JP2009099998A - Method of positioning disk-shaped object, device of positioning disk-shaped object using the method, conveying device, and semiconductor manufacturing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To shorten time of reference position teaching at each port during equipment starting-up in a semiconductor manufacturing apparatus provided with a positioning device and a conveying robot. <P>SOLUTION: Two points W1 and W2, in which circumference of a disk-shaped object 47 of a wafer or the like and a locus 43 of a detection unit are intersected, are detected; and a center position A of the disk-shaped object is calculated using the two points, a specific point O on a perpendicular bisector 42 of a line segment connecting the two points, and a radius r of the disk-shaped object. This makes the conveying robot perform positioning work; and by using the result, not only modification of a conveying path and reference position teaching in case of starting-up the equipment are mostly automated. In the case where there is a notch, the circumference of the disk-shaped object is detected by two loci of the detection unit and a correct center position is detected. Furthermore, in a disk-shaped object of unknown radius having a notch, the circumference is detected by three loci of the detection unit to obtain a radius, the loci being separated with each other by distance which does not bridge the notch; and accordingly, mix production using a wafer different in diameter becomes possible. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention must be performed when handling a disk-shaped object such as a semiconductor wafer between a plurality of locations, and is a reference position that serves as a reference for the position of the disk-shaped object in the reference coordinate system including the position of the handling device. A positioning method and apparatus using the method for determining the center position in the teaching, and a transport method and apparatus for automatically correcting the transport trajectory using the positioning, and further, The present invention also relates to a semiconductor manufacturing facility using the above apparatus.

  As shown in FIGS. 1 and 2, in general, the semiconductor manufacturing facility 1 moves from a cassette 6 in which semiconductor wafers and the like are stored on a shelf to a load lock chamber 8 which is a transfer port of various processing chambers 7, and The wafer is transferred from the load lock chamber 8 to the processing chamber 7 by the transfer robot 4 or has the transfer device 2. As shown in FIG. 3, the transfer robot 4 includes a holding arm 14 on which a wafer or the like is placed or fixed, and a transfer arm 12 that can bend, stretch, turn, and move up and down. The operation of the shaft is controlled by the control unit 11. The control unit 11 stores the transfer procedure, path, and coordinate information of the transfer position in the reference coordinate system including the position coordinates of the transfer robot 4, and issues an operation command to each axis of the transfer robot 4 based on the information. As a result, the transfer robot 4 can automatically transfer a disk-like object such as the wafer 13 to a predetermined transfer position. For this purpose, the control unit 11 can position the various devices and wafers in the reference coordinate system. It is necessary to recognize each coordinate.

  FIG. 26 shows a part of a flowchart of a teaching (teaching) process in the conventional transfer apparatus 2 shown in FIG. 25 for determining the origin coordinates when the semiconductor manufacturing facility 1 is started up. Here, “teaching” determines a reference position for transferring the wafer 13 and the like between the transfer robot 4, the cassette 6 and the load lock chamber 8, and a positioning device 10 provided separately if necessary. Work for.

  For example, when teaching about the process of transporting a disk-shaped object such as the wafer 13 stored in the cassette 6 to the load lock chamber 8, first, in step S1, temporary position information (initial value) of the designed transport robot 4 is obtained. Next, in step S2, the holding unit 14 of the transfer robot 4 is gradually moved by manual operation (manual) to the delivery position with the cassette 6 based on the design drawing as a reference position. However, the disk-like object remains in the normal position of the shelf in the cassette 6 and is not fixed to the holding unit 14.

  Next, in step S3, as shown in FIG. 3, a guide jig 20 is mounted on the holding portion 14, and it is visually checked whether the placement position of the disk-shaped object and the holding position on the design drawing are completely coincident with each other. Confirm by. If it is deviated, in step S4, the transport robot is manually turned little by little to manually rotate, bend, stretch, and move up and down to correct the position of the holding unit 14 to an appropriate position, and in step S5, the position obtained in step S4. Information is transmitted to the control unit 11 to update the initial position information.

  If there is no deviation in the confirmation in step S3, in step S6, the held disk-like object is transferred to the delivery position with the load lock chamber 8, and then in step S7, the disk-like object transfer position is as per the design drawing. Check visually that there is. If there is a deviation in the actual transport position, the process returns to step S4 and proceeds to step S5. If there is no deviation, the series of teaching ends.

  Hereinafter, with respect to the transfer robot 4, between the positioning device 10 and other cassettes 6 and the load lock chambers 8, and with respect to the vacuum robot 31, between the load lock chambers 8 and other ports such as the processing chambers 7. Similarly, the reference position is taught one by one according to the procedure from step S1 to step S7.

  Further, in the conventional production process, the disk-shaped object is positioned each time by using a positioning device (dedicated machine) 10 as shown in FIG. In the transfer apparatus 2 shown in FIG. 25, in order to prevent the trajectory of the wafer 13 being transferred from interfering with the cassette 6 or the edge of each entrance / exit, the wafer is placed on a disk rotary positioning apparatus 10 separate from the transfer robot 4. Usually, after 13 is delivered and positioned at a normal position, the transfer robot 4 receives the wafer 13 again and transfers it to the destination.

  In Japanese Examined Patent Publication No. 7-27953, in order to improve the productivity by omitting the delivery step, the transfer arm of the transfer robot is operated while holding the wafer, and each of the light emitting units 9a and 9b shown in FIG. A method of calculating the center position of the wafer by passing through a portal type positioning device having a light receiving portion 9b and having three sensors 9 for detecting the wafer 13 with a light beam 9c is proposed. In this method, the reference holding position of the wafer is taught in advance, and the trajectory of the holding unit 14 is corrected based on the deviation amount between the teaching position and the wafer center position detected by the portal type positioning device, Transport to destination without interference. As a result, the time required for delivery and reception to the positioning device 10 was shortened, and the above method contributed to the improvement of productivity.

  However, in the conventional teaching work described above, as shown in the flowchart of FIG. 26, trial and error is performed with all the equipments involved in the transfer robot 4 while confirming with the guide jig 20 with the naked eye. This is an all-manual method in which the reference position is repeatedly set, and is a very laborious method. Since this is a series of tense work by skilled technicians, it takes a whole day or more with only the conveying device shown in FIG.

