CN116038166A - Composite uniform-temperature water cooling structure based on welding and manufacturing method thereof - Google Patents
Composite uniform-temperature water cooling structure based on welding and manufacturing method thereof Download PDFInfo
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- CN116038166A CN116038166A CN202310332058.5A CN202310332058A CN116038166A CN 116038166 A CN116038166 A CN 116038166A CN 202310332058 A CN202310332058 A CN 202310332058A CN 116038166 A CN116038166 A CN 116038166A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K28/00—Welding or cutting not covered by any of the preceding groups, e.g. electrolytic welding
- B23K28/02—Combined welding or cutting procedures or apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
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- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a composite uniform-temperature water cooling structure based on welding and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: a groove is formed in the top of the heat conducting substrate, a heat storage cavity is processed at the bottom, a liquid injection port is processed on the side surface of the heat conducting substrate, and the liquid injection port is communicated with the heat storage cavity; placing a high-conductivity graphite plate in the groove, wherein the high-conductivity graphite plate has the same size as the groove, and covering a heat conduction cover plate on the groove; covering a water cooling plate at the bottom of the heat storage cavity; and injecting phase change working medium into the heat storage cavity through the liquid injection port, and welding and plugging the liquid injection port. The invention has flexible structure, and can achieve different heat dissipation effects by selecting different combination modes according to the use requirements; the welding modes are various, and the effective connection between different enterprises and different materials can be satisfied; the phase change working medium has various types, can meet the requirements of different use environments, has obvious heat dissipation effect and high equivalent heat conductivity coefficient; the welding mode is simple and the cost is low.
Description
Technical Field
The invention relates to the technical field of water cooling and heat dissipation, in particular to a composite uniform-temperature water cooling structure based on welding and a manufacturing method thereof.
Background
The electronic device generates more heat during use, and the heat needs to be discharged in time, otherwise, the service life of the electronic device is affected. The water cooling plate is a common water cooling device for electronic equipment and can take away heat generated in the electronic equipment. However, water cooling has some limitations, such as low temperature at the water inlet and high temperature at the water outlet, which can cause large temperature difference of the electronic equipment. In order to prevent the electronic equipment components from losing great because of failure caused by untimely heat dissipation, the water cooling plate is required to be started all the time when the electronic equipment works, so that the electronic equipment is protected, and obviously high cost is caused. In addition, if the water cooling plate is not started timely, the high temperature generated instantaneously by some electronic devices can damage the electronic devices and fail.
At present, most electronic products are subjected to natural convection heat exchange or water cooling heat dissipation, wherein the natural heat dissipation efficiency is low, the electronic products are greatly influenced by the environment, and temperature rise is easy to occur. The water cooling heat exchange efficiency is higher, but external equipment is needed, driving is provided, the heat exchange cost is higher, and the use place is limited.
The conventional heat dissipation structure comprises a water cooling plate, a temperature equalizing plate, a heat storage plate and the like, wherein the water cooling plate has the advantages of high heat exchange efficiency, large temperature difference, high cost, low temperature difference, starting time, poor external heat exchange effect, starting time block and large heat storage capacity, and the temperature is too high due to the fact that the heat storage plate can only work for a short time and work for a long time. In the structure for radiating the electronic product, the heat sink structure is a composite component integrating the temperature equalizing plate, the heat storage plate and the water cooling plate, and has the respective excellent performances of three heat radiating structures, so that the defects of the respective heat radiating modes or structures can be avoided.
Disclosure of Invention
The invention aims at solving the technical defect of single function of a water cooling structure in the prior art, and provides a manufacturing method of a composite uniform temperature water cooling structure based on welding.
Another object of the present invention is to provide a composite uniform temperature water-cooling structure manufactured by the manufacturing method.
