CN213186754U - Production equipment for laminated structure of circuit board - Google Patents

Abstract

The utility model relates to the field of circuit board production equipment, in particular to circuit board laminated structure production equipment, which comprises a sandwich structure laminating device, a prepreg feeding device, an inner layer plate feeding device, a material laminating device, a first transfer device, a second transfer device, a third transfer device and a total superposition table; the sandwich structure laminating device is used for laminating the copper foil and the mirror plate into a sandwich structure; the first transfer device is used for transferring the sandwich structure from the sandwich structure laminating device to the general laminating station; the second transfer device is used for transferring the inner-layer plate from the inner-layer plate feeding device to the stacking table of the stacking device; the prepreg feeding device is used for transferring prepregs to the material stacking table; the stacking device is used for stacking the prepreg and the inner plate into a prepreg-inner plate-prepreg structure; the third transfer device is used for transferring the prepreg-inner plate-prepreg structure to the general laminating station. Which can improve the production efficiency of the circuit board laminated structure.

Description

Production equipment for laminated structure of circuit board

Technical Field

The utility model relates to a circuit board production facility field especially relates to a circuit board laminated structure production facility.

Background

The structure required by the finished circuit board product is copper foil-prepreg-inner plate-prepreg-copper foil, so that more layers need to be laminated in production, and in order to separate the structures required by the two layers of circuit boards, a mirror plate needs to be added between the copper foil and the copper foil, and the copper foil-mirror plate-copper foil is called a sandwich structure.

Therefore, during the production of the circuit board, a cyclic lamination structure of copper foil-mirror plate-copper foil-prepreg-inner plate-prepreg-copper foil-mirror plate-copper foil, that is, a cyclic lamination structure of a sandwich structure-prepreg-inner plate-prepreg-sandwich structure, is stacked; and subsequently, the structure between the two layers of mirror plates is the structure required by the finished product of the circuit board.

However, the prior art devices have not been able to completely accomplish the above-described stacking work.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a circuit board laminated structure production facility aims at solving the equipment among the prior art and still can not accomplish above-mentioned range upon range of problem completely.

In order to achieve the above object, the present invention provides a circuit board laminated structure production apparatus, which includes a sandwich structure laminating device, a prepreg feeding device, an inner layer board feeding device, a material stacking device, a first transfer device, a second transfer device, a third transfer device and a total laminating table; the sandwich structure laminating device is used for laminating the copper foil and the mirror plate into a sandwich structure; the first transfer device is used for transferring the sandwich structure from the sandwich structure laminating device to the general laminating station; the second transfer device is used for transferring the inner-layer plate from the inner-layer plate feeding device to a stacking table of the stacking device; the prepreg feeding device is used for transferring prepregs to the laminating table; the stacking device is used for stacking the prepreg and the inner plate into a prepreg-inner plate-prepreg structure; the third transfer device is used for transferring the prepreg-inner plate-prepreg structure to the general laminating table; during production, the sandwich structure and the prepreg-inner plate-prepreg structure are sequentially stacked in the total stacking table.

Further, the sandwich structure laminating device comprises a first copper foil storage frame, a second copper foil storage frame, a mirror plate feeding device, a material sending device, a first copper foil transfer device, a second copper foil transfer device and a mirror plate transfer device; the material delivery device is provided with a material receiving position and a material discharging position; the mirror plate feeding device is used for feeding the mirror plate and positioning the fed mirror plate; the first copper foil transfer device is used for transferring copper foil from the first copper foil storage frame to the position above the mirror plate of the mirror plate feeding device; the second copper foil transfer device is used for transferring copper foils from the second copper foil storage frame to the material receiving position of the material sending-out device; the mirror plate transfer device is used for transferring the laminated structure of the copper foil and the mirror plate from the mirror plate feeding device to the upper part of the copper foil of the material delivery device; the material delivery device delivers the sandwich structure from the material receiving position to the material delivery position.

Furthermore, the prepreg feeding device comprises a prepreg storage frame, a taking and placing mechanism, and a suction nozzle and a pressure rod which are arranged on the prepreg storage frame; the taking and placing mechanism is suitable for moving to the upper side of the prepreg storage frame and sucking prepregs from the prepreg storage frame, the taking and placing mechanism is provided with a flanging mechanism, the flanging mechanism is used for flanging the edge part of the sucked prepregs upwards, the air suction nozzle is suitable for sucking air from bottom to top to the flanged edge part of the prepregs so as to separate the adhered prepregs, and the pressure rod is suitable for pressing the separated prepregs below; and the taking and placing mechanism is used for conveying the separated prepregs to the material stacking table.