  Further, as described above, a portal type positioning apparatus described in Japanese Patent Publication No. 7-275953 shown in FIG. 27 has been proposed for positioning a disk-shaped object during production. Since the method is used, there is no change in the labor required to start up the equipment. In addition, since it is a device that passes through a gate, there is a problem that one device must be installed at each load lock chamber or each entrance of each processing chamber, and this device is larger than the diameter of a disk-shaped specimen such as a wafer. Since this is a device, there has been a problem that the amount of investment becomes large. Furthermore, since there is no positioning step before inserting the disk-shaped object into the portal type positioning device, it is necessary to perform manual positioning that takes time and effort as described above so that the disk-shaped object does not collide with the device. was there. In the event of a collision, the generation of dust is indispensable, and there is also a problem that the test object such as a wafer may be damaged.

  Further, in the positioning method described in the above Japanese Patent Publication No. 7-27953, the method of discriminating the notch is illustrated geometrically, but no method of algebraically discriminating has been found. Therefore, in order to take the method of calculating the center of the disk by the least square method which is an approximate expression method, at least three sensors 9 as detection means are required, at least 6 points on the periphery of the disk and 1 center of the disk holding portion. , A total of at least 7 points shall be measured. In addition, the six points on the peripheral edge always include points on the edge of the notch but not on the circumference, strictly speaking, the correct position was not calculated and the accuracy was not good. In addition, the calculation formula for obtaining the radius of the disk based on the well-known Pythagorean theorem is presented from the four points on the periphery that do not include the notch, but the point on the notch cannot be excluded. Could not find the exact disc radius.

  As a result of intensive investigations to solve these problems, the present invention has developed a new and rigorous calculation method to measure and calculate the amount of deviation of the center position of a disk-like object such as a wafer, The present invention proposes a new automatic teaching method (auto teaching) and positioning method that realize quick start-up. The present invention also proposes a teaching device based on this theory, a positioning device, a transport method for correcting a transport trajectory based on the calculated deviation amount, a transport device, and semiconductor equipment using these. By the way, “teaching” as used in the present invention is a standard that includes the position of the handling device at the place where the disk-like material is placed, which is the standard for the operation of the holding unit of the handling device that carries the disk-like material and other handling. The reference position, which is the position coordinate in the coordinate system, is to be input and stored in the handling device, and “positioning” in the present invention is a disk-like shape placed at an arbitrary position on the holding unit or the like. This refers to finding out how much the position of the object and the holding part for holding it deviates from the previously inputted reference position.

First, the principle of the present invention will be described. FIG. 4 shows a case where the circumference of the disk intersects with the arc-shaped trajectory of one sensor. The disk 47 to be measured has W ₁ and W ₂ as the intersection points of the circumference with the known radius r and the arc-shaped detection locus 43 with the known radius R of the sensor, and the vertexes of the circular arc between the intersection points. Assuming W ₃ , an arc W ₁ W ₃ W ₂ is formed. A perpendicular bisector 42 of the line segment W ₁ W _{2 formed by} both ends of the arc passes through both the center A of the measurement disk 47 and the center O of the arc locus of the sensor. The deviation angle α between the perpendicular bisector 42 and the direction 41 taught in advance can be obtained by measurement. Further, the angle θ formed by the vertical bisector 42 and one end W _{1 of the} arc can be obtained by measurement.

Next, a line segment AO (= L ₁ ) having an unknown length is obtained as the center position of the measurement disk 47. If a perpendicular line is dropped from W ₁ to the line segment W ₃ O of the perpendicular bisector 42 and the intersection point is B,
Δ From W ₁ BO, BO = Rcos θ, W ₁ B = Rsin θ (Equation 1)
△ From W ₁ BA, BO = rcos φ + L ₁ , W ₁ B = rsin φ (Formula 2)
That is, Rcos θ = rcos φ + L ₁ (Equation 3)
Rsin θ = rsin φ (Equation 4)
When rearranged, rcos φ = Rcos θ−L ₁ (Equation 5)
rsin φ = Rsin θ (Equation 6)
When (Equation 5) and (Equation 6) are squared and both left and right sides are added,
cos ² φ + sin ² φ = 1
r ² = (R cos θ−L ₁ ) ² + R ² sin ² θ (Expression 7)
Therefore, L ₁ = R cos θ ± (r ² −R ² sin ² θ) ^1/2 ... (Equation 8)

Here, as shown in FIG. 4, when the center A of the disk to be measured with respect to the detection locus 43 of the sensor is inside the circle on which the detection locus rides,
L ₁ = R cos θ− (r ² −R ² sin ² θ) ^1/2 (Equation 9)
If it ’s on the outside,
L ₁ = R cos θ + (r ² −R ² sin ² θ) ^1/2 (Expression 10)
It becomes.
Here, since the center position C of the disc 46 taught in advance is known, if the line segment CO is L ₀ ,
Diameter deviation length ΔH = L ₁ −L ₀ ... (Formula 11)
Therefore, the disk can be positioned by using the previous shift angle α and the shift length ΔH in the diameter direction according to (Equation 11).

Next, referring to FIG. 5, a case will be described in which the linear detection trajectory 43 of one sensor cuts the circumference of a disk-like object 46 serving as a reference into an arc shape. The distance CD (= X ₀ ) from the center C is previously taught, where D is the intersection of the line EF formed by both ends of the arc of the disk 46 at the previously taught position and the perpendicular bisector. It turns out.

Similarly, in FIG. 5, a case where the circumference of the disk-like object 47 to be measured having a known radius r at the center A at an unknown position A is cut into an arc shape by the linear detection track 43 of the sensor will be described. If the two end points of the arc are W ₁ and W ₂ , the length of the line segment W ₁ W ₂ is known by measurement. The intersection of the perpendicular bisector of the line segment W ₁ W ₂ and the line segment W ₁ W ₂ and B, and the unknown distance AB = X _1,
△ ABW ₂ is a right triangle, so
X ₁ ² + (BW ₂ ) ² = r ² ... (Formula 12)
Here since it is _{BW 2 = W 1 W 2/} 2,
^{_{X 1 = ± {r 2 -}} (W 1 W 2/2) 2} 1/2 ····· ( Formula 13)
Therefore, the amount of deviation in the X direction is ΔX = X ₀ −X ₁ ... (Formula 14)
Is calculated as

Here, the point D on the detection trajectory 43 is known because it is the teaching position, and the point B is obtained by measurement since it is the midpoint of the line segment measurement points W ₁ W ₂ .
Therefore, the amount of deviation in the Y direction ΔY = BD (Equation 15)
Is also determined by measurement.
Therefore, the shift amount (ΔX, ΔY) is calculated.

