JP3186018B2 - High frequency wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency wiring board having a signal line for transmitting a high-frequency signal of 5 to 10 GHz or more.

[0002]

2. Description of the Related Art With the recent increase in operating speed and frequency of semiconductor chips, high-frequency wiring boards for mounting semiconductor chips having signal lines for efficiently transmitting high-frequency signals with little transmission loss are required.

As a signal line used for the high-frequency wiring board, a signal line having a coplanar line structure with a ground and a signal line having a quasi-rectangular coaxial line structure are known.

A signal line having a coplanar line structure with a ground is, as shown in FIG. 13, a signal line 2 provided on an insulating substrate 10 made of ceramic or plastic or the like.
0 on both sides of the signal line 2
It is provided with 0 at a predetermined interval.

[0005] The ground pattern 30 is formed on the portion of the insulating substrate 10 above or below the signal line 20 and the ground pattern 30 (the lower surface of the insulating substrate 10 in the figure) in parallel with the signal line 20 and the ground pattern 30. It is electrically connected to grounds 50 arranged in layers through a plurality of columnar conductor vias 40. Specifically, a portion of the ground pattern 30 inside the end portion 30b of the ground pattern is electrically connected to the ground 50 via a plurality of conductor vias 40. The conductive via 40 is provided on the insulating substrate 10 directly below the ground pattern 30.
0 are vertically penetrated and a plurality of 0s are arranged side by side at a small pitch. The signal line 20 is formed as a coplanar line with ground.

A signal line having a quasi-rectangular coaxial line structure is
As shown in FIG. 14, the upper part of the signal line 20 provided on the insulating substrate 10 made of ceramic or plastic or the like, and the part of the insulating substrate 10 below the same (in the figure, the upper surface of the insulating substrate 10 and the lower surface thereof). , Ground pattern 30
Are widely arranged in layers in parallel with the signal line 20. A ground pattern 3 is formed above and below the signal line 20.
It is surrounded by 0.

The ground pattern 30 provided above and below the signal line 20 is different from the ground pattern 30 constituting the ground provided below and above the signal line 20.
They are electrically connected via a plurality of conductor vias 40. In other words, the ground patterns 30 provided above and below the signal line 20 are electrically connected to each other via a plurality of columnar conductor vias 40 provided side by side on both sides of the signal line 20. More specifically, the upper and lower ground patterns 3 inward from the end 30b of the ground pattern.
The zero portions are electrically connected to each other through a plurality of conductor vias 40. A plurality of conductive vias 40 are provided side by side at a small pitch on the insulating substrate 10 sandwiched between the upper and lower ground patterns 30 by vertically penetrating the insulating substrate 10. A plurality of conductor vias 4 are formed on both sides of the signal line 20.
It is surrounded by 0. The signal line 20 is formed as a pseudo-rectangular coaxial line.

In the signal line 20 having the grounded coplanar line structure or the quasi-rectangular coaxial line structure, the signal line 20 is electrically connected to the ground provided side by side at a small pitch on the insulating substrate 10 at the side of the signal line 20. The plurality of conductor vias 40 function to prevent a high frequency signal transmitted through the signal line 20 from passing through adjacent conductor vias 40 adjacent to the side of the signal line 20 and being mixed into another signal line 20. do.

Here, in order to prevent a high-frequency signal transmitted through the signal line 20 from passing between adjacent conductor vias 40 adjacent to the side of the signal line 20 and being mixed into another signal line 20,
As described in Japanese Patent Publication No. 5-86859, the pitch of the plurality of conductor vias 40 provided side by side on the insulating substrate 10 on the side of the signal line 20 is determined by the wavelength λ of the high-frequency signal transmitted to the signal line 20. It is known that the length should be shorter than that.

[0010]

However, in a wiring board having a signal line having a grounded coplanar line structure or a quasi-rectangular coaxial line structure, as described above, the wiring board is placed on the insulating substrate 10 on the side of the signal line 20 as described above. Even when the pitch of the plurality of conductor vias 40 arranged side by side is shorter than the wavelength λ of the high-frequency signal transmitted to the signal line 20, the high-frequency signal of 5 to 10 GHz or more is still sufficiently transmitted through the signal line 20 with little transmission loss and low efficiency I couldn't tell you well.

