CN116116788A - Brush head mechanism, scrubber swing arm and semiconductor device - Google Patents
Brush head mechanism, scrubber swing arm and semiconductor device Download PDFInfo
- Publication number
- CN116116788A CN116116788A CN202310349373.9A CN202310349373A CN116116788A CN 116116788 A CN116116788 A CN 116116788A CN 202310349373 A CN202310349373 A CN 202310349373A CN 116116788 A CN116116788 A CN 116116788A
- Authority
- CN
- China
- Prior art keywords
- driving shaft
- brush head
- driving
- wafer
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007246 mechanism Effects 0.000 title claims abstract description 41
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 230000005540 biological transmission Effects 0.000 claims description 41
- 230000008093 supporting effect Effects 0.000 claims description 13
- 230000006698 induction Effects 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 52
- 235000012431 wafers Nutrition 0.000 description 115
- 238000000034 method Methods 0.000 description 33
- 230000008569 process Effects 0.000 description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 230000006872 improvement Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 230000003044 adaptive effect Effects 0.000 description 4
- 230000009194 climbing Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000005381 potential energy Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Abstract
The invention provides a brush head mechanism, a scrubber swing arm and semiconductor equipment, wherein the brush head mechanism comprises: the brush comprises a base, a pivoting assembly arranged on the base, a brush head formed at one end of the pivoting assembly extending axially out of the base, a driving assembly arranged on the base and used for driving the pivoting assembly to drive the brush head to rotate, and an adjusting assembly used for adjusting the distance between the bottom surface of the brush head and the surface of a wafer; the pivot assembly includes: a drive shaft connected to the brush head; the adjustment assembly includes: the connecting block is movably connected with the driving shaft, the counterweight unit is assembled on the connecting block and used for applying axial force to the driving shaft, and the elastic unit is axially sleeved on the driving shaft. Through this application, realized carrying out adaptability lift adjustment to the drive shaft automatically to improve the cleaning efficiency to the wafer.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a brush head mechanism, a scrubber swing arm and semiconductor equipment.
Background
In the semiconductor process, the wafer cleaning process is an important process step, and ultrafine particle contaminants, metal residues, organic residues and the like adhering to the wafer during the wafer processing process are generally removed by a wafer cleaning machine, and impurities remained on the wafer surface need to be effectively removed by using a chemical solution or gas without damaging the surface characteristics and electrical characteristics of the wafer. In order to improve the wafer cleaning efficiency, the brush wafer type wafer cleaning machine in the prior art sprays liquid medicine on the surface of a wafer through a liquid medicine spray head of the wafer cleaning equipment, and then the wafer is brushed by adopting a brush head.
The Chinese patent with the publication number of CN115106315B discloses a brush head mechanism of a brush wafer cleaning machine, which comprises a brush head body and a swing arm mechanism for driving the brush head body to lift, wherein the swing arm mechanism comprises a driving component, a connecting rod component and a shell, the driving component is connected with one end of the connecting rod component distributed along the length direction of the shell and drives the connecting rod component to pivot perpendicular to a rotating surface formed by the shell, and the other end of the connecting rod component far away from the driving component is connected with the brush head body; the brush head body comprises a base connected with the connecting rod assembly and a brush extending from the lower surface of the base, the bottom surface of the brush is always parallel to the plane where the wafer is located in the motion process of the base along with the connecting rod assembly, a gap is formed between the bottom surface of the brush and the wafer, and the distance between the bottom surface of the brush and the surface of the wafer is kept constant in the cleaning process.
However, due to the inconsistent wafer specifications, the wafer warp curvature is also inconsistent and there may be positive and negative warpage of the wafer. According to the brush in the wafer cleaning machine, in the process of cleaning the surface of the wafer, when the brush moves to the position of positive warp of the wafer, a cleaning acting force generated by a gas film or a water film formed between the brush and the wafer can have an upward lifting effect on the brush, so that the brush head and the driving shaft can gradually move upwards under the influence of the acting force, and when the brush moves to the position of negative warp of the wafer, the bottom surface of the brush can be far away from the negative warp of the wafer, although the lifting cylinder can lift and adjust the driving shaft, the distance between the bottom surface of the brush and the surface of the wafer (namely, the surface of the wafer and the positive/negative warp of the wafer) is kept constant, but the lifting cylinder is required to lift and lower the driving shaft frequently in the adjusting process, so that the time for cleaning operation of keeping constant distance between the brush and the surface of the wafer is increased, the cleaning efficiency is reduced, the abrasion loss of the lifting cylinder is increased, and the service life is shortened.
In view of the foregoing, there is a need for an improved brush head mechanism in the art that addresses the above-described problems.
Disclosure of Invention
The invention aims to disclose a brush head mechanism, a scrubber swing arm and semiconductor equipment, which are used for solving a plurality of defects of the brush head mechanism in the prior art, and particularly for realizing automatic adaptive lifting adjustment of a driving shaft so as to improve the cleaning efficiency of a wafer.
To achieve one of the above objects, the present invention provides a brush head mechanism comprising: the brush comprises a base, a pivoting assembly arranged on the base, a brush head formed at one end of the pivoting assembly extending axially out of the base, a driving assembly arranged on the base and used for driving the pivoting assembly to drive the brush head to rotate, and an adjusting assembly used for adjusting the distance between the bottom surface of the brush head and the surface of a wafer;
the pivot assembly includes: a drive shaft connected to the brush head;
the adjustment assembly includes: the connecting block is movably connected with the driving shaft, the counterweight unit is assembled on the connecting block and used for applying axial force to the driving shaft, and the elastic unit is axially sleeved on the driving shaft.