  The invention according to claim 1 and claim 2 relates to a method of teaching a reference position using the principle. That is, the present invention provides a method of teaching a reference position as a reference of the position of the disk-like object in a reference coordinate system including the position of the handling apparatus to the disk-like object handling apparatus, and a radius at a predetermined place as the reference position. A step of placing a known disk-like object, a step of obtaining a center position of the disk-like object in the reference coordinate system, and a position of the predetermined location in the reference coordinate system obtained by calculation based on the center position Storing in the handling device as a reference position, and the step of obtaining the center position of the disk-shaped object moves the detection means relative to the disk-shaped object to move around the circumference of the disk-shaped object. Crossing one trajectory of the detecting means, obtaining a position of the two crossing points by the crossing in the reference coordinate system, and vertical bisection of a line segment connecting the two crossing points A specific point on the line, the intersection of the two, and the disk shape Proposes a and the step of calculating the center position with a radius, the reference position teaching method of a disc-like object, which comprises a. Claim 7 relates to a device for implementing this method.

  The specific point here is defined as a point that is known or determined by measurement. That is, when the locus of the detecting means is a circle, it is the turning center of this circle, which is known. If the locus of the detection means is a straight line, it can be obtained immediately by measurement at the midpoint of the line connecting the two intersections with the circumference. In this teaching method, when placing a disk-like object at a predetermined place as a reference position, it is preferably performed manually, and when using a commercially available wafer as the disk-like object, preferably a notch, an orientation flat, etc. The recess is placed away from the detection trajectory. Moreover, you may use the disk shaped object which does not have a recessed part and a convex part other than a wafer. Note that the position of the convex portion or the concave portion may be automatically recognized by image processing or the like, and the convex portion or the concave portion may be automatically placed away from the detection trajectory.

Similarly, according to the above-described principle, when the disk-like object has no recesses or protrusions, or when these are avoided as described above, the positioning of the disk-like object according to claim 3 using one detection means. A method and a positioning device according to claim 9 were proposed. Specific examples of the teaching device and the positioning device described above include all devices that can implement the method of the present invention as a function, such as a known robot, a transfer device, and a positioning dedicated device.
In the present invention, a sensor for detecting a disk-shaped object may be fixed and the disk-shaped object may move, or the disk-shaped object may be fixed and the sensor may move. This motion may be a linear motion or a circular motion.
Further, in the methods of claims 3 to 5, it is necessary to previously teach the center position of the disk-like object. In this case, the method of claim 1 or claim 2 may be used, A known method may be used.

[Method 1 for avoiding the notch]
The invention according to claim 4 and claim 10 has a notch (recessed portion) as a reference location on a peripheral edge such as a notch or an orientation flat, or a convex portion such as a handle attached to a disk like a semiconductor wafer. In some cases, the positioning method and positioning apparatus are proposed. That is, here, when calculating the center position of the disk-like object, as shown in FIG. 6, for example, two detection means 43 and 44 are provided using different detection means 9. When the detection track 43 passes through the notch 51, which is a recess, the line segment formed by the two intersections with the outer periphery of the disk is shorter than when there is no notch there, and is calculated by the above calculation method. It is calculated that the disk center is closer to the turning center O.

一方、検出軌道４３が切り欠き部５１を通った場合は、旋回中心と円盤中心との距離ＣＯは、切り欠き部５１がなかった場合に比べてΔＬ₁ だけ短くなり、円盤４９であると誤認する。即ち、

と算出する。従って、（式１６）と（式１７）の計算結果を比べて大きい方を選べばよい。 More specifically, when both of the detection tracks 43 and 44 do not pass through the notch, the center A of the disk is obtained from the two triangles on the left side of the vertical bisector 42 in FIG. And the distance from the turning center O are both calculated as AO.

On the other hand, if the detected track 43 passes through the cutout portion 51, the distance CO between the turning center and the disc center is made shorter by [Delta] L ₁ than if no notch portion 51, and a disk 49 misidentification To do. That is,

And calculate. Therefore, the larger one may be selected by comparing the calculation results of (Expression 16) and (Expression 17).

In FIG. 7, when there is a notch in the detection track 44, the larger distance AO may be selected in the same manner.
That is, if the detected trajectory passes over the notch, the calculated disk center is always near the turning center O and is calculated to be small. In both cases, the two detection tracks are separated so that the notch does not enter, the circumference of the disk is cut into two arcs, and both ends are measured. That is, the one with the larger distance AO value may be selected.
Incidentally, when there is no notch on the two detection tracks 43 and 44, either one of them may be adopted in order to find the center position at the same place.

[Method 2 for avoiding notches, one method for passing twice with one sensor]
Next, as shown in FIGS. 8 and 9, two different arcs may be formed by one sensor and two swiveling operations. That is, when calculating the center of the disk-like object, the distance R from the turning center O to the detection trajectory 43 is left unchanged, and the second time, the center position of the disk-like object is shifted by the distance m. However, the distance m needs to be widened to the extent that it does not hit the notch in both of the two turning motions, and the distance m must be smaller than the diameter of the disk.

First, the detection procedure will be described with respect to the case where the detection track 43 does not pass through the notch 51 and the case where it passes through in FIG. First, when the detection track 43 does not pass through the notch 51, the disk 47 is recognized from the triangle of the turning angle θ ₁ on the left side of the vertical bisector 42 by the calculation formula (Formula 18) and the center thereof is detected. Is calculated as A.
AO = Rcos θ ₁ − (r ² −R ² sin ² θ ₁ ) ^1/2 (Equation 18)
On the other hand, when the detection trajectory 43 passes through the notch 51, the disc 49 is recognized from the triangle of the turning angle θ ₂ on the right side of the vertical bisector 42 and misidentified that the distance between both ends of the arc is short. The disc center is misidentified as C.
CO = Rcos θ ₂ − (r ² −R ² sin ² θ ₂ ) ^1/2 (Equation 19)
AO-CO = ΔL ₁ (Equation 20)
That is, it is calculated that the center C is closer to the turning center O side by ΔL _{1 when} it hits the notch.

