CN116075075A - PCB laminated board coincide equipment - Google Patents
PCB laminated board coincide equipment Download PDFInfo
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- CN116075075A CN116075075A CN202211558823.7A CN202211558823A CN116075075A CN 116075075 A CN116075075 A CN 116075075A CN 202211558823 A CN202211558823 A CN 202211558823A CN 116075075 A CN116075075 A CN 116075075A
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- copper foil
- plate
- prepreg
- inner layer
- transferring
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- 230000007246 mechanism Effects 0.000 claims abstract description 167
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 153
- 239000011889 copper foil Substances 0.000 claims abstract description 133
- 239000000463 material Substances 0.000 claims abstract description 95
- 238000003860 storage Methods 0.000 claims abstract description 74
- 238000012546 transfer Methods 0.000 claims abstract description 68
- 238000007599 discharging Methods 0.000 claims abstract description 55
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- 239000010949 copper Substances 0.000 claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 238000010030 laminating Methods 0.000 claims description 21
- 238000012937 correction Methods 0.000 claims description 15
- 239000000428 dust Substances 0.000 claims description 15
- 238000007664 blowing Methods 0.000 claims description 9
- 230000009471 action Effects 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 2
- 210000001503 joint Anatomy 0.000 claims description 2
- 230000005012 migration Effects 0.000 claims description 2
- 238000013508 migration Methods 0.000 claims description 2
- 238000003475 lamination Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 61
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 8
- 238000000605 extraction Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000033764 rhythmic process Effects 0.000 description 4
- 239000011232 storage material Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 230000000670 limiting effect Effects 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000029058 respiratory gaseous exchange Effects 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Abstract
The invention relates to the field of PCB laminated board production equipment, and particularly discloses PCB laminated board superposition equipment which comprises a superposition discharging device, a mirror plate feeding device, a copper foil feeding device, a prepreg feeding device, an inner layer plate feeding device, a temporary storage table, a first transfer device, a second transfer device and a third transfer device; the stacking and discharging device is provided with a conveying mechanism, a bearing mechanism and a stacking area for stacking materials, the bearing mechanism comprises a bearing block for bearing a bottom plate, the bearing mechanism can slide to the position below the stacking area and the position outside the stacking area, the conveying direction of the conveying mechanism is consistent with the sliding direction of the bearing mechanism, and the conveying mechanism can be lifted to be higher than the bearing block and lowered to be lower than the bearing block; during production, a copper foil-mirror plate-copper foil structure and a prepreg-inner layer plate-prepreg structure are sequentially laminated on the bottom plate in the lamination area.
Description
Technical Field
The invention relates to the field of PCB laminated board production equipment industry, in particular to PCB laminated board laminating equipment.
Background
The PCB laminated board comprises a single-layer structure and a multi-layer structure, the PP and the copper foil are sequentially overlapped on the upper side and the lower side of the single-layer circuit board by the multi-layer laminated board, and the single-layer circuit board with the copper foil-inner layer material-copper foil structure in the multi-layer PCB laminated board is also called an inner layer board.
In the production of a PCB laminate, a plurality of mirror plates and inner plates are laminated in sequence alternately between an upper cover plate and a bottom plate after a kraft paper or a cushion pad is laid, and a multi-layer circuit board is manufactured after lamination.
As described above, the materials are stacked on the bottom plate, and the bottom plate only plays a role in transporting the materials, so that the bottom plate needs to be reused, and the bottom plate can flow back and forth in the whole production workshop in actual production.
With the improvement of the technology, the prior art proposes a scheme of layered conveying of the bottom plates, specifically, the empty bottom plates are conveyed by a higher conveying track, and the bottom plates loaded with materials are conveyed by a lower conveying track, so that a new requirement is also proposed: PCB laminate folding equipment requires receiving empty pallets from a higher position and feeding out pallets loaded from a lower position to accommodate the layered transport, but there is currently no similar PCB laminate folding equipment.
Disclosure of Invention
The invention aims to provide PCB laminated board laminating equipment, which aims to solve the problem that no PCB laminated board laminating equipment can adapt to layered transmission at present.
