CN116148640A - Integrated circuit test equipment - Google Patents
Integrated circuit test equipment Download PDFInfo
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- CN116148640A CN116148640A CN202310421073.7A CN202310421073A CN116148640A CN 116148640 A CN116148640 A CN 116148640A CN 202310421073 A CN202310421073 A CN 202310421073A CN 116148640 A CN116148640 A CN 116148640A
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- 238000012360 testing method Methods 0.000 title claims abstract description 58
- 230000007246 mechanism Effects 0.000 claims abstract description 31
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract description 52
- 239000004065 semiconductor Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 241000252254 Catostomidae Species 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses integrated circuit testing equipment, which relates to the technical field of integrated circuit testing and comprises a main body, wherein two groups of moving frames are arranged at the top of the main body, and moving mechanisms matched with corresponding vacuum suction cups are arranged in the two groups of moving frames. According to the invention, when one group of vacuum chucks drives the wafer to test, the other group of vacuum chucks can feed or discharge the rest group of wafers, the vacuum chucks drive the wafer to do annular motion and simultaneously conduct certain degree of autorotation, so that no matter the movable frame is arranged at any position, the interfaces of the vacuum chucks face to the outside, and further the air circulation mechanism is used for conveniently and rapidly supplying air to the vacuum chucks, the vacuum chucks can move relative to the movable frame, so that the external test equipment can conveniently test any position of the wafer, the overall wafer test efficiency is higher, the overall work efficiency is effectively improved, and the test efficiency is improved.
Description
Technical Field
The invention relates to the technical field of integrated circuit testing, in particular to integrated circuit testing equipment.
Background
An integrated circuit is a miniature electronic device or component, which adopts a certain technology to interconnect the elements such as transistors, resistors, capacitors, inductors and the like required in a circuit together, and is manufactured on a small or several small semiconductor wafers or dielectric substrates, and then the semiconductor wafers or dielectric substrates are packaged in a tube shell to form a miniature structure with the required circuit function, wherein all the elements are structurally integrated, so that the electronic element is greatly advanced towards microminiaturization, low power consumption, intellectualization and high reliability, and the integrated circuit is the core of the semiconductor industry and mainly comprises two major types of integrated circuits and discrete devices.
Integrated circuits or microcircuits, microchips, chips are a way of miniaturizing circuits in electronics and are usually manufactured on the surface of a semiconductor wafer, wherein a tester is used for detecting the functions and performances of the chips, a probe station is connected with a sorter to realize the connection of the chips to be tested and the functional modules of the tester, the sorter automatically transfers the chips to be tested to a test station one by one, pins of the chips to be tested are connected with the functional modules of the tester through bases and special connecting wires on the test station, and the tester applies input signals to the chips and collects output signals to judge whether the functions and performances of the chips meet the design specification requirements.
In the prior art, wafers are fed onto a sorting machine through an external mechanical arm, the sorting machine automatically conveys the detected integrated circuits to a testing station one by one, the existing sorting machine is only provided with one wafer testing station, a group of wafers are required to be fed, tested and fed, the overall testing efficiency is low, and the testing efficiency of the wafers is affected.
Disclosure of Invention
Based on the above, the invention aims to provide integrated circuit testing equipment, so as to solve the technical problems that in the prior art, a sorting machine is only provided with one wafer testing station, a group of wafers need to be subjected to feeding, testing and blanking processes, the overall testing efficiency is low, and the testing efficiency of the wafers is affected.