As a further improvement of the present invention, the counterweight unit includes:
the hanging piece is movably connected with a plurality of balancing weights of the hanging piece, and locking pieces are used for fixing the balancing weights to the hanging piece;
the amount of the balancing weight on the hanging piece is adjusted to control the axial force applied by the connecting block to the driving shaft.
As a further improvement of the present invention, the adjusting assembly further includes:
the support plate is formed on the base, the support plate is configured with a longitudinally arranged slide rail, a sliding block longitudinally slides along the slide rail and is connected with the connecting block, the connecting block moves up and down along the support plate through the sliding block, and a sensor for detecting the lifting height of the connecting block.
As a further improvement of the present invention, the adjusting assembly further includes:
and the limiting piece longitudinally penetrates through the sliding block and partially extends into the supporting plate, and the limiting piece radially outwards extends to form at least one group of limiting parts for limiting the movable range of the connecting block.
As a further improvement of the present invention, the elastic unit includes:
the mounting seat is fixedly arranged on the elastic piece of the mounting seat, and the mounting cover is axially arranged at one end, far away from the mounting seat, of the elastic piece, and the mounting cover is fixedly connected with the driving shaft.
As a further improvement of the present invention, the pivot assembly includes:
the fixed seat axially penetrates through the fixed seat and is sleeved on the transmission cylinder of the driving shaft, the driven wheel is sleeved on a transmission section formed by the axial extension of the transmission cylinder, the transmission block is coaxially sleeved on the driving shaft and circumferentially abutted against the inner wall of the transmission cylinder, and the plurality of groups of first bearings are sleeved on the transmission cylinder and circumferentially abutted against the fixed seat and/or the base.
As a further improvement of the present invention, the driving assembly includes:
the driving belt comprises a first driving motor, a driving wheel arranged at the driving end of the first driving motor and a belt connecting the driving wheel and the driven wheel.
As a further improvement of the present invention, the drive shaft includes:
the driving section is connected with the mounting cover and the transmission block, and the rotating end is formed by extending the driving section upwards in the axial direction and is rotationally connected with the connecting block;
the transmission cylinder drives the driving section to axially rotate through the transmission block.
Based on the same thought, in order to achieve another object, the invention also discloses a swinging arm of the brushing machine, which comprises the following components: the brush head mechanism comprises a lifting unit, a driving shaft driven by the lifting unit to lift, a swinging assembly used for driving the driving shaft to rotate, and a receiving assembly nested in the driving shaft and provided with the brush head mechanism disclosed by any one of the invention.
As a further improvement of the invention, the driving end of the lifting unit forms a movable plate, a movable block which is arranged on the movable plate and is rotationally connected with the driving shaft, and a limiting block which is arranged on the movable block;
the driving shaft is concavely arranged inwards in the radial direction to form an inner concave part, and the limiting block at least partially extends into the inner concave part.
As a further improvement of the present invention, the scrubber swing arm further includes:
the driving shaft drives the induction block to rotate, and the induction block detects the rotation range of the driving shaft.
As a further improvement of the present invention, the swing assembly includes:
the second driving motor is arranged on the first rotating wheel of the second driving motor, sleeved on the supporting cylinder of the driving shaft, coaxially sleeved on the driving shaft and longitudinally arranged on the top end of the supporting cylinder, sleeved on the driving shaft and longitudinally abutted against the second rotating wheel of the second bearing, and a transmission belt for connecting the first rotating wheel and the second rotating wheel;
the driving shaft is provided with a plurality of limiting grooves in a concave mode on the peripheral surface, the limiting grooves are longitudinally distributed, and the second rotating wheel is provided with a transmission part protruding inwards in a radial mode, and the transmission part extends into the limiting grooves.
As a further improvement of the present invention, the receiving assembly includes:
the brush head mechanism comprises a cover, a cover shell, a cover seat, a cover support, a connecting tube, a support joint, a shoulder swinging plate, a telescopic cover and a base, wherein the cover shell is arranged on the swinging assembly and penetrated by the driving shaft, the cover seat is arranged on the cover shell and sleeved on the driving shaft, the cover seat is nested in the cover seat and is in rotary connection with the cover seat, the driving shaft longitudinally extends out of one end of the connecting tube to be fixedly connected with the support joint, the shoulder swinging plate is arranged on the support joint, the telescopic cover is arranged around the connecting tube and is connected with the shoulder swinging plate, and the cover is arranged on the base and is covered on the brush head mechanism.
Based on the same inventive idea, to achieve another object, the invention also discloses a semiconductor device comprising: at least one scrubber swing arm as disclosed in any one of the foregoing inventions.
Compared with the prior art, the invention has the beneficial effects that:
the driving shaft is automatically adjusted in an adaptive lifting manner through the counterweight unit, the elastic unit and other parts, so that a gap with constant distance between the bottom surface of the brush head and the surface of the wafer is kept in the cleaning process, the cleaning process is more stable, the situation that a water film or an air film is damaged due to the fact that the distance between the brush head and the wafer is too far or too near can be avoided, the adjusting speed is faster and more stable, the cleaning efficiency of the wafer is improved, and the adjusting precision is high.
