TWI844264B - Polishing system - Google Patents

Abstract

This application discloses a polishing system, including: a polishing device, the polishing device includes a polishing mechanism and a transport mechanism; a transfer mechanism, the transfer mechanism is detachably arranged on the polishing device, the transfer mechanism is used to transfer the receiving tank, the transport mechanism is used to transport the receiving tank on the transfer mechanism to the unloading part of the polishing device, and the transport mechanism is used to transport the receiving tank placed in the unloading part to the cleaning device.

Description

Polishing system

This application claims priority to Chinese patent application No. 202211664528.X filed in China on December 23, 2022, the entire contents of which are incorporated herein by reference.

This application belongs to the field of silicon wafer technology and specifically relates to a polishing system.

At present, in the final polishing process, according to the different cleaning methods after final polishing, the final polishing machine can be divided into two categories. One is the dry final polishing machine, in which the silicon wafer after processing is placed by a robot in a single-wafer cleaning machine connected to it, and is cleaned and dried with chemicals in the single-wafer cleaning machine, and the finally cleaned silicon wafer is placed in a silicon wafer storage box; the other is the wet final polishing machine, in which the processed silicon wafer is placed in a water tank by a robot, and the water tank with the silicon wafer is transported to a tank cleaning machine for cleaning. Since there is abrasive liquid residue on the surface of the silicon wafer after grinding, and the silicon wafer is placed in the water tank for too long, particles will be generated on the surface of the silicon wafer, which needs to be cleaned as soon as possible. Abnormalities in the tank cleaning machine will cause the silicon wafer to not be cleaned in time, so that the wet final polishing machine cannot produce normally, affecting the processing quality and efficiency of the silicon wafer.

The purpose of the embodiment of the present application is to provide a polishing system to solve the problem that the silicon wafer polished by the polishing machine cannot be cleaned by the cleaning machine due to abnormalities.

The embodiment of the present application provides a polishing system, which includes: a polishing device, the polishing device includes a polishing mechanism and a transport mechanism; and a transfer mechanism, the transfer mechanism is detachably arranged on the polishing device, the transfer mechanism is used to transfer a receiving tank, the transport mechanism is used to transport the receiving tank on the transfer mechanism to an unloading part of the polishing device, and the transport mechanism is used to transport a silicon wafer placed in the receiving tank of the unloading part to a cleaning device.

Optionally, the polishing equipment further includes a flipping mechanism, the transporting mechanism is used to transport the receiving tank on the transfer mechanism to the flipping mechanism, the flipping mechanism is used to flip the receiving tank placed on the flipping mechanism, and the transporting mechanism is used to transport the flipped receiving tank to the unloading part of the polishing equipment.

Optionally, the turning mechanism includes: a turning table, the turning table is used to place the containing tank; and a driving mechanism, the driving mechanism is used to drive the containing tank on the turning table to turn over.

Optionally, the transporting mechanism includes: a first transporting mechanism, which is used to transport the receiving tank on the transfer mechanism to the flipping mechanism, and to transport the flipped receiving tank to the unloading part of the polishing equipment; and a second transporting mechanism, which is used to transport the silicon wafer placed in the receiving tank of the unloading part to the cleaning equipment.

Optionally, the polishing system further includes: the cleaning device, which is used to clean the silicon wafer in the receiving tank.

Optionally, the polishing device has a first connecting portion, the transfer mechanism has a second connecting portion, and the first connecting portion and the second connecting portion are detachably connected.

Optionally, the first connecting part includes a connecting tube, the second connecting part includes a connecting shaft, and the connecting shaft is detachably inserted in the connecting tube; or the first connecting part includes a connecting shaft, the second connecting part includes a connecting tube, and the connecting shaft is detachably inserted in the connecting tube.

Optionally, the connecting tube has a plurality of positioning holes, which are spaced apart along the length direction of the connecting tube, the positioning holes are connected to the lumen of the connecting tube, and a movable positioning pin is provided in the positioning hole. When the connecting shaft is inserted in the connecting tube, the positioning pin can stop against or stay away from the connecting shaft.

Optionally, the transfer mechanism is arranged adjacent to the unloading portion of the polishing equipment.

Optionally, the transfer mechanism includes: a vehicle body, the vehicle body is provided with a bearing structure for placing the containing tank; and a running wheel, the running wheel is arranged at the bottom of the vehicle body.

