CN113871330A - Material scheduling method and semiconductor process equipment - Google Patents

Material scheduling method and semiconductor process equipment Download PDF

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Publication number
CN113871330A
CN113871330A CN202111002708.7A CN202111002708A CN113871330A CN 113871330 A CN113871330 A CN 113871330A CN 202111002708 A CN202111002708 A CN 202111002708A CN 113871330 A CN113871330 A CN 113871330A
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materials
determining
calibration module
judging whether
process chamber
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吴洁
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Beijing Naura Microelectronics Equipment Co Ltd
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Beijing Naura Microelectronics Equipment Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The embodiment of the invention provides a material scheduling method and semiconductor process equipment, wherein the method comprises the following steps: determining material transmission path information of a current operation task; the material conveying path information is used for defining equipment structures required to be passed by the materials and the sequence of the materials passing through the equipment structures; respectively determining the storage space characteristic information and the material storage state information of each equipment structure; generating a material scheduling global action sequence of the current operation task according to the material transmission path information, the storage space characteristic information and the material storage state information; the material scheduling global action sequence comprises material scheduling actions required to be executed by each equipment structure; and controlling each equipment structure to carry out material scheduling according to the material scheduling global action sequence. By adopting the method, the global optimal scheduling action sequence of one-time output material scheduling can be realized according to the structural characteristics of the equipment hardware, and the capacity of processing the materials by the machine can be greatly improved.

Description

Material scheduling method and semiconductor process equipment
Technical Field
The invention relates to the technical field of semiconductors, in particular to a material scheduling method and semiconductor process equipment.
Background
At present, a scheduling action sequence is output in a material path-based search tree mode in plasma photoresist removing equipment. Firstly, the position of a material is recorded by an algorithm to be used as a root node of a search tree, then, the search tree generates new leaf nodes every time the material moves, simultaneously, the state of equipment is synchronously updated, and finally, the search tree does not generate new nodes when the search step required by a task is achieved. At this time, the algorithm traverses all paths from the root node to the leaf nodes of the search tree, and selects the shortest path as a selection result, which is shown in fig. 1 and is a schematic diagram of a generation mode of the search tree. The generation of a partial search tree is shown. In general, the algorithm simulates four steps of material movement each time, that is, the algorithm can only ensure that the output action sequence is locally optimal within the four steps, but cannot ensure that the output sequence is a globally optimal sequence for the equipment material to be transmitted from a source end to a destination.
The action sequence output by the existing material scheduling algorithm is not a global optimal sequence, and the condition of wasting capacity can occur when equipment runs according to the action sequence to execute material scheduling.
Disclosure of Invention
In view of the above, embodiments of the present invention are proposed to provide a material scheduling method and a corresponding semiconductor processing apparatus that overcome or at least partially solve the above problems.
In order to solve the above problem, an embodiment of the present invention discloses a material scheduling method, which is applied to semiconductor process equipment, where the semiconductor process equipment includes multiple equipment structures for performing material operations respectively, and the method includes:
determining material transmission path information of a current operation task; the material conveying path information is used for defining equipment structures required to be passed by the materials and the sequence of the materials passing through the equipment structures;
respectively determining the storage space characteristic information and the material storage state information of each equipment structure;
generating a material scheduling global action sequence of the current operation task according to the material transmission path information, the storage space characteristic information and the material storage state information; the material scheduling global action sequence comprises material scheduling actions required to be executed by each equipment structure;
and controlling each equipment structure to carry out material scheduling according to the material scheduling global action sequence.
Optionally, the apparatus structure includes a process chamber, and the generating a material scheduling global action sequence of the current job task according to the material transmission path information, the storage space characteristic information, and the material storage state information includes:
determining the next scheduled material based on a preset material selection rule according to the storage space characteristic information and the material storage state information; wherein the preset material selection rule is used for determining a next scheduled target material based on a capacity maximization principle of the semiconductor process equipment and/or a utilization maximization principle of the process chamber;
determining a scheduling action of the next scheduled material according to the material transmission path information;
and generating the material scheduling global action sequence by adopting all the scheduling actions.
Optionally, the generating the material scheduling global action sequence by using all the scheduling actions includes:
establishing a root node of a search tree; the root node is used for recording initial material storage state information;
determining a new child node generated by the search tree according to the scheduling action of the next scheduled material output each time; the child nodes are used for recording the updated material storage state information after each time of simulating and executing the scheduling action;
after the scheduling actions of all the materials are calculated, determining the last child node generated by the search tree;
traversing all paths of the search tree from the root node to the last child node, and determining an action sequence corresponding to the shortest path in all the paths as the material scheduling global action sequence.
Optionally, before determining a new child node generated by the search tree, the method further includes:
judging whether a path from the root node to the child node is a path or not;
if yes, generating the child node;
if not, regenerating a child node, and returning to the step of judging whether the path from the root node to the child node is a path or not.
Optionally, the apparatus structure further includes a wafer cassette, a calibration module, and a wafer transfer robot, and the preset material selection rule includes a material selection rule set based on an available state of both arms of the wafer transfer robot, and includes:
and determining the next scheduled target material according to the material storage states of the wafer box, the calibration module, the wafer transfer mechanical arm and the process chamber.
Optionally, the determining a next scheduled target material according to the material storage states of the wafer cassette, the calibration module, the wafer transfer robot, and the process chamber includes:
judging whether the mechanical arm has materials or not;
if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the current operation task is a multi-operation task or not, and judging whether the process chamber has the last material or not;
if the current operation task is a multi-operation task and the process chamber has the last material, determining the material of the process chamber as the next scheduled target material; otherwise, judging whether the mechanical arm has materials or not, and judging whether the wafer box has materials or not;
if the mechanical arm does not have materials and the wafer box has materials, determining one material of the wafer box as the target material of the next scheduling; otherwise, judging whether the calibration module has the last material;
if the calibration module has the last material, determining the material of the calibration module as the next scheduled target material; otherwise, judging whether the mechanical arm has materials, judging whether the wafer box has materials, and judging whether the process chamber has materials;
if the robot arm does not have material, the wafer cassette does not have material, and the process chamber has material, determining the material of the process chamber as the target material for the next dispatch.
Optionally, the apparatus structure further includes a wafer cassette, a calibration module, and a wafer transfer robot, where the preset material selection rule includes a material selection rule set based on a single-arm available state of the wafer transfer robot, and the material selection rule includes:
determining a number of available slots of the process chamber;
determining an available chamber number for the process chamber;
determining the task type of the current job task;
and determining the next scheduled target material according to the number of the available slots, the number of the available chambers and the task type.