Drawings
FIG. 1 is a perspective view of a brush head mechanism of the present invention;
FIG. 2 is a perspective view of another view of the brush head mechanism;
FIG. 3 is a cross-sectional view of the drive shaft coupled to the drive cylinder;
FIG. 4 is a cross-sectional view of the drive block coupled to the drive section;
FIG. 5 is a cross-sectional view of the attachment of the anchor block to the base;
FIG. 6 is a perspective view of a swing arm of a scrubber incorporating a brush head mechanism in accordance with the present invention;
FIG. 7 is a perspective view of the drive shaft and stopper connection;
fig. 8 is a perspective view of the connection of the second drive motor to the first pulley, with the cover omitted;
fig. 9 is a cross-sectional view of the connection of the drive shaft to the telescoping shield.
Description of the embodiments
The present invention will be described in detail below with reference to the embodiments shown in the drawings, but it should be understood that the embodiments are not limited to the present invention, and functional, method, or structural equivalents and alternatives according to the embodiments are within the scope of protection of the present invention by those skilled in the art.
It should be understood that, in the present application, the terms "center", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "radial", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present technical solution and simplifying the description, and do not indicate or imply that the indicated devices or elements must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present technical solution.
In particular, in the following embodiments, the term "axial direction" refers to the direction indicated by the central axis Q in fig. 3. The term "longitudinal" refers to a direction parallel to the axial direction.
One embodiment of a brush head mechanism, scrubber swing arm, and semiconductor device is disclosed with reference to fig. 1-9.
Referring to fig. 1 to 3, in the present embodiment, the brush head mechanism 100 includes: the brush head comprises a base 11, a pivoting assembly 12 arranged on the base 11, a brush head 13 formed at one end of the pivoting assembly 12 extending axially out of the base 11, a driving assembly 14 for driving the pivoting assembly 12 to drive the brush head 13 to rotate, and an adjusting assembly 15 for adjusting the distance between the bottom surface of the brush head 13 and the surface of the wafer, wherein the base 11 is provided with a plurality of grooves; the pivot assembly 12 includes: a drive shaft 120 connected to the brush head 13; the adjustment assembly 15 includes: the coupling block 151 movably coupled to the driving shaft 120, the weight unit 152 assembled to the coupling block 151 and used for applying an axial force to the driving shaft 120, and the elastic unit 153 axially sleeved on the driving shaft 120. The engagement blocks 151 may form a rotational connection with the drive shaft 120 via bearings. Because the wafer specifications are inconsistent, the wafer warpage curvature is inconsistent, and positive warpage and negative warpage may exist on the wafer, so before the brush head 13 cleans the wafer, the connecting block 151 can apply an axial acting force to the driving shaft 120 through the weight of the counterweight unit 152, so that the driving shaft 120 is pressed downwards to enable the driving shaft 120 to move downwards, the elastic unit 153 is compressed, the driving shaft 120 synchronously drives the brush head 13 to move downwards, the bottom surface of the brush head 13 keeps the closest distance with the lowest part of the negative warpage part of the wafer, and a gap is formed between the bottom surface of the brush head 13 and the lowest part of the negative warpage part of the wafer, so that an air film or a water film for cleaning the wafer is formed between the brush head 13 and the wafer, and the cleaning effect is improved. In the process of cleaning the wafer by the brush head 13, a gap with constant distance is always reserved between the bottom surface of the brush head 13 and the surface of the wafer. The driving component 14 drives the brush head 13 to rotate through driving the pivoting component 12, so that an air film or a water film for cleaning the wafer is formed between the brush head 13 and the wafer, and the surface of the wafer is cleaned through the air film or the water film, so that the brush head 13 is prevented from being worn due to direct contact with the wafer.
In the process of cleaning the surface of the wafer by the brush head 13, when the brush head 13 moves from the wafer plane part to the part with positive warp of the wafer or from the part with negative warp of the wafer to the wafer plane part, the cleaning acting force generated by the air film or the water film formed between the brush head 13 and the wafer can exert an upward lifting effect on the brush head 13, so that the brush head 13 drives the driving shaft 120 to move upwards synchronously along the axial direction and drives the elastic unit 153 to stretch, the elastic potential energy accumulated by the elastic unit 153 is released to form an elastic acting force, the action of auxiliary lifting on the driving shaft 120 can be exerted by the elastic acting force, so that the cleaning acting force generated by the air film or the water film and the elastic acting force formed by the elastic unit 153 can enable the driving shaft 120 to automatically move upwards gradually, so that the brush head 13 is in a climbing state (namely, the cleaning state from the wafer plane part with positive warp of the wafer or from the part with negative warp of the wafer to the wafer plane part) in the cleaning state, and in the climbing state, the clearance between the bottom surface of the brush head 13 and the surface can be kept constant in the climbing state; when the brush head 13 moves from the wafer plane part to the part with negative warp of the wafer or from the part with positive warp of the wafer to the wafer plane part, the cleaning force generated by the air film or the water film will not have an upward lifting effect on the brush head 13, meanwhile, the weight of the counterweight unit 152 will drive the connecting block 151 to apply an axial force on the driving shaft 120, automatically press the driving shaft 120 to make the driving shaft 120 move downwards, and synchronously drive the brush head 13 to move downwards gradually, and compress the elastic unit 153, so that the brush head 13 is in a descending state (i.e. a cleaning state from the wafer plane part to the part with negative warp of the wafer or from the part with positive warp of the wafer to the wafer plane part) during cleaning, and in this descending state, the bottom surface of the brush head 13 can keep a constant gap with the wafer surface.