In the polishing system of the embodiment of the present application, the polishing equipment includes a polishing mechanism and a transporting mechanism, the transporting mechanism is detachably arranged on the polishing equipment, the transporting mechanism is used to transport the receiving tank, the transporting mechanism is used to transport the receiving tank on the transporting mechanism to the unloading part of the polishing equipment, and the transporting mechanism is used to transport the silicon wafer placed in the receiving tank of the unloading part to the cleaning equipment. During use, when the cleaning machine corresponding to the other polishing equipment fails to clean the polished silicon wafer due to an abnormality, the silicon wafer polished by the polishing equipment with the abnormal cleaning machine can be transferred to the position of the polishing equipment in the present application through the transfer mechanism, so that the transfer mechanism is connected to the polishing equipment in the present application, and the receiving tank on the transfer mechanism can be transferred to the unloading part of the polishing equipment through the transfer mechanism. The silicon wafers placed in the receiving tank of the unloading part are transported to the cleaning equipment, so that the silicon wafers polished by the abnormal polishing equipment of the cleaning machine can be transferred to the normal cleaning equipment for cleaning, so that the silicon wafers can be cleaned as soon as possible, and the silicon wafers are prevented from being placed for too long to cause particles to be generated on the surface of the silicon wafers, so that the polishing equipment of the abnormal cleaning machine can produce normally, thereby ensuring the processing quality and efficiency of the silicon wafers and avoiding the reduction of production capacity due to the abnormality of the cleaning machine.

To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only used for reference and description and are not used to limit the present invention.

The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, but not all of them. Based on the embodiments in this application, all other embodiments obtained by those with ordinary knowledge in the technical field to which the invention belongs are within the scope of protection of this application.

The terms "first", "second", etc. in the specification and patent scope of this application are used to distinguish similar objects, rather than to describe a specific order or precedence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of this application can be implemented in an order other than those illustrated or described herein. In addition, "and/or" in the specification and claims indicates at least one of the connected objects, and the character "/" generally indicates that the objects connected before and after are in an "or" relationship.

The polishing system provided in the embodiment of the present application is described in detail below through specific embodiments and their application scenarios with reference to FIGS. 1 to 7 .

As shown in Figures 1 to 7, the polishing system of the embodiment of the present application includes: a polishing device 10 and a transfer mechanism 30. The polishing device 10 includes a polishing mechanism and a transport mechanism 20. The transfer mechanism 30 is detachably arranged on the polishing device 10. The transfer mechanism 30 is used to transfer the receiving tank 40. The transport mechanism 20 is used to transport the receiving tank on the transfer mechanism 30 to the unloading part of the polishing device 10, and the transport mechanism 20 is used to transport the silicon wafer placed in the receiving tank 40 of the unloading part to the cleaning device.

The polishing device 10 may include a polishing mechanism, through which the silicon wafer can be polished, and the transport mechanism 20 can transport the silicon wafer. The polishing device 10 may be a dry final polisher, and the cleaning device may be arranged adjacent to the polishing device 10, and the silicon wafer polished by the dry final polisher may be cleaned by the cleaning device. The transfer mechanism 30 is detachably mounted on the polishing device 10. When it is necessary to transfer a silicon wafer on another polishing device, the transfer mechanism 30 can be removed from the polishing device 10 to separate the transfer mechanism 30 from the polishing device 10. The transfer mechanism 30 can be moved to another polishing device to transfer the receiving tank 40 for placing the silicon wafer. When the receiving tank 40 for placing the silicon wafer is transferred to the polishing device 10, the transfer mechanism 30 can be connected to the polishing device 10 to stabilize the transfer mechanism 30. So that the transport mechanism 20 in the polishing equipment 10 can transport the storage tank 40 on the transfer mechanism 30, and the storage tank 40 on the transfer mechanism 30 can be transported to the unloading part of the polishing equipment 10 through the transport mechanism 20. The transport mechanism 20 can transport the silicon wafer placed in the storage tank 40 of the unloading part to the cleaning equipment, and the silicon wafer in the transferred storage tank 40 is cleaned by the cleaning equipment. After the cleaning is completed, the empty storage tank 40 can be moved away from the unloading part through the transport mechanism 20.

