JPH09171984A - Substrate cleaning equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable secure fixing of a substrate and easy attachment and detachment of the substrate with respect to a substrate cleaning equipment in which cleaning solution remaining on the substrate is shaken off by rotating the substrate at a high speed. SOLUTION: When a substrate table 14 for setting a substrate 12 thereon is at a lower position where rotation of the substrate table is allowed, a stopper head 68a of a chuck pin 60 is abutted against a stopper block 72 of a base table 20, and the chuck pin 60 closes, so that a substrate holding portion 64 of the chuck pin 60 fixes the substrate 12 by pinching. On the other hand, when the substrate table 14 is at an upper position, the chuck pin 60 is opened by a spring 70 provided around a stopper bolt 68 of the chuck pin 60, and the fixing of the substrate 12 by pinching is released, thereby enabling attachment and detachment of the substrate 12. By opening and closing of the chuck pin 60 accompanying up and down movement of the substrate table 14, fixing of the substrate 12 and attachment and detachment thereof are carried out securely and easily.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning apparatus for cleaning and drying substrates used for semiconductors, liquid crystal displays and the like, and more particularly, to an improved substrate chuck structure for securely and easily attaching and detaching substrates. Regarding

[0002]

2. Description of the Related Art Semiconductor manufacturing processes and liquid crystal display manufacturing processes use a photo process for forming a desired pattern on a substrate, an etching process for etching an oxide film on the substrate surface, and a resist used in the photo process. It includes a peeling step for removing the like. In these processing steps, each processing is performed by supplying a predetermined processing liquid onto the substrate. Therefore, when moving to the next step, it is necessary to perform a substrate cleaning step of cleaning the substrate so that the processing liquid used in the previous step is sufficiently removed and does not remain. As an apparatus for performing such cleaning, while supplying a cleaning liquid to the surface of the substrate, the processing liquid etc. that has adhered to and remains on the substrate surface is cleaned with a brush or the like, and then the substrate surface is cleaned with nitrogen or the like. A device is widely used in which a substrate is rotated at a high speed while blowing an active gas, and the cleaning liquid remaining on the substrate is shaken off by the wind pressure of the inert gas and the centrifugal force.

Here, when the substrate has a rectangular shape, when the substrate is rotated at a high speed as described above, rotation spots and turbulent flow are likely to occur, and good cleaning liquid cannot be shaken off. Therefore, Japanese Patent Laid-Open No. 7-10 previously proposed by the applicant of the present application
In Japanese Patent No. 6233, the board is fitted in a substantially disk-shaped straightening plate having a board housing area formed by hollowing out the board shape in the center and rotating the board. According to this structure, stable high-speed rotation can be obtained by rotating the substrate together with the current plate, and the cleaning liquid can be satisfactorily shaken off and removed.

The rectifying plate is formed such that the size of the board housing area is larger than the board size (clearance of several mm) and the whole board is held by the wall surface, or the hollowing size is formed slightly larger than the boarding size, and the hollow part is formed. A plurality of fixing pins provided upright to form a substrate storage area to hold the corners and sides of the substrate.

[0005]

However, in the conventional substrate holding structure of the substrate cleaning apparatus, the size of the substrate housing region is formed larger than that of the substrate in order to facilitate mounting of the substrate on the rectifying plate. Therefore, the board is held in a loosely fit state in which the board can be easily moved within the board housing area of the rectifying plate. As a result, the substrate moves in the inertial direction simultaneously with the start of rotation of the straightening vane, and collides with the wall surface or the fixed pin. Especially,
In the case of a liquid crystal rectangular substrate formed of glass with a thickness of about 1 mm, the peripheral part of the substrate may be damaged due to collision,
There is a problem that the substrate may be broken.

On the other hand, in order to minimize the movement of the substrate and reduce the impact due to the collision, it is conceivable to make the size of the substrate housing area of the rectifying plate as close as possible to the size of the substrate to reduce the clearance. There is a problem in that a high positioning accuracy is required when the rectifying plate is mounted on the rectifying plate, and there is a risk that the rectifying plate and the substrate are meshed with each other after the high speed rotation and the substrate is cracked when the substrate is removed from the rectifying plate.