In pursuit of the cause, as shown in FIG. 13 or FIG. 14, in the signal line 20, the conductor via 40 constituting the ground is formed by connecting the ground pattern portion 30 a inside the end of the ground pattern 30 to the ground. Outside a ground pattern portion 30a electrically connected to the conductive via 40, and an end of a ground pattern called a stub (stub) 60 not directly electrically connected to the ground. 30b was found to be present because the stub 60 lowered the lowest resonance frequency value of the signal line 20. It has been found that the stub 60 prevents the transmission of the high-frequency signal to the signal line 20 with less transmission loss.

The reason is that, when the stub 60 exists at the end 30b of the ground pattern, the high-frequency signal transmitted to the signal line 20 leaks to the stub 60, and the stub 60
It is presumed that this is because it is mixed into the signal line 20 again through

[0013] The same thing as described above, as shown in FIG. 15, below or above a part of the signal line 20 provided on the insulating substrate 10 formed of ceramic or plastic or the like (in the figure, below). It has been found that the same can be applied to a wiring board in which a ground pattern 30 is locally arranged on the insulating substrate 10 sideways with respect to the signal line 20 and a characteristic impedance of a part of the signal line 20 is matched to a predetermined value. .

In this wiring board, the ground pattern 30 is connected to the insulating substrate 1 located on the side opposite to the signal line 20.
A portion 50 (shown as a lower surface of the insulating substrate 10 in the figure) is electrically connected to a ground 50 which is provided in a wide layer in parallel with the ground pattern 30 through a plurality of columnar conductor vias 40. Specifically, a portion of the ground pattern 30 inside the end portion 30b of the ground pattern is electrically connected to the ground 50 via a plurality of conductor vias 40. A plurality of conductive vias 40 are provided on the insulating substrate 10 immediately below the ground pattern 30 so as to be vertically arranged side by side. The characteristic impedance of a part of the signal line 20 is matched to a predetermined value such as 50Ω.

[0015] That is, even in such a wiring board, and are electrically connected via a plurality of conductive via 40 a ground pattern 30 portion of the inner from the end portion 30b of the ground pattern to ground 50, conductive via A ground pattern end 30b called a stub 60 exists outside the ground pattern portion 30a electrically connected to the signal line 40, and prevents the stub 60 from transmitting a high-frequency signal to the signal line 20 with a small transmission loss. There was found.

Heretofore, there has been known a wiring board in which the end 30b of the ground pattern is directly electrically connected to the ground 50, and the stub 60 is removed from the end 30b of the ground pattern.

In this wiring board, as shown in FIG. 16, a line 70 made of metallization or the like is provided on the end face of the insulating substrate 10, and the end 30b of the ground pattern is connected to the ground 50 or the ground via the line 70. Are electrically connected to the ground pattern 30 constituting Alternatively, as shown in FIG. 17, a half conductor via 80 formed by vertically dividing a columnar conductor via made of metallization or the like is provided at an end of the insulating substrate 10, and a ground pattern is provided via the half conductor via 80. Is electrically connected to the ground 50 or the ground pattern 30 constituting the ground.

However, in this wiring board,
A great deal of work and time is required for forming the line 70 made of metallized or the like on the end face of the insulating substrate 10 by a side printing method or forming the half conductor via 80 made of metallized or the like on the end of the insulating substrate 10. Cost me.

With recent miniaturization and high-density semiconductor devices, the above-mentioned line 70 is formed on the end face of the insulating substrate 10 side by side at a very small width or a very small pitch, and the above-mentioned half conductor via 80 is insulated. It is necessary to form them at the end of the substrate 10 side by side with a very small diameter and a very small pitch.
A large number of steps and skill are required for the work of forming the half-conductor via 80 and the half-conductor via 80, and the line 70 or the half-conductor via 80 may be electrically short-circuited to another line 70 or the half-conductor via 80 adjacent thereto. There was.

The inventors of the present invention have conducted various tests and studies and found that the length L of the stub 60 existing at the end 30b of the ground pattern is transmitted to the signal line 20 in each of the wiring boards. If the length is formed to be shorter than 1/4 of the wavelength λ of the signal, the adverse effect of the stub 60 existing at the end 30b of the ground pattern is eliminated, and the signal line 20 has a length of 5 mm.
It has been discovered that high-frequency signals such as 10 GHz or more can be transmitted efficiently with little transmission loss.

