CN116137768A - Power amplifier structure, active antenna unit and 5G base station - Google Patents

Power amplifier structure, active antenna unit and 5G base station Download PDF

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Publication number
CN116137768A
CN116137768A CN202111357263.4A CN202111357263A CN116137768A CN 116137768 A CN116137768 A CN 116137768A CN 202111357263 A CN202111357263 A CN 202111357263A CN 116137768 A CN116137768 A CN 116137768A
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CN
China
Prior art keywords
power amplification
board
receiving
power amplifier
plate
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Pending
Application number
CN202111357263.4A
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Chinese (zh)
Inventor
王富强
卫东
李朋军
宋林东
靖娜坤
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ZTE Corp
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ZTE Corp
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Filing date
Publication date
Application filed by ZTE Corp filed Critical ZTE Corp
Priority to CN202111357263.4A priority Critical patent/CN116137768A/en
Priority to PCT/CN2022/124377 priority patent/WO2023087973A1/en
Publication of CN116137768A publication Critical patent/CN116137768A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
    • H04W88/08—Access point devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Signal Processing (AREA)
  • Amplifiers (AREA)
  • Transceivers (AREA)

Abstract

The embodiment of the invention relates to the technical field of wireless communication and discloses a power amplifier structure, an active antenna unit and a 5G base station. The power amplifier structure comprises: the receiving and transmitting plate is provided with a front surface and a back surface opposite to the front surface, and the back surface of the receiving and transmitting plate is connected with a heat radiation body; a containing cavity is formed in one side, connected with the receiving and transmitting plate, of the radiating body, and the containing cavity is provided with an opening leading to the receiving and transmitting plate; a first power amplification plate is arranged at the position, located in the opening, of the back surface of the receiving and transmitting plate, a second power amplification plate is arranged at one side, far away from the receiving and transmitting plate, of the accommodating cavity, and a power amplification tube is arranged on the second power amplification plate; the first power amplification board and the second power amplification board are connected through the switching support in a signal interconnection mode, and a closed shielding cavity is formed between the first power amplification board, the second power amplification board and the switching support in a surrounding mode. On the premise of reducing the thickness of the AUU, the problems of heat dissipation and radio frequency shielding of the power amplifier part arranged on the back of the receiving and transmitting plate are solved.

