CN112151924B - Dielectric single-cavity dielectric waveguide filter - Google Patents
Dielectric single-cavity dielectric waveguide filter Download PDFInfo
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- CN112151924B CN112151924B CN201910578718.1A CN201910578718A CN112151924B CN 112151924 B CN112151924 B CN 112151924B CN 201910578718 A CN201910578718 A CN 201910578718A CN 112151924 B CN112151924 B CN 112151924B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P7/00—Resonators of the waveguide type
- H01P7/04—Coaxial resonators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/2002—Dielectric waveguide filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
- H01P1/2056—Comb filters or interdigital filters with metallised resonator holes in a dielectric block
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/212—Frequency-selective devices, e.g. filters suppressing or attenuating harmonic frequencies
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Abstract
The invention provides a dielectric single-cavity dielectric waveguide filter. Specifically, the medium single chamber includes: the medium single-cavity main body comprises an outer shell and an inner shell arranged in the outer shell, a cavity is formed between the outer shell and the inner shell, and a metal coupling hole capable of being spliced and coupled with a PIN needle is formed in the inner shell; the first avoidance hole is arranged on the shell and surrounds the outer side of the metal coupling hole. The invention solves the problem that the small-size and light-weight dielectric waveguide filter with the conventional connector scheme still adopted for input and output in the related technology cannot fully exert the performance, and simultaneously can fully exert the performance effect of the dielectric waveguide filter on the premise of reducing the size, the weight and the cost of the dielectric waveguide filter.
Description
Technical Field
The invention relates to the field of communication, in particular to a dielectric single-cavity dielectric waveguide filter.
Background
Currently, commercial demands of the 5G Massive MIMO technology for chinese mobile communication are becoming more and more urgent, and as the number of channels increases, the volume and weight of the base station system architecture need to increase. However, considering the limited processing size of the structural member and the difficulty of construction in the field, the size, weight and cost of the base station system architecture cannot be increased linearly, and the demands for miniaturization, light weight and low cost are more and more urgent.
The filter is used as a passive module of the base station system architecture and is used for selecting the frequency of the communication signal and filtering clutter or interference signals outside the frequency of the communication signal, and the size and the weight of the filter directly influence the development of miniaturization and light weight of the base station system architecture. The dielectric waveguide filter replaces an air part with a high-dielectric constant dielectric material to conduct electromagnetic waves and support the structure, and meanwhile, the metallization on the surface of the dielectric block plays a role of electromagnetic shielding, so that the size and weight of the filter module can be remarkably reduced. Meanwhile, the dielectric waveguide filter and the metal cavity filter are different in processing mode, and the conversion cost is much lower through powder sintering and die casting molding. In summary, dielectric waveguide filters have become a trend in the development of passive filter modules for 5G base station systems.
In the dielectric waveguide filter, if the conventional connector scheme is still adopted for input and output, the weight and volume advantages of the dielectric waveguide filter are reduced. For example, in the related art, an inner core coupling structure of a radio frequency connector is built in with an input end and an output end of the dielectric waveguide filter, however, the coupling structure is not simple enough and occupies a dimension in a height direction, and the dielectric waveguide filter is still a separate module, not a small device capable of being mounted on a board. In addition, in other related technologies, although the dielectric waveguide filter can be realized as a small device upper plate, the dielectric waveguide filter is limited to a microstrip line surface mount assembly mode, and the signal shielding property, the coupling range, the welding firmness and the high and low temperature stress resistance can not meet the market demand.
Therefore, there is no better solution to the problem of reduced weight and volume advantages of the dielectric waveguide filter caused by the conventional connector scheme for input and output on the dielectric waveguide filter with small volume and light weight in the related art.
Disclosure of Invention
The embodiment of the invention provides a dielectric single-cavity and dielectric waveguide filter, which at least solves the problem that the dielectric waveguide filter with small volume and light weight cannot fully exert the performance because the input and the output still adopt the conventional connector scheme in the related technology.