In order to achieve the above purpose, the invention provides a PCB laminated board superposition device, which comprises a superposition discharging device, a mirror board feeding device, a copper foil feeding device, a prepreg feeding device, an inner layer board feeding device, a temporary storage table, a first transfer device, a second transfer device and a third transfer device;
the stacking and discharging device is provided with a conveying mechanism, a bearing mechanism and a stacking area for stacking materials, the bearing mechanism comprises a bearing block for bearing a bottom plate, the bearing mechanism can slide to the position below the stacking area and the position outside the stacking area, the conveying direction of the conveying mechanism is consistent with the sliding direction of the bearing mechanism, and the conveying mechanism can be lifted to be higher than the bearing block and lowered to be lower than the bearing block;
the mirror plate feeding device is used for feeding the mirror plate to the mirror plate material position, the copper foil feeding device is used for feeding a first copper foil to the mirror plate material position and stacking the first copper foil above the mirror plate to form a copper foil-mirror plate structure, the copper foil feeding device is also used for feeding a second copper foil to the copper foil material position, the first transferring device is used for transferring the copper foil-mirror plate structure from the mirror plate material position to the copper foil material position and stacking the second copper foil above the first copper foil to form a copper foil-mirror plate-copper foil structure, and the first transferring device is also used for transferring the copper foil-mirror plate-copper foil structure from the copper foil material position to the stacking area; the mirror plate material level, the copper foil material level and the superposition area are arranged along a straight line, and the first transfer device is provided with two linked picking and placing mechanisms;
the inner layer plate feeding device is used for feeding the inner layer plate to the inner layer plate material level, the prepreg feeding device is used for feeding the prepreg level to the first prepreg material level and the second prepreg material level, the second transferring device is used for sequentially transferring materials from the inner layer plate material level to the first prepreg material level, the second prepreg material level and the temporary storage table so as to stack the prepreg-inner layer plate-prepreg structure and then transfer the prepreg-inner layer plate-prepreg structure to the temporary storage table; the inner layer plate material level, the first prepreg material level, the second prepreg material level and the temporary storage table are arranged along a straight line, and the second transfer device is provided with three linked picking and placing mechanisms; the temporary storage table is used for positioning and adjusting the prepreg-inner layer plate-prepreg structure, and the third transfer device is used for transferring the prepreg-inner layer plate-prepreg structure from the temporary storage table to the superposition area;
during production, a copper foil-mirror plate-copper foil structure and a prepreg-inner layer plate-prepreg structure are sequentially laminated on the bottom plate in the lamination area.
Further, the conveying mechanism is arranged into two sections, the first section conveying mechanism is located below the stacking area, the second section conveying mechanism is located outside the stacking area, the two sections of conveying mechanisms are respectively and independently lifted, and the two sections of conveying mechanisms can be in butt joint to convey the bottom plate.
Further, when the empty bottom plate is fed, the second section conveying mechanism is lifted to receive the empty bottom plate, and the empty bottom plate can be transferred to the bearing block after the second section conveying mechanism is lowered; the bearing mechanism drives the empty bottom plate to the overlapping area; after stacking, the first section conveying mechanism lifts the bottom plate carrying the materials, and then the first section conveying mechanism and the second section conveying mechanism both descend and send out the bottom plate carrying the materials.
Further, the mirror plate feeding device comprises a mirror plate transferring mechanism, a mirror plate discharging mechanism and a mirror plate storage position for storing the mirror plates of the whole stack, wherein the mirror plate transferring mechanism is used for transferring the mirror plates on the mirror plate storage position to the mirror plate discharging mechanism, and the mirror plates are located on the mirror plate discharging mechanism.
Further, two groups of copper foil feeding devices are arranged, namely a first copper foil storage feeding device and a second copper foil storage feeding device;
the first copper foil storage and feeding device comprises a first copper foil storage position of a first copper foil transfer mechanism, wherein the first copper foil storage position is used for storing a whole stack of copper foils, and the first copper foil transfer mechanism is used for transferring the copper foils on the first copper foil storage position to the position of the mirror plate and stacking the copper foils above the mirror plate to form a copper foil-mirror plate structure;
the second copper foil storage loading attachment includes second copper foil transfer mechanism, switch platform and second copper foil storage position, and second copper foil storage position is used for depositing the copper foil of whole buttress, and switch platform includes one high one low two accepting tables, and switch platform is provided with and connects position and copper foil material level, and these two accepting tables homoenergetic horizontal migration are to accepting position and copper foil material level, and second copper foil transfer mechanism is used for transferring the copper foil on the second copper foil storage position to the accepting table that is located accepting position, accepts the platform and shifts the copper foil to the copper foil material level.
Further, the inner layer plate feeding device comprises a Tray wheel rotating mechanism, an inner layer plate transferring mechanism and a centering mechanism, wherein the inner layer plate material level is located on the centering mechanism, the Tray wheel rotating mechanism comprises a feeding component for feeding a Tray plate with an inner layer plate and a discharging component for discharging an empty Tray plate, the inner layer plate transferring mechanism is provided with at least two linked transferring components which are respectively a first inner layer plate transferring component and a second inner layer plate transferring component, the first inner layer plate transferring component is used for transferring the Tray plate with the inner layer plate carried by the feeding component to the discharging component, the second inner layer plate transferring component is used for transferring the inner layer plate carried by the discharging component to the centering mechanism, and the centering mechanism is used for positioning and adjusting the inner layer plate.
Further, centering mechanism is including being used for accepting the locating plate of inlayer board, being used for correcting the correction subassembly of correcting the inlayer board with the locating plate cooperation, with correct the first drive assembly of subassembly linkage connection, be used for the gas blowing hole that the inlayer board was blown up, the locating plate is provided with the air chamber, locating plate top terminal surface is provided with a plurality of air current groove, intercommunication each other between air current groove, air chamber, the gas blowing hole.
Further, the feeding assembly and the discharging assembly can both be lifted, and the discharging assembly is lifted by one stage when the feeding assembly is lifted by one stage.
Further, the prepreg feeding device comprises a prepreg storage frame and a prepreg correction platform, wherein the prepreg correction platform is positioned between the prepreg storage frame and the prepreg material level, and the prepreg is taken out from the prepreg storage frame, corrected by the prepreg correction platform and then transferred to the prepreg material level.