The technical scheme adopted for realizing the purpose of the invention is as follows:
a manufacturing method of a composite uniform-temperature heat storage water cooling assembly comprises the following steps:
step 1, a groove is formed in the top of a heat conducting substrate, a heat storage cavity is processed in the bottom, a liquid injection port is processed on the side surface of the heat conducting substrate, the liquid injection port is communicated with the heat storage cavity, a high-conductivity graphite plate is arranged in the groove, the high-conductivity graphite plate and the groove are the same in size, and a heat conducting cover plate is covered on the groove;
or, step 1, a groove is formed in the top of the heat conducting substrate, a high-conductivity graphite plate is placed in the groove, the high-conductivity graphite plate and the groove are the same in size, a heat conducting cover plate is covered on the groove, a heat storage cavity is processed at the bottom, a liquid injection port is processed on the side surface of the heat conducting substrate, and the liquid injection port is communicated with the heat storage cavity;
or, step 2, covering a heat conduction bottom plate on the bottom of the heat storage cavity, processing a groove on the bottom of the heat conduction bottom plate, and covering a water cooling plate on the bottom of the graphite groove after placing a high-conductivity graphite plate in the groove;
step-by-step welding is carried out on the step 1 and the step 2, or the step 1 and the step 2 are assembled and then welded in one step;
and step 3, injecting a phase change working medium into the heat storage cavity through the liquid injection port, and welding and plugging the liquid injection port.
In the above technical scheme, the size of the groove is the same as the size of the high-conductivity graphite plate.
In the technical scheme, the heat conductivity coefficient of the high-conductivity graphite plate is not lower than 1000W/(m.K).
In the above technical solution, step 1 and step 2 are step-by-step welding:
in the step 1, after the heat-conducting cover plate is covered on the groove, namely welded on the top surface of the heat-conducting substrate, the welding in the step 1 adopts diffusion welding, preferably, the temperature of the diffusion welding is 500-600 ℃, and the pressure is 5-15 mpa;
in the step 2, after the water cooling plate is covered at the bottom of the heat storage cavity, the water cooling plate is welded at the bottom surface of the heat conduction substrate, friction stir welding, electron beam welding, laser welding or arc welding is adopted for welding, preferably, the rotating speed during friction stir welding is 500-1500 r/min, and the welding speed is 50-500 mm/min;
the first welding is performed by two solid aluminum alloys, and the middle part only has one cavity. In the second welding, a flat plate with a groove needs to be welded on the workpiece after the first welding, which is equivalent to two cavities. While the pressure of diffusion welding is vertically downward, in the case of two cavities, the welding position below the cavities is very disadvantageous. Diffusion welding is not solder, and is generally the preferred welding method, but diffusion welding cannot be used for the second welding, so that other welding methods are selected.
Or, in the step 2, the heat-conducting bottom plate is covered at the bottom of the heat storage cavity, after the heat-conducting bottom plate is welded (the diffusion welding mode can be adopted, the temperature of the diffusion welding is 500-600 ℃ and the pressure is 5-15 mpa) at the top surface of the heat-conducting substrate, the high-conductivity graphite plate is placed in a groove at the bottom of the heat-conducting bottom plate, the water-cooling plate is covered at the bottom of the graphite groove, and after the water-cooling plate is welded (friction stir welding, electron beam welding, laser welding or arc welding, preferably, the rotation speed during friction stir welding is 500-1500 r/min and the welding speed is 50-500 mm/min) at the bottom of the heat-conducting bottom plate, the step 3 is performed.
In the above technical solution, when the step 1 and the step 2 are assembled and welded in the subsequent step, a brazing filler metal is placed between two adjacent components in the assembly process, and then brazing welding is adopted.
In the technical scheme, the welding in the step 3 is friction stir welding, electron beam welding, laser welding or arc welding, preferably, the rotating speed during friction stir welding is 500-1500 r/min, and the welding speed is 50-500 mm/min.
In the above technical solution, the phase change working medium in the step 3 is paraffin, alkane or low melting point metal, and the flow channel in the water cooling plate is a serpentine flow channel or a cavity flow channel.
In the above technical solution, the heat conducting substrate and the heat conducting cover plate are made of aluminum alloy, magnesium alloy, copper alloy or titanium alloy.
In another aspect of the invention, a composite, temperature-homogenizing water-cooled component welded by the manufacturing method.
In another aspect of the invention, a composite uniform temperature heat storage water cooling structure comprises one or more composite uniform temperature heat storage water cooling components obtained through welding in the steps.