Description

Power amplifier structure, active antenna unit and 5G base station
Technical Field
The embodiment of the application relates to the technical field of wireless communication, in particular to a power amplifier structure, an active antenna unit and a 5G base station.
Background
With the development of the fifth generation mobile communication technology (5th Generation Mobile Communication Technology,5G) commercially, an active Antenna Unit (Active Antenna Unit, AAU) that structurally merges a remote radio frequency Unit (Remote Radio Unit, RRU) and an Antenna Unit (Antenna Unit, AU) in the fourth generation mobile communication technology (4th Generation Mobile Communication Technology,4G) becomes a main device of the 5G base station.
The AAU includes an antenna portion, a power amplifier portion, and other circuitry. For the design purpose of reducing the size of the AAU, only the antenna portion may be left on the front side of the transceiver board, while the other circuits, including the power amplifier portion, are soldered entirely on the back side of the transceiver board. However, soldering the power amplifier portion to the back surface of the transceiver board faces difficulties in meeting the design requirements of both heat dissipation and radio frequency shielding.
Disclosure of Invention
The main objective of the embodiments of the present application is to provide a power amplifier structure, an active antenna unit and a 5G base station, so that when the power amplifier part is disposed on the back of a transceiver board on the premise of satisfying the reduction of the AUU size, the heat dissipation effect is greatly improved, and the problem of radio frequency shielding is improved.
To at least achieve the above object, an embodiment of the present application provides a power amplifier structure, including: the receiving and transmitting plate is provided with a front surface and a back surface opposite to the front surface, and the back surface of the receiving and transmitting plate is connected with a heat radiation body; a containing cavity is formed in one side, connected with the receiving and transmitting plate, of the radiating body, and the containing cavity is provided with an opening leading to the receiving and transmitting plate; a first power amplification plate is arranged at the position, located in the opening, of the back surface of the receiving and transmitting plate, a second power amplification plate is arranged at one side, far away from the receiving and transmitting plate, of the accommodating cavity, and a power amplification tube is arranged on the second power amplification plate; the first power amplification board and the second power amplification board are connected through the switching support in a signal interconnection mode, and a closed shielding cavity is formed between the first power amplification board, the second power amplification board and the switching support in a surrounding mode.
To achieve at least the above object, embodiments of the present application further provide an active antenna unit, including: the power amplifier structure is provided.
To achieve at least the above object, an embodiment of the present application further provides a 5G base station, including: the active antenna element described above.
The utility model provides a power amplifier structure, including the transceiver board to and connect the radiator at the back of transceiver board, hold the chamber through setting up in the radiator, and with power amplifier part setting in holding the chamber, with the purpose that realizes further reducing AUU thickness dimension. In order to solve the heat dissipation problem of the power amplification tube arranged on the back surface of the receiving and transmitting plate, the power amplification part comprises a first power amplification plate, a second power amplification plate and a power amplification tube; the first power amplifier board is arranged at the back of the receiving and transmitting board and is positioned at the opening of the accommodating cavity, the second power amplifier board is arranged at one side of the accommodating cavity far away from the receiving and transmitting board, the power amplifier pipe is arranged on the second power amplifier board, namely, the power amplifier pipe, the second power amplifier board and the radiating body are of a structure which is sequentially overlapped, and further, indirect contact between the power amplifier pipe and the radiating body is realized, and heat generated in work of the power amplifier pipe can be conducted out through the radiating body. Because the solid structure of the radiator is partially hollowed out to form the accommodating cavity, the weight of the AUU is correspondingly reduced. In order to solve the problem of radio frequency shielding of the power amplification tube arranged on the back surface of the receiving and transmitting plate, the power amplification part further comprises a switching support arranged between the first power amplification plate and the second power amplification plate, and the switching support realizes mechanical connection and signal interconnection between the first power amplification plate and the second power amplification plate; the first power amplification plate, the switching support and the second power amplification plate surround to form a closed shielding cavity, so that a closed electromagnetic environment is provided for the power amplification part. The novel power amplifier structure that this embodiment provided has solved and has set up heat dissipation and radio frequency shielding problem behind the back of transceiver board with power amplifier part, on the basis that does not change current device design, through carrying out the flip-chip setting to the power amplifier pipe, has both satisfied and has set up the power amplifier pipe at the transceiver board back, has guaranteed again that the welding face of power amplifier pipe need not be towards the back of transceiver board to can satisfy the heat dissipation demand towards radiator one side. The technical possibility is provided for the AAU to only leave the antenna part on the front side of the receiving and transmitting board, the purpose of reducing the thickness dimension of the AAU is achieved, and the AUU weight is reduced additionally.