Next, as shown in FIG. 9, a case where the second turning operation is performed by shifting the distance m will be described. When the detection trajectory 43 passes through the notch 51 of the disk 47 in the first turn, it is mistakenly recognized that the circular arc has become small, and by the same calculation as Equation 19, the turn center O side from the original center A ′ by ΔL ₁ It is calculated that there is a disk center at C 'close to. Next, when the turning radius is shifted by a distance m so that the detection track 43 does not pass through the notch 51 of the disk 50, the center of the disk is recognized as A ″ from Equation 9.
Therefore, the larger one (A ″ O−m) may be adopted by comparing CO (= A ′ O−ΔL ₁ ) and A ″ O−m.
Similarly, if the notch portion is not found in the first turning operation, but the second turning operation is found, the larger one may be selected as the distance between the correct center of the disk and the turning center.

Next, when there is a convex part (not shown) on the circumference of the disk, it is always larger than the line segment formed by the two intersections as compared with the case where there is no convex part. Therefore, when there is a convex part on the circumference of the disk, it is calculated that the center of the disk is always farther from the turning center than when there is no protrusion. In other words, among the distances calculated from the two line segments according to Equation 9, if there is a convex portion as the correct distance between the center of the disk and the center of rotation, the smaller one may always be selected. Therefore, it is possible to select the center of the disc by the detection trajectory that does not hit the concave portion or the convex portion.
If the concave portion or the convex portion is not on the two detection trajectories, either one may be adopted to find the center position at the same place as described above.

  Further, in the fourth and tenth aspects, the same can be said for the case where the two detection tracks 43 and 44 are straight lines, and these are shown in FIGS. If the detected trajectory passes through the notch, it is calculated that the calculated disc center is always outside the detected trajectory as compared to the case where the detected trajectory does not pass. The two detection tracks 43 and 44 are separated by a parallel distance m so that the notch portions do not enter together, the circumference of the disk is cut into two arcs, and both ends are measured, and viewed from the detection track. Select the center of the disk on the inside.

More specifically, in FIG. 10, if both the detection trajectories 43 and 44 do not have a notch, the calculation from each of them has the center position of the disk-like object as A, and X _AP = X _AB + m.
However, when the detection trajectory 44 hits the notch, the calculation method of the present invention miscalculates that the arc is small and the circle is 49, and the center is calculated as A '.
Therefore, since X _AP <X _A′Q , X _AB + m <X _A′Q .
That is, the center position information based on the detection results of the detection trajectory 43 and the detection trajectory 44 is compared, and the smaller distance X _AB + m may be selected as a correct value.

Similarly, FIG. 11 shows a case where the detection track 43 is hooked on the notch. The calculation result when there is no notch on the detection trajectory 43 is X _AB = X _AP -m.
If there is a notch on the detection track 43, it is recognized as a circle 49, and X _AB <X _{A'B`, that</sub> is, X <sub>AP</sub> -m <X <sub>A'B`} .
Therefore, the center position information in the detection results of the detection trajectory 43 and the detection trajectory 44 is compared, and the smaller distance X _AP -m having no notch is selected as a correct value. That is, the center of the disk that is closer to the detection trajectory should always be selected.

Further, claims 4 and 10 include a case where two different circular arcs are formed by one linear motion with one sensor. That is, in FIG. 10 and FIG. 11, if the trajectory of the detection means 9 draws the detection trajectory 43 in the first operation, or the detection trajectory 44 in the second operation, or vice versa, the above description remains as it is. apply.
Next, in claims 6 and 12, the principle of the present invention is applied to an apparatus having a transfer function, and when a disk-like object such as a wafer is transferred to a destination from the obtained deviation amount of the center position, a collision or A method for correcting a transport path from a predetermined path so as not to cause interference and a transport apparatus therefor have been proposed.

[Method for Determining Wafer Radius r Using Three Detection Trajectories]
Among the disk-shaped objects, there are six types of semiconductor wafers, 3 inches, 4 inches, 5 inches, 6 inches, 8 inches, and 300 mm, and their radii are standardized according to the SEMI standard by the International Semiconductor Manufacturing Equipment Material Association. In addition, each size is stored in a dedicated cassette. Therefore, since the radius r of the wafer is known when the cassette is placed, it has been treated as a known value in the above calculation process. However, when confirming which wafer size is in the transfer process, there is a case where it is desired to measure the radius due to differences in wafer diameters by manufacturers or variations between lots.
In the present invention, in response to such a requirement, the radius r of the disk-shaped object can also be measured and calculated.

  Claims 13 to 16 describe a method and apparatus for measuring a disk-like object having an unknown radius, calculating the radius and center position, and positioning the disk-like object based on the calculation result. A transport device that corrects the transport path based on the calculation result is described.

Here, the principle of obtaining the radius of the disk will be described with reference to FIG. 12 in the case of intersecting the disk circumference and the turning trajectories of the three sensors. The turning baseline 40 is predetermined. Assuming that 43 of the three detection tracks 43, 44, 45 pass through the notch, the other detection track 44 and the vertical line segment between each of the two intersections of the detection track 45 with the outer peripheral edge of the wafer. The bisector 42 is common, and the angle formed with the turning base line 40 is α ₁ , but the angle formed between the vertical bisector 48 and the turning base line 40 in the case of the detection trajectory 43 is α ₂ , It is different from the α _1. Therefore, the detection trajectory 43 in which only one angle of the perpendicular bisector differs is excluded.
The triangle formed by each of the two intersections of the detection trajectory 44 and the detection trajectory 45 with the outer periphery of the wafer and the turning center O is an isosceles triangle, and the line 42 forms four right triangles. The turning angles θ ₁ and θ ₂ are both measurement angles, the turning radii R ₁ and R ₂ are both set distances, and L is an unknown.
r ² = (R ₁ cos θ ₁ −L) ² + R ₁ ² sin ² θ ₁ (Equation 21)
r ² = (R ₂ cos θ ₂ −L) ² + R ₂ ² sin ² θ ₂ (Equation 22)
When the detection tracks 44 and 45 are at a distance from the center of the disk when viewed from the turning center,
L = R ₁ cos θ ₁ − (r ² −R ₁ ² sin ² θ ₁ ) ^1/2 (Equation 23)
L = R ₂ cos θ ₂ − (r ² −R ₂ ² sin ² θ ₂ ) ^1/2 (Equation 24)
Substituting equation 24 into equation 21,

Ｓについて解くと

両辺二乗して

式２４に式３１を代入すると、

ここで、旋回角度θ₁ 、θ₂ はともに測定値であるからＬが求まり、円盤状物４７の中心Ａは、共通垂直二等分線４２上の、旋回中心Ｏから距離Ｌのところに求まる。
ちなみに、半径未知の円盤状物の半径ｒは、正の数だから、（式３３）で求められる。