Based on the findings, a wiring board was developed in which the stub 60 existing at the end 30b of the ground pattern would not adversely affect the high-frequency signal transmitted to the signal line 20.

At the same time, the stub 60 which may adversely affect the high-frequency signal transmitted to the signal line 20 is eliminated from the end 30b of the ground pattern.
We have developed a wiring board that is easy to manufacture.

That is, an object of the present invention is to provide a high-frequency wiring board (hereinafter referred to as a wiring board) in which a stub existing at an end of a ground pattern does not adversely affect a high-frequency signal transmitted to a signal line. I have.

It is another object of the present invention to provide a wiring board in which a stub which may adversely affect a high-frequency signal transmitted to a signal line is removed from an end of a ground pattern, and which is easy to manufacture. .

[0025]

In order to achieve the above object, a first wiring board according to the present invention comprises a plurality of conductors provided on the insulating substrate, the ground pattern being provided alongside the signal lines on the insulating substrate. In a wiring board electrically connected to ground via a via, the end of the ground pattern is located inward from the end of the insulating substrate, and the end of the ground pattern is closest to the end. Distance L between the conductor via and the ground pattern electrically connected to the conductor via
Is 波長 of the wavelength λ of the high-frequency signal transmitted to the signal line.
It is characterized by being formed to less than zero.

The distance L between the end of the ground pattern and the ground pattern electrically connected to the conductor via closest to the end, that is, the length L of the stub, is transmitted to the signal line. By forming the stub shorter than １ ／ of the wavelength λ, the adverse effect of the stub on the high-frequency signal transmitted to the signal line is eliminated. Alternatively, the stub is removed from the end of the ground pattern. Then, a high-frequency signal can be transmitted to the signal line with a small transmission loss.

A second wiring board according to the present invention is a wiring board in which a ground pattern provided on an insulating substrate alongside signal lines is electrically connected to the ground via a plurality of conductor vias provided on the insulating substrate. In a wiring board having an end portion of the ground pattern extending to an end portion of the insulating substrate, a ground pattern electrically connected to the end portion of the ground pattern and the conductor via closest to the end portion. The distance L between the portion and the portion is formed to be less than 波長 of the wavelength λ of the high-frequency signal transmitted to the signal line and larger than zero.

Then, the distance L between the end of the ground pattern and the ground pattern portion electrically connected to the conductor via closest to the end, that is, the length L of the stub, is transmitted to the signal line. By forming the stub shorter than １ ／ of the wavelength λ, the adverse effect of the stub on the high-frequency signal transmitted to the signal line is eliminated. Then, a high-frequency signal can be transmitted to the signal line with a small transmission loss.

In the first or second wiring board of the present invention, the ground pattern forms a signal line as a coplanar line, or the ground pattern forms a signal line as a pseudo-rectangular coaxial line. The ground layer or the ground pattern is a local ground pattern for matching the characteristic impedance of a part of the signal line to a predetermined value.

Further, it is preferable that the ground has a structure in which the ground is opposed to the signal line and the ground pattern and is provided in a wide layer on the insulating substrate.

Further, it is preferable that the high-frequency signal transmitted to the signal line is prevented from leaking out of the ground by the wide layered ground. Further, it is preferable that the ground pattern can be electrically connected to a wide layered ground opposed thereto with a short distance and a small ground potential difference via a plurality of conductor vias.

[0032]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a preferred embodiment of the first wiring board of the present invention, and is a partial perspective view thereof.
Hereinafter, the first wiring board will be described.

In the first wiring board shown in the figure, a band-shaped ground pattern 30 provided on both sides of the signal line 20 is provided with an end 30b of the ground pattern for forming the signal line 20 into a coplanar line structure with ground. , Are located inward from the end 10a of the insulating substrate. Then, the end 30b of the ground pattern and the conductor via 4 closest to the end 30b.
0, that is, the length L of the stub 60, and the distance L between the ground pattern portion 30a electrically connected to the signal line 2
For example, the wavelength is formed to be less than 1/4 of the wavelength λ of the high-frequency signal transmitted to 0 or within a range of 0 to 1 / 8λ.