Drawings
One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which the figures are not to be considered limiting unless expressly stated otherwise.
Fig. 1 is a schematic structural diagram of a power amplifier structure according to an embodiment of the present invention;
FIG. 2 is an enlarged view of a portion of the dashed box of FIG. 1; .
In the figures, the back of the 100-transceiver board, the 110-transceiver board, the front of the 120-transceiver board; 200-a heat radiation body, 210-a containing cavity, 211-a first groove, 212-a second groove and 220-an avoidance groove; 300-a first power amplification board; 400-a second power amplification board; 500-power amplifier tube and 510-welding surface; 600-switching a bracket; 700-shielding cavity; 800-digital device.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the embodiments of the present application will be described in detail below with reference to the accompanying drawings. However, as will be appreciated by those of ordinary skill in the art, in the various embodiments of the present application, numerous technical details have been set forth in order to provide a better understanding of the present application. However, the technical solutions claimed in the present application can be implemented without these technical details and with various changes and modifications based on the following embodiments. The following embodiments are divided for convenience of description, and should not be construed as limiting the specific implementation of the present application, and the embodiments may be mutually combined and referred to without contradiction.
In a conventional AAU, a power amplifier part is welded to the front surface of a transceiver board, and the power amplifier part includes at least a shielding cavity, a printed circuit board (Printed Circuit Board, PCB), and a power amplifier tube. The shielding cavity is used for realizing the radio frequency shielding requirement of the power amplifier part; the heat generated in the work of the power amplification tube is led to the heat radiation body through the welding surface of the power amplification tube.
The applicant has found that in order to effectively reduce the thickness dimension of the AAU, it is necessary to leave only the antenna portion on the front side of the transceiver board and to provide all the other circuits including the power amplifier portion on the back side of the transceiver board. The arrangement of the power amplifier part on the back of the transceiver board faces two important technical bottlenecks: firstly, in the prior art, when the power amplifier part is positioned on the front surface of the transceiving plate, only the transceiving plate is arranged between the welding surface of the power amplifier tube and the radiating body, and the welding surface of the power amplifier tube faces the radiating body, so that the radiating body is indirectly contacted, and the radiating requirement of the power amplifier tube can be ensured; if the power amplification tube is only turned to the back of the receiving and transmitting plate, the welding surface of the power amplification tube is connected with the back of the receiving and transmitting plate, namely, the welding surface of the power amplification tube only faces the receiving and transmitting plate, but does not face the heat radiation body, and at the moment, heat generated in the work of the power amplification tube cannot be conducted out through the heat radiation body. Secondly, the power amplifier part is matched with a shielding cavity for use, and the shielding cavity can realize radio frequency isolation of the power amplifier part from other parts; the power amplifier is partially arranged on the back of the receiving-transmitting board, so that the problem that the cavity height of the shielding cavity cannot be ensured occurs, and good shielding performance cannot be ensured. There is a need for a technique that solves both of the above problems simultaneously, converting a single-sided layout into a viable solution.
Through the research of the inventor, the structure that the back of the receiving and transmitting plate is connected with the radiator is kept unchanged, and the power amplifier part is arranged in the receiving and transmitting plate by arranging the receiving cavity in the radiator and communicating the opening of the receiving cavity with the receiving and transmitting plate, so that the power amplifier part is arranged on the back of the receiving and transmitting plate. The back of the receiving and transmitting plate is connected with a first power amplification plate in the opening, a power amplification tube and a peripheral circuit in the power amplification part are arranged on a second power amplification plate, the second power amplification plate is arranged on one side of the receiving cavity far away from the receiving and transmitting plate, namely, the structure that the power amplification tube, the second power amplification plate and the radiator are sequentially overlapped is still formed, so that the power amplification tube is indirectly connected with the radiator, and therefore the radiating requirement in the work of the power amplification tube is met. In addition, the first power amplification board and the second power amplification board are connected together through a switching support so as to meet the connection requirements between circuits such as signals and power supply on the transceiver board and the second power amplification board; and, the first power amplifier board. The switching support and the second power amplification plate form a closed shielding cavity, so that good shielding of the power amplification part is met. Through the arrangement, the two problems caused by the fact that the power amplifier is arranged on the back of the receiving-transmitting board in a rotating mode in the prior art are solved, the purpose of further reducing the thickness of the AUU is finally achieved, and meanwhile the effect of reducing the weight of the AUU is achieved.