For example, the polishing device 10 can be a dry final polisher, and the cleaning device can be installed adjacent to the polishing device 10. When the cleaning machine corresponding to the wet final polisher fails to clean the silicon wafer due to an abnormality, the silicon wafer on the wet final polisher can be transferred by the transfer mechanism 30, and the transfer mechanism 30 can be moved to the wet final polisher to transfer the receiving tank 40 for placing the silicon wafer, and the receiving tank 40 for placing the silicon wafer can be transferred to the polishing device 10, and the transfer mechanism 30 can be transferred by the transfer mechanism 20. The receiving tank 40 on the polishing device 10 is transferred to the unloading portion of the polishing device 10. The transport mechanism 20 can transport the silicon wafer placed in the receiving tank 40 in the unloading portion to the cleaning device. The cleaning device cleans the silicon wafer in the receiving tank 40 transferred from the wet final polisher, so that the silicon wafer polished by the wet final polisher can be cleaned in time to avoid affecting the production capacity of the wet final polisher.

In the polishing system of the embodiment of the present application, the polishing equipment includes a polishing mechanism and a transporting mechanism. The transporting mechanism is detachably arranged on the polishing equipment. The transporting mechanism is used to transport the receiving tank. The transporting mechanism is used to transport the receiving tank on the transporting mechanism to the unloading part of the polishing equipment. The transporting mechanism is used to transport the silicon wafer placed in the receiving tank of the unloading part to the cleaning equipment. During use, when the cleaning machine corresponding to the other polishing equipment fails to clean the polished silicon wafer due to an abnormality, the silicon wafer polished by the polishing equipment with the abnormal cleaning machine can be transferred to the position of the polishing equipment in this application through the transfer mechanism, so that the transfer mechanism is connected to the polishing equipment in this application, and the storage tank on the transfer mechanism can be transferred to the unloading part of the polishing equipment through the transfer mechanism, and the unloading part can be transferred through the transfer mechanism. The silicon wafers placed in the storage tank of the unloading part are transferred to the cleaning equipment, so that the silicon wafers polished by the abnormal polishing equipment of the cleaning machine can be transferred to the normal cleaning equipment for cleaning, so that the silicon wafers can be cleaned as soon as possible, preventing the silicon wafers from being placed for too long to cause particles to form on the surface of the silicon wafers, so that the polishing equipment of the abnormal cleaning machine can produce normally, ensuring the processing quality and efficiency of the silicon wafers, and avoiding the reduction of production capacity due to the abnormality of the cleaning machine.

In some embodiments, as shown in FIGS. 2 and 4 to 6, the polishing device 10 further includes a flipping mechanism 50. The transporting mechanism 20 is used to transport the receiving tank 40 on the transporting mechanism 30 to the flipping mechanism 50. The flipping mechanism 50 is used to flip the receiving tank 40 placed on the flipping mechanism 50 so that the position or posture of the receiving tank 40 is flipped to a suitable position so that the receiving tank 40 can be placed in the cleaning device for cleaning. The transport mechanism 20 is used to transport the flipped receiving tank 40 to the unloading part of the polishing equipment 10. The transport mechanism 20 can transport the silicon wafer placed in the receiving tank 40 in the unloading part to the cleaning equipment. The cleaning equipment cleans the silicon wafer in the transferred receiving tank 40, so that the silicon wafer can be cleaned as soon as possible, so that the polishing equipment with an abnormal cleaning machine can produce normally, avoiding the reduction of production capacity due to the abnormal cleaning machine.

In other embodiments, as shown in FIG. 2 and FIG. 4 to FIG. 6 , the turning mechanism 50 includes: a turning table 51 and a driving mechanism 52, the turning table 51 is used to place the receiving tank 40, and the driving mechanism 52 is used to drive the receiving tank 40 on the turning table 51 to turn over. The turning table 51 can be a plate body, and the plate body can be provided with an opening. The driving mechanism 52 can include a driving rod, and the driving rod can pass through the opening to drive the receiving tank 40 on the turning table 51 to turn over. For example, the opening direction of the receiving tank 40 before turning over can be a horizontal direction, and the opening direction of the receiving tank 40 after turning over can be vertically upward. The specific turning position and angle of the receiving tank 40 can be reasonably selected according to actual needs. The driving mechanism 52 may include a driving motor, a hydraulic cylinder, a pneumatic cylinder, a telescopic rod, etc. The specific structural form of the driving mechanism may be selected according to actual needs. The surface of the turning table 51 may be provided with an elastic layer, which has a buffering effect. When placing and turning the receiving tank 40, it can have a buffering effect to prevent damage to the silicon wafer in the receiving tank 40.