In order to achieve the above purpose, the present invention provides the following technical solutions: the integrated circuit testing equipment comprises a main body, wherein two groups of moving frames are arranged at the top of the main body, vacuum suckers are movably arranged at the tops of the two groups of moving frames, and moving mechanisms matched with the corresponding vacuum suckers are arranged in the two groups of moving frames;
the moving mechanism comprises a first rodless cylinder, a first sliding block, a second rodless cylinder, a second sliding block and a shunt pipe, wherein the first rodless cylinder, the first sliding block, the second rodless cylinder and the second sliding block are sequentially arranged in the moving frame from bottom to top;
the two groups of vacuum chucks, the two groups of moving mechanisms and external gas generating equipment are all communicated through a gas circulation mechanism, the gas circulation mechanism comprises a first electromagnetic valve, a first connecting pipe, a second electromagnetic valve and a communicating pipe, the first electromagnetic valve and the second electromagnetic valve are connected through the first connecting pipe, the first electromagnetic valve and the vacuum chucks are connected through the second connecting pipe, an interface matched with the second connecting pipe is arranged on the outer side of each vacuum chuck, a first gas storage cavity is fixedly arranged in the main body, a second gas storage cavity is fixedly arranged at the top of each first gas storage cavity, the inner sides of the two groups of the first electromagnetic valves are respectively connected with the first gas storage cavity and the second gas storage cavity in a sliding sealing manner, a communicating pipe penetrating through the main body is arranged on one side of the bottom of each first gas storage cavity, and a vent hole is formed in the surface of the top of each communicating pipe;
the outer sides of the two groups of the first electromagnetic valves are fixedly provided with a first annular slide plate and a second annular slide plate which are matched with the first air storage cavity and the second air storage cavity respectively, the bottom of the movable frame is movably connected with the movable frame, and the bottom of the movable frame is provided with a travelling mechanism;
the running mechanism comprises a movable frame, a motor, gears and an annular gear, wherein the movable frame is positioned at the bottom of the movable frame and is in rotary connection with the movable frame, the annular gear is fixedly arranged inside the main body, and the gears fixedly connected with the output shafts of the motors are meshed with the annular gear.
Through adopting above-mentioned technical scheme, through being provided with two sets of movable frames at the main part top, and every movable frame top all is provided with vacuum chuck, and then when one of them vacuum chuck drives the wafer and tests, another set of vacuum chuck can carry out material loading or unloading to other a set of wafers, and every movable frame is under the cooperation of gear and ring gear, and under the effect of gag lever post and spacing collar, can make vacuum chuck drive the wafer and carry out the rotation of certain degree when annular motion, and then no matter the movable frame is in any position, vacuum chuck's interface all is towards the outside, and then through the more convenient air feed to vacuum chuck of gas circulation mechanism, and gas circulation mechanism can also carry out the air supply to first rodless cylinder and second rodless cylinder simultaneously, and then can make vacuum chuck remove for movable frame, and then be convenient for external test equipment to test the optional position of wafer, whole wafer test efficiency is higher, whole work efficiency has been effectively promoted, test efficiency has been improved.
The invention is further characterized in that a limit ring is fixedly arranged in the main body, and limit rods extending to the inside of the limit ring are fixedly arranged on the inner sides of the bottoms of the two groups of movable frames.
Through adopting above-mentioned technical scheme, along with the revolution that moving mechanism drove vacuum chuck, under the combined action of gag lever post and spacing collar, make vacuum chuck and movable frame carry out the rotation of certain degree, and then can not the gas circulation mechanism take place to interfere.
The invention is further characterized in that a baffle plate positioned outside the first air storage cavity and the second air storage cavity is fixedly arranged outside the first electromagnetic valve, and the baffle plate is in sliding connection with the outer walls of the first air storage cavity and the second air storage cavity.
Through adopting above-mentioned technical scheme, the baffle plays first solenoid valve and still limit the direction for first gas storage chamber, the gliding further of second gas storage chamber, and whole slip process is more stable.
In summary, the invention has the following advantages: according to the invention, the two groups of moving frames are arranged at the top of the main body, the vacuum chucks are arranged at the top of each group of moving frames, when one group of vacuum chucks drive a wafer to perform testing, the other group of vacuum chucks can perform feeding or discharging on the other group of wafers, each group of moving frames can drive the wafer to perform annular movement and perform autorotation to a certain extent under the cooperation of the gears and the annular gears and the action of the limiting rods and the limiting rings, the interfaces of the vacuum chucks face to the outer side no matter the moving frames are positioned at any position, and then the air supply is performed on the vacuum chucks more conveniently through the air circulation mechanism, and the air circulation mechanism can also perform air supply on the first rodless cylinder and the second rodless cylinder at the same time, so that the vacuum chucks can move relative to the moving frames, and then the external testing equipment can perform testing on any position of the wafer conveniently, the whole wafer testing efficiency is higher, and the whole working efficiency is effectively improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a cross-sectional view of the present invention;
FIG. 3 is an enlarged view of the invention at A of FIG. 2;
FIG. 4 is a schematic view of the internal structure of the present invention;
FIG. 5 is a schematic view of a partial structure of the present invention;
FIG. 6 is a schematic view of the bottom view of the present invention;
fig. 7 is an enlarged view of fig. 6B in accordance with the present invention.