An embodiment of the invention relates to a power amplifier structure, which is applied to an AUU, and the application scene of the embodiment of the invention can comprise but is not limited to a scene with 5G base station products in China or abroad.
The specific structure of this embodiment is shown in fig. 1, and includes: a transceiver board 100, wherein the transceiver board 100 has a front surface and a back surface opposite to the front surface, and the heat sink 200 is connected to the back surface 110 of the transceiver board; a receiving cavity 210 is formed on one side of the heat radiation body 200 connected with the transceiver plate 100, and the receiving cavity 210 is provided with an opening leading to the transceiver plate 100; the back 110 of the receiving and transmitting plate is provided with a first power amplification plate 300 at a position in the opening, one side of the accommodating cavity 210 far away from the receiving and transmitting plate 100 is provided with a second power amplification plate 400, and the second power amplification plate 400 is provided with a power amplification tube 500; the first power amplification board 300 and the second power amplification board 400 are interconnected through the transfer support 600, and a closed shielding cavity 700 is formed between the first power amplification board 300, the second power amplification board 400 and the transfer support 600 in a surrounding mode.
In this embodiment, the radiator 200 including the transceiver board 100 and the back surface 110 connected to the transceiver board further reduces the thickness of the AUU by providing the accommodating cavity 210 in the radiator 200 and disposing the power amplifier part in the accommodating cavity 210. In order to solve the heat dissipation problem of the power amplifier tube 500 arranged on the back surface 110 of the transceiver board, the power amplifier part comprises a first power amplifier board 300, a second power amplifier board 400 and the power amplifier tube 500; the first power amplification board 300 is arranged on the back 110 of the receiving and transmitting board and is positioned at the opening of the accommodating cavity 210, the second power amplification board 400 is arranged on one side, far away from the receiving and transmitting board 100, of the accommodating cavity 210, the power amplification pipe 500 is arranged on the second power amplification board 400, namely, the power amplification pipe 500, the second power amplification board 400 and the heat radiation body 200 are sequentially overlapped, so that indirect contact with the heat radiation body 200 is realized, and heat generated in the work of the power amplification pipe 500 is led out through the heat radiation body 200. Since the receiving chamber 210 is provided on the radiator 200, the weight of the AUU is also reduced accordingly. In order to solve the problem of radio frequency shielding of the power amplification tube 500 arranged on the back surface 110 of the transceiver board, the power amplification part further comprises a transfer bracket 600 arranged between the first power amplification board 300 and the second power amplification board 400, and the transfer bracket 600 realizes mechanical connection and signal interconnection between the first power amplification board 300 and the second power amplification board 400; the first power amplification board 300, the transfer bracket 600 and the second power amplification board 400 form a closed shielding cavity 700 around the power amplification board, thereby providing a closed electromagnetic environment for the power amplification part. The novel power amplifier structure provided by the embodiment of the application solves the problems of heat dissipation and radio frequency shielding after the power amplifier part is arranged on the back 110 of the transceiver plate, and provides technical possibility for the AAU to only leave the antenna part in the positive setting mode of the transceiver plate 100 through flip-chip welding (Mount under the board) of the power amplifier part on the basis of not changing the design of the current device, thereby achieving the effect of reducing the thickness dimension and the weight of the AAU.
The implementation details of the power amplifier structure of this embodiment are specifically described below, and the following details are provided only for facilitating understanding, and are not necessary for implementing this embodiment.
In one example, considering that the auxiliary devices are more disposed on the first power amplification board 300, the planar size of the auxiliary devices is larger than that of the second power amplification board 400, in order to reduce the size of the accommodating cavity 210 as much as possible, the accommodating cavity 210 includes a first groove 211 and a second groove 212 from the position close to the transceiver board 100 to the position far from the transceiver board 100, the second groove 212 is formed at the bottom of the first groove 211, and the first groove 211 and the second groove 212 are communicated; the first groove 211 is used for accommodating the first power amplification board 300, and the second groove 212 is used for accommodating the second power amplification board 400, the power amplification tube 500 and the switching bracket 600; the projected size of the first recess 211 on the transceiver plate 100 is larger than the projected size of the second recess 212 on the transceiver plate 100. Thereby satisfying the arrangement requirements of the first power amplification board 300 and the second power amplification board 400, respectively. It can be understood that the cross-sectional dimension of the shielding cavity 700 enclosed by the adapter bracket 600 in this case is less than or equal to the planar dimension of the second power amplification board 400.
