CN209709141U - For the strip lines configuration of low-pass filter, low-pass filter, communication device and system - Google Patents

For the strip lines configuration of low-pass filter, low-pass filter, communication device and system Download PDF

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Publication number
CN209709141U
CN209709141U CN201920609834.0U CN201920609834U CN209709141U CN 209709141 U CN209709141 U CN 209709141U CN 201920609834 U CN201920609834 U CN 201920609834U CN 209709141 U CN209709141 U CN 209709141U
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China
Prior art keywords
strip line
low
pass filter
sublayer
strip
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何进军
蔡文新
陈鹏
韦俊杰
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Chongqing Si Ruchuang Porcelain Electric Technology Co Ltd
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Chongqing Si Ruchuang Porcelain Electric Technology Co Ltd
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Abstract

The utility model relates to wave filter technology fields, and in particular to a kind of strip lines configuration for low-pass filter, including at least two layers longitudinal strip line sublayer for being laminated and being parallel to each other;Each strip line sublayer is formed by plane pattern and is consistent, and the two-dimensional of each strip line sublayer is the relationship of uniform zoom, and the small strip line sublayer of area is completely in the coverage area of the big strip line sublayer of area;It is filled with medium base between the strip line sublayer, and intercouples between the strip line sublayer.The invention also discloses low-pass filter, communication device and the systems of application strip lines configuration.The utility model makes signal that reduction be lost during circuit transmission, to achieve the purpose that reduce system loss.The miniaturization of equipment can be further realized.

Description

For the strip lines configuration of low-pass filter, low-pass filter, communication device and system
Technical field
The utility model relates to wave filter technology fields, and in particular to a kind of strip lines configuration for low-pass filter, Low-pass filter, communication device and system.
Background technique
With the arriving of 5G communication era, the requirement to base station equipment weight and volume is smaller and smaller, due to small-sized The advantages that change, low-loss and good temp characteristic, dielectric filter just like has become the inevitable option of 5G epoch base station equipment, The application of middle ceramic waveguide filter is most representative.In the practical application of ceramic waveguide filter, it is often necessary to which collocation is used It is used in the low-pass filter for carrying out distal end inhibition, the final performance of shaping filter component, this filter assembly not only depends on It is also closely bound up with low-pass filter in ceramic waveguide filter itself.
Low-pass filter for inhibiting higher hamonic wave and noise signal is one of the important component in wireless communication system, In order to reduce the overall volume of filter assembly, the low-pass filter used with the collocation of ceramic waveguide filter uses body mostly Product is small, the strip line low-pass filter with good Planar integration degree.General strip line low-pass filter uses bilayer PCB The production of plate technique, is suppressed by two layers of medium substrate, wherein only gold of the single side covering for ground connection on one layer of medium substrate Belong to layer;After covering metal layer on one surface of another layer of dielectric-slab, the circuit layer to form stripline resonator circuit is etched, Metal layer of the another side covering for ground connection, last two layers of medium substrate is using ungrounded one side as involutory surface, pairing compacting Strip line low-pass filter is formed, providing holes and pad one kind is also needed to be used for the signal of strip line low-pass filter on medium substrate The supplementary structure of input/output interface and metallization VIA one kind for isolation signals.
For filter, size and loss are often conflict, how damage are reduced on the basis of guaranteeing miniaturization Consumption becomes each equipment vendor and the focus broken through is sought by device producer.The ceramic waveguide filter skill that the 5G epoch are necessarily used For art, traditional solution be reduce ceramic filter part loss, such as using low-k ceramic material, Using Multimodal technology etc., but use the material of low-k that volume can be made to increase to be unable to satisfy customer requirement;It uses Multimodal technology sexual valence is poor, can production it is not high;In contrast, the optimization of low-pass filter part is ignored always, however Strip line low-pass filter is not without optimizable space.
It stands in the design angle of electronic system, current density is critically important index, and the performance and the magnitude of current of circuit are close Correlation, and current density is determined by the dimension of object and shape of conductor, the circuit layer in strip line low-pass filter is in fact Matter is the metal layer to form specific pattern (being used to form stripline resonator circuit), and structure size is originally very small, is added On high frequency frequency domain (microwave band) use, due to skin effect, the conductive area of electric current can be more confined near surface, because And current density is promoted to increase, current density is excessively high, and loss also increases as, and then can overall performance bring to filter Negative consequence.