According to one embodiment of the present invention, there is provided a medium single chamber including: the medium single-cavity main body comprises an outer shell and an inner shell arranged in the outer shell, a cavity is formed between the outer shell and the inner shell, and a metal coupling hole capable of being spliced and coupled with a PIN needle is formed in the inner shell; the first avoidance hole is communicated with the cavity, and is arranged on the shell and surrounds the outer side of the metal coupling hole.
According to another embodiment of the present invention, there is provided a dielectric waveguide filter including: the filter comprises a filter medium block and one or more medium single cavities arranged in the filter medium block, wherein the medium single cavities are the medium single cavities.
According to the invention, the conventional transfer connector is canceled as input-output coupling, and meanwhile, the design thought that the metal coupling hole capable of being spliced and coupled with the PIN needle is arranged in the inner shell is adopted in the medium single cavity, and the avoiding hole is also arranged at the outer side of the metal coupling hole, so that the problem that the small-size and light-weight medium waveguide filter cannot fully play the performance caused by the fact that the conventional connector scheme is still adopted for input and output in the related technology can be solved, and meanwhile, the performance effect of the medium waveguide filter can be fully played on the premise of reducing the size, the weight and the cost of the medium waveguide filter.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
FIG. 1 is a block diagram of a single dielectric cavity according to an embodiment of the present invention;
FIG. 2 is a cross-sectional block diagram of a dielectric single cavity according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a coupled PIN needle in accordance with an embodiment of the invention;
FIG. 4 is a schematic diagram of another coupling PIN needle configuration in accordance with an embodiment of the invention;
fig. 5 is a schematic diagram of a dielectric waveguide filter according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of another dielectric waveguide filter according to an embodiment of the present invention
FIG. 7 is a schematic diagram of the structure of a carrier according to an embodiment of the invention;
FIG. 8 is a schematic diagram of a dielectric waveguide filter according to yet another embodiment of the present invention;
fig. 9 is a schematic structural view of still another carrier according to an embodiment of the present invention;
fig. 10 is a schematic structural view of yet another carrier according to an embodiment of the present invention.
Detailed Description
The invention will be described in detail hereinafter with reference to the drawings in conjunction with embodiments. It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.
Examples
In this embodiment, a single dielectric cavity is provided, fig. 1 is a structural diagram of a single dielectric cavity according to an embodiment of the present invention, and as shown in fig. 1, a single dielectric cavity 1 includes:
the medium single-cavity main body 12 comprises an outer shell 122 and an inner shell 124 arranged in the outer shell 122, a cavity is formed between the outer shell 122 and the inner shell 124, and a metal coupling hole 126 capable of being spliced and coupled with the PIN needle 2 is formed in the inner shell 124;
the first avoidance hole 14 is disposed on the housing 122, and surrounds the outer side of the metal coupling hole 126.
The first avoiding hole 14 penetrates through the housing 122, so that the cavity inside of the medium single-cavity main body 12 is communicated with the external environment. Of course, the first avoiding hole 14 may be a hole which is recessed to a certain depth but does not allow the inside of the cavity of the medium single cavity body 12 to communicate with the external environment.
Fig. 2 is a cross-sectional view of a single cavity of a medium according to an embodiment of the present invention, and as shown in fig. 2, the number of the first avoiding holes 14 may be one or more. In the case that only one first avoiding hole 14 is included in the medium single chamber 1, the first avoiding hole is a circular ring surrounding the outer side of the metal coupling hole and concentric with the metal coupling hole 126. And in the case of a plurality of first escape holes 14, a plurality of circular holes are formed around the outer side of the metal coupling hole 126, and the circular holes communicate with each other. The specific deployment mode may be determined according to the number and size of the first avoiding holes 14.
Optionally, both the outer surface of the housing 122 and the inner surface of the metal coupling hole 126 are covered with a metallization.
It should be noted that the metallization layer may be a silver plating layer, a copper plating layer or a copper-silver mixed plating layer. Other metal materials that can be beneficial to signal transmission are within the scope of the present embodiment.