Further, the prepreg correction platform comprises a bearing plate and a second driving assembly for driving the bearing plate to move, a supporting seat is arranged at the bottom of the second driving assembly, a collecting cavity is arranged on the supporting seat, a first air hole for adsorbing the prepreg and a second air hole for adsorbing tiny dust are arranged on the bearing plate, the second air hole is communicated with the collecting cavity, the prepreg is adsorbed on the bearing plate through the first air hole, and under the action of the second driving assembly, the bearing plate drives the sucked prepreg to move together to correct the prepreg, and the second air hole is used for sucking tiny dust around the prepreg.
When the PCB laminated board laminating equipment is used, the copper foil-mirror plate-copper foil-prepreg-inner layer board-prepreg-copper foil-mirror plate-copper foil circulating laminating is completed through the cooperation of the devices, an upper conveying line and a lower conveying line are formed after the conveying mechanism is lifted, the conveying mechanism can be lifted to a higher position (namely the upper conveying line) and lowered to a lower position (namely the lower conveying line), the peripheral conveying equipment connected with the laminating discharging device can convey an empty base board (namely no material) to the laminating discharging device from the higher position, the base board with the laminated material sent from the laminating discharging device can also be accepted from the lower position, the base board is supported by the conveying mechanism after being supported by the bearing block during laminating, the base board is conveyed into and out of the laminating discharging device through the conveying mechanism, the action cooperation between the mechanisms on the laminating discharging device is realized for the base board, the material conveying direction of the peripheral conveying equipment can be matched, further, the work rhythm on the equipment can be compact, and the production efficiency of the laminated board structure can be effectively improved.
Drawings
Fig. 1 is a schematic structural view of a PCB laminate laminating apparatus according to the present invention;
FIG. 2 is a schematic top view of a PCB laminate folding apparatus according to the present invention;
FIG. 3 is a schematic flow chart of a PCB laminate laminating apparatus according to the present invention;
fig. 4 is a schematic structural view of a stacking and discharging device of a PCB laminate stacking apparatus according to the present invention;
FIG. 5 is a schematic diagram showing the cooperation structure of a mirror plate feeding device, a copper foil feeding device and a first transfer device of a PCB laminated board laminating device;
fig. 6 is a schematic structural view of a first copper foil storage and feeding device of a PCB laminate laminating apparatus according to the present invention;
fig. 7 is a schematic structural view of a second copper foil storage and feeding device of the PCB laminate folding apparatus of the present invention;
fig. 8 is a schematic diagram of a prepreg correction stage of a PCB laminate laminating apparatus according to the present invention;
fig. 9 is a schematic structural view of an inner layer board feeding device of a PCB laminate laminating apparatus according to the present invention;
fig. 10 is a schematic view showing a partial structure of an inner panel feeding device of a PCB laminate laminating apparatus according to the present invention;
fig. 11 is a schematic structural view of a centering mechanism of a PCB laminate folding apparatus according to the present invention.
Reference numerals illustrate: 1. a stacking and discharging device; 11. a conveying mechanism; 12. a receiving mechanism; 121. a bearing block; 13. a superposition area; 14. a bottom plate; 15. a dust collection assembly; 2. mirror plate feeding device; 21. a mirror plate transfer mechanism; 22. a mirror plate discharging mechanism; 23. a mirror plate stores material level; 24. mirror plate material level; 3. copper foil feeding device; 31. the first copper foil storage and feeding device; 311. a first copper foil transfer mechanism; 312. a first copper foil storage location; 32. the second copper foil storage and feeding device; 321. a second copper foil transfer mechanism; 322. a switching platform; 3221. a receiving table; 3222. receiving a material level; 3223. copper foil material level; 323. a second copper foil storage location; 4. a prepreg feeding device; 41. a first prepreg level; 42. a second prepreg level; 43. a prepreg storage frame; 44. a prepreg correction platform; 441. a carrying plate; 442. a movement drive assembly; 443. a support base; 444. a first air hole; 445. a second air hole; 5. an inner layer plate feeding device; 51. a Tray rotation mechanism; 511. a feeding assembly; 512. a blanking assembly; 513. a carrier rack; 514. a lifting driving assembly; 515. a feed table; 516. a discharging table; 517. a first conveyor belt; 518. a second conveyor belt; 52. an inner layer plate transfer mechanism; 5211. a first inner layer plate transfer assembly; 5212. a second inner layer plate transfer assembly; 53. a centering mechanism; 531. the material level of the inner layer plate; 532. a positioning plate; 533. a corrective component; 534. a corrective drive assembly; 535. a blow hole; 536. a gas flow groove; 6. a temporary storage table; 7. a first transfer device; 8. a second transfer device; 9. and a third transfer device.
Detailed Description
The present invention will be described in detail with reference to specific examples.