Utility model content
Inventor reduce filtering device entirety power loss the problem of when, thinking is transformed into be typically ignored it is excellent Change the power loss direction of low-pass filter, in the process inventors have found that by changing the strip line in low-pass filter Structure (circuit layer is present in low-pass filter in the form of strip line), the band-like knot that script is made of single-layer metal film Structure is longitudinally derived as by what is be parallel to each other, and shape is identical with horizontal position, while the metal multilayer film to intercouple again is constituted Afterwards, it will not only change the filtering performance of low-pass filter script, but also can bring under working condition on entire strip line The decline of current density, thereby reduce by current density it is excessively high and the signal power loss of bring form of thermal energy.Base In above-mentioned discovery, inventor changes the existing strip lines configuration for low-pass filter, to complete the utility model.
Thus the utility model provides a kind of strip lines configuration for low-pass filter, wherein including at least two layers The strip line sublayer that longitudinal direction is laminated and is parallel to each other;Each strip line sublayer is formed by plane pattern and is consistent, each institute The two-dimensional for stating strip line sublayer is the relationship of uniform zoom, and the small strip line sublayer of area is completely in the big band of area In the coverage area of shape line sublayer;
It is filled with medium base between the strip line sublayer, and intercouples between the strip line sublayer.
The principles of the present invention and beneficial effect are: for the angle of equivalent circuit, since strip line sublayer can It is equivalent to form parallel resistance, so that circuit all-in resistance reduces, so that current density reduces;Or it can be from conductive surface product Angle for, increased strip line sublayer increases the surface area of strip line entirety, thus current density reduce;Signal energy Amount thermal losses during circuit transmission reduces, to reach the low-loss purpose of drop.Low-pass filter loss reduces, so that The surplus of filtering unit machine loss increases when design, so that the design difficulty of ceramic waveguide filter segment is reduced, ceramics Waveguide filter part is able to not only reduce the cost of ceramic waveguide filter using smaller volume, can also be further Realize the miniaturization of equipment.
Further, the strip line sublayer connects through-hole between being equipped with the sublayer of all strip line sublayers of vertical communication, It is the through-hole that hole wall is metallized that through-hole is connected between the sublayer.
It is connected between strip line sublayer longitudinally through the through-hole of metallization.The tie point between sublayer is not only increased, is improved Degree of coupling reinforces the integrated degree between sublayer, also further increases the surface area of strip line, reduces thermal losses.
Further, it is uniformly distributed along the edge of the strip line sublayer that through-hole is connected between the sublayer.
Preferably, the quantity of the strip line sublayer is two layers.
It is enough to play the effect of smaller loss, while does not will increase excessive manufacture difficulty and excessive cost.
Preferably, each strip line sublayer at the intermarginal distance in the outside of pattern between 0.05~0.2mm.
In the present solution, the two-dimensional between each strip line sublayer allows to have differences, but can not be excessive, in the numerical value model It can be realized best decreasing loss performance in enclosing.
Preferably, the spacing between the strip line sublayer is between 10-20mil.
Ensure the coupling between strip line sublayer, while closely will not bring difficulty to the manufacturing very much because of apart from inner.
On the basis of above-mentioned strip lines configuration, the utility model additionally provides a kind of low-pass filter, including medium base Plate and the stripline resonator circuit being arranged in medium substrate, some or all of described stripline resonator circuit is using upper State the strip lines configuration for low-pass filter.
The utility model additionally provides a kind of communication device, including dielectric waveguide filter and above-mentioned low-pass filter, The dielectric waveguide filter and low-pass filter are successively connected in series along the direction that signal inputs.
The device has benefited from the performance boost of wherein low-pass filter, and the part of dielectric waveguide filter is taken The smaller design of volume, to reduce whole volume and cost;Such as retain original design size, then the loss of device entirety It is minimized, is adapted to require loss higher system.
The utility model additionally provides a kind of communication system, including above-mentioned communication device, for receive/emit signal Filtering.
The system has benefited from used communication device, can be more compact, also or in the feelings for not changing original layout Under condition, obtain harvesting lower filtering loss, to improve overall performance.
Detailed description of the invention
Fig. 1 is the explosive view of low-pass filter in the utility model embodiment.
Fig. 2 is the explosive view of the communication device in the utility model embodiment.