Optionally, the determining the next scheduled target material according to the number of available slots, the number of available chambers, and the task type includes:
under the condition that the number of the available slot positions is not equal to the number of all slot positions, if the task type is a multi-job task or the number of the available chambers is multiple and each available chamber only has one slot position available, judging whether the mechanical arm has materials or not;
if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has a plurality of materials, judging whether the calibration module has the materials, or judging whether the calibration module has the materials to be transmitted to the process chamber during multi-operation tasks;
determining the material of the process chamber as the target material to be scheduled next if the process chamber has a plurality of materials and the calibration module has a material, or if the calibration module has a material to be transferred to the process chamber during a multi-job task; otherwise, judging whether the calibration module has materials;
if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not;
and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
Optionally, the determining the next scheduled target material according to the number of available slots, the number of available chambers, and the task type includes:
under the condition that the number of the available slot positions is not equal to the number of all slot positions, if the task type is a multi-job task or the number of the available chambers is multiple and only one slot position of one available chamber in the multiple available chambers is forbidden, judging whether the mechanical arm has materials or not;
if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has materials or not, judging whether the calibration module has materials or not, or judging whether the materials in the process chamber to which the materials of the calibration module need to be transmitted are full or not during multi-operation tasks;
if the process chamber has materials and the calibration module has materials, or the process chamber to which the materials of the calibration module need to be transferred is full of materials in the multi-job task, determining the materials of the process chamber as the target materials to be scheduled next; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has materials or not;
determining the material of the calibration module as the target material of the next schedule if the process chamber has material and the calibration module has material; otherwise, judging whether the calibration module has materials;
if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not;
and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
Optionally, the determining the next scheduled target material according to the number of available slots, the number of available chambers, and the task type includes:
under the condition that the number of the available slot positions is not equal to that of all the slot positions, if the task type is a single operation task or the number of the available cavities is one, whether the mechanical arm has materials or not is judged;
if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has materials or not;
determining the material of the process chamber as the target material for the next dispatch if the process chamber has material and the calibration module has material; otherwise, judging whether the calibration module has materials;
if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not;
and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
Optionally, the determining the next scheduled target material according to the number of available slots, the number of available chambers, and the task type includes:
under the condition that the number of the available slot positions is equal to that of all the slot positions, if the number of the available cavities is multiple, whether the mechanical arm has materials or not is judged;
if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chambers all have materials, and judging whether the calibration module has materials;
if the process chamber has material and the calibration module has material, determining the material of the process chamber as the target material for the next dispatch; otherwise, judging whether the calibration module has materials;
if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not;
and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
Optionally, the determining the next scheduled target material according to the number of available slots, the number of available chambers, and the task type includes:
under the condition that the number of the available slot positions is equal to that of all the slot positions, if the number of the available cavities is one or the task type is a multi-job task, judging whether the mechanical arm has materials or not;
if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has odd-numbered materials or not, or judging whether the process chamber has a plurality of materials or not and judging whether the calibration module has materials or not in the case of a single operation task;
if the process chamber has a material and the calibration module has an odd number of materials, or if the process chamber has a plurality of materials and the calibration module has a material in a single job task, determining the material of the process chamber as the target material to be scheduled next; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has even-numbered materials or not;
if the process chamber has material and the calibration module has even-numbered material, or the process chamber does not have material and the calibration module has even-numbered material, determining the material of the calibration module as the target material to be scheduled next.
Optionally, the determining the material conveying path information of the current job task includes:
acquiring material path editing information input by a user;
and generating the material transmission path information by adopting the material path editing information.
Optionally, the determining a scheduling action of the next scheduled material according to the material transmission path information includes:
if the material transmission path information is that the processed material does not pass through the calibration module in the process of being conveyed back to the wafer box from the process chamber, judging whether a preset temporary storage triggering condition is met;
and if so, placing the processed material in the calibration module, and controlling the calibration module not to calibrate the placed material.
Optionally, the temporary storage triggering condition includes:
not all available slot positions of the plurality of available slot positions of the process chamber are provided with materials to be processed; the process chamber is used to perform a machining process with all available slots having material to be machined.
The embodiment of the invention also discloses semiconductor process equipment, which comprises a plurality of equipment structures used for respectively carrying out material operation, and the semiconductor process equipment also comprises:
the controller is used for determining the material transmission path information of the current operation task; the material conveying path information is used for defining equipment structures required to be passed by the materials and the sequence of the materials passing through the equipment structures; respectively determining the storage space characteristic information and the material storage state information of each equipment structure; generating a material scheduling global action sequence of the current operation task according to the material transmission path information, the storage space characteristic information and the material storage state information; the material scheduling global action sequence comprises material scheduling actions required to be executed by each equipment structure; and controlling each equipment structure to carry out material scheduling according to the material scheduling global action sequence.
Optionally, the apparatus structure includes a process chamber, and the controller is configured to determine a next scheduled material based on a preset material selection rule according to the storage space characteristic information and the material storage state information; wherein the preset material selection rule is used for determining a next scheduled target material based on a capacity maximization principle of the semiconductor process equipment and/or a utilization maximization principle of the process chamber; determining a scheduling action of the next scheduled material according to the material transmission path information; and generating the material scheduling global action sequence by adopting all the scheduling actions.
Optionally, the controller is configured to establish a root node of a search tree; the root node is used for recording initial material storage state information; determining a new child node generated by the search tree according to the scheduling action of the next scheduled material output each time; the child nodes are used for recording the updated material storage state information after each time of simulating and executing the scheduling action; after the scheduling actions of all the materials are calculated, determining the last child node generated by the search tree; traversing all paths of the search tree from the root node to the last child node, and determining an action sequence corresponding to the shortest path in all the paths as the material scheduling global action sequence.
Optionally, the controller is configured to determine whether a path from the root node to the child node is a path; if yes, generating the child node; if not, regenerating a child node, and returning to the step of judging whether the path from the root node to the child node is a path or not.
Optionally, the apparatus structure further includes a wafer cassette, a calibration module, and a wafer transfer robot, the preset material selection rule includes a material selection rule set based on a dual-arm available state of the wafer transfer robot, and the controller is configured to determine a next scheduled target material according to material storage states of the wafer cassette, the calibration module, the wafer transfer robot, and the process chamber.
Optionally, the controller is configured to determine whether the robot arm has a material; if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the current operation task is a multi-operation task or not, and judging whether the process chamber has the last material or not; if the current operation task is a multi-operation task and the process chamber has the last material, determining the material of the process chamber as the next scheduled target material; otherwise, judging whether the mechanical arm has materials or not, and judging whether the wafer box has materials or not; if the mechanical arm does not have materials and the wafer box has materials, determining one material of the wafer box as the target material of the next scheduling; otherwise, judging whether the calibration module has the last material; if the calibration module has the last material, determining the material of the calibration module as the next scheduled target material; otherwise, judging whether the mechanical arm has materials, judging whether the wafer box has materials, and judging whether the process chamber has materials; if the robot arm does not have material, the wafer cassette does not have material, and the process chamber has material, determining the material of the process chamber as the target material for the next dispatch.
Optionally, the apparatus structure further includes a wafer cassette, a calibration module, and a wafer transfer robot, the preset material selection rule includes a material selection rule set based on a single-arm available state of the wafer transfer robot, and the controller is configured to determine the number of available slots of the process chamber; determining an available chamber number for the process chamber; determining the task type of the current job task; and determining the next scheduled target material according to the number of the available slots, the number of the available chambers and the task type.