In the present invention, unless explicitly stated and limited otherwise, when terminology such as "disposed," "connected," or "connected" is intended to be interpreted broadly, such as, for example, a fixed connection, a removable connection, or an integral connection; may be directly connected or connected through one or more intermediaries. The specific meaning of the terms described above in the present invention can be understood by those skilled in the art according to the specific circumstances. The direction words appearing in the invention are used for better explaining the characteristics of the features and the relation among the features, and it is understood that when the arrangement direction of the invention is changed, the characteristics of the features and the directions of the relation among the features are correspondingly changed, so that the direction words do not form absolute limiting effect on the characteristics of the features and the relation among the features in space, and only play a role in relative limiting.
Referring to fig. 1-11, the present invention provides a technical solution for a PCB laminate lamination apparatus: the device comprises a stacking discharging device 1, a mirror plate feeding device 2, a copper foil feeding device 3, a prepreg feeding device 4, an inner layer plate feeding device 5, a temporary storage table 6, a first transfer device 7, a second transfer device 8 and a third transfer device 9;
the stacking and discharging device 1 is provided with a conveying mechanism 11, a bearing mechanism 12 and a stacking area 13 for stacking materials, wherein the bearing mechanism 12 comprises a bearing block 121 for bearing a bottom plate 14, the bearing mechanism 12 can slide to be positioned below the stacking area 13 and outside the stacking area 13, the conveying direction of the conveying mechanism 11 is consistent with the sliding direction of the bearing mechanism 12, and the conveying mechanism 11 can be lifted to be higher than the bearing block 121 and lowered to be lower than the bearing block 121;
the mirror plate feeding device 2 is used for feeding the mirror plate to the mirror plate position 24, the copper foil feeding device 3 is used for feeding a first piece of copper foil to the mirror plate position 24 and stacking the first piece of copper foil above the mirror plate to form a copper foil-mirror plate structure, the copper foil feeding device 3 is also used for feeding a second piece of copper foil to the copper foil position 3223, the first transfer device 7 is used for transferring the copper foil-mirror plate structure from the mirror plate position 24 to the copper foil position 3223 and stacking the second piece of copper foil above the first transfer device 7 is also used for transferring the copper foil-mirror plate-copper foil structure from the copper foil position 3223 to the stacking area 13; the mirror plate material position 24, the copper foil material position 3223 and the superposition area 13 are arranged along a straight line, and the first transfer device 7 is provided with two linked picking and placing mechanisms;
the inner layer plate feeding device 5 is used for feeding the inner layer plate to an inner layer plate material level 531, the prepreg feeding device 4 is used for feeding the prepreg flat to a first prepreg material level 41 and a second prepreg material level 42, the second transferring device 8 is used for transferring materials from the inner layer plate material level 531 to the first prepreg material level 41, the second prepreg material level 42 and the temporary storage table 6 in sequence so as to stack a prepreg-inner layer plate-prepreg structure and then transfer the prepreg-inner layer plate-prepreg structure to the temporary storage table 6; the inner layer plate material level 531, the first prepreg material level 41, the second prepreg material level 42 and the temporary storage table 6 are arranged along a straight line, and the second transfer device 8 is provided with three linked picking and placing mechanisms; the temporary storage table 6 is used for positioning and adjusting the prepreg-inner layer board-prepreg structure, and the third transfer device 9 is used for transferring the prepreg-inner layer board-prepreg structure from the temporary storage table 6 to the superposition area 13;
in production, a copper foil-mirror plate-copper foil structure and a prepreg-inner layer plate-prepreg structure are sequentially laminated on the base plate 14 in the laminating area 13.
Through adopting above-mentioned technical scheme, when using, through the cooperation of each device, realize accomplishing copper foil-mirror board-copper foil-prepreg-inner plate-prepreg-copper foil-mirror board-copper foil's circulation stack, two conveyer lines about the conveyer mechanism 11 is formed after going up and down, conveyer mechanism 11 can rise to higher position (i.e. the conveyer line of top) and fall to lower position (i.e. the conveyer line of below), and the peripheral transfer equipment who is connected with stack discharging device 1 can send empty bottom plate 14 (i.e. not load the material) to stack discharging device 1 from higher position, can also accept the bottom plate 14 of stacking the material that goes out from stack discharging device 1 from lower position, bottom plate 14 is by conveyer mechanism 11 after bearing block 121 support when stacking, and bottom plate 14 business turn over this stack discharging device 1 is all realized by conveyer mechanism 11, the action cooperation between each mechanism on the stack discharging device 1 carries out the handing-over to bottom plate 14, the business turn over direction of peripheral transfer equipment that can cooperate, further, can make this upper and lower position accept the bottom plate 14 that stacks of stacking device from stack discharging device 1, can also accept, and by the effective circuit structure of stacking efficiency can be improved.
It should be noted that, the third transferring device 9 is provided with a picking and placing mechanism, and the picking and placing mechanism and the temporary storage table 6 are in the prior art, and the structure, principle, usage and the like of the third transferring device will be clear to those skilled in the art, and will not be described in detail herein.
In this embodiment, the conveying mechanism 11 is provided in two sections, the first section of conveying mechanism 11 is located below the stacking area 13, the second section of conveying mechanism 11 is located outside the stacking area 13, the two sections of conveying mechanisms 11 are respectively lifted and lowered independently, and the two sections of conveying mechanisms 11 can be abutted to convey the bottom plate 14.