Compared with the effect that the distance between the bottom surface of the brush and the surface of the wafer is kept constant in the cleaning process by the lifting cylinder which is realized by lifting and adjusting the driving shaft in the prior art, the effect that the distance between the bottom surface of the brush and the surface of the wafer is kept constant in the cleaning process by the brush head 13 which is realized by the counterweight unit 152, the elastic unit 153 and other parts is realized by the lifting cylinder, the lifting cylinder in the prior art needs to frequently lift the driving shaft according to the change of the lifting amplitude of the brush head 13 in the cleaning process so as to keep the distance between the bottom surface of the brush and the surface of the wafer constant in the cleaning process, thereby increasing the time consumption of the cleaning operation that the distance between the bottom surface of the brush and the surface of the wafer is kept constant in the process that the lifting cylinder acquires the lifting amplitude data of the brush head 13 in the cleaning process and then carries out the lifting and adjusting on the driving shaft, reducing the cleaning efficiency of the wafer, and the lifting cylinder is frequently driven to lift the driving shaft, increasing the abrasion loss of the lifting cylinder and reducing the service life. However, the brush head mechanism 100 omits the lifting cylinder, and for the change of the lifting amplitude of the brush head 13 in the cleaning process, the driving shaft 120 can be automatically subjected to adaptive lifting adjustment through the components such as the counterweight unit 152 and the elastic unit 153, so that a gap with constant distance between the bottom surface of the brush head 13 and the surface of the wafer in the cleaning process is realized, the cleaning process is more stable, the condition that a water film or an air film is damaged due to the fact that the distance between the brush head 13 and the wafer is too far and too close can be avoided, and compared with the lifting cylinder in the prior art, the lifting cylinder has a faster and more stable adjustment speed, so that the cleaning efficiency of the wafer is improved, and the adjustment precision is higher than that of the lifting cylinder.
The positive warp and the negative warp in this embodiment are defined based on the wafer with the front side facing upward. The positive warp and the negative warp are defined by the relative positions of the edge of the wafer and the horizontal plane where the center of the circle is located. The forward warping means that the edge of the wafer is positioned above the plane where the circle center is positioned, so as to form concave deformation; negative warpage means that the edge of the wafer is located below the plane of the center of the circle, forming convex deformation. The wafer plane part refers to a part located on the plane of the wafer center.
As shown in fig. 1 to 3, the weight unit 152 includes: the hanging piece 1521 is movably connected with a plurality of balancing weights 1522 of the hanging piece 1521, and a locking piece 1523 for fixing the balancing weights 1522 on the hanging piece 1521; the amount of axial force exerted by the engagement block 151 on the drive shaft 120 is controlled by adjusting the amount of weight 1522 on the catch 1521. It should be noted that, the hanging piece 1521 may be configured as a bolt with at least a part of a threaded structure, the locking piece 1523 may be configured as a nut that forms a threaded fit with the hanging piece 1521, so that the locking piece 1523 can vertically support the counterweight 1522 movably connected to the hanging piece 1521 on the connecting block 151, and the locking piece 1523 only needs to fix the counterweight 1522, so as to prevent the stability of lifting of the connecting block 151 from being affected due to shaking of the counterweight 1522 on the hanging piece 1521 during lifting of the connecting block 151, and avoid affecting the accuracy of adaptive lifting adjustment of the driving shaft 120 by the counterweight unit 152, the elastic unit 153, and other components. Because the wafer specifications are inconsistent, the wafer warpage curvature is inconsistent, the wafers with the same specification and the same warpage curvature can be set into a group according to the batch, before the brush head 13 cleans the wafers, the axial force applied by the connecting block 151 to the driving shaft 120 is controlled by adjusting the number of the balancing weights 1522 on the hanging pieces 1521, so that the bottom surface of the brush head 13 keeps the closest distance with the wafer surface and a gap is formed between the bottom surface of the brush head 13 and the wafer surface, and a gas film or a water film for cleaning the wafers is formed between the brush head 13 and the wafers, so that the cleaning effect is improved.
As shown in fig. 2, 3 and 5, the adjusting assembly 15 further includes: a support plate 150 formed at the base 11, the support plate 150 being configured with a slide rail 1501 disposed longitudinally, a slider 1502 sliding longitudinally along the slide rail 1501 and connecting the engagement block 151, the engagement block 151 being moved up and down along the support plate 150 by the slider 1502, and a sensor 155 for detecting an up-down height of the engagement block 151. The sensor 155 is disposed below the engagement block 151, and the sensor 155 forms a gap J with the lower surface of the engagement block 151. When the driving shaft 120 is influenced by the cleaning force generated by the air film or the water film and the elastic force formed by the elastic unit 153 to drive the engagement block 151 to gradually move upwards, the engagement block 151 synchronously drives the sliding block 1502 to longitudinally move upwards along the sliding rail 1501, and when the counterweight unit 152 applies the axial force to the driving shaft 120 through the engagement block 151, the counterweight unit 152 drives the engagement block 151 to downwardly move, and the engagement block 151 synchronously drives the sliding block 1502 to longitudinally move downwards along the sliding rail 1501; the longitudinal sliding of the sliding block 1502 on the sliding rail 1501 can play a guiding and limiting role on the connecting block 151 so as to prevent the connecting block 151 from synchronously rotating along with the driving shaft 120, and the connecting block 151 can play a rotating supporting effect on the driving shaft 120 so as to improve the rotating stability of the driving shaft 120. In addition, the size of the gap J (as shown in fig. 5) can be detected by the sensor 155 during the lifting of the engagement block 151; before the brush head 13 cleans the wafer, the height position of the brush head 13 needs to be adjusted according to wafers (i.e. wafers with the same specification and the same warp curvature) of different batches, so that the bottom surface of the brush head 13 can keep the closest distance with the lowest position of the wafer negative warp position, firstly, the number of the balancing weights 1522 on the hanging piece 1521 is adjusted, the connecting blocks 151 can be driven to move downwards along the supporting plate 150 through the weight of the balancing weights 1522 so as to apply axial force to the driving shaft 120 to press the driving shaft 120 downwards, meanwhile, the lower surface of the connecting blocks 151 is close to the sensor 155, the size of the gap J is detected through the sensor 155, the distance between the bottom surface of the brush head 13 and the lowest position of the wafer negative warp position is obtained, and then the number of the balancing weights 1522 is adjusted according to the actual requirement until the bottom surface of the brush head 13 can keep the closest distance with the lowest position of the wafer negative warp position and form a gap, so that a gas film or a water film for cleaning the wafer can be compressed to the greatest extent, and the cleaning effect is improved.
