CN116175380A - Polishing system - Google Patents

Polishing system Download PDF

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Publication number
CN116175380A
CN116175380A CN202211664528.XA CN202211664528A CN116175380A CN 116175380 A CN116175380 A CN 116175380A CN 202211664528 A CN202211664528 A CN 202211664528A CN 116175380 A CN116175380 A CN 116175380A
Authority
CN
China
Prior art keywords
polishing
accommodating groove
carrying
equipment
transfer mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211664528.XA
Other languages
Chinese (zh)
Inventor
马科宁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xian Eswin Silicon Wafer Technology Co Ltd
Xian Eswin Material Technology Co Ltd
Original Assignee
Xian Eswin Silicon Wafer Technology Co Ltd
Xian Eswin Material Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xian Eswin Silicon Wafer Technology Co Ltd, Xian Eswin Material Technology Co Ltd filed Critical Xian Eswin Silicon Wafer Technology Co Ltd
Priority to CN202211664528.XA priority Critical patent/CN116175380A/en
Priority to TW112104923A priority patent/TWI844264B/en
Publication of CN116175380A publication Critical patent/CN116175380A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention discloses a polishing system, comprising: the polishing device comprises a polishing mechanism and a carrying mechanism; the transfer mechanism is detachably arranged on the polishing equipment and used for transferring the accommodating groove, the carrying mechanism is used for carrying the accommodating groove on the transfer mechanism to the unloading part of the polishing equipment, and the carrying mechanism is used for carrying the accommodating groove placed on the unloading part to the cleaning equipment. The silicon wafer polished by the abnormal polishing equipment of the cleaning machine is transferred to the position of the polishing equipment through the transfer mechanism, the accommodating groove of the transfer mechanism is transferred to the unloading part of the polishing equipment through the transfer mechanism, and the accommodating groove of the unloading part is transferred to the cleaning equipment through the transfer mechanism, so that the silicon wafer polished by the abnormal polishing equipment of the cleaning machine is transferred to the normal cleaning equipment for cleaning, the silicon wafer is cleaned as soon as possible, the abnormal polishing equipment of the cleaning machine can be produced normally, the processing quality and efficiency of the silicon wafer are guaranteed, and the reduction of production capacity caused by the abnormality of the cleaning machine is avoided.