Furthermore, the pick-and-place mechanism comprises a mounting frame, a fixing frame, a flanging driving mechanism and a plurality of suckers, wherein the fixing frame is fixed on the mounting frame, the flanging frame is rotatably connected to the fixing frame, the suckers are distributed on the fixing frame and the flanging frame, and the flanging driving mechanism is connected between the fixing frame and the flanging frame and drives the flanging frame to rotate relative to the fixing frame.

Furthermore, the production equipment of the circuit board laminated structure comprises two groups of prepreg feeding devices which are arranged one above the other; the stacking device comprises a lifting mechanism for driving the stacking platform to lift, and when the stacking platform moves to a low position, the prepreg feeding device positioned below can place prepregs on the stacking platform; when the stacking table moves to a high position, the prepreg feeding device positioned above can place prepregs on the stacking table.

Furthermore, the air suction nozzle is arranged on the prepreg storage frame through a telescopic mechanism, the telescopic mechanism is arranged in an inclined mode, and the air suction nozzle can move to an extending position and a retracting position; when the air suction nozzle is located at the extending position, the air suction nozzle is close to the prepreg; when the suction nozzle is located the retraction position, the suction nozzle is far away from the prepreg and can avoid the prepreg.

Furthermore, the pressing rod is mounted on the prepreg storage frame through a bidirectional driving mechanism, the bidirectional driving mechanism is used for driving the pressing rod to move longitudinally and vertically, and the pressing rod can move to an extending position and a retracting position; when the pressure lever is positioned at the extending position, the pressure lever can press the prepreg downwards; when the pressing rod is located at the retraction position, the pressing rod can avoid the prepreg.

Furthermore, the inner-layer plate feeding device comprises a feeding conveying mechanism, a turnover mechanism and a discharging conveying mechanism which are connected in sequence, the inner-layer plate is suitable for being conveyed by the feeding conveying mechanism, the turnover mechanism and the discharging conveying mechanism in sequence, and the turnover mechanism can turn over the inner-layer plate; the second transfer device is capable of picking up the inner layer sheet from the outfeed conveyor mechanism.

Furthermore, the turnover mechanism comprises a support frame, a turnover frame and two groups of conveying roller sets, the turnover frame is rotatably connected to the support frame, the two groups of conveying roller sets are arranged on the turnover frame in parallel, and a conveying channel is formed between the two groups of conveying roller sets.

Further, a correcting device is arranged between the inner-layer plate feeding device and the stacking device, the correcting device comprises a support, a storage table, a correcting mechanism and a steering mechanism, the correcting mechanism is used for correcting the inner-layer plates placed on the storage table, and the steering mechanism is connected between the support and the storage table so as to enable the storage table to horizontally rotate relative to the support; the second transfer device can transfer the inner-layer plate from the inner-layer plate feeding device to the correcting device and then to the stacking device.

The utility model provides a circuit board laminated structure production facility, during the use, through the cooperation of each device, realize accomplishing the circulation of copper foil-runner plate-copper foil-prepreg-inner plating-prepreg-copper foil-runner plate-copper foil and fold the material, improve circuit board laminated structure's production efficiency.

Drawings

Fig. 1 is a schematic perspective view of the circuit board laminated structure production apparatus of the present invention;

fig. 2 is a plan view of the circuit board laminated structure production apparatus of the present invention;

fig. 3 is a front view of the circuit board laminated structure production apparatus of the present invention;

FIG. 4 is a schematic perspective view of a sandwich construction laminated device;

FIG. 5 is a schematic perspective view of a prepreg feeding device and a stacking device;

FIG. 6 is a schematic view of a partial perspective structure of the pick and place mechanism;

fig. 7 is a schematic perspective view of a prepreg storage frame;

fig. 8 is a partial enlarged view at a of fig. 7;

FIG. 9 is a schematic perspective view of an inner plate feeder;

FIG. 10 is a schematic perspective view of the turnover mechanism;

FIG. 11 is a schematic view of a partial perspective of the canting mechanism;

fig. 12 is a schematic perspective view of the calibration device.