The present invention has been made in view of the above conventional problems, and an object thereof is to securely fix a substrate during rotation, prevent damage due to collision of the substrate, and easily attach and detach the substrate. It is an object of the present invention to provide a substrate cleaning apparatus capable of performing the above.

[0008]

In order to achieve the above object, a first aspect of the present invention is a substrate for cleaning a substrate by supplying a cleaning liquid to the surface of the substrate while rotating the substrate within a plane formed by the substrate. In the cleaning device, the substrate to be cleaned is placed, the substrate is rotatable together with the placed substrate, and
The substrate table that can be raised and lowered and the substrate placed on the substrate table are arranged at least on opposite sides of the substrate table, and can be opened and closed in a substantially horizontal direction with respect to the substrate surface. In the closed state, the substrate is sandwiched and fixed to the substrate table. A plurality of opening / closing chuck pins, and a chuck pin operating means for sandwiching the substrate by the opening / closing chuck pins to fix the substrate table when the substrate table is in the lowered position, and releasing the fixing of the substrate by the opening / closing chuck pins when the substrate table is in the raised position. And are included.

According to the above construction, the substrate is sandwiched and fixed in the substantially horizontal direction with respect to the substrate surface by the opening and closing chuck pins arranged at the opposite side positions only when the substrate is in the rotatable lower position. Further, when the substrate is at the elevated position where the substrate is attached / detached, the fixing of the opening / closing chuck pin is released. Therefore, since the substrate is firmly fixed before the substrate is rotated, it is possible to reliably prevent the substrate from moving and colliding with the peripheral portion and being damaged.
Since the fixing is released when the substrate is attached and detached, the attachment and detachment work of the substrate can be easily performed.

In order to achieve the above object, a second invention is the substrate cleaning apparatus of the first invention, wherein the chuck pin operating means urges the opening / closing chuck pin in the opening direction. And an interlocking mechanism for driving the open / close chuck pin in the opening direction by the urging force of the urging means at the same time when the substrate table is raised to release the fixation of the substrate.

According to the above construction, the interlocking mechanism is operated by the urging means at the same time when the substrate table holding the substrate is raised, and the opening / closing chuck pin is opened. Therefore, the fixing and releasing operation of the substrate can be easily performed without using a complicated mechanism.

Further, in order to achieve the above object, a third aspect of the present invention is the substrate cleaning apparatus of the second aspect, wherein the chuck pin operating means further includes a lower end of the opening / closing chuck pin when the substrate table is lowered. When the substrate table descends, the lower end of the opening / closing chuck pin contacts the stopper, so that the opening / closing chuck pin is moved in the closing direction against the urging force of the urging means to sandwich the substrate. It is characterized by being fixed to the table.

According to the above construction, when the substrate table holding the substrate is lowered and the lower end of the opening / closing chuck pin comes into contact with the stopper, the opening / closing chuck pin performs the closing operation according to the contact state. Therefore, the substrate can be sandwiched and fixed without using a complicated mechanism. In addition, the sandwiching strength can be adjusted by adjusting the height of the stopper, and the sandwiching amount can be easily changed, so that substrates of different sizes can be easily fixed.

In order to achieve the above object, a fourth invention is the substrate cleaning apparatus of the first invention, wherein the chuck pin operating means is a detecting means for detecting an ascending / descending state of the substrate table, and the detecting means. And an actuator that opens and closes the opening and closing chuck pin based on the detection result of 1.

According to this structure, for example, the detecting means such as an optical sensor or a proximity sensor accurately recognizes the ascending / descending state of the substrate table, and the opening / closing operation of the opening / closing chuck pin is performed based on the detection result. The control system of the cleaning apparatus can easily and surely recognize the ascending / descending state of the substrate table and the opening / closing state of the opening / closing chuck pin, so that the substrate can be reliably held.