As shown in fig. 2 and 3, the adjusting assembly 15 further includes: a stop 154 extending longitudinally through the slider 1502 and partially into the support plate 150; the stopper 154 extends radially outwardly to form at least one set of stoppers 1541 for limiting the movable range of the engagement block 151. The spacing member 154 can play a role in guiding and spacing the connecting block 151 in the lifting process along the supporting plate 150, so as to improve the stability of the connecting block 151 in lifting along the supporting plate 150, and the spacing portion 1541 can prevent the lifting distance of the sliding block 1502 from being too large, thereby affecting the distance between the bottom surface of the brush head 13 and the surface of the wafer, resulting in difficulty in forming a constant gap, and preventing the sliding block 1502 from slipping on the sliding rail 1501 or the spacing member 154.
As shown in fig. 2 and 3, the elastic unit 153 includes: the mounting base 1531, the elastic member 1532 fixedly arranged on the mounting base 1531, and the mounting cover 1533 axially arranged at one end of the elastic member 1532 away from the mounting base 1531, the mounting cover 1533 being fixedly connected with the driving shaft 120. In the process that the weight unit 152 applies an axial force to the driving shaft 120 to press the driving shaft 120 downward so as to move the driving shaft 120 downward, the driving shaft 120 synchronously drives the mounting cover 1533 to move downward, so that the elastic member 1532 is compressed by the mounting cover 1533, and the elastic member 1532 is deformed to accumulate elastic potential energy; when the cleaning force generated by the air film or the water film has an effect of lifting the brush head 13 upwards, the brush head 13 drives the driving shaft 120 to move upwards synchronously along the axial direction, so that the driving shaft 120 drives the mounting cover 1533 to move upwards synchronously, the mounting cover 1533 drives the elastic element 1532 to stretch, the elastic potential energy accumulated by the elastic element 1532 is released to form an elastic force, and the action of auxiliary lifting on the driving shaft 120 can be achieved through the elastic force, so that the cleaning force generated by the air film or the water film and the elastic force formed by the elastic unit 153 can enable the driving shaft 120 to automatically drive the engagement block 151 to move upwards gradually.
As shown in fig. 1 to 5, the pivot assembly 12 includes: the fixed seat 121 axially penetrates through the fixed seat 121 and is sleeved on the transmission cylinder 122 of the driving shaft 120, the driven wheel 123 sleeved on the transmission section 1221 formed by the axial extension of the transmission cylinder 122, the transmission block 124 coaxially sleeved on the driving shaft 120 and circumferentially abutted against the inner wall of the transmission cylinder 122, and the multiple groups of first bearings 125 sleeved on the transmission cylinder 122 and circumferentially abutted against the fixed seat 121 and/or the base 11. Through the plurality of groups of first bearings 125 sleeved on the transmission barrel 122, the axes of the plurality of groups of first bearings 125 fall into an axis Q as shown in fig. 3, and meanwhile, the axis Q is perpendicular to the horizontal plane, so that the transmission barrel 122 can rotate around the axis Q in the fixed seat 121 through the first bearings 125, and the stability of the transmission barrel 122 driving the driving shaft 120 to axially rotate is improved.
The drive assembly 14 includes: the first driving motor 141, a driving wheel 142 disposed at the driving end of the first driving motor 141, and a belt 143 connecting the driving wheel 142 and the driven wheel 123. The first driving motor 141 drives the driving wheel 142 to rotate, and the belt 143 drives the driven wheel 123 to rotate, so that the driven wheel 123 can drive the transmission barrel 122 to synchronously rotate, and the transmission barrel 122 can drive the driving section 1201 to axially rotate through the transmission block 124, so that the driving section 1201 can drive the brush head 13 to rotate, and a gas film or a water film for cleaning a wafer can be formed between the bottom surface of the brush head 13 and the surface of the wafer.
The drive shaft 120 includes: a driving section 1201 connecting the mounting cover 1533 and the transmission block 124, and a rotating end 1202 formed by the axial upward extension of the driving section 1201, the rotating end 1202 being rotatably connected to the engagement block 151; the driving section 1201 is axially rotated by the driving barrel 122 through the driving block 124, and the driving section 1201 axially extends out of the rotating seat 126 and is fixedly connected with the brush head 13. The drive section 1201 is axially slidable within the rotary seat 126, the drive barrel 122 and the drive block 124. The engagement blocks 151 form a rotational connection with the rotational end 1202 via bearings to improve the rotational stability of the drive shaft 120.
