CN116631908A - Automatic wafer processing method and device and electronic equipment - Google Patents
Automatic wafer processing method and device and electronic equipment Download PDFInfo
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- CN116631908A CN116631908A CN202310566788.1A CN202310566788A CN116631908A CN 116631908 A CN116631908 A CN 116631908A CN 202310566788 A CN202310566788 A CN 202310566788A CN 116631908 A CN116631908 A CN 116631908A
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- 238000003672 processing method Methods 0.000 title claims abstract description 24
- 238000012545 processing Methods 0.000 claims abstract description 203
- 238000012546 transfer Methods 0.000 claims abstract description 140
- 239000000463 material Substances 0.000 claims abstract description 64
- 238000000034 method Methods 0.000 claims abstract description 61
- 230000008569 process Effects 0.000 claims abstract description 49
- 238000001514 detection method Methods 0.000 claims description 28
- 238000004140 cleaning Methods 0.000 claims description 14
- 238000004590 computer program Methods 0.000 claims description 12
- 239000013072 incoming material Substances 0.000 claims description 12
- 238000005259 measurement Methods 0.000 claims description 11
- 238000004806 packaging method and process Methods 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 11
- 238000011179 visual inspection Methods 0.000 claims description 8
- 238000000407 epitaxy Methods 0.000 claims description 5
- 238000007689 inspection Methods 0.000 claims 4
- 239000000047 product Substances 0.000 description 14
- 238000011144 upstream manufacturing Methods 0.000 description 7
- 238000003860 storage Methods 0.000 description 6
- 239000011265 semifinished product Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
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- 238000010586 diagram Methods 0.000 description 2
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- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
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- 238000011065 in-situ storage Methods 0.000 description 1
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- 230000003287 optical effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
The application provides an automatic wafer processing method, an automatic wafer processing device and electronic equipment, which relate to the technical field of wafer processing, and are based on a plurality of wafer processing equipment and a plurality of transfer robots, wherein the method comprises the following steps: acquiring the state and the position of each carrying robot; sequentially detecting the states of the wafer processing equipment according to the sequence reverse to the wafer processing sequence until the target wafer processing equipment in the finished state is detected; determining the transfer robot closest to the target wafer processing equipment and in an idle state as a target transfer robot according to the state and the position of each transfer robot; and controlling the target carrying robot to carry the processed material in the target wafer processing equipment to a placement position corresponding to the next process, updating the state of each wafer processing equipment, and repeating the steps until the wafer processing task is finished. The application provides the degree of automation of wafer processing, reduces the labor cost, and can avoid the problem of congestion caused by high concurrency control of the transfer robot.
Description
Technical Field
The application relates to the technical field of wafer processing, in particular to an automatic wafer processing method and device and electronic equipment.
Background
Wafer refers to a silicon wafer used for manufacturing a semiconductor circuit, the original material of which is silicon, and wafer processing is a process of processing the original material into a finished product through a complicated processing technology. The wafer processing includes a plurality of processing processes, and when one processing process is completed, the semi-finished product needs to be transferred to the next equipment for the next processing process. At present, the semi-finished product transportation between two processing technologies is usually completed by operating the carrying equipment by a worker, and the mode has lower automation degree and higher labor cost.
Disclosure of Invention
The application solves the problem of how to improve the automation degree of the wafer processing process and reduce the labor cost.
In order to solve the above problems, the present application provides an automatic wafer processing method, an apparatus and an electronic device.
In a first aspect, the present application provides an automatic wafer processing method, based on a plurality of wafer processing apparatuses and a plurality of transfer robots, the automatic wafer processing method comprising:
s100, acquiring the state and the position of each transfer robot;
s200, sequentially detecting states of the wafer processing equipment according to an order reverse to the wafer processing order until a target wafer processing equipment in a finished state is detected, wherein the finished state represents that materials which are processed are in the wafer processing equipment;
s300, determining the transfer robot closest to the target wafer processing equipment and in an idle state as a target transfer robot according to the state and the position of each transfer robot, wherein the idle state represents that the transfer robot is currently free of tasks and can receive new tasks;
and S400, controlling the target transfer robot to transfer the processed material in the target wafer processing equipment to a placement position corresponding to the next process, updating the state of each wafer processing equipment, and returning to S200 until the wafer processing task is finished.