Description

Polishing system
Technical Field
The invention belongs to the technical field of silicon wafers, and particularly relates to a polishing system.
Background
At present, in the processing process of a final polishing process, the final polishing machine can be divided into two main types according to different cleaning modes after final polishing, one type is a dry final polishing machine, a silicon wafer after the processing is finished is placed in a single-chip cleaning machine in butt joint with the silicon wafer by a manipulator, the cleaning and spin-drying of chemical agents are carried out in the single-chip cleaning machine, and finally the cleaned silicon wafer is placed in a silicon wafer storage box; the other type is a wet final polishing machine, wherein the processed silicon wafer is placed in a water tank by a mechanical arm, and the water tank with the silicon wafer is conveyed to a tank type cleaning machine for cleaning. Because the surface of the ground silicon wafer has residual grinding liquid, the silicon wafer is placed in the water tank for too long, particles are generated on the surface of the silicon wafer, the silicon wafer needs to be cleaned as soon as possible, and the silicon wafer cannot be cleaned in time due to the abnormality of the tank type cleaning machine, so that the wet type final polishing machine cannot normally produce, and the processing quality and efficiency of the silicon wafer are affected.
Disclosure of Invention
The embodiment of the invention aims to provide a polishing system which is used for solving the problem that a silicon wafer polished by a polishing machine cannot be cleaned due to the abnormality of a cleaning machine.
An embodiment of the present invention provides a polishing system, comprising:
the polishing device comprises a polishing mechanism and a carrying mechanism;
the transfer mechanism is detachably arranged on the polishing equipment and used for transferring the accommodating groove, the carrying mechanism is used for carrying the accommodating groove on the transfer mechanism to the unloading part of the polishing equipment, and the carrying mechanism is used for carrying the silicon wafer placed in the accommodating groove of the unloading part to the cleaning equipment.
Optionally, the polishing apparatus further includes a turnover mechanism, the carrying mechanism is configured to carry the accommodating groove on the transfer mechanism to the turnover mechanism, the turnover mechanism is configured to turn over the accommodating groove placed on the turnover mechanism, and the carrying mechanism is configured to carry the turned accommodating groove to an unloading part of the polishing apparatus.
Optionally, the turnover mechanism includes:
the overturning platform is used for placing the accommodating groove;
the driving mechanism is used for driving the accommodating groove on the overturning platform to overturn.
Optionally, the handling mechanism includes:
the first carrying mechanism is used for carrying the accommodating groove on the transferring mechanism to the overturning mechanism and carrying the overturned accommodating groove to an unloading part of the polishing equipment;
and the second conveying mechanism is used for conveying the silicon wafers placed in the accommodating groove of the unloading part to the cleaning equipment.
Optionally, the polishing system further comprises:
and the cleaning equipment is used for cleaning the silicon wafers in the accommodating groove.
Optionally, the polishing device is provided with a first connecting part, the transferring mechanism is provided with a second connecting part, and the first connecting part is detachably connected with the second connecting part.
Optionally, the first connection part comprises a connection pipe, the second connection part comprises a connection shaft, and the connection shaft is detachably inserted into the connection pipe; or alternatively
The first connecting portion comprises a connecting shaft, the second connecting portion comprises a connecting pipe, and the connecting shaft is detachably inserted into the connecting pipe.
Optionally, the connecting pipe is provided with a plurality of positioning holes, the positioning holes are distributed at intervals along the length direction of the connecting pipe, the positioning holes are communicated with the lumen of the connecting pipe, movable positioning pins are arranged in the positioning holes, and the positioning pins can be stopped or kept away from the connecting shaft under the condition that the connecting shaft is inserted into the connecting pipe.
Optionally, the transfer mechanism is disposed adjacent to an unloading portion of the polishing apparatus.
Optionally, the transfer mechanism includes:
the vehicle body is provided with a bearing structure for placing the accommodating groove;
the travelling wheel is arranged at the bottom of the vehicle body.