Based on the above structure, when the empty bottom plate 14 is fed, the second stage conveying mechanism 11 is lifted to receive the empty bottom plate 14 and transported, and the empty bottom plate 14 can be transferred to the bearing block 121 after the second stage conveying mechanism 11 is lowered; after the empty bottom plates 14 are transported to the stacking area 13 by the bearing mechanism 12, when the empty bottom plates 14 are stacked with materials 1-2 times, the first section conveying mechanism 11 is lifted up to bear the bottom plates 14, at this time, the bottom plates 14 are continuously stacked with the materials on the conveying mechanism 11, the bearing blocks 121 are lowered, the bearing mechanisms 12 slide away from the stacking area 13, the first section conveying mechanism 11 is lowered to the lowest level step by step and is intersected with the second section conveying mechanism 11, and finally the bottom plates 14 carrying the materials are transported to leave the frame 1 through the second section conveying mechanism 11, so that layered conveying of the bottom plates 14 on the stacking discharging device 1 is realized, the working rhythm on the device is compact, the production efficiency of the circuit board stacking structure can be effectively improved, and the conveying mode of the bottom plates 14 by the conveying mechanism 11, the sliding of the bearing mechanisms 12 and the lifting of the bearing blocks 121 on the bearing mechanisms can be realized in a plurality of modes in the prior art, so that the method is not repeated in the application.
In the stacking and discharging device 1, in the process of sequentially feeding the bottom plates 14, the process of carrying the bottom plates 14 on the first section conveying mechanism 11 and stacking the bottom plates 14 on the bottom plates 11 and the process of lifting the second section conveying mechanism 11 to receive new empty bottom plates 14 and transferring the empty bottom plates to the carrying blocks 121 are overlapped, the process of conveying the bottom plates 14 to the second section conveying mechanism 11 after the stacking of the first section conveying mechanism 11 is completed and the process of sliding the carrying mechanism 12 to the stacking area 13 are overlapped, and the process of conveying the bottom plates 14 away from the device by the second section conveying mechanism 11 and the process of lifting the first section conveying mechanism 11 and carrying the bottom plates 14 are overlapped. By the method, the new empty bottom plates 14 are continuously fed on the device and are stacked on the bottom plates 14 and then are transported out, and the time overlapping can accelerate the exchange speed and the circulation speed of the bottom plates 14 on the device, so that the working rhythm of the device is compact, and the working efficiency is higher.
In this embodiment, fold material discharging device 1 still includes dust extraction, and dust extraction is including four sets of dust extraction components 15, and four sets of dust extraction components 15 enclose to close and form stack district 13, dust extraction component 15 includes breathing pipe, wind chamber, output tube, and the intercommunication each other between breathing pipe, wind chamber, the output tube three realizes cleaning when stacking the material on bottom plate 14 and bottom plate 14, avoids influencing the production quality of PCB lamination board.
As shown in fig. 5, the mirror plate feeding device 2 includes a mirror plate transferring mechanism 21, a mirror plate discharging mechanism 22, and a mirror plate storing position 23 for storing a whole stack of mirror plates, wherein the mirror plate transferring mechanism 21 is used for transferring the mirror plates on the mirror plate storing position 23 to the mirror plate discharging mechanism 22, and the mirror plate position 24 is located on the mirror plate discharging mechanism 22.
As shown in fig. 6 and 7, the copper foil loading device 3 is provided with two groups, namely a first copper foil storage loading device 31 and a second copper foil storage loading device 32; the first copper foil storage and feeding device 31 comprises a first copper foil transfer mechanism 311 and a first copper foil storage position 312, wherein the first copper foil storage position 312 is used for storing a whole stack of copper foil, and the first copper foil transfer mechanism 311 is used for transferring the copper foil on the first copper foil storage position 312 to the mirror plate position 24 and overlapping the copper foil on the mirror plate position to form a copper foil-mirror plate structure; the second copper foil storage loading device 32 comprises a second copper foil transferring mechanism 321, a switching platform 322 and a second copper foil storage position 323, wherein the second copper foil storage position 323 is used for storing a whole stack of copper foil, the switching platform 322 comprises a high receiving platform 3221 and a low receiving platform 3222 and a copper foil position 3223, the two receiving platforms 3221 can horizontally move to the receiving position 3222 and the copper foil position 3223, the second copper foil transferring mechanism 321 is used for transferring the copper foil on the second copper foil storage position 323 to the receiving platform 3221 positioned at the receiving position 3222, and the receiving platform 3221 transfers the copper foil to the copper foil position 3223.
Based on the structure, each loading attachment can have sufficient space to set up more storage material level, and the staff can once only put into more materials to this equipment, reduces the number of times that comes and goes this equipment, has also reduced staff's intensity of labour, and, after the material on the storage material level is got, partial transfer mechanism can get another buttress material on another storage material level soon, the staff in suitable time again to empty storage material level in the replenishment material can, reduced the number of times that equipment shut down, can effectively improve production efficiency.