Optionally, the sequentially detecting the states of the wafer processing apparatuses in a reverse order to the wafer processing order includes:
and acquiring the states of the wafer processing equipment, and sequentially judging whether the states of the wafer processing equipment are the finished states according to the sequence reverse to the wafer processing sequence.
Optionally, the determining the transfer robot closest to the target wafer processing apparatus and in the idle state according to the state and the position of each transfer robot includes:
determining the distance between each carrying robot and the target wafer processing equipment according to the position of the carrying robot and the position of the target wafer processing equipment;
and sequentially detecting the states of the transfer robots according to the sequence from short distance to long distance until the transfer robot in an idle state is detected, and determining that the transfer robot is the target transfer robot.
Optionally, transfer robot includes AGV chassis, support and arm, the one end of support with the AGV chassis is connected, the stiff end of arm with the other end of support is connected, the clamping jaw is installed to the end of arm, the end of arm with be provided with the depth camera between the clamping jaw.
Optionally, the controlling the target transfer robot to transfer the processed material in the target wafer processing apparatus to a placement position corresponding to a next process includes:
controlling an AGV chassis of the target transfer robot to move to the target wafer processing equipment, and controlling a mechanical arm and a clamping jaw of the target transfer robot to clamp materials;
when the clamping jaw of the target carrying robot clamps materials, controlling the AGV chassis of the target carrying robot to move to a placing position corresponding to the next process, and controlling the mechanical arm and the clamping jaw of the target carrying robot to place the clamped materials at the placing position.
Optionally, the wafer processing device comprises a tandem connection machine, a visual inspection machine, an epitaxial furnace, a thickness detection device, a flatness detection device, a resistance detection device, a cleaning machine and a packaging machine.
Optionally, the wafer processing sequence sequentially comprises incoming material serial connection, incoming material cleaning, incoming material particle measurement, epitaxy, visual inspection, thickness detection, resistance detection, flatness detection, final cleaning, particle measurement, serial connection and packaging.
Optionally, the method further comprises:
and detecting the residual electric quantity of each transfer robot, and controlling the transfer robot to move to a charging area for charging when the residual electric quantity of the transfer robot is lower than a preset threshold value.
In a second aspect, the present application provides an automatic wafer processing apparatus based on a plurality of wafer processing devices and a plurality of transfer robots, the automatic wafer processing apparatus comprising:
the acquisition module is used for acquiring the state and the position of each carrying robot;
the detection module is used for sequentially detecting the states of the wafer processing equipment according to the sequence reverse to the wafer processing sequence until the target wafer processing equipment in the finished state is detected, wherein the finished state represents that materials which are processed are in the wafer processing equipment;
the processing module is used for determining that the carrying robot closest to the target wafer processing equipment and in an idle state is the target carrying robot according to the state and the position of each carrying robot, and the idle state represents that the carrying robot is currently free of tasks and can receive new tasks;
and the control module is used for controlling the target transfer robot to transfer the processed material in the target wafer processing equipment to a placement position corresponding to the next process, updating the state of each wafer processing equipment, and circularly calling each module until the wafer processing task is finished.
In a third aspect, the present application provides an electronic device comprising a memory and a processor;
the memory is used for storing a computer program;
the processor is configured to implement the wafer automatic processing method according to the first aspect when executing the computer program.
The wafer automatic processing method and device and the electronic equipment have the beneficial effects that: the state and the position of each carrying robot can be obtained in a wireless communication mode, the states of each wafer processing device are sequentially detected according to the sequence reverse to the wafer processing sequence, namely the last wafer processing device in the wafer processing sequence detects the states of the first wafer processing device, and the last wafer processing device in the wafer processing sequence detects the states of the first wafer processing device, so that materials approaching to a finished product to be processed can be conveniently conveyed to the next process in time. When detecting a target wafer processing device in a finished state, indicating that materials which are processed but not taken out exist in the target wafer processing device, determining a transfer robot which is separated from the target wafer processing device and is in an idle state as a target transfer robot, so as to ensure the transfer capability of the target transfer robot, shorten the moving distance of the target transfer robot and improve the transfer efficiency. And controlling the target carrying robot to carry the processed material in the target wafer processing equipment to a placement position corresponding to the next process. Updating the state of each wafer processing device, repeating the steps, and ensuring the normal operation of the wafer processing work until the wafer processing task is finished. The application utilizes the unstacking idea to backtrack and detect the state of each wafer processing device from the wafer processing device of the last process to the upstream, and preferentially conveys the semi-finished product which is close to the finished product, so that the material can be pushed to the direction of the finished product as much as possible, the yield of the finished product is improved, the materials in each wafer processing device are separately conveyed, and the problem of route congestion caused by simultaneous conveying of a plurality of conveying robots is avoided. In addition, the application does not need manual operation of carrying equipment to realize material transportation, improves the automation degree of the wafer processing process and reduces the labor cost.
