CN116053175A - Wafer scheduling method and device and semiconductor device - Google Patents

Wafer scheduling method and device and semiconductor device Download PDF

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CN116053175A
CN116053175A CN202211501746.1A CN202211501746A CN116053175A CN 116053175 A CN116053175 A CN 116053175A CN 202211501746 A CN202211501746 A CN 202211501746A CN 116053175 A CN116053175 A CN 116053175A
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target
wafer
movement
scheduling
manipulator
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CN116053175B (en
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许晓康
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Beijing Naura Microelectronics Equipment Co Ltd
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Beijing Naura Microelectronics Equipment Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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Abstract

The application discloses a wafer dispatching method, a device and semiconductor equipment, wherein a target manipulator for carrying wafers of a current batch is determined based on a source chamber and a target chamber of the wafers of the current batch; acquiring a scheduling mode of a target manipulator from a scheduling storage object in real time, wherein the scheduling storage object is generated when a processing task is started, and the target manipulator scheduling mode is preconfigured by a manipulator configuration module and is stored in the scheduling storage object when the processing task is started; and determining a moving sequence of the moving action of the wafers containing the current batch based on the target manipulator dispatching mode, and moving the wafers of the current batch according to the moving sequence. Therefore, the method and the device can set the manipulator dispatching mode meeting the dispatching requirement for the wafers of the current batch in advance, and dispatch the wafers based on the correspondingly set manipulator dispatching mode during wafer dispatching, so that a software restart is not needed to take effect, and the wafer dispatching method is more flexible.

Description

Wafer scheduling method and device and semiconductor device
Technical Field
The present disclosure relates to the field of semiconductor technologies, and in particular, to a wafer scheduling method and apparatus, and a semiconductor device.
Background
The semiconductor device includes a transfer chamber and a process chamber. The process flow is generally different for different batches of wafers (Wafer), resulting in different movement sequences (representing movement of wafers between chambers of the semiconductor device) corresponding to the different batches of wafers.
The existing wafer scheduling scheme is as follows: writing a scheduling mode of each chamber of the semiconductor equipment in the configuration file in advance; when the wafers of the current batch start to be dispatched, the dispatching mode of each chamber in the configuration file is read, and a moving sequence corresponding to the wafers of the current batch is determined based on the dispatching mode of each chamber, so that the dispatching of the wafers of the current batch is completed according to the determined moving sequence corresponding to the wafers of the current batch.
However, in the process of executing wafer scheduling by the machine software, the chamber scheduling mode cannot be modified in the software operation life cycle, and if the chamber scheduling mode is to be modified, the configuration file needs to be modified, and the software is restarted to be effective. This scheduling scheme is less flexible for users who need to frequently modify the chamber scheduling pattern.
Disclosure of Invention
The invention aims to provide a wafer dispatching method, a device and semiconductor equipment, wherein a manipulator dispatching mode meeting dispatching requirements is set for wafers of a current batch, and the wafers are dispatched based on the correspondingly set manipulator dispatching mode in wafer dispatching, so that software restarting is not needed to take effect, and the wafer dispatching method is more flexible.
In order to solve the above technical problems, the present application provides a wafer scheduling method, including:
determining a target robot for handling the current lot of wafers based on the source chamber and the target chamber of the current lot of wafers;
the method comprises the steps that a scheduling mode of the target manipulator is obtained from a scheduling storage object in real time, the scheduling storage object is generated when a processing task is started, and the target manipulator scheduling mode is preconfigured through a manipulator configuration module and is stored in the scheduling storage object when the processing task is started;
and determining a moving sequence of the moving action of the wafers in the current batch based on the target manipulator dispatching mode, and moving the wafers in the current batch according to the moving sequence.
Optionally, the wafer scheduling method includes:
and correspondingly setting manipulator scheduling modes meeting respective scheduling requirements for the wafers of different process flows based on the scheduling requirements of the wafers of different process flows.
Optionally, the scheduling requirements of the wafers based on different process flows correspondingly set a robot scheduling mode meeting respective scheduling requirements for the wafers of different process flows, including:
Responding to a received manipulator dispatching mode selection instruction of a dispatching mode editing interface corresponding to a wafer of a target process flow, and determining a manipulator dispatching mode matched with the manipulator dispatching mode selection instruction in the dispatching mode editing interface as a manipulator dispatching mode corresponding to the wafer of the target process flow; wherein the target process flow is any one of the process flows.
Optionally, the wafer scheduling method further includes:
storing the target manipulator dispatching mode into a dispatching storage object corresponding to the wafers of the current batch in a key value pair mode for use in determining the moving sequence; the name of the manipulator is key, and the scheduling mode is value.
Optionally, the determining a movement sequence of movement actions including the current lot of wafers based on the target robot dispatch mode includes:
in the dispatching process of the wafers in the current batch, determining the wafer with the highest moving priority from the wafers in the current batch based on the current state of the wafers in the current batch at regular intervals, and taking the wafer with the highest moving priority as a target wafer for current dispatching;
Determining the movement action of the target wafer based on the current wafer state, chamber state and manipulator state of the semiconductor device and the manipulator dispatching mode corresponding to the current batch of wafers;
performing simulated movement on the target wafer according to the movement of the target wafer, and returning to execute the step of determining the wafer with the highest movement priority from the wafers in the current batch based on the current state of the wafers in the current batch by taking the wafer state of the current batch after the simulated movement of the target wafer as a reference until the movement of the wafers in the current batch under the preset movement step number is determined;
and obtaining an optimal movement sequence containing the movement action of the wafers of the current batch under the preset movement steps based on the determined movement action of the wafers of the current batch under the preset movement steps.
Optionally, the number of wafers with the highest movement priority determined from the wafers in the current batch is multiple; the step of taking the wafer with the highest moving priority as the target wafer of the current scheduling comprises the following steps:
taking a plurality of wafers with the highest movement priority as target wafers of the current dispatching respectively to obtain movement actions of the wafers of the current batch under the preset movement steps under the wafers with different highest movement priorities;
The obtaining an optimal movement sequence including the movement motion of the current lot of wafers under the preset movement steps based on the determined movement motion of the current lot of wafers under the preset movement steps comprises the following steps:
based on the movement actions of the current batch of wafers under the preset movement step numbers under the wafers with different highest movement priorities, obtaining a plurality of movement sequences containing the movement actions of the current batch of wafers under the preset movement step numbers in a one-to-one correspondence manner;
and taking the moving sequence which takes the minimum moving time in the moving sequences as the optimal moving sequence.
