CN109818117A - For reducing the strip lines configuration of power consumption, low-pass filter, communication device and system - Google Patents
For reducing the strip lines configuration of power consumption, low-pass filter, communication device and system Download PDFInfo
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- CN109818117A CN109818117A CN201910251903.XA CN201910251903A CN109818117A CN 109818117 A CN109818117 A CN 109818117A CN 201910251903 A CN201910251903 A CN 201910251903A CN 109818117 A CN109818117 A CN 109818117A
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Abstract
The present invention relates to wave filter technology fields, and in particular to the thickness of a kind of strip lines configuration for reducing power consumption, the strip line including being used to form stripline resonator circuit, the strip line is greater than 100 microns.Low-pass filter, communication device and system of the present invention also for apply the strip lines configuration for reducing power consumption.Thermal losses reduction during circuit transmission that the invention enables signal energies, to reach the low-loss purpose of drop.The miniaturization of equipment can be further realized.
Description
Technical field
The present invention relates to wave filter technology fields, and in particular to a kind of strip lines configuration for reducing power consumption, low pass filtered
Wave device, communication device and system.
Background technique
With the arriving of 5G communication era, the requirement to base station equipment weight and volume is smaller and smaller, due to small-sized
The advantages that change, low-loss and good temp characteristic, dielectric filter just like has become the inevitable option of 5G epoch base station equipment,
The application of middle ceramic waveguide filter is most representative.In the practical application of ceramic waveguide filter, it is often necessary to arrange in pairs or groups one
Low-pass filter for carrying out distal end inhibition uses, and forms a filter assembly, therefore the final performance of filter assembly is not
It is only dependent upon ceramic waveguide filter itself, it is also closely bound up with low-pass filter.
Low-pass filter for inhibiting harmonic wave and noise signal is one of the important component in wireless communication system, in order to
The overall volume for reducing filter assembly is arranged in pairs or groups the low-pass filter that uses with ceramic waveguide filter, mostly using small in size,
Strip line low-pass filter with good Planar integration degree.General strip line low-pass filter uses double-layer PCB board work
Skill production, is suppressed by two layers of medium substrate, wherein only metal layer of the single side covering for ground connection on one layer of medium substrate；
After covering metal layer on one surface of another layer of dielectric-slab, etch the circuit layer to form stripline resonator circuit, it is another then
Metal layer of the same face covering for ground connection, last two layers of medium substrate is using ungrounded one side as involutory surface, pairing compacting
Strip line low-pass filter is formed, setting via hole and pad one kind is also needed to be used for the letter of strip line low-pass filter on medium substrate
The supplementary structure of number input/output interface and metallization VIA one kind for isolation signals.
For filter, and volume and loss are inversely proportional, and how to reduce loss on the basis of guaranteeing miniaturization becomes
The focus broken through is sought by Liao Ge equipment vendor and device producer.For the ceramic waveguide wave filter technology that the 5G epoch use, pass
The solution of system is to reduce the loss of ceramic filter part, for example use the ceramic material of low-k, use multimode
Technology etc., but use the material of low-k that volume can be made to increase to be unable to satisfy customer requirement；Use Multimodal technology
Sexual valence is poor, can production it is not high；In contrast, the optimization of low-pass filter part is ignored always, however strip line is low
Bandpass filter is not without optimizable space.
It stands in the design angle of electronic system, current density is critically important index, and the performance and the magnitude of current of circuit are close
Correlation, and current density is determined by the dimension of object of conductor, its essence is shapes for the circuit layer in strip line low-pass filter
At the metal layer of specific pattern (being used to form stripline resonator circuit), structure size is originally very small, in addition
High frequency frequency domain (microwave band) uses, and due to skin effect, the conductive area of electric current can be more confined near surface, thus promotees
Increase current density, current density is excessively high, can in the form of thermal energy loss power, and then can overall performance band to filter
The negative consequence come.