Drawings
FIG. 1 is a schematic flow chart of an automatic wafer processing method according to an embodiment of the application;
FIG. 2 is a schematic diagram of a wafer processing sequence for each process in accordance with an embodiment of the present application;
fig. 3 is a schematic flow chart of a dispatching strategy of the handling robot according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of an automatic wafer processing apparatus according to an embodiment of the application.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. While the application is susceptible of embodiment in the drawings, it is to be understood that the application may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but rather are provided to provide a more thorough and complete understanding of the application. It should be understood that the drawings and embodiments of the application are for illustration purposes only and are not intended to limit the scope of the present application.
It should be understood that the various steps recited in the method embodiments of the present application may be performed in a different order and/or performed in parallel. Furthermore, method embodiments may include additional steps and/or omit performing the illustrated steps. The scope of the application is not limited in this respect.
The term "including" and variations thereof as used herein are intended to be open-ended, i.e., including, but not limited to. The term "based on" is based at least in part on. The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments"; the term "optionally" means "alternative embodiments". Related definitions of other terms will be given in the description below. It should be noted that the terms "first," "second," and the like herein are merely used for distinguishing between different devices, modules, or units and not for limiting the order or interdependence of the functions performed by such devices, modules, or units.
It should be noted that references to "one", "a plurality" and "a plurality" in this disclosure are intended to be illustrative rather than limiting, and those skilled in the art will appreciate that "one or more" is intended to be construed as "one or more" unless the context clearly indicates otherwise.
The names of messages or information interacted between the devices in the embodiments of the present application are for illustrative purposes only and are not intended to limit the scope of such messages or information.
In the prior art, when a plurality of transfer robots are controlled to transfer materials, one transfer robot is controlled to transfer the materials processed by the process usually at the end of one process, but a narrow road section is usually present in a factory, and when the plurality of transfer robots simultaneously transfer the materials through the narrow road section, congestion and even collision are caused, so that safety accidents are caused.
As shown in fig. 1, in order to solve the above-mentioned problems in the prior art, the automatic wafer processing method according to the embodiment of the present application is based on a plurality of wafer processing apparatuses and a plurality of transfer robots, and includes:
s100, acquiring the state and the position of each transfer robot.
Specifically, the state of the transfer robot and the state of the wafer processing apparatus may be divided into an idle state, an operating state, and a completed state, and may be respectively represented by characters, for example, three states may be respectively represented by numerals 0, 1, and 2.
Idle state: for wafer processing equipment, the idle state indicates that there is currently no material in the equipment and no process tasks to be performed; for the transfer robot, it means that the transfer robot does not have any task at present, and can accept new tasks and schedule at any time, and the idle state can be represented by the number 0.
Operating state: for wafer processing equipment, indicating that materials are currently present in the equipment and are being processed by a process, other operations cannot be performed until the process is completed and finished products at the current stage are taken away; the transfer robot is represented by the numeral 1 when the transfer robot is moving, and the transfer robot is in an operating state no matter whether the transfer robot is carrying materials or not.
Completion state: for wafer processing equipment, the process of the current material in the equipment is finished, but the material still exists in a state that the material is not taken away temporarily in the equipment; for the transfer robot, the current task is represented to be completed, but the state of waiting for the completion of the processing of a certain device in situ is also needed on the schedule, and the completion state can be represented by the numeral 2.
And S200, sequentially detecting the states of the wafer processing equipment according to the sequence reverse to the wafer processing sequence until the target wafer processing equipment in the finished state is detected, wherein the finished state represents that the processed materials exist in the wafer processing equipment.
In particular, since there is typically no location within the factory floor for buffer storage of the green wafer materials processed by each process, there is a need to push the green wafer materials potentially toward the finished product. The target wafer processing equipment in a finished state can be reversely searched from the wafer processing equipment in the last procedure according to the unstacking idea. Specifically, detecting whether each wafer processing apparatus is in a completed state corresponds to detecting whether each process is performed.