[ description of reference ]

1-sandwich structure laminating device, 11-first copper foil storage frame, 12-second copper foil storage frame, 13-mirror plate feeding device, 14-material sending device, 15-first copper foil transferring device, 16-second copper foil transferring device and 17-mirror plate transferring device;

2-prepreg feeding device, 21-prepreg storage frame, 22-picking and placing mechanism, 221-mounting frame, 222-fixing frame, 223-flanging frame, 224-flanging driving mechanism, 225-sucking disc, 226-sliding driving mechanism, 227-sliding seat, 23-air suction nozzle, 231-telescoping mechanism, 24-pressing rod, 241-bidirectional driving mechanism and 25-prepreg correcting mechanism;

3-inner layer plate feeding device, 31-feeding conveying mechanism, 32-turnover mechanism, 321-support frame, 322-turnover frame, 323-conveying roller group and 33-discharging conveying mechanism;

4-stacking device, 41-stacking platform and 42-lifting mechanism;

5-a first transfer device;

6-a second transfer device;

7-a correcting device, 71-a bracket, 72-a storage table, 73-a correcting mechanism, 74-a steering mechanism and 75-a lifting frame;

8-a third transfer device;

9-total folding station, 91-first temporary placing station, 92-second temporary placing station.

Detailed Description

The present invention will be described in detail with reference to the following specific examples.

In the present application, when directional terms are used, they are used for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the scope of the invention in any way. In the present invention, unless otherwise expressly specified or limited, when terms such as "disposed on," "connected to," or "connected to" are present, these terms are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; or may be a mechanical connection; the two elements can be directly connected or connected through an intermediate medium, and the two elements can be communicated with each other. The specific meaning of the above terms in the present invention can be understood by those skilled in the art according to specific situations. In the present invention, unless otherwise specified and limited, when the first feature is present as "upper" and "lower" of the second feature, it may include that the first feature is in direct contact with the second feature, and it may also include that the first feature is in contact with the second feature not in direct contact but through another feature therebetween. Moreover, the first feature being "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely an elevation at which the first feature is higher than the elevation of the second feature; a first feature may be "below" a second feature, including a first feature that is directly below and obliquely below the second feature, or may simply be an indication that the first feature is at a lower elevation than the second feature.

The utility model provides a circuit board laminated structure production device, as shown in fig. 1 to 12, which comprises a sandwich structure laminating device 1, a prepreg feeding device 2, an inner plate feeding device 3, a laminating device 4, a first transfer device 5, a second transfer device 6, a third transfer device 8 and a total laminating table 9; the sandwich structure laminating device 1 is used for laminating a copper foil and a mirror plate into a sandwich structure; the first transfer device 5 is used to transfer the sandwich structure from the sandwich structure lamination device 1 to the general lamination station 9; the second transfer device 6 is used for transferring the inner-layer plate from the inner-layer plate feeding device 3 to the stacking table 41 of the stacking device 4; the prepreg feeding apparatus 2 is used to transfer prepregs to the laminating table 41; the stacking device 4 is used for stacking the prepreg and the inner layer plate into a prepreg-inner layer plate-prepreg structure; the third transfer device 8 is used for transferring the prepreg-inner plate-prepreg structure to the general laminating station 9; during production, the sandwich structure and the prepreg-inner plate-prepreg structure are sequentially stacked in the total stacking station 9.

Based on the structure, when the production equipment of the circuit board laminated structure is used, the circulation stacking of the copper foil, the mirror plate, the copper foil, the prepreg, the inner layer plate, the prepreg, the copper foil, the mirror plate and the copper foil is completed through the matching of all devices, and the production efficiency of the circuit board laminated structure is improved.

In this embodiment, the sandwich structure laminating apparatus 1 includes a first copper foil stock frame 11, a second copper foil stock frame 12, a mirror plate feeding device 13, a material sending device 14, a first copper foil transferring device 15, a second copper foil transferring device 16, and a mirror plate transferring device 17; the material delivery device 14 has a material receiving position and a material discharging position; the mirror plate feeding device 13 is used for feeding the mirror plate and positioning the fed mirror plate; a first copper foil transfer device 15 for transferring the copper foil from the first copper foil stock frame 11 to above the mirror plate of the mirror plate feeding device 13; the second copper foil transfer device 16 is used for transferring copper foil from the second copper foil storage frame 12 to the receiving position of the material delivery device 14; the mirror plate transfer device 17 is used for transferring the laminated structure of the copper foil and the mirror plate from the mirror plate feeding device 13 to the upper part of the copper foil of the material delivery device 14; the material delivery device 14 delivers the sandwich structure from the receiving position to the discharge position.