ここでは、検出手段の３本の検出軌跡が円弧の場合を説明したが、これら検出軌跡が３本の平行線であってもよい。その場合は、旋回基線４０に代えて、３本の平行線上の１点、または他の任意の１点を基点とすれば、同様にして半径未知の円盤状物の半径と、中心位置とを求めることができる。 here,
S = (r ² −R ₂ ² sin ² θ ₂ ) ^1/2 (Equation 26)
When substituting equation 26 into equation 25,

Solving for S

Square on both sides

Substituting equation 31 into equation 24,

Here, since the turning angles θ ₁ and θ ₂ are both measured values, L is obtained, and the center A of the disk-like object 47 is obtained at a distance L from the turning center O on the common perpendicular bisector 42. .
Incidentally, since the radius r of the disk-shaped object whose radius is unknown is a positive number, it can be obtained by (Expression 33).

Here, the case where the three detection trajectories of the detection means are arcs has been described, but these detection trajectories may be three parallel lines. In that case, instead of the turning base line 40, if one point on three parallel lines or another arbitrary point is used as a base point, the radius of the disk-like object whose radius is unknown and the center position are similarly determined. Can be sought.

Claims 2, 5, 14 and claims 8, 11, 16 are a novel method and apparatus in which the sensor locus is a circular orbit among teaching methods, positioning methods, teaching devices, and positioning devices applying the above-described principle. Limited. The sensor may move on the circular orbit, and the disk-shaped object may turn.
Furthermore, the present invention provides, in claim 18, an improved semiconductor manufacturing facility by using any one or more of the teaching device, the positioning device, and the conveying device as described above.
The present invention can be realized in both a positioning apparatus and a transport apparatus. Further, the transfer device referred to here includes a known device such as a transfer device having a turning motion mechanism and / or a linear motion mechanism, such as a SCARA robot, an articulated robot, and an XY axis moving table.

As a type of sensor for detecting two points on the outer periphery of the disk-like object, it is preferable to use a non-contact type sensor. Since a semiconductor wafer, which is an electronic component, is often handled, a transmissive or reflective optical sensor is preferable instead of an electromagnetic sensor or a mechanical sensor. Among them, a two-dimensional sensor such as a CCD with image processing means is used. Even if it is, it may be a line sensor in which the light quantity is quantified, or it may be a point sensor that shows ON and OFF. In order to realize the present invention, a single point sensor is sufficient as the optical sensor. However, as described above, two sensors may be used to detect notches and orientation flats. As the sensor for measuring the deviation angle, a known angle sensor such as an encoder may be used, but a pulse value as an angle may be employed by a pulse motor such as a servo motor or a stepping motor.
The above-described calculation formulas described in the present invention can be easily executed by calculation means configured by a computer for controlling the transfer robot of the transfer apparatus, etc., by a normal computer program. If it is used as a control means composed of a control computer such as a robot, it can be easily reflected in the motion trajectory of each part of the transport apparatus.
Further, the reference coordinate system in the present invention may be not only a rectangular coordinate system but also a polar coordinate system, and the position in the coordinate system is not only directly expressed by coordinate values, but also each axis of the transport robot. It may be expressed indirectly by the amount of operation.

Embodiments of a method for positioning a disk-like object will be described below with reference to the drawings for semiconductor manufacturing equipment according to the present invention.
The semiconductor manufacturing facility 1 shown in FIG. 1 has a transfer device 2 for transferring a wafer 13 which is a disk-like material from the cassette 6 to the load lock chamber 8 and the like, and is connected to the load lock chamber 8 to form and diffuse the wafer 13. And a processing apparatus 3 for performing various processes such as etching. Among them, the transfer device 2 includes one or a plurality of stages 19 on which cassettes 6 in which wafers are stored in a shelf shape can be placed, a scalar type transfer robot 4 having a transfer arm 12, and the transfer robot 4. A normal computer that controls the movement of the moving stage 17 parallel to the row in front of a plurality of stages arranged in parallel, the sensor 9 as the detecting means, and the operations of the transfer robot 4, the moving means 17 and the sensor 9. The control part 11 which has this is comprised. Note that a conventional positioning device 10 as shown in FIG. 25 can be included in the configuration of the transfer device 2 in order to accurately correct the position of the disk-like object or to detect a notch such as a notch on the wafer edge. .

Similarly, the processing apparatus 3 shown in FIG. 1 includes one or a plurality of chambers 7 that perform various processes such as resist coating, exposure, and etching, a transfer chamber 16 that connects the chambers 7, and a transfer chamber 16. A vacuum robot 31 for transporting the disk-shaped object, a sensor 9 as detection means, a load lock chamber 8 for delivering the disk-shaped object transported by the scalar-type transport robot 4 of the transport device 2, and the chamber 7 It comprises a transfer device 2 and a common control unit 11 for controlling the operation of the vacuum robot 31, the sensor 9, and a door described later of the load lock chamber 8.
The load lock chamber 8 is provided with a pocket (not shown) for placing a plurality of disk-shaped objects on the shelf. In addition, a load lock door 32 is disposed at the loading / unloading port in order to make the load lock chamber 8 in a vacuum state.

[Reference position teaching method (1)]
Before teaching at each port such as each cassette, each load lock chamber, each processing chamber, etc., first, the origin coordinates indicating the positional relationship between the holding portion and the disk-like object are taught.
In order to automatically transfer the wafer 13 in the semiconductor manufacturing facility 1 of FIG. 2, a reference including at least one position of the transfer robot 4 and the vacuum robot 31 in advance in the control unit 11 of the transfer apparatus 2 and the processing apparatus 3. After teaching the reference position as the origin coordinate on the coordinate system, it is necessary to teach the transport path. Since the position before teaching is usually designed with a margin, details need to be adjusted on site. An embodiment of the reference position teaching method of the present invention is shown in the flowchart of FIG. 13 in the case where one load lock chamber 8 is used.