In other respects, the configuration is the same as that of the wiring board having the signal line having the coplanar line structure with the ground shown in FIG.
The stub 60 existing at the end 30b of the ground pattern can eliminate the adverse effect on the high-frequency signal transmitted to the signal line 20 and transmit a high-frequency signal of 5 to 10 GHz or more to the signal line 20 with a small transmission loss. Alternatively, the length L of the stub 60 existing at the end 30b of the ground pattern
Is zero, that is, the stub 60 is excluded from the end 30b of the ground pattern, and a high-frequency signal of 5 to 10 GHz or more can be transmitted to the signal line 20 with little transmission loss.

FIG. 2 shows a preferred embodiment of the second wiring board of the present invention, and is a partial perspective view thereof. Hereinafter, the second wiring board will be described.

In the illustrated wiring board, an end portion 30b of a strip-shaped ground pattern 30 provided on both sides of the signal line 20 for forming the signal line 20 into a coplanar line structure with a ground is used as an insulating substrate. End 1 of
0a. Then, a distance L between the end 30b of the ground pattern and the ground pattern portion 30a electrically connected to the conductor via 40 closest to the end,
That is, the length L of the stub 60 is formed to be less than １ ／ of the wavelength λ of the high-frequency signal transmitted to the signal line 20 and larger than zero, for example, λλ.

In other respects, the structure is the same as that of the wiring board having the signal line having the coplanar line structure shown in FIG. 13, and in the second wiring board, the stub existing at the end 30b of the ground pattern is provided. 60 is the signal line 20
A high-frequency signal of 5 to 10 GHz or more can be transmitted to the signal line 20 with a small transmission loss by eliminating an adverse effect on a high-frequency signal transmitted to the signal line 20.

FIG. 3 shows another preferred embodiment of the first wiring board of the present invention, and is a partial perspective view of the preferred embodiment.
Hereinafter, the first wiring board will be described.

In the first wiring board shown in the figure, there are ground patterns 30 provided above and below the signal line 20, and the ends of the ground pattern for forming the signal line 20 into a quasi-rectangular coaxial line structure. 30b is located inside the end 10a of the insulating substrate. Then, the distance L between the end 30b of the ground pattern and the ground pattern portion 30a electrically connected to the conductor via 40 closest to the end, that is, the length L of the stub 60 is transmitted to the signal line 20. The wavelength is formed, for example, at の λ within a range of less than ４ to zero of the wavelength λ of the high-frequency signal.

In other respects, the structure is the same as that of the wiring board having the signal line having the quasi-rectangular coaxial line structure shown in FIG. 14, and in this first wiring board, the wiring board exists at the end 30b of the ground pattern. Stub 60 is the signal line 2
It is possible to transmit a high-frequency signal of 5 to 10 GHz or more to the signal line 20 with a small transmission loss by eliminating an adverse effect on a high-frequency signal transmitted to zero. Alternatively, by removing the stub 60 from the end 30b of the ground pattern,
High frequency signals of 5 to 10 GHz or more can be transmitted with little transmission loss.

FIG. 4 shows another preferred embodiment of the second wiring board according to the present invention, and is a partial perspective view thereof.
Hereinafter, the second wiring board will be described.

In the wiring board shown in the figure, the ground pattern 30 provided above and below the signal line 20, and the end 30 b of the ground pattern for forming the signal line 20 into a pseudo-rectangular coaxial line structure, End 10a of insulating substrate
Has been extended. And the end 3 of the ground pattern
0b and the length L of the stub 60, that is, the length L of the stub 60, which is electrically connected to the conductor via 40 closest to the end, is equal to 1 of the wavelength λ of the high-frequency signal transmitted to the signal line 20. It is formed to be less than / 4 and larger than zero, for example, ８λ.

In other respects, the structure is the same as that of the wiring board having the signal line having the quasi-rectangular coaxial line structure shown in FIG. 14, and in the second wiring board, the wiring board is provided at the end 30b of the ground pattern. Stub 60 is the signal line 2
It is possible to transmit a high-frequency signal of 5 to 10 GHz or more to the signal line 20 with a small transmission loss by eliminating an adverse effect on a high-frequency signal transmitted to zero.

FIG. 5 shows another preferred embodiment of the first wiring board of the present invention, and is a partial side sectional view of the preferred embodiment. Hereinafter, the first wiring board will be described.