In the figure: 1. a main body; 2. a moving rack; 3. a vacuum chuck; 4. an interface; 5. a first air storage chamber; 6. a second air storage chamber; 7. a first annular slide plate; 8. a second annular slide plate; 9. a first electromagnetic valve; 10. a first connection pipe; 11. a second connection pipe; 12. a second electromagnetic valve; 13. a shunt; 14. a first rodless cylinder; 15. a first slider; 16. a second rodless cylinder; 17. a second slider; 18. a guide rod; 19. ventilation holes; 20. a communicating pipe; 21. a baffle; 22. a movable frame; 23. a motor; 24. a gear; 25. an inner gear ring; 26. a limit rod; 27. and a limit ring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
Hereinafter, an embodiment of the present invention will be described in accordance with its entire structure.
The integrated circuit testing equipment comprises a main body 1, wherein two groups of moving frames 2 are arranged at the top of the main body 1, vacuum chucks 3 are movably arranged at the tops of the two groups of moving frames 2, moving mechanisms matched with the corresponding vacuum chucks 3 are arranged in the two groups of moving frames 2, and the two groups of moving frames 2 are arranged at the top of the main body 1, and the vacuum chucks 3 are arranged at the top of each group of moving frames 2, so that when one group of vacuum chucks 3 drive a wafer to be tested, the other group of vacuum chucks 3 can feed or discharge the rest group of wafers;
the moving mechanism comprises a first rodless cylinder 14, a first sliding block 15, a second rodless cylinder 16, a second sliding block 17 and a shunt pipe 13, wherein the first rodless cylinder 14, the first sliding block 15, the second rodless cylinder 16 and the second sliding block 17 are sequentially arranged in the moving frame 2 from bottom to top, specifically, the second electromagnetic valve 12 is connected with the first rodless cylinder 14 and the second rodless cylinder 16 through the shunt pipe 13, and the shunt pipe 13 is positioned at the outer side of the moving frame 2, a guide rod 18 penetrating through the first sliding block 15 and the second sliding block 17 is fixedly arranged in the moving frame 2, the first sliding block 15 slides relative to the first rodless cylinder 14, the second sliding block 17 slides relative to the second rodless cylinder 16, and the second sliding block 17 is fixedly connected with the vacuum chuck 3;
the two groups of vacuum chucks 3, the two groups of moving mechanisms and external gas generating equipment are all communicated through a gas circulation mechanism, the gas circulation mechanism comprises a first electromagnetic valve 9, a first connecting pipe 10, a second connecting pipe 11, a second electromagnetic valve 12 and a communicating pipe 20, the first electromagnetic valve 9 and the second electromagnetic valve 12 are connected through the first connecting pipe 10, the first electromagnetic valve 9 and the vacuum chucks 3 are connected through the second connecting pipe 11, an interface 4 matched with the second connecting pipe 11 is arranged on the outer side of the vacuum chucks 3, a first gas storage cavity 5 is fixedly arranged in the main body 1, a second gas storage cavity 6 is fixedly arranged at the top of the first gas storage cavity 5, the inner sides of the two groups of first electromagnetic valves 9 are respectively connected with the first gas storage cavity 5 and the second gas storage cavity 6 in a sliding sealing manner, the communicating pipe 20 penetrating through the main body 1 is arranged on one side of the bottom of the first gas storage cavity 5, and a vent 19 is formed in the top surface of the communicating pipe 20;
the outer sides of the two groups of first electromagnetic valves 9 are fixedly provided with a first annular slide plate 7 and a second annular slide plate 8 which are matched with the first air storage cavity 5 and the second air storage cavity 6 respectively, the bottom of the movable frame 2 is movably connected with a movable frame 22, and the bottom of the movable frame 22 is provided with a travelling mechanism;
the running gear includes movable frame 22, motor 23, gear 24, ring gear 25, movable frame 22 is located and removes 2 bottoms of the frame and is connected for rotating between the frame 2, ring gear 25 is fixed to be provided with inside main part 1, and motor 23 output shaft fixed connection's gear 24 and ring gear 25 mesh mutually, gas circulation mechanism can also provide the air supply to first rodless cylinder 14 and second rodless cylinder 16 simultaneously, and then can make vacuum chuck 3 remove for removing 2, and then be convenient for external test equipment tests the optional position of wafer, whole wafer test efficiency is higher, whole work efficiency has effectively been promoted, and test efficiency has been improved.