It should be noted that, in terms of the operation sequence, when one of the picking and placing mechanisms of the first transfer device 7 moves away from the upper side of the first copper foil storage and feeding device 31, no copper foil is located on the mirror plate material level 24, at this time, the first copper foil transfer mechanism 311 of the first copper foil storage and feeding device 31 can act and send a new copper foil to the mirror plate material level 24, but in terms of the second copper foil storage and feeding device 32, after the other picking and placing mechanism of the first transfer device 7 picks up the copper foil-mirror plate-copper foil laminated structure and moves away, one of the picking and placing mechanisms of the first transfer device 7 clamps the copper foil-mirror plate and simultaneously comes to the upper side of the copper foil material level 3223, in this embodiment, the copper foil feeding is performed in a switching manner, without the second copper foil transfer mechanism 321 entering the lower side of any picking and placing mechanism of the first transfer device 7, so that the rhythm can be accelerated, and the second copper foil transfer mechanism 321 is prevented from colliding with the picking and placing mechanism of the first transfer device 7.
As shown in fig. 9 to 11, the inner ply loading device 5 includes a Tray rotation mechanism 51, an inner ply transfer mechanism 52 and a centering mechanism 53, the inner ply level 531 is located in the centering mechanism 53, the Tray rotation mechanism 51 includes a loading component 511 for loading the Tray with the inner ply and a blanking component 512 for blanking the empty Tray, the inner ply transfer mechanism 52 is provided with at least two linked transfer components, namely a first inner ply transfer component 5211 and a second inner ply transfer component 5212, the first inner ply transfer component 5211 is used for transferring the Tray with the inner ply carried by the loading component 511 to the blanking component 512, the second inner ply transfer component 5212 is used for transferring the inner ply carried by the blanking component 512 to the centering mechanism 53, the centering mechanism 53 is used for positioning and adjusting the inner ply, and the first inner ply transfer component 5211 and the second inner ply transfer component 5212 are known in the art, and the structure, principle and use method thereof will not be described in detail herein.
In this embodiment, the centering mechanism 53 includes a positioning plate 532 for receiving the inner layer plate, a straightening assembly 533 cooperating with the positioning plate 532 for straightening the inner layer plate, a straightening driving assembly 534 connected with the straightening assembly 533 in a linkage manner, and a blowing hole 535 for blowing up the inner layer plate, wherein an air chamber is disposed on a bottom end surface of the positioning plate 532, a plurality of air flow grooves 536 are disposed on a top end surface of the positioning plate 532, and the air flow grooves 536, the air chamber and the blowing hole 535 are mutually communicated.
Based on the above structure, when in use, air is blown out from the air blowing holes 535, the inner layer plate is blown up through the air flow grooves 536, the inner layer plate is straightened through the straightening component 533 after being blown up, friction between the inner layer plate and the positioning plate 532 is avoided, the inner layer plate is also facilitated to be pushed, the straightening is more efficient, the air flow grooves 536 are arranged, the air flow area accepted by the inner layer plate in the initial state in contact with the positioning plate 532 is larger, the air chamber blows up the inner layer plate through the air flow grooves 536, the stress of the inner layer plate is more uniform, the inner layer plate can be effectively prevented from being damaged, the straightening component 533 and the straightening driving component 534 are straightened into the prior art, and the structure, the principle, the using method and the like of the straightening component 533 should be clear to those skilled in the art, and the details of the structure and the principle are not described herein.
In this embodiment, the feeding component 511 and the discharging component 512 can both lift, when the feeding component 511 descends by one stage, the discharging component 512 ascends by one stage, as shown in fig. 10, the feeding component 511 and the discharging component 512 both include a carrier 513, and a lift driving component 514 located at one side of the carrier 513, the lift driving component 514 drives the carrier 513 to move along a vertical direction, the Tray rotating mechanism 51 further includes a feeding table 515 for storing a Tray with an inner layer plate in a whole stack, a discharging table 516 for storing an empty Tray in the whole stack, first conveyor belts 517 are disposed on the feeding component 511 and the feeding table 515, second conveyor belts 518 are disposed on the discharging component 512 and the discharging table 516, the first conveyor belts 517 and the second conveyor belts 518 are respectively connected in a linkage manner, and the rotation driving component drives the Tray to move on the first conveyor belts 517 and the second conveyor belts 518, so that the Tray with the empty Tray on the feeding component 511 can be removed in time.
In actual operation, the first conveyor belt 517 is driven to feed the carrier 513 in the feeding assembly 511, the second conveyor belt 518 is used for moving out empty trays, the lifting driving assembly 514 in the feeding assembly 511 controls the carrier 513 to support the trays to ascend step by step, the inner layer plates on the Tray are transferred in cooperation with the transferring mechanism, the lifting driving assembly 514 in the discharging assembly 512 controls the carrier 513 to support the empty Tray to descend step by step, after the same inner layer plates are transferred completely, the second conveyor belt 518 is used for moving out the empty Tray of the whole stack, the lifting driving assembly 514 and the rotating driving assembly are started again and turn down, so that the carrier 513 in the feeding assembly 511 descends for feeding a new Tray of the whole batch, and the carrier 513 in the discharging assembly 512 ascends for supporting the empty Tray 517, which is to be explained, the conveying direction of the first conveyor belt 518 is opposite to that of the conveying direction of the second conveyor belt 518.