First, in step S11, the temporary position information (initial value) of the first load lock chamber 8 in the reference coordinate system in the design before teaching is input to the control unit 11. Next, in step S12, the holding unit 14 of the transfer robot 4 is introduced via the load lock door 32, and the holding unit 14 is manually placed in a predetermined position as a reference position in the first load lock chamber 8. A disk-like object (indicated here by the same reference numeral as the wafer) 13 made of a wafer or another plate having the same diameter is held and carried out.
Next, in step S13, the transport robot 4 transports the held disk-shaped object 13 to a sensor 9 as a detecting means, turns around the body axis of the robot 4, and the disk-shaped object 13 is irradiated with light from the sensor 9. The position of the two points of the intersection of the outer periphery of the disk-like object 13 and the sensor light with respect to the holding unit 14 and the position in the reference coordinate system is detected. In step S14, the center position of the disk-like object 13 at the predetermined location obtained from the position information of the two points on the outer peripheral edge obtained by the above-described calculation formula is used as a reference position. The temporary position information input in step S11 is rewritten, and the origin coordinate teaching operation is terminated.
Incidentally, these steps S11 to S14 are executed by the control unit 11 itself by a program given to the control unit 11 in advance.

  Similarly, each port such as another load lock chamber 8 is taught using the vacuum robot 31. That is, according to the present invention, all teaching can be automatically taught (auto teaching) except that a reference disk such as a wafer is manually placed at a predetermined position as a reference position first for each port. At that time, when the holding unit 14 holds the disc-like object 13, it is not necessary that the holding center of the holding unit 14 and the center of the disc-like object 13 coincide completely as in the conventional teaching method. As long as it does not interfere with the load lock door 32 and other devices, it may be slightly shifted.

[Reference position teaching method (2)]
In another embodiment of the reference position teaching method of the present invention, a conventional guide jig may be used. The holding unit 14 is moved to an appropriate position where a person can easily work, and a guide jig 20 as shown in FIG. 3 is installed on the holding unit 14, and a disk-like object is placed on the holding unit 14 to guide the jig. This is a method in which the center position of the disk-shaped object at that time is pressed against the tool 20 by hand and the reference position is used. The guide jig 20 physically fixes the position of the wafer with a curved surface that matches the wafer and a flat reference surface formed by the holding portion 14. FIG. 14 shows a flowchart of a processing procedure when auto teaching (automatic teaching) is performed in the apparatus of FIG. 3, and in this processing, teaching is performed at each port such as each cassette and each load lock chamber. First, the positional relationship between the holding part and the disk-shaped object is taught as a reference position.

First, in step T <b> 1, the temporary position information (initial value) of the disk-shaped object with respect to the holding unit 14 is input to the control unit 11. Next, in step T2, the guide jig 20 and the disk-like object 13 are manually placed on the holding unit 14, and are manually adjusted so that the center position of the disk-like object is at an appropriate position.
Next, in step T3, the disk-like object 13 is swung at the sensor 9 as the detecting means, and the positions of the two intersections between the outer peripheral edge of the disk-like object 13 and the sensor light with respect to the holding unit 14, and thus the reference coordinates. Detect position in the system. Then, at step T4, the transport of the control unit 11 with the center position of the disk-like object 13 on the holding unit 14 obtained from the obtained position information by the above-described calculation formula as the reference position on the holding unit 14 This is transmitted to the robot operation control program and stored in the control unit 11.
Incidentally, these steps T1 to T4 are executed by the control unit 11 itself by a program given in advance to the control unit 11 except for step T2.

[Other port teaching methods]
The flowchart of FIG. 15 shows the procedure of teaching (including positioning and trajectory correction) when a disc-shaped object is carried out from the cassette by auto teaching based on the reference position determined as described above.

First, in step U1, the transport temporary position information (initial value) and the reference position information are input to the control unit 11. Next, in step U2, the cassette 6 and the disk-like object 13 are manually placed at the designed positions.
Next, at step U3, the transfer robot 4 receives the disc-like object 13 from the delivery location in the cassette 6. In step U4, the transfer robot 4 moves the disk-like object 13 to the sensor 9 and turns it, and detects two points on the outer periphery in the same manner as described above.
Next, in step U5, the information (measured value) obtained in step T4 is transmitted to the deviation amount calculating means. Next, in step T6, the deviation amount is calculated by comparing the measurement value with the reference position. Next, in step U7, when there is a deviation, the deviation amount is transmitted to the transfer robot operation control program of the control unit 11.
Incidentally, these steps U1 to U7 are executed by the control unit 11 itself as a deviation amount calculation means or the like by a program given in advance to the control unit 11 except for step U2.
In step U8, the control unit 11 corrects the trajectory of the transfer robot 4 in consideration of the deviation amount. That is, the initial value that is the transport position on the design drawing is updated. If there is no deviation, the series of teaching ends.

  Similarly, the delivery location with each port such as another cassette 6 and each load lock chamber 8 is also performed according to the procedure from step U1 to step U8 in FIG. With the teaching method according to the present invention, all steps can be automatically performed except for the step of manually placing the disk-like object at the position on the design drawing in step U2.

  Further, when the position of the cassette 6 or the like is moved at the time of maintenance, conventionally, all the steps from the time-consuming steps S1 to S7 of FIG. 26 are manually performed again. However, in the auto teaching according to the present invention, FIG. If only step U2 is performed manually, the process proceeds automatically thereafter. Further, when the holding unit 14 is replaced, the reference position is taught again from step U1, the old and new information are compared, and the deviation amount is reflected in each measurement value. As a result, the transfer position to the load lock chamber 8 is always constant, there is no interference near each processing chamber 7, and dust is reduced.

  FIG. 16 shows a transfer apparatus 2 including a transfer robot 4 and an optical point sensor 9 as a detection means as an embodiment of the disk-shaped object positioning apparatus of the present invention. The drive means for operating the transfer arm 12 of the transfer robot 4 has a preset reference point, and the amount of deviation is calculated by measuring the output signal of the optical sensor 9 and the pulse of the stepping motor of the drive means. Ask. When the transfer arm 12 is started, the control unit 11 confirms that all axes of the transfer robot 4 are at the reference point, and in response to a command from the control unit 11, the axes of the transfer robot 4 are bent and extended and moved up and down. The wafer 13 is rotated at 9 to position the wafer 13.

  FIG. 16 also illustrates an embodiment of the positioning method of the present invention in which the reference position of the wafer 13 is taught in advance. The transfer robot 4 that has carried the wafer 13 out of the cassette 6 onto the holding unit 14 of the transfer arm 12 turns around the rotation axis of the body and rotates the core of the fixed optical sensor 9 as a detection means. The wafer 13 is passed between the letter-shaped frames, and the outer peripheral edge of the wafer 13 is cut into a circular arc with sensor light. As a result, the center position of the wafer 13 is measured and calculated, and the deviation amount and the position coordinates of the outer periphery of the wafer are calculated by the deviation amount calculation means, and the wafer position on the holding portion 14 of the transfer arm 12 is determined.