Optionally, the wafer processing device comprises a tandem connection machine, a visual inspection machine, an epitaxial furnace, a thickness detection device, a flatness detection device, a resistance detection device, a cleaning machine and a packaging machine.
Optionally, as shown in fig. 2, the wafer processing sequence is incoming material serial connection, incoming material cleaning, incoming material particle measurement, epitaxy, visual inspection, thickness detection, resistance detection, flatness detection, final cleaning, particle measurement, serial connection and packaging.
Specifically, the wafer processing sequence represents the execution sequence of each processing technology, and each technology in the wafer processing process is arranged according to the wafer processing sequence, and is sequentially supplied material serial connection, supplied material cleaning, supplied material particle measurement, epitaxy, visual inspection, thickness detection, resistance detection, flatness detection, final cleaning, particle measurement, serial connection and packaging.
S300, determining the transfer robot closest to the target wafer processing equipment and in an idle state as a target transfer robot according to the state and the position of each transfer robot, wherein the idle state represents that the transfer robot is currently free of tasks and can receive new tasks;
and S400, controlling the target transfer robot to transfer the processed material in the target wafer processing equipment to a placement position corresponding to the next process, updating the state of each wafer processing equipment, and returning to S200 until the wafer processing task is finished.
Specifically, the transfer robot closest to the target wafer processing equipment and in an idle state is made to be the target transfer robot, the transfer robot is in the idle state, the transfer capability of the transfer robot is guaranteed, the transfer robot closer to the target wafer processing equipment is searched, the moving distance of the transfer robot is shortened, the subsequent transfer efficiency is improved, the target transfer robot is controlled to transfer the processed material in the target wafer processing equipment to a placement position corresponding to the next process, the state of each wafer processing equipment is updated, for example, the material in the target wafer processing equipment is taken away, the state of the transfer robot needs to be updated to the idle state, the wafer processing equipment in the next process receives the material and starts to process, and the state of the transfer robot needs to be updated to the running state. And repeating the steps to ensure the normal pushing of the processing flow until the wafer processing task is finished.
As shown in fig. 3, a scheduling strategy of the handling robot is illustrated in fig. 3, agv refers to the handling robot, and the process machine refers to the wafer processing equipment, and firstly judges whether packaging is completed or not, if yes, the handling robot closest to the packaging machine and in an idle state is controlled to carry away the packaged finished product; if not, judging whether the serial connection is finished before shipment upstream, if so, selecting an idle and nearer carrying robot to carry the serial finished product to package, if not, judging whether the measurement of the final particles is finished upstream, if so, selecting the idle and nearer carrying robot to carry the measured finished product to the serial connection before shipment, if not, judging whether the final cleaning is finished upstream, and so on, judging whether each process is finished, namely whether each wafer processing device is in a finished state, and controlling the carrying robot to carry materials according to the judging result.
Table 1 throughput tact for different wafer processing equipment
As shown in table 1, the throughput beats of different wafer processing apparatuses are different, and compared with the prior art in which the respective dispatching and conveying robots convey materials after the processing of each wafer processing apparatus is completed, the embodiment determines the state of each apparatus by backtracking the unstacking idea upstream so as to dispatch and conveying the materials by the conveying robots, so that the problem of route congestion caused by high concurrency dispatching and conveying robots can be avoided.
In this embodiment, the states and positions of the transfer robots may be acquired through wireless communication, and the states of the wafer processing apparatuses may be sequentially detected in an order opposite to the wafer processing order, that is, the first wafer processing apparatus in the wafer processing order may last detect the states of the wafer processing apparatuses, and the last wafer processing apparatus in the wafer processing order may first detect the states of the wafer processing apparatuses, so as to facilitate timely conveying the materials approaching to be processed into the finished product to the next process. When detecting a target wafer processing device in a finished state, indicating that materials which are processed but not taken out exist in the target wafer processing device, determining a transfer robot which is separated from the target wafer processing device and is in an idle state as a target transfer robot, so as to ensure the transfer capability of the target transfer robot, shorten the moving distance of the target transfer robot and improve the transfer efficiency. And controlling the target carrying robot to carry the processed material in the target wafer processing equipment to a placement position corresponding to the next process. Updating the state of each wafer processing device, repeating the steps, and ensuring the normal operation of the wafer processing work until the wafer processing task is finished. The application utilizes the unstacking idea to backtrack and detect the state of each wafer processing device from the wafer processing device of the last process to the upstream, and preferentially conveys the semi-finished product which is close to the finished product, so that the material can be pushed to the direction of the finished product as much as possible, the yield of the finished product is improved, the materials in each wafer processing device are separately conveyed, and the problem of route congestion caused by simultaneous conveying of a plurality of conveying robots is avoided. In addition, the method of the embodiment does not need to manually operate the carrying equipment to realize material conveying, improves the automation degree of the wafer processing process, and reduces the labor cost.