In addition, the metallized plating layer of the outer surface of the housing 122 and the metallized plating layer of the inner surface of the metal coupling hole 126 may be the same metal material. Of course, the metallization of the outer surface of the housing 122 and the metallization of the inner surface of the metal coupling hole 126 may also be covered with metallization of different metal materials for different signal transmission purposes.
Fig. 3 is a schematic diagram of a structure of a coupling PIN according to an embodiment of the present invention. As shown in fig. 3, the coupling PIN 2 includes a plurality of elastic PINs 22 disposed at intervals, and in the process of assembling the coupling PIN 2 into the metal coupling hole 126, the plurality of elastic PINs 22 are elastically deformed and approach each other, so as to tightly assemble the coupling PIN 2 into the metal coupling hole 126.
Specifically, other elastic structures that can be interference fit inside the metal coupling hole 126 during the process of fitting the coupling PIN 2 inside the metal coupling hole 126 are also within the scope of protection of the present embodiment, and will not be described in detail herein.
In addition, the coupling PIN 2 may be fixed inside the metal coupling hole 126. And specific fixing means include, but are not limited to, fixing by welding.
Specifically, in fig. 3, the example given of the coupling PIN 2 is cylindrical. For example, fig. 4 is a schematic diagram of another configuration of a coupling PIN according to an embodiment of the present invention. As shown in fig. 4, the upper half is cylindrical and the lower half is a disk. The upper half area is a cylinder, and the lower half area is a square disk, which is also within the message scope of the embodiment.
Optionally, the metal coupling hole 126, the coupling PIN 2 and the center of the first avoidance hole 14 are coaxial.
By coaxially arranging the metal coupling hole 126, the coupling PIN 2 and the center of the first escape hole 14, a structure having the same function as a conventional connector is formed in the medium single chamber 1.
Here, if the number of the first escape holes 14 is plural, the center of the first escape hole 14 refers to the intersection point of the centers of the plural first escape holes 14.
In addition, it should be noted that, according to the structure of the dielectric single cavity provided in the above embodiment, in order to obtain a dielectric single cavity with appropriate coupling signal energy, the dimensions of the metal coupling hole 126, the coupling PIN 2 and the first avoiding hole 14 may be adjusted.
Examples
In this embodiment, a dielectric waveguide filter is further provided, and the dielectric waveguide filter is used to implement the foregoing embodiments and preferred implementations, which have already been described and will not be repeated.
Fig. 5 is a schematic structural diagram of a dielectric waveguide filter according to an embodiment of the present invention, and as shown in fig. 5, the apparatus includes:
a filter medium block 3;
one or more of the dielectric single cavities 1 are arranged in the filter dielectric block 3.
Note that the medium single chamber 1 in embodiment 2 is actually the medium single chamber described in embodiment 1.
The filter dielectric block 3 is provided with not only the dielectric single cavity 1 described in the present embodiment but also dielectric single cavities corresponding to other filtering functions.
Fig. 6 is a schematic structural diagram of another dielectric waveguide filter according to an embodiment of the present invention, and as shown in fig. 6, the filter dielectric block 3 includes:
one or more first tuning devices 32 are arranged on each dielectric single cavity 1, and one first tuning device 32 is arranged on each dielectric single cavity 1, and the first tuning devices 32 are used for tuning the resonance frequency of the dielectric single cavity 1.
The second debugging device 34 is positioned among the plurality of medium single cavities 1 and is used for performing coupling debugging among the medium single cavities 1.
Optionally, the filter medium block 3 is covered with a metal film with back glue.
It should be noted that, in daily use, the metallization of the first debug apparatus 32 and the second debug apparatus 34 may be damaged during the process of performing the debugging. In order to ensure the shielding and grounding properties of the signal and facilitate the suction cup to grasp the surface mount, the whole surface of the filter dielectric block 3 may be covered with a metal film (e.g., tin foil) of a back adhesive. Of course, in order to reduce the cost, the surface and the vicinity of the first debug device 32 and the second debug device 34 may be covered with a metal film of the back adhesive. In addition, the metal film must also have characteristics that satisfy the filter operation high temperature state without warping and falling off after long-time baking.