The calculated deviation amount is sent to the control unit 11 that controls the operation of the conveyance arm 12, and a correction value considering the deviation amount is added to the information on the conveyance position taught in advance to thereby determine the conveyance position. And the transfer trajectory is corrected. Further, the sensor 9 as the detection means in FIG. 16 can detect the disc-like object 13 at a position determined with respect to the transfer robot 4 when the transfer arm 12 holding the wafer 13 rotates. It is installed at a position where it can.
Similarly, the vacuum robot 31 in the processing apparatus 3 on the right side of FIG. 16 also uses a sensor as a detecting means, after receiving the teaching of the reference position in each load lock chamber 8 and each processing chamber 7 and the wafer 13. Positioning for position correction is performed.

[When used in a positioning device (aligner) 1]
FIG. 17 shows an embodiment in which the positioning method of the present invention is used in a positioning device. The positioning apparatus 10 includes a holding table 19 that can vacuum-suck the wafer 13. Below the holding table 19, an X-axis moving unit, a Y-axis moving unit that can move in the direction of one axis or two axes, and an elevating and lowering unit. Means 21 are provided. Here, in a state where the wafer 13 placed by the transfer robot 4 or the like is stationary, the detection arm 24 provided on the stage turns to draw a detection locus 43 and is provided at the tip of the detection arm 24. Two points on the outer peripheral edge of the wafer 13 are detected by the optical sensor 9 as the detecting means. Using these two positions, the calculation method of the present invention described above is applied to calculate the wafer center, the X and Y axis directions are corrected, the wafer held in the normal position is rotated, and another wafer is rotated. The sensor detects the notch at the edge of the wafer 13 and stops rotating.

[When used in a positioning device (aligner) 2]
FIG. 18 shows the positioning device 10 when the detection arm 24 is shorter than the wafer radius, and the operation method and positioning method are the same as those in FIG.

[When used in a positioning device (aligner) 3]
FIG. 19 shows a case where the position detection method of the present invention is carried out with a conventional positioning device. The positioning device 10 includes a holder 19 that can rotate, an X-axis moving unit, a Y-axis moving unit, an elevating unit, and a point sensor 9 as a detecting unit. When the rotating wafer 13 is eccentric, the edge of the wafer is cut by the detection track 43 having the same radius as that of the wafer 13 by rotation, and two points are detected. The subsequent positioning method is the same as that of the apparatus of FIG.

Conventionally, a disk-shaped object conveyed to a mounting table by a conveying robot or the like can obtain center position information of the disk-shaped object by a detection method shown in JP-A-6-224285 using an optical line sensor. In this method, it is necessary to detect the position information of the edge part for one rotation by rotating the mounting part. As shown in FIG. 20, when the part of the edge part is outside the detection range of the line sensor. The positioning operation is performed on the premise that the disc-shaped object is moved so as to be within the detection range by driving the moving means of the X axis and the Y axis. Therefore, when the positioning method of the present invention is used, even if a part of the edge is out of the detection range, the other part always enters the sensor due to the rotation of the wafer. If determined, the center position information of the disk-like object is calculated by the center position calculation method of the present invention as in FIG. In other words, the center of the wafer can be calculated without having to change the wafer at all.
If the center position of the wafer is known, the X and Y driving units of the positioning device are not necessary, and the holding unit 14 is set to the normal position before placement by operating the transfer robot 4 as shown in FIG. The disk-shaped object 13 can be positioned by moving it.

[Sensor in the holding part]
As shown in FIG. 22, the sensor 9 is provided at the tip or side of the holding portion 14 of the transfer robot 4, and two points on the outer peripheral edge of the disk-shaped object 13 placed by the turning or bending operation of the transfer robot 4. And the center position of the disk-like object 13 can be calculated. When it is determined whether or not a notch or the like overlaps on the detection trajectory, two detection means are arranged on the holding portion 14 by the method shown in FIGS. 10 and 11, or one detection means. The disk 13 can be scanned twice.

[Sensor on port door]
FIG. 23 shows two sensors 9 attached to the cassette door of the transfer apparatus 2 (only one of them is shown in the figure), the transfer arm 12 of the transfer robot 4 is driven and moved linearly, and the center of the wafer 13 is taken out. Is calculated and positioned, and corrected to the correct trajectory to other ports to be transported. The calculation method is as shown in FIGS.

[Linear motion]
FIG. 24 shows an embodiment of the positioning device according to the ninth aspect of the present invention. A detection means 9 consisting of a single sensor is attached to the transfer robot 4, and the transfer arm 12 of the transfer robot 4 is driven to move the wafer 13 in a straight line to detect two points on the outer peripheral edge of the wafer 13. With these, the center is calculated and positioned, and corrected to the correct trajectory to other ports to be transported. The calculation method is as shown in (Expression 12) to (Expression 15).
The position calculation for carrying out the teaching method, the positioning method, and the conveying method of the present invention is performed by the control unit 11 of the conveying device 2 in the above embodiment. However, the present invention is not limited to this, and the control unit 11 may be performed by a separate computer connected to the computer 11.
In addition, the input of the initial value in step S11 of FIG. 13, step T1 of FIG. 14, and step U1 of FIG. 15 is automatically performed by executing the program in the above embodiment, but it is performed by a keyboard operation or the like. It may be done manually.

  As described above, according to the disc-like reference position teaching method and positioning method of the present invention, a positioning dedicated machine is not particularly required, so that space can be saved and the apparatus cost can be reduced. In addition, one or two inexpensive point sensors are sufficient as the detection means, which can contribute to cost reduction.

  Furthermore, with the automatic teaching based on the present invention, in the case of the semiconductor manufacturing facility of FIG. 1, the number of work steps can be greatly reduced, and the work time can be shortened to about 1 to 2 hours, which is about 1/10 of the conventional one. did it. Furthermore, since there is no human error such as visual confirmation of the transport position, it is possible to easily recover the state before work even if maintenance is performed. In addition, since the amount of deviation can be calculated during the conveyance of the disk-like object, the round-trip time for conveyance to the positioning device is saved, and the productivity is improved. If the detection means is operated at all times and the detection means 9 is passed as required, misregistration detection is performed. Therefore, it is possible to manage whether the conveyance is normally performed and to always operate normally.