Fig. 3 is S (1,2) curve graph of the low-pass filter and traditional low-pass filter in the utility model embodiment.
Fig. 4 is the schematic block diagram of the base station in the utility model embodiment.
Specific embodiment
It is further described below by specific embodiment:
Appended drawing reference in Figure of description include: upper substrate 1, the second pad 11, third pad 12, Intermediate substrate 2, on Via hole 23, input signal via hole 24, output signal via hole are connected between strip line sublayer 21, lower strip line sublayer 22, sublayer 25, lower substrate 3, the first pad 31, dielectric waveguide filter 4, low-pass filter 5, probe 6.
A low pass for using the strip lines configuration disclosed in the utility model for low-pass filter is shown in Fig. 1 The structural schematic diagram of filter, the low-pass filter are formed by three pieces of substrate bondings, including upper substrate 1, Intermediate substrate 2 and lower base Plate 3, upper strip line sublayer 21 and lower strip line sublayer 22 connect via hole 23, input signal via hole 24 and output letter between sublayer Number via hole 25, the second pad 11 and the first pad 31.
The material of the upper substrate 1 on upper layer, the Intermediate substrate 2 of internal layer and undermost lower substrate 3 can be arbitrary medium material Material, the present embodiment preferably use Rogers's plate.1 upper and lower surface of upper substrate sees it is outer surface layer and inner surface respectively from top to bottom Layer, wherein outer surface layer is full copper clad layers, and interior surface layers are no copper layer, and upper substrate 1 is additionally provided with the second pad 11, for connecting Connect external signal.2 upper and lower surface of Intermediate substrate is respectively upper surface layer and undersurface layer, upper 21 He of strip line sublayer from top to bottom Lower strip line sublayer 22 is separately positioned on the upper and lower surface of Intermediate substrate 2, i.e., on upper surface layer and undersurface layer, and plane pattern It is consistent, the two-dimensional of the two is the relationship of uniform zoom, and the small lower strip line sublayer 22 of area is completely in area In the coverage area of big upper strip line sublayer 21, at a distance from lower strip line sublayer 22 and the outside of lower strip line sublayer 22 are intermarginal It can take and take 0.1mm in 0.05~0.2mm, the present embodiment, test proves, which takes in the range;Upper strip line Layer 21 and lower strip line sublayer 22 together form whole stripline resonator circuits of strip line low-pass filter 5, institute in figure Show it is only an example, the strip lines configuration of the utility model is suitable for the stripline resonator circuit of any pattern, can also only portion Stripline resonator circuit is divided to constitute using strip lines configuration disclosed in the utility model;Moreover, for Longitudinal data The multilayer stripline resonator circuit design of structure is equally applicable, only need to be by the part of the single layer strip line in original each layer Or all change strip lines configuration disclosed in the utility model into.
The copper thickness of upper strip line sublayer 21 and lower strip line sublayer 22 may be selected half ounce, one ounce or two ounces, this reality Apply in example be preferably two ounces, meanwhile, by connecting between multiple sublayers between upper strip line sublayer 21 and lower strip line sublayer 22 It takes over hole 23 to be connected, it is the through-hole that hole wall is metallized that via hole 23 is connected between sublayer, runs through upper strip line sublayer 21, intermediate base Plate 2 and lower strip line sublayer 22.Quantity and the position that via hole 23 is connected between sublayer are unlimited, connect between the sublayer in the present embodiment Via hole 23 is uniformly distributed along the edge of strip line sublayer.It is lower substrate interior surface layers that 3 upper and lower surface of lower substrate is seen respectively from top to bottom With lower substrate outer surface layer, wherein lower substrate interior surface layers are no copper layer, and lower substrate outer surface layer is full copper clad layers, lower substrate 3 It is additionally provided with the first pad 31, for connecting external signal.Input signal via hole 24 and output signal via hole 25 in figure, For the connection of upper strip line sublayer 21 and lower strip line sublayer 22 and input/output end port, input signal via hole 24 can be with It is blind hole, lower substrate interior surface layers (not penetrating lower substrate outer surface layer) is extended to by outer surface layer, is also possible to through-hole, 3 outer surface layer of lower substrate is extended directly to by outer surface layer.Output signal via hole 25 is equally also possible to blind hole, by lower substrate Outer surface layer extends to interior surface layers (not penetrating interior surface layers), is also possible to through-hole, direct by lower substrate outer surface layer Extend to outer surface layer.The structure of stripline resonator circuit in the present embodiment, which can be equivalent to form parallel resistance, makes electricity Road all-in resistance reduces, so that current density reduces, signal energy thermal losses during circuit transmission reduces, and reduces damage to reach The purpose of consumption.