In order to achieve the above object, a fifth invention is characterized in that, in the substrate cleaning apparatus of the first invention, a portion of the opening / closing chuck pin that abuts on the substrate is made of an elastic material. .

According to the above construction, since the elastic member can absorb an excessive pressing force of the opening / closing chuck pin, it is possible to surely prevent the substrate from being damaged by being pinched and fixed.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a perspective view in which a part of the substrate cleaning apparatus 10 according to the present embodiment is cut away. 2 and 3 are vertical sectional views of FIG.
Shows the state where the substrate table is in the lowered position, and FIG. 3 shows the state where the substrate table is in the raised position.

The characteristic feature of this embodiment is that the substrate table on which the substrate is placed can be raised and lowered in order to facilitate the attachment and detachment of the substrate, and a chuck structure for fixing the substrate as the substrate table is raised and lowered. The opening and closing of the
When closing the chuck structure, hold the substrate securely.
The substrate can be easily attached and detached during the opening operation.

As shown in the figure, the substrate 12 is placed substantially horizontally on a plurality of placing pins 16 provided on the substrate table 14 having a substantially disc shape, and is fixed by a substrate chuck structure described later. Further, the substrate table 14 can be lifted and lowered while the substrate 12 is placed by a table lifting mechanism described later. When the substrate 12 has a rectangular shape as shown in FIG.
In order to prevent the air flow from being disturbed at the corners of 2, a substantially disk-shaped straightening plate 18 is provided around the substrate. The current plate 18 is hollowed into a rectangular shape in conformity with the shape of the substrate 12 so that the substrate 12 can be housed in the same plane. The current plate 18 is preferably a disk having a thickness substantially equal to that of the substrate 12, and by making the substrate 12 and the current plate 18 into a disk shape as a whole, the above-mentioned rotation spots and turbulent flow can be prevented. It is possible to satisfactorily prevent the occurrence. A base table 20 is disposed below the substrate table 14 to connect the straightening plate 18 to the plurality of support columns 2.
It is fixedly supported by 2.

The base table 20 is fixed to a rotatable rotary cylinder 26 having a spline shaft 24 inside. In addition, a ball spline 28 is inserted between the spline shaft 24 and the inner wall of the rotary cylinder 26 (in this embodiment, there are two positions, an upper part and a lower part of the spline shaft 24), and the spline shaft 24 smoothly moves up and down. It can be slid. On the other hand, the rotary cylinder 26 has a plurality of bearings 30.
It is rotatably held by a holding cylinder 34 fixed to the frame 32 via. Since the ball spline 28 is fixed to the inner wall of the rotary cylinder 26, the spline shaft 24 can be rotated together by rotating the rotary cylinder 26 with respect to the frame 32. That is, by driving the rotary cylinder drive motor 38 connected to the rotary cylinder 26 via the drive belt 36, the rotary cylinder 26 and the spline shaft 24 can be simultaneously driven to rotate. As described above, the base table 20 is fixed to the rotary cylinder 26, and the substrate table 14 is fixed to the spline shaft 24. Therefore, by rotating the rotary cylinder 26, the base table 20 and the current plate 18 are rotated. The substrate table 14 and the substrate 12 can be integrally rotated. As a result, the substrate 12 can be rotated at a high speed and the remaining cleaning liquid can be shaken off and removed. A rotary encoder 40 is connected to the lower end of the spline shaft 24, detects the rotational displacement and rotational speed of the spline shaft 24, and feeds back the detection result to a control unit (not shown) to perform optimum rotational control. .