Based on the technical solution of the brush head mechanism 100 disclosed in the foregoing embodiment, the present embodiment also discloses a swing arm 200 of a scrubber.
Referring to fig. 1 to 9, in the present embodiment, the scrubber swing arm 200 includes: the lifting unit 21, the driving shaft 20 driven by the lifting unit 21 to lift, a swing assembly for driving the driving shaft 20 to rotate, and a receiving assembly 23 nested in the driving shaft 20 and configured with the brush head mechanism 100 as disclosed in the above embodiment. When a wafer is to be cleaned, the lifting unit 21 drives the driving shaft 20 to descend, the driving shaft 20 drives the brush head mechanism 100 to synchronously descend through the bearing assembly 23, the bottom surface of the brush head 13 is always parallel to the plane where the wafer is located in the process that the lifting unit 21 drives the brush head mechanism 100 to descend, and a constant distance gap is always kept between the brush head 13 and the wafer in the process that the brush head 13 cleans the wafer, so that an air film or a water film for cleaning the wafer is formed between the brush head 13 and the wafer, the wafer is prevented from being directly contacted with the brush head 13 to be worn, and the driving shaft 20 is driven to rotate around the central axis Z of fig. 8 through the swinging assembly, so that the driving shaft 20 drives the brush head 13 in the brush head mechanism 100 to move back and forth from the center of the circle of the wafer to the edge through the bearing assembly 23, and the whole surface of the wafer is cleaned.
As shown in fig. 7 and 8, the driving end of the lifting unit 21 forms a movable plate 211, a movable block 212 disposed on the movable plate 211 and rotatably connected to the driving shaft 20, and a stopper 213 disposed on the movable block 212; the driving shaft 20 is recessed radially inward to form an inner recess 201, and the stopper 213 extends at least partially into the inner recess 201. The lifting unit 21 drives the movable plate 211 to lift so as to synchronously drive the movable block 212, the limiting block 213 and the driving shaft 20 to lift; the movable block 212 can be rotatably connected with the driving shaft 20 through a bearing, and during the rotation process of the driving shaft 20, the limiting block 213 at least partially extends into the concave portion 201, but the limiting block 213 does not affect the rotation of the driving shaft 20, and can play a role in rotatably supporting the driving shaft 20.
As shown in fig. 7 and 8, the swing assembly includes: the second driving motor 221, a first rotating wheel 222 arranged on the second driving motor 221, a supporting cylinder 223 sleeved on the driving shaft 20, a second bearing 224 coaxially sleeved on the driving shaft 20 and longitudinally arranged at the top end of the supporting cylinder 223, a second rotating wheel 225 sleeved on the driving shaft 20 and longitudinally propped against the second bearing 224, and a driving belt 226 connecting the first rotating wheel 222 and the second rotating wheel 225; the outer peripheral surface of the driving shaft 20 is concavely provided with a plurality of limit grooves 202 distributed longitudinally, and the second rotating wheel 225 is radially inwards convexly provided with a transmission part (not shown) of which a part extends into the limit grooves 202. The second bearing 224 and the second rotating wheel 225 can be supported by the support cylinder 223. The first rotating wheel 222 is driven to rotate by the second driving motor 221, so that the transmission belt 226 can synchronously drive the second rotating wheel 225 to rotate, and the second rotating wheel 225 can synchronously drive the driving shaft 20 to rotate by the transmission part which partially extends into the limit groove 202, so that the driving shaft 20 can drive the brush head 13 in the brush head mechanism 100 to move back and forth from the circle center of the wafer to the edge through the bearing assembly 23, and the whole surface of the wafer is cleaned; and the transmission part can play a role in guiding and limiting the driving shaft 20 during lifting.
As shown in fig. 7 and 8, the scrubber swing arm 200 further includes: the driving shaft 20 drives the sensing block 25 to rotate, and the sensing block 25 detects the rotation range of the driving shaft 20. In the process of rotating the driving shaft 20, the driving shaft 20 drives the sensing blocks 25 to synchronously rotate, the sensing blocks 25 rotate between the sensors 26, and when the sensors 26 detect the sensing blocks 25, the driving shaft 20 stops rotating, and at the moment, the position of the sensing blocks 25 corresponds to the limit position of the brush head 13, so that the initial position of the brush head 13 and the proper position during wafer brushing are obtained.
As shown in fig. 7 to 9, the receiving assembly 23 includes: the brush head mechanism 100 comprises a housing 231 which is covered on the swinging assembly and penetrated by the driving shaft 20, a housing seat 232 which is arranged on the housing 231 and sleeved on the driving shaft 20, a connecting cylinder 233 which is nested on the housing seat 232 and is rotationally connected with the housing seat 232, a bearing joint 234 fixedly connected with one end of the driving shaft 20 extending longitudinally out of the connecting cylinder 233, a shoulder swinging plate 235 which is arranged on the bearing joint 234, a telescopic cover 236 which surrounds the connecting cylinder 233 and is connected with the shoulder swinging plate 235, and a housing 237 which is arranged on the base 11 and is covered on the brush head mechanism 100. The housing 231 can protect the swing assembly and prevent particles generated during operation of the swing assembly from floating in the cleaning environment of the wafer, thereby avoiding contamination of the wafer. The bearing connector 234 and the shoulder swinging plate 235 are driven to synchronously move in the rotation process of the driving shaft 20, the shoulder swinging plate 235 drives the telescopic cover 236 and the connecting barrel 233 to synchronously rotate on the cover seat 232, and the telescopic cover 236 is stretched through the shoulder swinging plate 235 in the lifting process of the driving shaft 20, so that gas-liquid mixture generated in the wafer cleaning process can be isolated through the telescopic cover 236, and corrosion to parts such as the driving shaft 20 in the telescopic cover 236 is avoided.