Summary of the invention
Inventor reduce filtering device entirety power loss the problem of when, thinking is transformed into be typically ignored it is excellent
Change the power loss direction of low-pass filter, in the process inventors have found that by changing the strip line in low-pass filter
Structure (circuit layer is present in low-pass filter in the form of strip line), the band-like knot that script is made of thin-layer metal membrane
Structure longitudinally thickeies, and will not only change the filtering performance of low-pass filter script, but also can bring entire band under working condition
The decline of current density on shape line, thereby reduce by current density it is excessively high and the signal power of bring form of thermal energy
Loss.Based on above-mentioned discovery, inventor changes the existing strip lines configuration for reducing power consumption, thereby completing the present invention.
Thus the present invention provides a kind of strip lines configurations for reducing power consumption, wherein including being used to form strip line
The thickness of the strip line of resonator circuit, the strip line is greater than 100 microns.
The principle of the present invention and beneficial effect are: for the angle of equivalent circuit, due to the enlarged in thickness of strip line
The cross-sectional area of strip line, so that the resistivity of strip line is reduced, so that circuit all-in resistance reduces, so that current density subtracts
It is small；Or can be for the angle of conductive surface product, (72 is micro- lower than 2 ounces for common strip line thickness on existing PCB industry
Rice), strip line thickness is significantly increased so that the surface area of strip line entirety increases, thus current density reduction in this programme；
Signal energy thermal losses during circuit transmission reduces, to reach the low-loss purpose of drop.Low-pass filter loss reduces,
So that in design, the surplus of filtering unit machine loss increases, to reduce the design of dielectric waveguide filter part, system
Difficulty is made, dielectric waveguide filter part is able to not only reduce the cost of dielectric waveguide filter using smaller volume, also
The miniaturization of equipment can be further realized.
Preferably, the thickness of the strip line is less than 250 microns.
Excessively high thickness is not only easy to manufacture, and cost is again higher, and needs thicker medium substrate that could cover.
Preferably, the strip line with a thickness of 144 microns.
The thickness sexual valence is relatively high, can preferably realize the reduction of loss, while will not bring excessively high cost.
Preferably, the cross section of the strip line is rectangle.
It was verified that selecting the strip line with rectangular section that can bring lower loss.
On the basis of above-mentioned strip lines configuration, the present invention also provides a kind of low-pass filter, including medium substrate and
Stripline resonator circuit in medium substrate is set, and some or all of described stripline resonator circuit uses above-mentioned use
In the strip lines configuration for reducing power consumption.
Further, the medium substrate is involuted by upper substrate and lower substrate, and the stripline resonator circuit is set to
On the involutory surface of lower substrate, the involutory surface of the upper substrate is equipped with the groove cooperated with the stripline resonator circuit.
Since the strip line in the present invention is thicker, so common pcb board direct pressing is not used, but the thing on upper substrate
First setting groove is for accommodating strip line, in this way, the medium substrate after pairing is more smooth, the combination of upper substrate and lower substrate
More closely.
The present invention also provides a kind of communication devices, described including dielectric waveguide filter and above-mentioned low-pass filter
Dielectric waveguide filter and low-pass filter are successively connected in series along the direction that signal inputs.
The device has benefited from the performance boost of wherein low-pass filter, and the part of dielectric waveguide filter is taken
The smaller design of volume, to reduce whole volume and cost；Such as retain original design size, then the loss of device entirety
It is minimized, is adapted to require loss higher system.
The present invention also provides a kind of communication systems, including above-mentioned communication device, for receiving/emitting the filter of signal
Wave.
The system has benefited from used communication device, can be more compact, also or in the feelings for not changing original layout
Under condition, lower filtering loss is obtained, to improve overall performance.
Further, the system at least further include the signal emission module being connect with the communication device and/or with it is described
The signal receiving module of communication device connection.
For receiving and/or emitting signal.