In the polishing system of the embodiment of the invention, the polishing device comprises a polishing mechanism and a carrying mechanism, wherein the carrying mechanism is detachably arranged on the polishing device, the carrying mechanism is used for carrying the accommodating groove on the carrying mechanism to the unloading part of the polishing device, and the carrying mechanism is used for carrying the silicon wafer placed in the accommodating groove of the unloading part to the cleaning device. In the use process, when the cleaning machine corresponding to other polishing equipment is abnormal and cannot clean the polished silicon wafer, the transfer mechanism can transfer the silicon wafer polished by the abnormal polishing equipment of the cleaning machine to the polishing equipment of the invention, so that the transfer mechanism is connected with the polishing equipment of the invention, the containing groove on the transfer mechanism can be transferred to the unloading part of the polishing equipment through the transfer mechanism, the silicon wafer placed in the containing groove of the unloading part can be transferred to the cleaning equipment through the transfer mechanism, the silicon wafer polished by the abnormal polishing equipment of the cleaning machine can be transferred to the normal cleaning equipment for cleaning, the silicon wafer can be cleaned as soon as possible, the silicon wafer surface is prevented from generating particles due to the fact that the silicon wafer is placed for too long, the abnormal polishing equipment of the cleaning machine can be produced normally, the processing quality and efficiency of the silicon wafer are ensured, and the reduction of production capacity caused by the abnormality of the cleaning machine is avoided.
Drawings
FIG. 1 is a schematic diagram of a polishing system according to an embodiment of the present invention;
FIG. 2 is another schematic structural view of a polishing system according to an embodiment of the present invention;
FIG. 3 is a schematic view of a transfer mechanism;
FIG. 4 is a schematic view of the handling mechanism handling the receiving slot from the transfer mechanism;
FIG. 5 is a schematic view of the flipping mechanism flipping the receiving slot;
FIG. 6 is a schematic view of the handling mechanism handling the receiving slot from the flipping mechanism;
fig. 7 is a schematic view of the coupling tube mated with the coupling shaft.
Reference numerals
A polishing apparatus 10;
a carrying mechanism 20; a first carrying mechanism 201; a second carrying mechanism 202;
a first connection portion 21; a second connection portion 22;
a positioning hole 23; a positioning pin 24;
a vehicle body 25; a load bearing structure 26; and road wheels 27.
A transfer mechanism 30;
a receiving groove 40;
a turnover mechanism 50; a flipping table 51; a drive mechanism 52.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the invention may be practiced otherwise than as specifically illustrated or described herein. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
The polishing system provided by the embodiment of the invention is described in detail below by way of specific embodiments and application scenarios thereof with reference to fig. 1 to 7.
As shown in fig. 1 to 7, a polishing system according to an embodiment of the present invention includes: polishing equipment 10, transfer mechanism 30, polishing equipment 10 includes polishing mechanism and transport mechanism 20, and transfer mechanism 30 detachably sets up in polishing equipment 10, and transfer mechanism 30 is used for transporting holding tank 40, and transport mechanism 20 is used for carrying holding tank on the transfer mechanism 30 to the uninstallation portion of polishing equipment 10, and transport mechanism 20 is used for carrying the silicon chip that is placed in holding tank 40 of uninstallation portion to cleaning equipment.
The polishing apparatus 10 may include a polishing mechanism by which a silicon wafer may be polished, and a handling mechanism 20 which may handle the silicon wafer. The polishing apparatus 10 may be a dry-type final polishing machine, and the cleaning apparatus may be disposed adjacent to the polishing apparatus 10, and the silicon wafer polished by the dry-type final polishing machine may be cleaned by the cleaning apparatus. The transfer mechanism 30 is detachably arranged on the polishing equipment 10, the transfer mechanism 30 can be detached from the polishing equipment 10 when the silicon wafers on other polishing equipment are required to be transferred, the transfer mechanism 30 is separated from the polishing equipment 10, the transfer mechanism 30 is moved to the accommodating groove 40 for accommodating the silicon wafers in the transfer mode of the other polishing equipment, the transfer mechanism 30 can be connected to the polishing equipment 10 when the accommodating groove 40 for accommodating the silicon wafers is transferred to the polishing equipment 10, the transfer mechanism 30 is enabled to be stable, so that the transfer mechanism 30 can be convenient for the transfer mechanism 20 in the polishing equipment 10 to transfer the accommodating groove 40 on the transfer mechanism 30, the transfer mechanism 20 can be used for transferring the silicon wafers in the accommodating groove 40 placed in the unloading part to the cleaning equipment, the cleaning equipment is used for cleaning the silicon wafers in the accommodating groove 40, and after the cleaning is completed, the empty accommodating groove 40 can be removed from the unloading part through the transfer mechanism 20.