  In addition, since the radius of an unknown disk-shaped object can be measured and discriminated, if the radius is confirmed with the apparatus of the present invention for each wafer, wafers of different sizes are simultaneously supplied to the semiconductor processing apparatus for processing. It is possible to improve the line operation rate and productivity.

It is a partially cutaway perspective view showing an embodiment of a semiconductor manufacturing facility for carrying out the present invention. It is a top view which shows the semiconductor manufacturing equipment of the said Example. It is a partially cutaway perspective view which shows the conveyance robot in the semiconductor manufacturing equipment of the said Example. It is a top view which shows the principle of the method of this invention. It is another top view which shows the principle of the method of this invention. It is a top view which shows the notch part detection principle by the two detection means of the method of this invention. It is another top view which shows the notch part detection principle by the two detection means of the method of this invention. It is a top view which shows the notch part detection principle by one detection means of the method of this invention. It is another top view which shows the notch part detection principle by one detection means of the method of this invention. It is a top view which shows the principle of a notch detection and positioning by two detection means of the method of this invention. It is another top view which shows the principle of a notch detection and positioning by two detection means of the method of this invention. It is a top view which shows the calculation principle of the disk radius based on the method of this invention. It is a flowchart which shows the teaching procedure to the conveying apparatus using one Example of the teaching method of this invention. It is a flowchart which shows the teaching procedure to the conveying apparatus using one Example of the teaching method of this invention. It is a flowchart which shows the teaching procedure of the other port to the conveying apparatus using one Example of the positioning method of this invention. It is a partially cutaway perspective view showing an embodiment of a transport device for carrying out the present invention. It is a partially cutaway perspective view showing an embodiment of a positioning device for carrying out the present invention. It is a partially cutaway perspective view showing another embodiment of a positioning device for carrying out the present invention. It is a partially cutaway perspective view showing another embodiment of a positioning device for carrying out the present invention. It is a partially cutaway perspective view showing another embodiment of a positioning device for carrying out the present invention. It is a partially cutaway perspective view showing another embodiment of a positioning device for carrying out the present invention. FIG. 4 is a partially cutaway perspective view showing an embodiment of notch detection and positioning by one detection means of the present invention. It is a partially cutaway perspective view showing an embodiment of notch detection and positioning by two detection means of the present invention. It is a partially cutaway perspective view showing an embodiment of a transport device for carrying out the present invention. It is a partially notched perspective view which shows the conventional conveying apparatus. It is a flowchart which shows the teaching procedure in the conventional conveying apparatus. It is a perspective view which shows the example of the conventional positioning device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor manufacturing equipment 2 Conveyance apparatus 3 Processing apparatus 4 Conveyance robot 5 Load port 6 Cassette 7 Processing chamber 8 Load lock room 9 Detection means (sensor)
DESCRIPTION OF SYMBOLS 10 Positioning device 11 Control part 12 Transfer arm 13 Disk-shaped object (wafer)
DESCRIPTION OF SYMBOLS 14 Holding part 15 Cassette mounting table 16 Transfer chamber 17 Linear moving means 18 Screw shaft 19 Holding stand 20 Guide jig 21 Lifting means 22 Screw shaft 23 Motor 24 Detection arm 25 Pulley 26 Timing belt 27 Wafer mounting table 31 Vacuum robot 32 Load Lock door 40 Turning base line 41 Straight line from the turning center to the center of the reference disk-like object 42 Straight line from the turning center to the center of the disk-like object 43 Detection orbit 44 Different detection orbits from 43 47 A disk-like object to be measured 48 A perpendicular bisector when a recess is detected 49 A virtual disk-like object 50 A disk-like object on a different turning radius from 47 47 A notch

Claims (6)

In a method for positioning a disk-like object having an unknown radius having one notch at a part of the periphery in a reference coordinate system including the position of a disk-like handling device,
Obtaining a center position of the disk-shaped object having the notch in the reference coordinate system;
Calculating a shift amount from a previously taught center position to the determined center position in the reference coordinate system;
Including
The step of determining the center position of the disk-shaped object having the notch,
A pair of three trajectories spaced apart from each other by a distance that does not engage the notch is crossed with respect to the periphery of the disk-shaped object by moving the detecting means relative to the disk-shaped object. Obtaining the positions of three sets of intersections of two points in the reference coordinate system;
Selecting a common vertical bisector among three vertical bisectors for each of the three sets of intersections;
Calculating a radius and a center position of the disk-like object from a specific point on the common vertical bisector and two sets of intersection points of the common vertical bisector; and
A method for positioning a disk-shaped object, comprising: 2. The disk-shaped object positioning method according to claim 1, wherein the locus of the detecting means is an arc. In an apparatus for positioning a disk-like object of unknown radius having one notch at a part of the periphery in a reference coordinate system including the position of a disk-like handling apparatus,
Means for obtaining a center position of the disk-shaped object having the notch in the reference coordinate system;
Means for calculating a shift amount from a previously taught center position to the determined center position in the reference coordinate system;
With
Means for determining the center position of the disk-shaped object having the notch,
A pair of three trajectories spaced apart from each other by a distance that does not engage the notch is crossed with respect to the periphery of the disk-shaped object by moving the detecting means relative to the disk-shaped object. Means for obtaining positions of three sets of intersections of two points in the reference coordinate system;
Means for selecting a common vertical bisector among three vertical bisectors for each of the three sets of intersections;
Means for calculating a radius and a center position of the disk-like object from a specific point on the common vertical bisector and two sets of intersection points of the common vertical bisector;
A disk-shaped object positioning device characterized by comprising: 4. The disk-shaped object positioning device according to claim 3, wherein the locus of the detecting means is an arc. In a disk-shaped object conveying device having an unknown radius having one notch at a part of the periphery,
The positioning device for the disk-shaped object according to claim 3 or 4,
Correction means for correcting the pre-taught transport trajectory of the holding unit of the transport device based on the deviation amount calculated by the positioning device;
Means for controlling the operation of the holding unit of the transfer device to transfer the disk-like object to a predetermined transfer position by the holding unit along the corrected transfer path;
A disk-shaped object conveying device characterized by comprising: The disk-shaped object positioning device according to claim 3 or 5,
The disk-shaped material conveying apparatus according to claim 5;
A semiconductor manufacturing facility comprising any one of the above.

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