Detailed description of the invention
Fig. 1 is the explosive view of the strip line low-pass filter in the embodiment of the present invention.
Fig. 2 is the bottom view of the upper substrate in Fig. 1.
Fig. 3 is the top view of the lower substrate in Fig. 1.
Fig. 4 is the explosive view of the communication device in the embodiment of the present invention.
Fig. 5 is the schematic block diagram of the base station in the embodiment of the present invention.
Specific embodiment
Appended drawing reference in Figure of description includes: upper substrate 1, the second pad 11, third pad 12, strip-line circuit layer
2, groove 20, output signal via hole 21, input signal via hole 22, lower substrate 3, the first pad 31, dielectric waveguide filter
4, low-pass filter 5, probe 6.
A low-pass filtering for using the strip lines configuration disclosed in this invention for reducing power consumption is shown in Fig. 1
Device.The low-pass filter is formed by two pieces of substrate bondings, is upper substrate 1, lower substrate 3 respectively；The material of 1 lower substrate 3 of upper substrate
It can be arbitrary medium material, the present embodiment preferably uses Rogers's plate, and thickness is optionally 20~40mi, in this example preferably
Use 30mil.1 upper and lower surface of upper substrate sees it is outer surface layer and interior surface layers respectively from top to bottom, wherein outer surface layer
For full copper clad layers, interior surface layers are no copper layer, and upper substrate 1 is additionally provided with the second pad 11, for connecting external signal.Intermediate
Circuit layer 2 uses copper material, and cross section is rectangle, forms whole stripline resonator circuits of strip line low-pass filter,
It is as shown in the figure only an example, strip lines configuration of the invention is suitable for the stripline resonator circuit of any pattern, can also be only
Segment striplines resonator circuit is constituted using strip lines configuration disclosed in the present invention.
It is lower substrate interior surface layers and lower substrate outer surface layer that 3 upper and lower surface of lower substrate is seen respectively from top to bottom, wherein under
Substrate interior surface layers are no copper layer, and lower substrate outer surface layer is full copper clad layers, and circuit layer 2 is bonded in lower substrate inner surface in this example
On layer, copper thickness may be selected 100-250 microns, as shown in Fig. 2, offering in the interior surface layers of upper substrate close with circuit layer 2
The groove 20 of cooperation；As shown in figure 3, lower substrate 3 is additionally provided with the first pad 31, for connecting external signal.Input in figure
Signal conduction hole 22 and output signal via hole 21, for the connection of circuit layer 3 and input/output end port, input signal conducting
Hole 22 can be blind hole, extend to lower substrate interior surface layers (not penetrating lower substrate outer surface layer) by outer surface layer, can also
To be through-hole, 3 outer surface layer of lower substrate is extended directly to by outer surface layer.Output signal via hole 21 is equally also possible to blind
Hole extends to interior surface layers (not penetrating interior surface layers) by lower substrate outer surface layer, is also possible to through-hole, by lower substrate outside
Superficial layer extends directly to outer surface layer.The structure of stripline resonator circuit in the present embodiment makes it in the operating condition
Current density reduce, signal energy thermal losses during circuit transmission reduces, to reach the low-loss purpose of drop.Low pass filtered
The loss of wave device reduces, so that machine loss surplus increases, to reduce the design difficulty of dielectric filter part, and then drops
The low cost of dielectric filter.
Since circuit layer 2 is thicker, common method for chemially etching efficiency is reduced, and takes the mode of machining to add in this example
Work circuit layer 2.Specific method can be but not limited to cutting, grinding, laser engraving etc..Correspondingly, machining can also be passed through
Mode process groove 20 in the interior surface layers of smooth upper substrate 3 originally.
Technique by 3 consolidation of upper substrate 1 and lower substrate is then the technique of existing multi-layer PCB board, further table
Face cover copper, punched and via hole metallization etc. techniques be also the prior art, therefore not to repeat here.