For example, the polishing apparatus 10 may be a dry finish polisher and the cleaning apparatus may be disposed adjacent to the polishing apparatus 10. When the cleaning machine corresponding to the wet final polishing machine is abnormal and can not clean the silicon wafer, the transfer mechanism 30 can be used for transferring the silicon wafer on the wet final polishing machine, the transfer mechanism 30 can be moved to the accommodating groove 40 for transferring the placed silicon wafer on the wet final polishing machine, the accommodating groove 40 for placing the silicon wafer is transferred to the polishing equipment 10, the carrying mechanism 20 can be used for carrying the accommodating groove 40 on the transfer mechanism 30 to the unloading part of the polishing equipment 10, the carrying mechanism 20 can be used for carrying the silicon wafer placed in the accommodating groove 40 of the unloading part to the cleaning equipment, and the silicon wafer in the accommodating groove 40 transferred from the wet final polishing machine is cleaned by the cleaning equipment, so that the polished silicon wafer of the wet final polishing machine can be cleaned in time, and the influence on the productivity of the wet final polishing machine is avoided.
In the polishing system of the embodiment of the invention, the polishing equipment comprises a polishing mechanism and a carrying mechanism, wherein the carrying mechanism is detachably arranged on the polishing equipment, the carrying mechanism is used for carrying the accommodating groove on the carrying mechanism to the unloading part of the polishing equipment, and the carrying mechanism is used for carrying the silicon wafer placed in the accommodating groove of the unloading part to the cleaning equipment. In the use process, when the cleaning machine corresponding to other polishing equipment is abnormal and cannot clean the polished silicon wafer, the silicon wafer polished by the abnormal polishing equipment of the cleaning machine can be transferred to the polishing equipment through the transfer mechanism, so that the transfer mechanism is connected with the polishing equipment, the containing groove on the transfer mechanism can be transferred to the unloading part of the polishing equipment through the transfer mechanism, the silicon wafer placed in the containing groove of the unloading part can be transferred to the cleaning equipment through the transfer mechanism, the silicon wafer polished by the abnormal polishing equipment of the cleaning machine can be transferred to the normal cleaning equipment for cleaning, the silicon wafer can be cleaned as soon as possible, the silicon wafer surface is prevented from generating particles due to the fact that the silicon wafer is placed too long, the abnormal polishing equipment of the cleaning machine can be produced normally, the processing quality and the processing efficiency of the silicon wafer are guaranteed, and the production capacity reduction caused by the abnormality of the cleaning machine is avoided.
In some embodiments, as shown in fig. 2 and fig. 4 to fig. 6, the polishing apparatus 10 further includes a turnover mechanism 50, the handling mechanism 20 is configured to handle the accommodating groove 40 on the transferring mechanism 30 to the turnover mechanism 50, the turnover mechanism 50 is configured to turn over the accommodating groove 40 placed on the turnover mechanism 50, so that the position or posture of the accommodating groove 40 is turned over to a proper position, so that the accommodating groove 40 is placed in the cleaning apparatus for cleaning, the handling mechanism 20 is configured to handle the turned accommodating groove 40 to the unloading portion of the polishing apparatus 10, the handling mechanism 20 is configured to handle the silicon wafer placed in the accommodating groove 40 of the unloading portion to the cleaning apparatus, and the silicon wafer in the accommodating groove 40 is cleaned by the cleaning apparatus, so that the silicon wafer can be cleaned as soon as possible, the abnormal polishing apparatus of the cleaning apparatus can be normally produced, and the reduction in productivity due to the abnormality of the cleaning apparatus is avoided.
In other embodiments, as shown in fig. 2, 4-6, the flipping mechanism 50 comprises: the overturning platform 51 and the driving mechanism 52, wherein the overturning platform 51 is used for placing the accommodating groove 40, and the driving mechanism 52 is used for driving the accommodating groove 40 on the overturning platform 51 to overturn. The overturning platform 51 may be a plate body, an opening may be formed in the plate body, the driving mechanism 52 may include a driving rod, the driving rod may penetrate through the opening to drive the accommodating groove 40 on the overturning platform 51 to overturn, for example, the opening direction of the accommodating groove 40 before overturning may be a horizontal direction, the opening direction of the accommodating groove 40 after overturning may be vertical upwards, and the specific overturning position and angle of the accommodating groove 40 may be reasonably selected according to actual needs. The driving mechanism 52 may include a driving motor, a hydraulic cylinder, a pneumatic cylinder, a telescopic rod, etc., and the specific structural form of the driving mechanism may be selected according to actual needs. The surface of the flipping table 51 may be provided with an elastic layer having a buffer function, and the elastic layer may have a buffer function when the accommodating groove 40 is placed and flipped, preventing damage to the silicon wafer in the accommodating groove 40.
