made of silica gel, SU-8 adhesive, PI film and the like, and the thickness uniformity of the thick adhesive layer 2 is better than 1%.
And secondly, reversely buckling the thick-adhesive-layer-containing red copper plate 1, pressing the red copper plate 1 on the DPC ceramic substrate 3, wherein the red copper plate 1 is positively charged, and the DPC ceramic substrate 3 is negatively charged.
Specifically, a thick glue layer-containing red copper plate 1 is reversely buckled and pressed on the DPC ceramic substrate 3 with the surface containing a metal seed layer, the red copper plate 1 is positively charged to serve as an electroplating anode, and the DPC ceramic substrate 3 is negatively charged to serve as an electroplating cathode.
Wherein, the distance between the electroplating anode and the electroplating cathode is the thickness of the thick adhesive layer 2.
And thirdly, placing the whole device in the second step in electroplating liquid, switching on a power supply, and directly depositing an electroplated copper pattern on the DPC ceramic substrate 3.
Specifically, the whole device in the second step is placed in an electrolyte containing copper sulfate, sulfuric acid and other components, and an electroplated copper pattern 4 is deposited on the DPC ceramic substrate 3 and can be electroplated to a proper thickness at one time.
Wherein the thickness of the electroplated copper pattern 4 is 0.5-3.0mm, and the thickness of the electroplated copper pattern is smaller than the thickness of the thick adhesive layer.
And step four, removing the red copper plate 1 containing the thick adhesive layer, and removing the redundant seed layer to obtain the ceramic substrate containing the large copper layer thickness.
Specifically, removing the red copper plate 1 containing the thick adhesive layer, etching to remove the redundant seed layer, and finally obtaining the ceramic substrate containing the large copper layer thickness
The invention is further described in detail in the following examples.
Example 1
Referring to fig. 1, embodiment 1 of the present invention provides a method for preparing a ceramic substrate with a large copper layer thickness by one-time electroplating, which mainly comprises the following steps:
firstly, selecting a clean and flat red copper plate 1, coating a thick adhesive layer 2 on the red copper plate 1, and then adopting a laser processing or LIGA technology to prepare a pattern.
Specifically, the first step includes:
(a1) Selecting a clean and flat copper plate 1 with the thickness of 0.5 mm;
(a2) The upper surface of the red copper plate 1 is coated with silica gel as a thick adhesive layer 2, the thickness of the thick adhesive layer 2 is 2mm, and the thickness uniformity is better than 1%;
(a3) The thick glue layer 2 is prepared into a pattern by a laser processing technology.
And secondly, reversely buckling the copper plate 1 containing the thick adhesive layer 2, pressing the copper plate on the DPC ceramic substrate 3, wherein the copper plate 1 is positively charged, and the DPC ceramic substrate 3 is negatively charged.
Specifically, the second step includes:
(b1) Reversely buckling the red copper plate 1 containing the thick adhesive layer 2, and pressing the red copper plate on the DPC ceramic substrate 3 with the surface containing the metal seed layer;
(b2) The red copper plate 1 is positively charged as an electroplating anode, the DPC ceramic substrate 3 is negatively charged as an electroplating cathode, and the distance between the electroplating anode and the electroplating cathode is the thickness of the thick adhesive layer 2.
And thirdly, placing the whole device in the second step in electroplating liquid, switching on a power supply, and directly depositing the electroplated copper pattern on the DPC ceramic substrate 3.
Specifically, the third step includes:
(c1) Placing the whole device in the second step into electrolyte containing copper sulfate, sulfuric acid and other components;
(c2) The electroplated copper pattern 4 was deposited directly on the DPC ceramic substrate 3, and was electroplated to a thickness of 1mm at one time.
And step four, removing the red copper plate 1 containing the thick adhesive layer, and removing the redundant seed layer to obtain the ceramic substrate containing the large copper layer thickness.
Specifically, the fourth step includes:
(d1) Removing the red copper plate 1 containing the thick adhesive layer;
(d2) And etching to remove the redundant seed layer.
Finally, the ceramic substrate with the large copper layer thickness is obtained
Example 2
Referring to fig. 1, embodiment 2 of the present invention provides a method for preparing a ceramic substrate with a large copper layer thickness by one-time electroplating, which mainly comprises the following steps:
firstly, selecting a clean and flat red copper plate, coating a thick adhesive layer 2 on the upper surface of the red copper plate 1, and then adopting a laser processing or LIGA technology to prepare a pattern.
Specifically, the first step includes:
(a1) Selecting a clean and flat copper plate 1 with the thickness of 3.0 mm;
(a2) Coating SU-8 glue on the upper surface of the red copper plate 1 as a thick glue layer 2, wherein the thickness of the thick glue layer 2 is 3.0mm, and the thickness uniformity is better than 1%;
(a3) The thick glue layer 2 is prepared into a pattern by a LIGA process.