Based on the technical solution of the scrubber swing arm 200 disclosed in the foregoing embodiment, the present embodiment also discloses a semiconductor device.
In this embodiment, the semiconductor device includes: at least one scrubber swing arm 200 as disclosed in the above embodiments. The semiconductor device may be used for performing semiconductor processes such as a cleaning process on a wafer.
The above list of detailed descriptions is only specific to practical embodiments of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent embodiments or modifications that do not depart from the spirit of the present invention should be included in the scope of the present invention.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (14)
1. A brush head mechanism, comprising:
the brush comprises a base, a pivoting assembly arranged on the base, a brush head formed at one end of the pivoting assembly extending axially out of the base, a driving assembly arranged on the base and used for driving the pivoting assembly to drive the brush head to rotate, and an adjusting assembly used for adjusting the distance between the bottom surface of the brush head and the surface of a wafer;
the pivot assembly includes: a drive shaft connected to the brush head;
the adjustment assembly includes: the connecting block is movably connected with the driving shaft, the counterweight unit is assembled on the connecting block and used for applying axial force to the driving shaft, and the elastic unit is axially sleeved on the driving shaft.
2. The brush head mechanism of claim 1, wherein the weight unit comprises:
the hanging piece is movably connected with a plurality of balancing weights of the hanging piece, and locking pieces are used for fixing the balancing weights to the hanging piece;
the amount of the balancing weight on the hanging piece is adjusted to control the axial force applied by the connecting block to the driving shaft.
3. The brushhead mechanism of claim 2, wherein the adjustment assembly further comprises:
the support plate is formed on the base, the support plate is configured with a longitudinally arranged slide rail, a sliding block longitudinally slides along the slide rail and is connected with the connecting block, the connecting block moves up and down along the support plate through the sliding block, and a sensor for detecting the lifting height of the connecting block.
4. The brush head mechanism of claim 3, wherein the adjustment assembly further comprises:
and the limiting piece longitudinally penetrates through the sliding block and partially extends into the supporting plate, and the limiting piece radially outwards extends to form at least one group of limiting parts for limiting the movable range of the connecting block.
5. The brush head mechanism of claim 1, wherein the resilient unit comprises:
the mounting seat is fixedly arranged on the elastic piece of the mounting seat, and the mounting cover is axially arranged at one end, far away from the mounting seat, of the elastic piece, and the mounting cover is fixedly connected with the driving shaft.
6. The brushhead mechanism of claim 5, wherein the pivot assembly includes:
the fixed seat axially penetrates through the fixed seat and is sleeved on the transmission cylinder of the driving shaft, the driven wheel is sleeved on a transmission section formed by the axial extension of the transmission cylinder, the transmission block is coaxially sleeved on the driving shaft and circumferentially abutted against the inner wall of the transmission cylinder, and the plurality of groups of first bearings are sleeved on the transmission cylinder and circumferentially abutted against the fixed seat and/or the base.
7. The brushhead mechanism of claim 6, wherein the drive assembly includes:
the driving belt comprises a first driving motor, a driving wheel arranged at the driving end of the first driving motor and a belt connecting the driving wheel and the driven wheel.
8. The brush head mechanism of claim 6, wherein the drive shaft comprises:
the driving section is connected with the mounting cover and the transmission block, and the rotating end is formed by extending the driving section upwards in the axial direction and is rotationally connected with the connecting block;
the transmission cylinder drives the driving section to axially rotate through the transmission block.
9. A scrubber swing arm, comprising: a lifting unit, a driving shaft driven by the lifting unit to lift, a swinging assembly for driving the driving shaft to rotate, and a receiving assembly nested in the driving shaft and configured with the brush head mechanism as claimed in any one of claims 1 to 8.
10. The swing arm of claim 9, wherein the drive end of the lifting unit forms a movable plate, a movable block disposed on the movable plate and rotatably connected to the drive shaft, and a stopper disposed on the movable block;
the driving shaft is concavely arranged inwards in the radial direction to form an inner concave part, and the limiting block at least partially extends into the inner concave part.
11. The scrubber swing arm of claim 10 wherein the scrubber swing arm further comprises:
the driving shaft drives the induction block to rotate, and the induction block detects the rotation range of the driving shaft.
12. The scrubber swing arm of claim 11 wherein the swing assembly comprises:
the second driving motor is arranged on the first rotating wheel of the second driving motor, sleeved on the supporting cylinder of the driving shaft, coaxially sleeved on the driving shaft and longitudinally arranged on the top end of the supporting cylinder, sleeved on the driving shaft and longitudinally abutted against the second rotating wheel of the second bearing, and a transmission belt for connecting the first rotating wheel and the second rotating wheel;
the driving shaft is provided with a plurality of limiting grooves in a concave mode on the peripheral surface, the limiting grooves are longitudinally distributed, and the second rotating wheel is provided with a transmission part protruding inwards in a radial mode, and the transmission part extends into the limiting grooves.