Optionally, a target robot for moving the target wafer from the source chamber to the target chamber includes a first slot and a second slot;
the determining the movement of the target wafer based on the current wafer state, the chamber state, the robot state of the semiconductor device, and the robot dispatch mode corresponding to the current lot of wafers includes at least one of:
if the target wafer is on the target manipulator, determining a movement action of the target wafer based on a dispatching mode of the target manipulator and a chamber state of the target chamber;
If the target wafer is in the source chamber and the target manipulator and the target chamber both have idle slots, determining a movement action of the target wafer based on a scheduling mode of the target manipulator;
if the target wafer is in the source chamber and the slot positions of the target manipulator are idle and the target chamber has no idle slot position, determining the movement action of the target wafer based on the scheduling mode of the target manipulator;
if the target wafer is in the source chamber and the first slot is provided with a wafer, the second slot is idle, and the target chamber has no idle slot, determining a movement action of the target wafer based on a scheduling mode of the wafer placed on the first slot to be sent into the chamber and the target manipulator;
and if the target wafer is not on the target manipulator and the target manipulator has no idle slot, determining that the target wafer has no movement.
Optionally, the scheduling modes of the target manipulator include a Push scheduling mode, a Pull scheduling mode and a Free scheduling mode;
the Push scheduling mode indicates that when the target manipulator finishes the operation of the source chamber on the target wafer, the target wafer is immediately taken out of the source chamber, and when the target chamber is idle, the target wafer is placed in the target chamber; the Pull dispatch mode indicates that the target manipulator takes out the target wafer in the source chamber and puts the target wafer into the target chamber when the target chamber is idle; and the Free scheduling mode is the Push scheduling mode under the default condition, and is automatically switched into the Push scheduling mode when the target chamber is processed.
Optionally, the determining the movement of the target wafer based on the scheduling mode of the target robot and the chamber state of the target chamber includes:
if the dispatch mode of the target manipulator is the Push dispatch mode, determining the movement action of the target wafer as the exchange action for exchanging the wafer in the target chamber with the target wafer when the wafer exists in the target chamber; determining a movement of the target wafer as a placement motion for placing the target wafer into the target chamber when there is no wafer in the target chamber;
and if the dispatch mode of the target manipulator is the Pull dispatch mode, determining the movement action of the target wafer as the placing action for placing the target wafer into the target chamber.
Optionally, when the target wafer is in the source chamber and the target robot and the target chamber have idle slots, determining the movement of the target wafer based on the scheduling mode of the target robot includes:
if the scheduling mode of the target manipulator is the Push scheduling mode, determining the movement action of the target wafer as the taking-out action for taking the target wafer from the source chamber to the target manipulator;
And if the dispatch mode of the target manipulator is the Pull dispatch mode, determining the movement action of the target wafer as a complete action for taking the target wafer out of the source chamber and immediately putting the target wafer into the target chamber.
Optionally, when the target wafer is in the source chamber and the slots of the target robot are all idle and the target chamber has no idle slots, the determining the movement of the target wafer based on the scheduling mode of the target robot includes:
if the scheduling mode of the target manipulator is the Push scheduling mode, determining the movement action of the target wafer as the taking-out action for taking the target wafer from the source chamber to the target manipulator;
and if the scheduling mode of the target manipulator is the Pull scheduling mode, determining that the target wafer does not move.
Optionally, the determining the movement of the target wafer based on the dispatch mode of the wafer placed on the first slot and the to-be-sent chamber and the target robot includes:
if the chamber to be sent of the wafer placed on the first slot is a source chamber where the target wafer is located and the scheduling mode of the target manipulator is the Push scheduling mode, determining the movement action of the target wafer as the exchange action for exchanging the wafer placed on the first slot with the target wafer;
If the chamber to be sent of the wafer placed on the first slot is a source chamber where the target wafer is located and the scheduling mode of the target manipulator is the Pull scheduling mode, determining that the target wafer does not move;
and if the chamber to be sent of the wafer placed on the first slot is not the source chamber where the target wafer is located, determining the movement action of the target wafer as the taking-out action for taking the target wafer from the source chamber to the second slot.
In order to solve the above technical problem, the present application further provides a wafer scheduling device, including:
the manipulator is used for carrying the wafer;
the manipulator configuration module comprises a scheduling mode editing interface;
a memory for storing a wafer scheduler;
and the controller is used for realizing any wafer scheduling method when executing the wafer scheduling program.
In order to solve the technical problem, the application also provides semiconductor equipment which comprises the equipment chamber and the wafer scheduling device.
The application provides a wafer dispatching method, which is used for determining a target manipulator for carrying wafers of a current batch based on a source chamber and a target chamber of the wafers of the current batch; acquiring a scheduling mode of a target manipulator from a scheduling storage object in real time, wherein the scheduling storage object is generated when a processing task is started, and the target manipulator scheduling mode is preconfigured by a manipulator configuration module and is stored in the scheduling storage object when the processing task is started; and determining a moving sequence of the moving action of the wafers containing the current batch based on the target manipulator dispatching mode, and moving the wafers of the current batch according to the moving sequence. Therefore, the method and the device can set the manipulator dispatching mode meeting the dispatching requirement for the wafers of the current batch in advance, and dispatch the wafers based on the correspondingly set manipulator dispatching mode during wafer dispatching, so that a software restart is not needed to take effect, and the wafer dispatching method is more flexible.
The application also provides a wafer scheduling device and semiconductor equipment, and the wafer scheduling device and the semiconductor equipment have the same beneficial effects as the wafer scheduling method.
Drawings
In order to more clearly illustrate the technical solutions of the present application or the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flowchart of a wafer scheduling method according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a scheduling mode editing interface according to an embodiment of the present disclosure;
FIG. 3 is a flowchart illustrating a method for determining a wafer movement according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a semiconductor device according to an embodiment of the present application.