Optionally, the sequentially detecting the states of the wafer processing apparatuses in a reverse order to the wafer processing order includes:
and acquiring the states of the wafer processing equipment, and sequentially judging whether the states of the wafer processing equipment are the finished states according to the sequence reverse to the wafer processing sequence.
Specifically, from the wafer processing equipment of the last process according to the wafer processing sequence, determining whether the state of each wafer processing equipment is a finished state or not sequentially by upstream backtracking. Specifically, each process arranged according to the wafer processing sequence can be regarded as a stack, the concept of stacking is adopted, and from the last process, whether the semi-finished products processed by each process can be stacked or not is judged in sequence.
Optionally, the determining the transfer robot closest to the target wafer processing apparatus and in the idle state according to the state and the position of each transfer robot includes:
determining the distance between each carrying robot and the target wafer processing equipment according to the position of the carrying robot and the position of the target wafer processing equipment;
and sequentially detecting the states of the transfer robots according to the sequence from short distance to long distance until the transfer robot in an idle state is detected, and determining that the transfer robot is the target transfer robot.
Specifically, the distance between each transfer robot and the target wafer processing equipment is determined first, then the transfer robots are sorted in order of short distance to the field, whether each transfer robot is in an idle state is sequentially judged according to the sorting, and when one transfer robot is detected to be in the idle state, the transfer robot is the target transfer robot which is closest to the target wafer processing equipment and is in the idle state.
In this optional embodiment, the carrying robot is in an idle state, so that the carrying capability of the carrying robot is ensured, and the moving distance of the carrying robot is shortened when the carrying robot closer to the target wafer processing equipment is found, so that the subsequent carrying efficiency can be improved.
Optionally, the transfer robot includes AGV (Automated Guided Vehicle, automatic guided vehicle) chassis, support and arm, the one end of support with the AGV chassis is connected, the stiff end of arm with the other end of support is connected, the clamping jaw is installed to the end of arm, the end of arm with be provided with the degree of depth camera between the clamping jaw.
Specifically, the transfer robot can further comprise a controller, wherein the controller can be arranged at one end of the support far away from the AGV chassis, and the controller is convenient to radiate, debug and the like. The AGV chassis may be an AGV chassis of model Tendoasis 300 and the robotic arm may be a robotic arm of model Xinjiang CR 16.
The tail end of the mechanical arm is provided with a fixed clamping jaw which is matched with the clamping position of the wafer container, and the clamping jaw is matched with the clamping tenon of the wafer container, so that the anti-interference capability in the process of forking is improved.
A depth camera or a gray industrial camera with annular active light is arranged between the clamping jaw and the arm part of the mechanical arm. The method can extract the edge of the target object in the gray level image shot by the method, so that the geometric characteristics of the target object are obtained, the positioning is completed, and the clamping jaw is convenient to clamp. In addition, the camera can also identify material bar code information on the wafer container and auxiliary positioning codes in factory environment, such as ArUco marks and the like.
The transfer robot can further comprise a laser radar, and the laser radar and the depth camera are used for scanning the topography in the factory to construct a map.
Optionally, the controlling the target transfer robot to transfer the processed material in the target wafer processing apparatus to a placement position corresponding to a next process includes:
controlling an AGV chassis of the target transfer robot to move to the target wafer processing equipment, and controlling a mechanical arm and a clamping jaw of the target transfer robot to clamp materials;
when the clamping jaw of the target carrying robot clamps materials, controlling the AGV chassis of the target carrying robot to move to a placing position corresponding to the next process, and controlling the mechanical arm and the clamping jaw of the target carrying robot to place the clamped materials at the placing position.