13. The scrubber swing arm of claim 12 wherein the receiving assembly comprises:
the brush head mechanism comprises a cover, a cover shell, a cover seat, a cover support, a connecting tube, a support joint, a shoulder swinging plate, a telescopic cover and a base, wherein the cover shell is arranged on the swinging assembly and penetrated by the driving shaft, the cover seat is arranged on the cover shell and sleeved on the driving shaft, the cover seat is nested in the cover seat and is in rotary connection with the cover seat, the driving shaft longitudinally extends out of one end of the connecting tube to be fixedly connected with the support joint, the shoulder swinging plate is arranged on the support joint, the telescopic cover is arranged around the connecting tube and is connected with the shoulder swinging plate, and the cover is arranged on the base and is covered on the brush head mechanism.
14. A semiconductor device, characterized by comprising: the at least one scrubber swing arm of any one of claims 9 to 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310349373.9A CN116116788B (en) | 2023-04-04 | 2023-04-04 | Brush head mechanism, scrubber swing arm and semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310349373.9A CN116116788B (en) | 2023-04-04 | 2023-04-04 | Brush head mechanism, scrubber swing arm and semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116116788A true CN116116788A (en) | 2023-05-16 |
| CN116116788B CN116116788B (en) | 2023-06-09 |
Family
ID=86308426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310349373.9A Active CN116116788B (en) | 2023-04-04 | 2023-04-04 | Brush head mechanism, scrubber swing arm and semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116116788B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1327423A (en) * | 1962-06-05 | 1963-05-17 | Unit Tool & Engineering Compan | Improvement in rotary printing machines |
| DE2747820A1 (en) * | 1977-10-26 | 1979-05-03 | Emil Schnekenburger | Brush mfg. machine with drilling and plugging units - has sensing pin and control member determining height adjustment of brushes |
| CN106714987A (en) * | 2014-09-26 | 2017-05-24 | 盛美半导体设备（上海）有限公司 | Apparatus and method for cleaning semiconductor wafer |
| CN210283573U (en) * | 2019-05-10 | 2020-04-10 | 深圳市领创精密机械有限公司 | Printing machine head lifting device for screen printing machine |
| CN113118088A (en) * | 2019-12-31 | 2021-07-16 | 盛美半导体设备(上海)股份有限公司 | Semiconductor cleaning device and brush head pressure feedback adjusting mechanism thereof |
| CN115106315A (en) * | 2022-08-30 | 2022-09-27 | 智程半导体设备科技(昆山)有限公司 | Brush head mechanism of brush sheet type wafer cleaning machine |
-
2023
- 2023-04-04 CN CN202310349373.9A patent/CN116116788B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1327423A (en) * | 1962-06-05 | 1963-05-17 | Unit Tool & Engineering Compan | Improvement in rotary printing machines |
| DE2747820A1 (en) * | 1977-10-26 | 1979-05-03 | Emil Schnekenburger | Brush mfg. machine with drilling and plugging units - has sensing pin and control member determining height adjustment of brushes |
| CN106714987A (en) * | 2014-09-26 | 2017-05-24 | 盛美半导体设备（上海）有限公司 | Apparatus and method for cleaning semiconductor wafer |
| CN210283573U (en) * | 2019-05-10 | 2020-04-10 | 深圳市领创精密机械有限公司 | Printing machine head lifting device for screen printing machine |
| CN113118088A (en) * | 2019-12-31 | 2021-07-16 | 盛美半导体设备(上海)股份有限公司 | Semiconductor cleaning device and brush head pressure feedback adjusting mechanism thereof |
| CN115106315A (en) * | 2022-08-30 | 2022-09-27 | 智程半导体设备科技(昆山)有限公司 | Brush head mechanism of brush sheet type wafer cleaning machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116116788B (en) | 2023-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106714987B (en) | The device and method for cleaning semi-conductor silicon chip | |
| JP2761887B2 (en) | Wafer holding device | |
| US20080189975A1 (en) | Substrate processing apparatus and substrate processing method | |
| KR19980071313A (en) | Mechanical clamping robot wrist | |
| US11380561B2 (en) | Cleaning device, substrate processing apparatus, maintenance method of cleaning device, and computer-readable recording medium including maintenance program of cleaning device | |
| CN116116788B (en) | Brush head mechanism, scrubber swing arm and semiconductor device | |
| CN1943016A (en) | Loading device for chemical mechanical polisher of semiconductor wafer | |
| CN115020317A (en) | Wafer lifting and rotating mechanism, semiconductor equipment processing unit and semiconductor equipment | |
| CN113118088A (en) | Semiconductor cleaning device and brush head pressure feedback adjusting mechanism thereof | |
| CN109015595B (en) | Robot sliding base | |
| CN112652564A (en) | Chip leveling device | |
| CN108608451B (en) | Sucking disc formula manipulator of plane self-adaptation regulation | |
| CN112872960A (en) | Wafer edge polishing device and polishing method | |
| JPH09171984A (en) | Substrate cleaning equipment | |
| CN116978847A (en) | Wafer carrying platform with position monitoring device | |
| CN213398658U (en) | Alignment device for panel | |
| CN218722647U (en) | Drying chamber | |
| CN112051715A (en) | Controllable lifting device with precision measurement and photoetching equipment comprising same | |
| CN212859042U (en) | Semiconductor silicon wafer centering and V-shaped groove finding device | |
| CN111070242A (en) | Wallboard detection mechanism and wallboard installation robot | |
| CN221050893U (en) | Battery piece conveying buffer mechanism | |
| JPH10223596A (en) | Substrate-cleaning device | |
| CN215942582U (en) | Polishing pad brushing device | |
| KR100835824B1 (en) | Vertical wafer gripping apparatus | |
| KR200189494Y1 (en) | Soft landing apparatus of spin scrubber |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 215000, No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region after: China Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region before: China |