Fig. 7 is a schematic structural view of a carrier according to an embodiment of the present invention. As shown in fig. 7, includes:
a carrier 4 connected with the medium single cavity 1;
the carrier 4 comprises: and a second avoidance hole 42 penetrating through the carrier 4, for avoiding at least a partial region of the coupling PIN 2 and the first avoidance hole 14.
Specifically, the peripheral dimension of the carrier 4 is larger than that of the dielectric waveguide filter, and the material can be selected according to hardness, elasticity, expansion coefficient and heat dissipation requirement, and is usually a PCB board. Optionally, the carrier 4 further comprises: two metal layers 44 covering the surface layer and the bottom layer of the carrier 4; an inner layer 46 is disposed between the two metal layers 44.
Optionally, the metal layer and/or the inner layer covering the surface layer of the carrier 4 is used for signal transmission. PIN PINs are connected to the metal layer and/or the inner layer covering the surface layer of the carrier 4 for signal transmission.
It should be noted that the metal layer 44 covering the bottom layer of the carrier 4 is used for soldering the dielectric waveguide filter, and strengthening the grounding.
Fig. 8 is a schematic structural view of yet another dielectric waveguide filter according to an embodiment of the present invention, as shown in fig. 8, the dielectric waveguide filter in fig. 8 is provided with a carrier 4 under a dielectric filter dielectric block 3. Furthermore, it can be seen from fig. 8 that a plurality of open grooves can also be formed on the outside of the carrier 4 close to the filter medium block 3. Because the temperature is very high when the dielectric waveguide filter is attached, the difference of the cold-heat shrinkage ratio of the two materials of the dielectric waveguide filter and the carrier 4 can be released through the open slot, so that the problem that the dielectric waveguide filter is fissile and the normal use of the dielectric filter is affected is effectively prevented.
Optionally, the filter medium block 3 is placed on the carrier 4, is pressed in place by adopting a fixture, and is placed into welding equipment with set temperature and time for welding. Meanwhile, the bottom of the carrier 4 is shown in the reverse side view, and the carrier comprises ground holes and second avoidance holes 42 in the bottom layer layout, wherein the inside of the second avoidance holes 42 can be metallized and transition to the bottom layer to form a closed peripheral shielding layer for the coupling PIN needle 2. At the same time, ground holes may be added between the input/output coupling PIN needles 2 to enhance input/output port isolation.
Fig. 9 is a schematic structural view of still another carrier according to an embodiment of the present invention, and as shown in fig. 9, the length of the metal coupling PIN 2 is adjusted according to design requirements and can be higher than that of the carrier 4. In this case, via pin bonding is combined with the inner layer 46. Specifically, the internal layer 46 may be a signal layer inside the carrier 4, or may be an internal signal layer of a PCB of another module of the base station system. Other modules of the base station system are not limited to PA modules or antenna modules.
Fig. 10 is a schematic structural diagram of a carrier according to another embodiment of the present invention, and as shown in fig. 9, a low-pass filter 5 is integrated on the carrier 4, so as to suppress the far-end harmonic of the dielectric waveguide filter. The low-pass filter 5 is positioned on the surface layer of the carrier 4 in the figure and is in a microstrip form, but can be actually arranged in the middle of the carrier 4, and the implementation form is adjusted according to the design requirement of the scheme.
It should furthermore be noted that a carrier 4 in a dielectric waveguide filter is not necessary. When the size of other modules of the base station system is not large and the welding requirement of the dielectric filter is not affected by high-low temperature deformation, the carrier 4 can be canceled.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the principle of the present invention should be included in the protection scope of the present invention.