Specifically, the scheduling strategy can be issued to the target transfer robot, the AGV chassis is controlled to move to a position corresponding to the target wafer processing equipment, and when the AGV chassis successfully reaches the position, the mechanical arm is controlled to execute corresponding operations, such as material removal. When the mechanical arm moves to the corresponding position, the opening or closing of the clamping jaw is controlled, the successful information is fed back after the clamping jaw is successfully clamped, and the mechanical arm is controlled to continuously execute the subsequent carrying action. In addition, in the carrying process of the mechanical arm and the clamping jaw, the depth camera can provide information such as grabbing target characteristics, bar code information reading, visual positioning and the like.
Optionally, the method further comprises:
and detecting the residual electric quantity of each transfer robot, and controlling the transfer robot to move to a charging area for charging when the residual electric quantity of the transfer robot is lower than a preset threshold value.
For example, the transfer robot may be forced to go to the automatic charging stake when the amount of electricity is below 20%, where the charging task is prioritized over any other task. When the electric quantity of the transfer robot is 20% -60%, if the transfer robot is in an idle state, the transfer robot can be controlled to automatically recharge until the transfer robot has task dispatch or the electric quantity exceeds 85%. To preserve battery life, transfer robots are typically charged with no more than 85% of their charge.
As shown in fig. 4, an automatic wafer processing apparatus according to an embodiment of the present application includes:
the acquisition module is used for acquiring the state and the position of each carrying robot;
the detection module is used for sequentially detecting the states of the wafer processing equipment according to the sequence reverse to the wafer processing sequence until the target wafer processing equipment in the finished state is detected, wherein the finished state represents that materials which are processed are in the wafer processing equipment;
the processing module is used for determining that the carrying robot closest to the target wafer processing equipment and in an idle state is the target carrying robot according to the state and the position of each carrying robot, and the idle state represents that the carrying robot is currently free of tasks and can receive new tasks;
and the control module is used for controlling the target transfer robot to transfer the processed material in the target wafer processing equipment to a placement position corresponding to the next process, updating the state of each wafer processing equipment, and circularly calling each module until the wafer processing task is finished.
The wafer automatic processing device of the present embodiment is used for implementing the wafer automatic processing method described above, and its advantages compared with the prior art are the same as those of the wafer automatic processing method described above compared with the prior art, and will not be described herein again.
Optionally, the detection module is specifically configured to: and acquiring the states of the wafer processing equipment, and sequentially judging whether the states of the wafer processing equipment are the finished states according to the sequence reverse to the wafer processing sequence.
Optionally, the processing module is configured to: determining the distance between each carrying robot and the target wafer processing equipment according to the position of the carrying robot and the position of the target wafer processing equipment; and sequentially detecting the states of the transfer robots according to the sequence from short distance to long distance until the transfer robot in an idle state is detected, and determining that the transfer robot is the target transfer robot.
Optionally, transfer robot includes AGV chassis, support and arm, the one end of support with the AGV chassis is connected, the stiff end of arm with the other end of support is connected, the clamping jaw is installed to the end of arm, the end of arm with be provided with the depth camera between the clamping jaw, control module is used for: controlling an AGV chassis of the target transfer robot to move to the target wafer processing equipment, and controlling a mechanical arm and a clamping jaw of the target transfer robot to clamp materials; when the clamping jaw of the target carrying robot clamps materials, controlling the AGV chassis of the target carrying robot to move to a placing position corresponding to the next process, and controlling the mechanical arm and the clamping jaw of the target carrying robot to place the clamped materials at the placing position.
Optionally, the wafer processing equipment comprises a tandem connection machine, a visual inspection machine, an epitaxial furnace, a thickness detection device, a flatness detection device, a resistance detection device, a cleaning machine and a packaging machine, wherein the wafer processing sequence sequentially comprises incoming material tandem connection, incoming material cleaning, incoming material particle measurement, epitaxy, visual inspection, thickness detection, resistance detection, flatness detection, final cleaning, particle measurement, tandem connection and packaging.
Optionally, the control module is specifically further configured to: and detecting the residual electric quantity of each transfer robot, and controlling the transfer robot to move to a charging area for charging when the residual electric quantity of the transfer robot is lower than a preset threshold value.