The loss of low-pass filter 5 reduces in the present embodiment, so that machine loss surplus increases, to reduce dielectric filter The design difficulty of device part thereby reduces the cost of dielectric filter.
Preferably used for the balance of cost, technology difficulty and performance, in the present embodiment two layers of strip line sublayer (on Strip line sublayer 21 and lower strip line sublayer 22) with a substrate composition strip lines configuration, wherein the thickness of substrate be optionally 10.3mil is preferably used in 10-20mil this example, the thickness of upper substrate 1 and lower substrate 3 is optionally 20~40mi, this example In preferably use 30mil.
Using the strip line sublayer on negative film photosensitive facture Intermediate substrate 2 in this example.The intermediate base after copper will specially be covered Meeting one layer of light-sensitive surface in its surface cover after plate 2 cleans up.This film, which encounters light, to be solidified, and one layer of protection is formed on copper foil Film washes the part for not forming protective film, then is etched away, and remaining metal film is exactly strip line sublayer.
The above method is taken to the two sides of Intermediate substrate 2, can be obtained the intermediate base layer 2 in the present embodiment, due to The strip line sublayer on two sides is aligned by the operation stage, and Yao Yuanyuan is convenient to (example on the plate that will be etched in two pieces of separation respectively Such as in the upper surface of intermediate base layer and in lower substrate inner surface) then in compression moulding when be aligned, so can ensure that The good alignment of strip line sublayer 21 and lower strip line sublayer 22, so that simple production process is easy and has very high consistency.
Technique by Intermediate substrate 2 and 3 consolidation of upper substrate 1 and lower substrate is then the technique of existing multi-layer PCB board, Further surface cover copper, punched and via hole metallization etc. techniques be also the prior art, therefore not to repeat here.
By the way that in 0-14GHz, it is matched required for it to be measured low-pass filter 5 for the setting of Network Analyzer calibration frequency Power loss in the passband (3.4~3.6GHz) of waveguide filter;As a result as shown in figure 3, the unit of horizontal axis is GHz in Fig. 3, The unit of the longitudinal axis is dB, is S (1,2) curve of traditional strip line low-pass filter with the curve of dot label in figure, removes For strip lines configuration using outside traditional single belt wiring, other settings are consistent with the low-pass filter 5 in the present embodiment, and in figure It is smooth not have markd curve for S (1,2) curve of the low-pass filter 5 in the present embodiment;According to those skilled in the art institute Well known knowledge, for S (1,2) if curve reading is that 0dB indicates that tested device is not lost in the Frequency point of reading, this is device Perfect condition, and read it is smaller, then illustrate loss it is bigger;3.4Ghz frequency point on S (1,2) curve of low-pass filter 5 in figure The reading of (being marked as m1) be -0.345dB, and S (1, the 2) curve of conventional lowpass filter the frequency point reading be - 0.56dB, that is to say, that on this frequency point, low-pass filter 5 reduces the loss of 0.225dB;The S of low-pass filter 5 in figure The reading of 3.6Ghz frequency point (being marked as m2) is -0.32dB on (1,2) curve, and S (1,2) curve of conventional lowpass filter It is -0.61dB in the reading of the frequency point, that is to say, that on this frequency point, low-pass filter 5 reduces the loss of 0.29dB;From It is found that in this passband (3.4GHz-3.6GHz), the loss of low-pass filter 5 is respectively less than conventional filter for observation in figure Loss, and loss difference is substantially all in 0.2dB or more.
In some alternative embodiments, the quantity of strip line sublayer is more than two layers, and then in these embodiments may It may require that more than one layer Intermediate substrate 2, for example, a kind of optional mode is in upper substrate 1 if including quadriply belt shape line sublayer Inner surface etch one layer of strip line sublayer, and one layer of strip line sublayer is etched on lower substrate inner surface, when compacting then It needs to additionally incorporate two layers of semi-solid preparation layer and is spaced one from intermediate base layer 3 with upper and lower substrates.