Claims (14)
1. A single media chamber, comprising:
the medium single-cavity main body comprises an outer shell and an inner shell arranged in the outer shell, a cavity is formed between the outer shell and the inner shell, and a metal coupling hole capable of being spliced and coupled with a PIN needle is formed in the inner shell;
the first avoidance hole is arranged on the shell and surrounds the outer side of the metal coupling hole;
the coupling PIN needle comprises a plurality of elastic clamping PINs which are arranged at intervals, and in the process of assembling the coupling PIN needle into the metal coupling hole, the plurality of elastic clamping PINs elastically deform and approach each other so as to assemble the coupling PIN needle into the metal coupling hole in an interference manner;
wherein the medium single cavity is arranged to be connected with a carrier, and a plurality of open grooves are formed on the outer side of the carrier.
2. A dielectric single chamber as claimed in claim 1, wherein,
the outer surface of the shell and the inner surface of the metal coupling hole are covered with a metallization plating layer.
3. The media single chamber of claim 2, wherein the metallic coupling aperture, the coupling PIN needle, and the center of the first relief aperture are coaxial.
4. A single media chamber, comprising:
the medium single-cavity main body comprises an outer shell and an inner shell arranged in the outer shell, a cavity is formed between the outer shell and the inner shell, and a metal coupling hole capable of being spliced and coupled with a PIN needle is formed in the inner shell;
the first avoidance hole is arranged on the shell and surrounds the outer side of the metal coupling hole;
wherein, the coupling PIN needle is fixed in the metal coupling hole;
wherein the medium single cavity is arranged to be connected with a carrier, and a plurality of open grooves are formed on the outer side of the carrier.
5. The single chamber of claim 4, wherein the chamber is configured to receive a plurality of media,
the outer surface of the shell and the inner surface of the metal coupling hole are covered with a metallization plating layer.
6. The media single chamber of claim 5, wherein the metal coupling aperture, the coupling PIN needle, and the center of the first relief aperture are coaxial.
7. A dielectric waveguide filter, comprising a filter dielectric block and one or more dielectric single cavities disposed in the filter dielectric block, wherein the dielectric single cavities are the dielectric single cavities of any one of claims 1-3 or claims 4-6.
8. The dielectric waveguide filter of claim 7, wherein the filter dielectric block further comprises:
and each medium single cavity is provided with a first debugging device, and the first debugging devices are used for debugging the resonance frequency of the medium single cavity.
9. The dielectric waveguide filter of claim 7, wherein the dielectric single cavity is a plurality of, the dielectric waveguide filter further comprising:
the second debugging device is positioned among the plurality of medium single cavities and used for performing coupling debugging among the medium single cavities.
10. The dielectric waveguide filter of claim 7, further comprising: the carrier is used for the preparation of the carrier,
the medium single cavity is connected with a carrier, and the carrier comprises:
the second avoidance hole penetrates through the carrier and is used for avoiding at least partial areas of the coupling PIN needle and the first avoidance hole.
11. The dielectric waveguide filter of claim 10, wherein the carrier further comprises:
two metal layers covering the surface layer and the bottom layer of the carrier;
and the inner layer is arranged between the two metal layers.
12. The dielectric waveguide filter of claim 11, wherein,
the metal layer and/or the inner layer covering the surface layer of the carrier is used for signal transmission.
13. Dielectric waveguide filter according to claim 12, characterized in that the coupling PIN is connected to the metal layer and/or the inner layer covering the surface layer of the carrier for signal transmission.