In the first wiring board shown in the figure, a part below the signal line 20 or above it (in the figure, below).
A ground pattern 30 which is provided side by side with respect to the signal line 20 on the portion of the insulating substrate 10 which is outside the ground pattern for matching the characteristic impedance of a part of the signal line 20 to a predetermined value. 30b
Are located more inward than the end 10a of the insulating substrate.
The distance L between the outer end 30b of the ground pattern and the ground pattern portion 30a electrically connected to the conductor via 40 closest to the end, that is, the outer end 30b of the ground pattern exists. Length L of stub 60
Is 高周波 of the wavelength λ of the high-frequency signal transmitted to the signal line 20.
For example, it is formed at 1 / 8λ within the range of less than or zero.

Further, the inner end 30 of the ground pattern
b is retracted inward of the ground pattern 30.
The distance L between the inner end 30b of the ground pattern and the ground pattern portion 30a electrically connected to the conductor via 40 closest to the end, that is, the inner end 30b of the ground pattern exists. Length L of stub 60
Is 高周波 of the wavelength λ of the high-frequency signal transmitted to the signal line 20.
For example, it is formed at 1 / 8λ within the range of less than or zero.

Other than the above, the signal line 2 shown in FIG.
A ground pattern 30 below or above a portion of the
Is locally provided, and is configured in the same manner as a wiring board in which the characteristic impedance of a part of the signal line 20 is matched to a predetermined value. In this first wiring board, the outer and inner ends of the ground pattern are provided. An adverse effect of the stub 60 existing in the portion 30b on the high-frequency signal transmitted to the signal line 20 can be eliminated, and a high-frequency signal of 5 to 10 GHz or more can be transmitted to the signal line 20 with a small transmission loss. Or, the end 30b outside or inside the ground pattern
The stub 60 is eliminated from the
High-frequency signals such as Hz or higher can be transmitted with little transmission loss.

FIG. 6 shows another preferred embodiment of the second wiring board according to the present invention, and is a partial side sectional view of the preferred embodiment. Hereinafter, the second wiring board will be described.

In the second wiring board shown in the figure, a portion below the signal line 20 or above it (in the figure, below).
A ground pattern 30 which is provided side by side with respect to the signal line 20 on the portion of the insulating substrate 10 which is outside the ground pattern for matching the characteristic impedance of a part of the signal line 20 to a predetermined value. 30b
Extends to the end 10a of the insulating substrate. And
The distance L between the outer end 30b of the ground pattern and the ground pattern portion 30a electrically connected to the conductor via 40 closest to the end, that is, the stub 60 existing at the outer end 30b of the ground pattern. Is less than 未 満 of the wavelength λ of the high-frequency signal transmitted to the signal line 20 and is greater than zero, for example, ８λ.

In other respects, the structure is the same as that of the first wiring board shown in FIG. 5, and in this wiring board, the stubs 60 existing outside the ground pattern and at the end 30b inside the ground pattern are connected to the signal line. A high-frequency signal of 5 to 10 GHz or more can be transmitted to the signal line 20 with little transmission loss by eliminating an adverse effect on the high-frequency signal transmitted to the signal line 20. Alternatively, by removing the stub 60 from the inner end 30b of the ground pattern, a high-frequency signal such as 5 to 10 GHz or more can be transmitted to the signal line 20 with little transmission loss.

According to the present invention, there is provided a wiring board in which a signal line is formed in a microstrip line structure by providing a ground pattern above or below the signal line, wherein the end portion of the ground pattern for forming the microstrip line is provided. The present invention can also be used for a wiring board in which the inner ground pattern portion is electrically connected to the ground via a plurality of conductor vias.

That is, in such a wiring board, the end of the ground pattern for forming the microstrip line provided above or below the signal line is located inside the end of the insulating substrate, and the ground pattern is formed. The distance L between the end of the ground pattern and the ground pattern electrically connected to the conductor via closest to the end, that is, the length L of the stub existing at the end of the ground pattern, is transmitted to the signal line. It may be formed to be less than １ ／ of the wavelength λ of the signal or zero. Or, a ground pattern for forming a microstrip line provided above or below the signal line,
The distance L between the end of the ground pattern extending to the end of the insulating substrate and the ground pattern electrically connected to the conductor via closest to the end, that is, the stub existing at the end of the ground pattern The length L may be less than １ ／ of the wavelength λ of the high-frequency signal transmitted to the signal line and greater than zero. Then, it is preferable to eliminate the adverse effect of the stub existing at the end of the ground pattern on the high-frequency signal transmitted to the signal line or to eliminate the stub from the end of the ground pattern.