Detailed Description
The core of the application is to provide a wafer dispatching method, a device and semiconductor equipment, wherein a manipulator dispatching mode meeting dispatching requirements is set for wafers of a current batch, and the wafers are dispatched based on the correspondingly set manipulator dispatching mode in wafer dispatching, so that software restarting is not needed to take effect, and the wafer dispatching method is more flexible.
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
A semiconductor apparatus includes an apparatus chamber including a transfer chamber for transferring a wafer and a process chamber for processing the wafer, and a Robot (Robot) for transferring the wafer from one apparatus chamber to another apparatus chamber. The process flow is generally different for different batches of wafers, resulting in different movement sequences for different batches of wafers. The existing wafer scheduling scheme is as follows: writing a scheduling mode of each chamber of the semiconductor equipment in the configuration file in advance; when the wafers of the current batch start to be dispatched, the dispatching mode of each chamber in the configuration file is read, and a moving sequence corresponding to the wafers of the current batch is determined based on the dispatching mode of each chamber, so that the dispatching of the wafers of the current batch is completed according to the determined moving sequence corresponding to the wafers of the current batch. However, in the process of executing wafer scheduling by the machine software, the chamber scheduling mode cannot be modified in the software operation life cycle, and if the chamber scheduling mode is to be modified, the configuration file needs to be modified, and the software is restarted to be effective. This scheduling scheme is less flexible for users who need to frequently modify the chamber scheduling pattern.
In order to solve the technical problems, the application provides a novel wafer scheduling method applied to semiconductor equipment. Referring to fig. 1, fig. 1 is a flowchart of a wafer scheduling method according to an embodiment of the present application. The wafer scheduling method comprises the following steps:
step S101: a target robot for handling the current lot of wafers is determined based on the source chamber and the target chamber of the current lot of wafers.
In particular applications, when a current lot of wafers starts to be dispatched (i.e., a processing task for the current lot of wafers (referred to as Job) is initiated), a robot (referred to as a target robot) for handling the current lot of wafers may be determined based on the source chamber and the target chamber of the current lot of wafers.
Step S102: and acquiring the scheduling mode of the target manipulator from the scheduling storage object in real time.
The dispatch storage object is generated when the machining task Job is started, and the target robot dispatch mode is configured in advance by the robot configuration module and stored in the dispatch storage object when the machining task Job is started.
Step S103: and determining a moving sequence of the moving action of the wafers containing the current batch based on the target manipulator dispatching mode, and moving the wafers of the current batch according to the moving sequence.
In a specific application, the method and the device determine the movement actions of the wafers in the current batch based on the dispatch modes of the target manipulators corresponding to the wafers in the current batch, so as to obtain a movement sequence containing the movement actions of the wafers in the current batch, then move the wafers in the current batch according to the movement actions of the wafers in the current batch contained in the movement sequence, and finally finish dispatch of the wafers in the current batch.
According to the wafer dispatching method, the manipulator dispatching mode meeting the dispatching requirements of the wafers of the current batch can be set in advance, the wafers are dispatched based on the corresponding set manipulator dispatching mode during wafer dispatching, the configuration file is not required to be modified, the fact that the software is restarted can be avoided, and the wafer dispatching method is enabled to be more flexible.
Based on the above embodiments:
as an alternative embodiment, the wafer scheduling method includes:
and correspondingly setting a manipulator scheduling mode meeting respective scheduling requirements for the wafers of different process flows based on the scheduling requirements of the wafers of different process flows.
In a specific application, taking a wafer of any process flow (referred to as a target process flow) as an example, the present application may determine a scheduling requirement (referred to as a target scheduling requirement) of the wafer of the target process flow based on a process requirement of the wafer of the target process flow, and set a robot scheduling mode meeting the target scheduling requirement of the wafer of the target process flow for the wafer of the target process flow through a robot configuration module based on the target scheduling requirement of the wafer of the target process flow.
It should be noted that, the semiconductor device is provided with a plurality of manipulators, and the scheduling modes set for each manipulator may be the same or different, and are determined according to the actual scheduling requirements. In addition, the process flow of wafers in the same batch is the same; the process flows for different batches of wafers may or may not be the same.
As an alternative embodiment, based on the scheduling requirements of the wafers in different process flows, the robot scheduling modes meeting the respective scheduling requirements are set for the wafers in different process flows, including:
responding to a received manipulator dispatching mode selection instruction of a dispatching mode editing interface corresponding to a wafer of a target process flow, and determining a manipulator dispatching mode matched with the manipulator dispatching mode selection instruction in the dispatching mode editing interface as a manipulator dispatching mode corresponding to the wafer of the target process flow; wherein the target process flow is any process flow.
In the embodiment of the application, a scheduling mode editing interface for setting a manipulator scheduling mode is added to a Sequence editing interface of the semiconductor device.
In a specific application, a user may send a manipulator scheduling mode selection instruction of a scheduling mode editing interface corresponding to a wafer of a target process flow based on a target scheduling requirement of the wafer of the target process flow (for example, a drop-down frame corresponding to each manipulator for selecting a manipulator scheduling mode is displayed on the scheduling mode editing interface, after clicking a drop-down frame corresponding to a certain manipulator, a manipulator scheduling mode to be selected is displayed below the drop-down frame corresponding to the manipulator, and the sending of the manipulator scheduling mode selection instruction of the manipulator is realized by clicking a certain manipulator scheduling mode). Based on the above, the present application determines, in response to a received manipulator scheduling mode selection instruction for a scheduling mode editing interface corresponding to a wafer of a target process flow, a manipulator scheduling mode in the scheduling mode editing interface that matches the manipulator scheduling mode selection instruction as a manipulator scheduling mode corresponding to the wafer of the target process flow.