On the other hand, as described above, the spline shaft 24 can be slid vertically by the ball spline 28. Hereinafter, the lifting mechanism for the spline shaft 24 will be described. A column 42 is provided upright on the frame 32 in parallel with the spline shaft 24, and a rotatable rod-shaped screw shaft 44 is provided in parallel with the column 42. An elevating motor 48 is connected to the lower end of the screw shaft 44 via a drive belt 46. In addition, the screw shaft 44 has a nut member 50.
Are screwed together and are moved up and down as the screw shaft 44 rotates. Further, the nut member 50 includes a support member 5
2 is fixed and is connected via a floating joint 54 to a lift guide plate 56 that supports the rotary encoder 40. Therefore, the lifting motor 48
By rotating the screw shaft 44 and moving the nut member 50 up and down, the spline shaft 24 to which the rotary encoder 40 is connected can be moved in the vertical direction. The guide rod 58 is parallel to the screw shaft 44.
And the floating joint 54 is interposed between the support member 52 fixed to the nut member 50 and the lift guide plate 56 to which the rotary encoder 40 is fixed. The operation can be performed smoothly. FIG. 2 shows a state in which the elevating mechanism is lowered to lower the spline shaft 24, that is, a state in which the substrate table 14 is lowered and can be rotated by driving the rotary cylinder drive motor 38, and FIG. 3 shows the spline shaft 24. It is shown in a raised state, that is, a state in which the substrate table 14 is raised and the substrate 12 can be attached to and detached from the substrate cleaning apparatus 10.

As described above, it is necessary to rotate the substrate 12 at a high speed in order to shake off the cleaning liquid remaining on the substrate 12, and the substrate 12 is surely placed on the substrate table 14 during rotation.
Need to be fixed. The substrate chuck structure will be described in detail below. As shown in FIGS. 1 to 3, a plurality of chuck pins 60 are provided on opposite sides of the substrate table 14 as opening and closing chuck pins for gripping and fixing the substrate 12. As shown in FIG. 2, when the substrate table 14 is in the lowered position, the chuck pins 60 perform a closing operation that stands up substantially vertically to sandwich the substrate 12 and fix it at a predetermined position. Further, when the substrate table 14 is in the raised position, the chuck pins 60 perform an opening operation of tilting outward to release the substrate 12, as shown in FIG.

The structure and opening / closing operation of the chuck pin 60 will be described with reference to FIGS. The chuck pin 60 has a substantially L-shape, and is rotatably supported by a bracket 62 provided around the substrate table 14 about a rotation shaft 60a. The bracket 62 is provided on the back surface side of the substrate table 14, and the substrate gripping portion 64, which is one end of the chuck pin 60, projects toward the front surface side of the substrate table 14 through the opening 14 a of the substrate table 14. Further, a stopper bolt 68 is erected on the arm portion 66 on the other end side of the chuck pin 60, and a stopper head 68a projects on the lower surface side of the chuck pin 60 and comes into contact with a stopper block described later when the substrate table 14 descends. It is like this. Further, for example, a spring 70 is provided around the stopper bolt 68 as a biasing means. One end of the spring 70 is engaged with the upper surface of the arm portion 66 of the chuck pin 60, and the other end is engaged with the spring receiver 14b of the substrate table 14. The arm portion 66 and the stopper block compose an interlocking mechanism, and the spring 70 and the interlocking mechanism compose chuck pin operating means. Therefore, the chuck pin 60 is rotated about the rotation shaft 60a by the urging force of the spring 70, and is indicated by arrow A in FIG.
As a result, the substrate gripper 64 performs an opening operation in the direction of arrow B in FIG. Since the opening / closing amount of the chuck pin 60 for attaching / detaching the substrate 12 is several mm, the amount of rotation of the chuck pin 60 is very small.
The board gripping portion 64 opens and closes in a substantially horizontal direction (direction of arrow B).

As described above, when the substrate table 14 is lifted by driving the lifting motor 48 (see FIG. 3) (FIG. 3).
State), the substrate 12 is released only by being supported by the mounting pins 16, and can be easily grasped by an arm or the like of a substrate transfer device (for example, a shuttle transfer device) not shown. The substrate 12 can be easily attached and detached.