Optionally, the controller is configured to, when the number of available slots is not equal to the number of all slots, determine whether the robot arm has a material first if the task type is a multi-job task or the number of available chambers is multiple and each available chamber has only one slot; if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has a plurality of materials, judging whether the calibration module has the materials, or judging whether the calibration module has the materials to be transmitted to the process chamber during multi-operation tasks; determining the material of the process chamber as the target material to be scheduled next if the process chamber has a plurality of materials and the calibration module has a material, or if the calibration module has a material to be transferred to the process chamber during a multi-job task; otherwise, judging whether the calibration module has materials; if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not; and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
Optionally, the controller is configured to, when the number of available slots is not equal to the number of all slots, determine whether the robot arm has the material first if the task type is a multi-job task or the number of available chambers is multiple and only one slot of one available chamber of the multiple available chambers is disabled; if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has materials or not, judging whether the calibration module has materials or not, or judging whether the materials in the process chamber to which the materials of the calibration module need to be transmitted are full or not during multi-operation tasks; if the process chamber has materials and the calibration module has materials, or the process chamber to which the materials of the calibration module need to be transferred is full of materials in the multi-job task, determining the materials of the process chamber as the target materials to be scheduled next; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has materials or not; determining the material of the calibration module as the target material of the next schedule if the process chamber has material and the calibration module has material; otherwise, judging whether the calibration module has materials; if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not; and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
Optionally, the controller is configured to, when the number of available slots is not equal to the number of all slots, determine whether the robot arm has a material first if the task type is a single job task or the number of available cavities is one; if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has materials or not; determining the material of the process chamber as the target material for the next dispatch if the process chamber has material and the calibration module has material; otherwise, judging whether the calibration module has materials; if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not; and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
Optionally, the controller is configured to, when the number of the available slots is equal to the number of all slots, determine whether the robot arm has a material first if the number of the available cavities is multiple; if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chambers all have materials, and judging whether the calibration module has materials; if the process chamber has material and the calibration module has material, determining the material of the process chamber as the target material for the next dispatch; otherwise, judging whether the calibration module has materials; if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not; and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
Optionally, the controller is configured to, when the number of available slots is equal to the number of all slots, determine whether the robot arm has a material first if the number of available cavities is one or the task type is a multi-job task; if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has odd-numbered materials or not, or judging whether the process chamber has a plurality of materials or not and judging whether the calibration module has materials or not in the case of a single operation task; if the process chamber has a material and the calibration module has an odd number of materials, or if the process chamber has a plurality of materials and the calibration module has a material in a single job task, determining the material of the process chamber as the target material to be scheduled next; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has even-numbered materials or not; if the process chamber has material and the calibration module has even-numbered material, or the process chamber does not have material and the calibration module has even-numbered material, determining the material of the calibration module as the target material to be scheduled next.
Optionally, the controller is configured to obtain material path editing information input by a user; and generating the material transmission path information by adopting the material path editing information.
Optionally, the controller is configured to determine whether a preset temporary storage triggering condition is met if the material transmission path information indicates that the processed material does not pass through the calibration module in the process of being transferred from the process chamber to the wafer cassette; and if so, placing the processed material in the calibration module, and controlling the calibration module not to calibrate the placed material.
Optionally, the temporary storage triggering condition includes:
not all available slot positions of the plurality of available slot positions of the process chamber are provided with materials to be processed; the process chamber is used to perform a machining process with all available slots having material to be machined.
The embodiment of the invention has the following advantages:
in the embodiment of the invention, the global action sequence of material scheduling aiming at the current operation task can be output according to the storage space characteristic information of each equipment structure of the semiconductor process equipment. By adopting the method, the global optimal scheduling action sequence of one-time output material scheduling can be realized according to the equipment hardware structure characteristics of the semiconductor process equipment, and the capacity of processing materials by a machine can be greatly improved.
Drawings
FIG. 1 is a schematic diagram of a search tree generation;
FIG. 2 is a schematic diagram of a hardware structure of a plasma resist remover;
FIG. 3 is a schematic view of a material transport path;
FIG. 4 is a flowchart illustrating the steps of a method for scheduling materials according to an embodiment of the present invention;
FIG. 5 is a flow chart of steps in another method of material scheduling in accordance with an embodiment of the present invention;
FIG. 6 is a schematic illustration of a material path editing interface in accordance with an embodiment of the present invention;
FIG. 7 is a flow diagram of a material selection rule according to an embodiment of the present invention;
FIG. 8 is a logic diagram of another material selection rule in accordance with an embodiment of the present invention;
FIG. 9 is a schematic illustration of a material scheduling process according to an embodiment of the present invention;
FIG. 10 is a flowchart of a method for creating a material scheduling global action sequence according to an embodiment of the present invention;
fig. 11 is a block diagram of a semiconductor processing apparatus according to an embodiment of the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of them. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.
Referring to fig. 2, a schematic diagram of a hardware structure of a plasma photoresist remover is shown. The plasma stripper may carry 3 wafer cassettes (Foup) having 1 wafer transfer Robot (TM Robot), 1 Aligner (Aligner), and 2 process chambers (PM). 25 pieces of materials can be placed in each wafer box, and the two sizes of 8 inches and 12 inches are compatible; the mechanical arm is used for conveying materials and is divided into an A/B finger and each finger can bear one piece of material; the material needs to be calibrated in a calibrator before being transferred into the process chamber, and the calibrator can bear one piece of material at most at a time; each process chamber is provided with two Slot positions for placing two pieces of materials to execute the process. Referring to fig. 3, a material conveying path is schematically illustrated. The material can be transmitted from the wafer box to the calibrator through the mechanical arm for calibration, then transmitted from the calibrator through the mechanical arm to the process chamber for processing, and after the process is completed, the material is transmitted back to the wafer box through the mechanical arm, so that all scheduling actions of the material are completed.
At present, a material scheduling action sequence is output in a search tree mode based on a material path. Firstly, the position of a material is recorded by an algorithm to be used as a root node of a search tree, then, the search tree generates new leaf nodes every time the material moves, simultaneously, the state of equipment is synchronously updated, and finally, the search tree does not generate new nodes when the search step required by a task is achieved. At the moment, the algorithm traverses all paths from the root node to the leaf nodes of the search tree, and selects the shortest path as a selection result. In general, the algorithm simulates four steps of material movement each time, that is, the algorithm can only ensure that the output action sequence is a local optimal solution within the four steps, but cannot ensure that the output sequence is a global optimal sequence of the equipment material from the source end to the destination.
The action sequence output by the existing material scheduling algorithm is not a global optimal sequence, and the condition of wasting capacity can occur when equipment runs according to the action sequence to execute material scheduling.
In addition, the existing material scheduling algorithm sets each material scanned by the equipment as a monitoring object, and the scheduling algorithm is synchronously updated once the material position changes. The existing algorithm can generally judge the time for processing the next material according to the previous material position, when a chamber of a machine table has a storage position, a manipulator takes out the material from a source end and puts the material into the chamber, the process is started after the material enters the chamber, after the process is finished, the material is taken out from the chamber by the manipulator and put back to the FOUP, and the algorithm stops calculating until all the materials are processed and return to the FOUP. The execution sequence of the transfer actions of the two materials A and B is shown as follows:
(1) material a is taken out from FOUP "→ PM1(Slot1) - - →;
(2) material B is taken out from FOUP "→ PM1(Slot2) - - →;
(3) material A- - → Robot- - - - → FOUP;
(4) material B- → Robot- → FOUP.
From the execution sequence, material a is removed from a FOUP and placed in a slot in PM1 for execution, after which material a is removed from the chamber to the robot. Material B is then removed from the FOUP and placed into another slot in PM1 for processing, and removed to the robot after completion. And finally, respectively placing the material A and the material B back to the FOUP by the mechanical arm. Therefore, although the hardware structure of the machine chamber is that one PM has two slots, and two pieces of materials can be processed simultaneously, in the prior art, only one Slot in the chamber is used for processing the materials at each time.
The existing manipulator can simultaneously bear two pieces of materials, and the existing material scheduling algorithm only takes one piece of material each time, so that only one Slot of PM executes process operation each time, thereby greatly reducing the capacity of a machine.
In view of the above, the present invention is intended to provide a material scheduling method and a corresponding semiconductor processing apparatus that overcome or at least partially solve the above-mentioned problems.
One of the core concepts of the embodiment of the present invention is that a global action sequence for material scheduling of a current job task may be output according to storage space characteristic information of each device structure of semiconductor process equipment. By adopting the method, the global optimal scheduling action sequence of one-time output material scheduling can be realized according to the equipment hardware structure characteristics of the semiconductor process equipment, and the capacity of processing materials by a machine can be greatly improved.