In the embodiment of the present invention, as shown in fig. 1, 2, 4 and 6, the carrying mechanism 20 includes: the first handling mechanism 201 and the second handling mechanism 202, the first handling mechanism 201 is used for handling the accommodating groove 40 on the transferring mechanism 30 to the turnover mechanism 50 and for handling the turned accommodating groove 40 to the unloading part of the polishing apparatus 10, the first handling mechanism 201 may be disposed on a truss of the polishing apparatus 10, the first handling mechanism 201 may include a first mechanical arm and a first guide rail, the first mechanical arm is disposed on the first guide rail, the first mechanical arm may move in a vertical direction and a horizontal direction, and the accommodating groove 40 may be clamped and handled by the first mechanical arm. The second carrying mechanism 202 is for carrying the silicon wafer placed in the accommodating groove 40 of the unloading section to the cleaning apparatus. The first handling mechanism 201 and the second handling mechanism 202 may be disposed adjacently, the second handling mechanism 201 may be disposed on a truss of the polishing apparatus 10, the second handling mechanism 201 may include a second mechanical arm and a second guide rail, the second mechanical arm is disposed on the second guide rail, the second mechanical arm may move in a vertical direction and a horizontal direction, and the silicon wafer placed in the accommodating groove 40 of the unloading portion may be handled to a cleaning apparatus by the second mechanical arm, and the silicon wafer placed in the accommodating groove 40 transferred by the cleaning apparatus may be cleaned. The polishing system can further comprise: the position detector is used for detecting the position of the transferring mechanism 30, and when the position detector detects that the position of the transferring mechanism 30 is at a preset position, the control module can control the carrying mechanism 20 to carry the accommodating groove on the transferring mechanism 30 to the unloading part of the polishing device 10, or can control the carrying mechanism 20 to carry the accommodating groove on the transferring mechanism 30 to the overturning mechanism 50.
In an embodiment of the present invention, the polishing system further comprises: and a cleaning device for cleaning the silicon wafer in the accommodating groove 40. The polishing equipment 10 can be a dry type final polishing machine, the cleaning equipment can be arranged close to the polishing equipment 10, the cleaning equipment can be a single-chip cleaning machine, the silicon wafers polished by the polishing equipment 10 can be cleaned through the single-chip cleaning machine, the silicon wafers in the accommodating grooves 40 transferred from other polishing equipment by the transferring mechanism 30 can also be cleaned, and other polishing equipment can be a wet type final polishing machine, so that the polished silicon wafers of the wet type final polishing machine can be cleaned in time, and the influence on the productivity of the wet type final polishing machine is avoided.
In some embodiments, as shown in fig. 7, the polishing apparatus 10 has a first connection portion 21 thereon, the transfer mechanism 30 has a second connection portion 22 thereon, the first connection portion 21 may be disposed on an outer sidewall of the polishing apparatus 10, the second connection portion 22 may be disposed on an outer sidewall of the transfer mechanism 30, the second connection portion 22 may be disposed adjacent to an end of the transfer mechanism 30, and the first connection portion 21 may be detachably connected to the second connection portion 22. The transfer mechanism 30 can be connected with the polishing apparatus 10 by the first connecting portion 21 and the second connecting portion 22 so that the transfer mechanism 30 is stable, so that the carrying mechanism 20 in the polishing apparatus 10 can carry the accommodation groove 40 on the transfer mechanism 30, and the accommodation groove 40 on the transfer mechanism 30 can be carried to the unloading portion of the polishing apparatus 10 by the carrying mechanism 20. The transfer mechanism 30 can be separated from the polishing apparatus 10 by detaching the first connecting portion 21 from the second connecting portion 22 so that the transfer mechanism 30 can be moved to the accommodating groove 40 in which the silicon wafer is transferred by other polishing apparatus.
Alternatively, as shown in fig. 7, the first connection part 21 includes a connection pipe, and the second connection part 22 includes a connection shaft detachably inserted in the connection pipe. Alternatively, the first connection part 21 includes a connection shaft, and the second connection part 22 includes a connection pipe, to which the connection shaft is detachably inserted. The axis of the connecting shaft may be collinear with the axis of the connecting tube to facilitate accurate alignment so that the transfer mechanism 30 may remain in a consistent position when the connecting shaft is inserted into the connecting tube. The length scale mark can be arranged on the outer side wall of the connecting shaft, the length of the connecting shaft inserted in the connecting pipe can be observed through the length scale mark, and the connecting shaft can be inserted in the connecting