By the way that in 0-14GHz, it is matched required for it to be measured low-pass filter 5 for the setting of Network Analyzer calibration frequency
Power loss (interior insertion loss) in the passband of dielectric waveguide filter is simultaneously compared with traditional strip line low-pass filter, is adopted
The loss range of decrease brought by low-pass filter 5 with different Cu thickness is as shown in table 1:
Table 1
| Copper thickness (micron) | Passband (GHz) | The range of decrease (dB) |
| 100 | 3.2~3.4 | 0.11 |
| 144 | 3.2~3.4 | 0.20 |
| 250 | 3.2~3.4 | 0.22 |
As seen from the table, when copper thickness reaches 100 microns, it is already possible to bring the loss of 0.11dB to decline, be increased to 144
When micron, it is already possible to bring the loss of 0.20dB to decline, and continue to mention high copper thickness to 250 microns, bring the loss of 0.22dB
Decline, the only more 0.02dB of copper thickness compared to 144 microns.So for the balance of cost, technology difficulty and performance, this implementation
It is thick that higher 144 microns of the copper of cost performance is preferably used in example.
It is worth noting that, in certain embodiments, the stripline resonator circuit in low-pass filter 5 only partially uses
Strip lines configuration disclosed by the invention for reducing power consumption is only one in the strip line for form shape line resonator circuit
Divide and be thickened, correspondingly, only reinforcement just needs matched groove 20.
As shown in figure 4, the present embodiment also discloses a kind of communication device, the device include above-mentioned low-pass filter 5 with
And a dielectric waveguide filter 4, the dielectric waveguide filter 4 use ceramic dielectric.Specifically, low-pass filter 5 also collects
At signal input interface, third pad 12 passes through the strip line in low-pass filter 5 in the signal input interface and figure
Connection, third pad 12 are then connect with the input port of dielectric waveguide filter 4 by probe 6, dielectric waveguide filter 4 it is defeated
Outlet then passes through another probe 6 and connect with the second pad 11, and the signal for that will pass through dielectric filter filtering accesses low pass filtered
Wave device 5, and pass through the signal that low-pass filter 5 filters and be output to and the welding of the first pad 31 through output signal via hole 25 again
In route, i.e., signal conduction hole 25 be the communication device signal output end；The stub end insertion dielectric filter filtering of probe 6
Interior, small head end then passes through the hole insertion low pass filtered at the signal input through-hole 24 or 12 center of third pad at 11 center of the second pad
In wave device 5, and the strip line be connected in dielectric waveguide filter 4 and low-pass filter 5 in the longitudinal direction (is inputted for connection signal
The part of interface and the part for forming stripline resonator circuit).
The reduction of 5 power loss of low-pass filter, so that the surplus of filtering unit machine loss increases in design, thus
Design, the manufacture difficulty of ceramic waveguide filter segment are reduced, ceramic waveguide filter segment is able to using smaller volume,
The cost of ceramic filter is not only reduced, the miniaturization of equipment can also be further realized.It is calculated through inventor, utilizes this hair
Power loss surplus brought by after bright can make the size of ceramic waveguide filter segment that can at most reduce 30%, for filter
It is a significant progress for the miniaturization of wave component.
The present invention also protects a kind of communication system with above-mentioned communication device, which can be any need
Use the radio-frequency system of above-mentioned communication device, such as aircraft, radar, base station, radio-frequency system on satellite etc..This
A little radio-frequency systems can send and receive signal, and be filtered after receipt or before sending, so as to receive or send out
The signal meet demand sent, therefore radio-frequency system at least further includes the letter connecting with the signal input part of above-mentioned communication device
Number transmitting module, the signal receiving module being connect with the signal output end of above-mentioned communication device.