In one example, a side surface of the second power amplifier board 400, which is far from the transceiver board 100, is completely attached to an inner wall of the accommodating cavity 210. As shown in fig. 1, the second power amplifier board 400 is completely attached to the bottom wall of the accommodating cavity 210, so as to increase the indirect contact area with the heat sink 200 as much as possible, thereby improving the heat dissipation effect. Also, the cavity height of the shielding cavity 700 formed between the first power amplification plate 300, the transfer bracket 600 and the second power amplification plate 400 can be increased as much as possible, thereby enhancing the rf shielding effect.
In addition, because the first power amplification board 300, the second power amplification board 400 and the switching support 600 are surrounded and formed with the sealed shielding cavity 700, other circuits with shielding requirements can be arranged in the shielding cavity 700.
In one example, the adapting support 600 is frame-shaped, and forms a rectangular shielding cavity 700 while supporting the first power amplification board 300 and the second power amplification board 400, so as to form an electromagnetic environment with sealing property. In other embodiments, the adapter bracket 600 may be annular, which is not particularly limited. In addition, according to practical requirements, the height of the adapting bracket 600, that is, the cavity height of the shielding cavity 700, is adjustable.
Specifically, the frame-shaped adapter bracket 600 includes at least three adapter plates attached to the inner wall of the second groove 212 and sequentially connected around the second power amplifier board 400. When the number of the adapter plates is three, the three adapter plates are sequentially connected to form a triangular frame shape. It can be understood that, in the case that the frame-shaped adapting support 600 includes four adapting plates, the four adapting plates are sequentially connected to form a square frame shape, and can form a rectangular shielding cavity with the first power amplification plate 300 and the second power amplification plate 400.
In addition, the power amplifier tube 500 includes a welding surface 510 positioned on one side surface of the housing of the power amplifier tube 500, and the power amplifier tube 500 is welded to the second power amplifier board 400 through the welding surface 510. The welding surface 510 is a connection surface between the power amplifier tube 500 and the second power amplifier board 400, and is also a heat dissipation surface of the power amplifier tube 500. By increasing the size of the welding surface 510, the size of the heat radiation surface of the power amplifier tube 500 is increased, thereby achieving the purpose of improving the heat radiation effect.
The power amplifier tube 500 is a radio frequency power amplifier tube 500 requiring heat dissipation, and is generally a final stage power amplifier tube 500. The power amplifier tube 500 realizes independent transmission and reception of multiple channels, has higher channel isolation requirement, and has higher heat consumption and stronger heat dissipation requirement during working.
In one example, the back 110 of the transceiver board is further provided with a digital device 800, where the digital device is other parts except for an antenna part and a power amplifier part, and a side of the heat sink 200 connected to the transceiver board 100 is further provided with a avoiding groove 220 for avoiding the digital device 800, where the digital device 800 at least partially extends into the avoiding groove 220.
It can be appreciated that a certain distance is kept between the avoidance groove 220 and the accommodating cavity 210, so that the processing difficulty of the heat radiation body 200 is reduced, and meanwhile, the mutual influence between devices is avoided.
In one example, the first power amplifier board 300 is provided with a power control module for power amplification, an isolation module, and a filtering module, where the isolation module may be a circulator, and the filtering module may be a picofarad capacitor. The first power amplifier board 300 is made of an integrated mixed board. The second power amplification board 400 is further provided with a circuit connected with the power amplification tube 500, and the first power amplification board 300 is made of a printed circuit board. The material of the adapting bracket 600 is a multi-layer circuit board, specifically, a multi-layer PCB board formed by stacking media and metals.
In one example, the material of the heat sink 200 is metal. Preferably, the heat sink 200 is made of aluminum. More preferably, the heat dissipation teeth are distributed on the surface of the heat dissipation body 200, so that the heat dissipation area of the heat dissipation body 200 is increased, and the heat dissipation environment of the power amplifier part during operation is improved.
The above examples in this embodiment are examples for easy understanding and are not limited to the technical solution of the present invention.
Another embodiment of the present invention relates to an active antenna unit, and details of the active antenna unit of this embodiment are specifically described below, which are provided for understanding only and are not necessary for implementing the present embodiment. The active antenna unit of the embodiment includes the power amplifier structure as described above. The front 120 of the transceiver board is provided with an antenna array, and the accommodating cavity 210 is disposed on the heat sink 200 at a position close to the antenna array. Based on multichannel demand, AUU includes more than one set of antenna array, and corresponding every antenna array of group is equipped with corresponding power amplifier part, sets up power amplifier part in the position department that is close to corresponding antenna array, can make AUU overall structure compacter reasonable.
Another embodiment of the invention relates to a 5G base station comprising an active antenna unit as described above.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples of carrying out the invention and that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