Referring to fig. 4, a flowchart illustrating steps of a material scheduling method according to an embodiment of the present invention is shown, and is applied to a semiconductor process device, where the semiconductor process device includes a plurality of device structures for performing material operations respectively, and specifically includes the following steps:
step 401, determining material transmission path information of the current job task.
Wherein the material transport path information is used to define the equipment configuration through which the material is required to pass and the order in which the material is passed through the equipment configuration.
In the embodiment of the invention, the material transmission path information of the current operation task can be determined.
Step 402, respectively determining the storage space characteristic information and the material storage state information of each equipment structure.
In the embodiment of the invention, the semiconductor process equipment comprises a plurality of equipment structures, and the characteristic information of the storage space for storing the material of each equipment structure and the material storage state information of each equipment structure can be obtained.
And 403, generating a material scheduling global action sequence of the current operation task according to the material transmission path information, the storage space characteristic information and the material storage state information.
And the material scheduling global action sequence comprises the material scheduling actions required to be executed by each equipment structure.
In the embodiment of the invention, after the material transmission path information, the storage space characteristic information of each equipment structure and the material storage state information are determined, the material scheduling global action sequence aiming at the current operation task can be determined by adopting the information.
And step 404, controlling each equipment structure to perform material scheduling according to the material scheduling global action sequence.
In the embodiment of the invention, each equipment structure in the semiconductor process equipment can be controlled to sequentially carry out material scheduling according to the material scheduling global action sequence.
In summary, in the embodiment of the present invention, the global action sequence of the material scheduling for the current job task may be output according to the storage space feature information of each equipment structure of the semiconductor process equipment. By adopting the method, the global optimal scheduling action sequence of one-time output material scheduling can be realized according to the equipment hardware structure characteristics of the semiconductor process equipment, and the capacity of processing materials by a machine can be greatly improved.
Referring to fig. 5, a flowchart illustrating steps of another material scheduling method according to an embodiment of the present invention is shown, and is applied to a semiconductor process device, where the semiconductor process device includes a plurality of device structures for performing material operations respectively, and specifically includes the following steps:
step 501, determining material transmission path information of a current operation task.
Wherein the material transport path information is used to define the equipment configuration through which the material is required to pass and the order in which the material is passed through the equipment configuration.
In an alternative embodiment, the semiconductor processing equipment has a material path editing module, and for step 501, the following sub-steps may be performed:
and a substep S11 of obtaining the editing information of the material path input by the user.
And a substep S12 of generating the material transfer path information using the material path editing information.
In the embodiment of the invention, in order to meet various requirements of a user for using the semiconductor equipment, the user is supported to customize a transmission path of materials in the equipment. A user may input material path editing information in a material path editing module of a semiconductor device to generate corresponding material transfer path information using the material path editing information. Fig. 6 is a schematic diagram of a material path editing interface according to an embodiment of the present invention. The user has different operation requirements on the material transmission path of the equipment at different periods, and the user can edit the required material path on the editing interface according to the equipment state.
Step 502, respectively determining the storage space characteristic information and the material storage state information of each equipment structure.
In the embodiment of the invention, the storage space characteristic information and the material storage state information of each equipment structure in the semiconductor process equipment can be respectively determined. For example, the apparatus structure may include process chambers, the number of process chambers and the number of slots in each process chamber may be determined, and the material storage status in the process chambers may be determined.
Step 503, determining the next scheduled material based on a preset material selection rule according to the storage space characteristic information and the material storage state information.
The preset material selection rule is used for determining the next scheduled target material based on the capacity maximization principle of the semiconductor process equipment and/or the utilization maximization principle of the process chamber.
In the embodiment of the invention, the next material to be scheduled can be determined according to the storage space characteristic information and the material storage state information of each equipment structure and by combining the preset material selection rule.
In order to ensure that the output action sequence is a global optimal solution, a preset material selection rule is introduced, and the rule can help to select the current optimal scheduling material.
In an optional embodiment, taking the plasma resist remover as an example, the apparatus structure includes a process chamber, a wafer cassette, a calibration module, and a wafer transfer robot, and the preset material selection rule includes a material selection rule set based on a dual-arm available state of the wafer transfer robot, and includes:
and determining the next scheduled target material according to the material storage states of the wafer box, the calibration module, the wafer transfer mechanical arm and the process chamber.
In the embodiment of the present invention, taking the plasma photoresist remover shown in fig. 2 as an example, a material selection rule in a corresponding dual-arm available state is set, specifically:
judging whether the mechanical arm has materials or not; if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the current operation task is a multi-operation task or not, and judging whether the process chamber has the last material or not; if the current operation task is a multi-operation task and the process chamber has the last material, determining the material of the process chamber as the next scheduled target material; otherwise, judging whether the mechanical arm has materials or not, and judging whether the wafer box has materials or not; if the mechanical arm does not have materials and the wafer box has materials, determining one material of the wafer box as the target material of the next scheduling; otherwise, judging whether the calibration module has the last material; if the calibration module has the last material, determining the material of the calibration module as the next scheduled target material; otherwise, judging whether the mechanical arm has materials, judging whether the wafer box has materials, and judging whether the process chamber has materials; if the robot arm does not have material, the wafer cassette does not have material, and the process chamber has material, determining the material of the process chamber as the target material for the next dispatch.
Fig. 7 is a flowchart illustrating a material selection rule according to an embodiment of the present invention. If the mechanical arm has the material, determining the material of the mechanical arm as a next scheduled target material; otherwise, executing the next judgment content. If the current operation task is a multi-operation task and the process chamber has the last material, determining the material of the process chamber as the next scheduled target material; otherwise, executing the next judgment content. If the mechanical arm does not have the materials and the wafer box has the materials, determining one material of the wafer box as a target material for next scheduling; otherwise, executing the next judgment content. If the calibration module has the last material, determining the material of the calibration module as the next scheduled target material; otherwise, executing the next judgment content. If the robot arm does not have material, the wafer box does not have material, and the process chamber has material, determining the material of the process chamber as the target material for the next dispatch.
For example, the calculation process of the material selection rule will be described by taking the plasma photoresist remover shown in fig. 2 as an example. Firstly, a user can edit a material transmission path through a material path editing interface: FOUP-Robot-Aligner-Robot-PM-Robot-FOUP, the initial material storage state of the semiconductor process equipment is that all materials are in the FOUP, according to the material selection rule, one material (P1_1) is selected from the FOUP to be used as the initial material for operation to perform action creation, then according to the material transmission path edited by a user, the next moving destination of the material is judged to be the Robot, the material (P1_1) can be taken onto the Robot, and the first scheduling action is completed, namely the material P1_1 is taken onto the Robot. After the action is completed, the current material storage state is that one material (P1_1) is on the Robot, and the rest of the materials are in the FOUP. And then continuing to select the material of the next created action according to the material selection rule, wherein the rule specifies that when the material is on the Robot, the material on the Robot is selected as the best scheduling material, so that the next scheduling action which can be output is used for placing the material (P1_1) on the Robot on the Aligner. After the action is finished, the material storage state of the current equipment is that the material (P1_1) is on the Aligner, and the rest of the materials are in the FOUP. Based on the material storage status of the equipment at this time, the rule selects the next material (P1_2) in the FOUP as the best scheduling material, and the material (P1_2) can be fetched onto the Robot, so that all scheduling actions can be completed based on the best scheduling material selected by the material selection rule.
In another alternative embodiment, the preset material selection rules further include material selection rules set based on a single arm availability status of a wafer transfer robot, which includes:
determining a number of available slots of the process chamber; determining an available chamber number for the process chamber; determining the task type of the current job task; and determining the next scheduled target material according to the number of the available slots, the number of the available chambers and the task type.