For example, base station as shown in Figure 5, base station includes duplexer, and duplexer includes transmitting band pass filter and collection of letters band
Bandpass filter, the two are all made of communication device disclosed in the present embodiment.The input terminal of transmitting band pass filter connects sender,
Output end connects antenna for base station；The input terminal of collection of letters bandpass filter connects antenna for base station, and output end connects receiver.Then for
Transmitting band pass filter, signal emission module are sender, and signal receiving module is antenna for base station.And collection of letters band logical is filtered
Wave device, signal emission module are antenna for base station, and signal receiving module is receiver.
In the base station of 5G communication system, large-scale antenna array technology is used, numerous antenna for base station is by with antenna
The form of array integrates, and (transmits band to reduce wiring and the loss of transmission line bring, the duplexer of each antenna
Bandpass filter and collection of letters bandpass filter) also integrate together；After the communication device in the present embodiment, the space saved can
So that the aerial array is more compact, the space saved can also be used to that other assemblies to be installed, or do not changing original
In the case where having size, the filtering loss of signal is reduced, to improve the performance of entire aerial array.
The above are merely the embodiment of the present invention, the common sense such as well known specific structure and characteristic are not made excessively herein in scheme
Description, all common of technical field that the present invention belongs to before one skilled in the art know the applying date or priority date
Technological know-how can know the prior art all in the field, and have using routine experiment means before the date
Ability, one skilled in the art can improve in conjunction with self-ability under the enlightenment that the application provides and implement we
Case, some typical known features or known method should not become the barrier that one skilled in the art implement the application
Hinder.It should be pointed out that for those skilled in the art, without departing from the structure of the invention, if can also make
Dry modification and improvement, these also should be considered as protection scope of the present invention, these all will not influence the effect that the present invention is implemented and
Patent practicability.The scope of protection required by this application should be based on the content of the claims, the specific reality in specification
Applying the records such as mode can be used for explaining the content of claim.
Claims (10)
1. for reducing the strip lines configuration of power consumption, it is characterised in that: including being used to form the band-like of stripline resonator circuit
The thickness of line, the strip line is greater than 100 microns.
2. the strip lines configuration according to claim 1 for reducing power consumption, it is characterised in that: the thickness of the strip line
Less than 250 microns.
3. the strip lines configuration according to claim 2 for reducing power consumption, it is characterised in that: the thickness of the strip line
It is 144 microns.
4. the strip lines configuration according to claim 1 for reducing power consumption, it is characterised in that: the strip line it is transversal
Face is rectangle.
5. low-pass filter, including medium substrate and the stripline resonator circuit being arranged in medium substrate, it is characterised in that:
Some or all of described stripline resonator circuit is any described for reducing the band-like of power consumption in Claims 1 to 5
Cable architecture.
6. low-pass filter according to claim 5, which is characterized in that the medium substrate is by upper substrate and lower substrate pair
It closes, the stripline resonator circuit is set on the involutory surface of lower substrate, and the involutory surface of the upper substrate is equipped with and institute
State the groove of stripline resonator circuit cooperation.
7. communication device, it is characterised in that: including low-pass filter described in dielectric waveguide filter and claim 6 or 7,
The dielectric waveguide filter and low-pass filter are successively contacted along the direction that signal inputs.
8. communication device according to claim 7, it is characterised in that: the dielectric waveguide filter is ceramic waveguide filtering
Device.
9. communication system, which is characterized in that including communication device as claimed in claim 8, for receiving the filtering of signal.
10. communication system according to claim 9, which is characterized in that at least further include being connect with the communication device
Signal emission module and/or the signal receiving module being connect with the communication device.
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| CN112151924A (en) * | 2019-06-28 | 2020-12-29 | 中兴通讯股份有限公司 | Dielectric single-cavity dielectric waveguide filter |
| CN114072965A (en) * | 2019-07-16 | 2022-02-18 | 瑞典爱立信有限公司 | Ceramic waveguide filter |
| EP3979518A4 (en) * | 2019-06-28 | 2022-07-20 | ZTE Corporation | Filter antenna and base station device |
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