In the technical scheme, the composite uniform-temperature water cooling assembly comprises a heat conduction cover plate, a high-conductivity graphite plate, a heat conduction substrate and a water cooling plate with an internal flow channel which are sequentially compounded together, wherein a heat storage cavity is formed in the heat conduction substrate, the heat storage cavity is covered and sealed by the water cooling plate, a phase change working medium is filled in the heat storage cavity, and a liquid injection port communicated with the heat storage cavity is formed in the side wall of the heat conduction substrate;
or, compound samming water cooling subassembly is including heat conduction apron, high guide graphite board, heat conduction base plate heat conduction apron, high guide graphite board and the water-cooling board that has the internal runner that compound together in proper order, offer the heat-retaining chamber on the heat conduction base plate, the heat-retaining chamber is closed by the water-cooling board lid and is sealed, and the phase transition working medium is filled in the heat-retaining chamber, offer on the lateral wall of heat conduction base plate with the notes liquid mouth that the heat-retaining chamber is linked together.
Compared with the prior art, the invention has the beneficial effects that:
1. the composite uniform-temperature heat storage water cooling structure is flexible in structure, different combination modes are selected according to use requirements, different heat dissipation effects can be achieved, and compared with an aluminum plate, the uniform-temperature performance of the composite uniform-temperature heat storage water cooling structure is reduced by 5-8 ℃ in temperature difference, and the overall working time is prolonged by 10-20 min.
2. The welding modes are various, the effective connection between different enterprises and different materials can be satisfied, the structures are connected by adopting the welding mode, the welding rate is more than or equal to 90%, and the contact thermal resistance is low.
3. The phase change working medium has various types, can meet the requirements of different use environments, has obvious heat dissipation effect and high equivalent heat conductivity coefficient; the welding mode is simple and the cost is low.
Drawings
Fig. 1 is a schematic structural diagram of a composite uniform temperature heat storage water cooling structure in embodiment 1.
Fig. 2 is a schematic structural diagram of a composite uniform temperature heat storage water cooling structure in embodiment 2.
Detailed Description
The present invention will be described in further detail with reference to specific examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
As shown in fig. 1, a manufacturing method of the composite uniform temperature heat storage water cooling component comprises the following steps:
step 1, preparing materials:
preparing 2 aluminum alloy plates, wherein the external dimensions are as follows: 200X 150X 30mm, 200X 150X 5mm, wherein 200X 150X 30mm aluminum alloy plate is used as aluminum alloy substrate 1, 200X 150X 5mm aluminum alloy plate is used as aluminum alloy plate cover plate 2, high conductivity graphite 3 is prepared, and the external dimensions are: 180×130×2mm, an aluminum alloy water-cooling plate 4 with an internal flow passage was prepared, and the external dimensions were: 200X 150X 6mm;
step 2.1, processing graphite grooves 5 with the size of 180 multiplied by 130 multiplied by 2mm on an aluminum alloy substrate 1 with the size of 200 multiplied by 150 multiplied by 30 mm;
step 2.2, after cleaning the surface of the aluminum alloy, assembling the high-conductivity graphite 3 into the graphite groove 5, and covering the upper end cover with an aluminum alloy cover plate 2 with the thickness of 200 multiplied by 150 multiplied by 5mm;
step 2.3, adopting a diffusion welding technology to connect the aluminum alloy substrate 1, the high-conductivity graphite 3 and the aluminum alloy cover plate 2, wherein the welding parameters are as follows: the temperature is 520 ℃ and the pressure is 5MPa, so that a welding piece is obtained;
and 4, connecting the welding piece and the periphery of the aluminum alloy water cooling plate 4 by adopting a friction stir welding technology, wherein the aluminum alloy water cooling plate 4 is covered on the heat storage cavity, and welding parameters are as follows: the rotating speed is 500 r/min, and the welding speed is 60 mm/min;
and 6, sealing the liquid injection port 6 by adopting a friction stir welding technology, wherein the welding parameters are as follows: the rotating speed is 1500 r/min, and the welding speed is 50 mm/min;
and 7, processing the appearance structure to meet the use requirement.
The compound temperature-equalizing heat-storage water-cooling assembly obtained through welding in the above steps comprises an aluminum alloy plate cover plate 2, high-conductivity graphite 3, an aluminum alloy substrate 1 and an aluminum alloy water-cooling plate 4 with an internal flow passage, wherein a heat storage cavity is formed in the aluminum alloy substrate 1 and is sealed by the aluminum alloy water-cooling plate 4 in a covering manner, a phase-change working medium is filled in the heat storage cavity, and a liquid injection port 6 communicated with the heat storage cavity is formed in the side wall of the aluminum alloy substrate 1.