For example, taking a semiconductor device 12K platform model as an example, there are three ATR (atmospheric robot), VTR1, and VTR2 (VTR: vacuum robot), each of which can set up Free, push, pull three robot scheduling modes (explained in detail in the following embodiments), as shown in fig. 2, a drop-down frame corresponding to the ATR, VTR1, and VTR2 is displayed on the scheduling mode editing interface, for example, after clicking the drop-down frame corresponding to the VTR2 robot, free, push, pull three robot scheduling modes are displayed below the drop-down frame corresponding to the VTR2 robot, and clicking a certain robot scheduling mode, so that the scheduling mode can be set up for the VTR2 robot.
As an alternative embodiment, the wafer scheduling method further includes:
storing the target manipulator dispatching mode into a dispatching storage object corresponding to the wafers of the current batch in a key value pair mode for use in determining a moving sequence; the name of the manipulator is key, and the scheduling mode is value.
In a specific application, after a manipulator scheduling mode meeting the target scheduling requirement is set for a wafer of a target process flow, scheduling setting information of the manipulator scheduling mode corresponding to the wafer containing the target process flow is stored in target process flow information in a database. When the wafers of the current batch start to be dispatched, determining the target manipulator dispatching mode corresponding to the wafers of the current batch based on the process flow of the wafers of the current batch is specifically implemented as follows: when the wafers of the current batch start to be dispatched, process flow information corresponding to the wafers of the current batch is acquired from a database, so that a target manipulator dispatching mode corresponding to the wafers of the current batch is obtained from the acquired process flow information.
In view of this, after obtaining the target robot dispatch mode corresponding to the wafers of the current lot, the present application stores the target robot dispatch mode in the form of a key value pair in a dispatch storage object (referred to as a Sequence object) corresponding to the wafers of the current lot with the name (e.g., ATR) of the robot as a key and the dispatch mode (e.g., free) as a value. The specific implementation of determining a movement sequence including movement actions of the wafers of the current lot based on the target robot dispatch mode is: and acquiring a target manipulator dispatching mode from a dispatching storage object corresponding to the wafers of the current batch, so as to determine a moving sequence of the moving action of the wafers containing the current batch based on the acquired target manipulator dispatching mode.
As an alternative embodiment, determining a movement sequence of movement actions including a current lot of wafers based on the target robot dispatch mode includes:
in the dispatching process of the wafers in the current batch, determining the wafer with the highest moving priority from the wafers in the current batch based on the current state of the wafers in the current batch at regular intervals, and taking the wafer with the highest moving priority as a target wafer for current dispatching;
determining the movement action of the target wafer based on the current wafer state, chamber state and manipulator state of the semiconductor device and a manipulator dispatching mode corresponding to the wafers in the current batch;
According to the movement of the target wafer, performing simulated movement on the target wafer, and returning to execute the step of determining the wafer with the highest movement priority from the wafers in the current batch based on the current state of the wafers in the current batch by taking the wafer state of the current batch after the simulated movement of the target wafer as a reference until the movement of the wafers in the current batch under the preset movement step number is determined;
and obtaining an optimal movement sequence containing the movement motion of the wafers of the current batch under the preset movement steps based on the determined movement motion of the wafers of the current batch under the preset movement steps.
In a specific application, in the whole dispatching process of the wafers of the current batch, the following dispatching steps are executed every preset dispatching period:
1) Determining a wafer with the highest movement priority from the wafers in the current batch based on the current state of the wafers in the current batch, and taking the determined wafer with the highest movement priority as a currently scheduled wafer (called a target wafer);
2) Determining the movement action of the target wafer based on the current wafer state, chamber state and manipulator state of the semiconductor device and a manipulator dispatching mode corresponding to the wafers in the current batch;
3) Performing simulated movement on the target wafer according to the movement of the target wafer (the simulated movement is an assumed movement event and is not a real movement on the target wafer), and returning to the step 1) based on the wafer state of the current batch of the target wafer after the simulated movement until the movement of the current batch of the wafers under the preset movement steps is determined (if the preset movement steps are 5, the movement of the wafers of the current batch in the next 5 times can be obtained);
4) Obtaining an optimal movement sequence containing the movement motion of the wafers of the current batch under the preset movement steps based on the determined movement motion of the wafers of the current batch under the preset movement steps;
5) The current lot of wafers is moved in an optimal movement sequence (where movement is the actual movement of the target wafer).
And (3) periodically executing the steps 1) to 5), and finally completing the dispatching of the wafers in the current batch.
As an alternative embodiment, the highest movement priority wafer determined from the current lot of wafers is a plurality; taking the wafer with the highest moving priority as the target wafer of the current scheduling, comprising:
respectively taking a plurality of wafers with highest movement priorities as target wafers of current dispatching to obtain movement actions of wafers of current batch under the wafers with different highest movement priorities under the preset movement steps;
Based on the determined movement motion of the wafers of the current batch under the preset movement steps, obtaining an optimal movement sequence containing the movement motion of the wafers of the current batch under the preset movement steps, wherein the optimal movement sequence comprises the following steps:
based on the movement actions of the wafers of the current batch under the preset movement steps of the wafers with different highest movement priorities, obtaining a plurality of movement sequences containing the movement actions of the wafers of the current batch under the preset movement steps in a one-to-one correspondence manner;
and taking the moving sequence which takes the minimum moving time in the plurality of moving sequences as the optimal moving sequence.
In a specific application, the number of wafers with the highest movement priority determined from the wafers in the current lot may be one or more, and the following specific scheduling steps are executed every preset scheduling period in the whole scheduling process of the wafers in the current lot:
1) Determining a wafer with the highest movement priority from the wafers in the current batch based on the current state of the wafers in the current batch;
2) If the number of the wafers with the highest moving priority is one, taking the wafer with the highest moving priority as a target wafer for current dispatching; if the number of the wafers with the highest determined movement priority is a plurality of, respectively taking the wafers with the highest movement priority as the target wafers of the current dispatching (namely, the wafers with the highest movement priority are parallelly arranged and taken as the target wafers of the current dispatching to execute the step 3) and the step 4); the simulated movement of any wafer with the highest movement priority does not affect the state of the wafer in the current batch corresponding to the wafers with the highest movement priorities in the rest parallel;
3) Determining the movement action of the target wafer based on the current wafer state, chamber state and manipulator state of the semiconductor device and a manipulator dispatching mode corresponding to the wafers in the current batch;
4) Performing simulated movement on the target wafer according to the movement of the target wafer, and returning to the step 1) by taking the state of the wafers in the current batch after the simulated movement of the target wafer as a reference until the movement of the wafers in the current batch under the preset movement step number is determined;
5) If the determined movement of the wafers of the current batch under the preset movement steps has only one result (only one wafer with the highest movement priority is determined each time in the dispatching period), taking the movement sequence of the movement of the wafers of the current batch under the preset movement steps as an optimal movement sequence; if the determined movement of the current lot of wafers under the preset movement steps has a plurality of results (in the dispatch period, the determined number of the wafers with the highest movement priority comprises a plurality of wafers), a plurality of movement sequences are obtained, each movement sequence comprises one result of the movement of the current lot of wafers under the preset movement steps, and the movement sequence which takes the minimum movement time in the plurality of movement sequences is taken as the optimal movement sequence;
6) And moving the wafers of the current batch according to the optimal movement sequence.