In the embodiment of the present application, as shown in Figures 1, 2, 4 and 6, the transport mechanism 20 includes: a first transport mechanism 201 and a second transport mechanism 202. The first transport mechanism 201 is used to transport the receiving tank 40 on the transport mechanism 30 to the flipping mechanism 50, and is used to transport the flipped receiving tank 40 to the unloading part of the polishing equipment 10. The first transport mechanism 201 can be arranged on the truss of the polishing equipment 10. The first transport mechanism 201 can include a first robot arm and a first guide rail. The first robot arm is arranged on the first guide rail. The first robot arm can move on the first guide rail. The first robot arm can move in the vertical direction and the horizontal direction. The receiving tank 40 can be clamped and transported by the first robot arm. The second transport mechanism 202 is used to transport the silicon wafer placed in the receiving tank 40 of the unloading part to the cleaning equipment. The first transport mechanism 201 and the second transport mechanism 202 can be arranged adjacent to each other, and the second transport mechanism 202 can be arranged on the truss of the polishing equipment 10. The second transport mechanism 202 can include a second robot arm and a second guide rail. The second robot arm is arranged on the second guide rail. The second robot arm can move on the second guide rail. The second robot arm can move in the vertical direction and the horizontal direction. The silicon wafer placed in the receiving tank 40 of the unloading part can be transported to the cleaning equipment through the second robot arm, and the silicon wafer in the transferred receiving tank 40 is cleaned by the cleaning equipment. The polishing system may further include: a position detector, which is used to detect the position of the transfer mechanism 30. When the position detector detects that the position of the transfer mechanism 30 is at a preset position, the control module can control the transport mechanism 20 to transport the receiving groove on the transfer mechanism 30 to the unloading part of the polishing equipment 10, or the control module can control the transport mechanism 20 to transport the receiving groove on the transfer mechanism 30 to the flipping mechanism 50.

In the embodiment of the present application, the polishing system further includes: a cleaning device, which is used to clean the silicon wafers in the receiving tank 40. The polishing device 10 can be a dry final polisher, and the cleaning device can be arranged adjacent to the polishing device 10. The cleaning device can be a single-wafer cleaning machine, which can clean the silicon wafers polished by the polishing device 10, and can also clean the silicon wafers in the receiving tank 40 transferred from other polishing devices by the transfer mechanism 30. Other polishing devices can be wet final polishers, so that the silicon wafers polished by the wet final polisher can be cleaned in time to avoid affecting the production capacity of the wet final polisher.

In some embodiments, as shown in FIG7 , the polishing device 10 has a first connection portion 21, and the transfer mechanism 30 has a second connection portion 22. The first connection portion 21 can be disposed on the outer wall of the polishing device 10, the second connection portion 22 can be disposed on the outer wall of the transfer mechanism 30, the second connection portion 22 can be disposed adjacent to the end of the transfer mechanism 30, and the first connection portion 21 and the second connection portion 22 can be detachably connected. The transfer mechanism 30 can be connected to the polishing device 10 through the first connection portion 21 and the second connection portion 22 to stabilize the transfer mechanism 30, so that the transfer mechanism 20 in the polishing device 10 can transfer the receiving tank 40 on the transfer mechanism 30, and the receiving tank 40 on the transfer mechanism 30 can be transferred to the unloading portion of the polishing device 10 through the transfer mechanism 20. The transfer mechanism 30 can be separated from the polishing device 10 by disassembling the first connection portion 21 and the second connection portion 22, so that the transfer mechanism 30 can be moved to other polishing devices to transfer the receiving tank 40 for placing the silicon wafer.