14. The dielectric waveguide filter of claim 11, further comprising a low pass filter integrated on or within the surface layer of the carrier.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910578718.1A CN112151924B (en) | 2019-06-28 | 2019-06-28 | Dielectric single-cavity dielectric waveguide filter |
| EP20833385.6A EP3985790A4 (en) | 2019-06-28 | 2020-05-09 | Dielectric single cavity and dielectric waveguide filter |
| PCT/CN2020/089479 WO2020259097A1 (en) | 2019-06-28 | 2020-05-09 | Dielectric single cavity and dielectric waveguide filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910578718.1A CN112151924B (en) | 2019-06-28 | 2019-06-28 | Dielectric single-cavity dielectric waveguide filter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112151924A CN112151924A (en) | 2020-12-29 |
| CN112151924B true CN112151924B (en) | 2023-07-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910578718.1A Active CN112151924B (en) | 2019-06-28 | 2019-06-28 | Dielectric single-cavity dielectric waveguide filter |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP3985790A4 (en) |
| CN (1) | CN112151924B (en) |
| WO (1) | WO2020259097A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114792874B (en) * | 2021-01-25 | 2024-04-02 | 南京以太通信技术有限公司 | Method for manufacturing dielectric filter and method for manufacturing electrode thereof |
| WO2023092518A1 (en) * | 2021-11-27 | 2023-06-01 | 华为技术有限公司 | Dielectric filter and communication device |
| CN114464971A (en) * | 2022-02-28 | 2022-05-10 | 华为技术有限公司 | Dielectric filter and electronic device |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01112801A (en) * | 1987-10-26 | 1989-05-01 | Kokusai Electric Co Ltd | Dielectric band-pass filter |
| JPH07221521A (en) * | 1994-02-08 | 1995-08-18 | Murata Mfg Co Ltd | Dielectric resonator and dielectric filter using the dielectric resonator |
| JPH07254804A (en) * | 1994-03-15 | 1995-10-03 | Murata Mfg Co Ltd | Dielectric resonator and its mount structure |
| US5731751A (en) * | 1996-02-28 | 1998-03-24 | Motorola Inc. | Ceramic waveguide filter with stacked resonators having capacitive metallized receptacles |
| US9583805B2 (en) * | 2011-12-03 | 2017-02-28 | Cts Corporation | RF filter assembly with mounting pins |
| WO2015157510A1 (en) * | 2014-04-10 | 2015-10-15 | Cts Corporation | Rf duplexer filter module with waveguide filter assembly |
| KR20160066727A (en) * | 2014-12-03 | 2016-06-13 | 주식회사 이너트론 | Filter package |
| CN107331930A (en) * | 2017-02-07 | 2017-11-07 | 四川省韬光通信有限公司 | The input and output coupled structure of dielectric waveguide filter and the method for controlling stiffness of coupling |
| CN109149024B (en) * | 2018-08-22 | 2020-03-24 | 京信通信技术(广州)有限公司 | Dielectric waveguide filter and port strength debugging method thereof |
| CN109167129B (en) * | 2018-08-22 | 2019-12-10 | 京信通信系统（中国）有限公司 | Resonator, port coupling device of dielectric waveguide filter and adjusting method thereof |
| CN109560355B (en) * | 2018-12-28 | 2024-05-14 | 重庆思睿创瓷电科技有限公司 | Dielectric body for 5G communication, dielectric waveguide filter, radio frequency module and base station |
| CN109755698A (en) * | 2019-01-30 | 2019-05-14 | 苏州市协诚五金制品有限公司 | A kind of structure for the Ceramic Dielectric Filter being installed on pcb board |
| CN208753480U (en) * | 2019-02-01 | 2019-04-16 | 苏州捷频电子科技有限公司 | Waveguide filter |
| CN109818117A (en) * | 2019-03-29 | 2019-05-28 | 重庆思睿创瓷电科技有限公司 | For reducing the strip lines configuration of power consumption, low-pass filter, communication device and system |
| CN110459840B (en) * | 2019-06-06 | 2022-02-11 | 深圳市大富科技股份有限公司 | Communication device, dielectric filter, and dielectric block |
| CN210074113U (en) * | 2019-07-19 | 2020-02-14 | 苏州捷频电子科技有限公司 | Dielectric filter |
-
2019
- 2019-06-28 CN CN201910578718.1A patent/CN112151924B/en active Active
-
2020
- 2020-05-09 EP EP20833385.6A patent/EP3985790A4/en active Pending
- 2020-05-09 WO PCT/CN2020/089479 patent/WO2020259097A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN112151924A (en) | 2020-12-29 |
| EP3985790A4 (en) | 2022-08-03 |
| EP3985790A1 (en) | 2022-04-20 |
| WO2020259097A1 (en) | 2020-12-30 |
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