And (3) periodically executing the steps 1) to 6), and finally completing the dispatching of the wafers in the current batch.
For example, in a certain dispatch period, determining the wafer with the highest movement priority from the wafers in the current batch based on the current state of the wafers in the current batch, and assuming that two wafers with the highest movement priority are determined, namely, wafer A and wafer B, on one hand, taking wafer A as the wafer of the current dispatch; determining the movement action of the wafer A based on the current wafer state, the chamber state and the manipulator state of the semiconductor equipment and a manipulator dispatching mode corresponding to the wafers in the current batch; according to the movement of the wafer A, performing simulated movement on the wafer A, and returning to execute the step of determining the wafer with the highest movement priority from the wafers in the current batch based on the current state of the wafers in the current batch by taking the wafer state of the current batch after the simulated movement of the wafer A as a reference until the movement of the wafers in the current batch under the preset movement step number is determined; on the other hand, the wafer B is taken as the currently scheduled wafer; determining the movement action of the wafer B based on the current wafer state, chamber state and manipulator state of the semiconductor equipment and a manipulator dispatching mode corresponding to the wafers in the current batch; and carrying out simulated movement on the wafer B according to the movement of the wafer B, and returning to the step of executing the wafer with the highest movement priority from the wafers in the current batch based on the current state of the wafers in the current batch by taking the wafer state of the current batch after the simulated movement of the wafer B as a reference until the movement of the wafers in the current batch under the preset movement steps is determined, thereby obtaining various results of the movement of the wafers in the current batch under the preset movement steps.
As an alternative embodiment, a target robot for moving a target wafer from a source chamber to a target chamber includes a first slot and a second slot;
determining a movement of the target wafer based on a current wafer state, a chamber state, a robot state of the semiconductor device, and a robot dispatch mode corresponding to a current lot of wafers, including at least one of:
if the target wafer is on the target manipulator, determining the movement of the target wafer based on the scheduling mode of the target manipulator and the chamber state of the target chamber;
if the target wafer is in the source chamber and the target manipulator and the target chamber both have idle slots, determining the movement of the target wafer based on the scheduling mode of the target manipulator;
if the target wafer is in the source chamber and the slot positions of the target manipulator are idle and the target chamber has no idle slot position, determining the movement action of the target wafer based on the scheduling mode of the target manipulator;
if the target wafer is in the source chamber and the first slot is provided with the wafer, the second slot is idle, and the target chamber does not have an idle slot, determining the movement of the target wafer based on the scheduling mode of the wafer placed on the first slot to be sent into the chamber and the target manipulator;
And if the target wafer is not on the target manipulator and the target manipulator has no idle slot, determining that the target wafer has no movement.
In a specific application, the process of determining the movement of the target wafer according to the present application includes:
1) Judging whether the target wafer is on the target manipulator or not; if yes, executing the step 2); if not, executing the step 3);
2) Determining a movement action of the target wafer based on a scheduling mode of the target manipulator and a chamber state of the target chamber;
3) Judging whether the target manipulator has an idle slot (slot: slot, used for storing wafers); if yes, executing the step 4); if not, determining that the target wafer does not move, namely returning to Null (Null, namely failing to generate effective movement);
4) Judging whether an idle slot position exists in the target cavity; if yes, executing the step 5); if not, executing the step 6);
5) Determining a movement action of the target wafer based on a scheduling mode of the target manipulator;
6) Judging whether two slots (a first slot and a second slot) of the target manipulator are idle or not; if yes, executing the step 7); if not (the first slot is provided with a wafer and the second slot is free), executing the step 8);
7) Determining a movement action of the target wafer based on a scheduling mode of the target manipulator;
8) And determining the movement action of the target wafer based on the dispatch mode of the wafer placed on the first slot and to be sent into the chamber and the target manipulator.
As an alternative embodiment, the scheduling modes of the target manipulator include a Push scheduling mode, a Pull scheduling mode and a Free scheduling mode;
the Push scheduling mode indicates that when the target manipulator finishes the operation of the target wafer in the source chamber, the target wafer is immediately taken out of the source chamber, and when the target chamber is idle, the target wafer is put into the target chamber; the Pull dispatch mode indicates that the target manipulator takes out the target wafer in the source chamber and puts the target wafer into the target chamber when the target chamber is idle; the Free dispatch mode is a Push dispatch mode by default, and is automatically switched to a Push dispatch mode when the target chamber is processed.
In the embodiment of the application, the target chamber is processed by moving a shift into the target chamber, and performing Clean or paint processing on the target chamber.
In the conventional wafer scheduling scheme, the wafer scheduling is performed in the scheduling mode of each chamber of the semiconductor device, whereas in the wafer scheduling scheme of the present application, the wafer scheduling is performed in the scheduling mode of each robot of the semiconductor device.
As an alternative embodiment, determining the movement of the target wafer based on the dispatch mode of the target robot and the chamber state of the target chamber includes:
if the dispatch mode of the target manipulator is a Push dispatch mode, determining the movement action of the target wafer as an exchange action for exchanging the wafer in the target chamber with the target wafer when the wafer exists in the target chamber; determining a movement of the target wafer as a placement motion for placing the target wafer into the target chamber when there is no wafer in the target chamber;
if the dispatch mode of the target manipulator is the Pull dispatch mode, determining the movement action of the target wafer as the placing action for placing the target wafer into the target chamber.