In the embodiment of the invention, the wafer transfer mechanical arm in the semiconductor process equipment can be a double-arm, if a single-arm is damaged in the using process of the equipment, a user can choose to disable one arm and use the other arm for material scheduling. Based on the special scene, a set of material selection rules set based on the single-arm available state is set.
In the embodiment of the present invention, taking the plasma resist remover shown in fig. 2 as an example, a material selection rule under a corresponding single-arm available state is set, specifically:
determining the next scheduled target material according to the number of available slots, the number of available chambers and the task type, wherein the determining comprises:
under the condition that the number of the available slot positions is not equal to the number of all slot positions, if the task type is a multi-job task or the number of the available chambers is multiple and each available chamber only has one slot position available, judging whether the mechanical arm has materials or not; if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has a plurality of materials, judging whether the calibration module has the materials, or judging whether the calibration module has the materials to be transmitted to the process chamber during multi-operation tasks; determining the material of the process chamber as the target material to be scheduled next if the process chamber has a plurality of materials and the calibration module has a material, or if the calibration module has a material to be transferred to the process chamber during a multi-job task; otherwise, judging whether the calibration module has materials; if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not; and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
Under the condition that the number of the available slot positions is not equal to the number of all slot positions, if the task type is a multi-job task or the number of the available chambers is multiple and only one slot position of one available chamber in the multiple available chambers is forbidden, judging whether the mechanical arm has materials or not; if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has materials or not, judging whether the calibration module has materials or not, or judging whether the materials in the process chamber to which the materials of the calibration module need to be transmitted are full or not during multi-operation tasks; if the process chamber has materials and the calibration module has materials, or the process chamber to which the materials of the calibration module need to be transferred is full of materials in the multi-job task, determining the materials of the process chamber as the target materials to be scheduled next; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has materials or not; determining the material of the calibration module as the target material of the next schedule if the process chamber has material and the calibration module has material; otherwise, judging whether the calibration module has materials; if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not; and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
Under the condition that the number of the available slot positions is not equal to that of all the slot positions, if the task type is a single operation task or the number of the available cavities is one, whether the mechanical arm has materials or not is judged; if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has materials or not; determining the material of the process chamber as the target material for the next dispatch if the process chamber has material and the calibration module has material; otherwise, judging whether the calibration module has materials; if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not; and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
Under the condition that the number of the available slot positions is equal to that of all the slot positions, if the number of the available cavities is multiple, whether the mechanical arm has materials or not is judged; if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chambers all have materials, and judging whether the calibration module has materials; if the process chamber has material and the calibration module has material, determining the material of the process chamber as the target material for the next dispatch; otherwise, judging whether the calibration module has materials; if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not; and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
Under the condition that the number of the available slot positions is equal to that of all the slot positions, if the number of the available cavities is one or the task type is a multi-job task, judging whether the mechanical arm has materials or not; if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has odd-numbered materials or not, or judging whether the process chamber has a plurality of materials or not and judging whether the calibration module has materials or not in the case of a single operation task; if the process chamber has a material and the calibration module has an odd number of materials, or if the process chamber has a plurality of materials and the calibration module has a material in a single job task, determining the material of the process chamber as the target material to be scheduled next; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has even-numbered materials or not; if the process chamber has material and the calibration module has even-numbered material, or the process chamber does not have material and the calibration module has even-numbered material, determining the material of the calibration module as the target material to be scheduled next.
Fig. 8 is a logic diagram illustrating another material selection rule according to an embodiment of the present invention. This rule applies to semiconductor processing equipment that is in a single arm serviceable state, such as the plasma stripper shown in fig. 2. In general, the next scheduled target material may be determined based on the number of available slots in the process chamber, the number of available chambers, and the type of task. The task types include multi-job tasks and single-job tasks, and specifically refer to the amount of tasks issued by semiconductor process equipment, for example, the tasks issued by LoadPort. The plurality of materials means two or more materials.
Step 504, determining the scheduling action of the next scheduled material according to the material transmission path information.
In the embodiment of the invention, the scheduling action of the next scheduled material can be determined according to the material transmission path information.
With respect to step 504, the following substeps may be performed:
and a substep S21, determining whether a preset temporary storage triggering condition is satisfied if the material transmission path information is that the processed material does not pass through the calibration module in the process of being transferred from the process chamber to the wafer box.
And a substep S22, if yes, placing the processed material in the calibration module, and controlling the calibration module not to calibrate the placed material.
The material conveying path may include the following two (omitting the robot arm conveying part in the middle):
(1)FOUP——Aligner——PM——FOUP；
(2)FOUP——Aligner——PM——Aligner——FOUP。
the two material transport path differences are primarily due to the need for the material to pass through the Aligner before it is returned to the FOUP. If the path taken by the user to deliver the tool item is the first path, based on throughput considerations, it may require that a portion of the item be aligned once again before the finished process is performed on the FOUP from the process chamber, where the alignment acts as a temporary storage area (generally referred to as Buffer area) for the item, and where the alignment is used only as a temporary storage item and no calibration is performed. That is, if the material transmission path information is that the processed material is not passed through the calibration module in the process of being transferred from the process chamber to the wafer box, whether a preset temporary storage triggering condition is met is judged; and if the preset temporary storage triggering condition is met, placing the processed material in the calibration module, and controlling the calibration module not to calibrate the placed material. The temporary storage triggering condition can be set according to the specific condition of equipment operation.
In an alternative embodiment, the temporary storage triggering condition includes:
not all of the plurality of available slots of the process chamber have material to be processed.
Wherein the process chamber is used to perform a machining process with all available slots having material to be machined.
In the embodiment of the invention, the processing technology is started when the materials to be processed are placed in the available slots of the process chamber. In order to improve the capacity to the maximum extent, when the available slot position of the process chamber has a placement vacancy, the calibration module can be used as a temporary material storage area so as to place the material to be processed in the process chamber as soon as possible.
Fig. 9 is a schematic diagram of a material scheduling process according to an embodiment of the present invention. Two materials P1_1 and P1_2 are processed in two slots in a PM1 chamber of semiconductor processing equipment, a mechanical arm has a material P1_3 waiting to be put into the PM1 chamber for operation, and an alignment has a material P1_4 which is calibrated (see (a) in FIG. 9). When the processes of the materials P1_1 and P1_2 are completed in the chamber, the robot will exchange P1_3 with the material P1_1 in the Slot1 of the PM1 chamber, and after the exchange is completed, P1_3 will enter one Slot of the PM1 chamber (see (b) in fig. 9), and at this time, if the user edits a path (FOUP — Aligner — PM — FOUP), the material P1_1 should be directly placed back to the FOUP, and such an action will cause another Slot of the PM1 chamber to wait for the P1_4 to enter the Slot before the processes are performed. Therefore, to maximize the throughput, maximize the utilization of the chamber, and reduce the idle time of the chamber, the material P1_1 is exchanged with P1_4 on the Aligner (see (c) in fig. 9) immediately after being taken onto the robot, and then P1_4 is immediately exchanged with P1_2 in the PM1 chamber, so that the PM1 can immediately start to perform the process. At this time, Aligner becomes a temporary storage point of P1_1, when the next material P1_5 is taken out from the FOUP, P1_5 will exchange pieces with material P1_1 on Aligner (see (d) in fig. 9), when P1_5 performs calibration, the robot can put P1_1 back into the FOUP, which can greatly save the number of times the robot calls back and forth between the FOUP and Aligner, and can also improve the utilization rate of the chamber and reduce the idle time of the chamber. P1_2 can be returned to the FOUP immediately after the chamber has completed the process without being placed in the Aligner for transfer.