Referring to fig. 2, 5 and 6, a limit ring 27 is fixedly arranged in the main body 1, and limit rods 26 extending into the limit ring 27 are fixedly arranged on the inner sides of the bottoms of the two groups of moving frames 2.
Referring to fig. 4, a baffle plate 21 positioned outside the first air storage cavity 5 and the second air storage cavity 6 is fixedly arranged outside the first electromagnetic valve 9, and the baffle plate 21 is in sliding connection with the outer walls of the first air storage cavity 5 and the second air storage cavity 6.
The working principle of the invention is as follows: when the wafer loading and unloading device is used, a power supply is switched on, two groups of movable frames 2 are arranged at the top of the main body 1, and vacuum chucks 3 are arranged at the top of each group of movable frames 2, so that when one group of vacuum chucks 3 drive a wafer to carry out testing, the other group of vacuum chucks 3 can carry out loading or unloading on the other group of wafers;
under the cooperation of the gear 24 and the annular gear 25 and the action of the limiting rod 26 and the limiting ring 27, each group of moving frames 2 can enable the vacuum chuck 3 to drive the wafer to do annular motion and simultaneously conduct rotation to a certain extent, so that the interface 4 of the vacuum chuck 3 faces to the outer side no matter where the moving frames 2 are positioned, and further, the air supply to the vacuum chuck 3 is more convenient through the air circulation mechanism;
the air circulation mechanism can also provide air sources for the first rodless air cylinder 14 and the second rodless air cylinder 16, so that the vacuum chuck 3 can move relative to the movable frame 2, and further, the external test equipment can test any position of the wafer conveniently, the overall wafer test efficiency is high, the overall work efficiency is effectively improved, and the test efficiency is improved;
specifically, a control module is arranged in the main body 1, wherein the control module plays a role in controlling the whole device, a communicating pipe 20 in the gas circulation mechanism is communicated with external gas generating equipment, and then the communicating pipe 20 provides a gas source for the first gas storage cavity 5 and the second gas storage cavity 6, firstly, one group of vacuum chucks 3 adsorb and fix one group of wafers, when the whole device moves below external test equipment, a first electromagnetic valve 9 closes a circulation port of a second connecting pipe 11, and then the interior of the vacuum chucks 3 keeps negative pressure to adsorb and fix the wafers, at the moment, a first connecting pipe 10 connected with the first electromagnetic valve 9 is in an open state, and then gas enters the interior of a second electromagnetic valve 12, and a two-component flow pipe 13 connected with the second electromagnetic valve 12 provides power for the first rodless cylinder 14 and the second rodless cylinder 16, so that the first rodless cylinder 14 and the second rodless cylinder 16 can drive the vacuum chucks 3 to move, and test different positions of the wafers;
further, when one group of vacuum chucks 3 drives a wafer to be tested, the other group of vacuum chucks 3 adsorbs and fixes a first group of wafers to be tested, then the other group of first electromagnetic valves 9 close the corresponding second connecting pipes 11, and the other group of vacuum chucks 3 can adsorb and fix the next group of wafers to be tested;
after the first group of wafers are tested, the first group of wafers are moved out of the testing station relative to the inner gear ring 25 through the corresponding motor 23 and the gear 24, at the moment, the structures such as the rodless cylinder and the like corresponding to the first group of wafers are reset, when the next group of wafers to be tested are moved to the testing station, the wafers after the testing are taken out by the external mechanical arm, then the next group of wafers to be tested are placed on the top of the vacuum chuck 3 through the mechanical arm, at the moment, when the vacuum chuck 3 adsorbs and fixes the wafers, the previous group of wafers to be tested are synchronously tested, the steps are repeated, and more time is consumed when the wafers are discharged;
in general, the invention can test a plurality of groups of wafers in turn in a cyclic and reciprocating manner through the two groups of vacuum chucks 3, effectively improves the testing efficiency of the whole wafer, greatly improves the whole working efficiency, and has more convenient whole use process.