Through the above-mentioned structural arrangement, can realize the following action: and feeding the mirror plate, placing the first layer of copper foil above the mirror plate after the mirror plate is in place, placing the laminated structure of the copper foil and the mirror plate above the other layer of copper foil to form a copper foil sandwich structure, and then sending out the sandwich structure.

In the present embodiment, the prepreg feeding apparatus 2 includes a prepreg storage frame 21, a pick-and-place mechanism 22, and a suction nozzle 23 and a pressure bar 24 disposed on the prepreg storage frame 21; the picking and placing mechanism 22 is suitable for moving to the position above the prepreg storage frame 21 and sucking the prepregs from the prepreg storage frame 21, the picking and placing mechanism 22 is provided with a flanging mechanism, and the flanging mechanism is used for flanging the edge part of the sucked prepregs upwards; the air suction nozzle 23 is suitable for sucking air from bottom to top to the edge part of the prepreg after being flanged so as to separate the adhered prepreg, and the pressure rod 24 is suitable for pressing down the separated prepreg which is positioned below; the pick-and-place mechanism 22 feeds the separated prepreg to the stacking table 41.

Based on the structure, the picking and placing mechanism 22 sucks the prepregs, the picking and placing mechanism 22 turns over the edge part of the prepregs, so that the prepregs which are adhered together are easier to separate, then the suction nozzle 23 sucks air towards the edge part which is turned over, through suction, the picking and placing mechanism 22 sucks the uppermost prepreg, the suction nozzle 23 sucks the lower prepreg downwards, so that a gap is formed between the lower prepreg and the uppermost prepreg, the compression rod 24 is inserted into the gap, and the lower prepreg is pressed downwards, so that the uppermost prepreg is separated from the lower prepreg. The pick and place mechanism 22 is moved away so that the individual prepregs can be individually picked from the stack of prepregs.

In this embodiment, the pick-and-place mechanism 22 includes a mounting frame 221, a fixing frame 222, a flanging frame 223, a flanging driving mechanism 224 and a plurality of suction cups 225, wherein the fixing frame 222 is fixed on the mounting frame 221, the flanging frame 223 is rotatably connected to the fixing frame 222, the plurality of suction cups 225 are distributed and installed on the fixing frame 222 and the flanging frame 223, and the flanging driving mechanism 224 is connected between the fixing frame 222 and the flanging frame 223 and drives the flanging frame 223 to rotate relative to the fixing frame 222. The semi-solidified sheet is sucked up through the structure, and the semi-solidified sheet is flanged. The flanging driving mechanism 224 preferably adopts a telescopic cylinder, such as an air cylinder or a hydraulic cylinder, and the flanging frame 223 is driven to rotate relative to the fixed frame 222 by the telescopic cylinder. Preferably, the prepreg storage frame further comprises a sliding base 227, the sliding base 227 is mounted on the prepreg storage frame 21 through a sliding driving mechanism 226, the sliding base 227 is further provided with a lifting mechanism, and the mounting frame 221 is mounted at a movable end of the lifting mechanism, so that the mounting frame 221 can be lifted and slid to pick and place and transfer the prepreg. Further preferably, a prepreg correction mechanism 25 is further disposed between the prepreg storage frame 21 and the stacking device 4, and the pick-and-place mechanism 22 can place the prepreg on the prepreg correction mechanism 25 to correct the direction and position of the prepreg and then send the prepreg to the stacking device 4.

In this embodiment, the production equipment for the circuit board laminated structure comprises two groups of prepreg feeding devices 2 arranged one above the other; the stacking device 4 comprises a lifting mechanism 42 for driving the stacking table 41 to lift, when the stacking table 41 moves to a low position, the prepreg feeding device 2 positioned below can place prepregs on the stacking table 41; when the stacking table 41 moves to the high position, the prepreg feeding apparatus 2 located above can place the prepreg on the stacking table 41.