In a specific application, step 2) in the process of determining the movement of the target wafer in the application, based on the scheduling mode of the target manipulator and the chamber state of the target chamber, the determination of the movement of the target wafer is specifically implemented as follows:
21 Judging whether the scheduling mode of the target manipulator is a Push scheduling mode; if yes, go to step 22); if not (the dispatch mode of the target manipulator is the Pull dispatch mode), executing step 24);
22 Judging whether a wafer exists in the target chamber; if yes (switch (Swap) condition is met), then step 23) is performed; if not (the exchange condition is not satisfied), executing step 24);
23 Determining the movement of the target wafer as a swap motion (SwapMove 1) for swapping the wafer in the target chamber with the target wafer;
24 Determining the movement of the target wafer as a placement motion (PlaceMove) for placing the target wafer into the target chamber.
As an alternative embodiment, when the target wafer is in the source chamber and the target robot and the target chamber have idle slots, determining the movement of the target wafer based on the dispatch mode of the target robot includes:
if the scheduling mode of the target manipulator is a Push scheduling mode, determining the movement action of the target wafer as the taking-out action for taking the target wafer from the source chamber to the target manipulator;
if the dispatch mode of the target robot is the Pull dispatch mode, the movement of the target wafer is determined as a complete motion for taking the target wafer out of the source chamber and immediately into the target chamber.
In a specific application, step 5) of the present application in determining the movement of the target wafer based on the scheduling mode of the target manipulator determines the movement of the target wafer as follows:
51 Judging whether the scheduling mode of the target manipulator is a Push scheduling mode; if yes, go to step 52); if not (the dispatch mode of the target manipulator is the Pull dispatch mode), executing step 53);
52 Determining a movement motion of the target wafer as a pick motion (PickMove) for picking the target wafer from the source chamber onto the target robot;
53 A movement motion of the target wafer is determined as a complete motion (FullMove) for taking the target wafer out of the source chamber and immediately into the target chamber.
As an alternative embodiment, when the target wafer is in the source chamber and the slots of the target robot are all idle and the target chamber has no idle slots, determining the movement of the target wafer based on the scheduling mode of the target robot includes:
if the scheduling mode of the target manipulator is a Push scheduling mode, determining the movement action of the target wafer as the taking-out action for taking the target wafer from the source chamber to the target manipulator;
if the scheduling mode of the target manipulator is the Pull scheduling mode, determining that the target wafer does not move.
In a specific application, step 7) of the present application in determining the movement of the target wafer based on the scheduling mode of the target manipulator determines the movement of the target wafer as follows:
71 Judging whether the scheduling mode of the target manipulator is a Push scheduling mode; if yes, go to step 72); if not (the dispatch mode of the target manipulator is the Pull dispatch mode), executing step 73);
72 Determining a movement motion of the target wafer as a pick motion (PickMove) for picking the target wafer from the source chamber onto the target robot;
73 Determining that the target wafer has no motion, i.e., returns to Null.
In addition, after determining that the dispatch mode of the target robot is the Push dispatch mode in step 71), before executing step 72), the present application may further determine whether the target wafer has completed the operation in the source chamber; if yes, go to step 72); if not, step 72) is not performed and it is determined that the target wafer has no movement, i.e., null is returned, to ensure that the target wafer is removed from the source chamber after the target wafer has completed operation in the source chamber, thereby ensuring process integrity of the target wafer.
As an alternative embodiment, determining the movement of the target wafer based on the dispatch mode of the wafer placed on the first slot and to be sent to the chamber and the target robot includes:
if the to-be-sent chamber of the wafer placed on the first slot is a source chamber where the target wafer is located and the scheduling mode of the target manipulator is a Push scheduling mode, determining the movement action of the target wafer as the exchange action for exchanging the wafer placed on the first slot with the target wafer;
If the to-be-sent chamber of the wafer placed on the first slot is a source chamber where the target wafer is located and the scheduling mode of the target manipulator is a Pull scheduling mode, determining that the target wafer does not move;
if the to-be-fed chamber of the wafer placed on the first slot is not the source chamber where the target wafer is located, determining the movement of the target wafer as the take-out action for taking the target wafer from the source chamber to the second slot.
In a specific application, step 8) in the process of determining the movement of the target wafer in the application, based on the dispatch mode of the wafer placed on the first slot to be sent into the chamber and the target manipulator, the determining the movement of the target wafer is specifically implemented as follows:
81 Judging whether the chamber to be sent of the wafer placed on the first slot is a source chamber where the target wafer is located; if yes, go to step 82); if not, go to step 85);
82 Judging whether the scheduling mode of the target manipulator is a Push scheduling mode; if yes, go to step 83); if not (the dispatch mode of the target manipulator is the Pull dispatch mode), then execute step 84;
83 Determining a movement of the target wafer as a swap motion (SwapMove 2) for swapping the wafer placed on the first slot with the target wafer;
84 Determining that the target wafer does not move, namely returning to Null;
85 A movement of the target wafer is determined as a pick motion (PickMove) for picking the target wafer from the source chamber onto the second slot.