The ground 50 is preferably provided in a wide layer on the insulating substrate 10 so as to face the signal line 20 and the ground pattern 30. It is preferable that the wide layered ground 50 can accurately prevent the high frequency signal transmitted to the signal line 20 from leaking out of the ground 50. Also, a plurality of conductive vias 4 are formed by connecting the ground pattern 30 to a wide layered ground 50 opposed thereto.
It is preferable that the connection can be made electrically short with a short distance via 0 and a small ground potential difference. Then, it is preferable that the ground pattern 30 can be accurately brought close to the ground potential.

[0054]

[Experimental Examples] FIGS. 8 to 12 show actually measured comparison data of high-frequency signal transmission characteristics of a signal line between a first wiring substrate of the present invention having a signal line having a coplanar line structure and a conventional wiring substrate. I have.

As shown in FIG. 7, the wiring board used to obtain these comparison data has a width of 0.2 mm provided on the upper surface of an insulating substrate (ε eff = 6) 10 made of alumina having a total length of 40 mm. On both sides of the band-shaped signal line 20 made of metallized, a band-shaped ground pattern 30 made of metallized having a width of 0.2 mm is formed between the inner edge of the ground pattern 30 and the side edge of the signal line 20 opposed thereto. They were arranged in parallel at a distance of 0.2 mm. The ground pattern 30 includes a plurality of conductive vias formed of metallized and horizontally arranged vertically on the insulating substrate 10 on a ground 50 formed of a metallized broadly arranged in parallel with the ground pattern 30 on the lower surface of the insulating substrate 10. 40 for electrical connection. And the signal line 20
Was regarded as a microstrip line, and its impedance was designed. Then, the characteristic impedance of the signal line 20 was matched to 50Ω.

FIG. 8 shows the ground pattern 3.
0 is electrically connected to a ground 50 via a plurality of conductor vias 40 arranged vertically on the insulating substrate 10 at a pitch of 5 mm, and stubs 60 are provided at both ends of the ground pattern 30. , Ie, the measured data of the transmission characteristics of the signal line 20 with the stub 60 having a length L of zero. It can be seen that the lowest resonance frequency value of this signal line 20 is around 12 GHz.

On the other hand, in the case shown in FIG. 9, the ground pattern 30 is
A signal line 20 electrically connected through a plurality of conductor vias 40 provided side by side vertically at an m pitch, and a stub 60 of 5 mm is provided at both ends of the ground pattern 30.
4 shows actual measurement data of the transmission characteristics of the signal line 20 having the following. In this signal line 20, the lowest resonance frequency value is 6
It turns out that it falls to around GHz.

FIG. 10 shows a signal line in which a ground pattern 30 is electrically connected to a ground 50 via a plurality of conductor vias 40 which are horizontally arranged on the insulating substrate 10 vertically at a pitch of 10 mm. 20 shows measured data of transmission characteristics of the signal line 20 having no stubs 60 at both ends of the ground pattern 30. It can be seen that the lowest resonance frequency value of this signal line 20 is around 6 GHz.

On the other hand, the one shown in FIG.
Transmission of the signal line 20 electrically connected via a plurality of conductor vias 40 arranged side by side up and down at a pitch of mm, and having a 10 mm stub 60 at both ends of the ground pattern 30. 9 shows measured data of characteristics. In this signal line 20, it can be seen that the lowest resonance frequency value drops to around 3 GHz.

FIG. 12 shows the relationship between the length L of the stub 60 (ground connection drop) and the lowest resonance frequency value of the signal line 20 in the wiring board shown in FIG. The relationship between the via pitch P of the plurality of conductor vias 40 provided and the lowest resonance frequency value of the signal line 20 is shown. According to this figure,
It can be seen that the shorter the length L of the stub 60 is, the higher the minimum resonance frequency value of the signal line 20 is.

[0061]

As described above, according to the first wiring board of the present invention, it is possible to eliminate the adverse effect of the stub existing at the end of the ground pattern on the high-frequency signal transmitted to the signal line, and to reduce the influence on the signal line. High-frequency signals of 5 to 10 GHz or more can be transmitted efficiently with little transmission loss. Or
By removing the stub from the end of the ground pattern, a high-frequency signal of 5 to 10 GHz or more can be efficiently transmitted to the signal line with little transmission loss.