Based on the structure, the material stacking table 41 is lowered to the lower position, the prepreg feeding device 2 located below transfers the prepreg from the prepreg storage frame 21 to the material stacking table 41, then the second transfer device 6 places the inner layer plate above the prepreg of the lower layer, then the material stacking table 41 is raised to the upper position, the prepreg feeding device 2 located above transfers the prepreg from the prepreg storage frame 21 to the material stacking table 41, the prepreg is placed above the inner layer plate, and then the work of placing two layers of prepregs on the front and back surfaces of the inner layer plate is completed.

In the present embodiment, the suction nozzle 23 is mounted on the prepreg storage frame 21 through the telescopic mechanism 231, the telescopic mechanism 231 is disposed obliquely, and the suction nozzle 23 can move to the extended position and the retracted position; when the suction nozzle 23 is in the extended position, the suction nozzle 23 is close to the prepreg; when the suction nozzle 23 is located at the retracted position, the suction nozzle 23 is far away from the prepreg and can avoid the prepreg. Based on the structure, the picking and placing mechanism 22 can be prevented from touching the suction nozzle 23 when picking up the prepreg, and the suction nozzle 23 can be prevented from extending to be close to the prepreg when the suction nozzle 23 is required to pick up the prepreg.

In the embodiment, the pressing rod 24 is installed on the prepreg storage frame 21 through a bidirectional driving mechanism 241, the bidirectional driving mechanism 241 is used for driving the pressing rod 24 to move longitudinally and vertically, and the pressing rod 24 can move to an extending position and a retracting position; when the pressing rod 24 is located at the extending position, the pressing rod 24 can press the prepreg downwards; when the press rod 24 is located at the retracted position, the press rod 24 can avoid the prepreg. Based on the above structure, when the picking and placing mechanism 22 picks up the prepreg, the pressing rod 24 can be prevented from obstructing the rising of the prepreg, and when the prepreg needs to be pressed down, the pressing rod 24 can be moved to the upper part of the prepreg below and then extended into the prepreg below. In addition, the pressing rod 24 can move vertically, a gap is formed between the prepregs after the pressing rod 24 rises, the entering success rate is high, and the pressing rod 24 descends to press the prepregs after entering the gap.

In the embodiment, the inner-layer plate feeding device 3 comprises a feeding conveying mechanism 31, a turnover mechanism 32 and a discharging conveying mechanism 33 which are connected in sequence, the inner-layer plate is suitable for being conveyed by the feeding conveying mechanism 31, the turnover mechanism 32 and the discharging conveying mechanism 33 in sequence, and the turnover mechanism 32 can turn over the inner-layer plate; the second transfer device 6 is able to take up the inner layer sheet from the outfeed conveyor mechanism 33. Based on the structure, the turnover mechanism 32 can turn over the inner-layer plate to adapt to different production requirements.

In this embodiment, the turnover mechanism 32 includes a support frame 321, a turnover frame 322, and two sets of conveying roller sets 323, the turnover frame 322 is rotatably connected to the support frame 321, the two sets of conveying roller sets 323 are parallel to each other and are mounted on the turnover frame 322, and a conveying passage is formed between the two sets of conveying roller sets 323. The inner plate conveys in getting into transfer passage, when needs overturn the inner plate, conveying roller group 323 stall, and the inner plate stops at tilting mechanism 32, and roll-over stand 322 upset 180 degrees to the upset of realization inner plate, the inner plate is seen off after the upset. When the inner-layer plate does not need to be turned, the conveying roller group 323 does not stop rotating, and the inner-layer plate directly passes through the turning mechanism 32.

In the present embodiment, a correcting device 7 is provided between the inner-layer board feeding device 3 and the stacking device 4, the correcting device 7 includes a support 71, a storage table 72, a correcting mechanism 73, and a steering mechanism 74, the correcting mechanism 73 is used for correcting the inner-layer boards placed on the storage table 72, and the steering mechanism 74 is connected between the support 71 and the storage table 72 to horizontally rotate the storage table 72 relative to the support 71; the second transfer device 6 is capable of transferring the inner layer boards from the inner layer board feeding device 3 to the correcting device 7 and then to the stacking device 4. Based on the structure, the inner-layer plate is conveyed to the stacking device 4 and then is corrected by the correcting device 7, so that the stacking quality is improved. Preferably, a lifting frame 75 is further provided on the support 71, the lifting frame 75 is used for driving the storage table 72 to lift, and after the storage table 72 is lifted, the storage table can be avoided from the correcting mechanism 73, so that the steering mechanism 74 can avoid colliding with the correcting mechanism 73 when driving the storage table 72 to steer.