The embodiment of the application provides electronic equipment, which comprises a memory and a processor; the memory is used for storing a computer program; the processor is configured to implement the wafer automatic processing method as described above when executing the computer program.
The embodiment of the application provides a computer readable storage medium, wherein a computer program is stored on the storage medium, and when the computer program is executed by a processor, the automatic wafer processing method is realized.
An electronic device that can be a server or a client of the present application will now be described, which is an example of a hardware device that can be applied to aspects of the present application. Electronic devices are intended to represent various forms of digital electronic computer devices, such as laptops, desktops, workstations, personal digital assistants, servers, blade servers, mainframes, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as personal digital processing, cellular telephones, smartphones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions, are meant to be exemplary only, and are not meant to limit implementations of the applications described and/or claimed herein.
The electronic device includes a computing unit that can perform various appropriate actions and processes according to a computer program stored in a Read Only Memory (ROM) or a computer program loaded from a storage unit into a Random Access Memory (RAM). In the RAM, various programs and data required for the operation of the device may also be stored. The computing unit, ROM and RAM are connected to each other by a bus. An input/output (I/O) interface is also connected to the bus.
The computer system may include a client and a server. The client and server are typically remote from each other and typically interact through a communication network. The relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other.
Those skilled in the art will appreciate that implementing all or part of the above-described methods in accordance with the embodiments may be accomplished by way of a computer program stored on a computer readable storage medium, which when executed may comprise the steps of the embodiments of the methods described above. The storage medium may be a magnetic disk, an optical disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), or the like. In the present application, the units described as separate units may or may not be physically separate, and units displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiment of the present application. In addition, each functional unit in the embodiments of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
Although the application is disclosed above, the scope of the application is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the application, and these changes and modifications will fall within the scope of the application.
Claims (10)
1. An automatic wafer processing method, characterized in that the automatic wafer processing method comprises the following steps of:
s100, acquiring the state and the position of each transfer robot;
s200, sequentially detecting states of the wafer processing equipment according to an order reverse to the wafer processing order until a target wafer processing equipment in a finished state is detected, wherein the finished state represents that materials which are processed are in the wafer processing equipment;
s300, determining the transfer robot closest to the target wafer processing equipment and in an idle state as a target transfer robot according to the state and the position of each transfer robot, wherein the idle state represents that the transfer robot is currently free of tasks and can receive new tasks;
and S400, controlling the target transfer robot to transfer the processed material in the target wafer processing equipment to a placement position corresponding to the next process, updating the state of each wafer processing equipment, and returning to S200 until the wafer processing task is finished.
2. The automatic wafer processing method according to claim 1, wherein sequentially detecting the states of the respective wafer processing apparatuses in an order reverse to the wafer processing order comprises:
and acquiring the states of the wafer processing equipment, and sequentially judging whether the states of the wafer processing equipment are the finished states according to the sequence reverse to the wafer processing sequence.
3. The automated wafer processing method of claim 1, wherein the determining the transfer robot closest to the target wafer processing apparatus and in an idle state based on the state and the position of each transfer robot is a target transfer robot comprises:
determining the distance between each carrying robot and the target wafer processing equipment according to the position of the carrying robot and the position of the target wafer processing equipment;
and sequentially detecting the states of the transfer robots according to the sequence from short distance to long distance until the transfer robot in an idle state is detected, and determining that the transfer robot is the target transfer robot.
4. The automatic wafer processing method according to claim 1, wherein the handling robot comprises an AGV chassis, a bracket and a mechanical arm, one end of the bracket is connected with the AGV chassis, a fixed end of the mechanical arm is connected with the other end of the bracket, a clamping jaw is mounted at the tail end of the mechanical arm, and a depth camera is arranged between the tail end of the mechanical arm and the clamping jaw.
5. The automated wafer processing method of claim 4, wherein controlling the target handling robot to handle the processed material in the target wafer processing apparatus to a placement location corresponding to a next process comprises:
controlling an AGV chassis of the target transfer robot to move to the target wafer processing equipment, and controlling a mechanical arm and a clamping jaw of the target transfer robot to clamp materials;
when the clamping jaw of the target carrying robot clamps materials, controlling the AGV chassis of the target carrying robot to move to a placing position corresponding to the next process, and controlling the mechanical arm and the clamping jaw of the target carrying robot to place the clamped materials at the placing position.