Although embodiments of the invention have been shown and described, the detailed description is to be construed as exemplary only and is not limiting of the invention as the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples, and modifications, substitutions, variations, etc. may be made in the embodiments as desired by those skilled in the art without departing from the principles and spirit of the invention, provided that such modifications are within the scope of the appended claims.
Claims (9)
1. Integrated circuit testing device comprising a main body (1), characterized in that: two groups of moving frames (2) are arranged at the top of the main body (1), vacuum chucks (3) are movably arranged at the tops of the two groups of moving frames (2), and moving mechanisms matched with the corresponding vacuum chucks (3) are arranged in the two groups of moving frames (2);
the two groups of vacuum chucks (3), the two groups of moving mechanisms and external gas generating equipment are all communicated through a gas circulation mechanism, the gas circulation mechanism comprises a first electromagnetic valve (9), a first connecting pipe (10), a second connecting pipe (11), a second electromagnetic valve (12) and a communicating pipe (20), the first electromagnetic valve (9) and the second electromagnetic valve (12) are connected through the first connecting pipe (10), the first electromagnetic valve (9) and the vacuum chucks (3) are connected through the second connecting pipe (11), a first gas storage cavity (5) is fixedly arranged in the main body (1), a second gas storage cavity (6) is fixedly arranged at the top of the first gas storage cavity (5), and the inner sides of the two groups of the first electromagnetic valves (9) are respectively connected with the first gas storage cavity (5) and the second gas storage cavity (6) in a sliding sealing manner;
the two groups of first solenoid valves (9) outside are fixed respectively be provided with first gas storage chamber (5), second gas storage chamber (6) matched with first annular slide (7) and second annular slide (8), remove frame (2) bottom swing joint and have movable frame (22), movable frame (22) bottom is provided with running gear, two groups remove frame (2) bottom inboard all fixedly provided with gag lever post (26).
2. An integrated circuit testing apparatus according to claim 1, wherein: the movable mechanism comprises a first rodless cylinder (14), a first sliding block (15), a second rodless cylinder (16), a second sliding block (17) and a shunt pipe (13), wherein the first rodless cylinder (14), the first sliding block (15), the second rodless cylinder (16) and the second sliding block (17) are sequentially arranged inside the movable frame (2) from bottom to top.
3. An integrated circuit testing apparatus according to claim 2, wherein: the second electromagnetic valve (12) is connected with the first rodless cylinder (14) and the second rodless cylinder (16) through the shunt pipe (13), and the shunt pipe (13) is positioned at the outer side of the movable frame (2).
4. An integrated circuit testing apparatus according to claim 2, wherein: guide rods (18) penetrating through the first sliding blocks (15) and the second sliding blocks (17) are fixedly arranged in the movable frame (2), the first sliding blocks (15) slide relative to the first rodless air cylinders (14), the second sliding blocks (17) slide relative to the second rodless air cylinders (16), and the second sliding blocks (17) are fixedly connected with the vacuum suction disc (3).
5. An integrated circuit testing apparatus according to claim 1, wherein: the walking mechanism comprises a movable frame (22), a motor (23), a gear (24) and an inner gear ring (25), wherein the movable frame (22) is positioned at the bottom of the movable frame (2) and is in rotary connection with the movable frame (2).
6. An integrated circuit testing apparatus according to claim 5, wherein: the inner gear ring (25) is fixedly arranged inside the main body (1), and a gear (24) fixedly connected with an output shaft of the motor (23) is meshed with the inner gear ring (25).