pipe according to actual needs to be different in length, so that the position of the transferring mechanism 30 can be adjusted and recorded according to needs, and the carrying mechanism 20 in the polishing equipment 10 can carry the accommodating groove 40 on the transferring mechanism 30. The length of the connection pipe can be adjusted so that the projecting position and length of the connection shaft can be adjusted by adjusting the length of the connection pipe, and thus the position of the transfer mechanism 30 can be adjusted so that the carrying mechanism 20 in the polishing apparatus 10 can carry the accommodation groove 40 on the transfer mechanism 30. The length of the connecting shaft can be adjusted so that the length of the connecting shaft extending into the connecting pipe can be adjusted by adjusting the length of the connecting shaft, and thus the position of the transfer mechanism 30 can be adjusted so that the carrying mechanism 20 in the polishing apparatus 10 can carry the receiving groove 40 on the transfer mechanism 30. The inside wall of connecting pipe can be equipped with the guide slot, and the guide slot can extend along the length direction of connecting pipe, and the lateral wall of connecting axle can set up the protruding rail, and the protruding rail can extend along the length direction of connecting axle, and the protruding rail can set up in the guide slot, and the protruding rail can follow the length direction of guide slot and remove in the guide slot for the connecting axle can steadily remove.
In some embodiments, as shown in fig. 7, the connecting pipe is provided with a plurality of positioning holes 23, the plurality of positioning holes 23 are distributed at intervals along the length direction of the connecting pipe, the plurality of positioning holes 23 can be distributed at intervals uniformly along the length direction of the connecting pipe, the positioning holes 23 are communicated with the lumen of the connecting pipe, movable positioning pins 24 are arranged in the positioning holes 23, and the positioning pins 24 can be stopped or kept away from the connecting shaft under the condition that the connecting shaft is inserted into the connecting pipe. One end of the positioning pin 24 may extend into the lumen of the connection tube, and may be stopped or kept away from the connection shaft by one end of the positioning pin 24, and one end of the positioning pin 24 may be provided with an elastic layer, and may have a buffering effect by the elastic layer, so as to prevent damage to the connection shaft. The connection pipe may be a transparent material pipe, for example, the connection pipe may be a transparent plastic pipe, so that the condition in the connection pipe may be observed, and the condition in which the connection shaft is inserted in the connection pipe may be observed. The length scale mark can be arranged on the outer side wall of the connecting pipe, the length of the connecting shaft inserted in the connecting pipe can be observed through the length scale mark, and the connecting shaft can be inserted in the connecting pipe according to different lengths according to actual needs.
As shown in fig. 7, the positioning hole 23 may be a screw hole, the positioning pin 24 may be a bolt, and the bolt is inserted into the screw hole, and the bolt may be turned as required so that one end of the bolt may be stopped against or away from the connecting shaft. Under the condition that the connecting shaft is inserted into the connecting pipe, the bolt can be rotated to enable one end part of the bolt to be abutted against the connecting shaft, so that the connecting shaft is stable and firm; in the case where the connecting shaft is required to be separated from the connecting pipe, the bolt may be rotated so that one end portion of the bolt is away from the connecting shaft, so that the connecting shaft may be separated from the connecting pipe, so that the transfer mechanism 30 may be separated from the polishing apparatus 10, so that the transfer mechanism 30 may be moved to the receiving groove 40 where the other polishing apparatus transfers the silicon wafer.
In some embodiments, the transfer mechanism 30 is disposed adjacent to the unloading portion of the polishing apparatus 10 so that the receiving groove 40 on the transfer mechanism 30 can be carried to the unloading portion of the polishing apparatus 10 by the carrying mechanism 20.
In an embodiment of the present invention, as shown in fig. 1 to 4, 6 and 7, the transfer mechanism 30 includes: the vehicle body 25 and the travelling wheel 27, the vehicle body 25 is provided with a bearing mechanism 26 for placing the accommodating groove, the bearing mechanism 26 can be a chamber with an opening, and the accommodating groove can be placed in the chamber. The number of the travelling wheels 27 can be a plurality of, such as four, the travelling wheels 27 are arranged at the bottom of the vehicle body 25, and the transfer mechanism 30 can be conveniently moved to the accommodating groove 40 for transferring and placing silicon wafers by other polishing equipment through the travelling wheels 27. A handle may be provided on the vehicle body 25, by which the vehicle body 25 may be pushed to move.
The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present invention and the scope of the claims, which are to be protected by the present invention.