Next, the lifting motor 48 (see FIG. 2) is driven to lower the substrate table 14, and the chuck pin 60 is moved.
When passes through the opening 20a provided in the base table 20, the stopper head 68a of the stopper bolt 68 contacts the stopper block 72 provided on the back surface side of the base table 20. When the stopper head 68a contacts the stopper block 72, the stopper bolt 68 is raised against the biasing force of the spring 70. That is, the chuck pin 60 closes in the direction of arrow C in FIG.
Pressed on 2. As described above, the chuck pin 60
Since a plurality of substrates are provided on opposite sides of the substrate 12, the substrate 12 can be sandwiched and fixed.

The substrate grip portion 64 of the chuck pin 60 is formed of an elastic member such as fluororesin, absorbs an excessive pressing force when sandwiching and fixing the substrate 12, and damages the substrate 12 by an excessive pressing force. To prevent it. Further, since the rotation angle (raising angle) of the chuck pin 60 can be easily adjusted by adjusting the height of the contact surface 72a of the stopper block 72, when the pressing force is changed depending on the type of substrate, Even when fixing substrates of different sizes, it is possible to easily change and adjust the pressing force and the pressing amount, which improves versatility.

Next, the procedure for removing the cleaning liquid from the substrate by the substrate cleaning apparatus will be described. First, as shown in FIG. 3, the substrate cleaning apparatus 10 raises the substrate table 14 by driving the elevating motor 48 in the normal direction, for example, and waits for the substrate 12 to be supplied from a substrate transfer device (not shown). . At this time, since the substrate table 14 is in the raised position, the chuck pin 60 is opened by the urging force of the spring 70 and waits for the supply of the substrate 12. When it is confirmed by a sensor or the like not shown that the substrate 12 is supplied onto the substrate table 14, the elevating motor 48 rotates in the direction opposite to that at the time of raising and lowers the substrate table 14. When the substrate table 14 descends and the stopper head 68a of the stopper bolt 68 abuts the stopper block 72, the closing operation of the chuck pin 60 is started and the substrate 12 starts to be sandwiched, and the substrate 12 is rotated before the substrate 12 is rotated. Securely fix. At this time, since the closing operation of each chuck pin 60 is performed at the same time, the substrate 1 on the substrate table 14 is closed.
The mounting position of the substrate 12 is automatically corrected to the center even if the mounting position is deviated from the predetermined position. The drive amount of the lift motor 48 is recognized by a rotary encoder or a sensor (not shown) so that the chuck pin 60 does not press the substrate 12 more than necessary.

As shown in FIG. 1, the holding cylinder 34 has a lower flange 34a at the bottom, and is fixed to the frame 32 here. In addition, the holding cylinder 34 has an upper flange 3
4b, the outer cup 76 is fixed. The outer cup 76 is arranged so that the substrate 12, the substrate table 14, and an annular hood 78, which will be described later, are housed inside the outer cup 76, and the cleaning liquid shaken off from the substrate 12 can be collected. That is, the drainage pipe 80 is provided at the bottom of the bottom of the outer cup 76, and the cleaning liquid accumulated at the bottom of the outer cup 76 is discharged from here. Further, the cleaning liquid shaken off from the substrate 12 collides with the inner wall of the annular hood 78, and as a result of the high speed rotation of the substrate 12, it becomes fine particles and is scattered into the air inside the outer cup 76. The splash of the cleaning liquid is the suction pipe 84.
The air is sucked into the suction blower 82 together with the air. In other words, there is an opening (suction hole 84a) of the suction pipe 84 near the bottom of the outer cup 76, and air is sucked in from here. Due to this suction, the approximate air flow in the outer cup 76 changes from top to bottom, stabilizing the air flow for cleaning liquid recovery.

In the present embodiment, as shown in FIG. 1, when the mounting and fixing of the substrate 12 is completed, the cleaning liquid supply nozzle 86 for supplying the cleaning liquid projects, and the brush 88 for brushing the surface of the substrate 12 also projects. Brush 88
Is provided at the tip of the brush arm 90 and is rotationally driven by a power transmission mechanism provided in the brush arm 90. In the cleaning process, the brush 88 brushes while supplying the cleaning liquid from the nozzle 86. The brush arm 90 cleans the substrate 12 while moving the brush 88 by a moving mechanism (not shown) so that the entire surface of the substrate 12 is brushed.