7. An integrated circuit testing apparatus according to claim 1, wherein: the limiting ring (27) is fixedly arranged in the main body (1), and a chute matched with the limiting rod (26) is formed in the limiting ring (27).
8. An integrated circuit testing apparatus according to claim 1, wherein: a communicating pipe (20) penetrating through the main body (1) is arranged on one side of the bottom of the first air storage cavity (5), and an air vent (19) is formed in the top surface of the communicating pipe (20).
9. An integrated circuit testing apparatus according to claim 1, wherein: the outside of the first electromagnetic valve (9) is fixedly provided with a baffle plate (21) positioned outside the first air storage cavity (5) and the second air storage cavity (6), and the baffle plate (21) is in sliding connection with the outer walls of the first air storage cavity (5) and the second air storage cavity (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310421073.7A CN116148640A (en) | 2023-04-19 | 2023-04-19 | Integrated circuit test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310421073.7A CN116148640A (en) | 2023-04-19 | 2023-04-19 | Integrated circuit test equipment |
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| Publication Number | Publication Date |
|---|---|
| CN116148640A true CN116148640A (en) | 2023-05-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310421073.7A Pending CN116148640A (en) | 2023-04-19 | 2023-04-19 | Integrated circuit test equipment |
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| Country | Link |
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| CN (1) | CN116148640A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108943455A (en) * | 2017-05-19 | 2018-12-07 | 浙江集英精密机器有限公司 | Workpiece transporter and workpiece conveyer method |
| CN109822419A (en) * | 2019-03-04 | 2019-05-31 | 天通日进精密技术有限公司 | Wafer transfer device and wafer transfer method |
| CN112864065A (en) * | 2020-12-31 | 2021-05-28 | 南通平鼎海机电设备有限公司 | Device applied to chip packaging test |
| CN113092985A (en) * | 2021-02-24 | 2021-07-09 | 陆敏敏 | Integrated circuit multi-station test platform and integrated circuit test method |
| CN114113140A (en) * | 2021-11-26 | 2022-03-01 | 深圳市北科检测科技有限公司 | Multistation LED lamp plate detection device |
| CN115602582A (en) * | 2022-11-07 | 2023-01-13 | 深圳市华芯邦科技有限公司（Cn） | Automatic defective product removing device for chip detection |
| CN218567535U (en) * | 2022-10-17 | 2023-03-03 | 深圳市芯源科创有限公司 | Rotary multi-station integrated circuit chip testing tool |
| CN218824565U (en) * | 2022-08-29 | 2023-04-07 | 无锡市爱普达微电子有限公司 | Multi-station test board for chip test |
-
2023
- 2023-04-19 CN CN202310421073.7A patent/CN116148640A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108943455A (en) * | 2017-05-19 | 2018-12-07 | 浙江集英精密机器有限公司 | Workpiece transporter and workpiece conveyer method |
| CN109822419A (en) * | 2019-03-04 | 2019-05-31 | 天通日进精密技术有限公司 | Wafer transfer device and wafer transfer method |
| CN112864065A (en) * | 2020-12-31 | 2021-05-28 | 南通平鼎海机电设备有限公司 | Device applied to chip packaging test |
| CN113092985A (en) * | 2021-02-24 | 2021-07-09 | 陆敏敏 | Integrated circuit multi-station test platform and integrated circuit test method |
| CN114113140A (en) * | 2021-11-26 | 2022-03-01 | 深圳市北科检测科技有限公司 | Multistation LED lamp plate detection device |
| CN218824565U (en) * | 2022-08-29 | 2023-04-07 | 无锡市爱普达微电子有限公司 | Multi-station test board for chip test |
| CN218567535U (en) * | 2022-10-17 | 2023-03-03 | 深圳市芯源科创有限公司 | Rotary multi-station integrated circuit chip testing tool |
| CN115602582A (en) * | 2022-11-07 | 2023-01-13 | 深圳市华芯邦科技有限公司（Cn） | Automatic defective product removing device for chip detection |
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Application publication date: 20230523 |