In this embodiment, the prepreg feeding device 4 includes a prepreg storage frame 43 and a prepreg correction platform 44, the prepreg correction platform is located between the prepreg storage frame 43 and the prepreg level, and the prepreg is removed from the prepreg storage frame 43 and corrected by the prepreg correction platform 44 and then transferred to the prepreg level, which can be understood that the processes of feeding and transferring the prepreg of the prepreg feeding device 4 are the prior art, and the structure, principle and usage method thereof will be clear to those skilled in the art and will not be described in detail herein.
As shown in fig. 8, the prepreg correction platform 44 includes a carrier plate 441 and a mobile driving assembly 442 for driving the carrier plate 441 to move, a supporting seat 443 is provided at the bottom of the mobile driving assembly 442, a funnel for collecting dust and cleaning is provided in the supporting seat 443, the funnel is communicated with a dust collecting pipeline, a first air hole 444 for adsorbing prepreg and a second air hole 445 for adsorbing dust are provided on the carrier plate 441, the second air hole 445 is communicated with the funnel, the prepreg is adsorbed on the carrier plate 441 through the first air hole 444, the carrier plate 441 drives the sucked prepreg to move together under the action of the mobile driving assembly 442 to correct the prepreg, the second air hole 445 is used for sucking dust around the prepreg, cleaning of working environment is ensured, inhalation of workers can be effectively avoided, dust adhesion on the surface of the prepreg can be effectively avoided, and processing of a circuit board is affected.
The above-described embodiments and features of the embodiments may be combined with each other without conflict.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention.
Claims (10)
1. A PCB laminate laminating apparatus, characterized in that: the device comprises a stacking discharging device (1), a mirror plate feeding device (2), a copper foil feeding device (3), a prepreg feeding device (4), an inner layer plate feeding device (5), a temporary storage table (6), a first transfer device (7), a second transfer device (8) and a third transfer device (9);
the stacking and discharging device (1) is provided with a conveying mechanism (11), a receiving mechanism (12) and a stacking area (13) for stacking materials, the receiving mechanism (12) comprises a bearing block (121) for bearing a bottom plate (14), the receiving mechanism (12) can slide to the position below the stacking area (13) and the position outside the position below the stacking area (13), the conveying direction of the conveying mechanism (11) is consistent with the sliding direction of the receiving mechanism (12), and the conveying mechanism (11) can be lifted to be higher than the bearing block (121) and lowered to be lower than the bearing block (121);
the mirror plate feeding device (2) is used for feeding the mirror plate to the mirror plate material position (24), the copper foil feeding device (3) is used for feeding a first copper foil to the mirror plate material position (24) and stacking the first copper foil above the mirror plate to form a copper foil-mirror plate structure, the copper foil feeding device (3) is also used for feeding a second copper foil to the copper foil material position (3223), the first transferring device (7) is used for transferring the copper foil-mirror plate structure from the mirror plate material position (24) to the copper foil material position (3223) and stacking the second copper foil above the first copper foil to form a copper foil-mirror plate-copper foil structure, and the first transferring device (7) is also used for transferring the copper foil-mirror plate-copper foil structure from the copper foil material position (3223) to the stacking area (13); the mirror plate material level (24), the copper foil material level (3223) and the superposition area (13) are arranged along a straight line, and the first transfer device (7) is provided with two linked picking and placing mechanisms;
the inner layer plate feeding device (5) is used for feeding the inner layer plate to an inner layer plate material level (531), the prepreg feeding device (4) is used for feeding the prepreg level to a first prepreg material level (41) and a second prepreg material level (42), and the second transferring device (8) is used for sequentially transferring materials from the inner layer plate material level (531) to the first prepreg material level (41), the second prepreg material level (42) and the temporary storage table (6) so as to stack out a prepreg-inner layer plate-prepreg structure and then transfer the prepreg-inner layer plate-prepreg structure to the temporary storage table (6); the inner layer plate material level (531), the first prepreg material level (41), the second prepreg material level (42) and the temporary storage table (6) are arranged along a straight line, and the second transfer device (8) is provided with three linked picking and placing mechanisms; the temporary storage table (6) is used for temporarily storing the prepreg-inner layer board-prepreg structure, and the third transfer device (9) is used for transferring the prepreg-inner layer board-prepreg structure from the temporary storage table (6) to the superposition area (13);
during production, a copper foil-mirror plate-copper foil structure and a prepreg-inner layer plate-prepreg structure are sequentially laminated on a bottom plate (14) in the laminating area (13).
2. The PCB laminate folding apparatus of claim 1, wherein: the conveying mechanism (11) is arranged into two sections, the first section conveying mechanism (11) is located below the stacking area (13), the second section conveying mechanism (11) is located outside the position below the stacking area (13), the two sections of conveying mechanisms (11) respectively and independently lift, and the two sections of conveying mechanisms (11) can be in butt joint to convey the bottom plate (14).
3. The PCB laminate folding apparatus of claim 2, wherein: when the empty bottom plate (14) is fed, the second section conveying mechanism (11) is lifted to receive the empty bottom plate (14), and the empty bottom plate (14) can be transferred to the bearing block (121) after the second section conveying mechanism (11) descends; the receiving mechanism (12) drives the empty bottom plate (14) to the overlapping area (13); after stacking, the first section conveying mechanism (11) lifts the bottom plate (14) carrying the materials, and then the first section conveying mechanism (11) and the second section conveying mechanism (11) both descend and send out the bottom plate (14) carrying the materials.