And for the ease of connecting via hole 23 between setting sublayer, in particularly preferred embodiment, using multiple intermediate base layers 3, If it is even level strip line sublayer, then the two-sided etching of each intermediate base layer 3 then the last layer or is most opened if it is odd-level Beginning, only single side etches one layer of intermediate base layer 3, the two-sided etching of remaining intermediate base layer 3, intermediate base layer 3 two-by-two between also need insertion half solid Change layer to be bonded together all intermediate base layers 3 in compacting, and plays the role of separating each strip line sublayer.All Intermediate base layer 3 connects via hole 23 between the sublayer that disposable setting connects all sublayers after being bonded together, and is finally by bonding again Multiple intermediate base layers 3 of one are put into compression moulding between upper and lower substrates.Strip line sublayer can be according to design in the utility model Demand voluntarily selects, and more strip line sublayer further decreases energy loss naturally, but need simultaneously technology difficulty and at It makes sacrifices on this.
It is worth noting that, each strip line sublayer in low-pass filter disclosed by the utility model need not have to complete one It causes, in certain embodiments, the stripline resonator circuit in low-pass filter only partially uses use disclosed by the utility model In the strip lines configuration of low-pass filter, i.e., certain strip line sublayers are not covered by the whole of stripline resonator circuit, and only It is only to cover band a part of required stripline resonator circuit, it can according further to technical idea disclosed by the utility model To know, the two-dimensional of each strip line sublayer also need not be completely the same, as long as meeting the relationship of uniform zoom, some strip line sublayers Than other " little Yi Quan ", moreover it is possible to it is single to arrive better decreasing loss effect, certainly cannot be too small, in the big strip line sublayer covering of area Under the premise of the small strip line sublayer of area, each strip line sublayer at pattern outer edge two-by-two between distance be maintained at 0.05 Between~0.2mm, to reach optimal decreasing loss effect.
As shown in Fig. 2, the present embodiment also discloses a kind of communication device, the device include above-mentioned low-pass filter 5 with And a dielectric waveguide filter 4, the dielectric waveguide filter 4 use ceramic dielectric.Specifically, low-pass filter 5 also collects At signal input interface, third pad 12 passes through the strip line in low-pass filter 5 in the signal input interface and figure Connection, third pad 12 are then connect with the input port of dielectric waveguide filter 4 by probe 6, dielectric waveguide filter 4 it is defeated Outlet then passes through another probe 6 and connect with the second pad 11, and the signal for that will pass through dielectric filter filtering accesses low pass filtered Wave device 5, and pass through the signal that low-pass filter 5 filters and be output to and the welding of the first pad 31 through output signal via hole 25 again In route, i.e., signal conduction hole 25 be the communication device signal output end;The stub end insertion dielectric filter filtering of probe 6 Interior, small head end then passes through the hole insertion low pass filtered at the signal input through-hole 24 or 12 center of third pad at 11 center of the second pad In wave device 5, and the strip line be connected in dielectric waveguide filter 4 and low-pass filter 5 in the longitudinal direction (is inputted for connection signal The part of interface and the part for forming stripline resonator circuit).
The reduction of 5 power loss of low-pass filter, so that the surplus of filtering unit machine loss increases in design, thus The design difficulty of ceramic waveguide filter segment is reduced, ceramic waveguide filter segment is able to using smaller volume, not only The cost of ceramic filter is reduced, the miniaturization of equipment can also be further realized.Through utility model, people is calculated, utilizes this reality The power loss surplus brought by after novel can make the size of ceramic waveguide filter segment that can at most reduce 30%, right It is a significant progress for the miniaturization of filtering unit.
The utility model also protects a kind of communication system with above-mentioned communication device, which can be any one Kind need to use the radio-frequency system of above-mentioned communication device, such as aircraft, radar, base station, the radio-frequency system on satellite Deng.These radio-frequency systems can send and receive signal, and be filtered after receipt or before sending, so as to be received Or the signal meet demand sent, therefore radio-frequency system at least further includes connecting with the signal input part of above-mentioned communication device Signal emission module, the signal receiving module that is connect with the signal output end of above-mentioned communication device.