In this embodiment, as shown in fig. 1 to fig. 3, a first temporary placing table 91 and a second temporary placing table 92 are disposed on two sides of the total laminating table 9, the first temporary placing table 91 is used for temporarily storing a sandwich structure, and the second temporary placing table 92 is used for temporarily storing a prepreg-inner-layer-prepreg structure. The first transfer device 5 is set to a double-head linkage, the second transfer device 6 is set to a three-head linkage, and the third transfer device 8 is set to a single head. The first head of the first transfer device 5 transfers the sandwich structure from the structure lamination device 1 to the first lay-on station 91, while the second head of the first transfer device 5 transfers the sandwich structure from the first lay-on station 91 to the general lamination station 9. A first head of the second transfer device 6 transfers the inner plies from the inner ply loading device 3 to the correction device 7, while a second head of the second transfer device 6 transfers the inner plies from the correction device 7 to the stacking device 4, while a third head of the second transfer device 6 transfers the prepreg-inner ply-prepreg structure from the stacking device 4 to the second lay-up table 92. The third transfer device 8 transfers the prepreg-core-prepreg structure from the second lay-up station 92 to the total lay-up station 9. The above actions can finish the ordered and efficient transfer of various materials, and the materials can be accurately stacked after the time sequence is set.

The utility model provides a circuit board laminated structure production facility, during the use, through the cooperation of each device, realize accomplishing the circulation of copper foil-runner plate-copper foil-prepreg-inner plating-prepreg-copper foil-runner plate-copper foil and fold the material, improve circuit board laminated structure's production efficiency.

The features of the embodiments and embodiments described above may be combined with each other without conflict.

It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.

Claims (10)

1. A circuit board laminated structure production equipment is characterized in that: the device comprises a sandwich structure laminating device (1), a prepreg feeding device (2), an inner-layer plate feeding device (3), a laminating device (4), a first transfer device (5), a second transfer device (6), a third transfer device (8) and a total laminating table (9);

the sandwich structure laminating device (1) is used for laminating the copper foil and the mirror plate into a sandwich structure;

-said first transfer means (5) are intended to transfer the sandwich structure from the sandwich structure lamination device (1) to said general lamination station (9);

the second transfer device (6) is used for transferring the inner-layer plate from the inner-layer plate feeding device (3) to a stacking table (41) of the stacking device (4);

the prepreg feeding device (2) is used for transferring prepregs to the stacking table (41);

the stacking device (4) is used for stacking the prepreg and the inner layer plate into a prepreg-inner layer plate-prepreg structure;

the third transfer device (8) is used for transferring the prepreg-inner plate-prepreg structure to the general laminating table (9);

during production, a sandwich structure and a prepreg-inner plate-prepreg structure are sequentially stacked in the total laminating table (9).

2. The circuit board laminated structure production apparatus according to claim 1, wherein: the sandwich structure laminating device (1) comprises a first copper foil storage frame (11), a second copper foil storage frame (12), a mirror plate feeding device (13), a material sending device (14), a first copper foil transfer device (15), a second copper foil transfer device (16) and a mirror plate transfer device (17);

the material delivery device (14) is provided with a material receiving position and a material discharging position;

the mirror plate feeding device (13) is used for feeding the mirror plate and positioning the fed mirror plate;

the first copper foil transfer device (15) is used for transferring copper foil from the first copper foil stock frame (11) to the position above the mirror plate of the mirror plate feeding device (13);

the second copper foil transfer device (16) is used for transferring copper foils from the second copper foil storage frame (12) to a material receiving position of the material sending-out device (14);

the mirror plate transfer device (17) is used for transferring the laminated structure of the copper foil and the mirror plate from the mirror plate feeding device (13) to the upper part of the copper foil of the material delivery device (14);

the material delivery device (14) delivers the sandwich structure from the material receiving position to the material delivery position.