Optionally, as shown in FIG7 , the first connecting portion 21 includes a connecting tube, the second connecting portion 22 includes a connecting shaft, and the connecting shaft is detachably inserted in the connecting tube. Alternatively, the first connecting portion 21 includes a connecting shaft, the second connecting portion 22 includes a connecting tube, and the connecting shaft is detachably inserted in the connecting tube. The axis of the connecting shaft and the axis of the connecting tube can be collinear to facilitate accurate alignment, so that the transfer mechanism 30 can maintain a consistent position when the connecting shaft is inserted in the connecting tube. The outer wall of the connecting shaft may be provided with length scale lines, through which the length of the connecting shaft inserted in the connecting tube can be observed, and the length of the connecting shaft inserted in the connecting tube can be made different according to actual needs, so that the position of the transfer mechanism 30 can be adjusted and recorded according to needs, so that the transport mechanism 20 in the polishing device 10 can transport the receiving groove 40 on the transport mechanism 30. The length of the connecting tube can be adjusted, so that by adjusting the length of the connecting tube, the insertion position and length of the connecting shaft can be adjusted, and then the position of the transport mechanism 30 can be adjusted, so that the transport mechanism 20 in the polishing device 10 can transport the receiving groove 40 on the transport mechanism 30. The length of the connecting shaft can be adjusted, so that the length of the connecting shaft extending into the connecting tube can be adjusted by adjusting the length of the connecting shaft, and then the position of the transfer mechanism 30 can be adjusted, so that the transport mechanism 20 in the polishing device 10 can transport the receiving groove 40 on the transfer mechanism 30. The inner wall of the connecting tube can be provided with a guide groove, which can extend along the length direction of the connecting tube, and the outer wall of the connecting shaft can be provided with a convex rail, which can extend along the length direction of the connecting shaft, and the convex rail can be provided in the guide groove, and the convex rail can move in the guide groove along the length direction of the guide groove, so that the connecting shaft can move stably.

In some embodiments, as shown in FIG. 7 , the connecting tube has a plurality of positioning holes 23, and the plurality of positioning holes 23 are spaced apart along the length direction of the connecting tube. The plurality of positioning holes 23 can be evenly spaced apart along the length direction of the connecting tube. The positioning holes 23 are connected to the lumen of the connecting tube. A movable positioning pin 24 is provided in the positioning hole 23. When the connecting shaft is inserted in the connecting tube, the positioning pin 24 can stop against or stay away from the connecting shaft. One end of the positioning pin 24 can extend into the lumen of the connecting tube, and can stop against or stay away from the connecting shaft through one end of the positioning pin 24. One end of the positioning pin 24 can be provided with an elastic layer, and the elastic layer can have a buffering effect to prevent damage to the connecting shaft. The connecting tube can be a transparent material tube, for example, a transparent plastic tube, so that the situation in the connecting tube can be observed, and the situation of the connecting shaft inserted in the connecting tube can be observed. Length scale lines can be set on the outer wall of the connecting tube, and the length of the connecting shaft inserted in the connecting tube can be observed through the length scale lines. The length of the connecting shaft inserted in the connecting tube can be different according to actual needs.

As shown in FIG7 , the positioning hole 23 can be a screw hole, and the positioning pin 24 can be a bolt. The bolt is inserted into the screw hole, and the bolt can be rotated as needed so that one end of the bolt can stop or move away from the connecting shaft. When the connecting shaft is inserted into the connecting tube, the bolt can be rotated so that one end of the bolt stops against the connecting shaft, so that the connecting shaft is stable and firm; when the connecting shaft needs to be separated from the connecting tube, the bolt can be rotated so that one end of the bolt moves away from the connecting shaft, so that the connecting shaft can be separated from the connecting tube, so that the transfer mechanism 30 can be separated from the polishing device 10, so that the transfer mechanism 30 can be moved to other polishing devices to transfer the receiving groove 40 for placing silicon wafers.

In some embodiments, the transfer mechanism 30 is disposed adjacent to the unloading portion of the polishing apparatus 10 , so that the receiving tank 40 on the transfer mechanism 30 can be transferred to the unloading portion of the polishing apparatus 10 by the transport mechanism 20 .

In the embodiment of the present application, as shown in Figs. 1 to 4, 6 and 7, the transfer mechanism 30 includes: a vehicle body 25 and running wheels 27. The vehicle body 25 is provided with a supporting structure 26 for placing a receiving tank. The supporting structure 26 can be a chamber with an opening, and the receiving tank can be placed in the chamber. The running wheels 27 are arranged at the bottom of the vehicle body 25. The number of the running wheels 27 can be multiple, for example, four. The running wheels 27 can facilitate the transfer mechanism 30 to move to other polishing equipment to transfer the receiving tank 40 for placing the silicon wafer. A handle can be provided on the vehicle body 25, and the vehicle body 25 can be pushed to move by the handle.