6. The automatic wafer processing method according to any one of claims 1 to 5, wherein the wafer processing apparatus includes a tandem mill, a vision inspection machine, an epitaxial furnace, a thickness inspection apparatus, a flatness inspection apparatus, a resistance inspection apparatus, a washer, and a packaging machine.
7. The method of claim 6, wherein the wafer processing sequence is incoming material serial connection, incoming material cleaning, incoming material particle measurement, epitaxy, visual inspection, thickness detection, resistance detection, flatness detection, final cleaning, particle measurement, serial connection, and packaging.
8. The automatic wafer processing method according to any one of claims 1 to 5, characterized by further comprising:
and detecting the residual electric quantity of each transfer robot, and controlling the transfer robot to move to a charging area for charging when the residual electric quantity of the transfer robot is lower than a preset threshold value.
9. An automatic wafer processing apparatus, characterized in that based on a plurality of wafer processing devices and a plurality of transfer robots, the automatic wafer processing apparatus comprises:
the acquisition module is used for acquiring the state and the position of each carrying robot;
the detection module is used for sequentially detecting the states of the wafer processing equipment according to the sequence reverse to the wafer processing sequence until the target wafer processing equipment in the finished state is detected, wherein the finished state represents that materials which are processed are in the wafer processing equipment;
the processing module is used for determining that the carrying robot closest to the target wafer processing equipment and in an idle state is the target carrying robot according to the state and the position of each carrying robot, and the idle state represents that the carrying robot is currently free of tasks and can receive new tasks;
and the control module is used for controlling the target transfer robot to transfer the processed material in the target wafer processing equipment to a placement position corresponding to the next process, updating the state of each wafer processing equipment, and circularly calling each module until the wafer processing task is finished.
10. An electronic device comprising a memory and a processor;
the memory is used for storing a computer program;
the processor, when executing the computer program, is configured to implement the wafer automatic processing method according to any one of claims 1 to 8.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1567558A (en) * | 2003-07-09 | 2005-01-19 | 上海华虹集成电路有限责任公司 | Stack test method |
| US20060027738A1 (en) * | 2004-08-06 | 2006-02-09 | John Berting | System and method for enhanced measurement of rheological properties |
| JP2009099998A (en) * | 2008-11-25 | 2009-05-07 | Rorze Corp | Method of positioning disk-shaped object, device of positioning disk-shaped object using the method, conveying device, and semiconductor manufacturing apparatus |
| TWM439254U (en) * | 2012-03-09 | 2012-10-11 | Solex Technology Corp | Wafer cleaning wafer rotation detecting structure |
| WO2020038359A1 (en) * | 2018-08-21 | 2020-02-27 | 深圳中科飞测科技有限公司 | Detection system and method |
| WO2022268112A1 (en) * | 2021-06-24 | 2022-12-29 | 深圳市库宝软件有限公司 | Automatic loading and unloading machine control method and apparatus, control device, and readable storage medium |
| CN116053175A (en) * | 2022-11-28 | 2023-05-02 | 北京北方华创微电子装备有限公司 | Wafer scheduling method and device and semiconductor device |
-
2023
- 2023-05-16 CN CN202310566788.1A patent/CN116631908A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1567558A (en) * | 2003-07-09 | 2005-01-19 | 上海华虹集成电路有限责任公司 | Stack test method |
| US20060027738A1 (en) * | 2004-08-06 | 2006-02-09 | John Berting | System and method for enhanced measurement of rheological properties |
| JP2009099998A (en) * | 2008-11-25 | 2009-05-07 | Rorze Corp | Method of positioning disk-shaped object, device of positioning disk-shaped object using the method, conveying device, and semiconductor manufacturing apparatus |
| TWM439254U (en) * | 2012-03-09 | 2012-10-11 | Solex Technology Corp | Wafer cleaning wafer rotation detecting structure |
| WO2020038359A1 (en) * | 2018-08-21 | 2020-02-27 | 深圳中科飞测科技有限公司 | Detection system and method |
| WO2022268112A1 (en) * | 2021-06-24 | 2022-12-29 | 深圳市库宝软件有限公司 | Automatic loading and unloading machine control method and apparatus, control device, and readable storage medium |
| CN116053175A (en) * | 2022-11-28 | 2023-05-02 | 北京北方华创微电子装备有限公司 | Wafer scheduling method and device and semiconductor device |
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