And if the path taken by the equipment material issued by the user is the second path, which indicates that the material needs to pass through the Aligner to perform calibration before being returned to the FOUP, the Aligner plays a role in calibrating the material, the equipment can be strictly conveyed according to the material conveying path, all the materials enter the Aligner to perform calibration after the process is performed from the chamber, and when the mechanical arm is idle, the materials are taken out from the Aligner and put back to the FOUP.
And 505, generating the material scheduling global action sequence by adopting all the scheduling actions.
And the material scheduling global action sequence comprises the material scheduling actions required to be executed by each equipment structure.
In the embodiment of the present invention, a material scheduling global action sequence may be determined by using all scheduling actions.
With respect to step 505, the following sub-steps may be performed:
and a substep S31 of establishing a root node of the search tree.
And a substep S32, determining a new child node generated by the search tree according to the scheduling action of the next scheduled material output each time.
And a substep S33, determining the last child node generated by the search tree after the dispatching action of all materials is calculated.
And a substep S34, traversing all paths of the search tree from the root node to the last child node, and determining an action sequence corresponding to a shortest path among all paths as the material scheduling global action sequence.
The root node is used for recording initial material storage state information; and the child nodes are used for recording the updated material storage state information after each time of simulating and executing the scheduling action.
In the embodiment of the invention, a material scheduling global action sequence can be output in a search tree mode.
In an optional embodiment, before determining a new child node generated by the search tree, the method further includes:
judging whether a path from the root node to the child node is a path or not; if yes, generating the child node; if not, regenerating a child node, and returning to the step of judging whether the path from the root node to the child node is a path or not.
Referring to fig. 10, a flowchart of creating a material scheduling global action sequence according to an embodiment of the present invention is shown. First, a search tree root node is established as an initial state. With the output of the maneuver action, the search tree is added with one child node each time an action step is generated. Before generating an action sequence each time, judging whether a path from a root node to the child node of the search tree is a path, if not, indicating that the currently generated path is deadlocked, exiting the path branch, regenerating a new child node, and judging whether the path from the root node to the child node is the path again until all scheduling actions of all materials are calculated. Different from the prior art, in order to ensure that the output action sequence is a global optimal solution, a material selection rule is introduced to select an optimal scheduling material, so that the search tree generates child nodes in a specified range, the path from the root node to the last child node of the search tree is traversed, and the shortest path is used as an optimal action path.
Step 506, controlling each equipment structure to perform material scheduling according to the material scheduling global action sequence.
In the embodiment of the invention, after the material scheduling global action sequence is determined, each equipment structure in the semiconductor equipment can be controlled to sequentially perform material scheduling according to the material scheduling global action sequence.
In summary, in the embodiment of the present invention, the global action sequence of the material scheduling for the current job task may be output according to the storage space feature information of each equipment structure of the semiconductor process equipment. By adopting the method, the global optimal scheduling action sequence of one-time output material scheduling can be realized according to the equipment hardware structure characteristics of the semiconductor process equipment, and the capacity of processing materials by a machine can be greatly improved. The automatic material transmission control process of the multi-chamber semiconductor process equipment is realized, the user-defined material transmission path in the equipment is supported, the globally optimal scheduling action sequence is output according to the user-defined material transmission path, the mode of adopting a locally optimal creating action sequence is abandoned, and the machine material processing capacity is improved to the maximum extent.
It should be noted that, for simplicity of description, the method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present invention is not limited by the illustrated order of acts, as some steps may occur in other orders or concurrently in accordance with the embodiments of the present invention. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred and that no particular act is required to implement the invention.
Referring to fig. 11, there is shown a block diagram of a semiconductor processing apparatus according to an embodiment of the present invention, the semiconductor processing apparatus 1101 includes a plurality of apparatus structures for performing a material handling operation respectively, and further includes,
a controller 11011 for determining material transfer path information of the current job task; the material conveying path information is used for defining equipment structures required to be passed by the materials and the sequence of the materials passing through the equipment structures; respectively determining the storage space characteristic information and the material storage state information of each equipment structure; generating a material scheduling global action sequence of the current operation task according to the material transmission path information, the storage space characteristic information and the material storage state information; the material scheduling global action sequence comprises material scheduling actions required to be executed by each equipment structure; and controlling each equipment structure to carry out material scheduling according to the material scheduling global action sequence.
In an optional embodiment of the present invention, the apparatus structure includes a process chamber, and the controller is configured to determine a next scheduled material based on a preset material selection rule according to the storage space characteristic information and the material storage state information; wherein the preset material selection rule is used for determining a next scheduled target material based on a capacity maximization principle of the semiconductor process equipment and/or a utilization maximization principle of the process chamber; determining a scheduling action of the next scheduled material according to the material transmission path information; and generating the material scheduling global action sequence by adopting all the scheduling actions.
In an optional embodiment of the present invention, the controller is configured to establish a root node of a search tree; the root node is used for recording initial material storage state information; determining a new child node generated by the search tree according to the scheduling action of the next scheduled material output each time; the child nodes are used for recording the updated material storage state information after each time of simulating and executing the scheduling action; after the scheduling actions of all the materials are calculated, determining the last child node generated by the search tree; traversing all paths of the search tree from the root node to the last child node, and determining an action sequence corresponding to the shortest path in all the paths as the material scheduling global action sequence.
In an optional embodiment of the present invention, the controller is configured to determine whether a path from the root node to the child node is a path; if yes, generating the child node; if not, regenerating a child node, and returning to the step of judging whether the path from the root node to the child node is a path or not.
In an optional embodiment of the present invention, the apparatus structure further comprises a wafer cassette, a calibration module, and a wafer transfer robot, the preset material selection rule comprises a material selection rule set based on a dual-arm available state of the wafer transfer robot, and the controller is configured to determine a next scheduled target material according to material storage states of the wafer cassette, the calibration module, the wafer transfer robot, and the process chamber.
In an optional embodiment of the present invention, the controller is configured to determine whether the robot arm has a material; if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the current operation task is a multi-operation task or not, and judging whether the process chamber has the last material or not; if the current operation task is a multi-operation task and the process chamber has the last material, determining the material of the process chamber as the next scheduled target material; otherwise, judging whether the mechanical arm has materials or not, and judging whether the wafer box has materials or not; if the mechanical arm does not have materials and the wafer box has materials, determining one material of the wafer box as the target material of the next scheduling; otherwise, judging whether the calibration module has the last material; if the calibration module has the last material, determining the material of the calibration module as the next scheduled target material; otherwise, judging whether the mechanical arm has materials, judging whether the wafer box has materials, and judging whether the process chamber has materials; if the robot arm does not have material, the wafer cassette does not have material, and the process chamber has material, determining the material of the process chamber as the target material for the next dispatch.
In an optional embodiment of the present invention, the apparatus structure further includes a wafer cassette, a calibration module, and a wafer transfer robot, wherein the preset material selection rule includes a material selection rule set based on a single-arm available state of the wafer transfer robot, and the controller is configured to determine the number of available slots of the process chamber; determining an available chamber number for the process chamber; determining the task type of the current job task; and determining the next scheduled target material according to the number of the available slots, the number of the available chambers and the task type.