Further, in the present embodiment, an upper gas injection nozzle 92 and a lower gas injection nozzle 94 for performing the drying operation of the substrate 12 after the cleaning operation of the substrate 12 is completed are provided. A gas having a low activity such as nitrogen is supplied from above and below the substrate 12 by the upper gas jet nozzle 92 and the lower gas jet nozzle 94. The upper gas jet nozzle 92 projects from above the substrate 12 to jet gas, and the lower gas jet nozzle 94 is formed at the upper end of the spline shaft 24. Gas is supplied to the lower gas injection nozzle 94 from a gas supply path 94 a provided on the spline shaft 24, and the gas is blown onto the lower surface of the substrate 12. Although a considerable part of the cleaning liquid for the substrate is blown off by this gas injection, there is a possibility that the cleaning liquid remains on the portion of the substrate 12 that is not directly exposed to the air flow. Therefore, by rotating the substrate 12 at a high speed, the residual cleaning liquid is completely shaken off. At this time, since the substrate 12 is reliably sandwiched by the chuck pins 60, the substrate 12 does not move during rotation and collide with other members to be damaged.

A dust collecting duct 96 is arranged around the upper portion of the holding cylinder 34. This dust collecting duct 96
The dust collecting hole 9 is connected to the suction blower 82 through the dust collecting pipe 96a and is provided on the inner peripheral surface of the dust collecting duct 96.
Dust near the upper portion of the holding cylinder 34 is collected from 6b and discharged to the outside of the outer cup 76.

As described above, when the cleaning liquid remaining on the substrate 12 is removed, the elevating motor 48 is again driven in the normal direction to raise the spline shaft 24 to raise the substrate table 14 and the chuck pins. The pinching and fixing of the substrate 12 by 60 is released. Substrate 1 as described above
Since 2 is supported only by the mounting pins 16, the substrate cleaning device 10 can be easily used by a transfer arm of the substrate transfer mechanism.
Can be taken from At this time, the mounting pin 16 described above
The height of the substrate 12 and the mounting position of the substrate 12 and the substrate table 1
By increasing the distance from the substrate 4, the insertion of the transfer arm or the like becomes easy, and the efficiency of attachment / detachment of the substrate 12 can be improved. Since the substrate 12 is securely fixed by the chuck pins 60 when the substrate table 14 is rotated, increasing the height of the mounting pins 16 does not affect the high-speed rotation of the substrate 12 and the like. Note that, in the present embodiment, an example in which two chuck pins 60 are arranged on one side of the substrate 12 has been described, but the same applies even if the number is increased or decreased or the arrangement position is changed. The effect of sandwiching and fixing can be obtained.

In the above embodiment, the chuck pin 60 is mechanically opened and closed by the action of the spring 70 and the stopper block 72 which are interlocked with the vertical movement of the substrate table 14. However, for example, It is also possible to provide detection means for detecting the raised position and the lowered position of the substrate table 14 and operate the actuator based on the detection result to electrically open and close the chuck pin 60.

When an optical sensor or a proximity sensor is used as the detecting means, the detecting means is attached at a position along the spline shaft 24 even if the position of the substrate table 14 can be directly detected in the vicinity of the substrate table 14. Alternatively, the position along the screw shaft 44 may be a position where the position of the substrate table 14 can be indirectly recognized. Further, the position of the substrate table 14 may be recognized using a detector that detects the number of rotations and the direction of rotation of the lifting motor 48. Based on the detection results of these detecting means, the chuck pin 60 performs an opening / closing operation by driving an actuator such as a motor or a cylinder. In this case, the chuck pin 60 may be directly operated by the drive shaft of the actuator, but since the substrate table 14 to which the chuck pin 60 is attached rotates at high speed, it is indirectly used by using a shaft or wire that is operated by a motor or a cylinder. It is desirable to open and close the chuck pin 60 first.