Claims (10)

1. A polishing system, comprising:
the polishing device comprises a polishing mechanism and a carrying mechanism;
the transfer mechanism is detachably arranged on the polishing equipment and used for transferring the accommodating groove, the carrying mechanism is used for carrying the accommodating groove on the transfer mechanism to the unloading part of the polishing equipment, and the carrying mechanism is used for carrying the silicon wafer placed in the accommodating groove of the unloading part to the cleaning equipment.
2. The polishing system of claim 1, wherein the polishing apparatus further comprises a turning mechanism for carrying the accommodation groove on the transfer mechanism to the turning mechanism, the turning mechanism for turning over the accommodation groove placed on the turning mechanism, and the carrying mechanism for carrying the accommodation groove after turning over to an unloading section of the polishing apparatus.
3. The polishing system of claim 2, wherein the turning mechanism comprises:
the overturning platform is used for placing the accommodating groove;
the driving mechanism is used for driving the accommodating groove on the overturning platform to overturn.
4. The polishing system of claim 2, wherein the handling mechanism comprises:
the first carrying mechanism is used for carrying the accommodating groove on the transferring mechanism to the overturning mechanism and carrying the overturned accommodating groove to an unloading part of the polishing equipment;
and the second conveying mechanism is used for conveying the silicon wafers placed in the accommodating groove of the unloading part to the cleaning equipment.
5. The polishing system as recited in claim 4, further comprising:
and the cleaning equipment is used for cleaning the silicon wafers in the accommodating groove.
6. The polishing system of claim 1, wherein the polishing apparatus has a first connection portion thereon and the transport mechanism has a second connection portion, the first connection portion being removably connected to the second connection portion.
7. The polishing system of claim 6, wherein the first connection portion comprises a connection tube and the second connection portion comprises a connection shaft removably inserted in the connection tube; or alternatively
The first connecting portion comprises a connecting shaft, the second connecting portion comprises a connecting pipe, and the connecting shaft is detachably inserted into the connecting pipe.
8. The polishing system of claim 7, wherein the connecting tube has a plurality of positioning holes therein, the plurality of positioning holes being spaced apart along a length of the connecting tube, the positioning holes being in communication with a lumen of the connecting tube, the positioning holes having a movable positioning pin disposed therein, the positioning pin being positionable against or away from the connecting shaft with the connecting shaft inserted therein.
9. The polishing system of claim 1, wherein the transfer mechanism is disposed adjacent to an unloading portion of the polishing apparatus.
10. The polishing system of claim 1, wherein the transport mechanism comprises:
the vehicle body is provided with a bearing structure for placing the accommodating groove;
the travelling wheel is arranged at the bottom of the vehicle body.
CN202211664528.XA 2022-12-23 2022-12-23 Polishing system Pending CN116175380A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202211664528.XA CN116175380A (en) 2022-12-23 2022-12-23 Polishing system
TW112104923A TWI844264B (en) 2022-12-23 2023-02-13 Polishing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211664528.XA CN116175380A (en) 2022-12-23 2022-12-23 Polishing system

Publications (1)

Publication Number Publication Date
CN116175380A true CN116175380A (en) 2023-05-30

Family

ID=86441323

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211664528.XA Pending CN116175380A (en) 2022-12-23 2022-12-23 Polishing system

Country Status (1)

Country Link
CN (1) CN116175380A (en)

Also Published As

Publication number Publication date
TW202330187A (en) 2023-08-01

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