In an optional embodiment of the present invention, the controller is configured to, when the number of the available slots is not equal to the number of all slots, determine whether the robot arm has a material first if the task type is a multi-job task or the number of the available chambers is multiple and each available chamber has only one slot available; if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has a plurality of materials, judging whether the calibration module has the materials, or judging whether the calibration module has the materials to be transmitted to the process chamber during multi-operation tasks; determining the material of the process chamber as the target material to be scheduled next if the process chamber has a plurality of materials and the calibration module has a material, or if the calibration module has a material to be transferred to the process chamber during a multi-job task; otherwise, judging whether the calibration module has materials; if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not; and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
In an optional embodiment of the present invention, the controller is configured to, when the number of available slots is not equal to the number of all slots, determine whether the robot arm has a material first if the task type is a multi-job task or the number of available chambers is multiple and only one slot of one available chamber of the multiple available chambers is disabled; if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has materials or not, judging whether the calibration module has materials or not, or judging whether the materials in the process chamber to which the materials of the calibration module need to be transmitted are full or not during multi-operation tasks; if the process chamber has materials and the calibration module has materials, or the process chamber to which the materials of the calibration module need to be transferred is full of materials in the multi-job task, determining the materials of the process chamber as the target materials to be scheduled next; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has materials or not; determining the material of the calibration module as the target material of the next schedule if the process chamber has material and the calibration module has material; otherwise, judging whether the calibration module has materials; if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not; and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
In an optional embodiment of the present invention, the controller is configured to, when the number of the available slots is not equal to the number of all slots, determine whether the robot arm has a material first if the task type is a single job task or the number of the available cavities is one; if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has materials or not; determining the material of the process chamber as the target material for the next dispatch if the process chamber has material and the calibration module has material; otherwise, judging whether the calibration module has materials; if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not; and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
In an optional embodiment of the present invention, the controller is configured to, when the number of the available slots is equal to the number of all slots, determine whether the robot arm has a material first if the number of the available cavities is multiple; if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chambers all have materials, and judging whether the calibration module has materials; if the process chamber has material and the calibration module has material, determining the material of the process chamber as the target material for the next dispatch; otherwise, judging whether the calibration module has materials; if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not; and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
In an optional embodiment of the present invention, the controller is configured to, when the number of the available slots is equal to the number of all slots, determine whether the robot arm has a material first if the number of the available cavities is one or the task type is a multi-job task; if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has odd-numbered materials or not, or judging whether the process chamber has a plurality of materials or not and judging whether the calibration module has materials or not in the case of a single operation task; if the process chamber has a material and the calibration module has an odd number of materials, or if the process chamber has a plurality of materials and the calibration module has a material in a single job task, determining the material of the process chamber as the target material to be scheduled next; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has even-numbered materials or not; if the process chamber has material and the calibration module has even-numbered material, or the process chamber does not have material and the calibration module has even-numbered material, determining the material of the calibration module as the target material to be scheduled next.
In an optional embodiment of the present invention, the controller is configured to obtain material path editing information input by a user; and generating the material transmission path information by adopting the material path editing information.
In an optional embodiment of the present invention, the controller is configured to determine whether a preset temporary storage triggering condition is met if the material transfer path information indicates that the processed material does not pass through the calibration module in the process of being transferred from the process chamber to the wafer cassette; and if so, placing the processed material in the calibration module, and controlling the calibration module not to calibrate the placed material.
In an alternative embodiment of the present invention, the temporary storage triggering condition includes:
not all available slot positions of the plurality of available slot positions of the process chamber are provided with materials to be processed; the process chamber is used to perform a machining process with all available slots having material to be machined.
In summary, in the embodiment of the present invention, the global action sequence of the material scheduling for the current job task may be output according to the storage space feature information of each equipment structure of the semiconductor process equipment. By adopting the method, the global optimal scheduling action sequence of one-time output material scheduling can be realized according to the equipment hardware structure characteristics of the semiconductor process equipment, and the capacity of processing materials by a machine can be greatly improved.
For the device embodiment, since it is basically similar to the method embodiment, the description is simple, and for the relevant points, refer to the partial description of the method embodiment.
An embodiment of the present invention further provides an electronic device, including: the system comprises a processor, a memory and a computer program which is stored on the memory and can run on the processor, wherein when the computer program is executed by the processor, each process of the material scheduling method embodiment is realized, the same technical effect can be achieved, and in order to avoid repetition, the details are not repeated.
The embodiment of the present invention further provides a computer-readable storage medium, where a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the computer program implements each process of the above-mentioned material scheduling method embodiment, and can achieve the same technical effect, and in order to avoid repetition, details are not repeated here.
For the device embodiment, since it is basically similar to the method embodiment, the description is simple, and for the relevant points, refer to the partial description of the method embodiment.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, apparatus, or computer program product. Accordingly, embodiments of the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, embodiments of the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
Embodiments of the present invention are described with reference to flowchart illustrations and/or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing terminal to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing terminal to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing terminal to cause a series of operational steps to be performed on the computer or other programmable terminal to produce a computer implemented process such that the instructions which execute on the computer or other programmable terminal provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the invention.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The material scheduling method and the semiconductor process equipment provided by the invention are described in detail, and the principle and the implementation mode of the invention are explained by applying specific examples, and the description of the examples is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims (16)

1. A material scheduling method applied to a semiconductor process facility including a plurality of facility structures for respectively performing material operations, the method comprising:
determining material transmission path information of a current operation task; the material conveying path information is used for defining equipment structures required to be passed by the materials and the sequence of the materials passing through the equipment structures;
respectively determining the storage space characteristic information and the material storage state information of each equipment structure;
generating a material scheduling global action sequence of the current operation task according to the material transmission path information, the storage space characteristic information and the material storage state information; the material scheduling global action sequence comprises material scheduling actions required to be executed by each equipment structure;
and controlling each equipment structure to carry out material scheduling according to the material scheduling global action sequence.
2. The method of claim 1, wherein the equipment structure comprises a process chamber, and wherein generating a material scheduling global action sequence for a current job task based on the material transport path information, the storage space characteristic information, and the material storage status information comprises:
determining the next scheduled material based on a preset material selection rule according to the storage space characteristic information and the material storage state information; wherein the preset material selection rule is used for determining a next scheduled target material based on a capacity maximization principle of the semiconductor process equipment and/or a utilization maximization principle of the process chamber;
determining a scheduling action of the next scheduled material according to the material transmission path information;
and generating the material scheduling global action sequence by adopting all the scheduling actions.
3. The method of claim 2, wherein said employing all of said scheduling actions to generate said material scheduling global action sequence comprises:
establishing a root node of a search tree; the root node is used for recording initial material storage state information;
determining a new child node generated by the search tree according to the scheduling action of the next scheduled material output each time; the child nodes are used for recording the updated material storage state information after each time of simulating and executing the scheduling action;
after the scheduling actions of all the materials are calculated, determining the last child node generated by the search tree;
traversing all paths of the search tree from the root node to the last child node, and determining an action sequence corresponding to the shortest path in all the paths as the material scheduling global action sequence.
4. The method of claim 3, wherein determining a new child node of the search tree further comprises:
judging whether a path from the root node to the child node is a path or not;
if yes, generating the child node;
if not, regenerating a child node, and returning to the step of judging whether the path from the root node to the child node is a path or not.
5. The method of claim 2, wherein the equipment configuration further comprises a wafer cassette, a calibration module, a wafer transfer robot, and the predetermined material selection rules comprise material selection rules based on a state of availability of the wafer transfer robot arms, comprising:
and determining the next scheduled target material according to the material storage states of the wafer box, the calibration module, the wafer transfer mechanical arm and the process chamber.