With such a configuration, the control system of the substrate cleaning apparatus can easily electrically recognize the up-and-down state of the substrate table 14 and the opening / closing operation of the chuck pin 60, so that a reliable substrate can be obtained. Can be fixed.

[0037]

As described above, according to the present invention, the substrate is substantially horizontal with respect to the surface of the substrate only by the open / close chuck pins arranged at opposite sides only when the substrate is in the lower position where it can rotate. It is sandwiched and fixed in the direction. Further, the fixing of the opening / closing chuck pin is released when the substrate is at the elevated position where the substrate is attached / detached. Therefore, when the substrate is rotated, the substrate is firmly fixed, it is possible to reliably prevent the substrate from moving and colliding with the peripheral portion and being damaged, and the fixing is released when the substrate is attached / detached so that the substrate can be attached / detached. Work can be performed easily.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view of an embodiment of a substrate cleaning apparatus according to the present invention.

FIG. 2 is a cross-sectional view of a substrate cleaning apparatus according to an embodiment of the present invention when a substrate is in a lowered position.

FIG. 3 is a cross-sectional view of a substrate cleaning apparatus according to an embodiment of the present invention when a substrate is in a raised position.

FIG. 4 is an enlarged view illustrating an open state of the chuck structure in the embodiment of the substrate cleaning apparatus according to the present invention.

FIG. 5 is an enlarged view illustrating a closed state of the chuck structure in the embodiment of the substrate cleaning apparatus according to the present invention.

[Explanation of symbols]

10 substrate cleaning device, 12 substrate, 14 substrate table, 16 mounting pin, 18 straightening plate, 20 base table, 24 spline shaft, 26 rotating cylinder, 34 holding cylinder,
38 rotary cylinder drive motor, 48 lift motor, 60 chuck pins, 64 substrate gripping portion, 70 spring, 7
2 Stopper block.

Claims (5)

[Claims] 1. A substrate cleaning apparatus for cleaning a substrate by supplying a cleaning liquid to the surface of the substrate while rotating the substrate in a plane formed by the substrate, the substrate to be cleaned is placed and placed on the substrate. The substrate table is rotatable with the substrate and can be moved up and down, and the substrate table is placed at least on the opposite side of the substrate placed on the substrate table and can be opened and closed in a substantially horizontal direction with respect to the substrate surface. A plurality of open / close chuck pins that sandwich the board and fix it to the substrate table.When the board table is in the lowered position, the board is pinched by the open / close chuck pins and fixed to the substrate table, and when the board table is in the raised position, the board is opened and closed with the open / close chuck pins. A substrate cleaning apparatus comprising: chuck pin operating means for releasing the fixation. 2. The substrate cleaning apparatus according to claim 1, wherein the chuck pin operating means includes an urging means for urging the opening / closing chuck pin in an opening direction, and an urging force of the urging means at the same time when the substrate table is raised. A substrate cleaning device comprising: an interlocking mechanism that drives the open / close chuck pin in the opening direction to release the fixation of the substrate. 3. The substrate cleaning apparatus according to claim 2, wherein the chuck pin operating means further has a stopper with which a lower end of the opening / closing chuck pin abuts when the substrate table is lowered, and the opening / closing chuck pin is lowered when the substrate table is lowered. The substrate cleaning apparatus is characterized in that when the lower end of the substrate comes into contact with the stopper, the opening / closing chuck pin is moved in the closing direction against the urging force of the urging means, and the substrate is sandwiched and fixed to the substrate table. 4. The substrate cleaning apparatus according to claim 1, wherein the chuck pin operating means opens and closes the open / close chuck pin based on a detection means for detecting a lifted state of the substrate table and a detection result of the detection means. An apparatus for cleaning a substrate, comprising: 5. The substrate cleaning apparatus according to claim 1, wherein a portion of the opening / closing chuck pin that abuts the substrate is made of an elastic material.