4. The PCB laminate folding apparatus of claim 1, wherein: the mirror plate feeding device (2) comprises a mirror plate transferring mechanism (21), a mirror plate discharging mechanism (22) and a mirror plate storage position (23) for storing the mirror plates of the whole stack, wherein the mirror plate transferring mechanism (21) is used for transferring the mirror plates on the mirror plate storage position (23) to the mirror plate discharging mechanism (22), and the mirror plate position (24) is located in the mirror plate discharging mechanism (22).
5. The PCB laminate folding apparatus of claim 4, wherein: the copper foil feeding devices (3) are provided with two groups, namely a first copper foil storage feeding device (31) and a second copper foil storage feeding device (32);
the first copper foil storage feeding device (31) comprises a first copper foil storage position (312) of a first copper foil transfer mechanism (311), the first copper foil storage position (312) is used for storing a whole stack of copper foil, and the first copper foil transfer mechanism (311) is used for transferring the copper foil on the first copper foil storage position (312) to a mirror plate position (24) and overlapping the copper foil above the mirror plate to form a copper foil-mirror plate structure;
the second copper foil storage loading attachment (32) includes second copper foil transfer mechanism (321), switch platform (322) and second copper foil storage position (323), second copper foil storage position (323) are used for depositing the copper foil of whole buttress, switch platform (322) are including one high one and two accepting bench (3221), switch platform (322) are provided with and connect material position (3222) and copper foil material position (3223), these two accepting bench (3221) homoenergetic horizontal migration to connect material position (3222) and copper foil material position (3223), second copper foil transfer mechanism (321) are used for transferring the copper foil on the second copper foil storage position (323) to accepting bench (3221) that are located and connect material position (3222), accepting bench (3221) is to copper foil transfer to copper foil material position (3223).
6. The PCB laminate folding apparatus of claim 1, wherein: the inner layer plate feeding device (5) comprises a Tray wheel rotating mechanism (51), an inner layer plate transferring mechanism (52) and a centering mechanism (53), wherein an inner layer plate material level (531) is located on the centering mechanism (53), the Tray wheel rotating mechanism (51) comprises a feeding component (511) for feeding a Tray plate with an inner layer plate and a discharging component (512) for discharging an empty Tray plate, the inner layer plate transferring mechanism (52) is provided with at least two linked transferring components which are respectively a first inner layer plate transferring component (5211) and a second inner layer plate transferring component (5212), the first inner layer plate transferring component (5211) is used for transferring the Tray plate with the inner layer plate carried by the feeding component (511) to the discharging component (512), the second inner layer plate transferring component (5212) is used for transferring the inner layer plate carried by the discharging component (512) to the centering mechanism (53), and the centering mechanism (53) is used for positioning and adjusting the inner layer plate.
7. The PCB laminate folding apparatus of claim 6, wherein: the centering mechanism (53) comprises a positioning plate (532) for supporting the inner layer plate, a correcting component (533) matched with the positioning plate (532) and used for correcting the inner layer plate, a first driving component connected with the correcting component (533) in a linkage mode, and a gas blowing hole (535) used for blowing the inner layer plate, wherein the positioning plate (532) is provided with a gas chamber, a plurality of gas flow grooves (536) are formed in the top end face of the positioning plate (532), and the gas flow grooves (536), the gas chamber and the gas blowing hole (535) are mutually communicated.
8. The PCB laminate folding apparatus of claim 6, wherein: the feeding component (511) and the discharging component (512) can both be lifted, and when the feeding component (511) descends by one stage, the discharging component (512) ascends by one stage.
9. The PCB laminate folding apparatus of claim 1, wherein: the prepreg feeding device (4) comprises a prepreg storage frame (43) and a prepreg correction platform (44), wherein the prepreg correction platform is positioned between the prepreg storage frame (43) and the prepreg material level, and the prepreg is taken out from the prepreg storage frame (43), corrected by the prepreg correction platform (44) and then transferred to the prepreg material level.
10. The PCB laminate folding apparatus of claim 9, wherein: the prepreg correction platform (44) comprises a bearing plate (441) and a second driving assembly for driving the bearing plate (441) to move, a supporting seat (443) is arranged at the bottom of the second driving assembly, a collecting cavity is arranged on the supporting seat (443), a first air hole (444) for adsorbing the prepreg and a second air hole (445) for adsorbing tiny dust are arranged on the bearing plate (441), the second air hole (445) is communicated with the collecting cavity, the prepreg is adsorbed on the bearing plate (441) through the first air hole (444), and under the action of the second driving assembly, the bearing plate (441) drives the sucked prepreg to move together to correct the prepreg, and the second air hole (445) is used for sucking tiny dust around the prepreg.
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| CN202211558823.7A CN116075075B (en) | 2022-12-06 | 2022-12-06 | PCB laminated board coincide equipment |
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| CN202211558823.7A CN116075075B (en) | 2022-12-06 | 2022-12-06 | PCB laminated board coincide equipment |
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