6. The method of claim 5, wherein determining a next scheduled target material based on material storage status of the cassette, the calibration module, the wafer transfer robot, and the process chamber comprises:
judging whether the mechanical arm has materials or not;
if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the current operation task is a multi-operation task or not, and judging whether the process chamber has the last material or not;
if the current operation task is a multi-operation task and the process chamber has the last material, determining the material of the process chamber as the next scheduled target material; otherwise, judging whether the mechanical arm has materials or not, and judging whether the wafer box has materials or not;
if the mechanical arm does not have materials and the wafer box has materials, determining one material of the wafer box as the target material of the next scheduling; otherwise, judging whether the calibration module has the last material;
if the calibration module has the last material, determining the material of the calibration module as the next scheduled target material; otherwise, judging whether the mechanical arm has materials, judging whether the wafer box has materials, and judging whether the process chamber has materials;
if the robot arm does not have material, the wafer cassette does not have material, and the process chamber has material, determining the material of the process chamber as the target material for the next dispatch.
7. The method of claim 2 or 5, wherein the equipment configuration further comprises a wafer cassette, a calibration module, and a wafer transfer robot, and the predetermined material selection rules comprise material selection rules based on a single arm availability status of the wafer transfer robot, comprising:
determining a number of available slots of the process chamber;
determining an available chamber number for the process chamber;
determining the task type of the current job task;
and determining the next scheduled target material according to the number of the available slots, the number of the available chambers and the task type.
8. The method of claim 7, wherein determining a next scheduled target material based on the number of available slots, the number of available chambers, and the task type comprises:
under the condition that the number of the available slot positions is not equal to the number of all slot positions, if the task type is a multi-job task or the number of the available chambers is multiple and each available chamber only has one slot position available, judging whether the mechanical arm has materials or not;
if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has a plurality of materials, judging whether the calibration module has the materials, or judging whether the calibration module has the materials to be transmitted to the process chamber during multi-operation tasks;
determining the material of the process chamber as the target material to be scheduled next if the process chamber has a plurality of materials and the calibration module has a material, or if the calibration module has a material to be transferred to the process chamber during a multi-job task; otherwise, judging whether the calibration module has materials;
if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not;
and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
9. The method of claim 7, wherein determining a next scheduled target material based on the number of available slots, the number of available chambers, and the task type comprises:
under the condition that the number of the available slot positions is not equal to the number of all slot positions, if the task type is a multi-job task or the number of the available chambers is multiple and only one slot position of one available chamber in the multiple available chambers is forbidden, judging whether the mechanical arm has materials or not;
if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has materials or not, judging whether the calibration module has materials or not, or judging whether the materials in the process chamber to which the materials of the calibration module need to be transmitted are full or not during multi-operation tasks;
if the process chamber has materials and the calibration module has materials, or the process chamber to which the materials of the calibration module need to be transferred is full of materials in the multi-job task, determining the materials of the process chamber as the target materials to be scheduled next; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has materials or not;
determining the material of the calibration module as the target material of the next schedule if the process chamber has material and the calibration module has material; otherwise, judging whether the calibration module has materials;
if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not;
and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
10. The method of claim 7, wherein determining a next scheduled target material based on the number of available slots, the number of available chambers, and the task type comprises:
under the condition that the number of the available slot positions is not equal to that of all the slot positions, if the task type is a single operation task or the number of the available cavities is one, whether the mechanical arm has materials or not is judged;
if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has materials or not;
determining the material of the process chamber as the target material for the next dispatch if the process chamber has material and the calibration module has material; otherwise, judging whether the calibration module has materials;
if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not;
and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
11. The method of claim 7, wherein determining a next scheduled target material based on the number of available slots, the number of available chambers, and the task type comprises:
under the condition that the number of the available slot positions is equal to that of all the slot positions, if the number of the available cavities is multiple, whether the mechanical arm has materials or not is judged;
if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chambers all have materials, and judging whether the calibration module has materials;
if the process chamber has material and the calibration module has material, determining the material of the process chamber as the target material for the next dispatch; otherwise, judging whether the calibration module has materials;
if the calibration module has materials, determining the materials of the calibration module as the next scheduled target materials; otherwise, judging whether the wafer box has materials or not;
and if the wafer box has the material, determining the material of the wafer box as the target material of the next dispatching.
12. The method of claim 7, wherein determining a next scheduled target material based on the number of available slots, the number of available chambers, and the task type comprises:
under the condition that the number of the available slot positions is equal to that of all the slot positions, if the number of the available cavities is one or the task type is a multi-job task, judging whether the mechanical arm has materials or not;
if the mechanical arm has materials, determining the materials of the mechanical arm as the next scheduled target materials; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has odd-numbered materials or not, or judging whether the process chamber has a plurality of materials or not and judging whether the calibration module has materials or not in the case of a single operation task;
if the process chamber has a material and the calibration module has an odd number of materials, or if the process chamber has a plurality of materials and the calibration module has a material in a single job task, determining the material of the process chamber as the target material to be scheduled next; otherwise, judging whether the process chamber has materials or not, and judging whether the calibration module has even-numbered materials or not;
if the process chamber has material and the calibration module has even-numbered material, or the process chamber does not have material and the calibration module has even-numbered material, determining the material of the calibration module as the target material to be scheduled next.
13. The method of claim 1, wherein determining material transfer path information for a current job task comprises:
acquiring material path editing information input by a user;
and generating the material transmission path information by adopting the material path editing information.
14. The method of claim 5, wherein the act of determining the next scheduled material from the material transport path information comprises:
if the material transmission path information is that the processed material does not pass through the calibration module in the process of being conveyed back to the wafer box from the process chamber, judging whether a preset temporary storage triggering condition is met;
and if so, placing the processed material in the calibration module, and controlling the calibration module not to calibrate the placed material.
15. The method of claim 14, wherein the temporary storage trigger condition comprises:
not all available slot positions of the plurality of available slot positions of the process chamber are provided with materials to be processed; the process chamber is used to perform a machining process with all available slots having material to be machined.
16. A semiconductor processing apparatus comprising a plurality of apparatus structures for respectively performing material handling, the semiconductor processing apparatus further comprising:
the controller is used for determining the material transmission path information of the current operation task; the material conveying path information is used for defining equipment structures required to be passed by the materials and the sequence of the materials passing through the equipment structures; respectively determining the storage space characteristic information and the material storage state information of each equipment structure; generating a material scheduling global action sequence of the current operation task according to the material transmission path information, the storage space characteristic information and the material storage state information; the material scheduling global action sequence comprises material scheduling actions required to be executed by each equipment structure; and controlling each equipment structure to carry out material scheduling according to the material scheduling global action sequence.
CN202111002708.7A 2021-08-30 2021-08-30 Material scheduling method and semiconductor process equipment Pending CN113871330A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115116909A (en) * 2022-08-30 2022-09-27 江苏邑文微电子科技有限公司 Wafer scheduling control method and device under abnormal working condition of semiconductor processing equipment
CN115555981A (en) * 2022-10-31 2023-01-03 上海华力微电子有限公司 Dispatching rule-based intelligent scheduling control method for self-adaptive copper chemical mechanical polishing equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115116909A (en) * 2022-08-30 2022-09-27 江苏邑文微电子科技有限公司 Wafer scheduling control method and device under abnormal working condition of semiconductor processing equipment
CN115116909B (en) * 2022-08-30 2022-11-11 江苏邑文微电子科技有限公司 Wafer scheduling control method and device under abnormal working condition of semiconductor processing equipment
CN115555981A (en) * 2022-10-31 2023-01-03 上海华力微电子有限公司 Dispatching rule-based intelligent scheduling control method for self-adaptive copper chemical mechanical polishing equipment

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