3. The circuit board laminated structure production apparatus according to claim 1, wherein: the prepreg feeding device (2) comprises a prepreg storage frame (21), a taking and placing mechanism (22), and a suction nozzle (23) and a pressure lever (24) which are arranged on the prepreg storage frame (21);

the taking and placing mechanism (22) is suitable for moving to the position above the prepreg storage frame (21) and sucking prepregs from the prepreg storage frame, the taking and placing mechanism (22) is provided with a flanging mechanism, and the flanging mechanism is used for flanging the edge part of the sucked prepregs upwards;

the air suction nozzle (23) is suitable for sucking air from bottom to top to the edge part of the semi-solidified sheet after being flanged so as to separate the adhered semi-solidified sheet, and the pressure lever (24) is suitable for pressing down the semi-solidified sheet which is separated and positioned below;

the taking and placing mechanism (22) sends the separated prepregs to the stacking table (41).

4. The circuit board laminated structure production apparatus according to claim 3, wherein: the taking and placing mechanism (22) comprises a mounting frame (221), a fixing frame (222), a flanging frame (223), a flanging driving mechanism (224) and a plurality of suckers (225), wherein the fixing frame (222) is fixed on the mounting frame (221), the flanging frame (223) is rotatably connected to the fixing frame (222), the suckers (225) are distributed on the fixing frame (222) and the flanging frame (223), and the flanging driving mechanism (224) is connected between the fixing frame (222) and the flanging frame (223) and drives the flanging frame (223) to rotate relative to the fixing frame (222).

5. The circuit board laminated structure production apparatus according to claim 4, wherein: the circuit board laminated structure production equipment comprises two groups of prepreg feeding devices (2) which are arranged one above the other;

the stacking device (4) comprises a lifting mechanism (42) for driving the stacking platform (41) to lift, and when the stacking platform (41) moves to a low position, the prepreg feeding device (2) positioned below can place prepregs on the stacking platform (41); when the stacking table (41) moves to a high position, the prepreg feeding device (2) located above can place prepregs on the stacking table (41).

6. The circuit board laminated structure production apparatus according to any one of claims 3 to 5, wherein: the suction nozzle (23) is mounted on the prepreg storage frame (21) through a telescopic mechanism (231), the telescopic mechanism (231) is obliquely arranged, and the suction nozzle (23) can move to an extending position and a retracting position; when the suction nozzle (23) is located at the extending position, the suction nozzle (23) is close to the prepreg; when suction nozzle (23) are located the position of contracting, suction nozzle (23) are kept away from the prepreg and can dodge the prepreg.

7. The circuit board laminated structure production apparatus according to any one of claims 3 to 5, wherein: the pressing rod (24) is mounted on the prepreg storage frame (21) through a bidirectional driving mechanism (241), the bidirectional driving mechanism (241) is used for driving the pressing rod (24) to move longitudinally and vertically, and the pressing rod (24) can move to an extending position and a retracting position; when the pressure lever (24) is located at the extending position, the pressure lever (24) can press the prepreg downwards; when the pressing rod (24) is located at the retracted position, the pressing rod (24) can avoid the prepreg.

8. The circuit board laminated structure production apparatus according to claim 1, wherein: the inner-layer plate feeding device (3) comprises a feeding conveying mechanism (31), a turnover mechanism (32) and a discharging conveying mechanism (33) which are sequentially connected, the inner-layer plate is suitable for being sequentially conveyed by the feeding conveying mechanism (31), the turnover mechanism (32) and the discharging conveying mechanism (33), and the turnover mechanism (32) can turn over the inner-layer plate;

the second transfer device (6) is capable of picking up the inner layer sheet from the outfeed conveyor mechanism (33).

9. The circuit board laminated structure production apparatus according to claim 8, wherein: the turnover mechanism (32) comprises a support frame (321), a turnover frame (322) and two groups of conveying roller sets (323), wherein the turnover frame (322) is rotatably connected to the support frame (321), the two groups of conveying roller sets (323) are arranged on the turnover frame (322) in parallel, and a conveying channel is formed between the two groups of conveying roller sets (323).

10. The circuit board laminated structure production apparatus according to claim 8 or 9, wherein: a correcting device (7) is arranged between the inner-layer plate feeding device (3) and the stacking device (4), the correcting device (7) comprises a support (71), a storage table (72), a correcting mechanism (73) and a steering mechanism (74), the correcting mechanism (73) is used for correcting the inner-layer plates placed on the storage table (72), and the steering mechanism (74) is connected between the support (71) and the storage table (72) so as to enable the storage table (72) to horizontally rotate relative to the support (71);

the second transfer device (6) can transfer the inner-layer plate from the inner-layer plate feeding device (3) to the correcting device (7) and then to the stacking device (4).

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