To sum up, as shown in fig. 3, a specific flow of determining the wafer moving action in the present application is:
1) Judging whether the target wafer is on the target manipulator or not; if yes, executing the step 2); if not, executing the step 6);
2) Judging whether the scheduling mode of the target manipulator is a Push scheduling mode or not; if yes, executing the step 3); if not, executing the step 5);
3) Judging whether a wafer exists in the target chamber; if yes, executing the step 4); if not, executing the step 5);
4) Determining the movement of the target wafer as SwapMove1;
5) Determining the movement of the target wafer as PlaceMove;
6) Judging whether the target manipulator has an idle slot position or not; if yes, executing the step 7); if not, returning to Null;
7) Judging whether an idle slot position exists in the target cavity; if yes, executing the step 8); if not, executing the step 11);
8) Judging whether the scheduling mode of the target manipulator is a Push scheduling mode or not; if yes, go to step 9); if not, executing the step 10);
9) Determining the movement of the target wafer as PickMove;
10 Determining the movement of the target wafer as FullMove;
11 Judging whether two slots of the target manipulator are idle or not; if yes, go to step 12); if not, executing step 15);
12 Judging whether the scheduling mode of the target manipulator is a Push scheduling mode; if yes, go to step 13); if not, returning to Null;
13 Judging whether the target wafer finishes the operation in the source chamber; if yes, go to step 14); if not, returning to Null;
14 Determining the movement of the target wafer as PickMove;
15 Judging whether the chamber to be sent of the wafer placed on the first slot is a source chamber where the target wafer is located; if yes, go to step 16); if not, executing step 18);
16 Judging whether the scheduling mode of the target manipulator is a Push scheduling mode; if yes, go to step 17); if not, returning to Null;
17 Determining the movement of the target wafer as SwapMove2;
18 Determining the motion of the target wafer as PickMove.
The application also provides a wafer scheduling device, which comprises:
the manipulator is used for carrying the wafer;
the manipulator configuration module comprises a scheduling mode editing interface;
A memory for storing a wafer scheduler;
and the controller is used for realizing the steps of any wafer scheduling method when the wafer scheduling program is executed.
The description of the wafer scheduling apparatus provided in the present application refers to the embodiment of the wafer scheduling method, and is not repeated herein.
The application also provides a semiconductor device, which comprises a device chamber and a wafer scheduling device.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a semiconductor device according to an embodiment of the present application. It should be noted that the number of the respective components given in the present embodiment is only an example, and should not be construed as limiting the scope of protection. Those skilled in the art can configure the number of corresponding components as desired in light of the present application. As shown in fig. 4, the semiconductor device configuration includes:
1) 1 to 3 LPs (loadports) are configured, namely, LP1/LP2/LP3, each LP can store 1 Cassette (load box), and 1 Cassette contains a plurality of slots, and each Slot can be used for placing one wafer; 3 LP1/LP2/LP3 can start the process at the same time or not, and can be configured according to the process requirement;
2) 1 EFEM (front end module of semiconductor device) is configured, which is mainly used for automatic loading and unloading of wafers;
3) 2 LL (load lock, vacuum transition chamber, which is the transition chamber before the wafer goes from non-vacuum state to high vacuum state, and can reach a certain degree of vacuum degree) are configured, namely LL1/LL2;
4) 1 to 6 process chambers are configured: A. b, C, D, E, F the process chamber has serial and parallel chambers which can be configured according to the process requirement;
5) 2 Transfer (Transfer chambers) are configured: transfer1, transfer2 for connecting Loadlock and process chamber;
6) 3 robots (Robot) are configured: ATR, VTR1, VTR2, respectively disposed in EFEM, transfer and Transfer2, for realizing Transfer of wafers between all stations;
7) 2 buffers (Buffer chambers) are configured for connecting Transfer1 and Transfer2.
The remaining description of the semiconductor device provided in the present application refers to the embodiment of the wafer scheduling apparatus, and is not repeated herein.
As one of ordinary skill in the art can appreciate, with the development of technology and the appearance of new scenes, the technical solutions provided in the embodiments of the present application are applicable to similar technical problems.
The terms first, second and the like in the description and in the claims, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances and are merely illustrative of the manner in which the embodiments of the application described herein have been described for objects of the same nature. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of elements is not necessarily limited to those elements, but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
From the above description of the embodiments, it will be apparent to those skilled in the art that the embodiments may be implemented by means of software plus necessary general hardware platforms, or of course may be implemented by means of hardware. Based on such understanding, the foregoing technical solutions may be embodied essentially or in part in the form of a software product, which may be stored in a computer-readable storage medium, such as a ROM/RAM, a magnetic disk, an optical disk, etc., including several instructions to cause a computer device (which may be a personal computer, a server, or a network device, etc.) to perform the various embodiments or methods of some parts of the embodiments.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.

Claims (14)

1. A wafer scheduling method, comprising:
determining a target robot for handling a current lot of wafers based on a source chamber and a target chamber of the current lot of wafers;
the method comprises the steps that a scheduling mode of the target manipulator is obtained from a scheduling storage object in real time, the scheduling storage object is generated when a processing task is started, and the target manipulator scheduling mode is preconfigured through a manipulator configuration module and is stored in the scheduling storage object when the processing task is started;
and determining a moving sequence of the moving action of the wafers in the current batch based on the target manipulator dispatching mode, and moving the wafers in the current batch according to the moving sequence.
2. The wafer scheduling method of claim 1, wherein the wafer scheduling method comprises:
and correspondingly setting manipulator scheduling modes meeting respective scheduling requirements for the wafers of different process flows based on the scheduling requirements of the wafers of different process flows.
3. The wafer scheduling method of claim 2, wherein the scheduling requirements of the wafers based on different process flows, respectively setting the robot scheduling modes for the wafers of the different process flows to meet the respective scheduling requirements, comprises:
Responding to a received manipulator dispatching mode selection instruction of a dispatching mode editing interface corresponding to a wafer of a target process flow, and determining a manipulator dispatching mode matched with the manipulator dispatching mode selection instruction in the dispatching mode editing interface as a manipulator dispatching mode corresponding to the wafer of the target process flow; wherein the target process flow is any one of the process flows.
4. The wafer scheduling method of claim 1, further comprising:
storing the target manipulator dispatching mode into a dispatching storage object corresponding to the wafers of the current batch in a key value pair mode for use in determining the moving sequence; the name of the manipulator is key, and the scheduling mode is value.
5. The wafer dispatching method of any one of claims 1-4, wherein the determining a movement sequence of movement actions comprising the current lot of wafers based on the target robot dispatch mode comprises:
in the dispatching process of the wafers in the current batch, determining the wafer with the highest moving priority from the wafers in the current batch based on the current state of the wafers in the current batch at regular intervals, and taking the wafer with the highest moving priority as a target wafer for current dispatching;
Determining the movement action of the target wafer based on the current wafer state, chamber state and manipulator state of the semiconductor device and the manipulator dispatching mode corresponding to the current batch of wafers;
performing simulated movement on the target wafer according to the movement of the target wafer, and returning to execute the step of determining the wafer with the highest movement priority from the wafers in the current batch based on the current state of the wafers in the current batch by taking the wafer state of the current batch after the simulated movement of the target wafer as a reference until the movement of the wafers in the current batch under the preset movement step number is determined;
and obtaining an optimal movement sequence containing the movement action of the wafers of the current batch under the preset movement steps based on the determined movement action of the wafers of the current batch under the preset movement steps.