According to the first wiring board of the present invention, since the end of the ground pattern is located inside the end of the insulating substrate, the ceramic green sheet for forming the insulating substrate is cut when manufacturing the same. In addition, it is possible to eliminate the need to simultaneously cut the metallized pattern for forming the ground pattern formed on the surface of the ceramic green sheet. Since the ceramic green sheet and the metallized pattern for forming the ground pattern are cut at the same time, it is possible to prevent a part of the metallized pattern from dropping into the cut surface of the ceramic green sheet.

According to the second wiring board of the present invention, the adverse effect of the stub existing at the end of the ground pattern on the high-frequency signal transmitted to the signal line is eliminated, and the signal line has five to five lines.
High-frequency signals such as 10 GHz or more can be transmitted efficiently with little transmission loss.

According to the first or second wiring board of the present invention, in order to improve the high-frequency characteristics of the signal line, a line or a half conductor via for electrically connecting the end of the ground pattern to the ground is provided. There is no need to provide an end face of the insulating substrate or an end portion of the insulating substrate, and a wiring board having a signal line with good high-frequency characteristics can be easily manufactured without trouble.

[Brief description of the drawings]

FIG. 1 is a partial perspective view of a first wiring board of the present invention.

FIG. 2 is a partial perspective view of a second wiring board according to the present invention.

FIG. 3 is a partial perspective view of a first wiring board of the present invention.

FIG. 4 is a partial perspective view of a second wiring board according to the present invention.

FIG. 5 is a partial side sectional view of the first wiring board of the present invention.

FIG. 6 is a partial side sectional view of a second wiring board according to the present invention.

FIG. 7 is a plan view of a wiring board.

8 is a transmission characteristic data diagram of the wiring board of FIG. 7;

FIG. 9 is a transmission characteristic data diagram of the wiring board of FIG. 7;

FIG. 10 is a transmission characteristic data diagram of the wiring board of FIG. 7;

FIG. 11 is a transmission characteristic data diagram of the wiring board of FIG. 7;

FIG. 12 is a data diagram of a lowest resonance frequency value of a signal line of the wiring board of FIG. 7;

FIG. 13 is a partial perspective view of a conventional wiring board.

FIG. 14 is a partial perspective view of a conventional wiring board.

FIG. 15 is a partial side sectional view of a conventional wiring board.

FIG. 16 is a partial perspective view of a conventional wiring board.

FIG. 17 is a partial perspective view of a conventional wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Insulating board 20 Signal line 30 Ground pattern 30a Ground pattern part 30b End of ground pattern 40 Conductor via 50 Ground 60 Stub 70 Line 80 Half conductor via

──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-60-240186 (JP, A) JP-A-7-99397 (JP, A) JP-A-5-1022693 (JP, A) JP-A 64-64 84689 (JP, A) Jikaichi Sho 51-6062 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 1/02 H01P 3/02 JICST file (JOIS)

Claims (6)

(57) [Claims] An end portion of the ground pattern in a wiring board in which a ground pattern provided on an insulating substrate and arranged alongside signal lines is electrically connected to ground via a plurality of conductor vias provided on the insulating substrate. Is positioned more inward than the end of the insulating substrate, and the distance L between the end of the ground pattern and the ground pattern portion electrically connected to the conductor via closest to the end, A high-frequency wiring board formed to be less than 1/4 or less than the wavelength λ of a high-frequency signal transmitted to a signal line. 2. A wiring board electrically connected to a ground via a plurality of conductor vias provided on the insulating substrate, the ground pattern being provided on the insulating substrate alongside the signal lines. In a wiring board having an end extending to the end of the insulating substrate, a distance L between an end of the ground pattern and a ground pattern portion electrically connected to the conductor via closest to the end is defined as A high-frequency wiring board formed to be less than １ ／ of the wavelength λ of the high-frequency signal transmitted to the signal line and larger than zero. 3. A ground line for forming a signal line on a coplanar line.
Or the high-frequency wiring board according to 2. 4. The ground pattern for forming a signal line into a pseudo-rectangular coaxial line according to claim 1.
Or the high-frequency wiring board according to 2. 5. The high-frequency wiring board according to claim 1, wherein the ground pattern is a local ground pattern for matching a characteristic impedance of a part of the signal line to a predetermined value. 6. The high-frequency wiring board according to claim 1, wherein the ground is provided in a wide layer on the insulating substrate so as to face the signal line and the ground pattern.