CN116178898A - 一种自配120℃井下环氧浇注材料 - Google Patents

一种自配120℃井下环氧浇注材料 Download PDF

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CN116178898A
CN116178898A CN202211602045.7A CN202211602045A CN116178898A CN 116178898 A CN116178898 A CN 116178898A CN 202211602045 A CN202211602045 A CN 202211602045A CN 116178898 A CN116178898 A CN 116178898A
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self
parts
casting material
epoxy
epoxy casting
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向红璇
张世芬
王信
肖叶
石浩
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Chongqing Huxi Electrical Industrial Co ltd
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Chongqing Huxi Electrical Industrial Co ltd
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4284Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/56Amines together with other curing agents
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    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04Epoxynovolacs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/08Stabilised against heat, light or radiation or oxydation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/91Use of waste materials as fillers for mortars or concrete

Abstract

本发明的目的是提供一种自配120℃井下环氧浇注材料,包括环氧树脂、固化剂、填料、增韧剂等成分,该材料具有良好流动性,能耐压、耐温、耐油,耐腐蚀等优点,并且现用现配,操作方便。

Description

一种自配120℃井下环氧浇注材料
技术领域
本发明涉及环氧浇注材料。
背景技术
目前我国环氧树脂生产和应用已得到了迅速的发展,生产的品种、产量日益增多,质量不断提高,在高速发展的现代起着越来越重要的作用。环氧树脂的固化收缩率是热固性树脂中最小的,固化后变形小,尺寸稳定,精确度高,其制品具有优异的电气绝缘性能和机械性能,因此,广泛地运用环氧树脂浇注成型来制造要求高的电气绝缘产品。
由于本定子细小,外径在200mm以下,长度从2000mm到9000mm之间,井下作业,因此要求一次配环氧材料量多,粘度小,且能耐压、耐温、耐油,耐腐蚀,虽然现成的浇注材料种类繁多,性能各异,但不能满足120℃井下的环氧浇注的浇注材料。该问题需要开发新材料来解决。
发明内容
本发明的目的是提供一种自配120℃井下环氧浇注材料,其特征在于,材料成分和配比为(以下份数均为重量份):
Figure BDA0003997501020000011
进一步,所述环氧树脂为多种树脂的混合物。
进一步,所述环多种树脂的混合物的材料成分和配比为:
环氧树脂E-51 1-2份
环氧树脂F-51 1-2份
SP树脂 0.1-1份
进一步,所述固化剂选自液态酸酐、双马来胺、丙三醇。
进一步,所述固化剂的材料成分和配比为:
液态酸酐HK-021; 1-2份
双马来胺D103; 0.1-1.5份
丙三醇 0.05-0.2份
进一步,材料成分还包括增韧剂0.1-1份。
进一步,所述增韧剂为聚癸二酸酐。
进一步,所述填料为硅微粉。
本发明的技术效果是毋庸置疑的,该材料具有良好流动性,能耐压、耐温、耐油,耐腐蚀等优点,并且现用现配,操作方便。
具体实施方式
下面结合实施例对本发明作进一步说明,但不应该理解为本发明上述主题范围仅限于下述实施例。在不脱离本发明上述技术思想的情况下,根据本领域普通技术知识和惯用手段,做出各种替换和变更,均应包括在本发明的保护范围内。
实施例1:
一种自配井温为120℃井下环氧浇注材料,其原料为环氧树脂、固化剂、填料,重量份数按照3.67:3.03:3.3进行称量配置。
实施例2:
本实施例主要技术方案同实施例1,进一步,原料包括环氧树脂、固化剂、填料、增韧剂,其中
树脂包括:
1)环氧树脂:E-51;
2)环氧树脂:F-51;
3)SP树脂。
固化剂包括:
1)液态酸酐:HK-021;
2)双马来胺:D103;
3)丙三醇。
增韧剂为:
聚癸二酸酐:PSPA。
填料为:
硅微粉:HGH-600
实施例3:
本实施例主要技术方案同实施例2,进一步,按照表1进行称量各种原料
表1:环氧浇注材料配比表,
材料 E-51 F-51 SP D103 HK-021 丙三醇 PSPA HGH-600
重量Kg 1.63 1.63 0.41 0.99 1.5 0.13 0.41 3.3
实施例4:
本实施例主要技术方案同实施例3,进一步,配置材料时包括以下步骤:
1)将环氧树脂和硅微粉分别送入100℃的烘箱中进行预热处理0.5~1h。
2)将聚癸二酸酐PSPA研磨成细粉。
3)待环氧树脂热透后,按上表进行称料,并分为三组份:
A组份为环氧树脂份:环氧树脂E-51和环氧树脂F-51;
B组份为固化剂份:高温树脂SP、液态酸酐HK-021、双马来胺D103和聚癸二酸酐PSPA;
C组份为填料:硅微粉HGH-600;
丙三醇单独称好后待用。
4)将称好的A、B两组份材料分别送入120℃的烘箱中进行彻底溶解,在加热过程中要每隔15min进行搅拌一次,使A、B两组份中的几种物质彻底溶解,待溶解至无悬浮颗粒存在时,准备配料。
5)从烘箱中取出A、B两组份料,在A组份料中加入C组份料,搅拌均匀,分别用温度计测其温度为60~70℃时,将混合均匀的A、C组份料倒入B组份料中,彻底搅拌混合均匀后,再倒入称好的丙三醇,混合均匀。
这样井温为120℃环氧浇注材料配制完成,再进行真空脱泡处理后就可以浇注产品。

Claims (8)

1.一种自配120℃井下环氧浇注材料,其特征在于,材料成分和配比为:
环氧树脂 3-4.5份
固化剂 2.5-4份
填料 3-4.5份。
2.根据权利要求1所述的一种自配120℃井下环氧浇注材料,其特征在于:所述环氧树脂为多种树脂的混合物。
3.根据权利要求2所述的一种自配120℃井下环氧浇注材料,其特征在于:所述环多种树脂的混合物的材料成分和配比为:
环氧树脂E-51 1-2份
环氧树脂F-51 1-2份
SP树脂0.1-1份。
4.根据权利要求1或2所述的一种自配120℃井下环氧浇注材料,其特征在于:所述固化剂选自液态酸酐、双马来胺、丙三醇。
5.根据权利要求1或4所述的一种自配120℃井下环氧浇注材料,其特征在于:所述固化剂的材料成分和配比为:
液态酸酐HK-021;1-2份
双马来胺D103;0.1-1.5份
丙三醇0.05-0.2份。
6.根据权利要求1所述的一种自配120℃井下环氧浇注材料,其特征在于:材料成分还包括增韧剂0.1-1份。
7.根据权利要求6所述的一种自配120℃井下环氧浇注材料,其特征在于:所述增韧剂为聚癸二酸酐。
8.根据权利要求1所述的一种自配120℃井下环氧浇注材料,其特征在于:所述填料为硅微粉。
CN202211602045.7A 2022-12-13 2022-12-13 一种自配120℃井下环氧浇注材料 Pending CN116178898A (zh)

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