The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are only illustrative and not restrictive. Under the inspiration of the present application, ordinary technical personnel in this field can make many forms without departing from the scope of protection of the purpose and claims of the present application, all of which are within the protection of the present application.

10: Polishing equipment 21: First connection part 23: Positioning hole 24: Positioning pin 20: Transport mechanism 201: First transport mechanism 202: Second transport mechanism 30: Transfer mechanism 22: Second connection part 25: Vehicle body 26: Carrying structure 27: Traveling wheel 40: Storage tank 50: Turning mechanism 51: Turning table 52: Driving mechanism

FIG1 is a schematic structural diagram of a polishing system according to an embodiment of the present application;

FIG2 is another schematic diagram of the structure of the polishing system of the embodiment of the present application;

FIG3 is a schematic structural diagram of a transfer mechanism;

FIG4 is a schematic diagram of the transport mechanism transporting the containing tank from the transfer mechanism;

FIG5 is a schematic diagram of the flipping mechanism flipping the containing tank;

FIG6 is a schematic diagram of the transport mechanism transporting the containing tank from the turning mechanism;

FIG. 7 is a schematic diagram showing the cooperation between the connecting pipe and the connecting shaft.

10: Polishing equipment

20: Transportation mechanism

201: First Transportation Agency

202: Second transport mechanism

30:Transshipment agency

25: Car body

26: Load-bearing structure

27: Travel wheel

40: Storage tank

Claims (7)

A polishing system includes: a polishing device, the polishing device includes a polishing mechanism and a transport mechanism; and a transport mechanism, the transport mechanism is detachably arranged on the polishing device, the transport mechanism is used to transport a receiving tank, the transport mechanism is used to transport the receiving tank on the transport mechanism to a loading portion of the polishing device, and the transport mechanism is used to transport a silicon wafer placed in the receiving tank of the loading portion to a cleaning device; wherein the polishing device has a first connecting portion, the transport mechanism has a second connecting portion, and the first connecting portion and the second connecting portion are detachably connected; Wherein, the first connecting part includes a connecting tube, the second connecting part includes a connecting shaft, and the connecting shaft is detachably inserted in the connecting tube; or the first connecting part includes a connecting shaft, the second connecting part includes a connecting tube, and the connecting shaft is detachably inserted in the connecting tube; wherein, the connecting tube has a plurality of positioning holes, the plurality of positioning holes are spaced along the length direction of the connecting tube, the positioning holes are connected to the lumen of the connecting tube, and a movable positioning pin is provided in the positioning hole, and when the connecting shaft is inserted in the connecting tube, the positioning pin can stop against or stay away from the connecting shaft. The polishing system as described in claim 1, wherein the polishing equipment further comprises a flipping mechanism, the transporting mechanism is used to transport the receiving tank on the transporting mechanism to the flipping mechanism, the flipping mechanism is used to flip the receiving tank placed on the flipping mechanism, and the transporting mechanism is used to transport the flipped receiving tank to the unloading part of the polishing equipment. The polishing system as described in claim 2, wherein the flipping mechanism comprises: a flipping table, the flipping table is used to place the receiving tank; and a driving mechanism, the driving mechanism is used to drive the receiving tank on the flipping table to flip. The polishing system as described in claim 2, wherein the transport mechanism comprises: a first transport mechanism, the first transport mechanism is used to transport the receiving tank on the transport mechanism to the flip mechanism, and to transport the flipped receiving tank to the unloading part of the polishing equipment; and a second transport mechanism, the second transport mechanism is used to transport the silicon wafer placed in the receiving tank of the unloading part to the cleaning equipment. The polishing system as described in claim 4 further comprises: the cleaning device, which is used to clean the silicon wafer in the receiving tank. A polishing system as described in claim 1, wherein the transfer mechanism is arranged adjacent to the unloading portion of the polishing equipment. The polishing system as described in claim 1, wherein the transfer mechanism comprises: a vehicle body, the vehicle body having a bearing structure for placing the containing tank; and a running wheel, the running wheel being arranged at the bottom of the vehicle body.