Claims (10)

1. The utility model provides a power amplifier structure which characterized in that includes: the receiving and transmitting plate is provided with a front surface and a back surface opposite to the front surface, and the back surface of the receiving and transmitting plate is connected with a heat radiation body;
a containing cavity is formed in one side, connected with the receiving and transmitting plate, of the radiating body, and the containing cavity is provided with an opening leading to the receiving and transmitting plate;
a first power amplification plate is arranged at the position, located in the opening, of the back surface of the receiving and transmitting plate, a second power amplification plate is arranged at one side, far away from the receiving and transmitting plate, of the accommodating cavity, and a power amplification tube is arranged on the second power amplification plate;
the first power amplification board and the second power amplification board are connected through the switching support in a signal interconnection mode, and a closed shielding cavity is formed between the first power amplification board, the second power amplification board and the switching support in a surrounding mode.
2. The power amplifier structure of claim 1, wherein the accommodating cavity comprises a first groove and a second groove which are sequentially arranged from a position close to the receiving-transmitting plate to a position far away from the receiving-transmitting plate, the second groove is arranged at the bottom of the first groove, and the first groove and the second groove are communicated;
the first groove is used for accommodating the first power amplification plate, and the second groove is used for accommodating the second power amplification plate, the power amplification tube and the switching support;
the projection size of the first groove on the receiving and transmitting plate is larger than that of the second groove on the receiving and transmitting plate.
3. The power amplifier structure according to claim 1 or 2, wherein a side surface of the second power amplifier board far from the transceiver board is completely attached to an inner wall of the accommodating cavity.
4. The power amplifier structure of claim 3, wherein a digital device is further arranged on the back of the transceiver board, an avoidance groove for avoiding the digital device is further formed in one side, connected with the transceiver board, of the heat radiation body, and the digital device at least partially stretches into the avoidance groove.
5. The power amplifier structure according to any one of claims 2 to 4, wherein the transfer bracket is frame-shaped.
6. The power amplifier structure of claim 5, wherein the frame-shaped adapter bracket comprises at least three adapter plates attached to the inner wall of the second groove and sequentially connected around the second power amplifier plate.
7. The power amplification structure of claim 1, wherein the first power amplification board is provided with a power control module, an isolation module and a filtering module for power amplification, and the first power amplification board is made of an integrated mixed pressure board;
the second power amplification board is also provided with a circuit connected with the power amplification tube, and the first power amplification board is made of a printed circuit board;
the material of the switching support is a multilayer circuit board.
8. The power amplifier structure of claim 1 or 7, wherein the heat sink is made of metal.
9. An active antenna unit, characterized in that it comprises a power amplifier structure according to any one of claims 1 to 8, an antenna array is disposed on the front surface of the transceiver board, and the accommodating cavity is disposed on the heat sink at a position close to the antenna array.
10. A 5G base station comprising an active antenna element according to claim 9.
CN202111357263.4A 2021-11-16 2021-11-16 Power amplifier structure, active antenna unit and 5G base station Pending CN116137768A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202111357263.4A CN116137768A (en) 2021-11-16 2021-11-16 Power amplifier structure, active antenna unit and 5G base station
PCT/CN2022/124377 WO2023087973A1 (en) 2021-11-16 2022-10-10 Power amplifier structure, active antenna unit, and 5g base station

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111357263.4A CN116137768A (en) 2021-11-16 2021-11-16 Power amplifier structure, active antenna unit and 5G base station

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CN116137768A true CN116137768A (en) 2023-05-19

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WO (1) WO2023087973A1 (en)

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