For example, base station as shown in Figure 4, base station includes duplexer, and duplexer includes transmitting band pass filter and collection of letters band Bandpass filter, the two are all made of communication device disclosed in the present embodiment.The input terminal of transmitting band pass filter connects sender, Output end connects antenna for base station;The input terminal of collection of letters bandpass filter connects antenna for base station, and output end connects receiver.Then for Transmitting band pass filter, signal emission module are sender, and signal receiving module is antenna for base station.And collection of letters band logical is filtered Wave device, signal emission module are antenna for base station, and signal receiving module is receiver.
In the base station of 5G communication system, large-scale antenna array technology is used, numerous antenna for base station is by with antenna The form of array integrates, and (transmits band to reduce wiring and the loss of transmission line bring, the duplexer of each antenna Bandpass filter and collection of letters bandpass filter) also integrate together;After the communication device in the present embodiment, the space saved can So that the aerial array is more compact, the space saved can also be used to that other assemblies to be installed, or do not changing original In the case where having size, the filtering loss of signal is reduced, to improve the performance of entire aerial array.
The above are merely the embodiments of the present invention, the common sense such as well known specific structure and characteristic are not made herein in scheme Excessive description, one skilled in the art know utility model technical field institute before the applying date or priority date Some ordinary technical knowledges can know the prior art all in the field, and have using conventional real before the date The ability of means is tested, one skilled in the art can improve simultaneously under the enlightenment that the application provides in conjunction with self-ability Implement this programme, some typical known features or known method should not become one skilled in the art and implement this The obstacle of application.It should be pointed out that for those skilled in the art, under the premise of not departing from the utility model structure, Several modifications and improvements can also be made, these also should be considered as the protection scope of the utility model, these all will not influence this The effect and patent practicability that utility model is implemented.This application claims protection scope should be with the content of its claim Standard, the records such as specific embodiment in specification can be used for explaining the content of claim.

Claims (10)

1. being used for the strip lines configuration of low-pass filter, it is characterised in that: be laminated and be parallel to each other including at least two layers longitudinal direction Strip line sublayer;Each strip line sublayer is formed by plane pattern and is consistent, the two-dimentional ruler of each strip line sublayer The very little relationship for uniform zoom, and the small strip line sublayer of area is completely in the coverage area of the big strip line sublayer of area It is interior;
It is filled with medium base between the strip line sublayer, and intercouples between the strip line sublayer.
2. the strip lines configuration according to claim 1 for low-pass filter, it is characterised in that: the strip line sublayer Via hole is connected between sublayer equipped with all strip line sublayers of vertical communication, connection via hole is metallized between the sublayer for hole wall Through-hole.
3. the strip lines configuration according to claim 2 for low-pass filter, it is characterised in that: connected between the sublayer Through-hole is uniformly distributed along the edge of the strip line sublayer.
4. the strip lines configuration according to claim 1 for low-pass filter, it is characterised in that: the strip line sublayer Quantity be two layers.
5. the strip lines configuration according to claim 1 for low-pass filter, it is characterised in that: each strip line Layer at the intermarginal distance in the outside of pattern between 0.05~0.2mm.
6. the strip lines configuration according to claim 1 for low-pass filter, it is characterised in that: the strip line sublayer Between spacing be 10-20mil.
7. low-pass filter, including medium substrate and the stripline resonator circuit being arranged in medium substrate, it is characterised in that: Some or all of described stripline resonator circuit is any band for low-pass filter in Claims 1 to 5 Shape cable architecture.
8. communication device, it is characterised in that: including low-pass filter described in dielectric waveguide filter and claim 7, institute It states dielectric waveguide filter and low-pass filter and successively contacts along the direction that signal inputs.
9. communication device according to claim 8, it is characterised in that: the dielectric waveguide filter is ceramic waveguide filtering Device.
10. communication system, which is characterized in that including communication device as claimed in claim 8, for receive/emit signal Filtering.
CN201920609834.0U 2019-04-28 2019-04-28 For the strip lines configuration of low-pass filter, low-pass filter, communication device and system Active CN209709141U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110011010A (en) * 2019-04-28 2019-07-12 重庆思睿创瓷电科技有限公司 For the strip lines configuration of low-pass filter, low-pass filter, communication device and system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110011010A (en) * 2019-04-28 2019-07-12 重庆思睿创瓷电科技有限公司 For the strip lines configuration of low-pass filter, low-pass filter, communication device and system
CN110011010B (en) * 2019-04-28 2024-05-10 重庆思睿创瓷电科技有限公司 Strip line structure for low-pass filter, communication device and system

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