6. The wafer dispatching method of claim 5, wherein the highest movement priority wafer determined from the current lot of wafers is a plurality of wafers; the step of taking the wafer with the highest moving priority as the target wafer of the current scheduling comprises the following steps:
taking a plurality of wafers with the highest movement priority as target wafers of the current dispatching respectively to obtain movement actions of the wafers of the current batch under the preset movement steps under the wafers with different highest movement priorities;
The obtaining an optimal movement sequence including the movement motion of the current lot of wafers under the preset movement steps based on the determined movement motion of the current lot of wafers under the preset movement steps comprises the following steps:
based on the movement actions of the current batch of wafers under the preset movement step numbers under the wafers with different highest movement priorities, obtaining a plurality of movement sequences containing the movement actions of the current batch of wafers under the preset movement step numbers in a one-to-one correspondence manner;
and taking the moving sequence which takes the minimum moving time in the moving sequences as the optimal moving sequence.
7. The wafer scheduling method of claim 5, wherein a target robot for moving the target wafer from the source chamber to the target chamber comprises a first slot and a second slot;
the determining the movement of the target wafer based on the current wafer state, the chamber state, the robot state of the semiconductor device, and the robot dispatch mode corresponding to the current lot of wafers includes at least one of:
if the target wafer is on the target manipulator, determining a movement action of the target wafer based on a dispatching mode of the target manipulator and a chamber state of the target chamber;
If the target wafer is in the source chamber and the target manipulator and the target chamber both have idle slots, determining a movement action of the target wafer based on a scheduling mode of the target manipulator;
if the target wafer is in the source chamber and the slot positions of the target manipulator are idle and the target chamber has no idle slot position, determining the movement action of the target wafer based on the scheduling mode of the target manipulator;
if the target wafer is in the source chamber and the first slot is provided with a wafer, the second slot is idle, and the target chamber has no idle slot, determining a movement action of the target wafer based on a scheduling mode of the wafer placed on the first slot to be sent into the chamber and the target manipulator;
and if the target wafer is not on the target manipulator and the target manipulator has no idle slot, determining that the target wafer has no movement.
8. The wafer scheduling method of claim 7, wherein the scheduling modes of the target robot include Push scheduling mode, pull scheduling mode, free scheduling mode;
The Push scheduling mode indicates that when the target manipulator finishes the operation of the source chamber on the target wafer, the target wafer is immediately taken out of the source chamber, and when the target chamber is idle, the target wafer is placed in the target chamber; the Pull dispatch mode indicates that the target manipulator takes out the target wafer in the source chamber and puts the target wafer into the target chamber when the target chamber is idle; and the Free scheduling mode is the Push scheduling mode under the default condition, and is automatically switched into the Push scheduling mode when the target chamber is processed.
9. The wafer scheduling method of claim 8, wherein determining the movement of the target wafer based on the scheduling pattern of the target robot and the chamber state of the target chamber comprises:
if the dispatch mode of the target manipulator is the Push dispatch mode, determining the movement action of the target wafer as the exchange action for exchanging the wafer in the target chamber with the target wafer when the wafer exists in the target chamber; determining a movement of the target wafer as a placement motion for placing the target wafer into the target chamber when there is no wafer in the target chamber;
And if the dispatch mode of the target manipulator is the Pull dispatch mode, determining the movement action of the target wafer as the placing action for placing the target wafer into the target chamber.
10. The wafer scheduling method of claim 8, wherein determining the movement of the target wafer based on the scheduling pattern of the target robot when the target wafer is in the source chamber and the target robot and the target chamber each have a free slot comprises:
if the scheduling mode of the target manipulator is the Push scheduling mode, determining the movement action of the target wafer as the taking-out action for taking the target wafer from the source chamber to the target manipulator;
and if the dispatch mode of the target manipulator is the Pull dispatch mode, determining the movement action of the target wafer as a complete action for taking the target wafer out of the source chamber and immediately putting the target wafer into the target chamber.
11. The wafer scheduling method of claim 8, wherein determining the movement of the target wafer based on the scheduling pattern of the target robot when the target wafer is in the source chamber and the target robot has no empty slots, comprises:
If the scheduling mode of the target manipulator is the Push scheduling mode, determining the movement action of the target wafer as the taking-out action for taking the target wafer from the source chamber to the target manipulator;
and if the scheduling mode of the target manipulator is the Pull scheduling mode, determining that the target wafer does not move.
12. The wafer scheduling method of claim 8, wherein determining the movement of the target wafer based on the scheduling pattern of the wafer placed on the first slot to be sent into the chamber and the target robot comprises:
if the chamber to be sent of the wafer placed on the first slot is a source chamber where the target wafer is located and the scheduling mode of the target manipulator is the Push scheduling mode, determining the movement action of the target wafer as the exchange action for exchanging the wafer placed on the first slot with the target wafer;
if the chamber to be sent of the wafer placed on the first slot is a source chamber where the target wafer is located and the scheduling mode of the target manipulator is the Pull scheduling mode, determining that the target wafer does not move;
And if the chamber to be sent of the wafer placed on the first slot is not the source chamber where the target wafer is located, determining the movement action of the target wafer as the taking-out action for taking the target wafer from the source chamber to the second slot.
13. A wafer scheduling apparatus, comprising:
the manipulator is used for carrying the wafer;
the manipulator configuration module comprises a scheduling mode editing interface;
a memory for storing a wafer scheduler;
a controller for implementing the steps of the wafer scheduling method of any one of claims 1-12 when executing the wafer scheduling program.
14. A semiconductor device comprising a device chamber and the wafer scheduling apparatus of claim 13.
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