Example 2
As shown in fig. 2, a manufacturing method of the composite uniform temperature heat storage water cooling component comprises the following steps:
step 1, preparing materials:
preparing 6 copper alloy plates:
the external dimensions 280×220×40mm×2 are respectively the first copper alloy substrate 7 and the second copper alloy substrate 8;
the external dimensions are 280×220×5mm×4, and are respectively used as a first copper alloy cover plate 9, a second copper alloy cover plate 10, a third copper alloy cover plate 11 and a fourth copper alloy cover plate 12;
four pieces of high-conductivity graphite are prepared, and the outline dimensions are as follows: 260X 200X 3mm X4 as the first high-conductivity graphite sheet 13, the second high-conductivity graphite sheet 14, the third high-conductivity graphite sheet 15 and the fourth high-conductivity graphite sheet 16, respectively,
a copper alloy water-cooling plate 17 with an internal flow passage was prepared, and the external dimensions were: 280X 220X 8mm;
step 2.1, machining graphite grooves 5 on the front surfaces of the copper alloy substrates of the first copper alloy substrate 7 and the second copper alloy substrate 8, wherein the groove sizes are 260 multiplied by 200 multiplied by 3mm, machining heat storage cavities 3 on the back surfaces of the first copper alloy substrate 7 and the second copper alloy substrate 8, machining liquid injection ports 6 on the side surfaces, and the sizes of the heat storage cavities 3 are as follows: 260X 200X 35mm;
the third copper alloy cover plate 11 and the fourth copper alloy cover plate 12 are provided with graphite grooves 5, and the sizes of the grooves are 260 multiplied by 200 multiplied by 3mm; no grooves are formed in the first copper alloy cover plate 9 and the second copper alloy cover plate 10
Step 2.2, after cleaning the surface of the copper alloy, assembling all parts and brazing filler metal together, wherein the steps are as follows from top to bottom:
the first copper alloy cover plate 9, the first high-conductivity graphite plate 13, the first copper alloy substrate 7, the third copper alloy cover plate 11, the second high-conductivity graphite plate 14, the copper alloy water-cooling plate 17, the third high-conductivity graphite plate 15, the fourth copper alloy cover plate 12, the second copper alloy substrate 8, the fourth high-conductivity graphite plate 16 and the second copper alloy cover plate 10, and silver-copper brazing filler metal sheets with the thickness of 0.1mm are required to be placed in all parts.
Step 2.3, integrally placing the assembled workpiece into a vacuum brazing furnace for welding, wherein the welding parameters are as follows: the temperature is 860 ℃, the pressure is 1MPa, and the heat preservation time is 30min;
and 4, sealing the liquid injection port by adopting a friction stir welding technology, wherein the welding parameters are as follows: the rotating speed is 1800 r/min, and the welding speed is 50 mm/min;
and 5, processing the appearance structure to meet the use requirement.