And secondly, reversely buckling the copper plate 1 containing the thick adhesive layer 2, pressing the copper plate on the DPC ceramic substrate 3, wherein the copper plate 1 is positively charged, and the DPC ceramic substrate 3 is negatively charged.
Specifically, the second step includes:
(b1) Reversely buckling the red copper plate 1 containing the thick adhesive layer 2, and pressing the red copper plate on the DPC ceramic substrate 3 with the surface containing the metal seed layer;
(b2) The red copper plate 1 is positively charged as an electroplating anode, the DPC ceramic substrate 3 is negatively charged as an electroplating cathode, and the distance between the electroplating anode and the electroplating cathode is the thickness of the thick adhesive layer 2.
And thirdly, placing the whole device in the second step in electroplating solution, switching on a power supply, and directly depositing the electroplated copper pattern on the DPC ceramic substrate 3.
Specifically, the third step includes:
(c1) Placing the whole device in the second step into electrolyte containing copper sulfate, sulfuric acid and other components;
(c2) The power is turned on, and the electroplated copper pattern 4 is directly deposited on the DPC ceramic substrate 3 and is electroplated to a thickness of 2mm at one time.
And step four, removing the red copper plate 1 containing the thick adhesive layer, and removing the redundant seed layer to obtain the ceramic substrate containing the large copper layer thickness.
Specifically, the fourth step includes:
(d1) Removing the red copper plate 1 containing the thick adhesive layer;
(d2) And etching to remove the redundant seed layer.
Finally, the ceramic substrate with the large copper layer thickness is obtained
It will be readily appreciated by those skilled in the art that the foregoing description is merely a preferred embodiment of the invention and is not intended to limit the invention, but any modifications, equivalents, improvements or alternatives falling within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (7)
1. A method for preparing a ceramic substrate with a large copper layer thickness by one-time electroplating, which is characterized by comprising the following steps:
(1) Selecting a clean and flat red copper plate, coating a thick adhesive layer on the upper surface of the red copper plate, and preparing a pattern by adopting a laser processing or LIGA process;
(2) Reversely buckling the red copper plate containing the thick adhesive layer, pressing the red copper plate on the DPC ceramic substrate, and then, positively charging the red copper plate, and negatively charging the DPC ceramic substrate;
(3) Placing the whole device in the step (2) in electroplating liquid, starting a power supply, and depositing an electroplated copper pattern on the DPC ceramic substrate;
(4) And removing the copper plate containing the thick adhesive layer, and removing the redundant seed layer to obtain the ceramic substrate containing the large copper layer thickness.
2. The method for preparing the ceramic substrate with the large copper layer thickness by one-time electroplating according to claim 1, wherein the method comprises the following steps of: in the step (1), the thickness of the copper plate is 0.5-3.0mm.
3. The method for preparing the ceramic substrate with the large copper layer thickness by one-time electroplating according to claim 1, wherein the method comprises the following steps of: in the step (1), the thick adhesive layer is made of silica gel, SU-8 gel, PI film and the like.
4. The method for preparing the ceramic substrate with the large copper layer thickness by one-time electroplating according to claim 1, wherein the method comprises the following steps of: in the step (1), the thickness of the thick adhesive layer is 1.0-5.0mm.
5. The method for preparing the ceramic substrate with the large copper layer thickness by one-time electroplating according to claim 1, wherein the method comprises the following steps of: in the step (2), the red copper plate is positively charged and serves as an electroplating anode, the DPC ceramic substrate is negatively charged and serves as an electroplating cathode, and the distance between the cathode and the anode is thick.
6. The method for preparing the ceramic substrate with the large copper layer thickness by one-time electroplating according to claim 1, wherein the method comprises the following steps of: in the step (3), the electroplated copper pattern may be electroplated to a suitable thickness at one time.
7. The method for preparing the ceramic substrate with the large copper layer thickness by one-time electroplating according to claim 1, wherein the method comprises the following steps of: in the step (3), the thickness of the electroplated copper pattern is 0.5-3.0mm and is smaller than the thickness of the thick adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211685199.7A CN116180171A (en) | 2022-12-27 | 2022-12-27 | Method for preparing ceramic substrate with large copper layer thickness by one-time electroplating |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211685199.7A CN116180171A (en) | 2022-12-27 | 2022-12-27 | Method for preparing ceramic substrate with large copper layer thickness by one-time electroplating |
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| Publication Number | Publication Date |
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| CN116180171A true CN116180171A (en) | 2023-05-30 |
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| CN202211685199.7A Pending CN116180171A (en) | 2022-12-27 | 2022-12-27 | Method for preparing ceramic substrate with large copper layer thickness by one-time electroplating |
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- 2022-12-27 CN CN202211685199.7A patent/CN116180171A/en active Pending
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