The compound temperature-equalizing heat-storage water-cooling structure comprises two compound temperature-equalizing heat-storage water-cooling components, wherein the two compound temperature-equalizing heat-storage water-cooling components share a copper alloy water-cooling plate, each compound temperature-equalizing heat-storage water-cooling component comprises a copper alloy cover plate, a high-conductivity graphite plate, a copper alloy substrate, a copper alloy cover plate, a high-conductivity graphite plate and a copper alloy water-cooling plate which are sequentially compounded together, a heat storage cavity is formed in the copper alloy substrate, the heat storage cavity is covered and sealed by the copper alloy cover plate, a phase-change working medium is filled in the heat storage cavity, and a liquid injection port communicated with the heat storage cavity is formed in the side wall of the copper alloy substrate.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
Claims (10)
1. The manufacturing method of the composite uniform-temperature heat storage water cooling assembly is characterized by comprising the following steps of:
step 1, a groove is formed in the top of a heat conducting substrate, a heat storage cavity is processed in the bottom, a liquid injection port is processed on the side surface of the heat conducting substrate, the liquid injection port is communicated with the heat storage cavity, a high-conductivity graphite plate is arranged in the groove, the high-conductivity graphite plate and the groove are the same in size, and a heat conducting cover plate is covered on the groove;
or, step 1, a groove is formed in the top of the heat conducting substrate, a high-conductivity graphite plate is placed in the groove, the high-conductivity graphite plate and the groove are the same in size, a heat conducting cover plate is covered on the groove, a heat storage cavity is processed at the bottom, a liquid injection port is processed on the side surface of the heat conducting substrate, and the liquid injection port is communicated with the heat storage cavity;
step 2, covering a water cooling plate at the bottom of the heat storage cavity;
or, step 2, covering a heat conduction bottom plate on the bottom of the heat storage cavity, processing a groove on the bottom of the heat conduction bottom plate, and covering a water cooling plate on the bottom of the graphite groove after placing a high-conductivity graphite plate in the groove;
step-by-step welding is carried out on the step 1 and the step 2, or the step 1 and the step 2 are assembled and then welded in one step;
and step 3, injecting a phase change working medium into the heat storage cavity through the liquid injection port, and welding and plugging the liquid injection port.
2. The method of manufacturing of claim 1, wherein the dimensions of the grooves are the same as the dimensions of the highly conductive graphite plate.
3. The method of manufacturing according to claim 1, wherein the high-conductivity graphite sheet has a thermal conductivity of not less than 1000W/(m-K).
4. The method of manufacturing according to claim 1, wherein step 1 and step 2 are step-by-step welding:
in the step 1, a heat conduction cover plate is covered on the groove, namely welded on the top surface of the heat conduction substrate;
in the step 2, after the water cooling plate is covered at the bottom of the heat storage cavity, the water cooling plate is welded at the bottom surface of the heat conducting substrate;
or in the step 2, the heat-conducting bottom plate is covered at the bottom of the heat storage cavity, after the heat-conducting bottom plate is welded on the top surface of the heat-conducting substrate, the high-conductivity graphite plate is placed in a groove at the bottom of the heat-conducting bottom plate, the water-cooling plate is covered at the bottom of the graphite groove, and after the water-cooling plate is welded on the heat-conducting bottom plate, the step 3 is performed.
5. The method of manufacturing according to claim 1, wherein the step 1 and the step 2 are assembled and then welded in a subsequent step, and a brazing filler metal is placed between the adjacent two members during the assembly, and then the brazing filler metal is used.
6. The method according to claim 1, wherein in the above technical scheme, the phase change working medium in the step 3 is paraffin, alkane or low melting point metal, and the flow channel in the water cooling plate is a serpentine flow channel or a cavity flow channel.
7. The method of claim 1, wherein the thermally conductive substrate and thermally conductive cover plate are made of aluminum alloy, magnesium alloy, copper alloy or titanium alloy.
8. A composite, temperature-homogenizing water-cooled component welded by the manufacturing method of any one of claims 1-7.
9. A composite uniform temperature water cooling structure comprising one or more composite uniform temperature water cooling modules according to claim 8.
10. The composite uniform-temperature water cooling structure according to claim 9, wherein the composite uniform-temperature water cooling assembly comprises a heat conduction cover plate, a high-conductivity graphite plate, a heat conduction substrate and a water cooling plate with an internal flow passage which are sequentially combined together, a heat storage cavity is formed in the heat conduction substrate, the heat storage cavity is covered and sealed by the water cooling plate, a phase change working medium is filled in the heat storage cavity, and a liquid injection port communicated with the heat storage cavity is formed in the side wall of the heat conduction substrate;
or, compound samming water cooling subassembly is including heat conduction apron, high guide graphite board, heat conduction base plate heat conduction apron, high guide graphite board and the water-cooling board that has the internal runner that compound together in proper order, offer the heat-retaining chamber on the heat conduction base plate, the heat-retaining chamber is closed by the water-cooling board lid and is sealed, and the phase transition working medium is filled in the heat-retaining chamber, offer on the lateral wall of heat conduction base plate with the notes liquid mouth that the heat-retaining chamber is linked together.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116903385A (en) * | 2023-07-14 | 2023-10-20 | 北京中凯新科科技有限公司 | Graphene aluminum temperature equalizing plate and preparation method thereof |
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